CD74HC30ME4 - Texas Instruments

Data sheet acquired from Harris Semiconductor

SCHS121D

Features

• Buffered Inputs

• Typical Propagation Delay: 10ns at VCC = 5V,

CL = 15pF, TA = 25oC

• Fanout (Over Temperature Range)

- Standard Outputs. . . . . . . . . . . . . . . 10 LSTTL Loads

- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads

• Wide Operating T emperature Range . . . -55oC to 125oC

• Balanced Propagation Delay and Transition Times

• Signiﬁcant Power Reduction Compared to LSTTL

Logic ICs

• HC Types

- 2V to 6V Operation

- High Noise Immunity: NIL = 30%, NIH = 30% of VCC

at VCC = 5V

• HCT Types

- 4.5V to 5.5V Operation

- Direct LSTTL Input Logic Compatibility,

VIL= 0.8V (Max), VIH = 2V (Min)

- CMOS Input Compatibility, Il≤1µA at VOL, VOH

Pinout

CD54HC30, CD54HCT30 (CERDIP)

CD74HC30 (PDIP, SOIC, SOP, TSSOP)

CD74HCT30 (PDIP, SOIC)

TOP VIEW

Description

The ’HC30 and ’HCT30 each contain an 8-input NAND gate

in one package. They provide the system designer with the

direct implementation of the positive logic 8-input NAND

function. Logic gates utilize silicon gate CMOS technology to

achieve operating speeds similar to LSTTL gates with the

low power consumption of standard CMOS integrated cir-

cuits. All devices have the ability to drive 10 LSTTL loads.

The HCT logic family is functionally pin compatible with the

standard LS logic family.

GND

Ordering Information

PART NUMBER TEMP. RANGE

(oC) PACKAGE

CD54HC30F3A -55 to 125 14 Ld CERDIP

CD54HCT30F3A -55 to 125 14 Ld CERDIP

CD74HC30E -55 to 125 14 Ld PDIP

CD74HC30M -55 to 125 14 Ld SOIC

CD74HC30MT -55 to 125 14 Ld SOIC

CD74HC30M96 -55 to 125 14 Ld SOIC

CD74HC30NSR -55 to 125 14 Ld SOP

CD74HC30PW -55 to 125 14 Ld TSSOP

CD74HC30PWR -55 to 125 14 Ld TSSOP

CD74HC30PWT -55 to 125 14 Ld TSSOP

CD74HCT30E -55 to 125 14 Ld PDIP

CD74HCT30M -55 to 125 14 Ld SOIC

CD74HCT30MT -55 to 125 14 Ld SOIC

CD74HCT30M96 -55 to 125 14 Ld SOIC

NOTE: When ordering, use the entire part number. The sufﬁxes 96

and R denote tape and reel. The sufﬁx T denotes a small-quantity

reel of 250.

CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.

CD54/74HC30,

CD54/74HCT30

High Speed CMOS Logic

8-Input NAND Gate

[

/Title

(

CD54H

30,

D74H

30,

D74H

T30)

Subject

(

High

peed

MOS

ogic 8-

August 1997 - Revised September 2003

Functional Diagram

Logic Symbol

TRUTH TABLE

INPUTS

OUTPUTABCDEFGH

LXXXXXXX H

XLXXXXXX H

XXLXXXXX H

XXXLXXXX H

XXXXLXXX H

XXXXXLXX H

XXXXXXLX H

XXXXXXXL H

HHHHHHHH L

NOTE: H = HIGH Voltage Level, L = LOW Voltage Level, X = Irrelevant

Y = ABCDEFGH

CD54/74HC30, CD54/74HCT30

Absolute Maximum Ratings Thermal Information

DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V

DC Input Diode Current, IIK

For VI < -0.5V or VI > VCC + 0.5V. . . . . . . . . . . . . . . . . . . . . .±20mA

