RFP50N06 - ON SEMICONDUCTOR

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RFP50N06

N-Channel Power MOSFET

60V, 50A, 22 mΩ

These N-Channel power MOSFETs are manufactured using

the MegaFET process. This process, which uses feature

sizes approaching those of LSI integrated circuits gives

optimum utilization of silicon, resulting in outstanding

performance. They were designed for use in applications

such as switching regulators, switching converters, motor

drivers, and relay drivers. These transistors can be operated

directly from integrated circuits.

Formerly developmental type TA49018.

Features

• 50A, 60V

•r

DS(ON) = 0.022Ω

• Temperature Compensating PSPICE® Model

• Peak Current vs Pulse Width Curve

• UIS Rating Curve

• 175oC Operating Temperature

Symbol

Packaging

Ordering Information

PART NUMBER PACKAGE BRAND

RFP50N06 TO-220AB RFP50N06

JEDEC TO-220AB

DRAIN

(FLANGE)

SOURCE

DRAIN

GATE

Data Sheet September 2013

RFP50N06

Absolute Maximum Ratings TC = 25oC, Unless Otherwise Speciﬁed

RFP50N06 UNITS

Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .VDSS 60 V

Drain to Gate Voltage (RGS = 20kΩ) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . VDGR 60 V

Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGS ±20 V

Continuous Drain Current (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .ID

Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IDM

(Figure 5)

Pulsed Avalanche Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . EAS (Figure 6)

Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PD

Linear Derating Factor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

131

0.877

W/oC

Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TJ, TSTG -55 to 175 oC

Maximum Temperature for Soldering

Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . TL

Package Body for 10s, see Techbrief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Tpkg

300

260

CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the

device at these or any other conditions above those indicated in the operational sections of this speciﬁcation is not implied.

NOTE:

1. TJ = 25oC to 150oC.

Electrical Speciﬁcations TC = 25oC, Unless Otherwise Speciﬁed

PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS

Drain to Source Breakdown Voltage BVDSS ID = 250µA, VGS = 0V (Figure 11) 60 - - V

Gate to Source Threshold Voltage VGS(TH) VGS = VDS, ID = 250µA (Figure 10) 2 - 4 V

Zero Gate Voltage Drain Current IDSS VDS = 60V,

VGS = 0V

TC = 25oC--1µA

TC = 150oC--50µA

Gate to Source Leakage Current IGSS VGS = ±20V - - ±100 nA

Drain to Source On Resistance rDS(ON) ID = 50A, VGS = 10V (Figures 9) - - 0.022 Ω

Turn-On Time tON VDD = 30V, ID = 50A

RL = 0.6Ω, VGS = 10V

RGS = 3.6Ω

(Figure 13)

--95 ns

Turn-On Delay Time td(ON) -1

2- ns

Rise Time tr-5

5- ns

Turn-Off Delay Time td(OFF) -3

7- ns

Fall Time tf-1

3- ns

Turn-Off Time tOFF --75 ns

Total Gate Charge Qg(TOT) VGS = 0 to 20V VDD = 48V, ID = 50A,

RL = 0.96Ω

Ig(REF) = 1.45mA

(Figure 13)

-125 150 nC

Gate Charge at 10V Qg(10) VGS = 0 to 10V -67 80 nC

Threshold Gate Charge Qg(TH) VGS = 0 to 2V -3.7 4.5 nC

Input Capacitance CISS VDS = 25V, VGS = 0V

f = 1MHz

(Figure 12)

-2020 - pF

Output Capacitance COSS -600 - pF

Reverse Transfer Capacitance CRSS -200 - pF

Thermal Resistance Junction to Case RθJC (Figure 3) -- 1.14 oC/W

Thermal Resistance Junction to Ambient RθJA TO-220 --62 oC/W

---- -

Source to Drain Diode Speciﬁcations

PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS

Source to Drain Diode Voltage VSD ISD = 50A --1.5 V

Reverse Recovery Time trr ISD = 50A, dISD/dt = 100A/µs--125 ns

Typical Performance Curves Unless Otherwise Speciﬁed

FIGURE 1. NORMALIZED POWER DISSIPATION vs CASE

TEMPERATURE

FIGURE 2. MAXIMUM CONTINUOUS DRAIN CURRENT vs

CASE TEMPERATURE

FIGURE 3. NORMALIZED MAXIMUM TRANSIENT THERMAL IMPEDANCE

FIGURE 4. FORWARD BIAS SAFE OPERATING AREA FIGURE 5. PEAK CURRENT CAPABILITY

1.2

1.0

0.8

0.6

0.4

0.2

0 25 50 75 100 125 150 175

POWER DISSIPATION MULTIPLIER

TC, CASE TEMPERATURE (oC)

