LP38690SD-ADJ/NOPB - Texas Instruments

LP38690

-ADJ

IN OUT

GND

VOUT

VIN

ADJ

LP38692

-ADJ

IN OUT

GND

VOUT

VIN

VEN EN ADJ

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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

LP38690-ADJ

LP38692-ADJ

SNVS323I –DECEMBER 2004–REVISED FEBRUARY 2016

LP3869x-ADJ 1-A Low Dropout CMOS Linear Regulator With Adjustable Output -

Stable With Ceramic Output Capacitors

1 Features

1• Input Voltage Range: 2.7 V to 10 V

• Output Voltage Range: 1.25 V to 9 V

• 2.5% Adjust Pin Voltage Accuracy (25°C)

• Low Dropout Voltage: 450 mV at 1 A (5-V Typical

VOUT)

• Precision (Trimmed) Bandgap Reference

• Ensured Specs for –40°C to +125°C

• 1-µA Off-State Quiescent Current

• Thermal Overload Protection

• Foldback Current Limiting

• Enable (EN) Pin (LP38692-ADJ)

• 5-Pin SOT-223 and 6-Pin WSON Packages

2 Applications

• Hard Disk Drives

• Notebook Computers

• Battery-Powered Devices

• Portable Instrumentation

3 Description

The LP38690-ADJ and LP38692-ADJ low dropout

CMOS linear regulators provide 2.5% precision

reference voltage, extremely low dropout voltage

(450 mV at 1-A load current, VOUT = 5 V) and

excellent AC performance utilizing ultralow equivalent

series resistance (ESR) ceramic output capacitors.

The low thermal resistance of the WSON and SOT-

223 packages allow the full operating current to be

used even in high ambient temperature

environments.

The use of a PMOS power transistor means that no

DC base drive current is required to bias it allowing

ground pin current to remain below 100 µA

regardless of load current, input voltage, or operating

temperature.

• Dropout Voltage: 450 mV (typical) at 1 A (typical

5-V out)

• Ground Pin Current: 55 µA (typical) at full load

• Adjust Pin Voltage: 2.5% (25°C) accuracy

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)

LP38690-ADJ WSON (6) 3.00 mm × 3.00 mm

LP38692-ADJ

LP38692-ADJ SOT-223 (5) 6.50 mm × 3.56 mm

(1) For all available packages, see the orderable addendum at

the end of the data sheet.

Simplified Schematic LP38690-ADJ Simplified Schematic LP38692-ADJ

VOUT = VADJ × (1 + R1/R2)

LP38690-ADJ

LP38692-ADJ

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Table of Contents

1 Features.................................................................. 1

2 Applications ........................................................... 1

3 Description............................................................. 1

4 Revision History..................................................... 2

5 Pin Configuration and Functions......................... 3

6 Specifications......................................................... 4

6.1 Absolute Maximum Ratings ...................................... 4

6.2 ESD Ratings.............................................................. 4

6.3 Recommended Operating Conditions....................... 4

6.4 Thermal Information.................................................. 4

6.5 Electrical Characteristics........................................... 5

6.6 Typical Characteristics.............................................. 6

7 Detailed Description............................................ 11

7.1 Overview................................................................. 11

7.2 Functional Block Diagrams ..................................... 11

7.3 Feature Description................................................. 12

7.4 Device Functional Modes........................................ 12

8 Application and Implementation ........................ 13

8.1 Application Information............................................ 13

8.2 Typical Application.................................................. 14

9 Power Supply Recommendations...................... 17

10 Layout................................................................... 17

10.1 Layout Guidelines ................................................. 17

10.2 Layout Examples................................................... 18

10.3 WSON Mounting................................................... 18

11 Device and Documentation Support................. 19

11.1 Device Support...................................................... 19

11.2 Documentation Support ........................................ 19

11.3 Related Links ........................................................ 19

11.4 Community Resources.......................................... 19

11.5 Trademarks........................................................... 19

11.6 Electrostatic Discharge Caution............................ 19

11.7 Glossary................................................................ 19

12 Mechanical, Packaging, and Orderable

Information........................................................... 20

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision H (April 2013) to Revision I Page

• Added top navigator icon for TI Design ................................................................................................................................. 1

• Added Device Information and Pin Configuration and Functions sections, ESD Ratings and Thermal Information

tables, Feature Description,Device Functional Modes,Application and Implementation,Power Supply

Recommendations,Layout,Device and Documentation Support, and Mechanical, Packaging, and Orderable

Information sections................................................................................................................................................................ 1

• Changed pin names from "Vin", "Vout" and "Ven" to "IN", "OUT", and "EN"......................................................................... 1

• Changed language of note 3 to Abs Max table ..................................................................................................................... 4

• Added Caution note to Foldback Current Limiting subsection ............................................................................................ 12

• Deleted paragraph beginning "For the LP38690-ADJ and LP38692-ADJ in the NGG0006A 6-Lead WSON

package..." and table following - information out of date...................................................................................................... 18

Changes from Revision G (December 2010) to Revision H Page

• Changed layout of National Data Sheet to TI format ........................................................................................................... 16

GND

EN ADJ

OUT

Exposed

Pad on

Bottom

(DAP)

GND

N/C ADJ

OUT

Exposed

Pad on

Bottom

(DAP)

ADJ

OUT GND

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5 Pin Configuration and Functions

NDC Package (LP38692-ADJ only)

5-Pin SOT-223

Top View

NGG Package (LP38690-ADJ)

6-Pin WSON

Top View NGG Package (LP38692-ADJ)

6-Pin WSON

Top View

(1) The EN pin is only available on the LP38692-ADJ.

