SSL21083T/1,118"" - NXP SEMICONDUCTORS

1. General description

The SSL21081/SSL21083 are a r ang e of high -vol tage Integrated Circuits (ICs) for driving

LED lamps in general mains non-dimmable lighting applications.

The main benefits of these products are:

•Small Printed-Circuit Board (PCB) footprint, and compact solution

•High efficiency (up to 95 %)

•Ease of integration

•Low electronic Bill Of Material (BOM)

These ICs incorporate a 300 V or 600 V MOSFET.

The ICs work as boundary conduction mode converters, typically in buck configuration.

The IC range has been designed to start up directly from the HV supply by an internal

high-voltage current source. Thereafter, the dV/dt supply is used with capacitive coupling

from the drain, or any other auxiliary supply. This function provides full flexibility in the

application design. The IC consumes 1.3 mA of supply current with an internal clamp

limiting the supply voltage.

The ICs provide accurate output current control with LED current accuracy within 5 %.

The ICs can be operated using Pulse-Width Modulation (PWM) current regulation and has

many protection features including easy LED temperature feedback.

2. Features and benefits

LED driver ICs for driving LED strings from a rectified mains supply

High-efficiency switch mode buck driver product family:

SSL21081AT/SSL21081T: drivers with integrated 300 V (DC) power switches

SSL21083AT/SSL21083T: drivers with integrated 600 V (DC) power switches

Controller with power-efficient boundary conduction mode of operation with:

No reverse recovery losses in freewheel diode

Zero Current Switching (ZCS) for turn -o n of switch

Zero voltage or valley switching for turn-on of switch

Minimal required inductance value and size

Direct PWM current regulation possible

Fast transient response through cycle-by-cycle current control:

Negligible AC mains ripple at LED current and mi nima l to tal capacitor value

SSL21081/SSL21083

Compact non-dimmable LED driver IC

Rev. 5 — 11 October 2012 Product data sheet

Product data sheet Rev. 5 — 11 October 2012 2 of 22

NXP Semiconductors SSL21081/SSL21083

Compact non-dimmable LED driver IC

No over or undershoots in the LED current

No binning on LED forward voltage required

Internal Protections:

UnderVoltage LockOut (UVLO)

Leading-Edge Blanking (LEB)

OverCurrent Protection (OCP)

Short-Winding Protection (SWP) SSL21081T/SSL21083T only

Internal OverTemperature Protection (OTP)

Brownout protection

Output Short Protection (OSP)

Low component count (see Figure 3) LED driver solution:

No Schottky diode required due to ZCS

No dim switch and high-side driver required for PWM current regulation

Easy external temperature protection with a single NTC resistor

Option for soft-start function

Compatible with wall switches with built-in indication light during standby1

IC lifetime easily matches or surpasses LED lamp lifetime

3. Applications

SSL21081/SSL21083 products are intended for compact mains non-dimmable LED

lighting applications with accurate fixed current output for single mains input voltages.

Mains input voltages include 100 V (AC), 120 V (AC) and 230 V (AC). The output signal

can be modulated usin g a PWM sign al.

1. The Hotaru switch is a well known wall switch with built-in light

Product data sheet Rev. 5 — 11 October 2012 3 of 22

NXP Semiconductors SSL21081/SSL21083

Compact non-dimmable LED driver IC

4. Quick reference data

[1] The maximum operating voltage at VCC can exceed 14 V when determined by the IC using the dV/Dt

supply.

5. Ordering information

Table 1. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

VCC supply voltage operating range [1] 8 - 14 V

RDSon drain-source on-state

resistance SSL21083T/SSL21083AT;

Tj = 25 C4 5 6 

SSL21083T/SSL21083AT;

Tj = 125 C67.5 9

SSL21081T/SSL21081AT;

Tj = 25 C2.05 2.3 2.55 

SSL21081T/SSL21081AT;

Tj = 125 C3.05 3.45 3.85 

fconv conversion frequency -100 -kHz

IDRAIN current on pin DRAIN SSL21083T/SSL21083AT 1 - 1 A

SSL21081T/SSL21081AT 2 - 2 A

VDRAIN voltage on pin DRAIN SSL21083T/SSL21083AT 0.4 -600 V

SSL21081T/SSL21081AT 0.4 -300 V

Table 2. Ordering information

Type number Package

Name Description Version

SSL21081T SO8 plastic small package outline body; 8 lea ds; body width

3.9 mm SOT96-1

SSL21083T

SSL21081AT

SSL21083AT

Product data sheet Rev. 5 — 11 October 2012 4 of 22

NXP Semiconductors SSL21081/SSL21083

Compact non-dimmable LED driver IC

5.1 Ordering options

Remark: All voltages are in V (AC) unless otherwise specified.

