www.fairchildsemi.com 2 OF 4 6/05/01 DS300313
NOTE:
1. Derate power dissipation linearly 1.70 mW/°C above 25°C ambient.
2. Derate power dissipation linearly 13.0 mW/°C above 25°C case.
3. RMA flux is recommended.
4. Methanol or isopropyl alcohols are recommended as cleaning agents.
5. Soldering iron tip 1/16” (1.6mm) minimum from housing.
6. As long as leads are not under any stress or spring tension
7. Total power output, PO, is the total power radiated by the device into a solid angle of 2 !steradians.
Parameter Symbol Rating Unit
Operating Temperature TOPR -65 to +125 °C
Storage Temperature TSTG -65 to +150 °C
Soldering Temperature (Iron)(3,4,5 and 6) TSOL-I 240 for 5 sec °C
Soldering Temperature (Flow)(3,4 and 6) TSOL-F 260 for 10 sec °C
Continuous Forward Current IF100 mA
Forward Current (pw, 1µs; 200Hz) IF10 A
Reverse Voltage VR3V
Power Dissipation(TA= 25°C)(1) PD170 mW
Power Dissipation(TC= 25°C)(2) PD1.3 W
ABSOLUTE MAXIMUM RATINGS (TA= 25°C unless otherwise specified)
PARAMETER TEST CONDITIONS SYMBOL MIN TYP MAX UNITS
Peak Emission Wavelength IF= 100 mA "PE — 940 — nm
Emission Angle at 1/2 Power #— ±40 — Deg.
Forward Voltage IF= 100 mA VF— — 1.7 V
Reverse Leakage Current VR= 3 V IR— — 10 µA
Total Power LED55BF(7) IF= 100 mA PO3.5 — — mW
Total Power LED55CF(7) IF= 100 mA PO5.4 — — mW
Total Power LED56F(7) IF= 100 mA PO1.5 — — mW
Rise Time 0-90% of output tr— 1.0 — µs
Fall Time 100-10% of output tf— 1.0 — µs
ELECTRICAL / OPTICAL CHARACTERISTICS (TA=25°C) (All measurements made under pulse conditions)
GaAs INFRARED EMITTING DIODE
LED55BF LED55CF LED56F