Precision Analog Microcontroller 12-bit Analog I/O, ARM7TDMI(R) MCU ADuC702x Series Preliminary Technical Data FEATURES 4 X General Purpose Timers Wake-up and Watchdog Timers Power Supply Monitor Three-phase 16-bit PWM generator* PLA - Programmable Logic (Array) Power Specified for 3V operation Active Mode: 3mA (@1MHz) 50mA (@45MHz) Packages and Temperature Range From 40 lead 6x6mm LFCSP to 80 pin LQFP* Fully specified for -40C to 125C operation Tools Low-Cost QuickStart Development System Full Third-Party Support Analog I/O Multi-Channel, 12-bit, 1MSPS ADC - Up to 16 ADC channels * Fully differential and single-ended modes 0 to VREF Analog Input Range 12-bit Voltage Output DACs - Up to 4 DAC outputs available* On-Chip 20ppm/C Voltage Reference On-Chip Temperature Sensor (3C) Uncommitted Voltage Comparator Microcontroller ARM7TDMI Core, 16/32-bit RISC architecture JTAG Port supports code download and debug Clocking options: - Trimmed On-Chip Oscillator ( 3%) - External Watch crystal - External clock source 45MHz PLL with Programmable Divider Memory 62k Bytes Flash/EE Memory, 8k Bytes SRAM In-Circuit Download, JTAG based Debug Software triggered in-circuit re-programmability On-Chip Peripherals UART, 2 X I2C and SPI Serial I/O Up to 40-Pin GPIO Port* * Package, PWM, GPIO availability and number of Analog I/O depend on part model. See page 9. APPLICATIONS Industrial Control and Automation Systems Smart Sensors, Precision Instrumentation Base Station Systems, Optical Networking (See general description on page 11) FUNCTIONAL BLOCK DIAGRAM ADC0 ... ... MUX 12-BIT DAC DAC0 12-BIT DAC DAC1 12-BIT DAC DAC2 12-BIT DAC DAC3 ADuC7026* 1MSPS 12-BIT ADC ADC11 CMP0 + CMP1 CMPOUT - TEMP SENSOR BANDGAP REF PWM0H VREF PWM0L XCLKI XCLKO OSC & PLL PSM RST POR ARM7TDMI-BASED MCU WITH ADDITIONAL PERIPHERALS PLA 2kX32 SRAM 31kX16 FLASH/EEPROM 4 GEN. PURPOSE TIMERS SERIAL I/O UART, SPI, I2C Threephase PWM PWM1H PWM1L PWM2H GPIO JTAG PWM2L EXT. MEMORY INTERFACE Figure 1 Rev. PrB Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective companies. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. www.analog.com Tel: 781.329.4700 Fax: 781.326.8703 (c) 2004 Analog Devices, Inc. All rights reserved. ADuC702x Series Preliminary Technical Data TABLE OF CONTENTS ADuC702x--Specifications ............................................................ 3 Reset and Remap ........................................................................ 36 Terminology ...................................................................................... 6 Other analog peripherals............................................................... 37 Absolute Maximum Ratings............................................................ 7 DAC.............................................................................................. 37 Ordering Guide............................................................................. 9 Power Supply Monitor ............................................................... 39 Pin function descriptions .............................................................. 10 Comparator ................................................................................. 39 General Description ....................................................................... 19 Oscillator and PLL - Power control ......................................... 40 Overview of the ARM7TDMI core.......................................... 19 Digital peripherals.......................................................................... 42 Memory organisation................................................................. 21 Three-phase PWM..................................................................... 42 ADC circuit information ............................................................... 26 General Purpose I/O.................................................................. 49 General Overview....................................................................... 26 Serial Port Mux........................................................................... 52 ADC Transfer Function............................................................. 26 Programmable Logic Array (PLA)........................................... 62 Typical Operation....................................................................... 27 Processor reference peripherals.................................................... 65 Converter operation................................................................... 29 Interrupt System ......................................................................... 65 Driving the analog inputs.......................................................... 30 Timers .......................................................................................... 67 ADC Calibration ........................................................................ 30 ADuC702x Hardware Design considerations ............................ 75 Temperature Sensor ................................................................... 30 Power supplies ............................................................................ 75 Bandgap Reference ..................................................................... 30 Grounding and Board Layout Recommendations................. 75 Nonvolatile Flash/EE Memory ..................................................... 32 Clock Oscillator .......................................................................... 76 Flash/EE memory overview ...................................................... 32 Power-on reset operation .......................................................... 76 Flash/EE Memory and the ADuC702x.................................... 32 Typical sysem configuration ..................................................... 77 Flash/EE memory security ........................................................ 32 Development Tools ........................................................................ 78 Flash/EE Control Interface........................................................ 33 In-Circuit Serial Downloader................................................... 78 Execution time from SRAM and FLASH/EE ......................... 34 Outline Dimensions ....................................................................... 79 Rev. PrB | Page 2 of 80 Preliminary Technical Data ADuC702x Series ADUC702X--SPECIFICATIONS 1 Table 1. (AVDD = IOVDD = 2.7 V to 3.6 V, VREF = 2.5 V Internal Reference, fCORE = 45MHz, All specifications TA = TMAX to TMIN, unless otherwise noted.) Parameter ADC CHANNEL SPECIFICATIONS ADC Powerup Time DC Accuracy 2, 3 Resolution Integral Nonlinearity Integral Nonlinearity 4 Differential Nonlinearity Differential Nonlinearity 4 DC Code Distribution CALIBRATED ENDPOINT ERRORS 5 Offset Error Offset Error Match Gain Error Gain Error Match DYNAMIC PERFORMANCE Signal-to-Noise Ratio (SNR) 6 Total Harmonic Distortion (THD) Peak Harmonic or Spurious Noise Channel-to-Channel Crosstalk 7 ANALOG INPUT Input Voltage Ranges Differential mode Single-ended mode Leakage Current Input Capacitance ON-CHIP VOLTAGE REFERENCE Output Voltage Accuracy Reference Temperature Coefficient Power Supply Rejection Ratio Output Impedance Internal VREF Power-On Time EXTERNAL REFERENCE INPUT9 Input Voltage Range Input Impedance DAC CHANNEL SPECIFICATIONS DC ACCURACY Resolution Relative Accuracy Differential Nonlinearity Offset Error Gain Error Gain Error Mismatch ADuC702x Unit 500 uS Test Conditions/Comments fSAMPLE = 1MSPS 12 1.5 0.5 2.0 +1/-0.9 0.5 +1/-0.9 1 Bits LSB max LSB typ LSB max LSB max LSB typ LSB max LSB typ 5 1 5 1 LSB max LSB typ LSB max LSB typ 71 -78 -78 -80 dB typ dB typ dB typ dB typ VCM8VREF/2 0 to VREF 5 20 Volts Volts A max pF typ 2.5 10 10 80 10 1 V mV max ppm/C typ dB typ typ ms typ 0.625 AVDD TBD V min V max K typ 2.5V internal reference 2.5V internal reference 1.0V external reference 2.5V internal reference 2.5V internal reference 1.0V external reference ADC input is a dc voltage Fin = 10kHz Sine Wave, fSAMPLE = 1MSPS During ADC Acquisition 0.47F from VREF to AGND Measured at TA = 25C RL = 5k, CL = 100pF 12 2 1 2 5 0.5 TBD Bits LSB typ LSB max mV max mV max % max % typ Rev. PrB | Page 3 of 80 Guaranteed Monotonic DAC output unbuffered DAC output buffered % of fullscale on DAC0 ADuC702x Series Parameter ANALOG OUTPUTS Output Voltage Range_0 Ouput Voltage Range_1 Output Voltage Range_2 Output Impedance DAC AC CHARACTERISTICS Voltage Output Settling Time Voltage Output Settling Time Digital to Analog Glitch Energy COMPARATOR Input Offset Voltage Input Bias Current Input Voltage Range Input Capacitance Hysteresis Response Time TEMPERATURE SENSOR Voltage Output at 25C Voltage TC Accuracy POWER SUPPLY MONITOR (PSM) IOVDD Trip Point Selection Power Supply Trip Point Accuracy Watchdog Timer (WDT)4 Timeout Period Flash/EE MEMORY Endurance10 Data Retention11 Digital Inputs Input Leakage Current Input Capacitance Logic Inputs4 VINL, Input Low Voltage VINH, Input High Voltage Logic Outputs VOH, Output High Voltage VOL, Output Low Voltage12 MCU CLOCK RATE STARTUP TIME At Power-On From Idle Mode From Power-Down Mode Programmable Logic Array (PLA) Propagation Delay Preliminary Technical Data ADuC702x Unit Test Conditions/Comments 0 to DACREF 0 to 2.5V 0 to DACVDD V typ V typ DACREF range: DACGND to DACVDD 10 typ 10 15 TBD s typ s typ nV-sec typ DAC Output buffered DAC Output unbuffered I LSB change at major carry 10 5 AGND to AVDD-1.2 7 5 10 1 10 mV nA typ Vmin/Vmax pF typ mV min mv max s min s max Hysteresis can be turned on or off via the CMPHYST bit in the CMPCON register Response time may be modified via the CMPRES bits in the CMPCON register TBD -1.5 3 mV typ mV/C typ C typ 2.79 3.07 2.5 V V % max 0 TBD ms min ms max 10,000 30 Cycles min Years min 10 1 10 A max A typ pF typ 0.4 2.0 V max V min IOVDD - 400mV 0.4 355.5 45.5 V min V max kHz min MHz max V typ Two selectable Trip Points Of the selected nominal Trip Point Voltage TJ = 55C All digital inputs including XTAL1 and XTAL2 All Logic inputs including XTAL1 and XTAL2 ISOURCE = 1.6mA ISINK = 1.6mA 8 programmable core clock selections within this range Core Clock = TBD MHz TBD TBD TBD TBD ns typ Rev. PrB | Page 4 of 80 From input pin to output pin Preliminary Technical Data Parameter POWER REQUIREMENTS 13, 14 Power Supply Voltage Range AVDD - AGND and IOVDD - IOGND ADuC702x Series ADuC702x Unit 2.7 3.6 V min V max Power Supply Current Normal Mode 3mA 5 50 60 mA typ mA max mA typ mA max Power Supply Current Idle Mode 1 mA max Power Supply Current Power Down Mode 30 100 A typ A max 1 Test Conditions/Comments 1MHz clock 1MHz clock 45MHz clock 45MHz clock External Crystal or Internal Osc ON External Crystal or Internal Osc ON Temperature Range -40 to +85C All ADC Channel Specifications are guaranteed during normal MicroConverter core operation. These specification apply to all ADC input channels. 4 These numbers are not production tested but are supported by design and/or characterization data on production release. 5 Based on external ADC system components, the user may need to execute a system calibration to remove external endpoint and achieve these specifications.. 6 SNR calculation includes distortion and noise components. 7 Channel-to-channel crosstalk is measured on adjacent channels. 8 The input signal can be centered on any dc common-mode voltage (VCM) as long as this value is within the ADC voltage input range specified. 9 When using an external reference input pin, the internal reference must be disabled by setting the lsb in the REFCON Memeory Mapped Register to 0. 10 Endurance is qualified to 50,000 cycles as per JEDEC Std. 22 method A117 and measured at -40C, +25C and +85C. Typical endurance at 25C is 70,000 cycles. 11 Retention lifetime equivalent at junction temperature (Tj) = 55C as per JEDEC Std. 22 method A117. Retention lifetime will derate with junction temperature. 12 Test carried out with a maximum of 20 I/O set to a low output level. 13 Power supply current consumption is measured in normal, idle and power-down modes under the following conditions: Normal Mode: TBD Idle Mode: TBD Power-Down: TBD 14 DVDD power supply current increases typically by TBD mA during a Flash/EE memory program or erase cycle. 2 3 Rev. PrB | Page 5 of 80 ADuC702x Series Preliminary Technical Data TERMINOLOGY ADC Specifications Integral Nonlinearity This is the maximum deviation of any code from a straight line passing through the endpoints of the ADC transfer function. The endpoints of the transfer function are zero scale, a point 1/2 LSB below the first code transition and full scale, a point 1/2 LSB above the last code transition. fundamental. Noise is the rms sum of all nonfundamental signals up to half the sampling frequency (fS/2), excluding dc. The ratio is dependent upon the number of quantization levels in the digitisation process; the more levels, the smaller the quantization noise. The theoretical signal to (noise + distortion) ratio for an ideal N-bit converter with a sine wave input is given by: Signal to (Noise + Distortion) = (6.02N + 1.76) dB Differential Nonlinearity Thus for a 12-bit converter, this is 74 dB. This is the difference between the measured and the ideal 1 LSB change between any two adjacent codes in the ADC. Total Harmonic Distortion Offset Error Total Harmonic Distortion is the ratio of the rms sum of the harmonics to the fundamental. This is the deviation of the first code transition (0000 . . . 000) to (0000 . . . 001) from the ideal, i.e., +1/2 LSB. DAC SPECIFICATIONS Gain Error Relative Accuracy This is the deviation of the last code transition from the ideal AIN voltage (Full Scale - 1.5 LSB) after the offset error has been adjusted out. Relative accuracy or endpoint linearity is a measure of the maximum deviation from a straight line passing through the endpoints of the DAC transfer function. It is measured after adjusting for zero error and full-scale error. Signal to (Noise + Distortion) Ratio Voltage Output Settling Time This is the measured ratio of signal to (noise + distortion) at the output of the ADC. The signal is the rms amplitude of the This is the amount of time it takes for the output to settle to within a 1 LSB level for a full-scale input change.. Rev. PrB | Page 6 of 80 Preliminary Technical Data ADuC702x Series ABSOLUTE MAXIMUM RATINGS Table 2. Absolute Maximum Ratings (TA = 25C unless otherwise noted) DVDD = IOVDD , AGND = REFGND = DACGND = GNDREF Parameter AVDD to DVDD AGND to DGND DVDD to DGND, AVDD to AGND Digital Input Voltage to DGND Digital Output Voltage to DGND VREF to AGND Analog Inputs to AGND Operating Temperature Range Industrial ADuC702x Storage Temperature Range Junction Temperature JA Thermal Impedance (CSP) JA Thermal Impedance (LQFP) Lead Temperature, Soldering Vapor Phase (60 sec) Infrared (15 sec) Rating -0.3V to +0.3V -0.3V to +0.3V -0.3V to +7V -0.3V to +5.5V -0.3V to +5.5V -0.3V to AVDD+0.3V -0.3V to AVDD+0.3V -40C to +125C TBD 125C TBD TBD TBD TBD Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ESD Caution ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. Rev. PrB | Page 7 of 80 ADuC702x Series Preliminary Technical Data PIN CONFIGURATION 40-Lead CSP 40 31 PIN 1 IDENTIFIER 1 64-Lead LQFP 30 64 ADuC7020/21/22 TOP VIEW (Not to Scale) 1 49 ADuC7024/ADuC7025 64-LEAD LQFP 21 10 48 PIN 1 IDENTIFIER TOP VIEW (Not to Scale) 11 20 64-Lead CSP 64 16 49 PIN 1 IDENTIFIER 1 33 32 17 48 80-Lead LQFP ADuC7024/ADuC7025 TOP VIEW (Not to Scale) 80 1 16 61 60 PIN 1 IDENTIFIER 33 17 32 ADuC7026/ADuC7027 80-LEAD LQFP TOP VIEW (Not to Scale) 20 41 21 Rev. PrB | Page 8 of 80 40 Preliminary Technical Data ADuC702x Series ORDERING GUIDE Model ADC Channels DAC Channels FLASH / RAM PWM ADuC7020BCP62 5 4 62kB/8kB ADuC7021BCP62 8 2 ADuC7021BCP32 8 ADuC7021ACP32 ADuC7022BCP62 8 (10 Bit NMC) 10 ADuC7022BCP32 ADuC7022ACP32 GPIO Temp Range Package Description Package Option Single 14 Single 13 2 32kB/4kB Single 13 2 32kB/4kB Single 13 62kB/8kB Single 13 10 32kB/4kB Single 13 62kB/8kB Single 13 ADuC7024BCP62 10 (10 Bit NMC) 10 2 62kB/8kB 30 ADuC7024BST62 10 2 62kB/8kB Three Phase Three Phase ADuC7025BCP62 12 62kB/8kB 30 ADuC7025BCP32 12 32kB/4kB ADuC7026BST62 12 Three Phase Three Phase Three Phase ADuC7027BST62 16 62kB/8kB ADuC7027AST62 16 (10 Bit NMC) 62kB/8kB 40-Lead Chip Scale Package 40-Lead Chip Scale Package 40-Lead Chip Scale Package 40-Lead Chip Scale Package 40-Lead Chip Scale Package 40-Lead Chip Scale Package 40-Lead Chip Scale Package 64-Lead Chip Scale Package 64 Lead Plastic Quad Flatpack 64-Lead Chip Scale Package 64-Lead Chip Scale Package 80 Lead Plastic Quad Flatpack 80 Lead Plastic Quad Flatpack 80 Lead Plastic Quad Flatpack Development System Development System Development System CP-40 62kB/8kB -40C to + 85C -40C to + 85C -40C to + 85C -40C to + 85C -40C to + 85C -40C to + 85C -40C to + 85C -40C to + 85C -40C to + 125C 4 62kB/8kB Ext Memory 30 30 -40C to + 85C -40C to + 85C -40C to + 125C Yes 40 Three Phase Yes 40 -40C to + 125C Three Phase Yes 40 -40C to + 125C EVAL-ADuC7020QS EVAL-ADuC7024QS EVAL-ADuC7026QS Contact the factory for chip availability. Rev. PrB | Page 9 of 80 CP-40 CP-40 CP-40 CP-40 CP-40 CP-40 CP-64-1 ST-64 CP-64-1 CP-64-1 ST-80 ST-80 ST-80 ADuC702x Series Preliminary Technical Data PIN FUNCTION DESCRIPTIONS - ADUC7020/ADUC7021/ADUC7022 Table 3. Pin Function Descriptions Pin# ADuC702X Mnemonic Type* ADC0 ADC1 ADC2/CMP0 ADC3/CMP1 ADC4 ADC5 ADC6 ADC7 ADC8 ADC9 I I I I I I I I I I 6 GNDREF S 6 7 8 9 7 8 DAC0/ADC12 DAC1/ADC13 DAC2/ADC14 DAC3/ADC15 TMS TDI I/O I/O I/O I/O I I 10 10 9 BM/P0.0/CMPOUT/P LAI[7] I/O 11 11 10 P0.6/T1/MRST/PLA O[3] O 12 13 14 15 12 13 14 15 11 12 13 14 TCK TDO IOGND IOVDD I O S S 16 16 15 LVDD S 17 17 16 DGND S 18 18 17 P0.3/TRST/ADCBUSY I 19 19 18 RST I 20 20 19 IRQ0/P0.4/CONVST ART/PLAO[1] I/O 21 21 20 IRQ1/P0.5/ADCBUSY /PLAO[2] I/O 22 22 21 P2.0/SPM9/PLAO[ 5]/CONVSTART I/O 23 23 22 P0.7/ECLK/SPM8/ PLAO[4]/XCLK I/O 7020 38 39 40 1 2 - 7021 37 38 39 40 1 2 3 4 - 7022 36 37 38 39 40 1 2 3 4 5 3 5 4 5 6 7 8 9 Function Single-ended or differential Analog input 0 Single-ended or differential Analog input 1 Single-ended or differential Analog input 2 / Comparator Positive Input Single-ended or differential Analog input 3 / Comparator Negative Input Single-ended or differential Analog input 4 Single-ended or differential Analog input 5 Single-ended or differential Analog input 6 Single-ended or differential Analog input 7 Single-ended or differential Analog input 8 Single-ended or differential Analog input 9 Ground voltage reference for the ADC. For optimal performance the analog power supply should be separated from IOGND and DGND DAC0 Voltage Output / Single-ended or differential Analog input 12 DAC1 Voltage Output / Single-ended or differential Analog input 13 DAC2 Voltage Output / Single-ended or differential Analog input 14 DAC3 Voltage Output / Single-ended or differential Analog input 15 JTAG Test Port Input - Test Mode Select. Debug and download access JTAG Test Port Input - Test Data In. Debug and download access Multifunction I/O pin: Boot Mode. The ADuC702X will enter serial download mode if BM is low at reset and will execute code if BM is pulled high at reset through a 1kOhm resistor/ General Purpose Input-Output Port 0.0 / Voltage Comparator Output/ Programmable Logic Array Input Element 7 Multifunction pin: driven low after reset General Purpose Output Port 0.6 / Timer 1 Input / Power on reset output / Programmable Logic Array Output Element 3 JTAG Test Port Input - Test Clock. Debug and download access JTAG Test Port Output - Test Data Out. Debug and download access Ground for GPIO. Typically connected to DGND 3.3V Supply for GPIO and input of the on-chip voltage regulator. 2.5V. Output of the on-chip voltage regulator. Must be connected to a 0.47F capacitor to DGND Ground for core logic. General Purpose Input-Output Port 0.3 / JTAG Test Port Input - Test Reset. Debug and download access / ADCBUSY signal output Reset Input. (active low) Multifunction I/O pin: External Interrupt Request 0, active high / General Purpose Input-Output Port 0.4 / Start conversion input signal for ADC / Programmable Logic Array Output Element 1 Multifunction I/O pin: External Interrupt Request 1, active high / General Purpose Input-Output Port 0.5 / ADCBUSY signal / Programmable Logic Array Output Element 2 Serial Port Multiplexed: General Purpose Input-Output Port 2.0 / UART / Programmable Logic Array Output Element 5/ Start conversion input signal for ADC Serial Port Multiplexed: General Purpose Input-Output Port 0.7 / Output for External Clock signal / UART / Programmable Logic Array Output Element 4/ Input to the Rev. PrB | Page 10 of 80 Preliminary Technical Data Pin# ADuC702X Mnemonic ADuC702x Series Type* 7020 7021 7022 24 24 23 XCLKO O 25 25 24 XCLKI I 26 26 25 P1.7/SPM7/PLAO[ 0] I/O 27 27 26 P1.6/SPM6/PLAI[6] I/O 28 28 27 P1.5/SPM5/PLAI[5] /IRQ3 I/O 29 29 28 P1.4/SPM4/PLAI[4] /IRQ2 I/O 30 30 29 P1.3/SPM3/PLAI[3] I/O 31 31 30 P1.2/SPM2/PLAI[2] I/O 32 32 31 P1.1/SPM1/PLAI[1] I/O 33 33 32 P1.0/T1/SPM0/PLA I[0] I/O 34 - - P4.2/PLAO[10] I/O 35 34 33 VREF I/O 36 37 35 36 34 35 AGND AVDD S S Function internal clock generator circuits Output from the crystal oscillator inverter Input to the crystal oscillator inverter and input to the internal clock generator circuits Serial Port Multiplexed: General Purpose Input-Output Port 1.7 / UART / SPI / Programmable Logic Array Output Element 0 Serial Port Multiplexed: General Purpose Input-Output Port 1.6 / UART / SPI / Programmable Logic Array Input Element 6 Serial Port Multiplexed: General Purpose Input-Output Port 1.5 / UART / SPI / Programmable Logic Array Input Element 5/ External Interrupt Request 3, active high Serial Port Multiplexed: General Purpose Input-Output Port 1.4 / UART / SPI / Programmable Logic Array Input Element 4/ External Interrupt Request 2, active high Serial Port Multiplexed: General Purpose Input-Output Port 1.3/ UART / I2C1 /Programmable Logic Array Input Element 3 Serial Port Multiplexed: General Purpose Input-Output Port 1.2 / UART / I2C1 /Programmable Logic Array Input Element 2 Serial Port Multiplexed: General Purpose Input-Output Port 1.1 / UART / I2C0 / Programmable Logic Array Input Element 1 Serial Port Multiplexed: General Purpose Input-Output Port 1.0/ Timer 1 Input / UART / I2C0 / Programmable Logic Array Input Element 0 General Purpose Input-Output Port 4.2 / Programmable Logic Array Output Element 10 2.5V internal Voltage Reference. Must be connected to a 0.47uF capacitor when using the internal reference. Analog Ground. Ground reference point for the analog circuitry 3.3V Analog Power * I = Input, O = Output, S = Supply. - No pin assigned. Rev. PrB | Page 11 of 80 ADuC702x Series Preliminary Technical Data PIN FUNCTION DESCRIPTIONS - ADUC7024/ADUC7025 Table 4. Pin Function Descriptions Pin# Mnemonic Type* 1 2 3 4 5 6 ADC4 ADC5 ADC6 ADC7 ADC8 ADC9 I I I I I I 7 GNDREF S 8 ADCNEG I 9 10 11 12 DAC0**/ADC12 DAC1**/ADC13 TMS TDI I/O I/O I I 13 P4.6/PLAO[14] I/O 14 P4.7/PLAO[15] I/O 15 BM/P0.0/CMPOUT/PLAI[7] I/O 16 P0.6/T1/MRST/PLAO[3] O 17 18 19 20 TCK TDO IOGND IOVDD I O S S 21 LVDD S 22 DGND S 23 P3.0/PWM0H/PLAI[8] I/O 24 P3.1/PWM0L/PLAI[9] I/O 25 P3.2/PWM1H/PLAI[10] I/O 26 P3.3/PWM1L/PLAI[11] I/O 27 P0.3/TRST/ADCBUSY I/O 28 RST 29 P3.4/PWM2H/PLAI[12] I/O 30 P3.5/PWM2L/PLAI[13] I/O I Function Single-ended or differential Analog input 4 Single-ended or differential Analog input 5 Single-ended or differential Analog input 6 Single-ended or differential Analog input 7 Single-ended or differential Analog input 8 Single-ended or differential Analog input 9 Ground voltage reference for the ADC. For optimal performance the analog power supply should be separated from IOGND and DGND Bias point or Negative Analog Input of the ADC in pseudo differential mode. Must be connected to the ground of the signal to convert. This bias point must be between 0V and 1V DAC0 Voltage Output / Single-ended or differential Analog input 12 DAC1 Voltage Output / Single-ended or differential Analog input 13 JTAG Test Port Input - Test Mode Select. Debug and download access JTAG Test Port Input - Test Data In. Debug and download access General Purpose Input-Output Port 4.6/ Programmable Logic Array Output Element 14 General Purpose Input-Output Port 4.7/ Programmable Logic Array Output Element 15 Multifunction I/O pin: Boot Mode. The ADuC7024/ADuC7025 will enter download mode if BM is low at reset and will execute code if BM is pulled high at reset through a 1kOhm resistor/ General Purpose Input-Output Port 0.0 / Voltage Comparator Output/ Programmable Logic Array Input Element 7 Multifunction pin: driven low after reset General Purpose Output Port 0.6 / Timer 1 Input / Power on reset output / Programmable Logic Array Output Element 3 JTAG Test Port Input - Test Clock. Debug and download access JTAG Test Port Output - Test Data Out. Debug and download access Ground for GPIO. Typically connected to DGND 3.3V Supply for GPIO and input of the on-chip voltage regulator. 