6. Block diagram

Table 3. Ordering options

Type Input voltage Internal MOSFET

characteristics Package Short-winding

protection

SSL21081T 100 V; 120 V 300 V (DC); 2 SO8 yes

SSL21081AT no

SSL21083T 100 V; 120 V; 230 V 600 V (DC); 5 SO8 yes

SSL21083AT no

Fig 1. SSL21081 /SSL21083 block diagram

aaa-005191

JFETHV

VCC

NTC

GND

DVDT

DRAIN

SOURCE

1.5 V

SUPPLY:

INTERNAL

REGULATOR

AND

BANDGAP

dV/dt

SUPPLY

VALLEY

DETECTION

TOFFMAX

LOGIC

TONMAX

BLANK

LOGIC

CONTROL

AND

PROTECTION

NTC

FUNCTION

THERMAL

SHUTDOWN

POR

0.5 V < >0.25 V

6, 7

Product data sheet Rev. 5 — 11 October 2012 5 of 22

NXP Semiconductors SSL21081/SSL21083

Compact non-dimmable LED driver IC

7. Pinning information

7.1 Pinning

7.2 Pin description

Fig 2. SSL21081 /SSL21083 pin configuration (SO8)

HV DRAIN

SOURCE GND

VCC GND

NTC DVDT

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Table 4. Pin descripti on

Symbol Pin (SO8) Description

HV 1high-voltage supply pin

SOURCE 2low-side internal switch

VCC 3supply voltage

NTC 4LED temperature protection input

DVDT 5AC supply pin

GND 6, 7 ground

DRAIN 8high-side internal switch

Product data sheet Rev. 5 — 11 October 2012 6 of 22

NXP Semiconductors SSL21081/SSL21083

Compact non-dimmable LED driver IC

8. Functional description

8.1 Converter operation

The converter in the SSL21081/SSL21083 is a Boundary Conduction Mode (BCM), peak

current controlled system. For the basic application diagram see Figure 3, for the

waveforms see Figure 4. This converter type operates at the boundary between

continuous and discontinuous mode. Energy is stored in inductor L each period that the

switch is on. The inductor current IL is zero when the internal MOSFET switch is switched

on. Thereafter, the amplitude of the current build-up in L is proportional to VIN VOUT and

the time that the internal MOSFET switch is on. When the internal MOSFET switch is

switched off, the current continues to flow through the freewheel diode and the output

capacitor. The current then falls at a rate proportional to the value of VOUT. The LED

current ILED is almost equal to half the peak switch current. A new cycle is started, as soon

as the inductor current IL is zero.

8.2 Valley detection

A new cycle is started when the primary switch is switched on (see Figure 4). Following

time t1, when the peak current is detected on the SOURCE pin, the switch is turned off

and the secondary stroke starts (3). When the secondary stroke is complete and the coil

current at t3 equals zero, the drain voltage starts to oscillate around the VIN  VOUT level.

The amplitude equals VOUT. A special feature, called valley detection is an integrated part

of the SSL21081/SSL 2 10 8 3 circu itr y. Dedicate d bu ilt- in circuitry connecte d to th e DRAI N

pin, senses when the voltage on the drain of th e switch has r eache d its lowest value. The

next cycle is then started and as a result the capacitive switching losses are reduced.

A valley is detected and accepted if both the frequency of the oscillations and the voltage

swing are within the range specified (fring and ∆Vvrec(min)) for detection. If a valid valley is

not detected, the secondary stroke is continued until the maximum off-time (toff(high)) is

reached, then the next cycle is started.