25 50 75 100 125 150 175

ID, DRAIN CURRENT (A)

TC, CASE TEMPERATURE (oC)

0.1

0.01

10-5 10-4 10-3 10-2 10-1 100101

t1, RECTANGULAR PULSE DURATION (s)

PDM

NOTES:

DUTY FACTOR: D = t1/t2

PEAK TJ = PDM x ZθJC x RθJC + TC

SINGLE PULSE

t1t2

THERMAL IMPEDANCE

ZθJC, NORMALIZED

0.01

0.02

0.05

0.1

0.2

0.5

400

100

11 10 100

VDS, DRAIN TO SOURCE VOLTAGE (V)

OPERATION IN THIS

AREA MAY BE

LIMITED BY rDS(ON)

1ms

100µs

10ms

100ms

VDSS(MAX) = 60V

ID, DRAIN CURRENT (A)

TC = 25oC

TJ = MAX RATED

SINGLE PULSE

10-3 10-2 10-1 100101102103104

102

103

t, PULSE WIDTH (ms)

VGS = 20V

VGS = 10V

TRANSCONDUCTANCE

MAY LIMIT CURRENT

IN THIS REGION

FOR TEMPERATURES ABOVE 25oC

DERATE PEAK CURRENT

CAPABILITY AS FOLLOWS:

175 TC

–

150

------------------------







IDM, PEAK CURRENT (A)

TC = 25oC

RFP50N06

NOTE: Refer to Fairchild Application Notes 9321 and 9322.

FIGURE 6. UNCLAMPED INDUCTIVE SWITCHING CAPABILITY FIGURE 7. SATURATION CHARACTERISTICS

FIGURE 8. TRANSFER CHARACTERISTICS FIGURE 9. NORMALIZED DRAIN TO SOURCE ON

RESISTANCE vs JUNCTION TEMPERATURE

FIGURE 10. NORMALIZED GATE THRESHOLD VOLTAGE vs

JUNCTION TEMPERATURE

FIGURE 11. NORMALIZED DRAIN TO SOURCE BREAKDOWN

VOLTAGE vs JUNCTION TEMPERATURE

RFP50N06

Typical Performance Curves Unless Otherwise Speciﬁed (Continued)

STARTING TJ = 150oC

STARTING TJ = 25oC

300

100

0.01 0.1 1 10

tAV , TIME IN AVALANCHE (ms)

If R = 0

tAV = (L) (IAS) / (1.3 RATED BVDSS - VDD)

If R ≠ 0

tAV = (L/R) ln [(IAS*R) / (1.3 RATED BVDSS - VDD) + 1]

IAS, AVALANCHE CURRENT (A)

125

100

0 1.5 3.0 4.5 6.0 7.5

ID, DRAIN CURRENT (A)

VDS, DRAIN TO SOURCE VOLTAGE (V)

VGS = 10V

VGS = 8V

VGS = 7V

VGS = 6V

VGS = 5V

VGS = 4V

PULSE DURATION = 80µs

TC = 25oC

DUTY CYCLE = 0.5% MAX

012345678910

VGS , GATE TO SOURCE VOLTAGE (V)

ID, DRAIN CURRENT (A)

125

100

PULSE DURATION = 80µs

DUTY CYCLE = 0.5% MAX -55oC

175oC

25oC

VDD = 15V

2.5

2.0

1.5

1.0

0.5

-80 -40 0 40 80 120 160 200

TJ, JUNCTION TEMPERATURE (oC)

NORMALIZED DRAIN TO SOURCE

PULSE DURATION = 80µs

VGS = 10V, ID = 50A

ON RESISTANCE

DUTY CYCLE = 0.5% MAX

2.0

1.5

1.0

0.5

-80 -40 0 40 80 160120 200

THRESHOLD VOLTAGE

TJ, JUNCTION TEMPERATURE (oC)

NORMALIZED GATE

VGS = VDS, ID = 250µA

2.0

1.5

1.0

0.5

-80 -40 0 40 80 120 160 200

NORMALIZED DRAIN TO SOURCE

BREAKDOWN VOLTAGE

TJ, JUNCTION TEMPERATURE (oC)

ID = 250µA

FIGURE 12. CAPACITANCE vs DRAIN TO SOURCE VOLTAGE

NOTE: Refer to Fairchild Application Notes AN7254 and AN7260.