2.5V. Output of the on-chip voltage regulator. Must be connected to a 0.47F capacitor to DGND Ground for core logic. General Purpose Input-Output Port 3.0/ PWM phase 0 high side output / Programmable Logic Array Input Element 8 General Purpose Input-Output Port 3.1/ PWM phase 0 low side output / Programmable Logic Array Input Element 9 General Purpose Input-Output Port 3.2/ PWM phase 1 high side output / Programmable Logic Array Input Element 10 General Purpose Input-Output Port 3.3/ PWM phase 1 low side output / Programmable Logic Array Input Element 11 General Purpose Input-Output Port 0.3 / JTAG Test Port Input - Test Reset. Debug and download access / ADCBUSY signal output Reset Input. (active low) General Purpose Input-Output Port 3.4 / PWM phase 2 high side output / Programmable Logic Array Input 12 General Purpose Input-Output Port 3.5 / PWM phase 2 low side output / Programmable Logic Array Input Element 13 Rev. PrB | Page 12 of 80 Preliminary Technical Data Pin# Mnemonic ADuC702x Series Type* 31 IRQ0/P0.4/CONVSTART/PLAO[1] I/O 32 IRQ1/P0.5/ADCBUSY/PLAO[2] I/O 33 P2.0/PWMTRIP/SPM9/PLAO[5]/CONVSTART I/O 34 P0.7/ECLK/SPM8/PLAO[4]/XCLK I/O 35 XCLKO O 36 XCLKI I 37 P3.6/PWMTRIP/PLAI[14] I/O 38 P3.7/PWMSYNC/PLAI[15] I/O 39 P1.7/SPM7/PLAO[0] I/O 40 P1.6/SPM6/PLAI[6] I/O 41 42 IOGND IOVDD 43 P4.0/PLAO[8] I/O 44 P4.1/PLAO[9] I/O 45 P1.5/SPM5/PLAI[5]/IRQ3 I/O 46 P1.4/SPM4/PLAI[4]/IRQ2 I/O 47 P1.3/SPM3/PLAI[3] I/O 48 P1.2/SPM2/PLAI[2] I/O 49 P1.1/SPM1/PLAI[1] I/O 50 P1.0/T1/SPM0/PLAI[0] I/O 51 P4.2/PLAO[10] I/O S S Function Multifunction I/O pin: External Interrupt Request 0, active high / General Purpose Input-Output Port 0.4 / Start conversion input signal for ADC / Programmable Logic Array Output Element 1 Multifunction I/O pin: External Interrupt Request 1, active high / General Purpose Input-Output Port 0.5 / ADCBUSY signal / Programmable Logic Array Output Element 2 Serial Port Multiplexed: General Purpose Input-Output Port 2.0 / PWM safety cut off / UART / Programmable Logic Array Output Element 5/ Start conversion input signal for ADC Serial Port Multiplexed: General Purpose Input-Output Port 0.7 / Output for External Clock signal / UART / Programmable Logic Array Output Element 4/ Input to the internal clock generator circuits Output from the crystal oscillator inverter Input to the crystal oscillator inverter and input to the internal clock generator circuits General Purpose Input-Output Port 3.6/ PWM safety cut off / Programmable Logic Array Input Element 14 General Purpose Input-Output Port 3.7/ PWM synchronisation input output /Programmable Logic Array Input Element 15 Serial Port Multiplexed: General Purpose Input-Output Port 1.7 / UART / SPI / Programmable Logic Array Output Element 0 Serial Port Multiplexed: General Purpose Input-Output Port 1.6 / UART / SPI / Programmable Logic Array Input Element 6 Ground for GPIO. Typically connected to DGND 3.3V Supply for GPIO and input of the on-chip voltage regulator. General Purpose Input-Output Port 4.0 / Programmable Logic Array Output Element 8 General Purpose Input-Output Port 4.1 / Programmable Logic Array Output Element 9 Serial Port Multiplexed: General Purpose Input-Output Port 1.5 / UART / SPI / Programmable Logic Array Input Element 5/ External Interrupt Request 3, active high Serial Port Multiplexed: General Purpose Input-Output Port 1.4 / UART / SPI / Programmable Logic Array Input Element 4/ External Interrupt Request 2, active high Serial Port Multiplexed: General Purpose Input-Output Port 1.3/ UART / I2C1 /Programmable Logic Array Input Element 3 Serial Port Multiplexed: General Purpose Input-Output Port 1.2 / UART / I2C1 /Programmable Logic Array Input Element 2 Serial Port Multiplexed: General Purpose Input-Output Port 1.1 / UART / I2C0 / Programmable Logic Array Input Element 1 Serial Port Multiplexed: General Purpose Input-Output Port 1.0/ Timer 1 Input / UART / I2C0 / Programmable Logic Array Input Element 0 General Purpose Input-Output Port 4.2 / Programmable Logic Array Output Element 10 Rev. PrB | Page 13 of 80 ADuC702x Series Pin# Mnemonic Preliminary Technical Data Type* 52 P4.3/PLAO[11] I/O 53 P4.4/PLAO[12] I/O 54 P4.5/PLAO[13] I/O 55 VREF I/O 56 57 58 59 60 61 62 63 64 DACREF DACGND AGND AVDD DACVDD ADC0 ADC1 ADC2/CMP0 ADC3/CMP1 I S S S S I I I I Function General Purpose Input-Output Port 4.3 / Programmable Logic Array Output Element 11 General Purpose Input-Output Port 4.4 / Programmable Logic Array Output Element 12 General Purpose Input-Output Port 4.5 / Programmable Logic Array Output Element 13 2.5V internal Voltage Reference. Must be connected to a 0.47uF capacitor when using the internal reference. External Voltage Reference for the DACs. Range: DACGND to DACVDD Ground for the DAC. Typically connected to AGND Analog Ground. Ground reference point for the analog circuitry 3.3V Analog Power 3.3V Power Supply for the DACs. Typically connected to AVDD Single-ended or differential Analog input 0 Single-ended or differential Analog input 1 Single-ended or differential Analog input 2/ Comparator positive input Single-ended or differential Analog input 3/ Comparator negative input * I = Input, O = Output, S = Supply. ** DAC outputs not present on ADuC7025 Rev. PrB | Page 14 of 80 Preliminary Technical Data ADuC702x Series PIN FUNCTION DESCRIPTIONS - ADUC7026/ADUC7027 Table 5. Pin Function Descriptions Pin# Mnemonic Type* 1 2 3 4 5 6 7 ADC4 ADC5 ADC6 ADC7 ADC8 ADC9 ADC10 I I I I I I I 8 GNDREF S 9 ADCNEG I 10 11 12 13 14 15 16 17 DAC0/ADC12 DAC1/ADC13 DAC1/ADC14 DAC1/ADC15 TMS TDI P0.1/BLE 18 P4.6/AD14/PLAO[14] I/O 19 P4.7/AD15/PLAO[15] I/O 20 BM/P0.0/CMPOUT/PLAI[7] I/O 21 P0.6/T1/MRST/PLAO[3]/AE O 22 23 24 25 26 TCK TDO P0.2/BHE IOGND IOVDD I O I/O S S 27 LVDD S 28 DGND S 29 P3.0/AD0/PWM0H/PLAI[8] I/O 30 P3.1/AD1/PWM0L/PLAI[9] I/O 31 P3.2/AD2/PWM1H/PLAI[10] I/O 32 P3.3/AD3/PWM1L/PLAI[11] I/O 33 P2.4/MS0 I/O I/O I/O I/O I/O I I I/O Function Single-ended or differential Analog input 4 Single-ended or differential Analog input 5 Single-ended or differential Analog input 6 Single-ended or differential Analog input 7 Single-ended or differential Analog input 8 Single-ended or differential Analog input 9 Single-ended or differential Analog input 10 Ground voltage reference for the ADC. For optimal performance the analog power supply should be separated from IOGND and DGND Bias point or Negative Analog Input of the ADC in pseudo differential mode. Must be connected to the ground of the signal to convert. This bias point must be between 0V and 1V DAC0 Voltage Output / Single-ended or differential Analog input 12 DAC1 Voltage Output / Single-ended or differential Analog input 13 DAC2 Voltage Output / Single-ended or differential Analog input 14 DAC3 Voltage Output / Single-ended or differential Analog input 15 JTAG Test Port Input - Test Mode Select. Debug and download access JTAG Test Port Input - Test Data In. Debug and download access General Purpose Input-Output Port 0.1/ External memory byte low enable P2.3/AE General Purpose Input-Output Port 4.6/ External Memory Interface/Programmable Logic Array Output Element 14 General Purpose Input-Output Port 4.7/ External Memory Interface / Programmable Logic Array Output Element 15 Multifunction I/O pin: Boot Mode. The ADuC7026 will enter UART download mode if BM is low at reset and will execute code if BM is pulled high at reset through a 1kOhm resistor/ General Purpose Input-Output Port 0.0 / Voltage Comparator Output/ Programmable Logic Array Input Element 7 Multifunction pin: driven low after reset General Purpose Output Port 0.6 / Timer 1 Input / Power on reset output / Programmable Logic Array Output Element 3 JTAG Test Port Input - Test Clock. Debug and download access JTAG Test Port Output - Test Data Out. Debug and download access General Purpose Input-Output Port 0.2/ External memory byte high enable Ground for GPIO. Typically connected to DGND 3.3V Supply for GPIO and input of the on-chip voltage regulator. 2.5V. Output of the on-chip voltage regulator. Must be connected to a 0.47F capacitor to DGND Ground for core logic. General Purpose Input-Output Port 3.0 / External Memory Interface/ PWM phase 0 high side output / Programmable Logic Array Input Element 8 General Purpose Input-Output Port 3.1 / External Memory Interface / PWM phase 0 low side output / Programmable Logic Array Input Element 9 General Purpose Input-Output Port 3.2 / External Memory Interface / PWM phase 1 high side output / Programmable Logic Array Input Element 10 General Purpose Input-Output Port 3.3 / External Memory Interface / PWM phase 1 low side output / Programmable Logic Array Input Element 11 General Purpose Input-Output Port 2.4 / External Memory select 0 Rev. PrB | Page 15 of 80 ADuC702x Series Pin# Mnemonic Preliminary Technical Data Type* 34 P0.3/TRST/A16/ADCBUSY I/O 35 36 37 P2.5/MS1 P2.6/MS2 RST I/O I/O I 38 P3.4/AD4/PWM2H/PLAI[12] I/O 39 P3.5/AD5/PWM2L/PLAI[13] I/O 40 IRQ0/P0.4/CONVSTART/PLAO[1] I/O 41 IRQ1/P0.5/ADCBUSY/PLAO[2] I/O 42 P2.0/PWMTRIP/SPM9/PLAO[5]/CONVSTART I/O 43 P0.7/ECLK/SPM8/PLAO[4]/XCLK I/O 44 XCLKO O 45 XCLKI I 46 P3.6/AD6/PWMTRIP/PLAI[14] I/O 47 P3.7/AD7/ECLK/PLAI[15] I/O 48 49 50 P2.7/MS3 P2.1/WS P2.2/RS I/O I/O I/O 51 P1.7/SPM7/PLAO[0] I/O 52 P1.6/SPM6/PLAI[6] I/O 53 54 IOGND IOVDD 55 P4.0/AD8/PLAO[8] I/O 56 P4.1/AD9/PLAO[9] I/O 57 P1.5/SPM5/PLAI[5]/IRQ3 I/O 58 P1.4/SPM4/PLAI[4]/IRQ2 I/O 59 P1.3/SPM3/PLAI[3] I/O S S Function General Purpose Input-Output Port 0.3 / JTAG Test Port Input - Test Reset. Debug and download access / ADCBUSY signal output General Purpose Input-Output Port 2.5 / External Memory select 1 General Purpose Input-Output Port 2.6 / External Memory select 2 Reset Input. (active low) General Purpose Input-Output Port 3.4 / External Memory Interface / PWM phase 2 high side output / Programmable Logic Array Input 12 General Purpose Input-Output Port 3.5 / External Memory Interface /PWM phase 2 low side output / Programmable Logic Array Input Element 13 Multifunction I/O pin: External Interrupt Request 0, active high / General Purpose Input-Output Port 0.4 / Start conversion input signal for ADC / Programmable Logic Array Output Element 1 Multifunction I/O pin: External Interrupt Request 1, active high / General Purpose Input-Output Port 0.5 / ADCBUSY signal / Programmable Logic Array Output Element 2 Serial Port Multiplexed: General Purpose Input-Output Port 2.0 / PWM safety cut off / UART / Programmable Logic Array Output Element 5/ Start conversion input signal for ADC Serial Port Multiplexed: General Purpose Input-Output Port 0.7 / Output for External Clock signal / UART / Programmable Logic Array Output Element 4/ Input to the internal clock generator circuits. Output from the crystal oscillator inverter Input to the crystal oscillator inverter and input to the internal clock generator circuits General Purpose Input-Output Port 3.6 / External Memory Interface / PWM safety cut off / Programmable Logic Array Input Element 14 General Purpose Input-Output Port 3.7/ / External Memory Interface / Output for External Clock signal /Programmable Logic Array Input Element 15 General Purpose Input-Output Port 2.7 / External Memory select 3 General Purpose Input-Output Port 2.1 / External Memory Write Strobe General Purpose Input-Output Port 2.2 / External Memory Read Strobe Serial Port Multiplexed: General Purpose Input-Output Port 1.7 / UART / SPI / Programmable Logic Array Output Element 0 Serial Port Multiplexed: General Purpose Input-Output Port 1.6 / UART / SPI / Programmable Logic Array Input Element 6 Ground for GPIO. Typically connected to DGND 3.3V Supply for GPIO and input of the on-chip voltage regulator. General Purpose Input-Output Port 4.0 / External Memory Interface / Programmable Logic Array Output Element 8 General Purpose Input-Output Port 4.1 / External Memory Interface /Programmable Logic Array Output Element 9 Serial Port Multiplexed: General Purpose Input-Output Port 1.5 / UART / SPI / Programmable Logic Array Input Element 5/ External Interrupt Request 3, active high Serial Port Multiplexed: General Purpose Input-Output Port 1.4 / UART / SPI / Programmable Logic Array Input Element 4 / External Interrupt Request 2, active high Serial Port Multiplexed: Rev. PrB | Page 16 of 80 Preliminary Technical Data Pin# * Mnemonic ADuC702x Series Type* 60 P1.2/SPM2/PLAI[2] I/O 61 P1.1/SPM1/PLAI[1] I/O 62 P1.0/T1/SPM0/PLAI[0] I/O 63 P4.2/AD10/PLAO[10] I/O 64 P4.3/AD11/PLAO[11] I/O 65 P4.4/AD12/PLAO[12] I/O 66 P4.5/AD13/PLAO[13] I/O 67 REFGND 68 VREF 69 70 71 72 73 74 75 76 77 78 79 80 DACREF DACGND AGND AGND AVDD AVDD DACVDD ADC11 ADC0 ADC1 ADC2/CMP0 ADC3/CMP1 S I/O I S S S S S S I I I I I Function General Purpose Input-Output Port 1.3/ UART / I2C1 /Programmable Logic Array Input Element 3 Serial Port Multiplexed: General Purpose Input-Output Port 1.2 / UART / I2C1 /Programmable Logic Array Input Element 2 Serial Port Multiplexed: General Purpose Input-Output Port 1.1 / UART / I2C0 / Programmable Logic Array Input Element 1 Serial Port Multiplexed: General Purpose Input-Output Port 1.0/ Timer 1 Input / UART / I2C0 / Programmable Logic Array Input Element 0 General Purpose Input-Output Port 4.2 / External Memory Interface / Programmable Logic Array Output Element 10 General Purpose Input-Output Port 4.3 / External Memory Interface /Programmable Logic Array Output Element 11 General Purpose Input-Output Port 4.4 / External Memory Interface /Programmable Logic Array Output Element 12 General Purpose Input-Output Port 4.5 / External Memory Interface /Programmable Logic Array Output Element 13 Ground for the reference. Typically connected to AGND 2.5V internal Voltage Reference. Must be connected to a 0.47uF capacitor when using the internal reference. External Voltage Reference for the DACs. Range: DACGND to DACVDD Ground for the DAC. Typically connected to AGND Analog Ground. Ground reference point for the analog circuitry Analog Ground. Ground reference point for the analog circuitry 3.3V Analog Power 3.3V Analog Power 3.3V Power Supply for the DACs. Typically connected to AVDD Single-ended or differential Analog input 11 Single-ended or differential Analog input 0 Single-ended or differential Analog input 1 Single-ended or differential Analog input 2/ Comparator positive input Single-ended or differential Analog input 3/ Comparator negative input I = Input, O = Output, S = Supply. Rev. PrB | Page 17 of 80 ADC0 ADC1 ADuC7026* ADC2/CMP0 ADC3/CMP1 DAC CONTROL ADC4 ADC CONTROL 12-BIT SAR ADC 1MSPS ADC5 ADC6 MUX DACREF DACGND DACVDD RESET LVDD DGND IOVDD IOVDD IOGND IOGND AVDD AVDD Preliminary Technical Data REFGND AGND AGND GND REF ADuC702x Series 12-BIT VOLTAGE OUTPUT DAC BUF DAC0*/ADC12 12-BIT VOLTAGE OUTPUT DAC BUF DAC1*/ADC13 12-BIT VOLTAGE OUTPUT DAC BUF DAC2*/ADC14 12-BIT VOLTAGE OUTPUT DAC BUF DAC3*/ADC15 ADC7 ADC8 ADC9 ADC10 ADC11 TEMP SENSOR ADCNEG P3.0/PWM0H/PLAI/AD0 P3.1/PWM0L/PLAI/AD1 CMPOUT/IRQ BM/P0.0/CMPOUT/PLAI VREF DAC WAKEUP/ RTC TIMER MCU CORE P3.6/PWMTRIP/PLAI/AD6 POWER SUPPLY MONITOR OSC DOWNLOADER BAND GAP REFERENCE PROG. LOGIC ARRAY P4.7/PLAO/AD15 XCLKO PROG. CLOCK DIVIDER SPI/I2 C SERIAL INTERFACE PLL JTAG EMULATOR P4.6/PLAO/AD14 P3.4/PWM2H/PLAI/AD4 P3.5/PWM2L/PLAI/AD5 8192 BYTES USER RAM (2k X 32 bits) MUX VREF P3.3/PWM1L/PLAI/AD3 ARM7TDMI MUX DAC P3.2/PWM1H/PLAI/AD2 Threephase PWM 62 KBYTES FLASH/EE (31k X 16 bits) UART SERIAL PORT XCLKI P3.7/ECLK/PLAI/AD7 IRQ0/P0.4/CONVSTART/PLAO INTERRUPT CONTROLLER POR IRQ1/P0.5/ADCBUSY /PLAO P0.0 Figure 2: Detailed Block Diagram Rev. PrB | Page 18 of 80 P0.1/BLE P0.2/BHE P2.7/MS3 P2.6/MS2 P2.5/MS1 P2.3/AE P2.4/MS0 P2.2/RS P2.1/WS P0.6/MRST/PLAO/AE/T1 TCK/XCLK P0.3/TRST/A16/ADCBUSY TDI TDO TMS P0.7/ECLK/SPM8/PLAO P2.0/PWMTRIP/SPM9/PLAO/CONVSTART P1.7/SPM7/PLAI P1.5/SPM5/PLAI P1.6/SPM6/PLAI P1.4/SPM4/PLAI P1.3/SPM3/PLAI P1.1/SPM1/PLAI P1.2/SPM2/PLAI P1.0/SPM0/PLAI/T1 P4.5/PLAO/AD13 P4.4/PLAO/AD12 P4.3/PLAO/AD11 P4.2/PLAO/AD10 P4.1/PLAO/AD9 P4.0/PLAO/AD8 SERIAL PORT MULTIPLEXER * See selection table for feature availability on different models. Preliminary Technical Data ADuC702x Series GENERAL DESCRIPTION The ADuC702x is fully integrated, 1MSPS, 12-bit data acquisition system incorporating a high performance multichannel ADC, a 16/32-bit MCU and Flash/EE Memory on a single chip. The ADC consists of up to 12 single-ended inputs. An additional 4 inputs are available but are multiplexed with the 4 DAC output pins. The 4 DAC outputs are only available on certain models of the ADuC702x, though in many cases where the DAC is not present this pin can still be used as an additional ADC input, giving a maximum of 16 ADC input channels. The ADC can operate in single-ended or differential input modes. The ADC input voltage is 0 to VREF. Low drift bandgap reference, temperature sensor and voltage comparator complete the ADC peripheral set. The ADuC702x also integrates 4 buffered voltage output DACs on-chip. The DAC output range is programmable to one of three voltage ranges. The device operates from an on-chip oscillator and PLL generating an internal high-frequency clock of 45 MHz. This clock is routed through a programmable clock divider from which the MCU core clock operating frequency is generated. The microcontroller core is an ARM7TDMI, 16/32-bit RISC machine, offering up to 45 MIPS peak performance. 62k Bytes of non-volatile Flash/EE are provided on-chip as well as 8k Bytes of SRAM. The ARM7TDMI core views all memory and registers as a single linear array. On-chip factory firmware supports in-circuit serial download via the UART and JTAG serial interface ports while nonintrusive emulation is also supported via the JTAG interface. These features are incorporated into a low-cost QuickStart Development System supporting this MicroConverter family. The parts operate from 2.7V to 3.6V and are specified over an industrial temperature range of -40C to 125C. When operating at 45MHz the power dissipation is 150mW. The ADuC702x is available in a variety of memory models and packages. These are detailed on page 9. OVERVIEW OF THE ARM7TDMI CORE The ARM7 core is a 32-bit Reduced Instruction Set Computer (RISC). It uses a single 32-bit bus for instruction and data. The length of the data can be 8, 16 or 32 bits and the length of the instruction word is 32 bits. The ARM7TDMI is an ARM7 core with 4 additional features: - T support for the Thumb (16 bit) instruction set. - D support for debug - M support for long multiplies - I include the EmbeddedICE module to support embedded system debugging. Thumb mode (T) An ARM instruction is 32-bits long. The ARM7TDMI processor supports a second instruction set that has been compressed into 16-bits, the Thumb instruction set. Faster execution from 16-bit memory and greater code density can usually be achieved by using the Thumb instruction set instead of the ARM instruction set, which makes the ARM7TDMI core particularly suitable for embedded applications. However the Thumb mode has two limitations: - Thumb code usually uses more instructions for the same job, so ARM code is usually best for maximising the performance of the time-critical code. - The Thumb instruction set does not include some instructions that are needed for exception handling, so the core will automatically switch to ARM code for exception handling. See ARM7TDMI User Guide for details on the core architecture, the programming model and both the ARM and ARM Thumb instruction sets. Long Multiply (M) The ARM7TDMI instruction set includes four extra instructions which perform 32-bit by 32-bit multiplication with 64-bit result and 32-bit by 32-bit multiplication-accumulation (MAC) with 64-bit result. This result is achieved in a reduced number of cycles than required on a standard ARM7 core. EmbeddedICE (I) EmbeddedICE provides integrated on-chip support for the core. The EmbeddedICE module contains the breakpoint and watchpoint registers which allow code to be halted for debugging purposes. These registers are controlled through the JTAG test port. When a breakpoint or watchpoint is encountered, the processor halts and enters debug state. Once in a debug state, the processor registers may be inspected as well as the Flash/EE, the SRAM and the Memory Mapped Registers. Exceptions ARM supports five types of exceptions, and a privileged processing mode for each type. The five type of exceptions are: - Normal interrupt or IRQ. It is provided to service generalpurpose interrupt handling of internal and external events - Fast interrupt or FIQ. It is provided to service data transfer or communication channel with low latency. FIQ has priority over IRQ Rev. PrB | Page 19 of 80 ADuC702x Series Preliminary Technical Data - Memory abort - Attempted execution of an undefined instruction - Software interrupt (SWI) instruction which can be used to make a call to an operating system. Typically the programmer will define interrupts as IRQ but for higher priority interrupt, i.e. faster response time, the programmer can define interrupt as FIQ. ARM Registers ARM7TDMI has a total of 37 registers, of which 31 are general purpose registers and six are status registers. Each operating mode has dedicated banked registers. When writing user-level programs, 15 general purpose 32-bit registers (r0 to r14), the program counter (r15) and the current program status register (CPSR) are usable. The remaining registers are used only for system-level programming and for exception handling. When an exception occurs, some of the standard register are replaced with registers specific to the exception mode. All exception modes have replacement banked registers for the stack pointer (r13) and the link register (r14) as represented in Figure 3. The fast interrupt mode has more registers (8 to 12) for fast interrupt processing, so that the interrupt processing can begin without the need to save or restore these registers and thus save critical time in the interrupt handling process. r0 r1 r2 r3 r4 r5 r6 r7 r8 r9 r10 r11 r12 r13 r14 r15 (PC) CPSR user mode Interrupt latency The worst case latency for an FIQ consists of the longest time the request can take to pass through the synchronizer, plus the time for the longest instruction to complete (the longest instruction is an LDM) which loads all the registers including the PC, plus the time for the data abort entry, plus the time for FIQ entry. At the end of this time, the ARM7TDMI will be executing the instruction at 0x1C (FIQ interrupt vector address). The maximum total time is 50 processor cycles, which is just over 1.1S in a system using a continuous 45 MHz processor clock. The maximum IRQ latency calculation is similar, but must allow for the fact that FIQ has higher priority and could delay entry into the IRQ handling routine for an arbitrary length of time. This time can be reduced to 42 cycles if the LDM command is not used, some compilers have an option to compile without using this command. Another option is to run the part in THUMB mode where this is reduced to 22 cycles. The minimum latency for FIQ or IRQ interrupts is five cycles in total which consists of the shortest time the request can take through the synchronizer plus the time to enter the exception mode. Note that the ARM7TDMI will always be run in ARM (32-bit) mode when in privileged modes, i.e. when executing interrupt service routines. usable in user mode system modes only r8_fiq r9_fiq r10_fiq r11_fiq r12_fiq r13_abt r13_fiq r13_svc r14_abt r14_svc r14_fiq SPSR_fiq fiq mode SPSR_svc svc mode SPSR_abt r13_und r13_irq r14_und r14_irq SPSR_irq abort mode SPSR_und irq undefined mode mode Figure 3: register organisation More information relative to the programmer's model and the ARM7TDMI core architecture can be found in the following documents from ARM: - DDI0029G, ARM7TDMI Technical Reference Manual. - DDI0100E, ARM Architecture Reference Manual. Rev. PrB | Page 20 of 80 Preliminary Technical Data ADuC702x Series MEMORY ORGANISATION The part incorporates two separate blocks of memory, 8kByte of SRAM and 64kByte of On-Chip Flash/EE memory. 