MP62340-1/MP62341-1
3.3V/5V, Dual-Channel 1A
Current-Limited Power Distribution Switch es
with Output Discharge
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The Future of Analog IC Technology
DESCRIPTION
The MP62340-1/MP62341-1 Power Distribution
Switch features internal current limiting to
prevent damage to host devices due to faulty
load conditions. The MP62340-1/MP62341-1
analog switch has 85m on-resistance and
operates from 2.7V to 5.5V input. It is available
with guaranteed current limits, making it ideal
for load switching applications. The MP62340-
1/MP62341-1 has built-in protection for both
over current and increased thermal stress. For
over current, the device will limit the current by
changing to a constant current mode.
As the temperature increases as a result of
short circuit, then the device will shut off. The
device will recover once the device temperature
reduces to approx 120°C.
The MP62340-1/MP62341-1 involves discharge
function that provides a resistive discharge path
for the external output capacitor when the part
is disabled.
The MP62340-1/MP62341-1 is available in 8-
pin MSOP package with exposed pad and
SOIC package without exposed pad.
FEATURES
• 1A Continuous Current
• Accurate Current Limit
• Output Discharge Function
• 2.7V to 5.5V Supply Range
• 140µA Quiescent Current
• 85m MOSFET
• Thermal-Shutdown Protection
• Under-Voltage Lockout
• 8ms FLAG Deglitch Time
• No FLAG Glitch During Power Up
• Reverse Current Blocking
• Active High & Active Low Options
• UL Recognized: E322138
APPLICATIONS
• PDAs
• Portable GPS
• Notebook PC
• Set-top-box
• Telecom and Network Systems
• PC Card Hot Swap
• USB Power Distribution
“MPS” and “The Future of Analog IC Technology” are Trademarks of Monolithic
Power Systems, Inc.
TYPICAL APPLICATION
OUT2
MP62340-1/
MP62341-1
OUT1
1
2
3
45
6
7
8
+5V
To USB Controller Output 1
Output 2
FLAG1
FLAG2
EN1*
IN
GND
EN2*
* EN is active high for MP62341-1
MP62340-1/MP62341-1 –CURRENT-LIMITED POWER DISTRIBUTION SWITCHES
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ORDERING INFORMATION
Part Number Enable Switch Maximum
Continuous
Load Current
Typical Sh ort-
Circuit Current
@ TA=25C Package Top Marking Temperature
MP62340DS-1* SOIC8 M62340-1
MP62340DH-1
Active
Low MSOP8E 62340
MP62341DS-1 SOIC8 M62341-1
MP62341DH-1
Active
High
Dual 1A 1.5A
MSOP8E 62341
–40°C to +85°C
* For Tape & Reel, add suffix –Z (e.g. MP62340DS–1–Z).
For RoHS compliant packaging, add suffix –LF (e.g. MP62340DS–1–LF–Z)
PACKAGE REFERENCE
GND
IN
EN1*
EN2*
FLAG1
OUT1
OUT2
FLAG2
1
2
3
4
8
7
6
5
TOP VIEW
SOIC8
1
2
3
4
8
7
6
5
TOP VIEW
GND
IN
EN1*
EN2*
FLAG1
OUT1
OUT2
FLAG2
EXPOSED PAD
ON BACKSIDE
CONNECT TO GND
MSOP8E
MP62340-1/MP62341-1
Dual-Channel
(* EN is active high for MP62341-1)
ABSOLUTE MAXIMUM RATINGS (1)
IN .................................................-0.3V to +6.0V
EN, FLAG, OUT to GND ..............-0.3V to +6.0V
Continuous Power Dissipation (TA = +25°C) (2)
MSOP8E.................................................... 2.3W
SOIC8..................................................... 1.4W
Junction Temperature...............................150°C
Lead Temperature ....................................260°C
Storage Temperature...............–65°C to +150°C
Operating Temperature..............–40°C to +85°C
Thermal Resistance (3) θJA θJC
SOIC8..................................... 90 ...... 42... °C/W
MSOP8E................................. 55 ...... 12... °C/W
Notes:
1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a function of the
maximum junction temperature TJ (MAX), the junction-to
ambient thermal resistance JA, and the ambient temperature
TA. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by PD (MAX) = (TJ
(MAX) - TA)/JA. Exceeding the maximum allowable powe
r
dissipation will cause excessive die temperature, and the
regulator will go into thermal shutdown. Internal thermal
shutdown circuitry protects the device from permanent
damage.