FIGURE 13. NORMALIZED SWITCHING WAVEFORMS FOR

CONSTANT GATE CURRENT

Test Circuits and Waveforms

FIGURE 14. UNCLAMPED ENERGY TEST CIRCUIT FIGURE 15. UNCLAMPED ENERGY WAVEFORMS

FIGURE 16. SWITCHING TIME TEST CIRCUIT FIGURE 17. SWITCHING WAVEFORMS

RFP50N06

Typical Performance Curves Unless Otherwise Speciﬁed (Continued)

CISS

COSS

CRSS

4000

3000

2000

1000

0 5 10 15 20 25

C, CAPACITANCE (pF)

VDS, DRAIN TO SOURCE VOLTAGE (V)

VGS = 0V, f = 1MHz

CISS = CGS + CGD

CRSS = CGD

COSS = CDS + CGD

7.5

5.0

2.5

Ig(REF)

Ig(ACT)

Ig(REF)

Ig(ACT)

t, TIME (µs)

VDD = BVDSS VDD = BVDSS

0.75 BVDSS

0.50 BVDSS

0.25 BVDSS

0.75 BVDSS

0.50 BVDSS

0.25 BVDSS

VDS, DRAIN TO SOURCE VOLTAGE (V)

VGS , GATE TO SOURCE VOLTAGE (V)

RL = 1.2Ω

Ig(REF) = 1.45mA

VGS = 10V

VGS

0.01Ω

IAS

VDS

VDD

DUT

VARY tP TO OBTAIN

REQUIRED PEAK IAS

VDD

VDS

BVDSS

IAS

tAV

VGS

RGS

DUT

VDD

VDS

VGS

tON

td(ON)

90%

10%

VDS 90%

10%

td(OFF)

tOFF

90%

50%

10% PULSE WIDTH

VGS

FIGURE 18. GATE CHARGE TEST CIRCUIT FIGURE 19. GATE CHARGE WAVEFORMS

RFP50N06

Test Circuits and Waveforms (Continued)

VGS +

VDS

VDD

DUT

Ig(REF)

VDD

Qg(TH)

VGS = 2V

Qg(10)

VGS = 10V

Qg(TOT)

VGS = 20V

VDS

VGS

Ig(REF)

PSPICE Electrical Model

.SUBCKT RFP50N06213

REV 2/22/93

*NOM TEMP = 25oC

CA 12 8 3.68e-9

CB 15 14 3.625e-9

CIN 6 8 1.98e-9

DBODY 7 5 DBDMOD

DBREAK 5 11DBKMOD

DPLCAP 10 5 DPLCAPMOD

EBREAK 11 7 17 18 64.59

EDS 14 8 5 8 1

EGS 13 8 6 8 1

ESG 6 10 6 8 1

EVTO 20 6 18 8 1

IT 8 17 1

LDRAIN 2 5 1e-9

LGATE 1 9 5.65e-9

LSOURCE 3 7 4.13e-9

MOS1 16 6 8 8 MOSMOD M=0.99

MOS2 16 21 8 8 MOSMOD M=0.01

RBREAK 17 18 RBKMOD 1

RDRAIN 5 16 RDSMOD 1e-4

RGATE 9 20 0.690

RIN 6 8 1e9

RSOURCE 8 7 RDSMOD 12e-3

RVTO 18 19 RVTOMOD 1

S1A 6 12 13 8 S1AMOD

S1B 13 12 13 8 S1BMOD

S2A 6 15 14 13 S2AMOD

S2B 13 15 14 13 S2BMOD

VBAT 8 19 DC 1

VTO 21 6 0.678

.MODEL DBDMOD D (IS=9.85e-13 RS=4.91e-3 TRS1=2.07e-3 TRS2=2.51e-7 CJO=2.05e-9 TT=4.33e-8)

.MODEL DBKMOD D (RS=1.98e-1 TRS1=2.35E-4 TRS2=-3.83e-6)

