Description
This family of T-1 lamps is widely used in general purpose
indicator applications. Diusants, tints, and optical design
are balanced to yield superior light output and wide view-
ing angles. Several intensity choices are available in each
color for increased design exibility.
HLMP-1301, HLMP-1401, HLMP-1503,
HLMP-K401, HLMP-K600
T-1 (3 mm) Diused LED Lamps
Data Sheet
Package Dimensions
Features
•   High intensity
•   Choice of 4 bright colors
High Eciency Red
Orange
Yellow
High Performance Green
•   Popular T-1 diameter package
•   Selected minimum intensities
•   Wide viewing angle
•   General purpose leads
•   Reliable and rugged
•   Available on tape and reel
2
Selection Guide
Material Color Part Number
Luminous Intensity Iv (mcd) at 10 mA
Min. Max.
GaAsP on GaP Red HLMP-1301 3.4 –
HLMP-1301-E00xx 3.4 –
HLMP-1301-FG0xx 5.4 17.2
HLMP-1301-G00xx 8.6 –
HLMP-1301-GH0xx 8.6 27.6
Yellow HLMP-1401 2.2 –
HLMP-1401-D00xx 3.6 –
HLMP-1401-E00xx 5.7 –
HLMP-1401-EF0xx 5.7 18.4
HLMP-1401-EFBxx 5.7 18.4
Orange HLMP-K401 2.1 –
HLMP-K401-E00xx 3.4 –
HLMP-K401-EF0xx 3.4 10.8
HLMP-K401-FGDxx 5.4 17.2
GaP Green HLMP-1503 1.0 –
HLMP-1503-C00xx 2.6 –
HLMP-1503-D00xx 4.2 –
HLMP-1503-DE0xx 4.2 13.4
HLMP-1503-DEDxx 4.2 13.4
Emerald Green[1] HLMP-K600 1.0 –
Note:
1. Please refer to Application Note 1061 for information comparing standard green and emerald green light output degradation.…
3
Part Numbering System
HLMP – X X XX - X X X XX
Mechanical Option
00: Bulk
01: Tape & Reel, Crimped Leads
02, Bx: Tape & Reel, Straight Leads
A1: Right Angle Housing, Uneven Leads
A2: Right Angle Housing, Even Leads
Dx, EE: Ammo Pack, Straight Leads
R4: Tape & Reel, Counter Clockwise
Vx: Ammo Pack, Horizontal Leads
FG: Products need inventory control for Customer IDI
Color Bin Options
0: Full Color Bin Distribution
B: Color Bins 2 & 3 only
D: Color Bins 4 & 5 only
Maximum Iv Bin Options
0: Open (no max. limit)
Others: Please refer to the Iv Bin Table
Minimum Iv Bin Options
Please refer to the Iv Bin Table
Color Options
3: GaP HER
4: GaP Yellow (except K4xx Series)
5: GaP Green
6: GaP Emerald Green
Package Options
1: T-1 (3 mm)
K: T-1 (3 mm) Orange (K4xx) or Emerald Green (K6xx)
4
Absolute Maximum Ratings at TA = 25°C
Parameter HER/Orange Yellow Green Units
Peak Forward Current 90 60 90 mA
Average Forward Current[1] 25 20 25 mA
DC Current[2] 30 20 30 A R
everse Voltage (IR = 100 μA) 5 5 5 V
Transient Forward Current[4] (10 μsec Pulse) 500 500 500 mA
LED Junction Temperature 110 110 110 °C
Operating Temperature Range -40 to +100 -40 to +100 -20 to +100 °C
Storage Temperature Range -40 to +100 -40 to +100 -40 to +100 °C
Notes:
1. See Figure 5 (HER/Orange), 10 (Yellow), or 15 (Green/Emerald Green) to establish pulsed operating conditions.
2. For Red, Orange, and Green series derate linearly from 50°C at 0.5 mA/°C. For Yellow series derate linearly from 50°C at 0.2 mA/°C.
3. For Red, Orange, and Green series derate power linearly from 25°C at 1.8 mW/°C. For Yellow series derate power linearly from 50°C at 1.6 mW/°C.
4. The transient peak current is the maximum non-recurring peak current that can be applied to the device without damaging the LED die and
wirebond. It is not recommended that the device be operated at peak currents beyond the peak forward current listed in the Absolute Maximum
Ratings.