62kByte of On-Chip Flash/EE memory are available to the user, and the remaining 2kBytes are reserved for the factory configured boot page. These two blocks are mapped as shown in Figure 4. Note that by default, after a reset, the Flash/EE memory is mirrored at address 0x00000000. It is possible to remap the SRAM at address 0x00000000 by clearing bit 0 of the REMAP MMR. This remap function is described in more details in the Flash/EE memory chapter. FFFFFFFFh MMRs FFFF0000h Reserved 0008FFFFh Flash/EE Memory The total 64kBytes of Flash/EE are organised as 32k X 16 bits. 31k X 16 bits are user space and 1k X 16 bits is reserved for the on chip kernel. The page size of this Flash/EE memory is 512Bytes. 62kBytes of Flash/EE are available to the user as code and nonvolatile data memory. There is no distinction between data and program as ARM code shares the same space. The real width of the Flash/EE memory is 16 bits, which means that in ARM mode (32-bit instruction), two accesses to the Flash/EE are necessary for each instruction fetch. It is therefore recommended to use Thumb mode when executing from Flash/EE memory for optimum access speed. The maximum access speed for the Flash/EE memory is 45MHz in Thumb mode and 22.5MHz in full ARM mode. More details on Flash/EE access time are outlined later in `Execution from SRAM and Flash/EE' section of this datasheet. Flash/EE SRAM 00080000h Reserved 8kBytes of SRAM are available to the user, organized as 2k X 32 bits, i.e. 2kWords. ARM code can run directly from SRAM at 45MHz , given that the SRAM array is configured as a 32-bit wide memory array. More details on SRAM access time are outlined later in `Execution from SRAM and Flash/EE' section of this datasheet. 00011FFFh SRAM 00010000h 0000FFFFh Re-mappable Memory Space (Flash/EE or SRAM) 00000000h Figure 4: Physical memory map Memory Mapped Registers Memory Access The ARM7 core sees memory as a linear array of 232 byte location where the different blocks of memory are mapped as outlined in Figure 4. The ADuC702x memory organisation is configured in little endian format: the least significant byte is located in the lowest byte address and the most significant byte in the highest byte address. bit31 Byte3 Byte2 Byte1 The Memory Mapped Register (MMR) space is mapped into the upper 2 pages of the memory array and accessed by indirect addressing through the ARM7 banked registers. The MMR space provides an interface between the CPU and all on-chip peripherals. All registers except the core registers reside in the MMR area. All shaded locations shown in Figure 6 are unoccupied or reserved locations and should not be accessed by user software. Table 6 shows a full MMR memory map. bit0 Byte0 ... ... ... ... 0xFFFFFFFFh B 7 3 A 6 2 9 5 1 8 4 0 0x00000004h 0x00000000h 32 bits Figure 5: little endian format Rev. PrB | Page 21 of 80 ADuC702x Series Preliminary Technical Data 0xFFFFFFFF 0xFFFFFC3C PWM 0xFFFFFC00 0xFFFFF820 0xFFFFF800 Flash Control Interface 0xFFFFF46C GPIO 0xFFFFF400 0xFFFF0B54 PLA 0xFFFF0B00 0xFFFF0A14 SPI 0xFFFF0A00 0xFFFF0948 I2C1 0xFFFF0900 0xFFFF0848 I2C0 0xFFFF0800 0xFFFF0730 UART 0xFFFF0700 0xFFFF0620 DAC 0xFFFF0600 0xFFFF0538 ADC 0xFFFF0500 0xFFFF0490 0xFFFF048C 0xFFFF0448 0xFFFF0440 0xFFFF0420 0xFFFF0404 0xFFFF0370 0xFFFF0360 0xFFFF0350 0xFFFF0340 0xFFFF0334 0xFFFF0320 Bandgap Reference Power Supply Monitor PLL & Oscillator Control Watchdog Timer Wake Up Timer General Purpose Timer 0xFFFF0310 Timer 0 0xFFFF0300 0xFFFF0238 0xFFFF0220 0xFFFF0110 0xFFFF0000 Remap & System Control Interrupt Controller Figure 6: Memory Mapped Rev. PrB | Page 22 of 80 Preliminary Technical Data ADuC702x Series Table 6. Complete MMRs list Address Name Byte Access Type Page Address Name Byte Cycle IRQ address base = 0xFFFF0000 Access Page Type Cycle 0x0414 PLLCON 2 RW 2 41 PLLKEY2 2 W 2 41 0x0000 IRQSTA 4 R 1 65 0x0418 0x0004 IRQSIG 4 R 1 65 PSM address base = 0xFFFF0440 0x0008 IRQEN 4 RW 1 65 0x0440 PSMCON 2 RW 2 39 0x000C IRQCLR 4 W 1 65 0x0444 CMPCON 2 RW 2 39 0x0010 SWICFG 4 W 1 66 Reference address base = 0xFFFF0480 0x0100 FIQSTA 4 R 1 65 0x048C RW 2 31 0x0104 FIQSIG 4 R 1 65 ADC address base = 0xFFFF0500 0x0108 FIQEN 4 RW 1 65 0x0500 ADCCON 1 RW 2 27 0x010C FIQCLR 4 W 1 65 0x0504 ADCCP 1 RW 2 28 0x0508 ADCCN 1 RW 2 28 System Control address base = 0xFFFF0200 REFCON 1 0x0220 REMAP 1 RW 1 36 0x050C ADCSTA 1 RW 2 27 0x0230 RSTSTA 1 R 1 36 0x0510 ADCDAT 4 R 2 27 0x0234 RSTCLR 1 W 1 36 0x0514 ADCRST 1 RW 2 27 0x0530 ADCGN 2 RW 2 30 ADCOF 2 RW 2 30 Timer address base = 0xFFFF0300 0x0300 T0LD 2 RW 2 67 0x0534 0x0304 T0VAL 2 R 2 67 DAC address base = 0xFFFF0600 0x0308 T0CON 2 RW 2 67 0x0600 DAC0CON 1 RW 2 37 0x030C T0CLRI 1 W 2 67 0x0604 DAC0DAT 4 RW 2 37 0x0320 T1LD 4 RW 2 68 0x0608 DAC1CON 1 RW 2 37 0x0324 T1VAL 4 R 2 68 0x060C DAC1DAT 4 RW 2 37 0x0328 T1CON 2 RW 2 68 UART base address = 0xFFFF0700 0x032C T1CLRI 1 W 2 68 0x0700 0x0330 T1CAP 4 RW 2 0x0340 T2LD 4 RW 0x0344 T2VAL 4 0x0348 T2CON 0x034C COMTX 1 RW 2 53 68 COMRX 1 R 2 53 2 69 COMDIV0 1 RW 2 53 R 2 69 COMIEN0 1 RW 2 54 2 RW 2 69 COMDIV1 1 R/W 2 53 T2CLRI 1 W 2 69 0x0708 COMIID0 1 R 2 54 0x0360 T3LD 2 RW 2 70 0x070C COMCON0 1 RW 2 53 0x0364 T3VAL 2 R 2 70 0x0710 COMCON1 1 RW 2 55 0x0368 T3CON 2 RW 2 70 0x0714 COMSTA0 1 R 2 54 0x036C T3CLRI 1 W 2 70 0x0718 COMSTA1 1 R 2 55 0x071C COMSCR 1 RW 2 53 PLL base address = 0xFFFF0400 0x0704 0x0404 POWKEY1 2 W 2 41 0x0720 COMIEN1 1 RW 2 56 0x0408 POWCON 2 RW 2 41 0x0724 COMIID1 1 R 2 56 0x040C POWKEY2 2 W 2 41 0x0728 COMADR 1 RW 2 53 0x0410 PLLKEY1 2 W 2 41 0X072C COMDIV2 2 RW 2 55 Rev. PrB | Page 23 of 80 ADuC702x Series Address Name Byte Preliminary Technical Data Access Type Page Address Name Byte Cycle I2C0 base address = 0xFFFF0800 Access Page Type Cycle 0x0A04 SPIRX 1 R 2 57 0x0800 I2C0MSTA 1 R 2 60 0x0A08 SPITX 1 W 2 57 0x0804 I2C0SSTA 1 R 2 60 0x0A0C SPIDIV 1 RW 2 57 0x0808 I2C0SRX 1 R 2 59 0x0A10 SPICON 2 RW 2 57 0x080C I2C0STX 1 W 2 59 PLA base address = 0xFFFF0B00 0x0810 I2C0MRX 1 R 2 59 0x0B00 PLAELM0 2 RW 2 62 0x0814 I2C0MTX 1 W 2 59 0x0B04 PLAELM1 2 RW 2 62 0x0818 I2C0CNT 1 RW 2 59 0x0B08 PLAELM2 2 RW 2 62 0x081C I2C0ADR 1 RW 2 59 0x0B0C PLAELM3 2 RW 2 62 0x0824 I2C0BYTE 1 RW 2 59 0x0B10 PLAELM4 2 RW 2 62 0x0828 I2C0ALT 1 RW 2 59 0x0B14 PLAELM5 2 RW 2 62 0x082C I2C0CFG 1 RW 2 59 0x0B18 PLAELM6 2 RW 2 62 0x0830 I2C0DIVH 1 RW 2 59 0x0B1C PLAELM7 2 RW 2 62 0x0834 I2C0DIVL 1 RW 2 59 0x0B20 PLAELM8 2 RW 2 62 0x0838 I2C0ID0 1 RW 2 59 0x0B24 PLAELM9 2 RW 2 62 0x083C I2C0ID1 1 RW 2 59 0x0B28 PLAELM10 2 RW 2 62 0x0840 I2C0ID2 1 RW 2 59 0x0B2C PLAELM11 2 RW 2 62 0x0844 I2C0ID3 1 RW 2 59 0x0B30 PLAELM12 2 RW 2 62 0x0B34 PLAELM13 2 RW 2 62 I2C1 base address = 0xFFFF0900 0x0900 I2C1MSTA 1 R 2 60 0x0B38 PLAELM14 2 RW 2 62 0x0904 I2C1SSTA 1 R 2 60 0x0B3C PLAELM15 2 RW 2 62 0x0908 I2C1SRX 1 R 2 59 0x0B40 PLACLK 1 RW 2 63 0x090C I2C1STX 1 W 2 59 0x0B44 PLAIRQ 4 RW 2 63 0x0910 I2C1MRX 1 R 2 59 0x0B48 PLAADC 4 RW 2 64 0x0914 I2C1MTX 1 W 2 59 0x0B4C PLADIN 4 R 2 64 0x0918 I2C1CNT 1 RW 2 59 0x0B50 PLADOUT 4 RW 2 64 0x091C I2C1ADR 1 RW 2 59 External Memory base address = 0xFFFFF000 0x0924 I2C1BYTE 1 RW 2 59 0xF000 XMCFG 1 RW 2 71 0x0928 I2C1ALT 1 RW 2 59 0xF010 XM0CON 1 RW 2 71 0x092C I2C1CFG 1 RW 2 59 0xF014 XM1CON 1 RW 2 71 0x0930 I2C1DIVH 1 RW 2 59 0xF018 XM2CON 1 RW 2 71 0x0934 I2C1DIVL 1 RW 2 59 0xF01C XM3CON 1 RW 2 71 0x0938 I2C1ID0 1 RW 2 59 0xF020 XM0PAR 2 RW 2 71 0x093C I2C1ID1 1 RW 2 59 0xF024 XM1PAR 2 RW 2 71 0x0940 I2C1ID2 1 RW 2 59 0xF028 XM2PAR 2 RW 2 71 0x0944 I2C1ID3 1 RW 2 59 0xF02C XM3PAR 2 RW 2 71 SPI base address = 0xFFFF0A00 0x0A00 SPISTA 1 GPIO base address = 0xFFFFF400 R 2 57 0xF400 GP0CON 4 RW 1 49 0xF404 GP1CON 4 RW 1 49 Rev. PrB | Page 24 of 80 Preliminary Technical Data Address Name Byte Access ADuC702x Series Page Type Cycle 0xF408 GP2CON 4 RW 1 49 0xF40C GP3CON 4 RW 1 49 0xF410 GP4CON 4 RW 1 49 0xF420 GP0DAT 4 RW 1 51 0xF424 GP0SET 1 W 1 51 0xF428 GP0CLR 1 W 1 51 0xF430 GP1DAT 4 RW 1 51 0xF434 GP1SET 1 W 1 51 0xF438 GP1CLR 1 W 1 51 0xF440 GP2DAT 4 RW 1 51 0xF444 GP2SET 1 W 1 51 0xF448 GP2CLR 1 W 1 51 0xF450 GP3DAT 4 RW 1 51 0xF454 GP3SET 1 W 1 51 0xF458 GP3CLR 1 W 1 51 0xF460 GP4DAT 4 RW 1 51 0xF464 GP4SET 1 W 1 51 0xF468 GP4CLR 1 W 1 51 The `Access' column corresponds to the access time reading or writing a MMR. It depends on the AMBA (Advanced Microcontroller Bus Architecture) bus used to access the peripheral. The processor has two AMBA busses, AHB (Advanced High-performance Bus) used for system modules and APB (Advanced Peripheral Bus) used for lower performance peripheral. Flash/EE base address = 0xFFFFF800 0xF800 FEESTA 1 R 1 33 0xF804 FEEMOD 1 RW 1 33 0xF808 FEECON 1 RW 1 33 0xF80C FEEDAT 2 RW 1 33 0xF810 FEEADR 2 RW 1 33 0xF818 FEESIGN 3 R 1 33 0xF81C FEEPRO 4 RW 1 34 0xF820 FEEHIDE 4 RW 1 34 PWM base address= 0xFFFFFC00 0xFC00 PWMCON 2 RW 1 47 0xFC04 PWMSTA 2 RW 1 47 0xFC08 PWMDAT0 2 RW 1 47 0xFC0C PWMDAT1 2 RW 1 47 0xFC10 PWMCFG 2 RW 1 47 0xFC14 PWMCH0 2 RW 1 47 0xFC18 PWMCH1 2 RW 1 47 0xFC1C PWMCH2 2 RW 1 47 0xFC20 PWMEN 2 RW 1 48 0xFC24 PWMDAT2 2 RW 1 48 Rev. PrB | Page 25 of 80 ADuC702x Series Preliminary Technical Data ADC CIRCUIT INFORMATION ADC TRANSFER FUNCTION GENERAL OVERVIEW The Analog Digital Converter (ADC) incorporates a fast, multichannel, 12-bit ADC. It can operate from 2.7V to 3.6V supplies and is capable of providing a throughput of up to 1MSPS when the clock source is 45MHz. This block provides the user with multi-channel multiplexer, differential track-and-hold, on-chip reference and ADC. The ADC consists of a 12-bit successive-approximation converter based around two capacitor DACs. It can operate in one of three different modes, depending on the input signal configuration : * fully differential mode, for small and balanced signals * single-ended mode, for any single-ended signals * pseudo-differential mode, for any single-ended signals, taking advantage of the common mode rejection offered by the pseudo differential input. The converter accepts an analog input range of 0 to VREF when operating in single-ended mode or pseudo-differential mode. In fully differential mode, the input signal must be balanced around a common mode voltage VCM, in the range 0V to AVDD and with a maximum amplitude of 2 VREF (see Figure 7). Pseudo-differential and single-ended modes In pseudo-differential or single-ended mode, the input range is 0 V to VREF. The output coding is straight binary in pseudo differential and single-ended modes with 1 LSB = FS/4096 or 2.5 V/4096 = 0.61 mV or 610 V when VREF = 2.5 V. The ideal code transitions occur midway between successive integer LSB values (i.e. 1/2 LSB, 3/2 LSBs, 5/2 LSBs, . . ., FS -3/2 LSBs). The ideal input/output transfer characteristic is shown in Figure 8. OUTPUT CODE 1111 1111 1111 1111 1111 1110 1111 1111 1101 1111 1111 1100 1LSB = FS 4096 0000 0000 0011 0000 0000 0010 0000 0000 0001 0000 0000 0000 0V 1LSB VOLTAGE INPUT +FS - 1LSB Figure 8: ADC transfer function in pseudo differential mode or single-ended mode AVDD VCM VCM 2VREF Fully differential mode 2VREF VCM 2VREF 0 Figure 7: examples of balanced signals for fully differential mode A high precision, low drift, and factory calibrated 2.5 V reference is provided on-chip. An external reference can also be connected as described later. Single or continuous conversion modes can be initiated in software. An external CONVSTART pin, an output generated from the on-chip PLA or a Timer1 or a Timer2 overflow can also be used to generate a repetitive trigger for ADC conversions. A voltage output from an on-chip bandgap reference proportional to absolute temperature can also be routed through the front end ADC multiplexer (effectively an additional ADC channel input) facilitating an internal temperature sensor channel, measuring die temperature to an accuracy of 3C. The amplitude of the differential signal is the difference between the signals applied to the VIN+ and VIN- pins (i.e., VIN+ - VIN-). The maximum amplitude of the differential signal is therefore -VREF to +VREF p-p (i.e. 2 X VREF). This is regardless of the common mode (CM). The common mode is the average of the two signals, i.e. (VIN+ + VIN-)/2 and is therefore the voltage that the two inputs are centred on. This results in the span of each input being CM VREF/2. This voltage has to be set up externally and its range varies with VREF, (see driving the ADC). The output coding is two's complement in fully differential mode with 1 LSB = 2VREF/4096 or 2x2.5 V/4096 = 1.22 mV when VREF = 2.5 V. The designed code transitions occur midway between successive integer LSB values (i.e., 1/2 LSB, 3/2 LSBs, 5/2 LSBs, . . ., FS -3/2 LSBs). The ideal input/output transfer characteristic is shown in Figure 9. Rev. PrB | Page 26 of 80 Preliminary Technical Data OUTPUT CODE 0111 1111 1111 0111 1111 1110 1LSB = ADuC702x Series ADC MMRS interface 2xV REF The ADC is controlled and configured via a number of MMRs that are listed below and described in detail in the following pages: 4096 0111 1111 1101 0000 0000 0001 0000 0000 0000 1111 1111 1111 1000 0000 0010 1000 0000 0001 1000 0000 0000 -V REF + 1LSB 0LSB +V REF - 1LSB VOLTAGE INPUT (Vin+ - Vin-) Figure 9: ADC transfer function in differential mode TYPICAL OPERATION Once configured via the ADC control and channel selection registers, the ADC will convert the analog input and provide a 12-bit result in the ADC data register. The top 4 bits are the sign bits and the 12-bit result is placed from bit 16 to 27 as shown in Figure 10. Again, it should be noted that in fully differential mode, the result is represented in two's complement format, and in pseudo differential and singleended mode, the result is represented in straight binary format. 31 27 16 15 SIGN BITS 12-bit ADC RESULT Figure 10: ADC Result Format - ADCCON: ADC Control Register allows the programmer to enable the ADC peripheral, to select the mode of operation of the ADC, either Single-ended, pseudo-differential or fully differential mode and the conversion type. This MMR is described Table 7. - ADCCP: ADC positive Channel selection Register - ADCCN: ADC negative Channel selection Register ADCSTA: ADC Status Register, indicates when an ADC conversion result is ready. The ADCSTA register contains only one bit, bit (bit 0), representing the status of the ADC. This bit is set at the end of an ADC conversion generating an ADC interrupt, it is cleared automatically by reading the ADCDAT MMR. When the ADC is performing a conversion, the status of the ADC can be read externally via the ADCBusy pin. This pin is high during a conversion. When the conversion is finished, ADCBusy goes back low. This information can be available on P0.3 (see chapter on GPIO) if enabled in ADCCON register. ADCDAT: ADC Data Result Register, hold the 12-bit ADC result as shown Figure 10 ADCRST: ADC Reset Register. Resets all the ADC registers 0 to their default value. - ADCOF: Offset calibration register. 10-bit register - ADCGN: Gain calibration register. 10-bit register The same format is used in DACxDAT, simplifying the software. Table 7: ADCCON MMR Bit Designations Bit Description 7 Enable Conversion Set by the user to enable conversion mode Cleared by the user to disable conversion mode 6 Enable ADCBUSY Set by the user to enable the ADCBUSY pin Cleared by the user to disable the ADCBUSY pin 5 ADC power control: Set by the user to place the ADC in normal mode, the ADC must be powered up for at least 500uS before it will convert correctly. Cleared by the user to place the ADC in power-down mode 4-3 2-0 Conversion Mode: 00 Single Ended Mode 01 Differential Mode 10 Pseudo-Differential Mode 11 Reserved Conversion Type: Rev. PrB | Page 27 of 80 ADuC702x Series Preliminary Technical Data 000 Enable CONVSTART pin as a conversion input 001 Enable timer 1 as a conversion input 010 Enable timer 0 as a conversion input 011 Single software conversion, will be set to 000 after conversion. 100 Continuous software conversion 101 PLA conversion Other Reserved Table 9: ADCCN* MMR bit designation Table 8: ADCCP* MMR bit designation Bit Description Bit Description 7-5 Reserved 7-5 Reserved 4-0 Positive Channel Selection Bits 4-0 Negative Channel Selection Bits 00000 ADC0 00000 ADC0 00001 ADC1 00001 ADC1 00010 ADC2 00010 ADC2 00011 ADC3 00011 ADC3 00100 ADC4 00100 ADC4 00101 ADC5 00101 ADC5 00110 ADC6 00110 ADC6 00111 ADC7 00111 ADC7 01000 ADC8 01000 ADC8 01001 ADC9 01001 ADC9 01010 ADC10 01010 ADC10 01011 ADC11 01011 ADC11 01100 DAC0/ADC12 01100 DAC0/ADC12 01101 DAC1/ADC13 01101 DAC1/ADC13 01110 DAC2/ADC14 01110 DAC2/ADC14 01111 DAC3/ADC15 01111 DAC3/ADC15 10000 Temperature sensor 10000 Reference 10001 AGND Others Reserved 10010 Reference 10011 AVDD/2 Others Reserved * ADC and DAC channel availability depends on part model. See page 9 for details. Rev. PrB | Page 28 of 80 Preliminary Technical Data ADuC702x Series CONVERTER OPERATION The ADC incorporates a successive approximation (SAR) architecture involving a charge-sampled input stage. This architecture is described below for the three different modes of operation. of the ADuC702x and SW2 switches between A (Channel-) and B (VREF). VIN- pin must be connected to Ground or a low voltage. The input signal on VIN+ can then vary from VIN- to VREF + VIN-. Note VIN- must be chosen so that VREF + VIN- does not exceed AVDD. CAPACITIVE DAC AIN0 The ADuC702x contains a successive approximation ADC based on two capacitive DACs. Figure 11 and Figure 12 show simplified schematics of the ADC in acquisition and conversion phase, respectively. The ADC is comprised of control logic, a SAR, and two capacitive DACs. In Figure 11 (the acquisition phase), SW3 is closed and SW1 and SW2 are in Position A, the comparator is held in a balanced condition, and the sampling capacitor arrays acquire the differential signal on the input. CAPACITIVE DAC AIN0 MUX Channel- AIN11 Cs B A SW1 A SW2 B VREF COMPARATOR SW3 MUX Channel+ Cs B A SW1 A SW2 B AIN11 VREF COMPARATOR SW3 CONTROL LOGIC Cs CAPACITIVE DAC VINChannel- Figure 13: ADC in pseudo-differential mode Single-ended mode In Single-ended mode, SW2 is always connected internally to ground. The VIN- pin can be floating. The input signal range on VIN+ is 0V to VREF. CONTROL LOGIC CAPACITIVE DAC AIN0 Cs CAPACITIVE DAC Figure 11: ADC acquisition phase ... ... Channel+ ... Differential mode MUX Channel+ B Cs A SW1 COMPARATOR SW3 CONTROL LOGIC ChannelAIN11 When the ADC starts a conversion (Figure 12), SW3 will open and SW1 and SW2 will move to Position B, causing the comparator to become unbalanced. Both inputs are disconnected once the conversion begins. The control logic and the charge redistribution DACs are used to add and subtract fixed amounts of charge from the sampling capacitor arrays to bring the comparator back into a balanced condition. When the comparator is rebalanced, the conversion is complete. The control logic generates the ADC's output code. The output impedances of the sources driving the VIN+ and VIN- pins must be matched; otherwise, the two inputs will have different settling times, resulting in errors. CAPACITIVE DAC Cs CAPACITIVE DAC VIN- Figure 14: ADC in single-ended mode Analog Input Structure Figure 15 shows the equivalent circuit of the analog input structure of the ADC. The four diodes provides ESD protection for the analog inputs. Care must be taken to ensure that the analog input signals never exceed the supply rails by more than 300 mV. This would cause these diodes to become forward biased and start conducting into the substrate. These diodes can conduct up to 10 mA without causing irreversible damage to the part. AIN0 ... Channel+ Cs B A SW1 A SW2 MUX Channel- B VREF COMPARATOR SW3 CONTROL LOGIC Cs AIN11 CAPACITIVE DAC Figure 12: ADC conversion phase Pseudo-differential mode In pseudo-differential mode, Channel- is linked to the VIN- pin The capacitors C1 in Figure 15 are typically 4 pF and can primarily be attributed to pin capacitance. The resistors are lumped components made up of the ON resistance of the switches. The value of these resistors is typically about 100 . The capacitors, C2, are the ADC's sampling capacitors and have a capacitance of 16 pF typically. For AC applications, removing high-frequency components from the analog input signal is recommended by the use of an RC low-pass filter on the relevant analog input pins. In applications where harmonic distortion and signal-to-noise Rev. PrB | Page 29 of 80 ADuC702x Series Preliminary Technical Data ratio are critical, the analog input should be driven from a low impedance source. Large source impedances will significantly affect