Rev. A
DX
2007
06
04
EGP30
– EGP30K
3.0A Sintered Glass Passivated
Super Fast Recovery Rectifier
TAITRON COMPONEN
S INCORPORATED www.taitroncomponents.com
Page 1
of 4
Tel: (800)
TAITRON (800)
824
8766 (661)
257
6060
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3.0A Sintered Glass Passivated Super Fast Recovery Rectifier
Features
• Sintered glass passivated (SGP) rectifier chip
• Low forward voltage, high current capability
• Low leakage current, high surge current capability
• High temperature soldering guaranteed: 260°C/10 seconds
/.0375" (9.5mm) lead length, 5lbs (2.3kg) tension
• RoHS Compliance
Mechanical Data
Case: JEDEC DO-201AD molded pl astic body
Epoxy: Plastic package has UL flammability classification 94V-0
Terminals: Plated axial leads, solderable per MIL-STD-750, Method 2026
Polarity: Color band denotes cathode end
Weight: 0.04ounces, 1.12 grams
Maximum Ratings and Electr ical Characteristics (T
A
=25ºC unless noted otherwise)
Symbol Description EGP30A EGP30B EGP30D EGP30G EGP30J EGP30K Unit Conditions
VRRM Maximum
Repetitive Peak
Reverse Voltage 50 100 200 400 600 800 V
VRMS Maximum RMS
Voltage 35 70 140 280 420 560 V
VDC Maximum DC
Blocking Voltage 50 100 200 400 600 800 V
IF(AV) Maximum Average
Forward Rectified
Current 3.0 A
0.375” (9.5mm)
lead length(Fig.1)
IFSM Peak Forward
Surge Current 125 115 A
8.3ms single half
sine-wave
superimposed on
rated load (JEDEC
Method)
DO-201AD