Technische Information / Technical Information
IGBT-Module
IGBT-Modules BSM 100 GD 60 DLC
Höchstzulässige Werte / Maximum rated values
Elektrische Eigenschaften / Electrical properties
Kollektor-Emitter-Sperrspannung
collector-emitter voltage VCES 600 V
Tc= 65°C IC,nom. 100 A
Tc= 25°C IC130 A
Periodischer Kollektor Spitzenstrom
repetitive peak collector current tP= 1ms, Tc= 65°C ICRM 200 A
Gesamt-Verlustleistung
total power dissipation Tc= 25°C, Transistor Ptot 430 W
Gate-Emitter-Spitzenspannung
gate-emitter peak voltage VGES +/- 20V V
Dauergleichstrom
DC forward current IF100 A
Periodischer Spitzenstrom
repetitive peak forw. current tP= 1ms IFRM 200 A
Grenzlastintegral der Diode
I2t - value, Diode VR= 0V, tp= 10ms, Tvj= 125°C I2t3.200 A2s
Isolations-Prüfspannung
insulation test voltage RMS, f= 50Hz, t= 1min. VISOL 2,5 kV
Charakteristische Werte / Characteristic values
Transistor / Transistor min. typ. max.
IC= 100A, VGE= 15V, Tvj= 25°C - 1,95 2,45 V
IC= 100A, VGE= 15V, Tvj= 125°C - 2,20 - V
Gate-Schwellenspannung
gate threshold voltage IC= 1,5mA, VCE= VGE, Tvj= 25°C VGE(th) 4,5 5,5 6,5 V
Eingangskapazität
input capacitance f= 1MHz, Tvj= 25°C, VCE= 25V, VGE= 0V Cies - 4,3 - nF
Rückwirkungskapazität
reverse transfer capacitance f= 1MHz, Tvj= 25°C, VCE= 25V, VGE= 0V Cres - 0,4 - nF
VCE= 600V, VGE= 0V, Tvj= 25°C - 1 500 µA
VCE= 600V, VGE= 0V, Tvj= 125°C -1-mA
Gate-Emitter Reststrom
gate-emitter leakage current VCE= 0V, VGE= 20V, Tvj= 25°C IGES - - 400 nA
prepared by: Andreas Vetter date of publication: 2000-04-26
approved by: Michael Hornkamp revision: 1
Kollektor-Dauergleichstrom
DC-collector current
VCE sat
ICES
Kollektor-Emitter Sättigungsspannung
collector-emitter saturation voltage
Kollektor-Emitter Reststrom
collector-emitter cut-off current
1 (8) BSM 100 GD 60 DLC
2000-02-08
Technische Information / Technical Information
IGBT-Module
IGBT-Modules BSM 100 GD 60 DLC
Charakteristische Werte / Characteristic values
Transistor / Transistor min. typ. max.
IC= 100A, VCC= 300V
VGE= ±15V, RG= 2,2, Tvj= 25°C td,on -25-ns
VGE= ±15V, RG= 2,2, Tvj= 125°C -25-ns
IC= 100A, VCC= 300V
VGE= ±15V, RG= 2,2, Tvj= 25°C tr-10-ns
VGE= ±15V, RG= 2,2, Tvj= 125°C -11-ns
IC= 100A, VCC= 300V
VGE= ±15V, RG= 2,2, Tvj= 25°C td,off - 130 - ns
VGE= ±15V, RG= 2,2, Tvj= 125°C - 150 - ns
IC= 100A, VCC= 300V
VGE= ±15V, RG= 2,2, Tvj= 25°C tf-20-ns
VGE= ±15V, RG= 2,2, Tvj= 125°C -30-ns
IC= 100A, VCC= 300V, VGE= 15V
RG= 2,2, Tvj= 125°C, Lσ= 15nH
IC= 100A, VCC= 300V, VGE= 15V
RG= 2,2, Tvj= 125°C, Lσ= 15nH
tP 10µsec, VGE 15V
Tvj125°C, VCC=360V, VCEmax= VCES -LσCE ·di/dt
Modulinduktivität
stray inductance module LσCE - 28 - nH
Modul-Leitungswiderstand, Anschlüsse - Chip
lead resistance, terminals - chip Tc= 25°C RCC'+EE' - 1,8 - m
Charakteristische Werte / Characteristic values
Diode / Diode min. typ. max.
Durchlaßspannung IF= 100A, VGE= 0V, Tvj= 25°C - 1,25 1,6 V
forward voltage IF= 100A, VGE= 0V, Tvj= 125°C - 1,20 - V
IF= 100A, -diF/dt= 4400A/µsec
VR= 300V, VGE= -10V, Tvj= 25°C IRM - 150 - A
VR= 300V, VGE= -10V, Tvj= 125°C - 180 - A
IF= 100A, -diF/dt= 4400A/µsec
VR= 300V, VGE= -10V, Tvj= 25°C Qr- 7,7 - µC
VR= 300V, VGE= -10V, Tvj= 125°C -13-µC
IF= 100A, -diF/dt= 4400A/µsec
VR= 300V, VGE= -10V, Tvj= 25°C Erec ---mJ
VR= 300V, VGE= -10V, Tvj= 125°C - 3,2 - mJ
Abschaltenergie pro Puls
reverse recovery energy
A
VF
Rückstromspitze
peak reverse recovery current
Sperrverzögerungsladung
recoverred charge
ISC - 450 -
- 2,9 - mJ
- 1,0 - mJ
Einschaltverzögerungszeit (ind. Last)
turn on delay time (inductive load)
Anstiegszeit (induktive Last)
rise time (inductive load)
Abschaltverzögerungszeit (ind. Last)
turn off delay time (inductive load)
Fallzeit (induktive Last)
fall time (inductive load)
Eoff
Eon
Einschaltverlustenergie pro Puls
turn-on energy loss per pulse
Abschaltverlustenergie pro Puls
turn-off energy loss per pulse
Kurzschlußverhalten
SC Data
2 (8) BSM 100 GD 60 DLC
2000-02-08
Technische Information / Technical Information
IGBT-Module
IGBT-Modules BSM 100 GD 60 DLC
Thermische Eigenschaften / Thermal properties min. typ. max.
- - 0,29 K/W
- - 0,55 K/W
Übergangs-Wärmewiderstand
thermal resistance, case to heatsink pro Modul / per module
λPaste= 1W/m*K / λgrease= 1W/m*K RthCK - 0,01 K/W
Höchstzulässige Sperrschichttemperatur
maximum junction temperature Tvj - - 150 °C
Betriebstemperatur
operation temperature Top -40 - 125 °C
Lagertemperatur
storage temperature Tstg -40 - 125 °C
Mechanische Eigenschaften / Mechanical properties
4Nm
-15 +15 %
Mit dieser technischen Information werden Halbleiterbauelemente spezifiziert, jedoch keine Eigenschaften zugesichert.
Sie gilt in Verbindung mit den zugehörigen Technischen Erläuterungen.
This technical information specifies semiconductor devices but promises no characteristics.
It is valid in combination with the belonging technical notes.
RthJC
Transistor / transistor, DC
Diode / diode, DC
Gehäuse, siehe Anlage
case, see appendix
Innere Isolation
internal insulation
Innerer Wärmewiderstand
thermal resistance, junction to case
CTI
comperative tracking index
Gewicht
weight G
Schraube M5
screw M5
Anzugsdrehmoment für mech. Befestigung
mounting torque
Al2O3
225
g310
M
3 (8) BSM 100 GD 60 DLC
2000-02-08
Technische Information / Technical Information
IGBT-Module
IGBT-Modules BSM 100 GD 60 DLC
IC [A]
VCE [V]
0
20
40
60
80
100
120
140
160
180
200
0,0 0,5 1,0 1,5 2,0 2,5 3,0 3,5
Tvj = 25°C
Tvj = 125°C
Ausgangskennlinie (typisch) IC= f (VCE)
Output characteristic (typical) VGE= 15V
0
20
40
60
80
100
120
140
160
180
200
0,0 0,5 1,0 1,5 2,0 2,5 3,0 3,5 4,0 4,5 5,0
VGE = 8V
VGE = 9V
VGE = 10V
VGE = 12V
VGE = 15V
VGE = 20V
Ausgangskennlinienfeld (typisch) IC= f (VCE)
Output characteristic (typical) Tvj= 125°C
4 (8) BSM 100 GD 60 DLC
2000-02-08
Technische Information / Technical Information
IGBT-Module
IGBT-Modules BSM 100 GD 60 DLC
IC [A]
VGE [V]
IF [A]
VF [V]
0
20
40
60
80
100
120
140
160
180
200
5 6 7 8 9 10 11 12 13
Tvj = 25°C
Tvj = 125°C
Übertragungscharakteristik (typisch) IC= f (VGE)
Transfer characteristic (typical) VCE= 20V
0
20
40
60
80
100
120
140
160
180
200
0,0 0,2 0,4 0,6 0,8 1,0 1,2 1,4 1,6
Tvj = 25°C
Tvj = 125°C
Durchlaßkennlinie der Inversdiode (typisch) IF= f (VF)
Forward characteristic of inverse diode (typical)
5 (8) BSM 100 GD 60 DLC
2000-02-08
Technische Information / Technical Information
IGBT-Module
IGBT-Modules BSM 100 GD 60 DLC
E [m J]
IC [A]
E [m J]
RG [
]
0,0
0,5
1,0
1,5
2,0
2,5
3,0
3,5
4,0
4,5
5,0
0 20 40 60 80 100 120 140 160 180 200
Eon
Eoff
Erec
Schaltverluste (typisch) E on= f (IC), Eoff= f (IC), Erec= f (IC)
Switching losses (typical) RG,on= 2,2Ω,
Ω,Ω,
Ω,=
==
=RG,off= 2,2
, VCC= 300V, Tvj= 125°C
0,0
0,5
1,0
1,5
2,0
2,5
3,0
3,5
4,0
012345678910
Eon
Eoff
Erec
Schaltverluste (typisch) Eon= f (RG), Eoff= f (RG), Erec= f (RG)
Switching losses (typical) IC= 100A , VCC= 300V , Tvj = 125°C
6 (8) BSM 100 GD 60 DLC
2000-02-08
Technische Information / Technical Information
IGBT-Module
IGBT-Modules BSM 100 GD 60 DLC
ZthJC
[K / W]
t [sec]
i 1234
ri [K/kW] : IGBT 12,3 152,0 102,2 23,5
τi [sec] : IGBT 0,0018 0,0240 0,0651 0,6626
ri [K/kW] : Diode 193,8 185,9 116,8 53,5
τi [sec] : Diode 0,0487 0,0169 0,1069 0,9115
IC [A]
VCE [V]
Sicherer Arbeitsbereich (RBSOA)
Reverse bias safe operation area (RBSOA) VGE= +15V, RG,off= 2,2Ω,
Ω,Ω,
Ω, Tvj= 125°C
Transienter Wärmewiderstand Z thJC = f (t)
Transient thermal impedance
0
20
40
60
80
100
120
140
160
180
200
220
0 100 200 300 400 500 600 700
IC,Modul
IC,Chip
0,001
0,01
0,1
1
0,001 0,01 0,1 1 10
Zth:IGBT
Zth:Diode
7 (8) BSM 100 GD 60 DLC
2000-02-08
Technische Information / Technical Information
IGBT-Module
IGBT-Modules BSM 100 GD 60 DLC
Gehäusemaße / Schaltbild
Package outline / Circuit diagram
21
7
8
9
10
5
6
4
3
connections to be made externa lly
12
1
20
2
13
14
P+ / P+ /
N- / N- /
IS8
11
19
17
15
119
94.5
118.11
123 5
19
612
3.8115.24 5 x 15.24 =76.2
110
19.05 3.81
4 x 19.0 5 = 7 6.2
99.9
121.5
1.15x1.0
4
18
789 1110
17 16 15
Econo 3
8 (8) BSM 100 GD 60 DLC
2000-02-08
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Attention
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staff. This Data Sheet is describing the specification of the products for which a
warranty is granted exclusively pursuant the terms and conditions of the supply
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