X24C01M-2,7 - Xicor, Inc.

X24C01

Serial E2PROM

Preliminary Information

DESCRIPTION

The X24C01 is a CMOS 1024 bit serial E2PROM,

internally organized as 128 x 8. The X24C01 features a

serial interface and software protocol allowing operation

on a simple two wire bus.

Xicor E2PROMs are designed and tested for applica-

tions requiring extended endurance. Inherent data re-

tention is greater than 100 years.

FEATURES

•2.7V to 5.5V Power Supply

•Low Power CMOS

—Active Current Less Than 1 mA

—Standby Current Less Than 50 µA

•Internally Organized 128 x 8

•2 Wire Serial Interface

—Bidirectional Data Transfer Protocol

•Four Byte Page Write Mode

•Self Timed Write Cycle

—Typical Write Cycle Time of 5 ms

•High Reliability

—Endurance: 100,000 Cycles

—Data Retention: 100 Years

•8-Pin Mini-DIP, 8-PIN MSOP, and 8-PIN SOIC

Packages

1K X24C01 128 x 8 Bit

3837 FHD F01

FUNCTIONAL DIAGRAM

START

STOP

LOGIC

CONTROL

LOGIC

H.V. GENERATION

TIMING

& CONTROL

WORD

ADDRESS

COUNTER

XDEC

YDEC

DOUT

ACK

PROM

32 X 32

DATA REGISTER

START CYCLE

(8) VCC

R/W

(4) VSS

(5) SDA

(6) SCL

DOUT

LOAD INC

CK 8

3837-1.2 7/28/97 T1/C0/D0 SH

X24C01

VSS

VCC

SCL

SDA

X24C01

PLASTIC

PIN CONFIGURATIONPIN DESCRIPTIONS

Serial Clock (SCL)

The SCL input is used to clock all data into and out of the

device.

Serial Data (SDA)

SDA is a bidirectional pin used to transfer data into and

out of the device. It is an open drain output and may be

wire-ORed with any number of open drain or open

collector outputs.

An open drain output requires the use of a pull-up

resistor. For selecting typical values, refer to the Guide-

lines for Calculating Typical Values of Bus Pull-Up

Resistors graph.

PIN NAMES

Symbol Description

NC No Connect

VSS Ground

VCC Supply Voltage

SDA Serial Data

SCL Serial Clock 3837 PGM T01

A.C. CONDITIONS OF TEST

Input Pulse Levels VCC x 0.1 to VCC x 0.9

Input Rise and

Fall Times 10 ns

Input and Output

Timing Levels VCC x 0.53837 PGM T02

3837 FHD F02

3837 FHD F03

EQUIVALENT A.C. LOAD CIRCUIT

3837 FHD F16

2190Ω

100pF

OUTPUT

DIP

VSS

VCC

SCL

SDA

X24C01

SOIC/MSOP

X24C01

DEVICE OPERATION

The X24C01 supports a bidirectional bus oriented pro-

tocol. The protocol defines any device that sends data

onto the bus as a transmitter and the receiving device as

the receiver. The device controlling the transfer is a

master and the device being controlled is the slave. The

master will always initiate data transfers and provide the

clock for both transmit and receive operations. There-

fore, the X24C01 will be considered a slave in all

applications.

Clock and Data Conventions

Data states on the SDA line can change only during SCL

LOW. SDA state changes during SCL HIGH are re-

served for indicating start and stop conditions. Refer to

Figures 1 and 2.

Start Condition

All commands are preceded by the start condition,

which is a HIGH to LOW transition of SDA when SCL is

HIGH. The X24C01 continuously monitors the SDA and

SCL lines for the start condition and will not respond to

any command until this condition has been met.

Figure 1. Data Validity

SCL

SDA

DATA STABLE DATA

CHANGE

3837 FHD F06

X24C01

Stop Condition

All communications must be terminated by a stop con-

dition, which is a LOW to HIGH transition of SDA when

SCL is HIGH. The stop condition is also used by the

X24C01 to place the device in the standby power mode

after a read sequence. A stop condition can only be

issued after the transmitting device has released the

bus.

Acknowledge

Acknowledge is a software convention used to indicate

successful data transfers. The transmitting device will

release the bus after transmitting eight bits. During the

ninth clock cycle the receiver will pull the SDA line LOW

to acknowledge that it received the eight bits of data.