Fig 3. Basic SSL21081/SSL21083 application diagra m

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Rinrush

NTC

6, 7

GND SOURCE

NTC Rsense

DVDT DRAIN

Vsec

LEDs

VCC

Product data sheet Rev. 5 — 11 October 2012 7 of 22

NXP Semiconductors SSL21081/SSL21083

Compact non-dimmable LED driver IC

8.3 Protective features

The IC has the following protective features:

•UnderVoltage LockOut (UVLO)

•Leading-Edge Blanking (LEB)

•OverCurrent Protection (OCP)

•Internal OverTemperature Protection (OTP)

•Brownout protection

•Short-Winding Protection (SWP) SSL21081T/SSL21083T only

•Output Short Protection (OSP)

•LED overtemperature control and protection

The SWP and the OSP are latched protections. These protections cause the IC to halt

until a reset (a result of power cycling) is executed. When VCC drops lower than VCC(rst),

the IC resets the latch protection mode. The internal OTP and LED over temperature

protections are safe-restart protections. The IC halts, causing VCC to fall lower than

VCC(stop), and instigates start-up. When VCC drops lower than VCC(rst), the IC resets the

latch protection mode. Switching starts only when no fault condition exists.

8.3.1 UnderVoltage LockOut (UVLO)

When the voltage on the VCC pin drops lower than VCC(stop), the IC stops switching. An

attempt is then made to restart by supplying VCC from the HV pin voltage.

Fig 4. Buck waveforms and valley detection

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demagnetization

VIN

valley

internal MOSFET switch

VGATE

VOUT

magnetization

t0t00

t2t3

Product data sheet Rev. 5 — 11 October 2012 8 of 22

NXP Semiconductors SSL21081/SSL21083

Compact non-dimmable LED driver IC

8.3.2 Leading-Edge Blanking (LEB)

To prevent false detection of the short-winding or overcurr en t, a bla nk i ng time follo win g

switch-on is implemented. When the internal MOSFET switch turns on there can be a

short current spike due to capacitive discharge of voltage over the drain and source.

During the LEB time (tleb), the spike is disregarded.

8.3.3 OverCurrent Protection (OCP)

The SSL21081/SSL21083 contain a highly accurate built-in peak current detector. It

triggers when the voltage at the SOURCE pin reaches the peak-level Vth(ocp)SOURCE. The

current throug h th e switch is sensed using a resistor connected to the SOURCE pin. The

sense circuit is activated following LEB time tleb. As the LED current is half the peak

current (by design), it automatically provides protection for maximum LED current during

operation. There is a propagation delay between overcurrent detection and the actual

closure of the switch t d(ocp-swoff). Due to the dela y, the actual peak current is slightly higher

than the OCP level set by the resistor in series to the SOURCE pin.

8.3.4 OverTemperature Protection (OTP)

When the internal OTP function is triggered at a certain IC temperature (Tth(act)otp), the

converter stops operating. The safe-restart protection is triggered and the IC restarts

again with switching resuming when the IC temperature drops lower than Tth(rel)otp.

8.3.5 Brownout protection

Brownout protection is designed to limit the lamp power when the input voltage drops

close to the output voltage level. Since the input power has to remain constant, the input

current would otherwise increase to a level that is too large for the input circuitry. For the

SSL21081/SSL21083, there is a maximum limit on the on-time ton(high). The rate of current

rise in the coil during the on-phase is proportional to the difference between input voltage

and output voltage. Therefore, the peak current cannot be reached before ton(high) and as

a result the average output current to the LEDs is reduced.

8.3.6 Short-Winding Protection (SWP) SSL21081T/SSL21083T only

SWP activates if there is a steep r ising current thr ough the MOSFET and thus through the

external resistor connected to the SOURCE pin. This current can occur when there is a

short from the freewheel diode. Additionally, it occurs due to a small/shorted inductor

between the input volta ge and the DRAIN pin. If the volt age on the SOURCE pin is greater

than 1.5 V, latched protection is triggered following LEB time tleb. In addition, if VCC drops

lower than VCC(rst) the IC resets the latched protection mode.

8.3.7 Output Short Protection (OSP)

During t he seco nd stroke (switc h-of time), if a valley is not detected within the off-time limit

(toff(high)), then typically the output voltage is less than the minimum limit allowed in the

application. This condition can occur either during starting up or due to a short. A timer is

started when toff(high) is detected, and is stopped only if a valid valley-detection occurs in

one of the subsequent cycles.

