2006-05-03
1
BCR166...
PNP Silicon Digital Transistor
• Switching circuit, inverter, interface circuit,
driver circuit
• Built in bias resistor (R1 = 4.7 kΩ , R2 = 47 kΩ )
BCR166/F/L3
BCR166T/W
EHA07183
3
21
C
EB
R
1
R
2
Type Marking Pin Configuration Package
BCR166
BCR166F
BCR166L3
BCR166T
BCR166W
WTs
WTs
WT
WT
WTs
1=B
1=B
1=B
1=B
1=B
2=E
2=E
2=E
2=E
2=E
3=C
3=C
3=C
3=C
3=C
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
SOT23
TSFP-3
TSLP-3-4
SC75
SOT323
2006-05-03
2
BCR166...
Maximum Ratings
Parameter Symbol Value Unit
Collector-emitter voltage VCEO 50 V
Collector-base voltage VCBO 50
Input forward voltage Vi
(
fwd
)
30
Input reverse voltage Vi
(
rev
)
5
Collector current IC100 mA
Total power dissipation-
BCR166, TS ≤ 102°C
BCR166F, TS ≤ 128°C
BCR166L3, TS ≤ 135°C
BCR166T, TS ≤ 109°C
BCR166W, TS ≤ 124°C
Ptot
200
250
250
250
250
mW
Junction temperature T
j
150 °C
Storage temperature Tst
g
-65 ... 150
Thermal Resistance
Parameter Symbol Value Unit
Junction - soldering point1)
BCR166
BCR166F
BCR166L3
BCR166T
BCR166W
RthJS
≤ 240
≤ 90
≤ 60
≤ 165
≤ 105
K/W
1For calculation of RthJA please refer to Application Note Thermal Resistance
2006-05-03
3
BCR166...
Electrical Characteristics at T
A
= 25°C, unless otherwise specified
Parameter Symbol Values Unit
min. typ. max.
DC Characteristics
Collector-emitter breakdown voltage
IC = 100 µA, IB = 0
V(BR)CEO 50 - - V
Collector-base breakdown voltage
IC = 10 µA, IE = 0
V(BR)CBO 50 - -
Collector-base cutoff current
VCB = 40 V, IE = 0
ICBO - - 100 nA
Emitter-base cutoff current
VEB = 5 V, IC = 0
IEBO - - 155 µA
DC current gain1)
IC = 5 mA, VCE = 5 V
hFE 70 - - -
Collector-emitter saturation voltage1)
IC = 10 mA, IB = 0.5 mA
VCEsat - - 0.3 V
Input off voltage
IC = 100 µA, VCE = 5 V
Vi(off) 0.4 - 0.8
Input on voltage
IC = 2 mA, VCE = 0.3 V
Vi(on) 0.5 - 1.4
Input resistor R13.2 4.7 6.2 kΩ
Resistor ratio R1/R20.09 0.1 0.11 -
AC Characteristics
Transition frequency
IC = 10 mA, VCE = 5 V, f = 100 MHz
fT- 160 - MHz
Collector-base capacitance
VCB = 10 V, f = 1 MHz
Ccb - 3 - pF
1Pulse test: t < 300µs; D < 2%
2006-05-03
4
BCR166...
DC current gain hFE = ƒ(IC)
VCE = 5 V (common emitter configuration)
10 -1 10 0 10 1 10 2
mA
IC
0
10
1
10
2
10
3
10
-
hFE
Collector-emitter saturation voltage
VCEsat = ƒ(IC), hFE = 20
0 0.2 0.4 0.6 V1
VCEsat
0
10
1
10
2
10
mA
IC
Input on Voltage Vi(on) = ƒ(IC)
VCE = 0.3V (common emitter configuration)
10 -1 10 0 10 1 10 2
V
Vi(on)
-1
10
0
10
1
10
2
10
mA
IC
Input off voltage Vi(off) = ƒ(IC)
VCE = 5V (common emitter configuration)
0 0.2 0.4 0.6 V1
Vi(off)
-3
10
-2
10
-1
10
0
10
1
10
mA
IC
2006-05-03
5
BCR166...