Refer to Figure 3.

The X24C01 will respond with an acknowledge after

recognition of a start condition, a seven bit word address

and a R/W bit. If a write operation has been selected, the

X24C01 will respond with an acknowledge after each

byte of data is received.

In the read mode the X24C01 will transmit eight bits of

data, release the SDA line and monitor the line for an

acknowledge. If an acknowledge is detected and no

stop condition is generated by the master, the X24C01

will continue to transmit data. If an acknowledge is not

detected, the X24C01 will terminate further data trans-

missions. The master must then issue a stop condition

to return the X24C01 to the standby power mode and

place the device into a known state.

Figure 2. Definition of Start and Stop

3837 FHD F07

Figure 3. Acknowledge Response From Receiver

SCL FROM

MASTER

DATA

OUTPUT

FROM

TRANSMITTER

189

DATA

OUTPUT

FROM

RECEIVER

START ACKNOWLEDGE

3837 FHD F08

SCL

SDA

START CONDITION STOP CONDITION

X24C01

WRITE OPERATIONS

Byte Write

To initiate a write operation, the master sends a start

condition followed by a seven bit word address and a write

bit. The X24C01 responds with an acknowledge, then

waits for eight bits of data and then responds with an

acknowledge. The master then terminates the transfer by

generating a stop condition, at which time the X24C01

begins the internal write cycle to the nonvolatile memory.

While the internal write cycle is in progress, the X24C01

inputs are disabled, and the device will not respond to any

requests from the master. Refer to Figure 4 for the

address, acknowledge and data transfer sequence.

Page Write

The most significant five bits of the word address define

the page address. The X24C01 is capable of a four byte

page write operation. It is initiated in the same manner as

the byte write operation, but instead of terminating the

transfer of data after the first data byte, the master can

transmit up to three more bytes. After the receipt of each

data byte, the X24C01 will respond with an acknowledge.

After the receipt of each data byte, the two low order

address bits are internally incremented by one. The high

order five bits of the address remain constant. If the

master should transmit more than four data bytes prior

to generating the stop condition, the address counter will

“roll over” and the previously transmitted data will be

overwritten. As with the byte write operation, all inputs

are disabled until completion of the internal write cycle.

Refer to Figure 5 for the address, acknowledge and data

transfer sequence.

Figure 4. Byte Write

BUS ACTIVITY:

SDA LINE

BUS ACTIVITY:

X24C01

WORD

ADDRESS (n) S

DATA n

3837 FHD F09

Figure 5. Page Write

BUS ACTIVITY:

SDA LINE

BUS ACTIVITY:

X24C01

WORD

ADDRESS (n) DATA n DATA n+1 DATA n+3

B3837 FHD F10

X24C01

Figure 6. ACK Polling SequenceAcknowledge Polling

The disabling of the inputs can be used to take advan-

tage of the typical 5 ms write cycle time. Once the stop

condition is issued to indicate the end of the host’s write

operation the X24C01 initiates the internal write cycle.

ACK polling can be initiated immediately. This involves

issuing the start condition followed by the word address

for a write operation. If the X24C01 is still busy with the

write operation no ACK will be returned. If the X24C01

has completed the write operation an ACK will be

returned and the controller can then proceed with the

next read or write operation.

READ OPERATIONS

Read operations are initiated in the same manner as

write operations with exception that the R/W bit of the

word address is set to a one. There are two basic read

operations: byte read and sequential read.

It should be noted that the ninth clock cycle of the read

operation is not a “don’t care.” To terminate a read

operation, the master must either issue a stop condition

during the ninth cycle or hold SDA HIGH during the ninth

clock cycle and then issue a stop condition.

Byte Read

To initiate a read operation, the master sends a start

condition followed by a seven bit word address and a

read bit. The X24C01 responds with an acknowledge

and then transmits the eight bits of data. The read

operation is terminated by the master; by not responding

with an acknowledge and by issuing a stop condition.

Refer to Figure 7 for the start, word address, read bit,

acknowledge and data transfer sequence.

WRITE OPERATION

COMPLETED

ENTER ACK POLLING

ISSUE

START

ISSUE SLAVE

ADDRESS AND R/W = 0

ACK

RETURNED?