If a valley is not detected for tdet(sc), it is conclude d th at a re al sh or t-c i rc uit ex ists and not

start-up. The IC enters latched protection. If VCC drops lower than VCC(rst), the IC resets

the latched protection mode. During PWM current regulation, the OSP timer is paused

during the off-cycle of the PWM signal.

Product data sheet Rev. 5 — 11 October 2012 9 of 22

NXP Semiconductors SSL21081/SSL21083

Compact non-dimmable LED driver IC

8.4 VCC supply

The SSL21081/SSL21083 are supplied using three methods:

•Under normal operation, the voltage swing on the DVDT pin is rectified within the IC

providing current towards the VCC pin

•At start-up, there is an internal current source connected to the HV pin. The current

source provides internal power until either the dV/dt supply or an external current on

the VCC pin provides the supply

•An external voltage source can be connected to the VCC pin

The IC starts up when the voltage at the VCC pin is higher than VCC(startup). The IC loc ks

out (stops switching) when the voltage at the VCC pin is lower than VCC(stop). The

hysteresis between the start and stop levels allows the IC to be supplied by a buffer

capacitor until the dV/dt supply is settled. The SSL21081/SSL21083 has an internal VCC

clamp, which is an internal active Zener (or shunt regulator). This internal active Zener

limits the voltage on the supply VCC pin to the maximum value of VCC. If the maximum

current of the dV/ dt supply minus the cu rr ent consumption of the IC (determined by the

load on the gate drivers), is lower than the maximum value of IDD no exte rnal Ze ner diode

is needed in the dV/dt supply circuit.

8.5 DVDT pin supply (dV/dt)

The DVDT pin is connected to an internal single-sided rectification stage. When an

alternating voltage with sufficient amplitude is supplied to the pin, the IC can be powered

without any other external power con n ect ion . This solution provides an effective method

to prevent the additional high- power losses, which would result if a regulator were used for

continuously powering the IC. Unlike an auxiliary supply, additional inductor windings are

not needed.

8.6 VCC regulator

During supply dips, the input voltage can drop too low to supply the required IC current

through the DVDT pin. Under these conditions, if the VCC voltage drops lower than

VCC(swon)reg level, another regulator with a current capability of up to Isup(high)HV is started.

The job of the regulator is to fill in the required supply current, which the dV/dt supply does

not deliver, thus preventing the IC going into UVLO. When the VCC volt age is higher than

VCC(swon)reg level, the regulator is turned off.

8.7 NTC function and PWM current regulation

The NTC pin can be used as a control method for LED thermal protection. Alternatively,

the pin can be used as an input to disable/enable light output using a digital signal (PWM

current regulation). The pin has an internal current source that generates the current of

Ioffset(NTC). An NTC resistor to monitor the LED temperature can be directly connected to

the NTC pin. Depending on the resistance value and the corresponding voltage on the

NTC pin, the converter reacts as shown in Figure 5.

Product data sheet Rev. 5 — 11 October 2012 10 of 22

NXP Semiconductors SSL21081/SSL21083

Compact non-dimmable LED driver IC

When the volt age on the NTC pin is higher than Vth(high)NTC see Figure 5 (4), the converter

delivers nominal output current. When th e voltage is lower than this level, the peak current

is gradually reduced until Vth(low)NTC is reached, se e Figure 5 (3). The peak current is now

half the peak curr ent of nomin al operation. When Vact(tmr)NTC is pa ssed, se e Figure 5 (2) a

timer starts to run to distinguish between the following situations:

•If the low-level Vdeact(tmr)NTC is not reached within time tto(deact)NTC, Figure 5 (1) LED

overtempe ratu re is dete ct ed . Th e IC stops switching and attempts to restart from the

HV pin voltage. Restart takes place when the voltage on NTC pin is higher than

Vth(high)NTC, see Figure 5 (4). It is assumed that the reduction in peak current did not

result in a lower NTC temperature and LED OTP is activated.

•If the low-level Vdeact(tmr)NTC is reached within the time tto(deact)NTC, Figure 5 (1) it is

assumed that the pin is pulled down externally. The restart function is not trig gered.

