B
BR
RI
IG
GH
HT
T
L
LE
ED
D
E
EL
LE
EC
CT
TR
RO
ON
NI
IC
CS
S
C
CO
OR
RP
P.
.
B
BL
L-
-C
C2
21
13
31
1A
A-
-1
1
Ver.1.0 Page: 1 of 2
SINCE 1981
2.54(.10)
NOM.
1.0(.039) MIN.
4.9(.193)
0.5(.02)
SQ. TYP.
1.5(.059)
MAX.
6.8(.267)
25.4(1.00) MIN.
Cathode
5.0(.197)
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25mm (0.01”) unless otherwise specified.
3. Lead spacing is measured where the leads emerge from
the package.
4. Specifications are subject to change without notice.
● Features: ● Package dimensions:
1. Chip material: GaP/GaP
2. Emitted color : Green
3. Lens Appearance : Green Diffused
4. Cylindrical shape.
5. Low power consumption.
6. Compatible
7. Long life solid state reliability.
8. This product don’t contained restriction
substance, compliance ROHS standard.
● Applications:
1. TV set
2. Monitor
3. Telephone
4. Computer
5. Circuit board
● Absolute Maximum Ratings(Ta=25℃)
Parameter Symbol Rating Unit
Power Dissipation Pd 80 mW
Forward Current IF 30 mA
Peak Forward Current*1 I
FP 150 mA
Reverse Voltage V
R 5 V
Operating Temperature Topr -40℃~80℃
Storage Temperature Tstg -40℃~85℃
Soldering Temperature Tsol 260℃(for 5 seconds)
*1Condition for IFP is pulse of 1/10 duty and 0.1msec width.
1.1