3) Measured on JESD51-7， 4-layer PCB.
MP62340-1/MP62341-1 –CURRENT-LIMITED POWER DISTRIBUTION SWITCHES
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ELECTRICAL CHARACTERISTICS (4)
VIN=5V, TA=+25°C, unless otherwise noted.
Parameter Condition Min Typ Max Units
IN Voltage Range 2.7 5.5 V
Supply Current One Channel Enabled, IOUT=0, One
Switch ON 90 120 µA
Supply Current Both Channels Enabled, IOUT=0, Both
Switches ON 140 160 µA
Shutdown Current Device Disable, VOUT=float, VIN=5.5V 1 µA
Off Switch Leakage Device Disable, VIN=5.5V 1 µA
Current Limit 1.1 1.5 2.2 A
Trip Current Current Ramp (slew rate100A/s) on
Output 1.7 2.4 A
Under-voltage Lockout Rising Edge 1.95 2.65 V
Under-voltage Hysteresis 250 mV
FET On Resistance IOUT=100mA (-40°CTA+85°C) 85 130 m
EN Input Logic High Voltage 2 V
EN Input Logic Low Voltage 0.8 V
FLAG Output Logic Low Voltage ISINK=5mA 0.4 V
FLAG Output High Leakage
Current VIN=VFLAG=5.5V 1 µA
Thermal Shutdown 140 °C
Thermal Shutdown Hysteresis 20 °C
VIN=5.5V, CL =1µF, RL =5.5 0.9 ms
VOUT Rising Time, Tr (5) VIN=2.7V, CL =1µF, RL =5.5 1.7 ms
VIN=5.5V, CL =1µF, RL =5.5 0.5 ms
VOUT Falling Time, Tf (6) VIN=2.7V, CL =1µF, RL =5.5 0.5 ms
Turn On Time, Ton (7) CL=100µF, RL=5.5 3 ms
Turn Off Time, Toff (8) CL=100µF, RL=5.5 10 ms
Discharge Resistance 100
FLAG Deglitch Time 4 8 15 ms
EN Input Leakage 1
µA
Reverse Leakage Current VOUT=5.5V, VIN=GND 0.2 µA
Notes:
4) Production test at +25°C. Specifications over the temperature range are guaranteed by design and characterization.
5) Measured from 10% to 90% output signal.
6) Measured from 90% to 10% output signal.
7) Measured from 50% EN signal to 90% output signal.
8) Measured from 50% EN signal to 10% output signal.
MP62340-1/MP62341-1 –CURRENT-LIMITED POWER DISTRIBUTION SWITCHES
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PIN FUNCTIONS
SOIC8
MSOP8E Name Description
1
GND,
Exposed Pad
(MSOP8E)
Ground. MSOP8E exposed pad must be connected to a ground plane for optional
thermal performance.
2 IN Input Voltage. Accepts 2.7V to 5.5V input.
3 EN1 Active Low: (MP62340-1), Active High: (MP62341-1)
4 EN2 Active Low: (MP62340-1), Active High: (MP62341-1)
5 FLAG2 IN-to-OUT2 Over-current, active-low output flag. Open-Drain.
6 OUT2 IN-to-OUT2 Power-Distribution Switch Output.
7 OUT1 IN-to-OUT1 Power-Distribution Switch Output
8 FLAG1 IN-to-OUT1 Over-current, active-low output flag. Open-Drain.
TYPICAL PERFORMANCE CHARACTERISTICS
TA = +25ºC, unless otherwise noted.