Instead, the output current is reduced to zero. PWM current regulation can be

implemented this way. The output current rises again when the voltage is higher than

Vdeact(tmr)NTC.

8.7.1 Soft-start function

The NTC pin can be used to make a soft start function. During switch-on, th e level on the

NTC pin is low. By connecting a capacitor (in parallel with the NTC resistor), a time

constant can be defined. The time constant causes the level on the NTC pin to increase

slowly. When passing level Vth(low)NTC Figure 5 (3), the convertor starts with half of the

maximum current. The output current slowly increases to maximum when Vth(high)NTC

Figure 5 (4) is reached.

Fig 5. NTC control curve

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2 3 4 5

Ipk

Peak current

Ipk / 2

Vth(ocp)SOURCE = 500 mV

Vth(ocp)SOURCE = 250 mV

VNTC

Vth(high)NTC

Vth(low)NTC

Vact(tmr)NTC

Vdeact(tmr)NTC

Product data sheet Rev. 5 — 11 October 2012 11 of 22

NXP Semiconductors SSL21081/SSL21083

Compact non-dimmable LED driver IC

8.8 Heat sink

The copper of the PCB acts as the heat sink for SSL21081/SSL21083 applications.

Equation 1 shows the relation between the maximum allowable power dissipation P and

the thermal resistance from junction to ambient.

(1)

Where:

Rth(j-a) = thermal resistance from junction to ambient

Tj(max) = maximum junction temperature

Tamb = ambient temperature

P = power dissipation

Rth j a– Tjmax

Tamb

–P=

Product data sheet Rev. 5 — 11 October 2012 12 of 22

NXP Semiconductors SSL21081/SSL21083

Compact non-dimmable LED driver IC

9. Limiting values

[1] An internal clamp sets the supply voltage and current limits.

[2] Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor.

[3] Charged device model: equivalent to charging the IC up to 1 kV and the subsequent discharging of each

pin down to 0 V over a 1 resistor.

Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

General

SR slew rate on pin DRAIN 5+5 V/ns

Ptot total power dissipation SO8 package -0.6 W

Tamb ambient temperature 40 +125 C

Tjjunction temperature 40 +150 C

Tstg storage temperature 55 +150 C

Voltages

VCC supply voltage continuous [1] 0.4 +14 V

VDRAIN voltage on pin DRAIN 600 V (DC) version 0.4 +600 V

300 V (DC) version 0.4 +300 V

VHV voltage on pin HV current limited 0.4 +600 V

VSOURCE voltage on pin SOURCE current limited 0.4 +5.2 V

VNTC voltage on pin NTC current limited 0.4 +5.2 V

Currents

IDD supply current at pin VCC [1] -20 mA

IDRAIN current on pin DRAIN 600 V (DC) version 1+1 A

300 V (DC) version 2+2 A

ISOURCE current on pin SOURCE 600 V (DC) version 1+1 A

300 V (DC) version 2+2 A

IDVDT current on pin DVDT duration 20 s

maximum -1.3 A

VESD electrostatic discharge

voltage human body model;

(for all pins except

DRAIN and HV)

[2] 2+2 kV

human body mode l

for DRAIN and HV 1+1 kV

charged device [3] 500 +500 V

Product data sheet Rev. 5 — 11 October 2012 13 of 22

NXP Semiconductors SSL21081/SSL21083

Compact non-dimmable LED driver IC

10. Thermal characteristics

11. Characteristics

Table 6. Thermal characteristics

Symbol Parameter Conditions Typ Unit

Rth(j-a) thermal resistance from junction to ambient in free air; SO8 package, PCB: 2 cm 3 cm,

2-layer, 35 m Cu per layer 142 K/W

in free air; SO8 package; PCB: JEDEC 2s2p 72 K/W

j-top t hermal resistance from junction to top top package temperature measured at the

warmest point on top of the case; SO8 package 3.4 K/W

Table 7. Characteristics

Symbol Parameter Conditions Min Typ Max Unit

fconv conversion frequency -100 -kHz

High-voltage

Ileak(DRAIN) leakage current on pin DRAIN VDRAIN = 600 V (DC) --10 A

VDRAIN = 300 V (DC) --10 A

Ileak(HV) leakage current on pin HV VHV = 600 V (DC) --30 A

VHV = 300 V (DC) --30 A

Supply

VCC supply voltage operating range [1] 8 - 14 V

VCC(startup) start-up supply voltage 11 12 13 V

VCC(stop) stop supply voltage 8910 V

VCC(hys) hysteresis of suppl y vol tage between VCC(startup) and VCC(stop) 2 - - V