(2) Pin 3 on the LP38690-ADJ is not used.

Pin Functions

I/O DESCRIPTIONLP38690-ADJ LP38692-ADJ

NAME WSON WSON SOT-223

ADJ 4 4 2 O The ADJ pin is used to set the regulated output voltage by connecting it to

the external resistors R1 and R2 (see Simplified Schematic LP38690-ADJ

and Simplified Schematic LP38692-ADJ).

DAP √ √ — — WSON only - The DAP (exposed pad) functions as a thermal connection

when soldered to a copper plane. See Layout Guidelines for more

information.

EN(1) — 3 1 I The EN pin allows the part to be turned to an ON or OFF state by pulling

this pin high or low.

GND 2 2 5 — Circuit ground for the regulator. For the SOT-223 package this is thermally

connected to the die and functions as a heat sink when the soldered down

to a large copper plane.

IN 1, 6 1, 6 4 I This is the input supply voltage to the regulator. For WSON devices, both

IN pins must be tied together for full current operation (250 mA maximum

per pin).

NC(2) 3 — — — No internal connection.

OUT 5 5 3 I Regulated output voltage.

LP38690-ADJ

LP38692-ADJ

SNVS323I –DECEMBER 2004–REVISED FEBRUARY 2016

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(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) If Military/Aerospace specified devices are required, contact the TI Sales Office/ Distributors for availability and specifications.

(3) If used in a dual-supply system where the regulator load is returned to a negative supply, the output pin must be diode clamped to

ground.

(4) At elevated temperatures, device power dissipation must be derated based on package thermal resistance and heatsink values (if a

heatsink is used). When using the WSON package, refer to Leadless Leadframe Package (LLP) (SNOA401) and the WSON Mounting

section in this datasheet. If power dissipation causes the junction temperature to exceed specified limits, the device goes into thermal

shutdown.

6 Specifications

6.1 Absolute Maximum Ratings

see (1)(2)

MIN MAX UNIT

All pins (with respect to GND), VMAX –0.3 12 V

IOUT(3) Internally Limited

Power dissipation(4) Internally Limited

Junction temperature −40 150 °C

Storage temperature, Tstg −65 150 °C

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings VALUE UNIT

V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) 2000 V

6.3 Recommended Operating Conditions MIN MAX UNIT

Supply voltage, VIN 2.7 10 V

Operating junction temperature, TJ–40 125 °C

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2) Thermal resistance value RθJA is based on EIA/JEDEC High-K printed circuit board defined by: JESD51-7 - High Effective Thermal

Conductivity Test Board for Leaded Surface Mount Packages.

(3) The PCB for the WSON (NGG) package RθJA includes four (4) thermal vias under the exposed thermal pad per EIA/JEDEC JESD51-5.

6.4 Thermal Information

THERMAL METRIC(1) LP38692-ADJ LP3869x-ADJ

UNITNDC (SOT-223) NGG (WSON)

5 PINS 6 PINS

RθJA(2) Junction-to-ambient thermal resistance, High-K 68.5 50.6(3) °C/W

RθJC(top) Junction-to-case (top) thermal resistance 52.2 44.4 °C/W

RθJB Junction-to-board thermal resistance 13.0 24.9 °C/W

ψJT Junction-to-top characterization parameter 5.5 0.4 °C/W

ψJB Junction-to-board characterization parameter 12.8 25.1 °C/W

RθJC(bot) Junction-to-case (bottom) thermal resistance n/a 5.4 °C/W

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(1) Typical numbers represent the most likely parametric norm for 25°C operation.

(2) Output voltage line regulation is defined as the change in output voltage from nominal value resulting from a change in input voltage.

(3) Output voltage load regulation is defined as the change in output voltage from nominal value as the load current increases from 1 mA to

full load.

(4) Dropout voltage is defined as the minimum input to output differential required to maintain the output within 100 mV of nominal value.

6.5 Electrical Characteristics

Unless otherwise specified: typical limits are for TJ= 25°C, minimum and maximum limits apply over the full operating

temperature range; VIN = VOUT + 1 V , CIN = COUT = 10 µF, ILOAD = 10 mA. Minimum and maximum limits are specified through

testing, statistical correlation, or design.

PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT

VADJ ADJ pin voltage VIN = 2.7 V, TJ= 25°C 1.219 1.25 1.281 V

3.2 V ≤VIN ≤10 V

100 µA < ILOAD < 1 A 1.187 1.25 1.313

ΔVOUT/ΔVIN Output voltage line regulation(2) VOUT + 0.5 V ≤VIN ≤10 V

ILOAD = 25 mA 0.03 0.1 %/V

ΔVOUT/ΔILOAD Output voltage load regulation(3) 1 mA < ILOAD < 1 A

VIN = VOUT + 1 V 1.8 5 %/A

VIN – VOUT Dropout voltage(4)

VOUT = 1.8 V, ILOAD = 1 A 950 1600

VOUT = 2.5 V, ILOAD = 0.1 A 80 145

VOUT = 2.5 V, ILOAD = 1A 800 1300

VOUT = 3.3 V, ILOAD = 0.1 A 65 110

VOUT = 3.3 V, ILOAD = 1 A 650 1000

VOUT = 5 V, ILOAD = 0.1 A 45 100

VOUT = 5 V, ILOAD = 1 A 450 800

IQQuiescent current VIN ≤10 V, ILOAD = 100 µA – 1A 55 100 µA

VEN ≤0.4 V, TJ= 25°C

(LP38692-ADJ Only) 0.001 1

IL(MIN) Minimum load current VIN – VOUT ≤4 V 100 µA

IFB Foldback current limit VIN – VOUT > 5 V 450 mA

VIN – VOUT < 4 V 1500

PSRR Ripple rejection VIN = VOUT + 2 V(DC), with 1 V(p-p) /

120-Hz ripple 55 dB

TSD Thermal shutdown activation

(junction temperature) 160 °C

TSD (HYST) Thermal shutdown hysteresis

(junction temperature) 10 °C

IADJ ADJ input leakage current VADJ = 0 –1.5 V

VIN = 10 V, TJ= 25°C –100 0.01 100 nA

enOutput noise BW = 10 Hz to 10 kHz

VOUT = 3.3 V 0.7 µV/√Hz

VOUT (LEAK) Output leakage current VOUT = VOUT(NOM) + 1 V at 10 VIN

TJ= 25°C 0.5 2 µA

VEN Enable voltage (LP38692-ADJ

Only)

Output = OFF 0.4

Output = ON, VIN = 4 V 1.8

Output = ON, VIN = 6 V 3

Output = ON, VIN = 10 V 4

IEN Enable pin leakage (LP38692-

ADJ Only) VEN = 0 V or 10 V , VIN = 10 V

TJ= 25°C –1 0.001 1 µA

10 100 1k 10k 100k

FREQUENCY (Hz)

RIPPLE REJECTION (dB)

VIN (DC) = 3.25V

VIN (AC) = 1V(p-p)

COUT = 1 PF

10 100 1k 10k 100k

FREQUENCY (Hz)

RIPPLE REJECTION (dB)

VIN (DC) = 3.25V

VIN (AC) = 1V(p-p)

COUT = 100 PF

10 100 1k 10k 100k

FREQUENCY (Hz)

0.0

0.5

1.0

1.5

NOISE (PV/ Hz)

COUT = 100 PF

10 100 1k 10k 100k

FREQUENCY (Hz)

RIPPLE REJECTION (dB)

VIN (DC) = 3.25V

VIN (AC) = 1V(p-p)

COUT = 10 PF

10 100 1k 10k 100k

FREQUENCY (Hz)

0.0

0.2

0.4

0.6

0.8

1.0

1.2

NOISE/ (PVHz)

COUT = 1 PF

FREQUENCY (Hz)

10 100 1k 10k 100k

0.0

0.2

0.4

0.6

0.8

1.0

NOISE (PV/ Hz)

COUT = 10 PF

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SNVS323I –DECEMBER 2004–REVISED FEBRUARY 2016

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6.6 Typical Characteristics

Unless otherwise specified: TJ= 25°C, CIN = COUT = 10 µF, EN pin is tied to VIN (LP38692-ADJ only), VOUT = 1.25 V, VIN = 2.7

V, ILOAD = 10 mA.

Figure 1. Noise vs Frequency Figure 2. Noise vs Frequency

Figure 3. Noise vs Frequency Figure 4. Ripple Rejection

Figure 5. Ripple Rejection Figure 6. Ripple Rejection

100

-50

-100

'VOUT (mV)

VIN (V)

VIN

VOUT

VOUT = 3.3V

COUT = 10 PF

100 Ps/DIV

100

-50

-100

'VOUT (mV)

VIN (V)

VIN

VOUT

VOUT = 1.25V

40 Ps/DIV

COUT = 1 PF

-10

-20

'VOUT (mV)

VIN (V)

VIN

VOUT

VOUT = 3.3V

COUT = 100 PF

200 Ps/DIV

-20

-40

'VOUT (mV)

VIN (V)

VIN

VOUT

VOUT = 1.25V

COUT = 10 PF

200 Ps/DIV

-50 -25 0 25 50 75 100 125

TEMPERATURE (oC)

-1

-0.8

-0.6

-0.4

-0.2

0.2

0.4

% DEVIATION

-10

-20

'VOUT (mV)

VIN (V)

VIN

VOUT

VOUT = 1.25V

COUT = 100 PF

200 Ps/DIV

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Typical Characteristics (continued)

Unless otherwise specified: TJ= 25°C, CIN = COUT = 10 µF, EN pin is tied to VIN (LP38692-ADJ only), VOUT = 1.25 V, VIN = 2.7

V, ILOAD = 10 mA.