V
I
(EN
X
)
VI(ENX)
V
O
(OUT
X
)
OUT
X
RL CL
V
O
(OUT
X
)
VO(OUTX)
50% 50% 50% 50%
90% 90%
90% 90%
10%
10% 10%
10%
t
on
t
r
t
f
ton
t
off toff
VOLTAGE WAVEFORMS
TEST CIRCUIT
Figure 1—Test Circuit and Voltage Waveforms
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TYPICAL PERFORMANCE CHARACTERISTICS
VIN=5V, CL=1µF,Ta=25℃, for only one channel unless otherwise noted.
INPUT VOLTAGE (V) INPUT VOLTAGE (V) INPUT VOLTAGE (V)
Input to Output Voltage vs.
Load Current Current Limit vs.
Input Voltage
Supply Current, Output
Enable vs. Input Voltage Static Drain-Source On-State
Resistance Variation vs.
Ambient Temperature
I
O
=0.1A
Static Drain-Source On-State
Resistance vs. Input Voltage
I
O
=1A
INPUT VOLTAGE (V) INPUT VOLTAGE (V)
1
1.5
2
2.5
3
3.5
2.5 3 3.5 4 4.5 5 5.5 6
TURN ON DELAY (ms)
1
1.1
1.2
1.3
1.4
1.5
2.5 3 3.5 4 4.5 5 5.5 6
TURN OFF DELAY (ms)
0.8
0.9
1
1.1
1.2
1.3
1.4
1.5
1.6
1.7
2.5 3 3.5 4 4.5 5 5.5 6
RISE TIME(ms)
30
35
40
45
50
55
60
65
2.5 3 3.5 4 4.5 5 5.5 6 2.5 3 3.5 4 4.5 5 5.5 6
FALL TIME (us)
60
70
80
90
100
110
SUPPLY CURRENT (uA)
-25
-20
-15
-10
-5
0
5
10
15
20
25
-40 -20 020 406080
AMBIENT TEMPERATURE (
o
C)
STATIC DRAIN-SOURCE ON-STATE
RESISTANCE VARIATION (%)
70
80
90
100
110
120
130
140
2.5 3 3.5 4 4.5 5 5.5 6
INPUT VOLTAGE (V)
STATIC DRAIN-SOURCE ON-STATE
0
20
40
60
80
100
120
140
0 0.2 0.4 0.6 0.8 1
OUTPUT CURRENT (A)
INPUT TO OUTPUT VOLTAGE (mV)
Vin=5.5V
Vin=5V
Vin=4V
Vin=2.7V
Vin=3.3V
1.4
1.5
1.6
1.7
1.8
2.5 3 3.5 4 4.5 5 5.5 6
INPUT VOLTAGE (V)
CURRENT LIMIT (A)
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TYPICAL PERFORMANCE CHARACTERISTICS(continued)
VIN=5V, CL=1µF,Ta=25℃, for only one channel, unless otherwise noted.
V
OUT
5V/div
I
OUT
1A/div
100us/div
Threshold Trip Current with
Ramped Load
on Enabled Device
Short Circuit Current,
Device Enabled into Short
4ms/div400us/div
EN
5V/div
Flag
5V/div
V
OUT
2V/div
I
OUT
1A/div
EN
5V/div
Flag
5V/div
V
OUT
5V/div
I
OUT
1A/div
I
OUT
500mA/div
I
OUT
1A/div
EN
5V/div
Flag
5V/div
V
OUT
2V/div
V
OUT
2V/div
I
OUT
1A/div
EN
5V/div
Flag
5V/div
EN
5V/div
400us/div 400us/div
400us/div
THRESHOLD TRIP CURRENT (A)
INPUT VOLTAGE (V)
Threshold Trip Current vs.