Total power dissipation Ptot = ƒ(TS)
BCR166
0 15 30 45 60 75 90 105 120 °C 150
TS
0
25
50
75
100
125
150
175
200
225
250
mW
300
Ptot
Total power dissipation Ptot = ƒ(TS)
BCR166F
0 15 30 45 60 75 90 105 120 °C 150
TS
0
25
50
75
100
125
150
175
200
225
250
mW
300
Ptot
Total power dissipation Ptot = ƒ(TS)
BCR166L3
0 15 30 45 60 75 90 105 120 °C 150
TS
0
25
50
75
100
125
150
175
200
225
250
mW
300
Ptot
Total power dissipation Ptot = ƒ(TS)
BCR166T
0 15 30 45 60 75 90 105 120 °C 150
TS
0
25
50
75
100
125
150
175
200
225
250
mW
300
Ptot
2006-05-03
6
BCR166...
Total power dissipation Ptot = ƒ(TS)
BCR166W
0 15 30 45 60 75 90 105 120 °C 150
TS
0
25
50
75
100
125
150
175
200
225
250
mW
300
Ptot
Permissible Pulse Load
Ptotmax/PtotDC = ƒ(tp)
BCR166
10 -6 10 -5 10 -4 10 -3 10 -2 10 0
s
tp
0
10
1
10
2
10
3
10
-
Ptotmax / PtotDC
D = 0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
Permissible Pulse Load RthJS = ƒ(tp)
BCR166
10 -6 10 -5 10 -4 10 -3 10 -2 10 0
s
tp
-1
10
0
10
1
10
2
10
3
10
K/W
RthJS
0.5
0.2
0.1
0.05
0.02
0.01
0.005
D = 0
2006-05-03
7
BCR166...
Permissible Pulse Load
Ptotmax/PtotDC = ƒ(tp)
BCR166F
10 -6 10 -5 10 -4 10 -3 10 -2 10 0
s
tp
0
10
1
10
2
10
3
10
Ptotmax/PtotDC
D=0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
Permissible Puls Load RthJS = ƒ (tp)
BCR166F
10 -6 10 -5 10 -4 10 -3 10 -2 10 0
s
tp
-1
10
0
10
1
10
2
10
K/W
RthJS
D=0.5
0.2
0.1
0.05
0.02
0.01
0.005
0
Permissible Puls Load RthJS = ƒ (tp)
BCR166L3
10 -7 10 -6 10 -5 10 -4 10 -3 10 -2 10 0
s
tp
-1
10
0
10
1
10
2
10
RthJS
0.5
0.2
0.1
0.05
0.02
0.01
0.005
D = 0
Permissible Pulse Load
Ptotmax/PtotDC = ƒ(tp)
BCR166L3
10 -7 10 -6 10 -5 10 -4 10 -3 10 -2 10 0
s
tp
0
10
1
10
2
10
3
10
Ptotmax/ PtotDC
D = 0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
2006-05-03
8
BCR166...
Permissible Puls Load RthJS = ƒ (tp)
BCR166T
10 -6 10 -5 10 -4 10 -3 10 -2 10 0
s
tp
-1
10
0
10
1
10
2
10
3
10
K/W
RthJS
D=0.5
0.2
0.1
0.05
0.02
0.01
0.005
0
Permissible Pulse Load
Ptotmax/PtotDC = ƒ(tp)
BCR166T
10 -6 10 -5 10 -4 10 -3 10 -2 10 0
s
tp
0
10
1
10
2
10
3
10
Ptotmax / PtotDC
D=0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
Permissible Puls Load RthJS = ƒ (tp)
BCR166W
10 -6 10 -5 10 -4 10 -3 10 -2 10 0
s
tp
-1
10
0
10
1
10
2
10
3
10
K/W
RthJS
0.5
0.2
0.1
0.05
0.02
0.01
0.005
D = 0
Permissible Pulse Load
Ptotmax/PtotDC = ƒ(tp)
BCR166W
10 -6 10 -5 10 -4 10 -3 10 -2 10 0
s
tp
0
10
1
10
2
10
3
10
-
Ptotmax / PtotDC
D = 0
0.005
0.01
0.02
0.05
0.1
0.2
0.5
2006-05-03
9
BCR166...
Package SC75
Package Outline
Foot Print
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
1.6
±0.2
0.5
0.10 M0.5
A
0.2
0.2
+0.1
-0.05
1 2
-0.05
3
+0.1
1.6±0.2
0.20 MA
0.7
0.15
10˚
MAX.
0.1 MAX.
±0.1
±0.1
±0.1
0.8
MAX.
10˚
1.15
0.65
0.4
0.4
0.65
0.50.5
BCR108T
Type code
Pin 1
4
8
1.8
0.2 MAX.
0.9
1.4
1.75
0.45
Pin 1
2005, December
Date code
Marking Layout (Example)
2006-05-03
10
BCR166...