.MODEL DPLCAPMOD D (CJO=1.42e-9 IS=1e-30 N=10)

.MODEL MOSMOD NMOS (VTO=3.65 KP=35 IS=1e-30 N=10 TOX=1 L=1u W=1u)

.MODEL RBKMOD RES (TC1=1.23e-3 TC2=-2.34e-7)

.MODEL RDSMOD RES (TC1=5.01e-3 TC2=1.49e-5)

.MODEL RVTOMOD RES (TC1=-5.03e-3 TC2=-5.16e-6)

.MODEL S1AMOD VSWITCH (RON=1e-5 ROFF=0.1 VON=-6.75 VOFF=-2.5)

.MODEL S1BMOD VSWITCH (RON=1e-5 ROFF=0.1 VON=-2.5 VOFF=-6.75)

.MODEL S2AMOD VSWITCH (RON=1e-5 ROFF=0.1 VON=-2.7 VOFF=2.3)

.MODEL S2BMOD VSWITCH (RON=1e-5 ROFF=0.1 VON=2.3 VOFF=-2.7)

.ENDS

NOTE: For further discussion of the PSPICE model consult A New PSPICE Sub-Circuit for the Power MOSFET Featuring Global Temperature

Options; authors, William J. Hepp and C. Frank Wheatley.

DPLCAP RDRAIN

DBREAK

LDRAIN

DRAIN

SOURCE

LSOURCE

DBODY

RBREAK

RVTO

VBAT

19IT

RSOURCE

EBREAK

MOS2

EDSEGS

RIN CIN

VTO

ESG

S1A S2A

S2BS1B

CBCA

EVTO

RGATE

GATE

LGATE

1817

209

12 15

MOS1

RFP50N06

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intended to be an exhaustive list of all such trademarks.

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the failure of the life support device or system, or to affect its safety or

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PRODUCT STATUS DEFINITIONS

Definition of Terms

AccuPower™

AX-CAP®*

BitSiC™

Build it Now™

CorePLUS™

CorePOWER™

CROSSVOLT™

CTL™

Current Transfer Logic™

DEUXPEED®

Dual Cool™

EcoSPARK®

EfficentMax™

ESBC™

Fairchild®

Fairchild Semiconductor®

FACT Quiet Series™

FACT®

FAST®

FastvCore™

FETBench™

FPS™

F-PFS™

FRFET®

Global Power ResourceSM

GreenBridge™

Green FPS™

Green FPS™ e-Series™

Gmax™

GTO™

IntelliMAX™

ISOPLANAR™

Marking Small Speakers Sound Louder

and Better™

MegaBuck™

MICROCOUPLER™

MicroFET™

MicroPak™

MicroPak2™

MillerDrive™

MotionMax™

mWSaver®

OptoHiT™

OPTOLOGIC®

OPTOPLANAR®

PowerTrench®

PowerXS™

Programmable Active Droop™

QFET®

QS™

Quiet Series™

RapidConfigure™

Saving our world, 1mW/W/kW at a time™

SignalWise™

SmartMax™

SMART START™

Solutions for Your Success™

SPM®

STEALTH™

SuperFET®

SuperSOT™-3

SuperSOT™-6

SuperSOT™-8

SupreMOS®

SyncFET™

Sync-Lock™

®*

TinyBoost®

TinyBuck®

TinyCalc™

TinyLogic®

TINYOPTO™

TinyPower™

TinyPWM™

TinyWire™

TranSiC™

TriFault Detect™

TRUECURRENT®*

SerDes™

UHC®

Ultra FRFET™

UniFET™

VCX™

VisualMax™

VoltagePlus™

XS™

™

Datasheet Identification Product Status Definition

Advance Information Formative / In Design Datasheet contains the design specifications for product development. Specifications

may change in any manner without notice.

Preliminary First Production

Datasheet contains preliminary data; supplementary data will be published at a later

date. Fairchild Semiconductor reserves the right to make changes at any time without

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No Identification Needed Full Production Datasheet contains final specifications. Fairchild Semiconductor reserves the right to

make changes at any time without notice to improve the design.

Obsolete Not In Production Datasheet contains specifications on a product that is discontinued by Fairchild

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Rev. I66

RFP50N06

www.onsemi.com

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regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or

specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer

application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not

designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification

in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized

application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and

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