Input Voltage Current Limit Response Time
vs. Peak Current
PEAK CURRENT (A)
2.5 3 3.5 4 4.5 5 5.5 6
1.6
1.7
1.8
1.9
2
2.1
2.2
2.3
4
8
12
16
20
2 4 6 8 101214161820
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TYPICAL PERFORMANCE CHARACTERISTICS(continued)
VIN=5V, CL=1µF,Ta=25℃, for only one channel, unless otherwise noted.
Flag
5V/div
V
OUT
2V/div
I
OUT
500mA/div
2ms/div
Inrush Current with
Different Load Capacitance
IOUT=1A
1ms/div
Ramped Load
on Enabled Device
2ms/div
Flag
2V/div
Turn Off Delay and Fall Time
with Output Discharge
IOUT=0A
I
OUT
1A/div
I
OUT
1A/div
EN
5V/div
EN
5V/div
Flag
5V/div
I
OUT
500mA/div 200us/div
470uF
220uF
100uF
MP62340-1/MP62341-1 –CURRENT-LIMITED POWER DISTRIBUTION SWITCHES
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FUNCTION BLOCK DIAGRAM
Thermal
Sense
Deglitch
FLAG2
Logic
Thermal
Sense
Charge
Pump
EN1*
IN
EN2*
Charge
Pump
UVLO
Deglitch
Current
Sense
Current
Sense
Logic
GND
AMP
--
+
AMP
--
+
FLAG1
Vref
+
-
OUT1
OUT2
* EN is active high for MP62341-1
Figure 2—Functional Block Diagram
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DETAILED DESCRIPTION
Over Current
When the load exceeds trip current (minimum
threshold current triggering constant-current
mode) or a short is present, MP62340-
1/MP62341-1 switches into to a constant-current
mode (current limit value). MP62340-1/MP62341-
1 will be shutdown only if the over current
condition stays long enough to trigger thermal
protection.
Trigger over current protection for different
overload conditions occurring in applications:
1) The output has been shorted or overloaded
before the device is enabled or input applied.
MP62340-1/MP62341-1 detects the short or
overload and immediately switches into a
constant-current mode.
2) A short or an overload occurs after the device
is enabled. After the current-limit circuit has
been tripped (reached the trip current
threshold), the device switches into constant-
current mode. However, high current may
flow for a short period of time before the
current-limit circuit can react.
3）Output current has been gradually increased
beyond the recommended operating current.
The load current rises until the trip current
threshold is reached or until the thermal limit
of the device is exceeded. The MP62340-1/
MP62341-1 is capable of delivering current up
to the trip current threshold without damaging
the device. Once the trip threshold has been
reached, the device switches into its constant-
current mode.
Flag Response
The FLAG pin is an open drain configuration.
This FAULT will report a fail mode after an 8ms
deglitch timeout. This is used to ensure that no
false fault signals are reported. This internal
deglitch circuit eliminates the need for extend
components. The FLAG pin is not deglitched
during an over temp or voltage lockout.
Thermal Protection
The purpose of thermal protection is to prevent
damage in the IC by allowing exceptive current to
flow and heating the junction. The die temp. is
internally monitored until the thermal limit is
reached. Once this temp. is reached, the switch
will turn off and allow the chip to cool. The switch
has a built-in hysteresis.
Under-voltage Lockout (UVLO)
This circuit is used to monitor the input voltage to
ensure that the MP62340-1/MP62341-1 is
operating correctly. This UVLO circuit also
ensures that there is no operation until the input
voltage reaches the minimum spec.
Enable
The logic pin disables the chip to reduce the
supply current. The device will operate once the
enable signal reaches the appropriate level. The
input is compatible with both COMS and TTL.
Output Discharge
The part involves a discharge function that
provides a resistive discharge path for the
external output capacitor. The function will be
active when the part is disabled (Input voltage is
under UVLO or enable is deasserted) and it will
be done in a very limited time.
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APPLICATION INFORMATION
Power-Supply Considerations
Greater than 10µF capacitor between IN and
GND is recommended. This precaution reduces
power-supply transients that may cause ringing
on the input and improves the immunity of the
device to short-circuit transients.