Figure 7. VADJ vs Temperature

Figure 8. Line Transient Response

Figure 9. Line Transient Response Figure 10. Line Transient Response

Figure 11. Line Transient Response Figure 12. Line Transient Response

400

200

-200

-400

'VOUT (mV)

0.01

ILOAD (A)

ILOAD

VOUT

COUT = 1 PF

10 Ps/DIV

400

200

-200

-400

'VOUT (mV)

0.01

0.5

ILOAD (A)

ILOAD

VOUT

COUT = 1 PF

10 Ps/DIV

400

200

-200

-400

'VOUT (mV)

0.01

ILOAD (A)

ILOAD

VOUT

COUT = 10 PF

40 Ps/DIV

200

100

-100

-200

'VOUT (mV)

0.01

0.5

ILOAD (A)

ILOAD

VOUT

COUT = 10 PF

40 Ps/DIV

100

-50

-100

'VOUT (mV)

VIN (V)

VIN

VOUT

VOUT = 3.3V

100 Ps/DIV

COUT = 1 PF

100

-50

-100

'VOUT (mV)

0.01

ILOAD (A)

ILOAD

VOUT

COUT = 100 PF

200 Ps/DIV

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Typical Characteristics (continued)

Unless otherwise specified: TJ= 25°C, CIN = COUT = 10 µF, EN pin is tied to VIN (LP38692-ADJ only), VOUT = 1.25 V, VIN = 2.7

V, ILOAD = 10 mA.

Figure 13. Line Transient Response Figure 14. Load Transient Response

Figure 15. Load Transient Response Figure 16. Load Transient Response

Figure 17. Load Transient Response Figure 18. Load Transient Response

0 200 400 600 800 1000

200

400

600

800

1000

1200

1400

1600

VDROPOUT (mV)

IOUT (mA)

-40°C 25°C

125°C

VOUT = 1.8V

VEN (V)

VIN = 10V

VIN = 6V

VIN = 4V

0.5

0.7

0.9

1.1

1.3

1.5

1.7

1.9

2.1

2.3

-50 -25 0 25 50 75 100 125

TEMPERATURE (oC)

0 200 400 600 800 1000

2.2

2.4

2.6

2.8

3.2

3.4

MINIMUM VIN (V)

IOUT (mA)

-40°C 25°C

125°C

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Typical Characteristics (continued)

Unless otherwise specified: TJ= 25°C, CIN = COUT = 10 µF, EN pin is tied to VIN (LP38692-ADJ only), VOUT = 1.25 V, VIN = 2.7

V, ILOAD = 10 mA.

VOUT = 1.25 V

Figure 19. VOUT vs VIN

VOUT = 1.8 V

Figure 20. VOUT vs VIN

Figure 21. VOUT vs VIN (Power-Up) Figure 22. Minimum VIN vs IOUT

Figure 23. Dropout Voltage vs IOUT Figure 24. Enable Voltage vs Temperature

-50 -25 0 25 50 75 100 125

TEMPERATURE (oC)

0.02

0.022

0.024

0.026

0.028

0.03

0.032

0.034

'VOUT/'VIN (%/V)

'VOUT/'IOUT (%/A)

-50 -25 0 25 50 75 100 125

TEMPERATURE (oC)

-3.5

-3.0

-2.5

-2.0

-1.5

-1.0

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Typical Characteristics (continued)

Unless otherwise specified: TJ= 25°C, CIN = COUT = 10 µF, EN pin is tied to VIN (LP38692-ADJ only), VOUT = 1.25 V, VIN = 2.7

V, ILOAD = 10 mA.

Figure 25. Load Regulation vs Temperature Figure 26. Line Regulation vs Temperature

ENABLE

LOGIC

MOSFET

DRIVER

FOLDBACK

CURRENT

LIMITING

1.25-V

REFERENCE

THERMAL

SHUTDOWN

OUT

GND

P-FET

ADJ

ENABLE

LOGIC

MOSFET

DRIVER

FOLDBACK

CURRENT

LIMITING

1.25-V

REFERENCE

THERMAL

SHUTDOWN

OUT

GND

P-FET

N/C

ADJ

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7 Detailed Description

7.1 Overview

The LP3869x-ADJ devices are designed to meet the requirements of portable, battery-powered digital systems

providing an accurate output voltage with fast start-up. When disabled via a low logic signal at the enable pin

(EN), the power consumption is reduced to virtually zero (LP38692-ADJ only). The LP3869x devices perform well

with a single 1-μF input capacitor and a single 1-μF ceramic output capacitor.

