LMV551/LMV552/LMV554
3 MHz, Micropower RRO Amplifiers
General Description
The LMV551/LMV552/LMV554 are high performance, low
power operational amplifiers implemented with National’s ad-
vanced VIP50 process. They feature 3 MHz of bandwidth
while consuming only 37 μA of current per amplifier, which is
an exceptional bandwidth to power ratio in this op amp class.
These amplifiers are unity gain stable and provide an excel-
lent solution for low power applications requiring a wide band-
width.
The LMV551/LMV552/LMV554 have a rail-to-rail output stage
and an input common mode range that extends below ground.
The LMV551/LMV552/LMV554 have an operating supply
voltage range from 2.7V to 5.5V. These amplifiers can operate
over a wide temperature range (−40°C to 125°C) making them
a great choice for automotive applications, sensor applica-
tions as well as portable instrumentation applications. The
LMV551 is offered in the ultra tiny 5-Pin SC70 and 5-Pin
SOT-23 package. The LMV552 is offered in an 8-Pin MSOP
package. The LMV554 is offered in the 14-Pin TSSOP.
Features
(Typical 5V supply, unless otherwise noted.)
Guaranteed 3V and 5.0V performance
High unity gain bandwidth 3 MHz
Supply current (per amplifier) 37 µA
CMRR 93 dB
PSRR 90 dB
Slew rate 1 V/µs
Output swing with 100 k load 70 mV from rail
Total harmonic distortion 0.003% @ 1 kHz, 2 k
Temperature range −40°C to 125°C
Applications
Active filter
Portable equipment
Automotive
Battery powered systems
Sensors and Instrumentation
Typical Application
20152601
20152613
Open Loop Gain and Phase vs. Frequency
PRODUCTION DATA information is current as of
publication date. Products conform to specifications per
the terms of the Texas Instruments standard warranty.
Production processing does not necessarily include
testing of all parameters.
201526 SNOSAQ5E Copyright © 1999-2012, Texas Instruments Incorporated
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for
availability and specifications.
ESD Tolerance (Note 2)
Human Body Model
LMV551/LMV552/LMV554 2 KV
Machine Model
LMV551 100V
LMV552/LMV554 250V
VIN Differential (@ V+ = 5V) ±2.5V
Supply Voltage (V+ - V)6V
Voltage at Input/Output pins V+ +0.3V, V −0.3V
Storage Temperature Range −65°C to 150°C
Junction Temperature (Note 3) 150°C
Soldering Information
Infrared or Convection (20 sec) 235°C
Wave Soldering Lead Temp. (10 sec) 260°C
Operating Ratings (Note 1)
Temperature Range (Note 3) −40°C to 125°C
Supply Voltage (V+ – V)2.7V to 5.5V
Package Thermal Resistance (θJA (Note 3))
5-Pin SC70 456°C/W
5-Pin SOT-23 234°C/W
8-Pin MSOP 235°C/W
14-Pin TSSOP 160°C/W
3V Electrical Characteristics
Unless otherwise specified, all limits are guaranteed for TA = 25°C, V+ = 3V, V = 0V, VCM = V+/2 = VO. Boldface limits apply at
the temperature extremes. (Note 4)
Symbol Parameter Conditions Min
(Note 6)
Typ
(Note 5)
Max
(Note 6)
Units
VOS Input Offset Voltage 1 3
4.5 mV
TC VOS Input Offset Average Drift 3.3 μV/°C
IBInput Bias Current (Note 7) 20 38 nA
IOS Input Offset Current 1 20 nA
CMRR Common Mode Rejection Ratio 0V VCM 2.0V 74
72
92 dB
PSRR Power Supply Rejection Ratio 3.0 V+ 5V,
VCM = 0.5V
LMV551/LMV552 80
78 92
dB
LMV554 78
76
2.7 V+ 5.5V,
VCM = 0.5V
LMV551/LMV552 80
78 92
LMV554 78
76
CMVR Input Common-Mode Voltage
Range
CMRR 68 dB
CMRR 60 dB
0
0
2.1
2.1 V
LMV551/LMV552/LMV554
2 Copyright © 1999-2012, Texas Instruments Incorporated
Symbol Parameter Conditions Min
(Note 6)
Typ
(Note 5)
Max
(Note 6)
Units
AVOL Large Signal Voltage Gain 0.4 VO 2.6,
RL = 100 k to V+/2
LMV551/LMV552 81
78 90
dB
LMV554 79
77
0.4 VO 2.6, RL = 10 k to V+/2 71
68
80
VOOutput Swing High RL = 100 k to V+/2 40 48
58
mV from
rail
RL = 10 k to V+/2 85 100
120
Output Swing Low RL = 100 k to V+/2 50 65
77
RL = 10 k to V+/2 95 110
130
ISC Output Short Circuit Current Sourcing (Note 9) 10 mA
Sinking (Note 9) 25
ISSupply Current per Amplifier 34 42
52 μA
SR Slew Rate AV = +1,
10% to 90% (Note 8)
1 V/μs
ΦmPhase Margin RL = 10 k, CL = 20 pF 75 Deg
GBW Gain Bandwidth Product 3 MHz
enInput-Referred Voltage Noise f = 100 kHz 70 nV/
f = 1 kHz 70
inInput-Referred Current Noise f = 100 kHz 0.1 pA/
f = 1 kHz 0.15
THD Total Harmonic Distortion f = 1 kHz, AV = 2, RL = 2 k 0.003 %
5V Electrical Characteristics
Unless otherwise specified, all limits are guaranteed for TA = 25°C, V+ = 5V, V = 0V, VCM = V+/2 = VO. Boldface limits apply at
the temperature extremes.