5
Electrical Characteristics at TA = 25°C
Symbol Description Device HLMP- Min. Typ. Max. Units Test Conditions
2θ1/2Included Angle Between Half
Luminous Intensity Points
All 60 Deg. IF = 10 mA
See Note 1
lPEAK Peak Wavelength High Eciency Red 635 nm Measurement at Peak
Orange 600
Yellow 583
Green 565
Emerald Green 558
ldDominant Wavelength High Eciency Red 626 nm See Note 2
Orange 602
Yellow 585
Green 569
Emerald Green 560
Dl1/2Spectral Line Halfwidth High Eciency Red 40 nm
Yellow 36
Green 28
Emerald Green 24
tsSpeed of Response High Eciency Red 90 ns
Orange 280
Yellow 90
Green 500
Emerald Green 3100
C Capacitance High Eciency Red 11 pF VF = 0;
Orange 4 f = 1 MHz
Yellow 15
Green 18
Emerald Green 35
RθJ-PIN Thermal Resistance All 290 °C/W Junction to Cathode
Lead
VFForward Voltage HER/Orange 1.5 1.9 2.4 V IF = 10 mA
Yellow 1.5 2.0 2.4
Green 1.5 2.1 2.7
Emerald Green 2.1 2.7
VRReverse Breakdown Voltage All 5.0 V IR = 100 μA
hV Luminous Ecacy High Eciency Red 145 lumens See Note 3
Orange 380 watt
Yellow 500
Green 595
Emerald Green 655
Notes:
1. θ1/2 is the o-axis angle at which the luminous intensity is half the axial luminous intensity.
2. The dominant wavelength, ld, is derived from the CIE chromaticity diagram and represents the single wavelength which denes the color of the
device.
3. Radiant intensity, le, in watts/steradian, may be found from the equation Ie= Iv/hv, where Iv is the luminous intensity in candelas and hv is the
luminous ecacy in lumens/watt.
6
Figure 5. Maximum tolerable peak current vs.
pulse duration. (IDC MAX as per MAX ratings).
Figure 3. Relative luminous intensity vs. DC
forward current.
Figure 2. Forward current vs. forward voltage
characteristics.
Figure 4. Relative eciency (luminous intensity
per unit current) vs. peak LED current.
T-1 High Eciency Red, Orange Diused Lamps
Figure 1. Relative intensity vs. wavelength.
ORANGE
HIGH EFFICIENCY RED
WAVELENGTH – nm
RELATIVE INTENSITY
1.0
0.5
0
500 550 600 650 700 750
YELLOW
EMERALD GREEN
HIGH
PERFORMANCE
GREEN
TA = 25° C
AlGaAs RED
Figure 6. Relative luminous intensity vs. angular displacement.
7
T-1 Yellow Diused Lamps
Figure 10. Maximum tolerable peak current vs.
pulse duration. (IDC MAX as per MAX ratings).
Figure 7. Forward current vs. forward voltage
characteristics.
Figure 8. Relative luminous intensity vs. forward
current.
Figure 9. Relative eciency (luminous intensity
per unit current) vs. peak current.
Figure 11. Relative luminous intensity vs. angular displacement.
8
T-1 Green/Emerald Green Diused Lamps
Figure 13. Relative luminous intensity vs.
forward current.
Figure 12. Forward current vs. forward voltage
characteristics.
Figure 14. Relative eciency (luminous inten-
sity per unit vurrent) vs. peak LED current.
Figure 15. Maximum tolerable peak current vs.
pulse duration. (IDC MAX as per MAX ratings).
Figure 16. Relative luminous intensity vs. angular displacement.
9
Intensity Bin Limits
Color
Intensity Range (mcd)
Bin Min. Max.
D 2.4 3.8
E 3.8 6.1
F 6.1 9.7
G 9.7 15.5
H 15.5 24.8
I 24.8 39.6
J 39.6 63.4
K 63.4 101.5
L 101.5 162.4
M 162.4 234.6
N 234.6 340.0
Red/Orange
O 340.0 540.0
P 540.0 850.0
Q 850.0 1200.0
R 1200.0 1700.0
S 1700.0 2400.0
T 2400.0 3400.0
U 3400.0 4900.0
V 4900.0 7100.0
W 7100.0 10200.0
X 10200.0 14800.0
Y 14800.0 21400.0
Z 21400.0 30900.0
C 2.5 4.0
D 4.0 6.5
E 6.5 10.3
F 10.3 16.6
G 16.6 26.5
H 26.5 42.3
I 42.3 67.7
J 67.7 108.2
K 108.2 173.2
Yellow L 173.2 250.0
M 250.0 360.0
N 360.0 510.0
O 510.0 800.0
P 800.0 1250.0
Q 1250.0 1800.0
R 1800.0 2900.0
S 2900.0 4700.0
T 4700.0 7200.0
U 7200.0 11700.0
V 11700.0 18000.0
W 18000.0 27000.0
10
Intensity Bin Limits, continued
Intensity Range (mcd)
Color Bin Min. Max.
A 1.1 1.8
B 1.8 2.9
C 2.9 4.7
D 4.7 7.6
E 7.6 12.0
F 12.0 19.1
G 19.1 30.7
H 30.7 49.1
I 49.1 78.5
J 78.5 125.7
Green/ K 125.7 201.1
Emerald Green L 201.1 289.0
M 289.0 417.0
N 417.0 680.0
O 680.0 1100.0
P 1100.0 1800.0
Q 1800.0 2700.0
R 2700.0 4300.0
S 4300.0 6800.0
T 6800.0 10800.0
U 10800.0 16000.0
V 16000.0 25000.0
W 25000.0 40000.0
Maximum tolerance for each bin limit is ± 18%.