7.2 Functional Block Diagrams

Figure 27. LP38690-ADJ (WSON)

Figure 28. LP38692-ADJ (SOT-223, WSON)

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7.3 Feature Description

7.3.1 Foldback Current Limiting

Foldback current limiting is built into the LP3869x-ADJ which reduces the amount of output current the part can

deliver as the output voltage is reduced. The amount of load current is dependent on the differential voltage

between VIN and VOUT. Typically, when this differential voltage exceeds 5 V, the load current will limit at about

450 mA. When the VIN –VOUT differential is reduced below 4 V, load current is limited to about 1500 mA.

CAUTION

When toggling the LP38692 EN pin after the input voltage (VIN) is applied, the foldback

current limit circuitry is functional the first time that the EN pin is taken high. The

foldback current limit circuitry is non-functional the second, and subsequent, times that

the EN pin is taken high. Depending on the input and output capacitance values the

input inrush current may be higher than expected which can cause the input voltage to

droop.

If the EN pin is connected to the IN pin, the foldback current limit circuitry is functional

when VIN is applied if VIN starts from less than 0.4 V.

7.4 Device Functional Modes

7.4.1 Enable Pin (LP38692-ADJ Only)

The LP38692–ADJ has an enable pin (EN) which allows an external control signal to turn the regulator output on

and off. The enable on/off threshold has no hysteresis. The voltage signal must rise and fall cleanly, and

promptly, through the on and off voltage thresholds. The EN pin has no internal pull-up or pull-down to establish

a default condition and, as a result, this pin must be terminated either actively or passively. If the EN pin is driven

from a source that actively pulls high and low, the drive voltage must not be allowed to go below ground potential

or higher than VIN. If the application does not require the enable function, the pin must be connected directly to

the IN pin.

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8 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Customers should

validate and test their design implementation to confirm system functionality.

8.1 Application Information

8.1.1 Reverse Voltage

A reverse voltage condition exists when the voltage at the OUT pin is higher than the voltage at the IN pin.

Typically this happens when IN is abruptly taken low and COUT continues to hold a sufficient charge such that the

input-to-output voltage becomes reversed. A less-common condition is when an alternate voltage source is

connected to the output.

There are two possible paths for current to flow from the OUT pin back to the input during a reverse voltage

condition.

1. While VIN is high enough to keep the control circuity alive, and the EN pin (LP38692-ADJ only) is above the

VEN(ON) threshold, the control circuitry will attempt to regulate the output voltage. If the input voltage is less

than the programmed output voltage, the control circuit drives the gate of the pass element to the full ON

condition. In this condition, reverse current flows from the OUT pin to the IN pin, limited only by the RDS(ON) of

the pass element and the output to input voltage differential. Discharging an output capacitor up to 1000 μF

in this manner does not damage the device as the current rapidly decays. However, continuous reverse

current must be avoided. When the EN pin is low this condition is prevented.

2. The internal PFET pass element has an inherent parasitic diode. During normal operation, the input voltage

is higher than the output voltage and the parasitic diode is reverse biased. However, when VIN is below the

value where the control circuity is alive, or the EN pin is low (LP38692-ADJ only), and the output voltage is

more than 500 mV (typical) above the input voltage the parasitic diode becomes forward biased and current

flows from the OUT pin to the IN pin through the diode. The current in the parasitic diode must be limited to

less than 1-A continuous and 5-A peak.

If used in a dual-supply system where the regulator output load is returned to a negative supply, the OUT pin

must be diode clamped to ground to limit the negative voltage transition. A Schottky diode is recommended for

this protective clamp.

LP38692

-ADJ

IN OUT

GND

VOUT

VIN

VEN EN ADJ

LP38690

-ADJ

IN OUT

GND

VOUT

VIN

ADJ

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8.2 Typical Application

Figure 29. LP38690-ADJ Typical Application

VOUT = VADJ × (1 + R1/R2)

Figure 30. LP38692-ADJ Typical Application

8.2.1 Design Requirements

For typical CMOS voltage regulator applications, use the parameters listed in Table 1

Table 1. Design Parameters

DESIGN PARAMETER EXAMPLE VALUE

Minimum input voltage 2.7 V

Minimum output voltage 1.25 V

Output current 150 mA

Input and output capacitors 1 µF

Input/output capacitor ESR range 0 mΩto 100 mΩ

8.2.2 Detailed Design Procedure

8.2.2.1 Setting The Output Voltage

The output voltage is set using the external resistors R1 and R2 (see Figure 29 and Figure 30). The output

voltage is given by Equation 1:

VOUT = VADJ × (1 + ( R1 / R2 ) ) (1)

Because the part has a minimum load current requirement of 100 µA, TI recommends that R2 always be 12 kΩ

or less to provide adequate loading. Even if a minimum load is always provided by other means, it is not

recommended that very high value resistors be used for R1 and R2 because it can make the ADJ node

susceptible to noise pickup. A maximum value of 100 kΩis recommended for R2 to prevent this from occurring.

8.2.2.2 External Capacitors

Like any low-dropout regulator, external capacitors are required to assure stability. These capacitors must be

correctly selected for proper performance.

8.2.2.2.1 Input Capacitor

An input capacitor of at least 1 µF is required (ceramic recommended). The capacitor must be located not more

than one centimeter from the IN pin and returned to a clean analog ground.