OPERATION

A WRITE?

PROCEED

ISSUE STOP

YES

PROCEED

ISSUE STOP

3837 FHD F11

Figure 7. Byte Read

3837 FHD F12

BUS ACTIVITY:

MASTER

SDA LINE

BUS ACTIVITY:

X24C01

WORD

ADDRESS n S

KDATA n

X24C01

Sequential Read

Sequential read is initiated in the same manner as the

byte read. The first data byte is transmitted as with the

byte read mode, however, the master now responds

with an acknowledge, indicating it requires additional

data. The X24C01 continues to output data for each

acknowledge received. The read operation is termi-

nated by the master; by not responding with an acknowl-

edge and by issuing a stop condition.

The data output is sequential, with the data from address

n followed by the data from n + 1. The address counter

for read operations increments all address bits, allowing

the entire memory contents to be serially read during

one operation. At the end of the address space (address

127) the counter “rolls over” to zero and the X24C01

continues to output data for each acknowledge re-

ceived. Refer to Figure 8 for the address, acknowledge

and data transfer sequence.

Figure 8. Sequential Read

3837 FHD F13

Figure 9. Typical System Configuration

MASTER

TRANSMITTER/

RECEIVER

SLAVE

RECEIVER

SLAVE

TRANSMITTER/

RECEIVER

MASTER

TRANSMITTER

MASTER

TRANSMITTER/

RECEIVER

PULL-UP

RESISTORS

SDA

SCL

VCC

3837 FHD F14

BUS ACTIVITY:

SDA LINE

BUS ACTIVITY:

X24C01

ADDRESS

DATA n+x

DATA n

DATA n+1

DATA n+2

X24C01

Supply Voltage Limits

X24C01 4.5V to 5.5V

X24C01-3.5 3.5V to 5.5V

X24C01-3 3.0V to 5.5V

X24C01-2.7 2.7V to 5.5V

ABSOLUTE MAXIMUM RATINGS*

Temperature Under Bias.................. –65°C to +135°C

Storage Temperature ....................... –65°C to +150°C

Voltage on any Pin with

Respect to VSS ............................ –1.0V to +7.0V

D.C. Output Current ............................................5 mA

Lead Temperature

(Soldering, 10 Seconds) ............................. 300°C

*COMMENT

Stresses above those listed under “Absolute Maximum

Ratings” may cause permanent damage to the device.

This is a stress rating only and the functional operation of

the device at these or any other conditions above those

indicated in the operational sections of this specification is

not implied. Exposure to absolute maximum rating condi-

tions for extended periods may affect device reliability.

RECOMMENDED OPERATING CONDITIONS

Temperature Min. Max.

Commercial 0°C70°C

Industrial –40°C +85°C

Military –55°C +125°C

D.C. OPERATING CHARACTERISTICS (Over recommended operating conditions, unless otherwise specified)

Limits

Symbol Parameter Min. Max. Units Test Conditions

ICC(1) VCC Supply Current (Read) 1 mA SCL = VCC x 0.1/VCC x 0.9 Levels

ICC(2) VCC Supply Current (Write) 2 @ 100 KHz, SDA = Open

ISB1(1) VCC Standby Current 100 µA SCL = SDA = VCC,

VCC = 5V ± 10%

ISB2(1) VCC Standby Current 50 µA SCL = SDA = VCC, VCC = 2.7V

ILI Input Leakage Current 10 µAV

IN = GND to VCC

ILO Output Leakage Current 10 µAV

OUT = GND to VCC

VlL(2) Input Low Voltage –1.0 VCC x 0.3 V

VIH(2) Input High Voltage VCC x 0.7 VCC + 0.5 V

VOL Output Low Voltage 0.4 V IOL = 2.1 mA 3837 PGM T03

CAPACITANCE TA = 25°C, f = 1.0 MHz, VCC = 5V

Symbol Parameter Max. Units Test Conditions

CI/O(3) Input/Output Capacitance (SDA) 8 pF VI/O = 0V

CIN(3) Input Capacitance (SCL) 6 pF VIN = 0V3837 PGM T05

Notes: (1) Must perform a stop command prior to measurement.