DC Output Diode Current, IOK

For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA

DC Output Source or Sink Current per Output Pin, IO

For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA

DC VCC or Ground Current, ICC or IGND . . . . . . . . . . . . . . . . . .±50mA

Operating Conditions

Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC

Supply Voltage Range, VCC

HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V

HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V

DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC

Input Rise and Fall Time

2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)

4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)

6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)

Package Thermal Impedance, θJA (see Note 1)

E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .80oC/W

M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .86oC/W

NS (SOP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .76oC/W

PW (TSSOP) Package. . . . . . . . . . . . . . . . . . . . . . . . . .113oC/W

Maximum Junction Temperature (Hermetic Pac kage or Die) . . . 175oC

Maximum Junction Temperature (Plastic Package) . . . . . . . . 150oC

Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC

Maximum Lead Temperature (Soldering 10s). . . . . . . . . . . . . 300oC

(SOIC - Lead Tips Only)

CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation

of the device at these or any other conditions above those indicated in the operational sections of this speciﬁcation is not implied.

NOTE:

1. The package thermal impedance is calculated in accordance with JESD 51-7.

DC Electrical Speciﬁcations

PARAMETER SYMBOL

TEST

CONDITIONS

VCC (V)

25oC -40oC TO +85oC -55oC TO 125oC

UNITSVI(V) IO(mA) MIN TYP MAX MIN MAX MIN MAX

HC TYPES

High Level Input

Voltage VIH - - 2 1.5 - - 1.5 - 1.5 - V

4.5 3.15 - - 3.15 - 3.15 - V

6 4.2 - - 4.2 - 4.2 - V

Low Level Input

Voltage VIL - - 2 - - 0.5 - 0.5 - 0.5 V

4.5 - - 1.35 - 1.35 - 1.35 V

6 - - 1.8 - 1.8 - 1.8 V

High Level Output

Voltage

CMOS Loads

VOH VIH or

VIL -0.02 2 1.9 - - 1.9 - 1.9 - V

-0.02 4.5 4.4 - - 4.4 - 4.4 - V

-0.02 6 5.9 - - 5.9 - 5.9 - V

High Level Output

Voltage

TTL Loads

---------V

-4 4.5 3.98 - - 3.84 - 3.7 - V

-5.2 6 5.48 - - 5.34 - 5.2 - V

Low Level Output

Voltage

CMOS Loads

VOL VIH or

VIL 0.02 2 - - 0.1 - 0.1 - 0.1 V

0.02 4.5 - - 0.1 - 0.1 - 0.1 V

0.02 6 - - 0.1 - 0.1 - 0.1 V

Low Level Output

Voltage

TTL Loads

---------V

4 4.5 - - 0.26 - 0.33 - 0.4 V

5.2 6 - - 0.26 - 0.33 - 0.4 V

Input Leakage

Current IIVCC or

GND -6--±0.1 - ±1-±1µA

CD54/74HC30, CD54/74HCT30

Quiescent Device

Current ICC VCC or

GND 0 6 - - 2 - 20 - 40 µA

HCT TYPES

High Level Input

Voltage VIH - - 4.5 to

5.5 2-- 2 - 2 - V

Low Level Input

Voltage VIL - - 4.5 to

5.5 - - 0.8 - 0.8 - 0.8 V

High Level Output

Voltage

CMOS Loads

VOH VIH or

VIL -0.02 4.5 4.4 - - 4.4 - 4.4 - V

High Level Output

Voltage

TTL Loads

-4 4.5 3.98 - - 3.84 - 3.7 - V

Low Level Output

Voltage

CMOS Loads

VOL VIH or

VIL -0.02 4.5 - - 0.1 - 0.1 - 0.1 V

Low Level Output

Voltage

TTL Loads

4 4.5 - - 0.26 - 0.33 - 0.4 V

Input Leakage

Current IIVCC

and

GND

- 5.5 - ±0.1 - ±1-±1µA

Quiescent Device

Current ICC VCC or

GND 0 5.5 - - 2 - 20 - 40 µA

Additional Quiescent

Device Current Per

Input Pin: 1 Unit Load

(Note 2)