11
Color Categories
Lambda (nm)
C olor Category # Min. Max.
9 522.5 555.5
Emerald Green 8 555.5 558.5
7 558.5 561.5
6 561.5 564.5
6 561.5 564.5
5 564.5 567.5
Green 4 567.5 570.5
3 570.5 573.5
2 573.5 576.5
1 582.0 584.5
3 584.5 587.0
Yellow 2 587.0 589.5
4 589.5 592.0
5 592.0 593.0
1 597.0 599.5
2 599.5 602.0
3 602.0 604.5
Orange 4 604.5 607.5
5 607.5 610.5
6 610.5 613.5
7 613.5 616.5
8 616.5 619.5
Tolerance for each bin limit is ± 0.5 nm.
12
Mechanical Option Matrix
Mechanical Option Code Denition
00 Bulk Packaging, minimum increment 500 pcs/bag
01 Tape & Reel, crimped leads, minimum increment 1800 pcs/bag
02 Tape & Reel, straight leads, minimum increment 1800 pcs/bag
A1 Right Angle Housing, uneven leads, minimum increment 500 pcs/bag
A2 Right Angle Housing, even leads, minimum increment 500 pcs/bag
BG Tape & Reel, straight leads in 2K increment
BJ Tape & Reel, straight leads in 2K increment
DD Ammo Pack, straight leads in 2K increment
DJ Ammo Pack, straight leads in 2K increment
EE Ammo Pack, straight leads in 5K increment
R4 Tape & Reel, straight leads, counter clockwise, anode lead leaving the reel rst
VA Ammo Pack, horizontal leads in 2K increment
VB Ammo Pack, horizontal leads in 2K increment
FG Inventory Control for Customer IDI
Note: All categories are established for classication of products. Products may not be available in all categories. Please contact your local Avago
representative for further clarication/information.
Precautions
Lead Forming
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering into PC board.
• If lead forming is required before soldering, care must
be taken to avoid any excessive mechanical stress
induced to LED package. Otherwise, cut the leads of LED
to length after soldering process at room temperature.
The solder joint formed will absorb the mechanical
stress of the lead cutting from traveling to the LED chip
die attach and wirebond.
• It is recommended that tooling made to precisely form
and cut the leads to length rather than rely upon hand
operation.
Soldering Conditions
• Care must be taken during PCB assembly and soldering
process to prevent damage to LED component.
• The closest LED is allowed to solder on board is 1.59
mm below the body (encapsulant epoxy) for those
parts without stando.
• Recommended soldering conditions:
Wave Soldering
Manual Solder
Dipping
Pre-heat Temperature 105 °C Max. –
Pre-heat Time 30 sec Max. –
Peak Temperature 250 °C Max. 260 °C Max.
Dwell Time 3 sec Max. 5 sec Max.
• Wave soldering parameter must be set and maintained
according to recommended temperature and dwell
time in the solder wave. Customer is advised to
periodically check on the soldering prole to ensure
the soldering prole used is always conforming to
recommended soldering condition.
• If necessary, use xture to hold the LED component
in proper orientation with respect to the PCB during
soldering process.
• Proper handling is imperative to avoid excessive
thermal stresses to LED components when heated.
Therefore, the soldered PCB must be allowed to cool to
room temperature, 25°C, before handling.
• Special attention must be given to board fabrication,
solder masking, surface plating and lead holes size and
component orientation to assure solderability.
• Recommended PC board plated through hole sizes for
LED component leads:
LED Component
Lead Size Diagonal
Plated Through
Hole Diameter
0.457 x 0.457 mm
(0.018 x 0.018 inch)
0.646 mm
(0.025 inch)
0.976 to 1.078 mm
(0.038 to 0.042 inch)
0.508 x 0.508 mm
(0.020x 0.020 inch)
0.718 mm
(0.028 inch)
1.049 to 1.150 mm
(0.041 to 0.045 inch)
Note:
Refer to application note AN1027 for more information on
soldering LED components.
Figure 17. Recommended wave soldering prole.
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2008 Avago Technologies. All rights reserved. Obsoletes 5989-4252EN
AV02-1555EN - October 13, 2008
LAMINAR WAVE BOTTOM SIDE
OF PC BOARD
HOT AIR KNIFE
TURBULENT WAVE
FLUXING
PREHEAT
0 10 20
30
50
100
150
200
250
30 40 50
TIME – SECONDS
TEMPERATURE – C
60 70 80 90 100
TOP SIDE OF
PC BOARD
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150C (100C PCB)
SOLDER WAVE TEMPERATURE = 245C
AIR KNIFE AIR TEMPERATURE = 390C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40
SOLDER: SN63; FLUX: RMA
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE EXERTING
MECHANICAL FORCE.