TD62502~503PG/FG TOSHIBA Bipolar Digital Integrated Circuit Silicon Monolithic TD62502PG,TD62502FG,TD62503PG,TD62503FG 7ch Single Driver: Common Emitter The TD62502PG/FG and TD62503PG/FG Series are comprised of seven NPN transistor arrays. Applications include relay, hammer, lamp and display (LED) drivers. TD62502PG, TD62503PG Features * Output current (single output) 200 mA (max) * High sustaining voltage output 35 V (min) * Inputs compatible with various types of logic. * TD62502PG/FG : RIN = 10.5 k + 7 V Zener Diode*** 14 to 25 V P-MOS * TD62503PG/FG : RIN = 2.7 k*** TTL, 5 V C-MOS * Package Type-PG: DIP-16 pin * Package Type-FG: SOP-16 pin TD62502FG, TD62503FG Weight DIP16-P-300-2.54A: 1.11g (typ.) SOP16-P-225-1.27: 0.16g (typ.) Pin Assignment (top view) O1 O2 O3 O4 O5 O6 O7 NC 16 15 14 13 12 11 10 9 1 I1 2 I2 3 I3 4 I4 5 I5 6 I6 7 8 I7 COM-E Note: NC pin assignment The NC pin is not assigned to an internal chip of these products; hence, no need to assign necessarily. If it is needed, Toshiba recommends that you connect the NC pin to the common emitter (GND). 1 2009-12-14 TD62502~503PG/FG Schematics (each driver) TD62502PG/FG Output 7V 10.5 k (*) 10 k Input (*) (*) (*) (*) (*) Common emitter TD62503PG/FG Output R1 (*) 10 k Input (*) (*) (*) (*) (*) Common emitter R1 = 2.7 k : Parasitic diodes Note: The input and output parasitic diodes cannot be used as clamp diodes. Absolute Maximum Ratings (Ta = 25C) Characteristics Symbol Rating Unit Collector-emitter voltage VCEO 35 V Collector-base voltage VCBO 50 V IC 200 mA/ch VIN -0.5 to 30 V Collector current Input voltage PG Power dissipation FG PD 1.0 W 0.625 (Note) Operating temperature Topr -40 to 85 C Storage temperature Tstg -55 to 150 C Note: On Glass Epoxy PCB (30 x 30 x 1.6 mm Cu 50%) Operating Ranges (Ta = -40 to 85C) Characteristics Symbol Condition Min Typ. Max Unit Collector-emitter voltage VCEO 0 35 V Collector-base voltage VCBO 0 50 V IC 0 150 mA/ch 14.0 25 2.4 25 0 7.0 0 0.4 0.360 (Note) 0.325 Collector current Input voltage (Output on) TD62502PG/FG Input voltage (Output off) TD62502PG/FG TD62503PG/FG TD62503PG/FG Power dissipation PG FG VIN (ON) IIN = 1 mA, IC = 10 mA VIN (OFF) IC 10 A PD V V W Note: On Glass Epoxy PCB (30 x 30 x 1.6 mm Cu 50%) 2 2009-12-14 TD62502~503PG/FG Electrical Characteristics (Ta = 25C) Characteristics Output leakage current Collector-emitter saturation voltage DC current transfer ratio TD62502PG/FG Input voltage (Output on) TD62503PG/FG Symbol Test Circuit ICEX 1 VCE (sat) 2 hFE VIN (ON) Turn-ON delay tON Turn-OFF delay tOFF Test Condition Min Typ. Max Unit VCE = 25V, VIN = 0 V 10 A IIN = 1 mA, IC = 10 mA 0.2 IIN = 3 mA, IC = 150 mA 0.8 2 VCE = 10 V, IC = 10 mA 50 3 IIN = 1 mA, IC = 10 mA 13 17 23 2.4 3.4 4.2 4 VOUT = 35 V, RL = 3.3k CL = 15 pF 50 200 V V ns Test Circuit 1. ICEX 2. hFE, VCE (sat) IIN VCE Open VIN 3. VIN (ON) IC IIN VCE, VCE (sat) IC VIN (ON) IC hFE = IIN ICEX 4. tON, tOFF VOUT = 35 V Input R1 Pulse generator C B (Note 2) (Note 1) E RL = 3.3 k Output tf tr 90% 50% Input 10% CL = 15 pF (Note 3) VIH 90% 50% 50 s tON 10% 0 tOFF VOH Output 50% 50% VOL Note 1: Pulse width 50 s, Duty cycle 10% Output impedance 50 , tr 5 ns, tf 10 ns Note 2: Input Condition Type Number VIH TD62502PG/FG 15 V TD62503PG/FG 3V Note 3: CL includes probe and jig capacitance Precautions for Using This IC does not integrate protection circuits such as overcurrent and overvoltage protectors. Thus, if excess current or voltage is applied to the IC, the IC may be damaged. Please design the IC so that excess current or voltage will not be applied to the IC. Utmost care is necessary in the design of the output line, VCC and GND line since IC may be destroyed due to short-circuit between outputs, air contamination fault, or fault by improper grounding. 3 2009-12-14 TD62502~503PG/FG PD - Ta 0.8 (2) 0.6 (3) 0.4 IIN (mA) (1) Type-PG FREE AIR (2) Type-FG ON PCB 30 x 30 x 1.6 mm Cu 50% On glass Epoxy PCB (3) Type-FG FREE AIR (1) 1.0 TD62502PG/FG IIN - VIN 4 3 Input current Power dissipation PD (W) 1.2 2 1 Ta = 25C 0.2 IOUT = 25 to 100 mA 0 0 25 50 100 75 125 0 0 150 10 Ambient temperature Ta (C) 20 30 Input voltage VIN TD62503PG/FG IIN - VIN 2 mA (mA) Collector current IC IIN (mA) Input current (V) 120 100 2 1 Ta = 25C 1 mA 80 700 A 60 IIN = 500 A 40 20 IOUT = 25 to 100 mA 0 0 50 IC - VCE (sat) 4 3 40 4 8 12 Input voltage VIN 16 Ta = 25C 0 0 20 0.2 0.4 0.6 0.8 Output saturation voltage (V) 4 1.0 1.2 1.4 VCE (sat) 2009-12-14 TD62502~503PG/FG Package Dimensions Weight: 1.11 g (typ.) 5 2009-12-14 TD62502~503PG/FG Package Dimensions Weight: 0.16 g (typ.) 6 2009-12-14 TD62502~503PG/FG Notes on Contents 1. Equivalent Circuits The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 2. Test Circuits Components in the test circuits are used only to obtain and confirm the device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment. IC Usage Considerations Notes on Handling of ICs (1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. (2) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. (3) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. (4) Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time. (5) Carefully select external components (such as inputs and negative feedback capacitors) and load components (such as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to a speaker with low input withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL) connection type IC that inputs output DC voltage to a speaker directly. 7 2009-12-14 TD62502~503PG/FG Points to Remember on Handling of ICs (1) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheral components. (2) Back-EMF When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor's power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the device's motor power supply and output pins might be exposed to conditions beyond absolute maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design. About solderability, following conditions were confirmed * Solderability (1) Use of Sn-37Pb solder Bath * solder bath temperature = 230C * dipping time = 5 seconds * the number of times = once * use of R-type flux (2) Use of Sn-3.0Ag-0.5Cu solder Bath * solder bath temperature = 245C * dipping time = 5 seconds * the number of times = once * use of R-type flux 8 2009-12-14 TD62502~503PG/FG RESTRICTIONS ON PRODUCT USE * Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively "Product") without notice. * This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. * Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS. * Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document. 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