∆ICC VCC

-2.1 - 4.5 to

5.5 - 100 360 - 450 - 490 µA

NOTE:

2. For dual-supply systems theoretical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA.

DC Electrical Speciﬁcations (Continued)

PARAMETER SYMBOL

TEST

CONDITIONS

VCC (V)

25oC -40oC TO +85oC -55oC TO 125oC

UNITSVI(V) IO(mA) MIN TYP MAX MIN MAX MIN MAX

HCT Input Loading Table

INPUT UNIT LOADS

All 0.6

NOTE: Unit Load is ∆ICC limit speciﬁed in DC Electrical

Speciﬁcations table, e.g. 360µA max at 25oC.

Switching Speciﬁcations Input tr, tf = 6ns

PARAMETER SYMBOL TEST

CONDITIONS VCC

(V)

25oC -40oC TO 85oC -55oC TO 125oC

UNITSMIN TYP MAX MIN MAX MIN MAX

HC TYPES

Propagation Delay, Input to

Output (Figure 1) tPLH, tPHL CL= 50pF 2 - - 130 - 165 - 195 ns

4.5 - - 26 - 33 - 39 ns

6 - - 22 - 28 - 33 ns

PropagationDelay,DataInputto

Output Y tPLH, tPHL CL= 15pF 5 - 10 - ----ns

CD54/74HC30, CD54/74HCT30

Transition Times (Figure 1) tTLH, tTHL CL= 50pF 2 - - 75 - 95 - 110 ns

4.5 - - 15 - 19 - 22 ns

6 - - 13 - 16 - 19 ns

Input Capacitance CI- - - - 10 - 10 - 10 pF

Power Dissipation Capacitance

(Notes 3, 4) CPD - 5-25-----pF

HCT TYPES

Propagation Delay, Input to

Output (Figure 2) tRHL, tPHL CL= 50pF 4.5 - - 28 - 35 - 42 ns

PropagationDelay,DataInputto

Output Y tPLH, tPHL CL= 15pF 5 - 11 - ----ns

Transition Times (Figure 2) tTLH, tTHL CL= 50pF 4.5 - - 15 - 19 - 22 ns

Input Capacitance CI- - - - 10 - 10 - 10 pF

Power Dissipation Capacitance

(Notes 3, 4) CPD - 5-26-----pF

NOTES:

3. CPD is used to determine the dynamic power consumption, per gate.

4. PD = VCC2 fi (CPD + CL) where fi = Input Frequency, CL = Output Load Capacitance, VCC = Supply Voltage.

Switching Speciﬁcations Input tr, tf = 6ns (Continued)

PARAMETER SYMBOL TEST

CONDITIONS VCC

(V)

25oC -40oC TO 85oC -55oC TO 125oC

UNITSMIN TYP MAX MIN MAX MIN MAX

Test Circuits and Waveforms

FIGURE 1. HC AND HCU TRANSITION TIMES AND PROPAGA-

TION DELAY TIMES, COMBINATION LOGIC FIGURE 2. HCT TRANSITION TIMES AND PROPAGATION

DELAY TIMES, COMBINATION LOGIC

tPHL tPLH

tTHL tTLH

90%

50%

10%

50%

10%

INVERTING

OUTPUT

INPUT

GND

VCC

tr = 6ns tf = 6ns

90%

tPHL tPLH

tTHL tTLH

2.7V

1.3V

0.3V

1.3V

10%

INVERTING

OUTPUT

INPUT

GND

tr = 6ns tf = 6ns

90%

CD54/74HC30, CD54/74HCT30

PACKAGE OPTION ADDENDUM

www.ti.com 5-Sep-2011

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status (1) Package Type Package

Drawing Pins Package Qty Eco Plan (2) Lead/

Ball Finish MSL Peak Temp (3) Samples

(Requires Login)