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8.2.2.2.2 Output Capacitor

An output capacitor is required for loop stability. It must be located less than 1 centimeter from the device and

connected directly to the OUT and GND pins using traces which have no other currents flowing through them.

The minimum amount of output capacitance that can be used for stable operation is 1 µF. Ceramic capacitors

are recommended (the LP3869x-ADJ was designed for use with ultralow-ESR capacitors). The LP3869x-ADJ is

stable with any output capacitor ESR between 0 Ωand 100 Ω.

8.2.2.2.3 Selecting A Capacitor

It is important to note that capacitance tolerance and variation with temperature must be taken into consideration

when selecting a capacitor so that the minimum required amount of capacitance is provided over the full

operating temperature range.

8.2.2.2.3.1 Ceramic

For values of capacitance in the 10-µF to 100-µF range, ceramics are usually larger and more costly than

tantalum capacitors but give superior AC performance for bypassing high frequency noise because of very low

ESR (typically less than 10 mΩ). However, some dielectric types do not have good capacitance characteristics

as a function of voltage and temperature.

Z5U and Y5V dielectric ceramics have capacitance that drops severely with applied voltage. A typical Z5U or

Y5V capacitor can lose 60% of its rated capacitance with half of the rated voltage applied to it. The Z5U and Y5V

also exhibit a severe temperature effect, losing more than 50% of nominal capacitance at high and low limits of

the temperature range.

X7R and X5R dielectric ceramic capacitors are strongly recommended if ceramics are used, as they typically

maintain a capacitance range within ±20% of nominal over full operating ratings of temperature and voltage.

They are typically larger and more costly than Z5U/Y5U types for a given voltage and capacitance.

8.2.2.2.3.2 Tantalum

Solid tantalum capacitors have good temperature stability: a high-quality tantalum typically show a capacitance

value that varies less than 10-15% across the full temperature range of –40°C to +125°C. ESR varies only about

2× going from the high-to-low temperature limits.

The increasing ESR at lower temperatures can cause oscillations when marginal quality capacitors are used (if

the ESR of the capacitor is near the upper limit of the stability range at room temperature).

8.2.2.3 RFI/EMI Susceptibility

Radio frequency interference (RFI) and electromagnetic interference (EMI) can degrade any integrated circuit’s

performance because of the small dimensions of the geometries inside the device. In applications where circuit

sources are present which generate signals with significant high frequency energy content (> 1 MHz), care must

be taken to ensure that this does not affect the device regulator.

If RFI/EMI noise is present on the input side of the regulator (such as applications where the input source comes

from the output of a switching regulator), good ceramic bypass capacitors must be used at the IN pin of the

device.

If a load is connected to the device output which switches at high speed (such as a clock), the high-frequency

current pulses required by the load must be supplied by the capacitors on the device output. Since the bandwidth

of the regulator loop is less than 100 kHz, the control circuitry cannot respond to load changes above that

frequency. This means the effective output impedance of the device at frequencies above 100 kHz is determined

only by the output capacitors.

In applications where the load is switching at high speed, the output of the device may need RF isolation from

the load. It is recommended that some inductance be placed between the output capacitor and the load, and

good RF bypass capacitors be placed directly across the load.

PCB layout is also critical in high noise environments, since RFI/EMI is easily radiated directly into PC traces.

Noisy circuitry should be isolated from clean circuits where possible, and grounded through a separate path. At

MHz frequencies, ground planes begin to look inductive and RFI/ EMI can cause ground bounce across the

ground plane. In multi-layer PCB applications, care should be taken in layout so that noisy power and ground

planes do not radiate directly into adjacent layers which carry analog power and ground.

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SNVS323I –DECEMBER 2004–REVISED FEBRUARY 2016

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8.2.2.4 Output Noise

Noise is specified in two ways: Spot Noise or Output Noise Density is the RMS sum of all noise sources,

measured at the regulator output, at a specific frequency (measured with a 1-Hz bandwidth). This type of noise is

usually plotted on a curve as a function of frequency. Total Output Noise or Broad-Band Noise is the RMS sum

of spot noise over a specified bandwidth, usually several decades of frequencies.

Attention must be given to the units of measurement. Spot noise is measured in units µV/√Hz or nV/√Hz and total

output noise is measured in µVRMS

The primary source of noise in low-dropout regulators is the internal reference. Noise can be reduced in two

ways: by increasing the transistor area or by increasing the current drawn by the internal reference. Increasing

the area decreases the chance of fitting the die into a smaller package. Increasing the current drawn by the

internal reference increases the total supply current (GND pin current).

8.2.2.5 Power Dissipation

Knowing the device power dissipation and proper sizing of the thermal plane connected to the tab or pad is

critical to ensuring reliable operation. Device power dissipation depends on input voltage, output voltage, and

load conditions and can be calculated with Equation 2.