VCC(rst) reset supply voltage 4.5 55.5 V

VCC(swon)reg regulator switch-on supply

voltage insufficient dV/dt supply 8.75 9.25 9.75 V

VCC(swoff)reg regulator switch-off supply

voltage insufficient dV/dt supply 9.5 10 10.5 V

VCC(reg)hys regulator supply voltage

hysteresis VCC(swoff)reg  VCC(swon)reg 0.3 - - V

VCC(regswon-stop) supply voltage difference

between regulator switch-on and

stop

VCC(swon)reg  VCC(stop) 0.3 - - V

Consumption

Istb(HV) standby current on pin HV during start-up or in protection;

VHV = 100 V 300 350 400 A

ICC supply current normal operation -1.3 -mA

Product data sheet Rev. 5 — 11 October 2012 14 of 22

NXP Semiconductors SSL21081/SSL21083

Compact non-dimmable LED driver IC

Capability

Isup(high)HV high sup ply current on pin HV Standby: VHV = 40 V;

VCC < VCC(stop)

11.3 1.6 mA

Regulator On: VHV = 40 V;

VCC < VCC(swon)reg after start-up 22.3 2.6 mA

Current and SWP

Vth(ocp)SOURCE overcurrent protection threshold

voltage on pin SOURCE V/t = 0.1 V/s480 500 520 mV

V/t = 0.1 V/s; VNTC = 0.325 V 230 250 270 mV

td(ocp-swoff) delay time from overcurren t

protection to switch-off V/t = 0.1 V/s - 75 100 ns

tleb leading edge bla nking time overcurrent protection 260 300 340 ns

short-winding protection 210 250 290 ns

tleb leading edge blanking time

difference between tleb for overcurrent

protection and short-winding

protection

30 50 -ns

Vth(swp)SOURCE short-winding protection

threshold voltage on pin

SOURCE

SSL21081 and SSL2108 3T only 1.4 1.5 1.6 V

Valley detection

(V/t)vrec valley recognition voltage change

with time on pin DRAIN 30 20 10 V/s

fring ringing frequency [2] 200 550 1000 kHz

Vvrec(min) minimum valley recognition

voltage difference voltage drop on pin DRAIN 15 20 25 V

td(vrec-swon) valley recognition to switch-on

delay time -100 -ns

Brownout detection

ton(high) high on-time 12.5 15 17.5 s

MOSFET output stage

VBR(DRAIN) breakdown voltage on pin DRAIN 600 V (DC) version; Tj > 0 C600 - - V

300 V (DC) version; Tj > 0 C300 - - V

RDSon drain-source on -state resist a nce 600 V (DC) version; Tj = 25 C 4 5 6 

600 V (DC) version; Tj = 125 C 6 7.5 9

300 V (DC) version; Tj = 25 C2.05 2.3 2.55 

300 V (DC) version; Tj = 125 C3.05 3.45 3.85 

dV/dt)f(DRAIN) fall rate of change of voltage on

pin DRAIN 300 V (DC) version;

CDRAIN = 150 pF, RSOURCE = 2.2 

[2] -1.2 -V/ns

600 V (DC) version;

CDRAIN = 75 pF; RSOURCE = 1.2 

-1.5 -V/ns

Table 7. Characteristics …continued

Symbol Parameter Conditions Min Typ Max Unit

Product data sheet Rev. 5 — 11 October 2012 15 of 22

NXP Semiconductors SSL21081/SSL21083

Compact non-dimmable LED driver IC

[1] The maximum operating voltage at VCC can exceed 14 V when determined by the IC using the dV/dt supply.

[2] This parameter is not tested during production, by design it is guaranteed.