5962-8974601CA ACTIVE CDIP J 14 1 TBD Call TI Call TI

8404001CA ACTIVE CDIP J 14 1 TBD Call TI Call TI

CD54HC30F ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type

CD54HC30F3A ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type

CD54HCT30F3A ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type

CD74HC30E ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type

CD74HC30EE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type

CD74HC30M ACTIVE SOIC D 14 50 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

CD74HC30M96 ACTIVE SOIC D 14 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

CD74HC30M96E4 ACTIVE SOIC D 14 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

CD74HC30M96G4 ACTIVE SOIC D 14 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

CD74HC30ME4 ACTIVE SOIC D 14 50 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

CD74HC30MG4 ACTIVE SOIC D 14 50 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

CD74HC30MT ACTIVE SOIC D 14 250 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

CD74HC30MTE4 ACTIVE SOIC D 14 250 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

CD74HC30MTG4 ACTIVE SOIC D 14 250 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

CD74HC30NSR ACTIVE SO NS 14 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

CD74HC30NSRE4 ACTIVE SO NS 14 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

CD74HC30NSRG4 ACTIVE SO NS 14 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

CD74HC30PW ACTIVE TSSOP PW 14 90 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

PACKAGE OPTION ADDENDUM

www.ti.com 5-Sep-2011

Addendum-Page 2

Orderable Device Status (1) Package Type Package

Drawing Pins Package Qty Eco Plan (2) Lead/

Ball Finish MSL Peak Temp (3) Samples

(Requires Login)

CD74HC30PWE4 ACTIVE TSSOP PW 14 90 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

CD74HC30PWG4 ACTIVE TSSOP PW 14 90 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

CD74HC30PWR ACTIVE TSSOP PW 14 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

CD74HC30PWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

CD74HC30PWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

CD74HC30PWT ACTIVE TSSOP PW 14 250 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

CD74HC30PWTE4 ACTIVE TSSOP PW 14 250 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

CD74HC30PWTG4 ACTIVE TSSOP PW 14 250 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

CD74HCT30E ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type

CD74HCT30EE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type

CD74HCT30M ACTIVE SOIC D 14 50 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

CD74HCT30M96 ACTIVE SOIC D 14 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

CD74HCT30M96E4 ACTIVE SOIC D 14 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

CD74HCT30M96G4 ACTIVE SOIC D 14 2500 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

CD74HCT30ME4 ACTIVE SOIC D 14 50 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

CD74HCT30MG4 ACTIVE SOIC D 14 50 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

CD74HCT30MT ACTIVE SOIC D 14 250 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

CD74HCT30MTE4 ACTIVE SOIC D 14 250 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

CD74HCT30MTG4 ACTIVE SOIC D 14 250 Green (RoHS

& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM

PACKAGE OPTION ADDENDUM

www.ti.com 5-Sep-2011

Addendum-Page 3

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF CD54HC30, CD54HCT30, CD74HC30, CD74HCT30 :

•Catalog: CD74HC30, CD74HCT30

•Military: CD54HC30, CD54HCT30

NOTE: Qualified Version Definitions:

•Catalog - TI's standard catalog product

•Military - QML certified for Military and Defense Applications

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

CD74HC30M96 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1

CD74HC30MT SOIC D 14 250 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1

CD74HC30NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1

CD74HC30PWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1

CD74HC30PWT TSSOP PW 14 250 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1

CD74HCT30M96 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1

CD74HCT30MT SOIC D 14 250 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 14-Jul-2012

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

CD74HC30M96 SOIC D 14 2500 367.0 367.0 38.0

CD74HC30MT SOIC D 14 250 367.0 367.0 38.0

CD74HC30NSR SO NS 14 2000 367.0 367.0 38.0

CD74HC30PWR TSSOP PW 14 2000 367.0 367.0 35.0

CD74HC30PWT TSSOP PW 14 250 367.0 367.0 35.0

CD74HCT30M96 SOIC D 14 2500 367.0 367.0 38.0

CD74HCT30MT SOIC D 14 250 367.0 367.0 38.0

PACKAGE MATERIALS INFORMATION

www.ti.com 14-Jul-2012

Pack Materials-Page 2

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