PD(MAX) = (VIN(MAX) – VOUT)×IOUT (2)

Power dissipation can be minimized, and greater efficiency can be achieved, by using the lowest available

voltage drop option that would still be greater than the dropout voltage (VDO). However, keep in mind that higher

voltage drops result in better dynamic (that is, PSRR and transient) performance.

On the WSON (NGD) package, the primary conduction path for heat is through the exposed power pad to the

PCB. To ensure the device does not overheat, connect the exposed pad, through thermal vias, to an internal

ground plane with an appropriate amount of copper PCB area.

On the SOT-223 (NDC) package, the primary conduction path for heat is through the pins to the PCB.

Power dissipation and junction temperature are most often related by the junction-to-ambient thermal resistance

(RθJA) of the combined PCB and device package and the temperature of the ambient air (TA), according to

Equation 3 or Equation 4:

TJ(MAX) = TA(MAX) +(RθJA × PD(MAX)) (3)

PD= TJ(MAX) – TA(MAX) / RθJA (4)

Unfortunately, this RθJA is highly dependent on the heat-spreading capability of the particular PCB design, and

therefore varies according to the total copper area, copper weight, and location of the planes. The RθJA recorded

in Thermal Information is determined by the specific EIA/JEDEC JESD51-7 standard for PCB and copper-

spreading area, and is to be used only as a relative measure of package thermal performance. For a well-

designed thermal layout, RθJA is actually the sum of the package junction-to-case (bottom) thermal resistance

(RθJCbot) plus the thermal resistance contribution by the PCB copper area acting as a heat sink.

8.2.2.6 Estimating Junction Temperature

The EIA/JEDEC standard recommends the use of psi (Ψ) thermal characteristics to estimate the junction

temperatures of surface mount devices on a typical PCB board application. These characteristics are not true

thermal resistance values, but rather package specific thermal characteristics that offer practical and relative

means of estimating junction temperatures. These psi metrics are determined to be significantly independent of

copper-spreading area. The key thermal characteristics (ΨJT and ΨJB) are given in Thermal Information and are

used in accordance with Equation 5 or Equation 6.

TJ(MAX) = TTOP + (ΨJT × PD(MAX))

where

• PD(MAX) is explained in Equation 4

• TTOP is the temperature measured at the center-top of the device package. (5)

TJ(MAX) = TBOARD + (ΨJB × PD(MAX))

where

• PD(MAX) is explained in Equation 4.

• TBOARD is the PCB surface temperature measured 1-mm from the device package and centered on the

package edge. (6)

LP38690-ADJ

LP38692-ADJ

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SNVS323I –DECEMBER 2004–REVISED FEBRUARY 2016

Product Folder Links: LP38690-ADJ LP38692-ADJ

For more information about the thermal characteristics ΨJT and ΨJB, see Semiconductor and IC Package

Thermal Metrics (SPRA953); for more information about measuring TTOP and TBOARD, see the Using New

Thermal Metrics (SBVA025); and for more information about the EIA/JEDEC JESD51 PCB used for validating

RθJA, see the Thermal Characteristics of Linear and Logic Packages Using JEDEC PCB Designs (SZZA017).

These application notes are available at www.ti.com.

8.2.3 Application Curves

Figure 31. VOUT vs VEN, ON (LP38692-ADJ Only) Figure 32. VOUT vs VEN, OFF (LP38692-ADJ Only)

9 Power Supply Recommendations

The LP3869x-ADJ devices are designed to operate from an input supply voltage range of 2.7 V to 10 V. The

input supply must be well regulated and free of spurious noise. To ensure that the LP3869x-ADJ output voltage

is well regulated, the input supply must be at least VOUT + 0.5 V, or 2.7 V, whichever is higher. A minimum

capacitor value of 1-μF is required to be within 1 cm of the IN pin.

10 Layout

10.1 Layout Guidelines

Good PC layout practices must be used or instability can be induced because of ground loops and voltage drops.

The input and output capacitors must be directly connected to the IN, OUT, and GND pins of the regulator using

traces which do not have other currents flowing in them (Kelvin connect).

The best way to do this is to lay out CIN and COUT near the device with short traces to the IN, OUT, and GND

pins. The regulator ground pin must be connected to the external circuit ground so that the regulator and its

capacitors have a single point ground.

Stability problems have been seen in applications where vias to an internal ground plane were used at the

ground points of the device and the input and output capacitors. This was caused by varying ground potentials at

these nodes resulting from current flowing through the ground plane. Using a single point ground technique for

the regulator and the regulator capacitors fix the problem. Because high current flows through the traces going

into IN and coming from OUT, Kelvin connect the capacitor leads to these pins so there is no voltage drop in

series with the input and output capacitors.

EN ADJ OUT IN

GND

CIN

COUT

Thermal Vias

VIN

VOUT

GND

VIN

VEN

GND

VOUT

3 4

COUT

Thermal Vias

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SNVS323I –DECEMBER 2004–REVISED FEBRUARY 2016

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Product Folder Links: LP38690-ADJ LP38692-ADJ

10.2 Layout Examples

Figure 33. LP38692-ADJ SOT-223 Package Figure 34. LP3869x-ADJ WSON Package

10.3 WSON Mounting

The NGG0006A (No Pullback) 6-lead WSON package requires specific mounting techniques which are detailed

in AN-1187 Leadless Leadframe Package (LLP),SNOA401. The pad style which to use with the WSON package

is the NSMD (non-solder mask defined) type. Additionally, TI recommends the PCB terminal pads to be 0.2 mm

longer than the package pads to create a solder fillet to improve reliability and inspection.