Date Code marking for discrete packages with
one digit (SCD80, SC79, SC75
1)
) CES-Code
1) New Marking Layout for SC75, implemented at October 2005.
.
Month 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014
01apAPapAPapAP
02bqBQbqBQbqBQ
03crCRcrCRcrCR
04d sDSd sDSd s DS
05e t ETe t ETe t ET
06fuFUfuFUfuFU
07gvGVgvGVgvGV
08h xHXh xHXh xHX
09jyJYjyJYjyJY
10k zKZk zKZk zKZ
11l 2L4 l 2L4 l 2L4
12n3N5n3N5n3N5
2006-05-03
11
BCR166...
Package SOT23
Package Outline
Foot Print
Marking Layout (Example)
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
EH
s
BCW66
Type code
Pin 1
0.8
0.9 0.91.3
0.8 1.2
0.25 MBC
1.9
-0.05
+0.1
0.4
±0.1
2.9
0.95
C
B
0...8˚
0.2 A
0.1 MAX.
10˚ MAX.
0.08...0.15
1.3
±0.1
10˚ MAX.
M
2.4
±0.15
±0.1
1
A
0.15 MIN.
1)
1) Lead width can be 0.6 max. in dambar area
12
3
3.15
4
2.65
2.13
0.9
8
0.2
1.15
Pin 1
Manufacturer
2005, June
Date code (YM)
2006-05-03
12
BCR166...
Package SOT323
Package Outline
Foot Print
Marking Layout (Example)
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
1.25
±0.1
0.1 MAX.
2.1
±0.1
0.15
+0.1
-0.05
0.3
+0.1
±0.1
0.9
12
3A
±0.2
2
-0.05
0.650.65
M
3x
0.1
0.1 MIN.
0.1
M
0.2 A
0.2
4
2.15 1.1
8
2.3
Pin 1
Pin 1
2005, June
Date code (YM)
BCR108W
Type code
0.6
0.8
1.6
0.65
0.65
Manufacturer
2006-05-03
13
BCR166...
Package TSFP-3
4
Package Outline
Foot Print
Marking Layout (Example)
Standard Packing
Reel ø180 mm = 3.000 Pieces/Reel
Reel ø330 mm = 10.000 Pieces/Reel
±0.05
0.2
3
±0.05
1.2
12
10˚ MAX.
±0.05
0.8
1.2±0.05
±0.04
0.55
±0.05
0.2
±0.05
0.15
±0.05
0.2
0.4
±0.05
0.4
±0.05
0.4
0.45
1.05
0.4 0.4
BCR847BF
Type code
Pin 1
0.2
1.35
0.3
0.7
1.2
1.5
8
Pin 1
Manufacturer
2006-05-03
14
BCR166...
Package TSLP-3-4
Package Outline
Foot Print
Marking Layout
Standard Packing
2
3
1
0.76
4
1.16
0.5
Pin 1
marking
8
Reel ø180 mm = 15.000 Pieces/Reel
For board assembly information please refer to Infineon website "Packages"
Stencil aperturesCopper Solder mask
0.38
0.2
0.315
0.95
0.5
0.17
0.255
0.2
0.45
0.225
1
0.6
0.225
0.15
0.35
0.2
R0.1
R0.19
Pin 1
Top view
0.05 MAX.
Bottom view
21
±0.035
0.5
3
0.575
1)
±0.035
0.4
1)
±0.035
2x
0.25
1)
0.35
±0.035
2x0.15
1)
marking
1) Dimension applies to plated terminal
0.4
+0.1
±0.05
±0.05
±0.05
1
0.6
±0.05
BCR133L3
Type code
Pin 1 marking
Laser marking
2006-05-03
15
BCR166...
Edition 2006-02-01
Published by
Infineon Technologies AG
81726 München, Germany
© Infineon Technologies AG 2006.
All Rights Reserved.
Attention please!
The information given in this dokument shall in no event be regarded as a guarantee
of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any
examples or hints given herein, any typical values stated herein and/or any information
regarding the application of the device, Infineon Technologies hereby disclaims any
and all warranties and liabilities of any kind, including without limitation warranties of
non-infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices
please contact your nearest Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest
Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or
systems with the express written approval of Infineon Technologies, if a failure of
such components can reasonably be expected to cause the failure of that
life-support device or system, or to affect the safety or effectiveness of that
device or system.
Life support devices or systems are intended to be implanted in the human body,
or to support and/or maintain and sustain and/or protect human life. If they fail,
it is reasonable to assume that the health of the user or other persons
may be endangered.