Symbol Parameter Conditions Min
(Note 6)
Typ
(Note 5)
Max
(Note 6)
Units
VOS Input Offset Voltage 1 3.0
4.5 mV
TC VOS Input Offset Average Drift 3.3 μV/°C
IBInput Bias Current (Note 7) 20 38 nA
IOS Input Offset Current 1 20 nA
CMRR Common Mode Rejection Ratio 0 VCM 4.0V 76
74
93 dB
PSRR Power Supply Rejection Ratio 3V V+ 5V to VCM = 0.5V 78
75
90
dB
2.7V V+ 5.5V to VCM = 0.5V 78
75
90
CMVR Input Common-Mode Voltage
Range
CMRR 68 dB
CMRR 60 dB
0
0
4.1
4.1 V
AVOL Large Signal Voltage Gain 0.4 VO 4.6, RL = 100 k to V+/2 78
75
90
dB
0.4 VO 4.6, RL = 10 k to V+/2 75
72
80
LMV551/LMV552/LMV554
Copyright © 1999-2012, Texas Instruments Incorporated 3
Symbol Parameter Conditions Min
(Note 6)
Typ
(Note 5)
Max
(Note 6)
Units
VOOutput Swing High RL = 100 k to V+/2 70 92
122
mV from
rail
RL = 10 k to V+/2 125 155
210
Output Swing Low RL = 100 k to V+/2 60 70
82
RL = 10 k to V+/2 110 130
155
ISC Output Short Circuit Current Sourcing (Note 9) 10 mA
Sinking (Note 9) 25
ISSupply Current Per Amplifier 37 46
54 μA
SR Slew Rate AV = +1, VO = 1 VPP
10% to 90% (Note 8)
1 V/μs
ΦmPhase Margin RL = 10 k, CL = 20 pF 75 Deg
GBW Gain Bandwidth Product 3 MHz
enInput-Referred Voltage Noise f = 100 kHz 70 nV/
f = 1 kHz 70
inInput-Referred Current Noise f = 100 kHz 0.1 pA/
f = 1 kHz 0.15
THD Total Harmonic Distortion f = 1 kHz, AV = 2, RL = 2 k 0.003 %
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Characteristics
Tables.
Note 2: Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of JEDEC)
Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
Note 3: The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is
PD = (TJ(MAX) - TA)/ θJA. All numbers apply for packages soldered directly onto a PC board.
Note 4: Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating
of the device such that TJ = TA. No guarantee of parametric performance is indicated in the electrical tables under conditions of internal self-heating where TJ >
TA.
Note 5: Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will
also depend on the application and configuration. The typical values are not tested and are not guaranteed on shipped production material.
Note 6: Limits are 100% production tested at 25°C. Limits over the operating temperature range are guaranteed through correlations using statistical quality
control (SQC) method.
Note 7: Positive current corresponds to current flowing into the device.
Note 8: Slew rate is the average of the rising and falling slew rates.
Note 9: The part is not short circuit protected and is not recommended for operation with heavy resistive loads.