(2) VIL min. and VIH max. are for reference only and are not tested.

(3) This parameter is periodically sampled and not 100% tested.

X24C01

A.C. CHARACTERISTICS (Over recommended operating conditions, unless otherwise specified)

Read & Write Cycle Limits

Symbol Parameter Min. Max. Units

fSCL SCL Clock Frequency 0 100 KHz

TINoise Suppression Time 100 ns

Constant at SCL, SDA Inputs

tAA SCL Low to SDA Data Out Valid 0.3 3.5 µs

tBUF Time the Bus Must Be Free Before a 4.7 µs

New Transmission Can Start

tHD:STA Start Condition Hold Time 4.0 µs

tLOW Clock Low Period 4.7 µs

tHIGH Clock High Period 4.0 µs

tSU:STA Start Condition Setup Time 4.7 µs

tHD:DAT Data In Hold Time 0 µs

tSU:DAT Data In Setup Time 250 ns

tRSDA and SCL Rise Time 1 µs

tFSDA and SCL Fall Time 300 ns

tSU:STO Stop Condition Setup Time 4.7 µs

tDH Data Out Hold Time 300 ns

3837 PGM T06

POWER-UP TIMING

Symbol Parameter Max. Units

tPUR(4) Power-up to Read Operation 1 ms

tPUW(4) Power-up to Write Operation 5 ms 3837 PGM T07

Bus Timing

tSU:STA tHD:STA tHD:DAT tSU:DAT

tLOW

tSU:STO

tBUF

SCL

SDA IN

SDA OUT

tDH

tAA

tFtHIGH

3837 FHD F04

Note: (4) tPUR and tPUW are the delays required from the time VCC is stable until the specified operation can be initiated. These parameters

are periodically sampled and not 100% tested.

X24C01

WRITE CYCLE LIMITS

Symbol Parameter Min. Typ.(5) Max. Units

tWR(6) Write Cycle Time 5 10 ms

3837 PGM T08

The write cycle time is the time from a valid stop

condition of a write sequence to the end of the internal

erase/program cycle. During the write cycle, the X24C01

Write Cycle Timing

bus interface circuits are disabled, SDA is allowed to

remain high, and the device does not respond to its word

address.

SDA 8th BIT

WORD n

ACK

tWR

STOP

CONDITION START

CONDITION X24C01

ADDRESS

SCL

3837 FHD F05

Guidelines for Calculating Typical Values of

Bus Pull-Up Resistors SYMBOL TABLE

Must be

steady Will be

steady

May change

from Low to

High

Will change

from Low to

High

May change

from High to

Low

Will change

from High to

Low

Don’t Care:

Changes

Allowed

Changing:

State Not

Known

N/A Center Line

is High

Impedance

OUTPUTSINPUTSWAVEFORM

3837 FHD F15

120

100

20 40 60 80 100 120

RESISTANCE (KΩ)

BUS CAPACITANCE (pF)

MIN.

RESISTANCE

MAX.

RESISTANCE

RMAX = CBUS

RMIN = IOL MIN

VCC MAX =2.6KΩ

Notes: (5) Typical values are for TA = 25°C and nominal supply voltage (5V).

(6) tWR is the minimum cycle time to be allowed from the system perspective unless polling techniques are used. It is the maximum

time the device requires to automatically complete the internal write operation.

X24C01

0.020 (0.51)

0.016 (0.41)

0.150 (3.81)

0.125 (3.18)

0.325 (8.25)

0.300 (7.62)

0.110 (2.79)

0.090 (2.29)

0.430 (10.92)

0.360 (9.14)

0.300

(7.62) REF.

PIN 1 INDEX

0.140 (3.56)

0.130 (3.30)

0.020 (0.51)

0.015 (0.38)

PIN 1

SEATING

PLANE

0.062 (1.57)

0.058 (1.47)

0.255 (6.47)

0.245 (6.22)

0.060 (1.52)

0.020 (0.51)

TYP. 0.010 (0.25)

0°

15°

0.092 (2.34)

DIA. NOM.

HALF SHOULDER WIDTH ON

ALL END PINS OPTIONAL

0.015 (0.38)

MAX.