In order to achieve smaller output load transient,
placing a high-value electrolytic capacitor on the
output pin(s) is recommended when the output
load is heavy.
OUT2
MP62340-1/
MP62341-1
OUT1
1
2
3
45
6
7
8
+5V
To USB Controller Output 1
Output 2
FLAG1
FLAG2
EN1*
IN
GND
EN2*
* EN is active high for MP62341-1
Figure 3—Application Circuit
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PACKAGE INFORMATION
MSOP8E (EXPOSED PAD)
NOTE:
1) CONTROL DIMENSION IS IN INCHES. DIMENSION IN BRACKET IS
IN MILLIMETERS.
2) PACKAGE LENGTH DOES NOT INCLUDE MOLD FLASH,
PROTRUSION OR GATE BURR.
3) PACKAGE WIDTH DOES NOT INCLUDE INTERLEAD FLASH OR
PROTRUSION.
4) LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING)
SHALL BE 0.004" INCHES MAX.
5) PIN 1 IDENTIFICATION HAS HALF OR FULL CIRCLE OPTION.
6) DRAWING MEETS JEDEC MO-187, VARIATION AA-T.
7) DRAWING IS NOT TO SCALE.
0.030(0.75)
0.037(0.95) 0.043(1.10)MAX
0.002(0.05)
0.006(0.15)
FRONT VIEW
SEATING PLANE
PIN 1 ID
(NOTE 5)
0.114(2.90)
0.122(3.10) 0.187(4.75)
0.199(5.05)
14
5
8
0.010(0.25)
0.014(0.35) 0.0256(0.65)BSC
0.114(2.90)
0.122(3.10)
TOP VIEW
0.004(0.10)
0.008(0.20)
SIDE VIEW
GAUGE PLANE
0.010(0.25)
0.016(0.40)
0.026(0.65)
0o-6o
RECOMMENDED LAND PATTERN
0.016(0.40) 0.0256(0.65)BSC
0.100(2.54)
0.181(4.60)
0.075(1.90)
0.040(1.00)
Exposed Pad
BOTTOM VIEW
0.087(2.20)
0.099(2.50)
0.062(1.58)
0.074(1.88)
MP62340-1/MP62341-1 –CURRENT-LIMITED POWER DISTRIBUTION SWITCHES
NOTICE: The information in this document is subject to change without notice. Users should warrant and guarantee that third
party Intellectual Property rights are not infringed upon when integrating MPS products into any application. MPS will not
assume any legal responsibility for any said applications.
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SOIC8
0.016(0.41)
0.050(1.27)
0o-8o
DETAIL "A"
0.010(0.25)
0.020(0.50) x 45o
SEE DETAIL "A"
0.0075(0.19)
0.0098(0.25)
0.150(3.80)
0.157(4.00)
PIN 1 ID
0.050(1.27)
BSC
0.013(0.33)
0.020(0.51)
SEATING PLANE
0.004(0.10)
0.010(0.25)
0.189(4.80)
0.197(5.00)
0.053(1.35)
0.069(1.75)
TOP VIEW
FRONT VIEW
0.228(5.80)
0.244(6.20)
SIDE VIEW
14
85
RECOMMENDED LAND PATTERN
0.213(5.40)
0.063(1.60)
0.050(1.27)
0.024(0.61)
NOTE:
1) CONTROL DIMENSION IS IN INCHES. DIMENSION IN
BRACKET IS IN MILLIMETERS.
2) PACKAGE LENGTH DO ES NOT INCLU DE MOLD FLASH,
PROTRUSIONS OR GATE BURRS.
3) PACKAGE WIDTH DOES NOT INCL UDE INTERLEA D FLASH
OR PROTRUSIONS.
4) LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING)
SHALL BE 0.004" INCHES MAX.
5) DRAWING CONFORMS TO JEDEC MS-01 2, VARIATION AA.
6) DRAWING IS NOT TO SCALE.
0.010(0.25) BSC
GAUGE PLANE
