(0.50 mm) .0197" QTH SERIES
QTH–030–01–L–D–A
QTH–060–07–F–D–A
QTH–090–01–C–D–A
Standard Stack Heights
from 5 mm to 25 mm
Integral metal plane for
power or ground
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
QTH PINS PER ROW
NO. OF PAIRS
PLATING
OPTION
–030, –060, –090
(60 total pins per bank = –D)
–020, –040, –060
(20 pairs per bank = –D–DP)
–F
= Gold Flash on
Signal Pins and
Ground Plane,
Matte Tin on tails
–L
= 10 µ" (0.25 µm)
Gold on Signal Pins
and Ground Plane,
Matte Tin on tails
–C*
= Electro-Polished
Selective
50 µ" (1.27 µm) min
Au over 150 µ" (3.81 µm)
Ni on Signal Pins in
contact area,
10 µ" (0.25 µm) min
Au over 50 µ" (1.27 µm)
Ni on Ground Plane
in contact area,
Matte Tin over
50 µ" (1.27 µm) min
Ni on all solder tails
–D
= Single-Ended
–D–DP
= Differential Pair
(–01 only)
LEAD
STYLE TYPE AOTHER
OPTION
–K
= (7.00 mm)
.275" DIA
Polyimide
film Pick &
Place Pad
(N/A with -05 &
-07 lead style)
–TR
= Tape & Reel
(–090 positions
maximum)
–L
= Latching
Option
(–01 lead
style only)
(N/A on
–060 (–D–DP)
& –090)
Specify
LEAD
STYLE
from
chart
HIGH-SPEED GROUND PLANE HEADER
QTH
LEAD
STYLE AHEIGHT
WITH
QSH*
–01 (4.27)
.168
(5.00)
.197
–02 (7.26)
.286
(8.00)
.315
–03 (10.27)
.404
(11.00)
.433
–04 (15.25)
.600
(16.00)
.630
–05 (18.26)
.718
(19.00)
.748
–07 (24.24)
.954
(25.00)
.984
–09 (13.26)
.522
(14.00)
.551
*Processing conditions
will affect mated height.
See SO Series for
board space tolerances
(20.00) .7875
–DP = (No. of Pairs per Row/20) x (20.00) .7875
–D = (No. of Pins per Row/30) x (20.00) .7875
(0.20)
.008
(0.50)
.0197
01
02
(7.11)
.280
(0.76)
.030
(0.64)
.025
A
A
(0.89)
.035
DIA
–01 & –02
–03 thru –09
–L
*Note:
–C Plating passes
10 year MFG testing
Note:
Some lengths, styles and
options are non-standard,
non-returnable.
For complete specifications and
recommended PCB layouts see
www.samtec.com?QTH
Insulator Material:
Liquid Crystal Polymer
Terminal Material:
Phosphor Bronze
Plating:
Au or Sn over 50 µ" (1.27 µm) Ni
Current Rating:
Contact:
2 A per pin
(2 pins powered)
Ground Plane:
25 A per ground plane
(1 ground plane powered)
Operating Temp Range:
-55 °C to +125 °C
Voltage Rating:
175 VAC (5 mm Stack Height)
Max Cycles: 100
RoHS Compliant: Ye s
SPECIFICATIONS
For complete scope of
recognitions see
www.samtec.com/quality
RECOGNITIONS
PROCESSING
Lead–Free Solderable: Ye s
SMT Lead Coplanarity:
(0.10 mm) .004" max (030-060)
(0.15 mm) .006" max (090)*
*(.004" stencil solution
may be available; contact
IPG@samtec.com)
Board Stacking:
For applications requiring
more than two connectors per
board contact ipg@samtec.com
FILE NO. E111594
Board Mates:
QSH
Cable Mates:
HQCD, HQDP
(See Also Available Note)
Standoffs:
SO
®
Compatible with
UMPT/UMPS for
flexible two-piece
power/signal solutions
POWER/SIGNAL
APPLICATION
F-219
Gbps
25
HIGH-SPEED CHANNEL PERFORMANCE
QTH/QSH @ 5 mm Mated Stack Height
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
or contact SIG@samtec.com
EXTENDED LIFE
PRODUCT
10 YEAR MFG
WITH 50 µ" GOLD
HIGH MATING
CYCLES
STANDARDS
• PISMO™ 1
Visit www.samtec.com/standards
for more information.
ALSO AVAILABLE
(MOQ Required)
• 15 mm, 22 mm and
30 mm stack height
• 30 µ" (0.76 µm) Gold
(Specify -H plating for
Data Rate cable mating
applications.)
• Edge Mount & Guide Posts
• 80 (-DP), 120, 150
positions per row
• Retention Option
