All specification & dimensions are subject to change, please call your nearest Foxconn sales representative for update information.
SPECIFICATIONS FBD DDR II Connector
AT 540 Series
Vertical Type, T/H Type
1.00mm [.039”] Pitch
240 Pos.
Mechanical
Contact Retention Force: 0.75Lbs (0.34kgf) min. per Contact
Durability: 25 Cycles
Dram Board Insertion Force: 3 oz max. per Contact
Electrical
Voltage Rating: 250V AC
Current Rating: 0.5A max., 30
℃
max., in Temperature Rise
Insulation Resistance: 1000MΩ min. initial
Dielectric Withstanding Voltage: 500V DC at Sea Level
Low Level Contact Resistance: 30mΩ max. initial
Physical
Housing: Thermoplastic, UL 94V-0 rated in Black Color
Contact: Copper alloy
Ejector: Thermoplastic, UL 94V-0 rated in Black Color
Metal Hold Down: Copper alloy
Operating Temperature: -55
℃
to +105
℃
DRAWING
ORDERING INFORMATION
PRODUCT NO.: A T 5 4 0 * * - H 3 D M - * *
Contact Area Plating
1=Gold Flash
Vertrical
FBD DDR II DIMM
1=2.67 [.105]
0=3.18 [.124]
Tail Length
1.00mm Pitch
40=240 Pos.
No. of Pos.
Memory Socket 4F=LEAD FREE
Extension Code
PLATING TYPE
3=30u" Gold
7=15u" Gold