LMV551/LMV552/LMV554
4 Copyright © 1999-2012, Texas Instruments Incorporated
Connection Diagrams
5-Pin SC70/ SOT-23
20152602
Top View
8-Pin MSOP
20152611
Top View
14-Pin TSSOP
20152610
Top View
Ordering Information
Package Part Number Package Marking Transport Media NSC Drawing
5-Pin SC70 LMV551MG A94 1k Units Tape and Reel MAA05A
LMV551MGX 3k Units Tape and Reel
5-Pin SOT-23 LMV551MF AF3A 1k Units Tape and Reel MF05A
LMV551MFX 3k Units Tape and Reel
8-Pin MSOP LMV552MM AH3A 1k Units Tape and Reel MUA08A
LMV552MMX 3.5k Units Tape and Reel
14-Pin TSSOP LMV554MT LMV554MT 94 Units/Rail MTC14
LMV554MTX 2.5k Units Tape and Reel
LMV551/LMV552/LMV554
Copyright © 1999-2012, Texas Instruments Incorporated 5
Typical Performance Characteristics
Open Loop Gain and Phase with Capacitive Load
20152614
Open Loop Gain and Phase with Resistive Load
20152615
Open Loop Gain and Phase with Resistive Load
20152616
Open Loop Gain and Phase with Resistive Load
20152617
Open Loop Gain and Phase with Resistive Load
20152618
Slew Rate vs. Supply voltage
20152619
LMV551/LMV552/LMV554
6 Copyright © 1999-2012, Texas Instruments Incorporated
Small Signal Transient Response
20152620
Large Signal Transient Response
20152621
Small Signal Transient Response
20152622
Input Referred Noise vs. Frequency
20152623
THD+N vs. Amplitude @ 3V
20152624
THD+N vs. Amplitude @ 5V
20152625
LMV551/LMV552/LMV554
Copyright © 1999-2012, Texas Instruments Incorporated 7
THD+N vs. Amplitude
20152626
THD+N vs. Amplitude
20152627
Supply Current vs. Supply Voltage
20152628
VOS vs. VCM
20152629
VOS vs. VCM
20152630
VOS vs. Supply Voltage
20152631
LMV551/LMV552/LMV554
8 Copyright © 1999-2012, Texas Instruments Incorporated
IBIAS vs. VCM
20152632
IBIAS vs. VCM
20152633
IBIAS vs. Supply Voltage
20152634
Positive Output Swing vs. Supply Voltage
20152635
Negative Output Swing vs. Supply Voltage
20152636
Positive Output Swing vs. Supply Voltage
20152637
LMV551/LMV552/LMV554
Copyright © 1999-2012, Texas Instruments Incorporated 9
Negative Output Swing vs. Supply Voltage
20152638
Applications Information
ADVANTAGES OF THE LMV551/LMV552/LMV554
Low Voltage and Low Power Operation
The LMV551/LMV552/LMV554 have performance guaranteed at supply voltages of 3V and 5V and are guaranteed to be operational
at all supply voltages between 2.7V and 5.5V. For this supply voltage range, the LMV551/LMV552/LMV554 draw the extremely
low supply current of less than 37 μA per amp.
Wide Bandwidth
The bandwidth to power ratio of 3 MHz to 37 μA per amplifier is one of the best bandwidth to power ratios ever achieved. This
makes these devices ideal for low power signal processing applications such as portable media players and instrumentation.
Low Input Referred Noise
The LMV551/LMV552/LMV554 provide a flatband input referred voltage noise density of 70 nV/ , which is significantly better
than the noise performance expected from an ultra low power op amp. They also feature the exceptionally low 1/f noise corner
frequency of 4 Hz. This noise specification makes the LMV551/LMV552/LMV554 ideal for low power applications such as PDAs
and portable sensors.
Ground Sensing and Rail-to-Rail Output
The LMV551/LMV552/LMV554 each have a rail-to-rail output stage, which provides the maximum possible output dynamic range.
This is especially important for applications requiring a large output swing. The input common mode range includes the negative
supply rail which allows direct sensing at ground in a single supply operation.
Small Size
The small footprints of the LMV551/LMV552/LMV554 packages save space on printed circuit boards, and enable the design of
smaller and more compact electronic products. Long traces between the signal source and the op amp make the signal path
susceptible to noise. By using a physically smaller package, the amplifiers can be placed closer to the signal source, reducing noise
pickup and enhancing signal integrity
STABILITY OF OP AMP CIRCUITS
Stability and Capacitive Loading
As seen in the Phase Margin vs. Capacitive Load graph, the phase margin reduces significantly for CL greater than 100 pF. This
is because the op amp is designed to provide the maximum bandwidth possible for a low supply current. Stabilizing them for higher
capacitive loads would have required either a drastic increase in supply current, or a large internal compensation capacitance,
which would have reduced the bandwidth of the op amp. Hence, if the LMV551/LMV552/LMV554 are to be used for driving higher
capacitive loads, they will have to be externally compensated.
