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Product Datasheet Search Results:
1 Pages, 20 KB, Original- FINELINE BGATM PACKAGES
- Altera Corporation
- CUSTOMER ADVISORY Fine Line BGATM Packages
4 Pages, 314 KB, Original- AMD PACKAGES AND PACKING
- Advanced Micro Devices
- Board Assembly
10 Pages, 1485 KB, Original- PACKAGES AND PACKING
- Advanced Micro Devices
- Die and Wafer Shipments
25 Pages, 453 KB, Original- PACKAGES
- Cml Microcircuits
- A Complete presentation of CMLs Package Styles (plus Despatch Packaging) in One PDF File Tape and Reel info updated
11 Pages, 555 KB, Original- CERAMIC DUAL-IN-LINE PACKAGES
- Cypress Semiconductor
- Ceramic Dual-In-Line Packages
2 Pages, 160 KB, Original- PACKAGES NOTES & PROCESSING
- Infineon Technologies
- TSLP SOLDERING RECOMMENDATIONS
36 Pages, 1058 KB, Original- SMD PACKAGES
- Infineon Technologies
- Thermal Resistance (Linear)
2 Pages, 3247 KB, Original- ROHM ASIC PACKAGES
- N/a
- ROHM ASIC Packages
2 Pages, 11 KB, Original- EXTERNAL LEAD FINISH FOR HERMETIC PACKAGES
- National Semiconductor
- External Lead Finish for Hermetic Packages
2 Pages, 12 KB, Original- EXTERNAL LEAD FINISH FOR PLASTIC PACKAGES
- National Semiconductor
- External Lead Finish for Plastic Packages
6 Pages, 434 KB, Original- HERMETIC PACKAGES
- National Semiconductor
- Hermetic Packages
19 Pages, 500 KB, Original- METAL CAN PACKAGES
- National Semiconductor
- Metal Can Packages (TO-3/TO-5/TO-8/TO-18/TO-39/TO-46/TO-52/TO-72)
Product Details Search Results:
Methode.com/MSC13P1050
{"Status":"ACTIVE","Operating Frequency-Max":"10 GHz","Coupling Type":"THREADED","Manufacturer Series":"SMC","Contact Material":"NOT SPECIFIED","Connector Style":"STRAIGHT","Terminates To":"CABLE","Characteristic Impedance":"50 ohm","Dielectric Material":"POLYPROPYLENE","Connection Type":"SMC CONNECTOR"}...
1022 Bytes - 09:41:50, 22 September 2024