the AC performance of the ADC. This may necessitate the use of an input buffer amplifier. The choice of the op amp will be a function of the particular application. AVDD D R1 C2 For offset error correction, either an external pin must be tied to AGND (system calibration) or the internal AGND channel must be selected (device calibration). A software loop must be implemented to tweak the value in ADCOF register each time until the transition of ADCDAT reads code 0 to 1. Offset error correction is done digitally and has a resolution of 0.25 lsb and a range of +/- 3.125% of VREF. D C1 For gain error correction, either an external pin must be tied to VREF (system calibration) or the internal reference channel must be selected (device calibration). A software loop must be implemented to tweak the value in ADCGN register each time until the transition of ADCDAT reads code 4094 to 4095. Similar to the offset calibration, the gain calibration resolution is 0.25 lsb with a range of +/- 3% of VREF. AVDD D R1 C2 D C1 TEMPERATURE SENSOR Figure 15: Equivalent Analog Input Circuit Conversion Phase: Switches Open Track Phase: Switches Closed When no amplifier is used to drive the analog input, the source impedance should be limited to values lower than 1 k . The maximum source impedance will depend on the amount of total harmonic distortion (THD) that can be tolerated. The THD will increase as the source impedance increases and the performance will degrade. DRIVING THE ANALOG INPUTS Internal or external reference can be used for the ADC. In differential mode of operation, there are restrictions on common mode input signal (VCM) that are dependant on reference value and supply voltage used to ensure that the signal remains within the supply rails. Table 10 gives some calculated VCM min VCM max for some conditions. Table 10: VCM ranges AVDD VREF VCM min VCM max Signal Peak-Peak 3.3V 2.5V 1.25V 2.05V 2.5V 2.048V 1.024V 2.276V 2.048V 1.25 0.75V 2.55V 1.25 2.5V 1.25V 1.75V 2.5V 2.048V 1.024V 1.976V 2.048V 1.25 0.75V 2.25V 1.25 3.0V ADCOF and ADCGN. The ADuC702x provides a voltage output from an on-chip bandgap reference proportional to absolute temperature. It can also be routed through the front end ADC multiplexer (effectively an additional ADC channel input) facilitating an internal temperature sensor channel, measuring die temperature to an accuracy of 3C. BANDGAP REFERENCE The ADuC702x provides an on-chip bandgap reference of 2.5V, which can be used for the ADC and for the DAC. This internal reference also appears on the VREF pin. When using the internal reference, a capacitor of 0.47F must be connected from the external VREF pin to AGND, to ensure stability and fast response during ADC conversions. This reference can also be connected to an external pin (VREF) and used as a reference for other circuits in the system. An external buffer would be required because of the low drive capability of the VREF output. A programmable option also allows an external reference input on the VREF pin. The bandgap reference interface consists on a 8-bit MMR, REFCON described in ADC CALIBRATION Table 11. System calibration or device calibration are performed in software. Two 10-bit registers are available for calibration, Rev. PrB | Page 30 of 80 Preliminary Technical Data ADuC702x Series Table 11: REFCON MMR bit designations Bit Description 7-2 Reserved 1 Internal reference powerdown enable Set by user to place the internal reference in power-down mode and use an external reference Cleared by user to place the internal reference in normal mode and use it for ADC conversions Internal reference output enable Set by user to connect the internal 2.5V reference to the VREF pin. The reference can be used for external component but will need to be buffered. Cleared by user to disconnect the reference from the VREF pin. 0 Rev. PrB | Page 31 of 80 ADuC702x Series Preliminary Technical Data NONVOLATILE FLASH/EE MEMORY (3) JTAG access FLASH/EE MEMORY OVERVIEW The JTAG protocol uses the on-chip JTAG interface to facilitate code download and debug. The ADuC702x incorporates Flash/EE memory technology onchip to provide the user with non-volatile, in-circuit reprogrammable memory space. Like EEPROM, Flash memory can be programmed in-system at a byte level, although it must first be erased; the erase being performed in page blocks. Thus, Flash memory is often and more correctly referred to as Flash/EE memory. Overall, Flash/EE memory represents a step closer to the ideal memory device that includes non-volatility, in-circuit programmability, high density, and low cost. Incorporated in the ADuC702x, Flash/EE memory technology allows the user to update program code space in-circuit, without the need to replace one time programmable (OTP) devices at remote operating nodes. FLASH/EE MEMORY AND THE ADUC702X The ADuC702x contains a 64 kByte array of Flash/EE Memory. The lower 62 Kbytes is available to the user and the upper 2 kBytes of this Flash/EE program memory array contain permanently embedded firmware, allowing in circuit serial download. These 2 Kbytes of embedded firmware also contain a power-on configuration routine that downloads factory calibrated coefficients to the various calibrated peripherals (ADC, temperature sensor, bandgap references and so on). This 2 kByte embedded firmware is hidden from user code. The 62kBytes of Flash/EE memory can be programmed incircuit, using the serial download mode or the JTAG mode provided or via parallel programming. (1) Serial Downloading (In-Circuit Programming) The ADuC702x facilitates code download via the standard UART serial port or via the I2C port. The ADuC702x will enter serial download mode after a reset or power cycle if the BM pin is pulled low through an external 1kOhm resistor. Once in serial download mode, the user can download code to the full 62kBytes of Flash/EE memory while the device is in circuit in its target application hardware. A PC serial download executable is provided as part of the development system for serial downloading via the UART. An application note is available at www.analog.com/microconverter describing the protocol for serial downloading via the UART and I2C. (2) Parallel Programming FLASH/EE MEMORY SECURITY The 62kByte of Flash/EE memory available to the user can be read and write protected. Bit 31 of the FEEPRO/FEEHIDE MMR protects the 62kBytes from being read through JTAG and also in parallel programming mode. The other 31 bits of this register protect writing to the flash memory, each bit protects 4 pages, i.e. 2kBytes. Write protection is activated for all type of access. There are two levels of protection: - Protection can be set and removed by writing directly into FEEHIDE MMR. - FEEPRO can be protected by a key to avoid direct access to FEEPRO. The key is saved once and must be entered again to modify FEEPRO. A mass erase will set the key back to 0xFFFF but will also erase all the user code. Sequence to write the key: 1. Enter an address in FEEADR. 2. Do a single READ command, wait for the read to be successful by monitoring FEESTA. 3. Run a verify command. 4. Write the bit in FEEPRO corresponding to the page to be protected. 5. Enable key protection by setting bits 7 to 4 of FEEMOD. 6. Write a 32 bit key in FEEADR, FEEDAT 7. Run the write key command 0x0C in FEECON, wait for the read to be successful by monitoring FEESTA. To remove or modify the protection the same sequence can be used with a modified value of FEEPRO. The sequence above is illustrated in the following example, this protects writing pages 4 to 7 of the FLASH: FEEADR = 0x800; FEECON=0x01; while (!(FEESTA & 0x01)){} FEECON=0x04; FEEPRO=0xFFFFFFFD; FEEMOD=(FEEMOD & 0xF0); FEEADR=0xAA55; FEEDAT=0xAA55; FEECON= 0x0C; while (!(FEESTA & 0x01)){} The parallel programming protocol allows the on-chip Flash/EE memory be programmed by industry standard third party programmers. Rev. PrB | Page 32 of 80 //Any address, //Read command //Wait for read //Verify Command //Protect pages 4 to 7 //Write key enable //16 bit key value //16 bit key value // Write key command //Wait for command Preliminary Technical Data ADuC702x Series FLASH/EE CONTROL INTERFACE Serial, parallel and JTAG programming use the Flash/EE Control Interface, which includes seven MMRs: - FEESTA: read only register, reflects the status of the Flash Control Interface - FEEMOD: sets the operating mode of the Flash Control Interface - FEEDAT: 16-bit data register. FEEADR: 16-bit address register. FEESIGN: 24-bit code signature FEEPRO: protection following subsequent reset MMR. Requires software key. See description Table 15 - FEEHIDE: Immediate Protection MMR. Does not require any software keys. See description Table 15 - FEECON: 8-bit command register. The commands are described Table 14 Table 12: FEESTA MMR bit designations Bit Description 15-6 Reserved 5 Burst command enable Set when the command is a burst command: 0x07, 0x08 or 0x09 Cleared when other command Reserved 4 3 2 1 0 Flash interrupt status bit Set automatically when an interrupt occurs, i.e. when a command is complete and the Flash/EE interrupt enable bit in the FEEMOD register is set Cleared when reading FEESTA register Flash/EE controller busy Set automatically when the controller is busy Cleared automatically when the controller is not busy Command fail Set automatically when a command completes unsuccessfully Cleared automatically when reading FEESTA register Command complete Set by MicroConverter when a command is complete Cleared automatically when reading FEESTA register Table 13: FEEMOD MMR bit designations Bit Description 7-5 Reserved 4 Flash/EE interrupt enable: Set by user to enable the Flash/EE interrupt. The interrupt will occur when a command is complete. Cleared by user to disable the Flash/EE interrupt Reserved 3-0 Table 14: command codes in FEECON Code 0x00* 0x01* 0x02* 0x03* command Null Single Read Single Write Erase-Write 0x04* Single Verify 0x05* Single Erase Description Idle state Load FEEDAT with the 16-bit data indexed by FEEADR Write FEEDAT at the address pointed by FEEADR. This operation takes 20s. Erase the page indexed by FEEADR and write FEEDAT at the location pointed by FEEADR. This operation takes 20ms Compare the contents of the location pointed by FEEADR to the data in FEEDAT. The result of the comparison is returned in FEESTA bit 1 Erase the page indexed by FEEADR Rev. PrB | Page 33 of 80 ADuC702x Series 0x06* Mass erase 0x07 0x08 0x0B Burst read Burst readwrite Erase Burst read-write Burst termination Signature 0x0C Protect 0x0D 0x0E 0x0F Reserved Reserved Ping 0x09 0x0A * Preliminary Technical Data Erase 62kByte of user space. The 2kByte of kernel are protected. This operation takes 2.48s To prevent accidental execution a command sequence is required to execute this instruction, this is described below. Default command. No write is allowed. This operation takes 2 cycles Write can handle a maximum of 8 data of 16 bits and takes a maximum of 8 x 20 s Will automatically erase the page indexed by the write, allow to write pages without running an erase command. This command takes 20 ms to erase the page + 20 s per data to write Stops the running burst to allow execution from Flash/EE immediately Give a signature of the 64kBytes of Flash/EE in the 24-bit FEESIGN MMR. This operation takes 32778 clock cycles. This command can be run only once. The value of FEEPRO is saved and can be removed only with a mass erase (0x06) or with the key Reserved Reserved No operation, interrupt generated The FEECON will always read 0x07 immediately after execution of any of these commands. Command Sequence for executing a Mass Erase FEEADR = 0x800; FEECON=0x01; while (!(FEESTA & 0x01)){} FEECON=0x04; FEEDAT=0x06; FEECON=0x06; //Any address //Read command //Wait for read //Verify Command //Mass erase enable //Mass erase command Table 15: FEEPRO and FEEHIDE MMR bit designations Bit Description 31 Read protection Cleared by user to protect all code Set by user to allow reading the code Write protection for pages 123 to 120, for pages 119 to 116... and for pages 0 to 3 Cleared by user to protect the pages in writing Set by user to allow writing the pages 30-0 EXECUTION TIME FROM SRAM AND FLASH/EE Execution from Flash/EE This chapter describes SRAM and Flash/EE access times during execution for applications where execution time is critical. Execution from SRAM Fetching instructions from SRAM takes one clock cycle as the access time of the SRAM is 2ns and a clock cycle is 22ns minimum. However, if the instruction involve reading or writing data to memory, one extra cycle must be added if the data is in SRAM, or three cycle if the data is in Flash/EE, one cycle to execute the instruction and two cycles to get the 32-bit data from Flash/EE. A control flow instruction, for example a branch instruction will take one cycle to fetch but also two cycle to fill the pipeline with the new instructions. Because the Flash/EE width is 16-bit and access time for 16-bit words is 22ns, execution from Flash/EE cannot be done in one cycle as from SRAM when CD bit =0. Also some dead times are needed before accessing data for any value of CD bits. In ARM mode, where instructions are 32 bits, two cycles are needed to fetch any instruction when CD = 0 and in Thumb mode, where instructions are 16 bits, one cycle is needed to fetch any instruction. Timing is identical in both mode when executing instructions that involve using the Flash/EE for data memory. If the instruction to be executed is a control flow instruction, an extra cycle is needed to decode the new address of the program counter and then four cycles are needed to fill the pipe-line. A data processing instruction involving only core register doesn't require any extra clock cycle but if it involves data in Flash/EE, an extra clock cycle is needed to decode the address of the data and two cycles to get the 32-bit data from Flash/EE. An extra Rev. PrB | Page 34 of 80 Preliminary Technical Data ADuC702x Series cycle must also be added before fetching another instruction. Data transfer instruction are more complex and are summarised Table 16. Table 16: execution cycles in ARM/Thumb mode Instructions Fetch cycles Dead time Data access LD 2/1 1 2 1 LDH 2/1 1 1 1 Dead time LDM/PUSH 2/1 N 2xn N STR 2/1 1 2 x 20s 1 STRH 2/1 1 20s 1 STRM/POP 2/1 N 2 x N x 20s N With 1<N16, N number of data to load or store in the multiple load/store instruction. The SWAP instruction combine a LD and STR instruction with only one fetch giving a total of 8 cycles plus 40s. Rev. PrB | Page 35 of 80 ADuC702x Series Preliminary Technical Data RESET AND REMAP The ARM exception vectors are all situated at the bottom of the memory array, from address 0x00000000 to address 0x00000020 as shown Figure 16. FFFFFFFFh 0008FFFFh kernel interrupt service routines Flash/EE 00080000h 00011FFFh interrupt service routines SRAM 00010000h Mirror Space ARM exception 0x00000020 00000000h vector addresses 0x00000000 Figure 16: remap for exception execution By default and after any reset, the Flash/EE is mirrored at the bottom of the memory array. The remap function allows the programmer to mirror the SRAM at the bottom of the memory array, facilitating execution of exception routines from SRAM instead of from Flash/EE. This means exceptions are executed twice as fast, exception being executed in ARM mode (32 bit) and the SRAM being 32-bit wide instead of 16-bit wide Flash/EE memory. Remap operation When a reset occurs on the ADuC702x, execution starts automatically in factory programmed internal configuration code. This so called kernel is hidden and cannot be accessed by user code. If the ADuC702x is in normal mode (BM pin is high), it will execute the power-on configuration routine of the kernel and then jump to the reset vector address, 0x00000000, to execute the users reset exception routine. Because the Flash/EE is mirrored at the bottom of the memory array at reset, the reset interrupt routine must always be written in Flash/EE. The remap is done from Flash/EE by setting bit0 of the REMAP register. Precaution must be taken to execute this command from Flash/EE, above address 0x00080020, and not from the bottom of the array as this will be replaced by the SRAM. This operation is reversible: the Flash/EE can be remapped at address 0x00000000 by clearing Bit0 of the REMAP MMR. Precaution must again be taken to execute the remap function from outside the mirrored area. Any kind of reset will remap the Flash /EE memory at the bottom of the array. Reset There are four kinds of reset: external reset, Power-on-reset, watchdog expiation and software force. The RSTSTA register indicates the source of the last reset and RSTCLR allows to clear the RSTSTA register. These registers can be used during a reset exception service routine to identify the source of the reset. If RSTSTA is null, the reset was external. Table 17: REMAP MMR bit designations Bit Name Description 0 Remap Remap Bit. Set by the user to remap the SRAM to address 0x00000000. Cleared automatically after reset to remap the Flash/EE memory to address 0x00000000. Table 18: RSTSTA MMR bit designations Bit Description 7-3 Reserved 2 Software reset Set by user to force a software reset. Cleared by setting the corresponding bit in RSTCLR Watchdog timeout Set automatically when a watchdog timeout occurs Cleared by setting the corresponding bit in RSTCLR Power-on-reset Set automatically when a power-on-reset occurs Cleared by setting the corresponding bit in RSTCLR 1 0 Rev. PrB | Page 36 of 80 Preliminary Technical Data ADuC702x Series OTHER ANALOG PERIPHERALS DAC. The signal range is 0V to AVDD. DAC DAC MMRs interface The ADuC702x incorporate dual 12-bit voltage output DACs on-chip. Each DAC has a rail-to-rail voltage output buffer capable of driving 5k/100pF. Each buffer can be bypassed. Each DAC is configurable independently through a Control register and a Data register. These two registers are identical for the four DACs and only DAC0CON and DAC0DAT will be described in detail. Each DAC has three selectable ranges, 0V to VREF (internal bandgap 2.5V reference), 0V to DACREF (pin 56) and 0V to AVDD. DACREF is equivalent to an external reference for the Table 19: DAC0CON MMR bit designations Bit Name Description 6 DACBYP 5 DACCLK 4 DACCLR 3 Buffer bypass bit: Set by the user to bypass the output buffer. Cleared by user to buffer the DAC output. By default the DAC is buffered. DAC update rate: Set by the user to update the DAC using timer1. Cleared by user to update the DAC using the core clock. DAC clear bit: Set by the user to enable normal DAC operation. Cleared by user to reset data register of the DAC to zero. Reserved This bit should be left at `0' 2 Reserved This bit should be left at `0' 1-0 DAC range bits 00 Power down mode. The DAC output is in tri-state 01 0-DACREF range 10 0-VREF (2.5V) range 11 0-AVDD range Table 20: DAC0DAT MMR bit designations Bit Description 31-28 Reserved 27-16 12-bit data for DAC0 15-0 Reserved Rev. PrB | Page 37 of 80 ADuC702x Series Preliminary Technical Data Using the DACs The on-chip DAC architecture consists of a resistor string DAC followed by an output buffer amplifier, the functional equivalent of which is illustrated in Figure 17. AVDD VREF DACREF R OUTPUT BUFFER BYPASSED FROM MCU that Figure 18 represents a transfer function in 0-to-AVDD mode only. In 0-to-VREF or 0-to-DAC R E F modes (with VREF < AVDD or DACREF < AVDD) the lower nonlinearity would be similar, but the upper portion of the transfer function would follow the "ideal" line right to the end (V in this case, not AVDD), REF showing no signs of endpoint linearity errors. AVDD AVDD-100mV R DAC0 R ~~ ~ R R 100mV ~ 000h FFFh Figure 17: DAC structure Figure 18: endpoint nonlinearities due to amplifier saturation As illustrated in Figure 17, the reference source for each DAC is user selectable in software. It can be either AVDD, VREF or DACREF. In 0-to-AVDD mode, the DAC output transfer function spans from 0 V to the voltage at the AVDD pin. In 0to-DACREF mode, the DAC output transfer function spans from 0 V to the voltage at the DACREF pin. In 0-to-VREF mode, the DAC output transfer function spans from 0 V to the internal 2.5V reference, VREF. The DAC output buffer amplifier features a true rail-to-rail output stage implementation. This means that, unloaded, each output is capable of swinging to within less than 5 mV of both AVDD and ground. Moreover, the DAC's linearity specification (when driving a 5k resistive load to ground) is guaranteed through the full transfer function except codes 0 to 100, and, in 0-to-AVDD mode only, codes 3995 to 4095. Linearity degradation near ground and VDD is caused by saturation of the output amplifier, and a general representation of its effects (neglecting offset and gain error) is illustrated in Figure 18. The dotted line in Figure 18 indicates the ideal transfer function, and the solid line represents what the transfer function might look like with endpoint nonlinearities due to saturation of the output amplifier. Note The endpoint nonlinearities conceptually illustrated in Figure 18 get worse as a function of output loading. Most of the ADuC702x's datasheet specifications assume a 5 k resistive load to ground at the DAC output. As the output is forced to source or sink more current, the nonlinear regions at the top or bottom (respectively) of Figure 18 become larger. With larger current demands, this can significantly limit output voltage swing. To reduce the effects of the saturation of the output amplifier at values close to ground and to give reduced offset and gain errors, the internal buffer can be bypassed in the DAC control register. This allows a full rail-to-rail output from the DAC which should then be buffered externally using a dual supply op-amp in order to get a rail-to-rail output. This external buffer should be located as near as physically possible to the DAC output pin on the PCB. Rev. PrB | Page 38 of 80 Preliminary Technical Data ADuC702x Series POWER SUPPLY MONITOR The Power Supply Monitor monitors the IOVDD supply on the ADuC702x. It indicate when IOVDD supply pin drops below one of two supply trip points. The monitor function is controlled via the PSMCON register. If enabled in the IRQEN or FIQEN register, the monitor will interrupt the core using the PSMI bit in the PSMCON MMR. This bit will be cleared immediately once CMP goes high. This monitor function allows the user to save working registers to avoid possible data loss due to the low supply or brown-out conditions, and also ensures that normal code execution will not resume until a safe supply level has been established. Table 21: PSMCON MMR bit descriptions Bit Name Description 3 CMP 2 TP Comparator Bit This is a read-only bit and directly reflects the state of the comparator Read `1' indicates the IOVDD supply is above its selected trip point. Read `0' indicates the IOVDD supply is below its selected trip point. Trip Point Selection Bits 1 PSMEN 0 PSMI 0 - 2.79V 1 - 3.07V Power Supply Monitor Enable Bit Set to `1' by the user to enable the Power Supply Monitor circuit Clear to `0' by the user to disable the Power Supply Monitor circuit