THE WORLD LEADER IN DSP AND ANALOG
Bluetooth™Chip Set Solution
from Texas Instruments
Product Bulletin
TI's low-power, affordable Bluetooth Chip Set supports the latest Bluetooth
specification with just two devices — an RF transceiver and a digital
baseband controller. An all-digital interface between the devices, plus on-
chip support for standard communication interfaces and TMS320™ digital
signal processors (DSPs), make the chip set easy to implement in
Bluetooth applications.
Key Features:
• Complete two-chip solution
supports current Bluetooth™
specification
• Chip set includes:
- Digital baseband controller with
on-chip Bluetooth, ROM-based
software stack up to Host
Controller Interface (HCI)
- RF transceiver
• No external flash memory
required
• Extremely sensitive reception of
-86 dBm extends range up to five
times Bluetooth requirements
• Point-to-point support for
simultaneous voice and data
communication
• Supports up to 1 Mbps
transmission in 2.4-GHz ISM band
• Low-power operation: around
10 mA for typical Bluetooth
voice application
• All-digital interface between
chips simplifies design
• Integrates easily with TMS320™
DSPs for use in mobile
Internet appliances
Host:
Cell-phone
PC
Camera
ROM, RAM
I/F
RISC
Processor
Bluetooth
Core
Power
Management
Unit
Bluetooth Baseband
BSN6030
Bluetooth RF
Transceiver
TRF6001
Hardware
The Bluetooth Chip Set from
Texas Instruments provides a
two-chip solution that supports
the latest Bluetooth specification
for short-distance wireless com-
munications. Consisting of the
BSN6030 Bluetooth Baseband
Controller and the TRF6001
Bluetooth Radio Frequency (RF)
Transceiver, the chip set inte-
grates the complete Bluetooth
software stack up to the Host
Controller Interface (HCI), with
no external flash memory
required, for a complete
Bluetooth system solution.
Operating in the 2.4-GigaHertz
(GHz) ISM band worldwide, TI's
Bluetooth solution supports
simultaneous point-to-point
transmission of voice and data,
with rates up to 1 Megabit per
second (Mbps). The chip set not
only saves space and power but
also can extend the range of
transmission up to five times the
distance of a standard implemen-
tation of the Bluetooth
specification. Among the many
types of systems that can take
advantage of the TI solution are:
• Digital cellular phones
• Internet appliances
• Cordless phones
• Hands-free phone headsets
• Wireless home networks for
PCs, PDAs
• Remote game and video
controls
• PC-peripheral communications,
including printers, digital
cameras, internet audio players
bluetooth_a4.qxd 11/3/00 8:56 AM Page 1
TI's Bluetooth Chip Set includes the complete Bluetooth software stack up to
the Host Controller Interface (HCI) in on-chip ROM, eliminating the need for
external flash memory.
Bluetooth Profiles
RFCOMM; TCP/IP;...
L2CAP
Audio
HCI Driver HCI Driver
I/F Driver I/F Driver
Host UART UART
HCI Firmware
Link Manager
Link Controller
Bluetooth
Baseband
Software
MicroStar Junior™ Packaging
TI’s advanced MicroStar Junior
packaging helps minimize your circuit
board’s size, weight and cost. These
high-performance packages provide
excellent heat dissipation and low
inductance in a low-profile, chip-scale
footprint. MicroStar Junior packages
are available with fully or selectively
populated ball grids.
Extended Range
The TI Bluetooth solution offers
an extended sensitivity of -86
decibels with reference to 1
milliWatt (0 dBm) and a bit error
rate (BER) of 10 -3. This figure
represents an increase of 16 dB
beyond the sensitivity required
by the standard. Under certain
conditions, a signal that a basic
implementation receives at no
greater distance than 10 meters
can be received by the TI solution
at up to 50 meters. This extra
sensitivity allows applications
using TI’s Bluetooth solution to
operate more reliably at longer
distances.
Low Power Consumption
Both baseband controller and RF
transceiver operate at 3.3 V
and employ power-down modes
to prolong system operation
between battery charges. The
BSN6030 controller features an
extra-low-power 1.8-V core for
additional power savings. The high
efficiency of the chip set keeps
power consumption to about 10
milliamperes (mA) for a typical
Bluetooth voice application.