NTC function

Vth(high)NTC high threshold voltage on pin

NTC 0.47 0.5 0.53 V

Vth(low)NTC low threshold voltage on pin NTC 0.325 0.35 0.375 V

Vact(tmr)NTC timer activation voltage on pin

NTC 0.26 0.29 0.325 V

Vdeact(tmr)NTC timer deactivation voltage on pin

NTC 0.17 0.2 0.23 V

tto(deact)NTC deactivation time-out time on pin

NTC 33 46 59 s

Ioffset(NTC) offset current on pin NTC -47 -A

OSP

tdet(sc) short-circuit de tection time 16 20 24 ms

toff(high) high off-time 30 36 42 s

Temperature prote c t io ns

Tth(act)otp overtemperature protection

activation threshold temperature 160 170 180 C

Tth(rel)otp overtemperature protection

release threshold temperature 90 100 110 C

Table 7. Characteristics …continued

Symbol Parameter Conditions Min Typ Max Unit

Product data sheet Rev. 5 — 11 October 2012 16 of 22

NXP Semiconductors SSL21081/SSL21083

Compact non-dimmable LED driver IC

12. SSL21081/SSL21083 buck configuration

Further application information can b e found in th e SSL21081 /SSL21083 application note.

Fig 6. Buck configuration for SSL21081/SSL21083

001aan696

10 Ω

RT1

NTC

C1 C2

IC1

fuse

RGND

mains

HV 81 DRAIN

SOURCE

RGND

72 GND

VCC 63 GND

NTC 54 DVDT

LED1...n

LED+

LED-

Product data sheet Rev. 5 — 11 October 2012 17 of 22

NXP Semiconductors SSL21081/SSL21083

Compact non-dimmable LED driver IC

13. Package outline

Fig 7. Package outline SOT96-1 (SOT8)

UNIT A

max. A1A2A3bpcD

(1) E(2) (1)

ELL

pQZywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

inches

1.75 0.25

0.10 1.45

1.25 0.25 0.49

0.36 0.25

0.19 5.0

4.8 4.0

3.8 1.27 6.2

5.8 1.05 0.7

0.6 0.7

0.3 8

0.25 0.10.25

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

1.0

0.4

SOT96-1

detail X

vMA

(A )

pin 1 index

076E03 MS-012

0.069 0.010

0.004 0.057

0.049 0.01 0.019

0.014 0.0100

0.0075 0.20

0.19 0.16

0.15 0.05 0.244

0.228 0.028

0.024 0.028

0.012

0.010.010.041 0.004

0.039

0.016

0 2.5 5 mm

scale

SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1

99-12-27

03-02-18

Product data sheet Rev. 5 — 11 October 2012 18 of 22

NXP Semiconductors SSL21081/SSL21083

Compact non-dimmable LED driver IC

14. Abbreviations

15. References

[1] AN11040 — Drivers for LED lighting - application note

Table 8. Abbreviations

Acronym Description

BCM Boundary Conduction Mode

BOM Bill Of Materials

LED Light Emitting Diode

LEB Leading-Edge Blanking

MOSFET Metal-Oxide Semiconductor Field-Effect Transistor

OCP OverCurrent Protection

OSP Output Short Protection

OTP OverTemperature Protection

PCB Printed-Circuit Board

PWM Pulse-Width Modulation

SWP Short-Winding Protection

UVLO UnderVoltage LockOut

ZCS Zero Current Switching

Product data sheet Rev. 5 — 11 October 2012 19 of 22

NXP Semiconductors SSL21081/SSL21083

Compact non-dimmable LED driver IC

16. Revision history

Table 9. Revision history

Document ID Release date Data sheet status Change notice Supersedes

SSL21081_SSL21083 v.5 20121011 Product data sheet -SSL2108_SER v.4

SSL2108_SER v.4 20120508 Product data sheet -SSL21081T_2T_3 T_4T v.3.1

SSL21081T_2T_3T_4T v.3.1 20120222 Product data sheet -SSL21081T_2T_3T_4T v.3

SSL21081T_2T_3T_4T v.3 20120214 Product data sheet -SSL21081T_2T_3T_4T v.2

SSL21081T_2T_3T_4T v.2 20111206 Preliminary data sheet -SSL2108X v.1

SSL2108X v.1 20110909 Preliminary data sheet - -

Product data sheet Rev. 5 — 11 October 2012 20 of 22

NXP Semiconductors SSL21081/SSL21083

Compact non-dimmable LED driver IC

17. Legal information

17.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

17.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the shor t data sheet, the

full data sheet shall pre vail.

Product specificatio n — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyond those described in the

Product data sheet.

17.3 Disclaimers

Limited warr a nty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information. NXP Se miconductors takes no

responsibility for the content in this document if provided by an inf ormation

source outside of NXP Semiconductors.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequ ential damages (including - wit hout limitatio n - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggreg ate and cumulative li ability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use — NXP Semiconductors product s are not designed,

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in perso nal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconducto rs products in such equipment or

applications and ther efore such inclu sion and/or use is at the cu stomer’s own

risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty tha t such application s will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semicondu ctors products , and NXP Semiconductors

accepts no liability for any assistance with applications or cu stomer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by custo m er’s

third party customer(s). Customer is responsible for doing all necessary

testing for th e customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanent ly and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are so ld subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the term s and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing i n this document may be interpreted or

construed as an of fer t o sell product s that is open for accept ance or t he grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data from the objective specification for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.

Product [short] dat a sheet Production This document contains the product specification.

Product data sheet Rev. 5 — 11 October 2012 21 of 22

NXP Semiconductors SSL21081/SSL21083

Compact non-dimmable LED driver IC

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automo tive use. It is neither qua lif ied nor test ed

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automot ive specifications and standard s, customer

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applicat ions, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed product cl aims resulting fr om customer design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

Translations — A non-English (translated) version of a document is for

reference only. The English version shall prevail in case of any discrepancy

between the translated and English versions.

17.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respect i ve ow ners.

GreenChip — is a trademark of NXP B.V.

18. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors SSL21081/SSL21083

Compact non-dimmable LED driver IC

For more information, please visit: http://www.nxp.co m

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 11 October 2012

Document i dentifier: SSL21081_SSL21083

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

19. Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1

3 Applications. . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

4 Quick reference data . . . . . . . . . . . . . . . . . . . . . 3

5 Ordering information. . . . . . . . . . . . . . . . . . . . . 3

5.1 Ordering options. . . . . . . . . . . . . . . . . . . . . . . . 4

6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4

7 Pinning information. . . . . . . . . . . . . . . . . . . . . . 5

7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5

8 Functional description . . . . . . . . . . . . . . . . . . . 6

8.1 Converter operation . . . . . . . . . . . . . . . . . . . . . 6

8.2 Valley detection. . . . . . . . . . . . . . . . . . . . . . . . . 6

8.3 Protective features . . . . . . . . . . . . . . . . . . . . . . 7

8.3.1 UnderVoltage LockOut (UVLO) . . . . . . . . . . . . 7

8.3.2 Leading-Edge Blanking (LEB) . . . . . . . . . . . . . 8

8.3.3 OverCurrent Protection (OCP) . . . . . . . . . . . . . 8

8.3.4 OverTemperature Protection (OTP) . . . . . . . . . 8

8.3.5 Brownout protection . . . . . . . . . . . . . . . . . . . . . 8

8.3.6 Short-Winding Protec tion (SWP)

SSL21081T/SSL21083T only. . . . . . . . . . . . . . 8

8.3.7 Output Short Protection (OSP). . . . . . . . . . . . . 8

8.4 VCC supply. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

8.5 DVDT pin supply (dV/dt). . . . . . . . . . . . . . . . . . 9

8.6 VCC regulator. . . . . . . . . . . . . . . . . . . . . . . . . . 9

8.7 NTC function and PWM current regu lation. . . . 9

8.7.1 Soft-start function . . . . . . . . . . . . . . . . . . . . . . 10

8.8 Heat sink. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

9 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 12

10 Thermal characteristics . . . . . . . . . . . . . . . . . 13

11 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 13

12 SSL21081/SSL2108 3 bu ck configuration. . . . 16

13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 17

14 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 18

15 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

16 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 19

17 Legal information. . . . . . . . . . . . . . . . . . . . . . . 20

17.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 20

17.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

17.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 20

17.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 21

18 Contact information. . . . . . . . . . . . . . . . . . . . . 21

19 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22