Power Supply Monitor Interrupt Bit. This bit will be set high by the MicroConverter if CMP is low, indicating low I/O supply. The PSMI Bit can be used to interrupt the processor. Once CMP returns high, the PSMI bit may be cleared by writing a `1' to this location. A write of `0' has no effect. There is no timeout delay, PSMI may be cleared immediately once CMP goes high. COMPARATOR The ADuC702x also integrates an uncommitted voltage comparator. ADC2/CMP0 MUX ADC3/CMP1 DAC0 The positive input is multiplexed with ADC2 and the negative input has two options: ADC3 or DAC0. The output of the comparator can be configured to generate a system interrupt, can be routed directly to the Programmable Logic Array, can start an ADC conversion or be on an external pin, CMPOUT. MUX PLA IRQ ADC START CONVERSION P0.0/CMPOUT Figure 19: Comparator The comparator interface consists on a 16-bit MMR, CMPCON described below. Table 22: CMPCON MMR bit descriptions Bit Name 15-11 Description Reserved 10 CMPEN 9-8 CMPIN Comparator enable bit: Set by user to enable the comparator Cleared by user to disable the comparator Comparator negative input select bits: 00 Reserved 01 ADC3 input Rev. PrB | Page 39 of 80 ADuC702x Series 7-6 CMPOC 5 CMPOL 4-3 CMPRES 2 CMPHYST 1 CMPORI 0 CMPOFI Preliminary Technical Data 10 DAC0 11 Reserved Comparator output configuration bits: 00 Start ADC conversion 01 Reserved 10 Output on CMPOUT 11 IRQ Comparator output logic state bit When low the comparator output is high when the positive input (CMP0) is above the negative input (CMP1). When high, the comparator output is high when the positive input is below the negative input Response time 00 10s 01 5s 10 1s 11 0.5s Comparator hysteresis bit: Set by user to have an hysteresis of about 7.5mV Cleared by user to have no hysteresis Comparator output rising edge interrupt Set automatically when a rising edge occurs on the monitored voltage (CMP0) Cleared by user by writing a 1 to this bit. Comparator output falling edge interrupt Set automatically when a falling edge occurs on the monitored voltage (CMP0) Cleared by user OSCILLATOR AND PLL - POWER CONTROL The ADuC702x integrates a 32.768kHz oscillator, a clock divider and a PLL. The PLL locks onto a multiple (1376) of the internal oscillator to provide a stable 45MHz clock for the system. The core can operate at this frequency, or at binary submultiples of it, to allow power saving. The default core clock is the PLL clock divided by 8 (CD = 3) or 5.6 MHz. The core clock frequency can be output on the ECLK pin as described Figure 20. A power down mode is available on the ADuC702x. SCLKS WAKEUP TIMER INT. 32kHz * OSCILLATOR CRYSTAL OSCILLATOR XCLKO XCLKI XCLK WATCHDOG TIMER AT POWER MDCLK UP 32.768kHz PLL 45MHz MDCLK ANALOG PERIPHERALS CD /2CD CORE The operating mode, clocking mode and programmable clock divider are controlled via two MMRs, PLLCON and POWCON. PLLCON controls operating mode of the clock system while POWCON controls the core clock frequency and the powerdown mode. * 32.768kHz +/-3% P0.7/ECLK Figure 20: clocking system A certain sequence has to be followed to write in the PLLCON and POWCON registers, to prevent accidental programming. PLLCON: PLLKEY1 = 0xAA PLLCON = 0x01 PLLKEY2 = 0x55 Rev. PrB | Page 40 of 80 POWCON: POWKEY1 = 0x01 POWCON = 0x00 POWKEY1 = 0xF4 Preliminary Technical Data ADuC702x Series Table 23: PLLCON MMR bit designations Bit Name 7-3 Description Reserved 2 SCLKS 1-0 MDCLK Slow clock selection for watchdog timer: Set by the user to use the internal 32kHz for the timer. This bit must be set to use watchdog timer if there is no external crystal Cleared by user to use the external 32kHz crystal Clocking modes 00 Reserved 01 PLL + 32kHz oscillator - default configuration 10 Reserved 11 XCLK pin Table 24: POWCON MMR bit designations Bit Name 7 Description Reserved 6-4 PC 3 FINT 2-0 CD Operating modes: 000 Normal mode 011 Power down mode enable. XIRQ0, XIRQ1, timer2 and timer3 can wake-up the ADuC702x. Others Reserved Fast interrupt response bit Set by user to enable the fast interrupt response. If an interrupt occurs when FINT is set, the CPU will run at the fastest clock frequency in the interrupt service routine. After completing the ISR, execution resumes at the clock speed set by the CD bits Cleared by user to disable the fast interrupt response CPU clock divider bits 000 45.088 MHz 001 22.544 MHz 010 11.272 MHz 011 5.636 MHz 100 2.818 MHz 101 1.409 MHz 110 704.5 kHz 111 352.2 kHz Rev. PrB | Page 41 of 80 ADuC702x Series Preliminary Technical Data DIGITAL PERIPHERALS THREE-PHASE PWM General overview The ADuC702x provides a flexible, programmable, three-phase PWM waveform generator that can be programmed to generate the required switching patterns to drive a three-phase voltage source inverter for ac induction (ACIM) motor control. The PWM generator produces three pairs of PWM signal on the six PWM output pins (PWM0H, PWM0L, PWM1H, PWM1L, PWM2H, and PWM2L). The six PWM output signals consist of three high-side drive signals and three low-side drive signals. The switching frequency and dead time of the generated PWM patterns are programmable using the PWMDAT0 and PWMDAT1 MMRs. In addition, three duty-cycle control registers (PWMCH0, PWMCH1 and PWMCH2) directly control the duty cycles of the three-pairs of PWM signals. Each of the six PWM output signals can be enabled or disabled by separate output enable bits of the PWMEN register. In addition, three control bits of the PWMEN register permit crossover of the two signals of a PWM pair. In crossover mode, the PWM signal destined for the high side switch is diverted to the complementary low side output and the signal destined for the low side switch is diverted to the corresponding high side output signal. In many applications, there is a need to provide an isolation barrier in the gate-drive circuits that turns on the power devices of the inverter. In general, there are two common isolation techniques, optical isolation using opto-couplers and transformer isolation using pulse transformers. The PWM controller permits mixing of the output PWM signals with a high frequency chopping signal to permit easy interface to such pulse transformers. The features of this gate-drive chopping mode can be controlled by the PWMCFG register. An 8-bit value within the PWMCFG register directly controls the chopping frequency. High frequency chopping can be independently enabled for the high-side and the low-side outputs using separate control bits in the PWMCFG register. The PWM generator is capable of operating in two distinct modes, single update mode or double update mode. In single update mode the duty cycle values are programmable only once per PWM period, so that the resultant PWM patterns are symmetrical about the midpoint of the PWM period. In the double update mode, a second updating of the PWM duty cycle values is implemented at the midpoint of the PWM period. In this mode, it is possible to produce asymmetrical PWM patterns, that produce lower harmonic distortion in three-phase PWM inverters. This technique also permits closed loop controllers to change the average voltage applied to the machine windings at a faster rate and so permits faster closed loop bandwidths to be achieved. The operating mode of the PWM block is selected by a control bit in the PWMCON register. In single update mode a PWMSYNC pulse is produced at the start of each PWM period. In double update mode, an additional PWMSYNC pulse is produced at the midpoint of each PWM period. The PWM block can also provide an internal synchronisation pulse on the SYNC pin that is synchronise to the PWM switching frequency. In single update mode a pulse is produce at the start of each PWM period. In double update mode, an additional pulse is also produced at the mid-point of each PWM period. The width of the pulse is programmable through the PWMDAT2 register. The PWM block can also accept an external synchronisation pulse on the SYNC pin. The selection of external synchronisation or internal synchronisation is in the PWMCON register. The SYNC input timing can be synchronised to the internal peripheral clock, which is selected in the PWMCON register. If the external synchronisation pulse from the chip pin is asynchronous to the internal peripheral clock (typical case), the external SYNC is considered asynchronous and should be synchronised. The synchronisation logic will add latency add jitter from the external pulse to the actual PWM outputs. The size of the pulse on the SYNC pin must be greater than two core clock periods. The PWM signals produced by the ADuC702x can be shut off via a dedicated asynchronous PWM shutdown pin, PWMTRIP, that, when brought low, instantaneously places all six PWM outputs in the OFF state (high). This hardware shutdown mechanism is asynchronous so that the associated PWM disable circuitry does not go through any clocked logic, thereby ensuring correct PWM shutdown even in the event of a loss of the core clock. Status information about the PWM system is available to the user in the PWMSTA register. In particular, the state of the PWMTRIP pin is available, as well as a status bit that indicates whether operation is in the first half or the second half of the PWM period. Description of the PWM block A functional block diagram of the PWM controller is shown in Figure 21. The generation of the six output PWM signals on pins PWM0H to PWM2L is controlled by four important blocks: * The Three-Phase PWM Timing Unit, which is the core of the PWM controller. It generates three pairs of complemented and dead-time-adjusted centre-based PWM signals. * The Output Control Unit allows the redirection of the outputs of the Three-Phase Timing Unit for each channel to either the Rev. PrB | Page 42 of 80 Preliminary Technical Data ADuC702x Series high-side or the low-side output. In addition, the Output Control Unit allows individual enabling/disabling of each of the six PWM output signals. The PWM sync pulse control unit generates the internal synchronisation pulse and also controls whether the external SYNC pin is used or not. * The Gate Drive Unit permits the generation of the high frequency chopping frequency and its subsequent mixing with the PWM signals. The PWM controller is driven by the ADuC702x core clock frequency and is capable of generating two interrupts to the ARM core. One interrupt is generated on the occurrence of a PWMSYNC pulse and the other is generated on the occurrence of any PWM shutdown action. * The PWM Shutdown Controller takes care of the PWM shutdown via the PWMTRIP pin and generates the correct RESET signal for the Timing Unit. Configuration Registers Duty Cycle Registers PWMCON PWMDAT0 PWMDAT1 PWMDAT2 PWMCH0 PWMCH1 PWMCH2 PWMEN PWMCFG PWM0H PWM0L Three-Phase PWM Timing Unit Output Control Unit Gate Drive Unit PWM1H PWM1L PWM2H PWM2L Sync core clock PWMSYNC to interrupt controller PWMTRIP Figure 21: Overview of the PWM controller should not be used. Three-phase timing unit PWM Switching Dead Time, PWMDAT1 MMR PWM Switching Frequency, PWMDAT0 MMR The PWM switching frequency is controlled by the PWM period register, PWMDAT0. The fundamental timing unit of the PWM controller is tCORE = 1/fCORE where fCORE is the core frequency of the MicroConverter. Therefore, for a 45 MHz fCORE, the fundamental time increment is 21 ns. The value written to the PWMDAT0 register is effectively the number of tCORE clock increments in half a PWM period. The required PWMDAT0 value is a function of the desired PWM switching frequency (fPWM) and is given by: PWMDAT0 = fcore / (2 x fPWM) Therefore, the PWM switching period, Ts, can be written as: Ts = 2 x PWMDAT0 x tCORE The largest value that can be written to the 16-bit PWMDAT0 MMR is 0xFFFF = 65535 which corresponds to a minimum PWM switching frequency of: fPWM(min) = 45 x 106 / (2 x 65535) = 343.99 Hz Note that PWMDAT0 value of 0 and 1 are not defined and The second important parameter that must be set up in the initial configuration of the PWM block is the switching dead time. This is a short delay time introduced between turning off one PWM signal (e.g. AH) and turning on the complementary signal (AL). This short time delay is introduced to permit the power switch being turned off (in this case, AH) to completely recover its blocking capability before the complementary switch is turned on. This time delay prevents a potentially destructive short-circuit condition from developing across the dc link capacitor of a typical voltage source inverter. The dead time is controlled by the 10-bit, read/write PWMDAT1 register. There is only one dead-time register that controls the dead time inserted into all three pairs of PWM output signals. The dead time, TD, is related to the value in the PWMDAT1 register by: TD = PWMDAT1 x 2 x tCORE Therefore, a PWMDAT1 value of 0x00A (= 10), introduces an 426 ns delay between the turn-off on any PWM signal (say, AH) and the turn-on of its complementary signal (AL). The amount Rev. PrB | Page 43 of 80 ADuC702x Series Preliminary Technical Data of the dead time can therefore be programmed in increments of 2tCORE (or 42 ns for a 45 MHz core clock). The PWMDAT1 register is a 10-bit register so that its maximum value is 0x3FF (= 1023), corresponding to a maximum programmed dead time of: TD(max) = 1023 x 2 x tCORE = 1023 x 2 x 22 x10-9 = 45.37 s for a core clock of 45 MHz. Obviously, the dead time can be programmed to be zero by writing 0 to the PWMDAT1 register. PWM Operating Mode, PWMCON and PWMSTA MMRs The PWM controller of the ADuC702x can operate in two distinct modes, single update mode and double update mode. The operating mode of the PWM controller is determined by the state of Bit 2 of the PWMCON register. If this bit is cleared the PWM operates in the single update mode. Setting Bit 2 places the PWM in the double update mode. The default operating mode is single update mode. In single update mode, a single PWMSYNC pulse is produced in each PWM period. The rising edge of this signal marks the start of a new PWM cycle and is used to latch new values from the PWM configuration registers (PWMDAT0 and PWMDAT1) and the PWM duty cycle registers (PWMCH0, PWMCH1 and PWMCH2) into the three-phase timing unit. In addition, the PWMEN register is also latched into the output control unit on the rising edge of the PWMSYNC pulse. In effect, this means that the characteristics and resultant duty cycles of the PWM signals can be updated only once per PWM period at the start of each cycle. The result is that PWM patterns that are symmetrical about the midpoint of the switching period are produced. In double update mode, there is an additional PWMSYNC pulse produced at the midpoint of each PWM period. The rising edge of this new PWMSYNC pulse is again used to latch new values of the PWM configuration registers, duty cycle registers and the PWMEN register. As a result it is possible to alter both the characteristics (switching frequency and dead time) as well as the output duty cycles at the midpoint of each PWM cycle. Consequently, it is possible to produce PWM switching patterns that are no longer symmetrical about the midpoint of the period (asymmetrical PWM patterns). In double update mode, it may be necessary to know whether operation at any point in time is in either the first half or the second half of the PWM cycle. This information is provided by Bit 0 of the PWMSTA register, which is cleared during operation in the first half of each PWM period (between the rising edge of the original PWMSYNC pulse and the rising edge of the new PWMSYNC pulse introduced in double update mode). Bit 0 of the PWMSTA register is set during operation in the second half of each PWM period. This status bit allows the user to make a determination of the particular half-cycle during implementation of the PWMSYNC interrupt service routine, if required. The advantage of double update mode is that lower harmonic voltages can be produced by the PWM process and faster control bandwidths are possible. However, for a given PWM switching frequency, the PWMSYNC pulses occur at twice the rate in the double update mode. Since new duty cycle values must be computed in each PWMSYNC interrupt service routine, there is a larger computational burden on the ARM core in double update mode. PWM Duty Cycles, PWMCH0, PWMCH1, PWMCH2 MMRs The duty cycles of the six PWM output signals on pins AH to CL are controlled by the three 16-bit read/write duty cycle registers, PWMCH0, PWMCH1 and PWMCH2. The duty cycle registers are programmed in integer counts of the fundamental time unit, tCORE, and define the desired on-time of the high-side PWM signal produced by the three-phase timing unit over half the PWM period. The switching signals produced by the threephase timing unit are also adjusted to incorporate the programmed dead time value in the PWMDAT1 register. The three-phase timing unit produces active low signals so that a low level corresponds to a command to turn on the associated power device. PWMCH0 PWMCH0 0H 0L 2x PWMDAT1 2x PWMDAT1 PWMDAT2+1 PWMSYNC PWMSTA (0) PWMDAT0 PWMDAT0 Figure 22: Typical PWM outputs of Three-Phase timing unit in single update mode A typical pair of PWM outputs (in this case for AH and AL) from the timing unit are shown in Figure 22 for operation in single update mode. All illustrated time values indicate the integer value in the associated register and can be converted to time by simply multiplying by the fundamental time increment, tCORE. First, it is noted that the switching patterns are perfectly symmetrical about the midpoint of the switching period in this single update mode since the same values of PWMCH0, PWMDAT0 and PWMDAT1 are used to define the signals in both half cycles of the period. It can be seen how the programmed duty cycles are adjusted to incorporate the desired dead time into the resultant pair of PWM signals. Clearly, the dead time is incorporated by moving the switching instants of both PWM signals (0H and 0L) away from the instant set by the PWMCH0 register. Both switching edges are moved by an equal amount (PWMDAT1 x tCORE) to preserve the Rev. PrB | Page 44 of 80 Preliminary Technical Data ADuC702x Series symmetrical output patterns. Also shown is the PWMSYNC pulse and Bit 0 of the PWMSTA register that indicates whether operation is in the first or second half cycle of the PWM period. The resultant on-times of the PWM signals over the full PWM period (two half periods) produced by the timing unit can be written as: T0H = 2 x (PWMCH0 - PWMDAT1) x tCORE T0L = 2 x (PWMDAT0 - PWMCH0 - PWMDAT1) x tCORE T0L = (PWMDAT01 + PWMDAT02 - PWMCH01 - PWMCH02 - PWMDAT11 - PWMDAT12) x tCORE where the subscript 1 refers to the value of that register during the first half cycle and the subscript 2 refers to the value during the second half cycle. The corresponding duty cycles are: d0H = T0H / Ts = (PWMCH01 + PWMCH02 - PWMDAT11 - PWMDAT12) / (PWMDAT01 + PWMDAT02) d0L = T0L /Ts = (PWMDAT01 + PWMDAT02 - PWMCH01 PWMCH02 - PWMDAT11 - PWMDAT12) / (PWMDAT01 + PWMDAT02) since for the completely general case in double update mode, the switching period is given by: And the corresponding duty cycles: d0H = T0H / Ts = (PWMCH0 - PWMDAT1) / PWMDAT0 d0L = T0L / Ts = (PWMDAT0 - PWMCH0 - PWMDAT1) / PWMDAT0 The minimum permissible T0H and T0L values are zero, corresponding to a 0% duty cycle. In a similar fashion, the maximum value is TS, corresponding to a 100% duty cycle. The output signals from the timing unit for operation in double update mode are shown in Figure 23. This illustrates a completely general case where the switching frequency, dead time and duty cycle are all changed in the second half of the PWM period. Of course, the same value for any or all of these quantities could be used in both halves of the PWM cycle. However, it can be seen that there is no guarantee that symmetrical PWM signals will be produced by the timing unit in double update mode. Additionally, it is seen that the dead time is inserted into the PWM signals in the same way as in the single update mode. PWMCH01 PWMCH02 Ts = (PWMDAT01 + PWMDAT02) x tCORE Again, the values of T0H and T0L are constrained to lie between zero and TS. PWM signals similar to those illustrated in Figure 22 and Figure 23 can be produced on the 1H, 1L, 2H and 2L outputs by programming the PWMCH1 and PWMCH2 registers in a manner identical to that described for PWMCH0. The PWM controller does not produce any PWM outputs until all of the PWMDAT0, PWMCH0, PWMCH1 and PWMCH2 registers have been written to at least once. Once these registers have been written, internal counting of the timers in the three-phase timing unit is enabled. Writing to the PWMDAT0 register starts the internal timing of the main PWM timer. Provided the PWMDAT0 register is written prior to the PWMCH0, PWMCH1 and PWMCH2 registers in the initialisation, the first PWMSYNC pulse and interrupt (if enabled) appear 1.5 x tCORE x PWMDAT0 seconds after the initial write to the PWMDAT0 register in single update mode. In double update mode, the first PWMSYNC pulse appears after PWMDAT0 x tCORE seconds. 