www.element14.com
www.farnell.com
www.newark.com
Page <1> V1.026/02/13
Surface Mount
Zener Diode
Features:
• Planar Die Construction
• 500mW Power Dissipation
• General Purpose, Medium Current
• Ideally Suited For Automated Assembly Processes
Applications:
• Zener diode
• Ultra-small surface mount package
Maximum Rating @ Ta = 25°C unless otherwise specied
Characteristic Symbol Value Unit
Forward voltage @ IF = 10mA VF0.9 V
Power dissipation PD500 mW
Thermal resistance, junction to ambient air RθjA 350 °C/W
Junction temperature Tj150 °C
Storage temperature range Tstg -65 to +150 °C
Note : Device mounted on ceramic PCB; 7.6mm × 9.4mm × 0.87mm with pad areas 25mm2.
Tested with pulses, Tp ≤ 1ms.
Electrical Characteristics @ Ta = 25°C unless otherwise specied
Type Number Type
Code
Zener Voltage Range Test
Current
Maximum Zener
Impedance
Maximum Reverse
Leakage Current
Vz@IZT IZT ZZT@IZT ZZK@IZK = 0.25mA IR@VR
Nom(V) Min(V) Max(V) mA Ω μA V
MMSZ5234B E4 6.2 5.89 6.51 20 7 1,000 5 4