The input current is split between two IN pins, 1 and 6. The two IN pins must be connected together to ensure

that the device can meet all specifications at the rated current.

The thermal dissipation of the WSON package is directly related to the printed circuit board construction and the

amount of additional copper area connected to the DAP.

The DAP (exposed pad) on the bottom of the WSON package is connected to the die substrate with a conductive

die attach adhesive. The DAP has no direct electrical (wire) connection to any of the pins. There is a parasitic PN

junction between the die substrate and the device ground. As such, it is strongly recommend that the DAP be

connected directly to the ground at device lead 2 (that is, GND). Alternately, but not recommended, the DAP may

be left floating (that is, no electrical connection). The DAP must not be connected to any potential other than

ground.

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LP38692-ADJ

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SNVS323I –DECEMBER 2004–REVISED FEBRUARY 2016

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11 Device and Documentation Support

11.1 Device Support

11.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT

CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES

OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER

ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

11.2 Documentation Support

11.2.1 Related Documentation

For related documentation see the following:

•AN-1187 Leadless Leadframe Package (LLP) (SNOA401)

•Semiconductor and IC Package Thermal Metrics (SPRA953)

•Using New Thermal Metrics (SBVA025)

•Thermal Characteristics of Linear and Logic Packages Using JEDEC PCB Designs (SZZA017)

11.3 Related Links

Table 2 lists quick access links. Categories include technical documents, support and community resources,

tools and software, and quick access to sample or buy.

Table 2. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL

DOCUMENTS TOOLS &

SOFTWARE SUPPORT &

COMMUNITY

LP38690-ADJ Click here Click here Click here Click here Click here

LP38692-ADJ Click here Click here Click here Click here Click here

11.4 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective

contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of

Use.

TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration

among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help

solve problems with fellow engineers.

Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and

contact information for technical support.

11.5 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.6 Electrostatic Discharge Caution

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

11.7 Glossary

SLYZ022 —TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

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SNVS323I –DECEMBER 2004–REVISED FEBRUARY 2016

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Product Folder Links: LP38690-ADJ LP38692-ADJ

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

PACKAGE OPTION ADDENDUM

www.ti.com 14-Oct-2017

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LP38690SD-ADJ/NOPB ACTIVE WSON NGG 6 1000 Green (RoHS

& no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 125 L112B

LP38690SDX-ADJ/NOPB ACTIVE WSON NGG 6 4500 Green (RoHS

& no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 125 L112B

LP38692MP-ADJ/NOPB ACTIVE SOT-223 NDC 5 1000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LJNB

LP38692MPX-ADJ/NOPB ACTIVE SOT-223 NDC 5 2000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LJNB

LP38692SD-ADJ/NOPB ACTIVE WSON NGG 6 1000 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L122B

LP38692SDX-ADJ/NOPB ACTIVE WSON NGG 6 4500 Green (RoHS

& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L122B

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

PACKAGE OPTION ADDENDUM

www.ti.com 14-Oct-2017

Addendum-Page 2

(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish

value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

LP38690SD-ADJ/NOPB WSON NGG 6 1000 180.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1

LP38690SDX-ADJ/NOPB WSON NGG 6 4500 330.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1

LP38692MP-ADJ/NOPB SOT-223 NDC 5 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3

LP38692MPX-ADJ/NOPB SOT-223 NDC 5 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3

LP38692SD-ADJ/NOPB WSON NGG 6 1000 178.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1

LP38692SDX-ADJ/NOPB WSON NGG 6 4500 330.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 24-Aug-2017

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

LP38690SD-ADJ/NOPB WSON NGG 6 1000 203.0 203.0 35.0

LP38690SDX-ADJ/NOPB WSON NGG 6 4500 346.0 346.0 35.0

LP38692MP-ADJ/NOPB SOT-223 NDC 5 1000 367.0 367.0 35.0

LP38692MPX-ADJ/NOPB SOT-223 NDC 5 2000 367.0 367.0 35.0

LP38692SD-ADJ/NOPB WSON NGG 6 1000 210.0 185.0 35.0

LP38692SDX-ADJ/NOPB WSON NGG 6 4500 367.0 367.0 35.0

PACKAGE MATERIALS INFORMATION

www.ti.com 24-Aug-2017

Pack Materials-Page 2

MECHANICAL DATA

NDC0005A

www.ti.com

MECHANICAL DATA

NGG0006A

www.ti.com

SDE06A (Rev A)

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Click to View Pricing, Inventory, Delivery & Lifecycle Information:

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LP38690SD-ADJ LP38690SD-ADJ/NOPB LP38690SDX-ADJ/NOPB