PACKAGING INFORMATION

8-LEAD PLASTIC IN-LINE PACKAGE TYPE P

NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)

X24C01

PACKAGING INFORMATION

0.150 (3.80)

0.158 (4.00) 0.228 (5.80)

0.244 (6.20)

0.014 (0.35)

0.019 (0.49)

PIN 1

PIN 1 INDEX

0.010 (0.25)

0.020 (0.50)

0.050 (1.27)

0.188 (4.78)

0.197 (5.00)

0.004 (0.19)

0.010 (0.25)

0.053 (1.35)

0.069 (1.75)

(4X) 7°

0.027 (0.683)

0.037 (0.937)

0.0075 (0.19)

0.010 (0.25)

0° – 8°

X 45°

3926 FHD F22

8-LEAD PLASTIC SMALL OUTLINE GULL WING PACKAGE TYPE S

NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESIS IN MILLIMETERS)

X24C01

0.118 ± 0.002

(3.00 ± 0.05)

0.040 ± 0.002

(1.02 ± 0.05)

0.150 (3.81)

REF.

0.193 (4.90)

REF.

0.030 (0.76)

0.036 (0.91)

0.032 (0.81)

0.007 (0.18)

0.005 (0.13)

0.008 (0.20)

0.004 (0.10)

0.0216 (0.55)

7° TYP

R 0.014 (0.36)

0.118 ± 0.002

(3.00 ± 0.05)

0.012 + 0.006 / -0.002

(0.30 + 0.15 / -0.05) 0.0256 (0.65) TYP

8-LEAD MINIATURE SMALL OUTLINE GULL WING PACKAGE TYPE M

NOTE:

1. ALL DIMENSIONS IN INCHES AND (MILLIMETERS)

3003 ILL 01

PACKAGING INFORMATION

X24C01

LIMITED WARRANTY

Devices sold by Xicor, Inc. are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. Xicor, Inc. makes no warranty,

express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement.

Xicor, Inc. makes no warranty of merchantability or fitness for any purpose. Xicor, Inc. reserves the right to discontinue production and change specifications and

prices at any time and without notice.

Xicor, Inc. assumes no responsibility for the use of any circuitry other than circuitry embodied in a Xicor, Inc. product. No other circuits, patents, licenses are

implied.

U.S. PATENTS

Xicor products are covered by one or more of the following U.S. Patents: 4,263,664; 4,274,012; 4,300,212; 4,314,265; 4,326,134; 4,393,481; 4,404,475;

4,450,402; 4,486,769; 4,488,060; 4,520,461; 4,533,846; 4,599,706; 4,617,652; 4,668,932; 4,752,912; 4,829, 482; 4,874, 967; 4,883, 976. Foreign patents and

additional patents pending.

LIFE RELATED POLICY

In situations where semiconductor component failure may endanger life, system designers using this product should design the system with appropriate error

detection and correction, redundancy and back-up features to prevent such an occurence.

Xicor's products are not authorized for use in critical components in life support devices or systems.

1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose

failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant

injury to the user.

2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life

support device or system, or to affect its safety or effectiveness.

Device

ORDERING INFORMATION

VCC Limits

Blank = 4.5V to 5.5V

3.5 = 3.5V to 5.5V

3 = 3.0V to 5.5V

2.7 = 2.7V to 5.5V

Temperature Range

Blank = Commercial = 0°C to +70°C

I = Industrial = –40°C to +85°C

M = Military = –55°C to +125°C

Package

P = 8-Lead Plastic DIP

S = 8-Lead SOIC

M = 8-Lead MSOP

X24C01 X X -X

X24C01 X

Blank = 8-Lead SOIC

P = 8-Lead Plastic DIP

M = 8-Lead MSOP

Blank = 4.5V to 5.5V, 0°C to +70°C

F = 2.7V to 5.5V, 0°C to +70°C

G = 2.7V to 5.5V, –40°C to +85°C

I = 4.5V to 5.5V, –40°C to +85°C

B = 3.5V to 5.5V, 0°C to +70°C

C = 3.5V to 5.5V, –40°C to +85°C

D = 3.0V to 5.5V, 0°C to +70°C

E = 3.0V to 5.5V, –40°C to +85°C

M = 4.5V to 5.5V, –55°C to +125°C

Part Mark Convention