0H 0L PWMSYNC 2x PWMDAT11 PWMDAT21+1 Output Control Unit 2x PWMDAT12 PWMDAT22+1 PWMSTA (0) PWMDAT01 PWMDAT02 Figure 23: Typical PWM outputs of the Three-phase timing unit in double update mode In general the on-times of the PWM signals in double update mode can be defined as: T0H = (PWMCH01 + PWMCH02 - PWMDAT11 - PWMDAT12) x tCORE The operation of the Output Control Unit is controlled by the 9-bit read/write PWMEN register. This register controls two distinct features of the Output Control Unit that are directly useful in the control of ECM or BDCM. The PWMEN register contains three crossover bits, one for each pair of PWM outputs. Setting Bit 8 of the PWMEN register enables the crossover mode for the 0H/0L pair of PWM signals, setting Bit 7 enables crossover on the 1H/1L pair of PWM signals and setting Bit 6 enables crossover on the 2H/2L pair of PWM signals. If crossover mode is enabled for any pair of PWM signals, the high-side PWM signal from the timing unit (0H, for example) is diverted to the associated low-side output of the Output Control Unit so that the signal will ultimately appear at the 0L pin. Of course, the corresponding low-side output of the Timing Unit is also diverted to the complementary high-side output of Rev. PrB | Page 45 of 80 ADuC702x Series Preliminary Technical Data the Output Control Unit so that the signal appears at the 0H pin. Following a reset, the three crossover bits are cleared so that the crossover mode is disabled on all three pairs of PWM signals. The PWMEN register also contains six bits (Bits 0 to 5) that can be used to individually enable or disable each of the six PWM outputs. If the associated bit of the PWMEN register is set, the corresponding PWM output is disabled irrespective of the value of the corresponding duty cycle register. This PWM output signal will remain in the OFF state as long as the corresponding enable/disable bit of the PWMEN register is set. The implementation of this output enable function is implemented after the crossover function. Following a reset, all six enable bits of the PWMEN register are cleared so that all PWM outputs are enabled by default. In a manner identical to the duty cycle registers, the PWMEN is latched on the rising edge of the PWMSYNC signal so that changes to this register only become effective at the start of each PWM cycle in single update mode. In double update mode, the PWMEN register can also be updated at the midpoint of the PWM cycle. In the control of an ECM only two inverter legs are switched at any time and often the high-side device in one leg must be switched ON at the same time as the low-side driver in a second leg. Therefore, by programming identical duty cycles values for two PWM channels (e.g. PWMCH0 = PWMCH1) and setting Bit 7 of the PWMEN register to cross over the 1H/1L pair of PWM signals, it is possible to turn ON the high-side switch of Phase A and the low-side switch of Phase B at the same time. In the control of ECM, it is usual for the third inverter leg (Phase C in this example) to be disabled for a number of PWM cycles. This function is implemented by disabling both the 2H and 2L PWM outputs by setting Bits 0 and 1 of the PWMEN register. This situation is illustrated in Figure 24, where it can be seen that both the 0H and 1L signals are identical, since PWMCH0 = PWMCH1 and the crossover bit for phase B is set. PWMCH0 = PWMCH1, crossover BH/BL pair and disable 0L, 1H, 2H and 2L outputs. Operation is in single update mode. In addition, the other four signals (0L, 1H, 2H and 2L) have been disabled by setting the appropriate enable/disable bits of the PWMEN register. For the situation illustrated in Figure 24, the appropriate value for the PWMEN register is 0x00A7. In normal ECM operation, each inverter leg is disabled for certain periods of time so that the PWMEN register is changed based on the position of the rotor shaft (motor commutation). Gate Drive Unit The Gate Drive Unit of the PWM controller adds features that simplify the design of isolated gate drive circuits for PWM inverters. If a transformer-coupled power device gate drive amplifier is used then the active PWM signal must be chopped at a high frequency. The 10-bit read/write PWMCFG register allows the programming of this high frequency chopping mode. The chopped active PWM signals may be required for the highside drivers only, for the low-side drivers only or for both the high-side and low-side switches. Therefore, independent control of this mode for both high- and low-side switches is included with two separate control bits in the PWMCFG register. Typical PWM output signals with high frequency chopping enabled on both high-side and low-side signals are shown in Figure 25. Chopping of the high side PWM outputs (0H, 1H and 2H) is enabled by setting Bit 8 of the PWMCFG register. Chopping of the low-side PWM outputs (0L, 1L and 2L) is enabled by setting Bit 9 of the PWMCFG register. The high frequency chopping frequency is controlled by the 8-bit word (GDCLK) placed in Bits 0 to 7 of the PWMCFG register. The period of this high frequency carrier is: Tchop = (4 x (GDCLK + 1)) x tCORE and the chopping frequency is therefore an integral subdivision of the MicroConverter core frequency: PWMCH0 PWMCH0 = PWMCH1 = PWMCH1 fchop = fCORE / (4 x (GDCLK + 1)) The GDCLK value may range from 0 to 255, corresponding to a programmable chopping frequency rate from 45.9 kHz to 11.75 MHz for a 45 MHz core frequency. The gate drive features must be programmed before operation of the PWM controller and typically are not changed during normal operation of the PWM controller. Following a reset, all bits of the PWMCFG register are cleared so that high frequency chopping is disabled, by default. 0H 2 x PWMDAT1 2 x PWMDAT1 0L 1H 1L 2H 2L PWMDAT0 PWMDAT0 Figure 24. Example active LO PWM signals suitable for ECM control, Rev. PrB | Page 46 of 80 Preliminary Technical Data PWMCH0 ADuC702x Series PWMCH0 Following a PWM shutdown, the PWM can only be re-enabled (in a PWMTRIP interrupt service routine, for example) by writing to all of the PWMDAT0, PWMCH0, PWMCH1 and PWMCH2 registers. Provided the external fault has been cleared and the PWMTRIP has returned to a high level, internal timing of the three-phase timing unit resumes and new duty-cycle values are latched on the next PWMSYNC boundary. 0H 2 x PWMDAT1 2 x PWMDAT1 0L 4 x (GDCLK + 1 ) x tCORE PWMDAT0 PWMDAT0 Figure 25: typical PWM signals with high frequency gate chopping enabled on both high-side and low-side switches PWM MMRs interface The PWM block is controlled via the following nine MMRs: PWM shutdown In the event of external fault conditions, it is essential that the PWM system be instantaneously shut down in a safe fashion. A low level on the PWMTRIP pin provides an instantaneous, asynchronous (independent of the MicroConverter core clock) shutdown of the PWM controller. All six PWM outputs are placed in the OFF state, i.e. high state. In addition, the PWMSYNC pulse is disabled. The PWMTRIP pin has an internal pull-down resistor so that if the pin becomes disconnected the PWM will be disabled. The state of the PWMTRIP pin can be read from Bit 3 of the PWMSTA register. - PWMCON: control register, enable the PWM, choose the update rate - PWMSTA: reflects the status of the PWM - PWMDAT0: unsigned 16-bit register for switching period - PWMDAT1: unsigned 10-bit register for dead time - PWMCFG: gate chopping - PWMCH0,CH1,CH2: channel duty cycle for the three phases - PWMEN: allows enabling channel outputs and crossover. See bit definition Table 28. - PWMDAT2: unsigned 10-bit register for PWM sync pulse width. On the occurrence of a PWM shutdown command, a PWMTRIP interrupt will be generated, internal timing of the three-phase timing unit of the PWM controller is stopped. Table 25: PWMCON MMR Bit Descriptions Bit Name 7-5 Description Reserved 4 PWM_SYNCSEL 3 PWM_EXTSYNC 2 PWMDBL 1 PWM_SYNC_EN 0 PWMEN External sync select Set to use external sync Cleared to use internal sync External sync select Set to select external synchronous sync signal Cleared for asynchronous sync signal Double Update Mode Set to `1' by the user to enable double update mode Clear to `0' by the user to enable single update mode PWM synchronisation enable Set by user to enable synchronisation Cleared by user to disable synchronisation PWM Enable Bit Set to `1' by the user to enable the PWM Clear to `0' by the user to disable the PWM. Also cleared automatically with PWMTRIP Table 26: PWMSTA MMR Bit Descriptions Bit Name 15-10 9 Description Reserved PWMSYNCINT PWM sync interrupt bit Rev. PrB | Page 47 of 80 ADuC702x Series Preliminary Technical Data 8 PWMTRIPINT PWM trip interrupt bit 3 PWMTRIP Raw signal from the PWMTRIP pin 2-1 0 Reserved PWMPHASE PWM Phase Bit Set to `1' by the MicroConverter when the timer is counting down (1st half) Clear to `0' by the MicroConverter when the timer is counting up (2nd half) Table 27: PWMCFG MMR Bit Descriptions Bit Name Description 9 CHOPLO low-side Gate Chopping enable bit 8 CHOPHI high-side Gate Chopping enable bit 0:7 GDCLK PWM Gate Chopping Period (unsigned) Table 28: PWMEN MMR bit descriptions Bit Name Description 8 0H0L_XOVR 7 1H1L_XOVR 6 2H2L_XOVR 5 0L_EN 4 0H_EN 3 1L_EN 2 1H_EN 1 2L_EN 0 2H_EN Channel 0 Output Crossover Enable Bit Set to `1' by the user to enable channel 0 output crossover Clear to `0' by the user to disable channel 0 output crossover Channel 1 Output Crossover Enable Bit Set to `1' by the user to enable channel 1 output crossover Clear to `0' by the user to disable channel 1 output crossover Channel 2 Output Crossover Enable Bit Set to `1' by the user to enable channel 2 output crossover Clear to `0' by the user to disable channel 2 output crossover AL Output Enable Bit Set to `1' by the user to disable the 0L output of the PWM Clear to `0' by the user to enable the 0L output of the PWM AH Output Enable Bit Set to `1' by the user to disable the 0H output of the PWM Clear to `0' by the user to enable the 0H output of the PWM BL Output Enable Bit Set to `1' by the user to disable the 1L output of the PWM Clear to `0' by the user to enable the 1L output of the PWM BH Output Enable Bit Set to `1' by the user to disable the 1H output of the PWM Clear to `0' by the user to enable the 1H output of the PWM CL Output Enable Bit Set to `1' by the user to disable the 2L output of the PWM Clear to `0' by the user to enable the 2L output of the PWM CH Output Enable Bit Set to `1' by the user to disable the 2H output of the PWM Clear to `0' by the user to enable the 2H output of the PWM Rev. PrB | Page 48 of 80 Preliminary Technical Data ADuC702x Series Table 30: GPIO pin function Descriptions GENERAL PURPOSE I/O The ADuC702x provides 40 General Purpose bi-directional I/O pins (GPIO). All I/O pins are 5V tolerant which means that the GPIOs support an input voltage of 5V. In general many of the GPIO pins have multiple functions, see Table 30 for the pin function definition. By default the GPIO pins are configured in GPIO mode. All GPIO pins have internal pull up resistor and their drive capability is 1.6mA. The 40 GPIO are grouped in 5 ports, port 0 to 4. Each port is controlled by four MMRs: - GPxCON: Port x Control Register, selects the function of each pin of port x. as described in Table 29 - GPxDAT: Port x Configuration and Data Register. It configures the direction of the GPIO pins of port x, sets the output value for the pins configured as output and receives the stores the input value of the pins configured as input. - GPxSET: data set port x - GPxCLR: data clear port x With x representing the port number. Port Pin 0 P0.0 P0.1 P0.2 P0.3 P0.4 1 Table 29: GPxCON MMR Bit Descriptions Bit Description 31-30 Reserved 29-28 Select function of Px.7 pin 27-26 Reserved 25-24 Select function of Px.6 pin 23-22 Reserved 21-20 Select function of Px.5 pin 19-18 Reserved 17-16 Select function of Px.4 pin 15-14 Reserved 13-12 Select function of Px.3 pin 11-10 Reserved 9-8 Select function of Px.2 pin 7-6 Reserved 5-4 Select function of Px.1 pin 3-2 Reserved 1-0 Select function of Px.0 pin 2 3 4 Rev. PrB | Page 49 of 80 Configuration 01 10 CMP MS2 PWM2H BLE PWM2L BHE TRST A16 PWMTRIP MS1 11 PLAI[7] ADCBUSY PLAO[1] P0.5 GPIO IRQ1 ADCBUSY MS0 PLAO[2] P0.6 P0.7 P1.0 P1.1 P1.2 P1.3 P1.4 GPIO GPIO GPIO GPIO GPIO GPIO GPIO IRQ2 MRST ECLK SIN SOUT RTS CTS RI AE SIN SCL0 SDA0 SCL1 SDA1 CLK PLAO[3] PLAO[4] PLAI[0] PLAI[1] PLAI[2] PLAI[3] PLAI[4] P1.5 GPIO IRQ3 DCD MISO PLAI[5] P1.6 P1.7 P2.0 P2.1 P2.2 P2.3 P2.4 P2.5 P2.6 P2.7 P3.0 P3.1 P3.2 P3.3 P3.4 P3.5 P3.6 P3.7 P4.0 P4.1 P4.2 P4.3 P4.4 P4.5 P4.6 GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO GPIO DSR DTR CONVS PWM0H PWM0L PWM0H PWM0L PWM1H PWM1L PWM0H PWM0L PWM1H PWM1L PWM2H PWM2L PWMTRIP PWMSYNC - MOSI CSL SOUT WS RS AE MS0 MS1 MS2 MS3 AD0 AD1 AD2 AD3 AD4 AD5 AD6 AD7 AD8 AD9 AD10 AD11 AD12 AD13 AD14 PLAI[6] PLAO[0] PLAO[5] PLAO[6] PLAO[7] PLAI[8] PLAI[9] PLAI[10] PLAI[11] PLAI[12] PLAI[13] PLAI[14] PLAI[15] PLAO[8] PLAO[9] PLAO[10] PLAO[11] PLAO[12] PLAO[13] PLAO[14] See Table 6 page 3 for address location of these 20 registers. The default value of GPxCON is 0x00000000, all port pins are defined as GPIO, except GP0CON which is 0x01001000 in order to make the TRST and MRST functions available at reset. 00 GPIO GPIO GPIO GPIO GPIO IRQ0 ADuC702x Series P4.7 GPIO Preliminary Technical Data - AD15 PLAO[15] Rev. PrB | Page 50 of 80 Preliminary Technical Data ADuC702x Series Table 31: GPxDAT MMR Bit Descriptions Bit Description 31-24 23-16 Direction of the data: Set to `1' by the user to configure the GPIO pin as an output Clear to `0' by the user to configure the GPIO pin as an input Port x data output 15-8 Reflect the state of Port x pins at reset (read only) 7-0 Port x data input (read only) Table 32: GPxSET MMR Bit Descriptions Bit Description 31-24 Reserved 23-16 Data port x set bit: Set to `1' by the user to set bit on port x. will also set the corresponding bit in the GPxDAT MMR Clear to `0' by the user will not affect the data out Reserved 15-0 Table 33: GPxCLR MMR Bit Descriptions Bit Description 31-24 Reserved 23-16 Data port x clear bit: Set to `1' by the user to clear bit on port x, will also clear the corresponding bit in the GPxDAT MMR Clear to `0' by the user will not affect the data out Reserved 15-0 Rev. PrB | Page 51 of 80 ADuC702x Series Preliminary Technical Data supports various word length, stop bits and parity generation options selectable in the configuration register. SERIAL PORT MUX The Serial Port Mux multiplexes the serial port peripherals (two I2C, SPI, UART) and the Programmable Logic Array (PLA) to a set of ten GPIO pins. Each pin must be configured to one of its specific I/O function as described in Table 34. SPM0 SPM1 SPM2 SPM3 SPM4 SPM5 SPM6 SPM7 SPM8 SPM9 GPIO 00 P1.0 P1.1 P1.2 P1.3 P1.4 P1.5 P1.6 P1.7 P0.7 P2.0 UART 01 SIN SOUT RTS CTS RI DCD DSR DTR ECLK CONV UART/I2C/SPI 10 I2C0SCL I2C0SDA I2C1SCL I2C1SDA SPICLK SPIMISO SPIMOSI SPICSL SIN SOUT PLA 11 PLAI[0] PLAI[1] PLAI[2] PLAI[3] PLAI[4] PLAI[5] PLAI[6] PLAO[0] PLAO[4] PLAO[5] Table 34: SPM configuration Table 34 details the mode for each of the SPMUX GPIO pins. This configuration has to be done via the GP0CON, GP1CON and GP2CON MMRs. By default these ten pins are configured as GPIOs. Baud rate generation There is two way of generating the UART baudrate. - Normal 450 UART baudrate generation: The baudrate is a divided version of the core clock using the value in COMDIV0 and COMDIV1 MMRs (16-bit value, DL). Baudrate = 45.088MHz 2 x 16 x 2 x DL CD The following table gives some common baudrate values: Baudrate 9600 19200 115200 9600 19200 115200 CD DL Actual baudrate % error 0 0 0 3 3 3 92h 49h 0Ch 12h 9h 1h 9651 19301 117417 9785 19569 88062 0.53% 0.53% 1.92% 1.92% 1.92% 23.55% Table 36: baudrate using the normal baudrate generator UART SERIAL INTERFACE - Using the fractional divider: The UART peripheral is a full-duplex Universal Asynchronous Receiver/Transmitter, fully compatible with the 16450 serial port standard. The UART performs serial-to-parallel conversion on data characters received from a peripheral device or a MODEM, and parallel-to-serial conversion on data characters received from the CPU. The UART includes a fractional divider for baudrate generation and has a network addressable mode. The UART function is made available on the following 10 pins of the ADuC702x: The fractional divider combined with the normal baudrate generator allows the generating of a wider range of more accurate baudrates. Pin SPM0 (mode 1) SPM1 (mode 1) SPM2 (mode 1) SPM3 (mode 1) SPM4 (mode 1) SPM5 (mode 1) SPM6 (mode 1) SPM7 (mode 1) SPM8 (mode 2) SPM9 (mode 2) Signal RTS CTS SIN SOUT RI DCD DSR DTR SIN SOUT Core Clock FBEN /2 /16DL UART /(M+N/2048) Figure 26: baudrate generation options Description Request To Send Clear To Send Serial Receive Data Serial Transmit Data Ring Indicator Data Carrier Detect Data Set Ready Data Terminal Ready Serial Receive Data Serial Transmit Data Calculation of the baudrate using fractional divider is as follow: Baudrate = 45.088MHz 2CD x 16 x DL x 2 x ( M + M+ N ) 2048 N 45.088MHz = 2048 Baudrate x 2CD x 16 x DL x 2 Example: Generation of 9600 baud with CD bits = 3. The previous table gives DL = 12h. Table 35: UART signal description The serial communication adopts a asynchronous protocol that Rev. PrB | Page 52 of 80 Preliminary Technical Data M+ ADuC702x Series N 45.088MHz = 2048 9600 x 23 x 16 x 18 x 2 UART registers definition The UART interface consists on 12 registers namely: N M+ = 1.019 2048 M = 1 and N = 0.019 x 2048 = 39 Baudrate = 45.088MHz 2 3 x 16 x 18 x 2 x (1 + 39 ) 2048 Baudrate = 9602 bps Error = 0.02% compared to 1.92% with the normal baudrate generator. - COMTX: 8-bit transmit register - COMRX: 8-bit receive register - COMDIV0: divisor latch (low byte) COMTX, COMRX and COMDIV0 share the same address location. COMTX and COMTX can be accessed when bit 7 in COMCON0 register is cleared. COMDIV0 can be accessed when bit 7 of COMCON0 is set. - COMDIV1: divisor latch (high byte) - COMCON0: line control register - COMSTA0: line status register - COMIEN0: interrupt enable register - COMIID0: interrupt identification register - COMCON1: modem control register - COMSTA1: modem status register - COMDIV2: 16-bit fractional baud divide register - COMSCR: 8-bit scratch register used for temporary storage. Also used in network addressable UART mode. Table 37: COMCON0 MMR Bit Descriptions Bit Name Description 7 DLAB 6 BRK 5 SP 4 EPS 3 PEN 2 STOP 1-0 WLS Divisor latch access Set by user to enable access to COMDIV0 and COMDIV1 registers Cleared by user to disable access to COMDIV0 and COMDIV1 and enable access to COMRX and COMTX Set break. Set by user to force SOUT to 0 Cleared to operate in normal mode Stick parity Set by user to force parity to defined values: 1 if EPS = 1 and PEN = 1 0 if EPS = 0 and PEN = 1 Even parity select bit Set for even parity Cleared for odd parity Parity enable bit: Set by user to transmit and check the parity bit Cleared by user for no parity transmission or checking Stop bit Set by user to transmit 1.5 Stop bit if the Word Length is 5 bits or 2 Stop bits if the word length is 6, 7 or 8 bits. The receiver checks the first Stop bit only, regardless of the number of Stop bits selected Cleared by user to generate 1 Stop bit in the transmitted data Word length select: 00 = 5 bits 01 = 6 bits 10 = 7 bits 11 = 8 bits Rev. PrB | Page 53 of 80 ADuC702x Series Preliminary Technical Data Table 38: COMSTA0 MMR Bit Descriptions Bit Name Description Reserved 7 6 TEMT 5 THRE 4 BI 3 FE 2 PE 1 OE 0 DR COMTX empty status bit Set automatically if COMTX is empty Cleared automatically when writing to COMTX COMTX and COMRX empty Set automatically if COMTX and COMRX are empty Cleared automatically when one of the register receives data Break error Set when SIN is held low for more than the maximum word length Cleared automatically Framing error Set when invalid stop bit Cleared automatically Parity error Set when a parity error occurs Cleared automatically Overrun error Set automatically if data are overwrite before been read Cleared automatically Data ready Set automatically when COMRX is full Cleared by reading COMRX Table 39: COMIEN0 MMR Bit Descriptions Bit Name Description Reserved 7-4 3 EDSSI 2 ELSI 1 ETBEI 0 ERBFI Modem status interrupt enable bit Set by user to enable generation of an interrupt if any of COMSTA1[3:0] are set Cleared by user RX status interrupt enable bit Set by user to enable generation of an interrupt if any of COMSTA0[3:0] are set Cleared by user Enable transmit buffer empty interrupt Set by user to enable interrupt when buffer is empty during a transmission Cleared by user Enable receive buffer full interrupt Set by user to enable interrupt when buffer is full during a reception Cleared by user Table 40: COMIID0 MMR Bit Descriptions Bit 2-1 Bit 0 Priority Definition Clearing operation Status bits NINT 00 1 11 0 1 Receive line status interrupt 10 0 2 Receive buffer full interrupt Read COMRX 01 0 3 Transmit buffer empty interrupt Write data to COMTX or read COMIID0 00 0 4 Modem status interrupt Read COMSTA1 register No interrupt Rev. PrB | Page 54 of 80 Read COMSTA0 Preliminary Technical Data ADuC702x Series Table 41: COMCON1 MMR Bit Descriptions Bit Name Description Reserved 7-5 4 LOOPBACK 1 RTS 0 DTR Loop back Set by user to enable loop back mode. In loop back mode the SOUT is forced high. Also the modem signals are directly connected to the status inputs (RTS to CTS, DTR to DSR, OUT1 to RI and OUT2 to DCD) Request to send Set by user to force the RTS output to 0 Cleared by user to force the RTS output to 1 Data terminal ready Set by user to force the DTR output to 0 Cleared by user to force the DTR output to 1 Table 42: COMSTA1 MMR Bit Descriptions Bit Name Description 7 DCD Data carrier detect 6 RI Ring indicator 5 DSR Data set ready 4 CTS Clear to send 3 DDCD 2 TERI 1 DDSR 0 DCTS Delta DCD Set automatically if DCD changed state since COMSTA1 last read Cleared automatically by reading COMSTA1 Trailing edge RI Set if NRI changed from 0 to 1 since COMSTA1 last read Cleared automatically by reading COMSTA1 Delta DSR Set automatically if DSR changed state since COMSTA1 last read Cleared automatically by reading COMSTA1 Delta CTS Set automatically if CTS changed state since COMSTA1 last read Cleared automatically by reading COMSTA1 Table 43: COMDIV2 MMR Bit Descriptions Bit Name Description 15 FBEN Fractional baudrate generator enable bit Set by user to enable the fractional baudrate generator Cleared by user to generate baudrate using the standard 450 UART baudrate generator Reserved 12-11 FBM[1-0] M. if FBM = 0, M = 4 10-0 FBN[10-0] N 14-13 Rev. PrB | Page 55 of 80 ADuC702x Series Preliminary Technical Data Network addressable UART mode This mode allows connecting the MicroConverter on a 256node serial network, either as a hardware single-master or via software in a multi-master network. Bit 7 of COMIEN1 (ENAM bit) must be set to enable UART in network addressable mode. Note that there is no parity check in this mode, the parity bit is used for address. Network addressable UART register definitions Three additional register: scratch register is the transmitted network address control bit. If set to 1, the device is transmitting an address. If cleared to 0, the device is transmitting data. - COMIEN1: 8-bit network enable register. - COMIID1: 8-bit network interrupt register. Bit 7 to 4 are reserved. See Table 45. - COMADR: 8-bit read and write network address register. Holds the address the network addressable UART checks for. On receiving this address the device interrupts the processor and/or sets the appropriate status bit in COMIID1. COMIEN1, COMIID1 and COMADR are used only in network addressable UART mode. - COMSCR: 8-bit scratch register used for temporary storage. In network address mode, the least significant bit of the Table 44: COMIEN1 MMR Bit Descriptions Bit Name Description 7 ENAM 6 E9BT 5 E9BR 4 ENI Network address mode Enable bit set by user to enable network address mode cleared by user to disable network address mode 9-bit transmit enable bit Set by user to enable 9-bit transmit. ENAM must be set Cleared by user to disable 9-bit transmit 9-bit receive enable bit Set by user to enable 9-bit receive. ENAM must be set Cleared by user to disable 9-bit receive network interrupt Enable bit 3 E9BD 2 ETD 1 NABP 0 NAB Word length Set for 9-bit data. E9BT has to be cleared. Cleared for 8-bit data Transmitter pin driver Enable bit Set by user to enable SOUT pin as an output in slave mode or multi-master mode Cleared by user, SOUT is three-state Network address bit, interrupt polarity bit Network address bit Set by user to transmit the slave's address Cleared by user to transmit data Table 45: COMIID1 MMR Bit Descriptions Bit 3-1 Bit 0 priority Definition Clearing operation Status bits NINT 000 1 110 0 2 Matching network address Read COMRX 101 0 3 Address transmitted, buffer empty Write data to COMTX or read COMIID0 011 0 1 Receive line status interrupt Read COMSTA0 010 0 2 Receive buffer full interrupt Read COMRX 001 0 3 Transmit buffer empty interrupt Write data to COMTX or read COMIID0 000 0 4 Modem status interrupt Read COMSTA1 register No interrupt