1. Product profile
1.1 General description
NPN general-purpose transistors in a small SOT23 (TO-236AB) Surface-Mounted
Device (SMD) plastic package.
[1] /DG: halogen-free.
1.2 Features
nGeneral-purpose transistors
nTwo current gain selections
nAEC-Q101 qualified
nSmall SMD plastic package
1.3 Applications
nGeneral-purpose switching and amplification
1.4 Quick reference data
2PD601ARL; 2PD601ASL
50 V, 100 mA NPN general-purpose transistors
Rev. 01 — 6 November 2008 Product data sheet
Table 1. Product overview
Type number[1] Package PNP complement
NXP JEDEC
2PD601ARL SOT23 TO-236AB 2PB709ARL
2PD601ASL 2PB709ASL
2PD601ARL/DG SOT23 TO-236AB 2PB709ARL/DG
2PD601ASL/DG 2PB709ASL/DG
Table 2. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
VCEO collector-emitter voltage open base - - 50 V
ICcollector current - - 100 mA
hFE DC current gain VCE =10V;
IC=2mA
hFE group R 210 - 340
hFE group S 290 - 460
2PD601AXL_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 6 November 2008 2 of 9
NXP Semiconductors 2PD601ARL; 2PD601ASL
50 V, 100 mA NPN general-purpose transistors
2. Pinning information
3. Ordering information
[1] /DG: halogen-free.
4. Marking
[1] * = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
Table 3. Pinning
Pin Description Simplified outline Graphic symbol
1 base
2 emitter
3 collector
12
3
sym021
3
2
1
Table 4. Ordering information
Type number[1] Package
Name Description Version
2PD601ARL - plastic surface-mounted package; 3 leads SOT23
2PD601ASL
2PD601ARL/DG
2PD601ASL/DG
Table 5. Marking codes
Type number Marking code[1]
2PD601ARL SM*
2PD601ASL SK*
2PD601ARL/DG SR*
2PD601ASL/DG SY*
2PD601AXL_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 6 November 2008 3 of 9
NXP Semiconductors 2PD601ARL; 2PD601ASL
50 V, 100 mA NPN general-purpose transistors
5. Limiting values
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
6. Thermal characteristics
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
7. Characteristics
Table 6. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VCBO collector-base voltage open emitter - 60 V
VCEO collector-emitter voltage open base - 50 V
VEBO emitter-base voltage open collector - 6 V
ICcollector current - 100 mA
ICM peak collector current single pulse;
tp≤1ms - 200 mA
IBM peak base current single pulse;
tp≤1ms - 100 mA
Ptot total power dissipation Tamb ≤25 °C[1] - 250 mW
Tjjunction temperature - 150 °C
Tamb ambient temperature −55 +150 °C
Tstg storage temperature −65 +150 °C
Table 7. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Rth(j-a) thermal resistance from junction
to ambient in free air [1] - - 500 K/W
Table 8. Characteristics
T
amb
=25
°
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
ICBO collector-base cut-off current VCB =60V; I
E=0A--10nA
VCB =60V;I
E=0A;
Tj= 150 °C--5µA
IEBO emitter-base cut-off current VEB =5V; I
C=0A --10nA
hFE DC current gain VCE =2V;
IC= 100 mA [1] 90 - -
hFE group R VCE =10V;
IC=2mA 210 - 340
hFE group S VCE =10V;
IC=2mA 290 - 460
2PD601AXL_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 6 November 2008 4 of 9
NXP Semiconductors 2PD601ARL; 2PD601ASL
50 V, 100 mA NPN general-purpose transistors
[1] Pulse test: tp≤300 µs; δ≤0.02.
8. Test information
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard
Q101 - Stress test qualification for discrete semiconductors
, and is
suitable for use in automotive applications.
9. Package outline
VCEsat collector-emitter saturation
voltage IC= 100 mA;
IB=10mA [1] - - 250 mV
fTtransition frequency VCE =10V;
IC= 2 mA;
f = 100 MHz
100 - - MHz
Cccollector capacitance VCB =10V;
IE=i
e=0A;
f=1MHz
--3pF
Table 8. Characteristics
…continued
T
amb
=25
°
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Fig 1. Package outline SOT23 (TO-236AB)
04-11-04Dimensions in mm
0.45
0.15
1.9
1.1
0.9
3.0
2.8
2.5
2.1 1.4
1.2
0.48
0.38 0.15
0.09
12
3
2PD601AXL_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 6 November 2008 5 of 9
NXP Semiconductors 2PD601ARL; 2PD601ASL
50 V, 100 mA NPN general-purpose transistors
10. Packing information
[1] For further information and the availability of packing methods, see Section 14.
[2] /DG: halogen-free.
11. Soldering
Table 9. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type number[2] Package Description Packing quantity
3000 10000
2PD601ARL SOT23 4 mm pitch, 8 mm tape and reel -215 -235
2PD601ASL
2PD601ARL/DG
2PD601ASL/DG
Fig 2. Reflow soldering footprint SOT23 (TO-236AB)
solder lands
solder resist
occupied area
solder paste
sot023_fr
0.5
(3×)
0.6
(3×)
0.6
(3×)
0.7
(3×)
3
1
3.3
2.9
1.7
1.9
2
Dimensions in mm
2PD601AXL_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 6 November 2008 6 of 9
NXP Semiconductors 2PD601ARL; 2PD601ASL
50 V, 100 mA NPN general-purpose transistors
Fig 3. Wave soldering footprint SOT23 (TO-236AB)
solder lands
solder resist
occupied area
preferred transport direction during soldering
sot023_fw
2.8
4.5
1.4
4.6
1.4
(2×)
1.2
(2×)
2.2
2.6
Dimensions in mm
2PD601AXL_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 6 November 2008 7 of 9
NXP Semiconductors 2PD601ARL; 2PD601ASL
50 V, 100 mA NPN general-purpose transistors
12. Revision history
Table 10. Revision history
Document ID Release date Data sheet status Change notice Supersedes
2PD601AXL_1 20081106 Product data sheet - -
2PD601AXL_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 6 November 2008 8 of 9
NXP Semiconductors 2PD601ARL; 2PD601ASL
50 V, 100 mA NPN general-purpose transistors
13. Legal information
13.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
13.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
NXP Semiconductors 2PD601ARL; 2PD601ASL
50 V, 100 mA NPN general-purpose transistors
© NXP B.V. 2008. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 6 November 2008
Document identifier: 2PD601AXL_1
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
15. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 3
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3
8 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 4
8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 4
9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 4
10 Packing information. . . . . . . . . . . . . . . . . . . . . . 5
11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 7
13 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 8
13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 8
13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
13.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
14 Contact information. . . . . . . . . . . . . . . . . . . . . . 8
15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
