Pb
RoHS
ECCM1C-15-24.000M TR
ECCM1 C -15 -24.000M TR
Series
RoHS Compliant (Pb-free) 5.0mm x 7.0mm Ceramic
SMD Crystal
Frequency Tolerance/Stability
±30ppm at 25°C, ±50ppm over 0°C to +70°C
Mode of Operation
AT-Cut Fundamental
Packaging Options
Tape & Reel
Nominal Frequency
24.000MHz
Load Capacitance
15pF Parallel Resonant
ELECTRICAL SPECIFICATIONS
Nominal Frequency 24.000MHz
Frequency Tolerance/Stability ±30ppm at 25°C, ±50ppm over 0°C to +70°C
Aging at 25°C ±3ppm/year Maximum
Load Capacitance 15pF Parallel Resonant
Shunt Capacitance (C0) 7pF Maximum
Equivalent Series Resistance 30 Ohms Maximum
Mode of Operation AT-Cut Fundamental
Drive Level 50µWatts Maximum, 50µWatts Correlation
Spurious Response -3dB Minimum (Measured from Fo to Fo +5000ppm)
Storage Temperature Range -40°C to +85°C
Insulation Resistance 500 Megaohms Minimum (Measured at 100Vdc)
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
ESD Susceptibility MIL-STD-883, Method 3015, Class 1, HBM: 1500V
Fine Leak Test MIL-STD-883, Method 1014, Condition A
Flammability UL94-V0
Gross Leak Test MIL-STD-883, Method 1014, Condition C
Mechanical Shock MIL-STD-883, Method 2002, Condition B
Moisture Resistance MIL-STD-883, Method 1004
Moisture Sensitivity J-STD-020, MSL 1
Resistance to Soldering Heat MIL-STD-202, Method 210, Condition K
Resistance to Solvents MIL-STD-202, Method 215
Solderability MIL-STD-883, Method 2003
Temperature Cycling MIL-STD-883, Method 1010, Condition B
Vibration MIL-STD-883, Method 2007, Condition A
MECHANICAL DIMENSIONS (all dimensions in millimeters)
MARKING
ORIENTATION
7.00
±0.15
5.00
±0.15
1.3 MAX 1.0 ±0.2
(x4)
Note: Chamfer and index
mark not shown.
4.6
±0.2
1.2 ±0.1
(x4)
2.54 ±0.20
2
3
41
23
4
1
PIN CONNECTION
1 Crystal
2 Cover/Ground
3 Crystal
4 Cover/Ground
LINE MARKING
1E24.00
E=Ecliptek Designator
2XXXXX
XXXXX=Ecliptek
Manufacturing Identifier
www.ecliptek.com | Specification Subject to Change Without Notice | Rev T 8/12/2010 | Page 1 of 5
ECCM1C-15-24.000M TR
All Tolerances are ±0.1
Suggested Solder Pad Layout
Solder Land
(X4)
All Dimensions in Millimeters
3.6
1.1
1.4 (x4)
2.2 (X4)
www.ecliptek.com | Specification Subject to Change Without Notice | Rev T 8/12/2010 | Page 2 of 5
DIA 50 MIN
DIA 20.2 MIN
DIA 13.0 ±0.2
2.5 MIN Width
10.0 MIN Depth
Tape slot in Core
for Tape Start
DIA 40 MIN
Access Hole at
Slot Location
1.5 MIN
Tape & Reel Dimensions
*Compliant to EIA 481A
ECCM1C-15-24.000M TR
16.0 ±0.3
7.5 ±0.2
6.75 ±0.20
4.0 ±0.2
2.0 ±0.2
8.0 ±0.2 5.4 ±0.1
DIA 1.5 ±0.1
7.9
±0.1
0.30 ±0.05
1.7 ±0.1
22.4 MAX
360 MAX
Quantity Per Reel: 1,000 units
16.4 +2.0/-0.0
www.ecliptek.com | Specification Subject to Change Without Notice | Rev T 8/12/2010 | Page 3 of 5
T Min
S
T Max
S
Critical Zone
T to T
L P
Ramp-up Ramp-down
TL
TP
t 25°C to Peak
t Preheat
StL
tP
Temperature (T)
Time (t)
Recommended Solder Reflow Methods
ECCM1C-15-24.000M TR
High Temperature Infrared/Convection
TS MAX to TL (Ramp-up Rate) 3°C/second Maximum
Preheat
- Temperature Minimum (TS MIN) 150°C
- Temperature Typical (TS TYP) 175°C
- Temperature Maximum (TS MAX) 200°C
- Time (tS MIN) 60 - 180 Seconds
Ramp-up Rate (TL to TP)3°C/second Maximum
Time Maintained Above:
- Temperature (TL)217°C
- Time (tL)60 - 150 Seconds
Peak Temperature (TP)260°C Maximum for 10 Seconds Maximum
Target Peak Temperature (TP Target) 250°C +0/-5°C
Time within 5°C of actual peak (tp)20 - 40 seconds
Ramp-down Rate 6°C/second Maximum
Time 25°C to Peak Temperature (t) 8 minutes Maximum
Moisture Sensitivity Level Level 1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev T 8/12/2010 | Page 4 of 5
T Min
S
T Max
S
Critical Zone
T to T
L P
Ramp-up Ramp-down
TL
TP
t 25°C to Peak
t Preheat
StL
tP
Temperature (T)
Time (t)
Recommended Solder Reflow Methods
ECCM1C-15-24.000M TR
Low Temperature Infrared/Convection 240°C
TS MAX to TL (Ramp-up Rate) 5°C/second Maximum
Preheat
- Temperature Minimum (TS MIN) N/A
- Temperature Typical (TS TYP) 150°C
- Temperature Maximum (TS MAX) N/A
- Time (tS MIN) 60 - 120 Seconds
Ramp-up Rate (TL to TP)5°C/second Maximum
Time Maintained Above:
- Temperature (TL)150°C
- Time (tL)200 Seconds Maximum
Peak Temperature (TP)240°C Maximum
Target Peak Temperature (TP Target) 240°C Maximum 1 Time / 230°C Maximum 2 Times
Time within 5°C of actual peak (tp)10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
Ramp-down Rate 5°C/second Maximum
Time 25°C to Peak Temperature (t) N/A
Moisture Sensitivity Level Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev T 8/12/2010 | Page 5 of 5