Worldwide Operation
The TRF6001 transceiver employs
frequency-hopping spread
spectrum (FHSS) technology
for maximum robustness of the
radio link. The complete chipset
is designed for worldwide regula-
tory compliance for operation in
the 2.4-GHz requency band.
High Performance
The BSN6030 controller achieves
high performance with an inte-
grated 32-bit ARM7™RISC
microprocessor, plus 16K words
of RAM for data storage and 112K
words of programmed ROM.
In addition to running the
complete Bluetooth software stack
up to the HCI, the device offers
processing power for Bluetooth
profiles or general application
software. To save external compo-
nents and simplify design, support
for A-Law and µ-Law codecs is
included on chip, along with a
high-speed UART serial interface.
Flexible Clocking
The chip set can operate with
flexible clock sources ranging
from 10 to 20 MHz in increments
of 1 MHz. Since system clock
requirements vary, this versatility
permits designers to use TI's
Bluetooth chip set in a wide v
ariety of applications.
bluetooth_a4.qxd 11/3/00 8:56 AM Page 2
Ease of Design
An all-digital interface between
the devices, plus several integrat-
ed interfaces to standard commu-
nications, make it easy to imple-
ment TI's Bluetooth solution in a
system. The chip set also con-
nects easily to a TMS320 DSP for
added value in high-performance
real-time applications such as
mobile Internet appliances and
wireless digital phones with
Bluetooth capabilities.
BSN6030 Bluetooth Baseband
Controller
• Embedded ARM7 RISC
microprocessor
• 16K word RAM, 112K word
fully programmed ROM with
Bluetooth software stack
up to HCI including UART
transport layer
• 3.3-V single supply with
power-down modes
• Ultra-low-power 1.8-V core
• On-chip PLL for variable clock
source from 10 to 20 MHz
• Integrated UART interface
• Glueless connection to
external Codecs
• Space-saving MicroStar
Junior BGA package options
down to a 6x6 mm footprint
TRF6001 Bluetooth
RF Transceiver
• 2.4-GHz frequency-hopping
spread spectrum (FHSS)
radio
• 3.3-V single supply with
power-down mode
• -86 dB sensitivity at
BER = 10 -3
• Single-conversion receiver
• Low-noise amplifier with
gain control
• On-chip PLL for variable
clock source from 10 to
20 MHz
• Space-saving 5x5 mm,
56-lead MicroStar Junior
BGA package
The Bluetooth Chip Set is fully
supported by an evaluation mod-
ule (EVM), documentation and
reference design, as well as by
TI's extensive network of
wireless applications specialists
throughout the world.
Space Savings
TI's Bluetooth chip set is designed
to save space in mobile applica-
tions. No external flash memory
is required for program code,
saving cost and space, as well as
eliminating potential problems
with the availability of flash
devices.
The BSN6030 controller is
available in a range of small-scale
MicroStar Junior ball grid arrays
(BGA), down to an 80-lead, 6x6
mm package. The TRF6001
transceiver is available in a
56-lead MicroStar Junior BGA
that measures just 5x5 mm.
Together, the chips require less
board area than a single-chip
8x8 mm solution.
TI's Roadmap for Bluetooth
TI is committed to developing a
complete family of low-power
solutions for Bluetooth applica-
tion needs. TI's plans for future
generations of Bluetooth products
include integration of functionali-
ty such as low intermediate fre-
quency (IF) filtering, and support
for point-to-multipoint operations.
For More Information
To learn more about TI's
Bluetooth Chip Set, or other TI
short-distance wireless products,
call your regional TI sales office
or visit
www.ti.com/sc/bluetooth
bluetooth_a4.qxd 11/3/00 8:56 AM Page 3
The red/black banner, TMS320 and MicroStar Junior are trademarks of Texas Instruments.
Bluetooth is a trademark of Telefonaktiebolaget L M Ericsson.
ARM is a trademark of Advanced RISC Machines, Ltd.
All other trademarks are the property of their respective owners.
© 2000 Texas Instruments Incorporated
Printed in the U.S.A. SWCT002
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