Rev. PrB | Page 56 of 80 Preliminary Technical Data ADuC702x Series SPIDIV register as follow: SERIAL PERIPHERAL INTERFACE The ADuC702x integrates a complete hardware Serial Peripheral Interface (SPI) on-chip. SPI is an industry standard synchronous serial interface that allows eight bits of data to be synchronously transmitted and received simultaneously, i.e., full duplex up to a maximum bit rate of 5.6Mbs. The SPI Port can be configured for Master or Slave operation and typically consists of four pins, namely: MISO (Master In, Slave Out Data I/O Pin) The MISO (master in slave out) pin is configured as an input line in master mode and an output line in slave mode. The MISO line on the master (data in) should be connected to the MISO line in the slave device (data out). The data is transferred as byte wide (8-bit) serial data, MSB first. f serialclock = f coreclock 2 x (1 + SPIDIV ) The maximum serial bit clock frequency is 1/8 of the core clock which, based on a maximum core clock frequency of 45MHz is just above 5.6Mbs. In slave mode the SPICON register must be configured with the phase and polarity of the expected input clock. In both master and slave modes, the data is transmitted on one edge of the SCL signal and sampled on the other. It is important therefore that the polarity and phase are configured the same for the master and slave devices. Chip Select (CS) Input Pin MOSI (Master Out, Slave In Pin) The MOSI (master out slave in) pin is configured as an output line in master mode and an input line in slave mode. The MOSI line on the master (data out) should be connected to the MOSI line in the slave device (data in). The data is transferred as byte wide (8-bit) serial data, MSB first. In SPI Slave Mode, a transfer is initiated by the assertion of CS which is an active low input signal. The SPI port will then transmit and receive 8-bit data until the transfer is concluded by desassertion of CS . In slave mode CS is always an input. SPI registers definition SCL (Serial Clock I/O Pin) The following MMR registers are used to control the SPI interface: The master serial clock (SCL) is used to synchronize the data being transmitted and received through the MOSI SCL period. Therefore, a byte is transmitted/received after eight SCL periods. The SCL pin is configured as an output in master mode and as an input in slave mode. - SPICON: 16-bit control register SPISTA: 8-bit read only status register SPIDIV: 8-bit serial clock divider register SPITX: 8-bit write only transmit register SPIRX: 8-bit read only receive register In master mode polarity and phase of the clock are controlled by the SPICON register, and the bit-rate is defined in the Table 46: SPICON MMR Bit Descriptions Bit Description 15-13 Reserved 12 Continuous transfer enable Set by user to enable continuous transfer. In master mode the transfer will continue until no valid data is available in the TX register. CS will be asserted and remain asserted for the duration of each 8-bit serial transfer until TX is empty Cleared by user to disable continuous transfer. Each transfer consists of a single 8-bit serial transfer. If valid data exists in the SPITX register then a new transfer is initiated after a stall period Loop back enable Set by user to connect MISO to MOSI and test software Cleared by user to be in normal mode Slave output enable Set by user to enable the slave output Cleared by user to disable slave output Slave select input enable Set by user in master mode to enable the output SPIRX overflow overwrite enable Set by user, the valid data in the RX register is overwritten by the new serial byte received 11 10 9 8 Rev. PrB | Page 57 of 80 ADuC702x Series 7 6 5 4 3 2 1 0 Preliminary Technical Data Cleared by user, the new serial byte received is discarded SPITX underflow mode Set by user to transmit the previous data Cleared by user to transmit 0 Transfer and interrupt mode (master mode) Set by user to initiate transfer with a write to the SPITX register. Interrupt will occur when TX is empty Cleared by user to initiate transfer with a read of the COMRX register. Interrupt will occur when RX is full LSB first transfer enable bit Set by user the LSB is transmitted first Cleared by user the MSB is transmitted first Reserved Serial clock polarity mode bit Set by user, the serial clock idles high Cleared by user the serial clock idles low Serial clock phase mode bit Set by user, the serial clock pulses at the beginning of each serial bit transfer Cleared by user, the serial clock pulses eat end of each serial bit transfer Master mode enable bit Set by user to enable master mode Cleared by user to enable slave mode SPI enable bit Set by user to enable the SPI Cleared to disable the SPI Table 47: SPISTA MMR Bit Descriptions Bit Description 7-6 Reserved 5 SPIRX data register overflow status bit Set if SPIRX is overflowing Cleared by reading SPISRX register SPIRX data register IRQ Set automatically if bit 3 or 5 are set Cleared by reading SPIRX register SPIRX data register full status bit Set automatically if a valid data is present in the SPIRX register Cleared by reading SPIRX register SPITX data register underflow status bit Set automatically if SPITX is under flowing Cleared by writing in the SPITX register SPITX data register IRQ Set automatically if bit 0 is clear or bit 2 is set Cleared by writing in the SPITX register or if finished transmission disabling the SPI SPITX data register empty status bit Set by writing to SPITX to send data. This bit is set during transmission of data Cleared when SPITX is empty 4 3 2 1 0 Rev. PrB | Page 58 of 80 Preliminary Technical Data ADuC702x Series f serialclock = I2C COMPATIBLE INTERFACES The ADuC702x supports two fully licensed* I2C interfaces. The I2C interfaces are both implemented as a full hardware master and slave interface. The two I2C interfaces being identical, this document will describe only I2C0 in detail. The two pins used for data transfer, SDA and SCL are configured in a Wired-AND format that allows arbitration in a multi-master system. The I2C bus peripheral's addresses in the I2C bus system is programmed by the user. This ID can be modified at any time while a transfer is not in progress. The user can configure the interface to respond to four slave addresses. The transfer sequence of a I2C system consists of a master device initiating a transfer by generating a START condition while the bus is idle. The master transmits the address of the slave device and the direction of the data transfer in the initial address transfer. If the master does not loose arbitration and the slave acknowledges then the data transfer is initiated. This continues until the master issues a STOP condition and the bus becomes idle. The I2C peripheral master and slave functionality are independent and may be active simultaneously. A slave is activated when a transfer has been initiated on the bus. If it is not being addressed it will remain inactive until another transfer is initiated. This also allows a master device which looses arbitration to respond as a slave in the same cycle. Serial Clock Generation The I2C master in the system generates the serial clock for a transfer. The master channel can be configured to operate in Fast mode (400 kHz) or Standard mode (100 kHz). f coreclock 2 x (2 + I 2C 0 DIVH + I 2C 0 DIVL) Slave addresses The registers I2C0ID0, I2C0ID1, I2C0ID2 and I2C0ID3 contain the device IDs. The device compares the four I2C0IDx registers to the address byte. The 7 most significant bits of either ID register must be identical to that of the 7 most significant bits of the first address byte received to be correctly addressed. The LSB of the ID registers, transfer direction bit, is ignored in the process of address recognition. I2C registers description The I2C peripheral interface consists on 17 8-bit MMRs: - I2C0CFG: configuration register described Table 48 - I2C0DIVH, I2C0DIVL: clock divider registers - I2C0SRX, I2C0STX, and I2C0SSTA: respectively receive, transmit and status register for the slave channel. The status register is described Table 49. - I2C0ID0, I2C0ID1, I2C0ID2 and I2C0ID3: slave address device ID register - I2C0MRX, I2C0MTX, and I2C0MSTA: respectively receive, transmit and status register for the master channel. The status register is described Table 50. - I2C0CNT: Master receive data count register. If a master read transfer sequence is initiated, the I2C0CNT register denotes the number of bytes to be read from the slave device. - I2C0ADR: master address byte register. The I2C0ADR value is the address of the device the master wants to communicate with, it will be transmitted automatically at the start of a master transfer sequence if there is no valid data in the I2C0MTX register when setting the master enable bit. - I2C0ALT: hardware general call ID register, used in slave mode The bit-rate is defined in the I2C0DIVH and I2C0DIVL MMRs as follow : Table 48: I2C0CFG MMR Bit Descriptions Bit Description 7 Master serial clock enable bit Set by user to enable generation of the serial clock in master mode Cleared by user to disable serial clock in master mode Loop back enable bit Set by user to internally connect the transition to the reception, to test user software Cleared by user to operate in normal mode START back-off disable bit Set by user in multi-master mode. If losing arbitration the master will try to transmit again straight away Cleared by user to enable START back-off. The master after losing arbitration will wait before trying to transmit again Hardware general call enable (bit 3 must be set) Set by user to enable hardware general call Cleared by user to disable hardware general call 6 5 4 Rev. PrB | Page 59 of 80 ADuC702x Series 3 2 1 0 Preliminary Technical Data General call enable bit Set by user to address every device on the I2C bus Cleared by user to operate in normal mode Reserved Master enable bit Set by user to enable the master I2C channel Cleared by user to disable the master I2C channel Slave enable bit Set by user to enable the slave I2C channel. A slave transfer sequence will be monitored for the device address in I2C0ID0, I2C0ID1, I2C0ID2 and I2C0ID3. if the device address is recognised the part will participate in the slave transfer sequence Cleared by user to disable the slave I2C channel Table 49: I2C0SSTA MMR Bit Descriptions Bit Description 7 Transmit FIFO flush Set by user to flush the transmit FIFO Cleared by user to operate in normal mode Slave busy Set automatically if the slave is busy Cleared automatically No ACK Set if master asking for data and no data is available Cleared automatically Slave receive FIFO overflow Set automatically if the slave receive FIFO is overflowing Cleared automatically by reading I2C0SRX Slave receive IRQ Set after receiving data Cleared automatically by reading the I2C0SRX register Slave transmit IRQ Set at the end of a transmission Cleared automatically by writing to the I2C0STX register Slave transmit FIFO underflow Set automatically if the slave transmit FIFO is underflowing Cleared automatically by writing to the I2C0STX register Slave transmit FIFO empty Set automatically if the slave transmit FIFO is empty Cleared automatically by writing to the I2C0STX register 6 5 4 3 2 1 0 Table 50: I2C0MSTA MMR Bit Descriptions Bit Description 7 Transmit FIFO flush Set by user to flush the transmit FIFO Cleared by user to operate in normal mode Master busy Set automatically if the master is busy Cleared automatically Arbitration loss Set in multi-master mode if another master has the bus Cleared when the bus becomes available 6 5 Rev. PrB | Page 60 of 80 Preliminary Technical Data 4 3 2 1 0 * ADuC702x Series No ACK Set automatically, if the master receive FIFO is full, the master doesn't acknowledge the data received Cleared automatically Master receive FIFO overflow Set automatically if the master receive FIFO is overflowing Cleared automatically by reading I2C0MRX Master receive IRQ Set after receiving data Cleared automatically by reading the I2C0MRX register Master transmit IRQ Set at the end of a transmission Cleared automatically by writing to the I2C0MTX register Master TX FIFO empty Set automatically if the master transmit FIFO is empty Cleared automatically by writing to the I2C0MTX register Purchase of licensed I2C components of Analog Devices or one of its sublicensed Associated Companies conveys a license for the purchaser under the Philips I2C Patent Rights to use the ADuC702X in an I2C system, provided that the system conforms to the I2C Standard Specification as defined by Philips. Rev. PrB | Page 61 of 80 ADuC702x Series Preliminary Technical Data of block 0 is fed back to the input 0 of mux 0 of element 0 of block 1. PROGRAMMABLE LOGIC ARRAY (PLA) The ADuC702x integrates a fully Programmable Logic Array (PLA) which consists of two independent but interconnected PLA blocks. Each block consists of eight PLA elements, which gives a total of 16 PLA elements. PLA Block 0 A PLA element contains a two-input lookup table that can be configured to generate any logic output function based on two inputs and a flip-flop as represented in Figure 27 below. 0 2 A 3 B 4 LOOK-UP TABLE PLA Block 1 Element Input Output Element Input Output 0 P1.0 P1.7 8 P3.0 P4.0 1 P1.1 P0.4 9 P3.1 P4.1 2 P1.2 P0.5 10 P3.2 P4.2 3 P1.3 P0.6 11 P3.3 P4.3 4 P1.4 P0.7 12 P3.4 P4.4 5 P1.5 P2.0 13 P3.5 P4.5 6 P1.6 P2.1 14 P3.6 P4.6 7 P0.0 P2.2 15 P3.7 P4.7 1 Table 51: element input/output PLA MMRs interface Figure 27: PLA element The PLA peripheral interface consists on 21 MMRs: In total, 30 GPIO pins are available on the ADuC702x for the PLA. These include 16 input pins and 14 output pins. They need to be configured in the GPxCON register as PLA pins before using the PLA. Note that the comparator output is also included as one of the 16 input pins. The PLA is configured via a set of user MMRs and the output(s) of the PLA can be routed to the internal interrupt system, to the CONVSTART signal of the ADC, to a MMR or to any of the 16 PLA output pins. The interconnection between the two blocks is supported by connecting output of element 7 of block 1 fed back to the input 0 of mux 0 of element 0 of block 0, and the output of element 7 - PLAELMx: element0 to element 15 control registers, configure the input and output mux of each element, select the function in the lookup table and bypass/use the flip-flop. - PLACLK: clock selection for the flip-flops of block 0 and clock selection for the flip-flops of block 1 - PLAIRQ: enable IRQ0 or/and IRQ1 and select the source of the IRQ - PLAADC: PLA source fro ADC start conversion signal - PLADIN: data input MMR for PLA - PLADOUT: data output MMR for PLA. This register is always updated. A PLA tool is provided in the development system to easily configure the PLA. Table 52: PLAELMx MMR Bit Descriptions Bit Description 31-11 Reserved 10-9 Mux (0) control, select feedback from: 8-7 Mux (1) control, select feedback from: 6 Mux (2) control Set by user to select the output of mux (1) Cleared by user to select the bit value from PLADIN Mux (3) control Set by user to select the input pin of the particular element Cleared by user to select the output of mux (0) Look-up table control 0000 - 0 0001 - NOR 0010 - B AND NOT A 5 4-1 PLAELM0 00 - element 15 01 - element 2 10 - element 4 11 - element 6 00 - element 1 01 - element 3 10 - element 5 11 - element 7 Rev. PrB | Page 62 of 80 PLAELM1 - 7 PLAELM8 PLAELM9-15 element 0 element 2 element 4 element 6 element 1 element 3 element 5 element 7 element 7 element 10 element 12 element 14 element 9 element 11 element 13 element 15 element 8 element 10 element 12 element 14 element 9 element 11 element 13 element 15 Preliminary Technical Data ADuC702x Series 0011 - NOT A 0100 - A AND NOT B 0101 - NOT B 0110 - EXOR 0111 - NAND 1000 - AND 1001 - EXNOR 1010 - B 1011 - NOT A OR B 1100 - A 1101 - A OR NOT B 1110 - OR 1111 - 1 0 Mux (4) control Set by user to bypass the flip-flop Cleared by user to select the flip-flop. Cleared by default Table 53: PLACLK MMR Bit Descriptions Bit Description 7 Reserved 6-4 Block1 clock source selection: 000 - GPIO clock on P0.5 001 - GPIO clock on P0.0 010 - GPIO clock on P0.7 011 - HCLK 100 - OCLK 101 - Timer 1 overflow Other - Reserved Reserved 3 2-0 Block0 clock source selection: 000 - GPIO clock on P0.5 001 - GPIO clock on P0.0 010 - GPIO clock on P0.7 011 - HCLK 100 - OCLK 101 - Timer 1 overflow Other - Reserved Table 54: PLAIRQ MMR Bit Descriptions Bit Description 15-13 Reserved 12 PLA IRQ1 enable bit Set by user to enable IRQ1 output from PLA Cleared by user to disable IRQ1 output from PLA PLA IRQ1 source 0000 - PLA element 0 0001 - PLA element 1 ... 1111 - PLA element 15 Reserved 11-8 7-5 4 PLA IRQ0 enable bit Set by user to enable IRQ0 output from PLA Cleared by user to disable IRQ0 output from PLA Rev. PrB | Page 63 of 80 ADuC702x Series 3-0 Preliminary Technical Data PLA IRQ0 source 0000 - PLA element 0 0001 - PLA element 1 ... 1111 - PLA element 15 Table 55: PLAADC MMR Bit Descriptions Bit Description 31-5 Reserved 4 ADC start conversion enable bit Set by user to enable ADC start conversion from PLA Cleared by user to disable ADC start conversion from PLA ADC start conversion source 0000 - PLA element 0 0001 - PLA element 1 ... 1111 - PLA element 15 3-0 Table 56: PLADIN MMR Bit Descriptions Bit Description 31-16 Reserved 15-0 Input Bit to element 15-0 Table 57: PLADOUT MMR Bit Descriptions Bit Description 31-16 Reserved 15-0 Output Bit from element 15-0 Rev. PrB | Page 64 of 80 Preliminary Technical Data ADuC702x Series PROCESSOR REFERENCE PERIPHERALS INTERRUPT SYSTEM There are 24 interrupt sources on the ADuC702x which are controlled by the Interrupt Controller. Most interrupts are generated from the on-chip peripherals like ADC, UART, etc. and two additional interrupt sources are generated from external interrupt request pins, XIRQ0 and XIRQ1. The ARM7TDMI CPU core will only recognise interrupts as one of two types, a normal interrupt request IRQ and a fast interrupt request FIQ. All the interrupts can be masked separately. The control and configuration of the interrupt system is managed through nine interrupt-related registers, four dedicated to IRQ, four dedicated to FIQ. An additional MMR is used to select the programmed interrupt source. The bits in each IRQ and FIQ registers represent the same interrupt source as described in Table 58. Table 58: IRQ/FIQ MMRs bit description Bit Description 0 1 All interrupts OR'ed SWI: not used in IRQEN/CLR and FIQEN/CLR 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 Timer 0 Timer 1 Wake Up timer - Timer 2 Watchdog timer - Timer 3 Flash control ADC channel PLL lock I2C0 Slave I2C0 Master I2C1 Master SPI Slave SPI Master UART External IRQ0 Comparator PSM External IRQ1 PLA IRQ0 PLA IRQ1 External IRQ2 External IRQ3 PWM trip PWM sync IRQ The IRQ is the exception signal to enter the IRQ mode of the processor. It is used to service general purpose interrupt handling of internal and external events. The four 32-bit registers dedicated to IRQ are: - IRQSIG, reflects the status of the different IRQ sources. If a peripheral generate an IRQ signal, the corresponding bit in the IRQSIG will be set, otherwise it is cleared. The IRQSIG bits are cleared when the interrupt in the particular peripheral is cleared. All IRQ sources can be masked in the IRQEN MMR. IRQSIG is read-only. - IRQEN, provides the value of the current enable mask. When bit is set to 1, the source request is enabled to create an IRQ exception. When bit is set to 0, the source request is disabled or masked which will not create an IRQ exception. - IRQCLR, (write-only register) allows clearing the IRQEN register in order to mask an interrupt source. Each bit set to 1 will clear the corresponding bit in the IRQEN register without affecting the remaining bits. The pair of registers IRQEN and IRQCLR allows independent manipulation of the enable mask without requiring an atomic read-modifywrite. - IRQSTA, (read-only register) provides the current enabled IRQ source status. When set to 1 that source should generate an active IRQ request to the ARM7TDMI core. There is no priority encoder or interrupt vector generation. This function is implemented in software in a common interrupt handler routine. All 32 bits are logically OR'ed to create the IRQ signal to the ARM7TDMI core. FIQ The FIQ (Fast Interrupt reQuest) is the exception signal to enter the FIQ mode of the processor. It is provided to service data transferor communication channel tasks with low latency. The FIQ interface is identical to the IRQ interface providing the second level interrupt (highest priority). Four 32-bit registers are dedicated to FIQ, FIQSIG, FIQEN, FIQCLR and FIQSTA. Bit 31 to 1 of FIQSTA are logically OR'ed to create the FIQ signal to the core and the bit 0 of both the FIQ and IRQ registers (FIQ source). The logic for FIQEN and FIQCLR will not allow an interrupt source to be enabled in both IRQ and FIQ masks. A bit set to `1' in FIQEN will, as a side-effect, clear the same bit in IRQEN. A bit set to `1' in IRQEN will, as a side-effect, clear the same bit in FIQEN. An interrupt source can be disabled in both IRQEN and FIQEN masks. Programmed interrupts As the programmed interrupts are non-mask-able, they are controlled by another register, SWICFG, which write into both IRQSTA and IRQSIG registers or/and FIQSTA and FIQSIG Rev. PrB | Page 65 of 80 ADuC702x Series Preliminary Technical Data registers at the same time. programmed source interrupt. The 32-bit register dedicated to software interrupt is SWICFG described Table 59. This MMR allows the control of Table 59: SWICFG MMR Bit Descriptions Bit Description 31-3 Reserved 2 Programmed Interrupt-FIQ Setting/clearing this bit correspond in setting/clearing bit 1 of FIQSTA and FIQSIG Programmed Interrupt-IRQ Setting/clearing this bit correspond in setting/clearing bit 1 of IRQSTA and IRQSIG Reserved 1 0 Note that any interrupt signal must be active for at least the equivalent of the interrupt latency time, to be detected by the interrupt controller and to be detected by user in the IRQSTA/FIQSTA register. Rev. PrB | Page 66 of 80 Preliminary Technical Data ADuC702x Series Timer0 - RTOS timer TIMERS Timer0 is a general purpose 16-bit count-down timer with a programmable prescaler. The prescaler source is the core clock frequency and can be scaled by factors of 1, 16 or 256. The ADuC702x has four general purpose Timer/Counters: - Timer0, - Timer1, - Timer2 or Wake-up Timer, - Timer3 or Watchdog Timer. 