LMV551/LMV552/LMV554
10 Copyright © 1999-2012, Texas Instruments Incorporated
20152603
FIGURE 1. Gain vs. Frequency for an Op Amp
An op amp, ideally, has a dominant pole close to DC, which causes its gain to decay at the rate of 20 dB/decade with respect to
frequency. If this rate of decay, also known as the rate of closure (ROC), remains the same until the op amp’s unity gain bandwidth,
the op amp is stable. If, however, a large capacitance is added to the output of the op amp, it combines with the output impedance
of the op amp to create another pole in its frequency response before its unity gain frequency (Figure 1). This increases the ROC
to 40 dB/ decade and causes instability.
In such a case a number of techniques can be used to restore stability to the circuit. The idea behind all these schemes is to modify
the frequency response such that it can be restored to an ROC of 20 dB/decade, which ensures stability.
In the Loop Compensation
Figure 2 illustrates a compensation technique, known as ‘in the loop’ compensation, that employs an RC feedback circuit within
the feedback loop to stabilize a non-inverting amplifier configuration. A small series resistance, RS, is used to isolate the amplifier
output from the load capacitance, CL, and a small capacitance, CF, is inserted across the feedback resistor to bypass CL at higher
frequencies.
20152604
FIGURE 2. In the Loop Compensation
The values for RS and CF are decided by ensuring that the zero attributed to CF lies at the same frequency as the pole attributed
to CL. This ensures that the effect of the second pole on the transfer function is compensated for by the presence of the zero, and
that the ROC is maintained at 20 dB/decade. For the circuit shown in Figure 2 the values of RS and CF are given by Equation 1.
Values of RS and CF required for maintaining stability for different values of CL, as well as the phase margins obtained, are shown
in Table 1. RF, RIN, and RL are to be 10 k, while ROUT is 340Ω.
(1)
LMV551/LMV552/LMV554
Copyright © 1999-2012, Texas Instruments Incorporated 11
TABLE 1.
CL (pF) RS (Ω) CF (pF) Phase Margin (°)
50 340 8 47
100 340 15 42
150 340 22 40
Although this methodology provides circuit stability for any load capacitance, it does so at the price of bandwidth. The closed loop
bandwidth of the circuit is now limited by RF and CF.
Compensation by External Resistor
In some applications it is essential to drive a capacitive load without sacrificing bandwidth. In such a case, in the loop compensation
is not viable. A simpler scheme for compensation is shown in Figure 3. A resistor, RISO, is placed in series between the load
capacitance and the output. This introduces a zero in the circuit transfer function, which counteracts the effect of the pole formed
by the load capacitance and ensures stability. The value of RISO to be used should be decided depending on the size of CL and
the level of performance desired. Values ranging from 5 to 50 are usually sufficient to ensure stability. A larger value of RISO
will result in a system with less ringing and overshoot, but will also limit the output swing and the short circuit current of the circuit.
20152612
FIGURE 3. Compensation by Isolation Resistor
Typical Application
ACTIVE FILTERS
With a wide unity gain bandwidth of 3 MHz, low input referred noise density and a low power supply current, the LMV551/LMV552/
LMV554 are well suited for low-power filtering applications. Active filter topologies, such as the Sallen-Key low pass filter shown in
Figure 4, are very versatile, and can be used to design a wide variety of filters (Chebyshev, Butterworth or Bessel). The Sallen-
Key topology, in particular, can be used to attain a wide range of Q, by using positive feedback to reject the undesired frequency
range.
In the circuit shown in Figure 4, the two capacitors appear as open circuits at lower frequencies and the signal is simply buffered
to the output. At high frequencies the capacitors appear as short circuits and the signal is shunted to ground by one of the capacitors
before it can be amplified. Near the cut-off frequency, where the impedance of the capacitances is on the same order as RG and
RF, positive feedback through the other capacitor allows the circuit to attain the desired Q.
20152609
FIGURE 4. Sallen-Key Filter
LMV551/LMV552/LMV554
12 Copyright © 1999-2012, Texas Instruments Incorporated
Physical Dimensions inches (millimeters) unless otherwise noted
5-Pin SC70
NS Package Number MAA05A
5-Pin SOT-23
NS Package Number MF05A
LMV551/LMV552/LMV554
Copyright © 1999-2012, Texas Instruments Incorporated 13
8-Pin MSOP
NS Package Number MUA08A
14-Pin TSSOP
NS Package Number MTC14
LMV551/LMV552/LMV554
14 Copyright © 1999-2012, Texas Instruments Incorporated
Notes
LMV551/LMV552/LMV554
Copyright © 1999-2012, Texas Instruments Incorporated 15
Notes
Copyright © 1999-2012, Texas Instruments
Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All
semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time
of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated