SPECIFICATION
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Supplier : Samsung electro-mechanics •
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• Samsung P/N : CL31B334KACNNNC
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Product : Multi-layer Ceramic Capacitor •
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Description : CAP, 330㎋
㎋㎋
㎋, 25V, ±10%, X7R, 1206
CL 31 B 334 K A C N N N C
①
①①
① ②
②②
② ③
③③
③ ④
④④
④ ⑤
⑤⑤
⑤ ⑥
⑥⑥
⑥ ⑦
⑦⑦
⑦ ⑧
⑧⑧
⑧ ⑨
⑨⑨
⑨ ⑩
⑩⑩
⑩ ⑪
⑪⑪
⑪
①
①①
①Series Samsung Multi-layer Ceramic Capacitor
②
②②
②Size 1206 (inch code) L: 3.2 ± 0.15 mm W: 1.6 ± 0.15 mm
③
③③
③Dielectric X7R ⑧
⑧⑧
⑧Inner electrode
④
④④
④Capacitance 330 ㎋Termination
⑤
⑤⑤
⑤Capacitance ±10 % Plating (Pb Free)
tolerance ⑨
⑨⑨
⑨Product Normal
⑥
⑥⑥
⑥Rated Voltage 25 V ⑩
⑩⑩
⑩Special Reserved for future use
⑦
⑦⑦
⑦Thickness 0.85 ± 0.15 mm ⑪
⑪⑪
⑪Packaging Cardboard Type, 7" reel
B. Samsung Reliablility Test and Judgement condition
Capacitance Within specified tolerance 1㎑±10% 1.0±0.2Vrms
Tan δ
δδ
δ (DF) 0.025 max.
Insulation 10,000Mohm or 500Mohm⋅㎌Rated Voltage 60~120 sec.
Resistance Whichever is Smaller
Appearance No abnormal exterior appearance Microscope (×10)
Withstanding No dielectric breakdown or of the rated voltage
Voltage mechanical breakdown
Temperature X7R
Characterisitcs (From -55℃ to 125℃, Capacitance change shoud be within ±15%)
Adhesive Strength No peeling shall be occur on the 500g⋅F, for 10±1 sec.
of Termination terminal electrode
Bending Strength Capacitance change : within ±12.5% Bending to the limit (1mm)
with 1.0mm/sec.
Solderability More than 75% of terminal surface SnAg3.0Cu0.5 solder
is to be soldered newly 245±5℃, 3±0.3sec.
(preheating : 80~120℃ for 10~30sec.)
Resistance to Capacitance change : within ±7.5% Solder pot : 270±5℃, 10±1sec.
Soldering heat Tan δ, IR : initial spec.
A. Samsung Part Number
Performance Test condition
250%
Sn 100%
Cu
Ni