16-bit Load The four timers in their normal mode of operation can be either free-running or periodic. - In free-running mode the counter decrements/increments from the maximum/minimum value until zero/full scale and starts again at the maximum /minimum value. - In periodic mode the counter decrements/increments from the value in the Load Register(TxLD MMR,) until zero/full scale and starts again at the value stored in the Load Register. The value of a counter can be read at any time by accessing its value register (TxVAL). Timers are started by writing in the Control register of the corresponding timer (TxCON). In normal mode, an IRQ is generated each time the value of the counter reaches zero, if counting down, or full-scale, if counting up. An IRQ can be cleared by writing any value to Clear register of the particular timer (TxCLRI). Core Clock Prescaler / 1, 16 or 256 16-bit Down Counter Timer0IRQ Timer0 Value Figure 28:timer 0 block diagram Timer0 interface consists in four MMRS: - T0LD and T0VAL are 16-bit registers (bit 0 to 15) and hold 16-bit unsigned integers. T0VAL is read-only. - T0CLRI is an 8-bit register. Writing any value to this register will clear the interrupt - T0CON is the configuration MMR described in Table 60 below Table 60: T0CON MMR Bit Descriptions Bit Name Description 31-8 Reserved 7 Timer0 enable bit: Set by user to enable timer 0 Cleared by user to disable timer 0. by default. Timer 0 mode: Set by user to operate in periodic mode Cleared by user to operate in free-running mode. Default mode Reserved 6 5-4 3-2 1-0 Prescale: 00 Core clock / 1. value by default 01 Core clock / 16 10 Core clock / 256 11 Undefined. Equivalent to 00 Reserved Timer1 Timer1 is a 32-bit general purpose timer, count-down or countup, with a programmable prescaler. The prescaler source can be the 32kHz Oscillator, the core clock frequency, or an external GPIO, P1.0 or P0.6. This source can be scaled by a factor of 1, 16, 256 or 32768. The counter can be formatted as a standard 32-bit value or as Hours:Minutes:Seconds:Hundreths. Timer1 has a capture register (T1CAP), which can be triggered by a selected IRQ source initial assertion. This feature can be used to determine the assertion of an event with more accuracy than the precision allowed by the RTOS timer at the time the IRQ is serviced. Timer 1 can be used to start ADC conversions as shown in the block diagramFigure 29. Timer1 interface consists in five MMRS: - T1LD, T1VAL and T1CAP are 32-bit registers and hold 32- Rev. PrB | Page 67 of 80 ADuC702x Series Preliminary Technical Data bit unsigned integers. T1VAL and T1CAP are read-only. - T1CLRI is an 8-bit register. Writing any value to this register will clear the timer1 interrupt. - T1CON is the configuration MMR described in Table 61 below. 32-bit Load 32kHz Oscillator Core Clock Frequency P0.6 P1.0 Prescaler / 1, 16, 256 or 32768 32-bit Up/Down Counter Timer1IRQ ADC conversion Timer1 Value Capture IRQ[31:0] Figure 29:timer 1 block diagram Table 61: T1CON MMR Bit Descriptions Bit Description 31-18 Reserved 17 Event Select bit: Set by user to enable time capture of an event Cleared by user to disable time capture of an event Event select range, 0 to 31 The events are as described in Table 58. All events are offset by 2, i.e. event 2 in Table 58 becomes event zero for the purposes of timer 1. Clock select: 000 Core clock 001 Oscillator 32.768kHz 010 P1.0 raising edge triggered 011 P0.6 raising edge triggered Count up: Set by user for timer 1 to count up Cleared by user for timer 1 to count down. by default Timer1 enable bit: Set by user to enable timer 1 Cleared by user to disable timer 1. by default. Timer 1 mode: Set by user to operate in periodic mode Cleared by user to operate in free-running mode. Default mode Format: 00 Binary Reserved 01 10 Hr:Min:Sec:Hundredths - 23 hours to 0 hour 11 Hr:Min:Sec:Hundredths - 255 hours to 0 hour Prescale: 0000 Source clock / 1 0100 Source clock / 16 1000 Source clock / 256 1111 Source clock / 32768 16-12 11-9 8 7 6 5-4 3-0 Timer2 - Wake-Up Timer Timer2 is a 32-bit wake-up timer, count-down or count-up, with a programmable prescaler. It is clocked directly by the internal 32.768kHz oscillator. The wake-up timer will continue to run when the core clock is disabled. The clock source can be scaled by a factor of 1, 16, 256 or 32768. Rev. PrB | Page 68 of 80 Preliminary Technical Data ADuC702x Series The counter can be formatted as plain 32-bit value or as Hours:Minutes:Seconds:Hundreths. Timer 2 can be used to start ADC conversions as shown in the block diagram Figure 30.. 32-bit Load 32.768kHz Oscillator Prescaler / 1, 16, 256 or 32768 Timer2IRQ 32-bit Up/Down Counter ADC conversion Timer2 interface consists in four MMRS: Timer2 Value - T2LD and T2VAL are 32-bit registers and hold 32-bit unsigned integers. T2VAL is read-only. - T2CLRI is an 8-bit register. Writing any value to this register will clear the timer2 interrupt. - T2CON is the configuration MMR described in Table 62 below. Figure 30:timer 2 block diagram Table 62: T2CON MMR Bit Descriptions Bit Description 31-9 Reserved 8 Count up: Set by user for timer 2 to count up Cleared by user for timer 2 to count down. by default Timer2 enable bit: Set by user to enable timer 2 Cleared by user to disable timer 2. by default. Timer 2 mode: Set by user to operate in periodic mode Cleared by user to operate in free-running mode. Default mode Format: 00 Binary Reserved 01 10 Hr:Min:Sec:Hundredths - 23 hours to 0 hour 11 Hr:Min:Sec:Hundredths - 255 hours to 0 hour Prescale: 0000 Source clock / 1 by default 0100 Source clock / 16 1000 Source clock / 256 expected for format 2 and 3 1111 Source clock / 32768 7 6 5-4 3-0 16-bit Load Timer3 - Watchdog Timer Timer3 has two modes of operation, normal mode and watchdog mode. The Watchdog timer is used to recover from an illegal software state. Once enabled it requires periodic servicing to prevent it from forcing a reset of the processor. 32.768kHz Prescaler / 1, 16 or 256 16-bit Up/Down Counter Watchdog Reset Timer3IRQ Timer3 Value Figure 31:timer 3 block diagram Normal mode: The Timer3 in normal mode is identical to Timer0 except for the clock source and the count-up functionality. The clock source is 32kHz from the PLL and can be scaled by a factor of 1, 16 or 256. Watchdog mode: Watchdog mode is entered by setting bit 5 in T3CON MMR. Timer3 decrements from the value present in T3LD Register until zero. T3LD is used as timeout. The timeout can be 512 seconds maximum, using the maximum prescaler, /256, fullscale in T3LD. Timer3 is clocked by the internal 32kHZ crystal when operating in the Watchdog mode. If the timer reaches 0, a reset or an interrupt occurs, depending on bit 1 in T3CON register. To avoid reset or interrupt, any Rev. PrB | Page 69 of 80 ADuC702x Series Preliminary Technical Data value must be written to T3ICLR before the expiration period. This reloads the counter with T3LD and begins a new timeout period. As soon watchdog mode is entered, T3LD and T3CON are write-protected. These two registers can not be modified until a reset clears the watchdog enable bit and causes Timer3 to exit watchdog mode. Timer3 interface: initial value or seed is written to T3ICLR before entering watchdog mode. After entering watchdog mode, a write to T3ICLR must match this expected value. If it matches, the LFSR is advanced to the next state when the counter reload happens. If it fails to match the expected state, reset is immediately generated, even if the count has not yet expired. The value 0x00 should not be used as an initial seed due to the properties of the polynomial. The value 0x00 will always be guaranteed to force an immediate reset. The value of the LFSR can not be read; it must be tracked/generated in software. It consists in four MMRS: - T3LD and T3VAL are 16-bit registers (bit 0 to 15) and hold 16-bit unsigned integers. T0VAL is read-only. - T3CLRI is an 8-bit register. Writing any value to this register will clear the timer3 interrupt in normal mode or will reset a new timeout period in watchdog mode. - T3CON is the configuration MMR described in Table 63. Secure bit clear (watchdog mode only): The secure clear bit is provided for a higher level of protection. When set, a specific sequential value must be written to T3ICLR to avoid a watchdog reset. The value is a sequence generated by the 8-bit LFSR (Linear Feedback Shift Register) polynomial = X8 + X6 + X5 + X + 1 as shown Figure 32. The Q 7 D Q 6 D Reserved 8 Count up: Set by user for timer 3 to count up Cleared by user for timer 3 to count down. by default Timer3 enable bit: Set by user to enable timer 3 Cleared by user to disable timer 3. by default. Timer 3 mode: Set by user to operate in periodic mode Cleared by user to operate in free-running mode. Default mode Watchdog mode enable bit: Set by user to enable watchdog mode Cleared by user to disable watchdog mode. by default. Secure Clear bit: Set by user to use the secure clear option Cleared by user to disable the secure clear option. by default. Prescale: 00 Source clock / 1 by default 01 Source clock / 16 10 Source clock / 256 11 Undefined. Equivalent to 00 Watchdog IRQ option bit: Set by user to produce an IRQ instead of a reset when the watchdog reaches 0 Cleared by user to disable the IRQ option. Reserved 3-2 1 0 4 D Q 3 D Q 2 D Q 1 D Q 0 D 1) entered initial seed in T3ICLR, 0xAA, before starting timer 3 in watchdog mode 2) enter 0xAA in T3ICLR, timer 3 is reloaded 3) enter 0x37 in T3ICLR, timer 3 is reloaded 4) enter 0x6E in T3ICLR, timer 3 is reloaded 5) enter 0x66. 0xDC was expected, the watchdog reset the chip. 31-9 4 Q Example of sequence: Description 5 D Figure 32: 8-bit LFSR Bit 6 5 Clock Table 63: T3CON MMR Bit Descriptions 7 Q Rev. PrB | Page 70 of 80 Preliminary Technical Data ADuC702x Series documented in the table below. External Memory Interfacing The only ADuC702x models which feature an external memory interface are the ADuC7026 and ADuC7027. The external memory interface requires a larger number of pins, this is why it is only available on larger pin count package. Address Start Address End Contents 0x10000000 0x1001FFFF External Memory 0 The pins required for interfacing to an external memory are: 0x20000000 0x2001FFFF External Memory 1 0x30000000 0x3001FFFF External Memory 2 0x40000000 0x4001FFFF External Memory 3 Pin Function AD[15:0} Address/Data Bus A16 Extended Addressing MS[3:0} Memory Select Pins WR Write Strobe RS Read Strobe AE Address Latch Enable BHE, BLE Byte Write Capability Each external memory region can be controlled through the following three MMRs XMCFG is set to 1 to enable external memory access. This must be set to 1 before any port pins will function as external memory access pins. The port pins must also be individually enabled via the GPxCON MMR XMxCON are registers that enable/disable a memory region. This register also controls the data bus width of the memory region. There are four external memory regions available. These are XMxPAR are registers that define the protocol used for accessing the external memory for each memory region. Table 64: XMxCON MMR Bit Descriptions Bit Description 1 Selects between 8 and 16 bit data bus width. Set by the user to select a 16 bit data bus Cleared by the user to select an 8 bit data bus. Enables Memory Region Set by the user to enable memory region Cleared by the user to disable the memory region 0 Table 65: XMxPAR MMR Bit Descriptions Bit Description 15 Enable Byte write strobe Set by the user gates the BHE and BLE outputs with the WR output. This allows byte write capability without using Number of wait states on the Address latch enable strobe. 14-12 11 10 9 Enable dynamic addressing Set by the user to enable 16 bit addressing mode Cleared by the user to enable 8 bit addressing mode Extra address hold time Set by the user to disable extra hold time Cleared by the user to enable one clock cycle of hold on address in read and write Extra bus transition time on Read Set by the user to disable extra bus transition time Rev. PrB | Page 71 of 80 ADuC702x Series Preliminary Technical Data Cleared by the user to enable one extra clock before and after the Read Strobe, RS 8 7-4 3-0 Extra bus transition time on Write Set by the user to disable extra bus transition time Cleared by the user to enable one extra clock before and after the Write Strobe, WS Number of Write Wait States Set by the user to select the number of wait states added to the length of the WS pulse. 0x0 is 1clock 0xF is 16 clock cycles (default value) Number of Read Wait States Set by the user to select the number of wait states added to the length of the RS pulse. 0x0 is 1clock 0xF is 16 clock cycles (default value) EPROM A16 A16 AD15:0 D0-D15 ADuC7026 ADuC7027 A0:15 LATCH AE MS0 MS1 CS WS WE RS OE RAM A16 D0-D15 A0:15 CS WE OE Figure 33 Interfacing to external EPROM/RAM Rev. PrB | Page 72 of 80 Preliminary Technical Data ADuC702x Series MCLK ADDRESS DATA AD 16:0 MSx AE RS WS Figure 34: External Memory Read Cycle MCLK ADDRESS DATA AD 16:0 MSx AE RS WS Figure 35: External Memory Read cycle with Address hold and Bus turn cycles Rev. PrB | Page 73 of 80 ADuC702x Series Preliminary Technical Data MCLK DATA ADDRESS AD 16:0 MSx AE RS WS Figure 36: External Memory Write Cycle with address and write hold cycles MCLK ADDRESS DATA AD 16:0 MSx AE RS WS Figure 37: External Memory Write Cycle with wait states Rev. PrB | Page 74 of 80 Preliminary Technical Data ADuC702x Series ADUC702X HARDWARE DESIGN CONSIDERATIONS POWER SUPPLIES The ADuC702X operational power supply voltage range is 2.7V to 3.6V. Separate analog and digital power supply pins (AVDD and IOVDD, respectively) allow AVDD to be kept relatively free of noisy digital signals often present on the system IOVDD line. In this mode, the part can also operate with split supplies; that is, using different voltage supply levels for each supply. For example, this means that the system can be designed to operate with a IOVDD voltage level of 3.3 V while the AVDD level can be at 3 V, or vice versa if required. A typical split supply configuration is shown in Figure 38. AVDD pin with trace lengths as short as possible. Connect the ground terminal of each of these capacitors directly to the underlying ground plane. Finally, it should also be noted that, at all times, the analog and digital ground pins on the ADuC702x must be referenced to the same system ground reference point. Linear Voltage regulator The ADuC702x requires a single 3.3V supply but the core logic requires a 2.5V supply. An on-chip linear regulator generates the 2.5V from IOVDD for the core logic. LVDD pin 21 is the 2.5V supply for the core logic. An external compensation capacitor of 0.47 F must be connected between LVDD and DGND (as close as possible to these pins) to act as a tank of charge as shown Figure 40. ANALOG SUPPLY ADuC7026 DIGITAL SUPPLY 10F + - 10F + - ADuC7026 LVDD 0.47F AVDD IOVDD DGND DACVDD 0.1F GNDREF 0.1F DACGND IOGND AGND REFGND Figure 40: voltage regulator connections Figure 38: External dual supply connections As an alternative to providing two separate power supplies, the user can help keep AVDD quiet by placing a small series resistor and/or ferrite bead between it and IOVDD, and then decoupling AVDD separately to ground. An example of this configuration is shown in Figure 39. With this configuration other analog circuitry (such as op amps, voltage reference, and so on) can be powered from the AVDD supply line as well. DIGITAL SUPPLY 1.6V BEAD + 10uF 10uF ADuC7026 IOVDD AVDD DACVDD 0.1uF GNDREF 0.1uF DACGND IOGND AGND REFGND Figure 39: external single supply connections Notice that in both Figure 38 and Figure 39, a large value (10 F) reservoir capacitor sits on IOVDD and a separate 10 F capacitor sits on AVDD. Also, local small-value (0.1 F) capacitors are located at each AVDD and IOVDD pin of the chip. As per standard design practice, be sure to include all of these capacitors, and ensure the smaller capacitors are close to each The LVDD pin should not be used for any other chip. It is also recommended that the IOVDD has excellent power supply decoupling this to help improving line regulation performance of the on-chip voltage regulator. GROUNDING AND BOARD RECOMMENDATIONS LAYOUT As with all high resolution data converters, special attention must be paid to grounding and PC board layout of ADuC702xbased designs in order to achieve optimum performance from the ADCs and DAC. Although the ADuC702x has separate pins for analog and digital ground (AGND and IOGND), the user must not tie these to two separate ground planes unless the two ground planes are connected together very close to the ADuC702x, as illustrated in the simplified example of Figure 41a. In systems where digital and analog ground planes are connected together somewhere else (at the system's power supply for example), they cannot be connected again near the ADuC702x since a ground loop would result. In these cases, tie the ADuC702x's AGND and IOGND Pins all to the analog ground plane, as illustrated in Figure 41b. In systems with only one ground plane, ensure that the digital and analog components are physically separated onto separate halves of the board such that digital return currents do not flow near analog circuitry and vice versa. The ADuC702x can then be placed between the Rev. PrB | Page 75 of 80 ADuC702x Series Preliminary Technical Data digital and analog sections, as illustrated in Figure 41c. a. XCLKI and XCLKO and connect a capacitor from each pin to ground as shown Figure 42 This crystal allows the PLL to lock correctly to give a frequency of 45.088MHz. If no external crystal is present, the internal oscillator will be used to give a frequency of 45.088MHz 5% typically. PLACE DIGITAL COMPONENTS HERE PLACE ANALOG COMPONENTS HERE ADuC7026 AGND DGND XCLKO 12pF 32.768kHz 12pF b. PLACE ANALOG COMPONENTS HERE PLACE DIGITAL COMPONENTS HERE AGND XCLKI TO INTERNAL PLL Figure 42: external parallel resonant crystal connections DGND To use an external source clock input instead of the PLL, bit 1 and bit 0 of PLLCON must be modified. The external clock uses pin 17, XCLK. ADuC7026 c. PLACE ANALOG COMPONENTS HERE PLACE DIGITAL COMPONENTS HERE XCLKI GND EXTERNAL CLOCK SOURCE XCLK TO FREQUENCY DIVIDER Figure 41:. System grounding schemes In all of these scenarios, and in more complicated real-life applications, keep in mind the flow of current from the supplies and back to ground. Make sure the return paths for all currents are as close as possible to the paths the currents took to reach their destinations. For example, do not power components on the analog side of Figure 41b with IOVDD since that would force return currents from IOVDD to flow through AGND. Also, try to avoid digital currents flowing under analog circuitry, which could happen if the user placed a noisy digital chip on the left half of the board in Figure 41c. Whenever possible, avoid large discontinuities in the ground plane(s) (such as are formed by a long trace on the same layer), since they force return signals to travel a longer path. And of course, make all connections to the ground plane directly, with little or no trace separating the pin from its via to ground. If the user plans to connect fast logic signals (rise/fall time < 5 ns) to any of the ADuC702x's digital inputs, add a series resistor to each relevant line to keep rise and fall times longer than 5 ns at the ADuC702x input pins. A value of 100 or 200 is usually sufficient to prevent high speed signals from coupling capacitively into the ADuC702x and affecting the accuracy of ADC conversions. Figure 43:connecting an external clock source Whether using the internal PLL or an external clock source, the ADuC702x's specified operational clock speed range is 50kHz to 20MHz to ensure correct operation of the analog peripherals and Flash/EE. POWER-ON RESET OPERATION An internal POR (Power-On Reset) is implemented on the ADuC702x. For LVDD below 1.98 V, the internal POR will hold the ADuC702x in reset. As LVDD rises above 1.98 V, an internal timer will time out for typically 128 ms before the part is released from reset. The user must ensure that the power supply IOVDD has reached a stable 2.7 V minimum level by this time. Likewise on power-down, the internal POR will hold the ADuC702x in reset until LVDD has dropped below 1.98V. Figure 44 illustrates the operation of the internal POR in detail. CLOCK OSCILLATOR The clock source for the ADuC702x can be generated by the internal PLL or by an external clock input. To use the internal PLL, connect a 32.768kHz parallel resonant crystal between Rev. PrB | Page 76 of 80 Preliminary Technical Data ADuC702x Series 3.3V IOVDD 2.5V 1.98V TYP 1.98V TYP LVDD 128ms TYP POR 0.12ms TYP MRST Figure 44:. ADuC7024/ADuC7025 Internal Power-on-Reset operation TYPICAL SYSEM CONFIGURATION A typical ADuC7024/ADuC7025 configuration is shown in Figure 45. It summarizes some of the hardware considerations discussed in the previous paragraphs. Figure 45:. Typical System Configuration Rev. PrB | Page 77 of 80 ADuC702x Series Preliminary Technical Data DEVELOPMENT TOOLS An entry level, low cost development system is available for the ADuC702X family. This system consists of the following PCbased (Windows(R) compatible) hardware and software development tools: Hardware: - ADuC702x Evaluation board - Serial Port programming cable - JTAG emulator Software: - Integrated Development Environment, incorporating assembler, compiler and non intrusive JTAG-based debugger - Serial Downloader software - Example Code Miscellaneous: - CD-ROM Documentation IN-CIRCUIT SERIAL DOWNLOADER The Serial Downloader is a Windows application that allows the user to serially download an assembled program to the onchip program FLASH/EE memory via the serial port on a standard PC. Rev. PrB | Page 78 of 80 Preliminary Technical Data ADuC702x Series OUTLINE DIMENSIONS a 40-Lead Lead Frame Chip Scale Package [LFCSP] 6 x 6 mm Body (CP-40) Dimensions shown in millimeters 6.00 BSC SQ 0.60 MAX PIN 1 INDICATOR 0.60 MAX 31 30 PIN 1 INDICATOR 0.50 BSC 5.75 BSC SQ TOP VIEW 1 4.25 4.10 SQ 3.95 EXPOSED PAD (BOTTOM VIEW) 0.50 0.40 0.30 128MAX 40 10 11 21 20 0.25 MIN 4.50 REF 0.80 MAX 0.65 TYP 0.05 MAX 0.02 NOM 1.00 0.85 0.80 SEATING PLANE 0.30 0.23 0.18 0.20 REF COPLANARITY 0.08 COMPLIANT TO JEDEC STANDARDS MO-220-VJJD-2 Figure 6. 40-Lead Frame Chip Scale Package [LFCSP] (CP-40)--Dimensions shown in millimetres 6 4 -Lead Lead Frame Chip Scale Package [ LFCSP] 9 x 9 mm Body ( CP-6 4 -1 ) Dimensions shown in millimet ers 9 .00 BSC SQ 0 .6 0 MAX 0 .6 0 MAX 0 .3 0 0 .2 5 0 .1 8 64 49 48 1 PIN 1 INDICATOR 8 .7 5 BSC SQ TOP V IEW 1 .0 0 0 .8 5 0 .8 0 16 17 33 32 7 .5 0 REF 0 .8 0 MAX 0 .6 5 TYP 1 2 MAX 4 .8 5 4 .7 0 SQ 4 .5 5 EXPOSED PAD ( BOT TOM VIEW) 0 .4 5 0 .4 0 0 .3 5 PIN 1 INDICATOR 0 .05 MAX 0 .02 NOM 0 .5 0 BSC SEATING PLANE 0 .2 0 REF COMPLIANT TO JEDEC STANDARDS MO-2 2 0 -VMMD Figure 46. 64-Lead Frame Chip Scale Package [LFCSP] (CP-64-1)--Dimensions shown in millimetres Rev. 0 | Page 79 of 80 ADuC702x Series Preliminary Technical Data 0.063 (1.60) MAX 0.006(0.15) 0.002(0.05) 12o TYP 64 49 48 1 SEATING PLANE TOP VIEW 33 32 16 0o 3.5o 3.5o 0.02 (0.50) BSC 0.0087 0.002 (0.22 0.05) 64-Lead LQF Package [LQFP] (S-64)--Dimensions shown in millimetres 0.559 (14.20) 0.543 (13.80) 0.480 (12.20) 0.465 (11.80) 0.063 (1.60) MAX 0.030 (0.75) 0.020 (0.50) 80 1 61 60 0.480 (12.20) 0.465 (11.80) SE AT IN G PL A N E TO P VIE W (PIN S D OW N ) 0.003 (0.08) MAX 0.006 (0.15) 0.002 (0.05) 20 21 0.543 (14.20) 0.543 (13.80) Figure 47. 17 41 40 0.019 (0.50) B SC 0.011 (0.27) 0.007 (0.17) 0.057 (1.45) 0.053 (1.35) Figure 2. 80-Lead LQF Package [LQFP] (S-80)--Dimensions shown in millimetres Rev. PrB | Page 80 of 80 PR04955-0-8/04(PrB) 0.024 0.006 (0.60 0.15) 0.47(12.0) BSC 0.39(10.0) BSC