SPECIFICATION
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Supplier : Samsung electro-mechanics •
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Samsung P/N : CL31C330JIFNNNF
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Product : Multi-layer Ceramic Capacitor •
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Description : CAP, 33㎊
㎊㎊
㎊, 1000V, ±5%, C0G, 1206
CL 31 C 330 J I F N N N F
①
①①
① ②
②②
② ③
③③
③ ④
④④
④ ⑤
⑤⑤
⑤ ⑥
⑥⑥
⑥ ⑦
⑦⑦
⑦ ⑧
⑧⑧
⑧ ⑨
⑨⑨
⑨ ⑩
⑩⑩
⑩ ⑪
⑪⑪
⑪
①
①①
①Series Samsung Multi-layer Ceramic Capacitor
②
②②
②Size 1206 (inch code) L: 3.2 ± 0.15 mm W: ± 0.15 mm
③
③③
③Dielectric C0G ⑧
⑧⑧
⑧Inner electrode
④
④④
④Capacitance 33 ㎊Termination
⑤
⑤⑤
⑤Capacitance ±5 %Plating (Pb Free)
tolerance ⑨
⑨⑨
⑨Product Normal
⑥
⑥⑥
⑥Rated Voltage 1000 V ⑩
⑩⑩
⑩Special Reserved for future use
⑦
⑦⑦
⑦Thickness 1.25 ± 0.15 mm ⑪
⑪⑪
⑪Packaging Embossed Type, 13" reel
B. Samsung Reliablility Test and Judgement condition
Capacitance Within specified tolerance 1㎒±10% 0.5~5Vrms
Q1000 min
Insulation 10,000Mohm or 500Mohm⋅㎌500±50 Vdc 60~120 sec.
Resistance Whichever is Smaller
Appearance No abnormal exterior appearance Microscope (×10)
Withstanding No dielectric breakdown or of the rated voltage
Voltage mechanical breakdown
Temperature C0G
Characterisitcs (From -55℃ to 125℃, Capacitance change shoud be within ±30PPM/℃)
Adhesive Strength No peeling shall be occur on the 500g⋅F, for 10±1 sec.
of Termination terminal electrode
Bending Strength Capacitance change : Bending to the limit (1mm)
within ±5% or ±0.5㎊ whichever is larger with 1.0mm/sec.
Solderability More than 75% of terminal surface SnAg3.0Cu0.5 solder
is to be soldered newly 245±5℃, 3±0.3sec.
(preheating : 80~120℃ for 10~30sec.)
Resistance to Capacitance change : Solder pot : 270±5℃, 10±1sec.
Soldering heat within ±2.5% or ±0.25㎊ whichever is larger
Tan δ, IR : initial spec.
Performance Test condition
Sn 100%
Cu
Ni
1.6
120%
A. Samsung Part Number
Vibration Test Capacitance change : Amplitude : 1.5mm
within ±2.5% or ±0.25㎊ whichever is larger From 10㎐ to 55㎐ (return : 1min.)
Tan δ, IR : initial spec. 2hours × 3 direction (x, y, z)
High Temperature Capacitance change :
With
of the rated voltage
Resistance within ±3% or ±0.3㎊ whichever is larger Max. operating temperature
Q : 350 min 1000+48/-0hrs
IR : 1000Mohm or 50Mohm ⋅ ㎌
Temperature Capacitance change : 1 cycle condition
Cycling within ±2.5% or ±0.25㎊ whichever is larger
Min. operating temperature
→25℃
Tan δ, IR : initial spec. →Max. operating temperature →25℃
5 cycle test
C. Recommended Soldering method :
Reflow ( Reflow Peak Temperature : 260+0/-5℃, 10sec. Max )
* For the more detail Specification, Please refer to the Samsung MLCC catalogue.
Whichever is Smaller
Performance Test condition
100%
