VIN1
GND GND
NMI
VCC
PFI
MR
VCC
PP
PFO
INT
LLO
Reset
Reset
VIN2
bus
WDI
LM3710, LM3711
www.ti.com
SNVS150E NOVEMBER 2000REVISED MARCH 2013
LM3710/LM3711 Microprocessor Supervisory Circuits with Power Fail Input, Low Line
Output, Manual Reset and Watchdog Timer
Check for Samples: LM3710,LM3711
1FEATURES DESCRIPTION
The LM3710/LM3711 series of microprocessor
2 Standard Reset Threshold Voltage: 3.08V supervisory circuits provide the maximum flexibility for
Custom Reset Threshold Voltages: For other monitoring power supplies and battery controlled
voltages between 2.2V and 5.0V in 10mV functions in systems without backup batteries. The
increments, contact TI LM3710/LM3711 series are available in VSSOP-10
and 9-bump DSBGA packages.
No External Components Required
Manual-Reset Input Built-in features include the following:
RESET (LM3710) or RESET (LM3711) Outputs Reset: Reset is asserted during power-up, power-
Precision Supply Voltage Monitor down, and brownout conditions. RESET is ensured
down to VCC of 1.0V.
Factory Programmable Reset and Watchdog
Timeout Delays Manual Reset Input: An input that asserts reset when
pulled low.
Separate Power Fail Comparator
Available in DSBGA Package for Minimum Power-Fail Input: A 1.225V threshold detector for
Footprint power fail warning, or to monitor a power supply other
than VCC.
±0.5% Reset Threshold Accuracy at Room
Temperature Low Line Output: This early power failure warning
indicator goes low when the supply voltage drops to a
±2% Reset Threshold Accuracy Over value which is 2% higher than the reset threshold
Temperature Extremes voltage.
Reset Assertion Down to 1V VCC (RESET Watchdog Timer: The WDI (Watchdog Input)
Option Only) monitors one of the µP's output lines for activity. If no
28 µA VCC Supply Current output transition occurs during the watchdog timeout
period, reset is activated.
APPLICATIONS
Embedded Controllers and Processors
Intelligent Instruments
Automotive Systems
Critical µP Power Monitoring
Typical Application
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2000–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Reset VCC
GND WDI
MR
NC PFI
LLO
PFO
C B A
1
2
3
1
2
3
4
9
5
10
8
7
6
VCC
MR
PFI
WDI
NC
GND
LLO
PFO
NC
Reset
LM3710, LM3711
SNVS150E NOVEMBER 2000REVISED MARCH 2013
www.ti.com
Connection Diagram
Figure 1. VSSOP-10
Figure 2. Top View
(looking from the coating side)
DSBGA 9 Bump Package
PIN DESCRIPTIONS
Pin No. Name Function
DSBGA VSSOP
A1 2 MR Manual-Reset input. When MR is less than VMRT (Manual Reset Threshold) RESET/RESET is
engaged.
B1 1 VCC Power Supply input.
C1 10 RESET Reset Logic Output. Pulses low for tRP (Reset Timeout Period) when triggered, and stays low
whenever VCC is below the reset threshold or when MR is below VMRT. It remains low for tRP after
either VCC rises above the reset threshold, or after MR input rises above VMRT (LM3710 only).
RESET Reset Logic Output. RESET is the inverse of RESET (LM3711 only).
C2 8 PFO Power-Fail Logic Output. When PFI is below VPFT, PFO goes low; otherwise, PFO remains high.
C3 7 LLO Low-Line Logic Output. Early Power-Fail warning output. Low when VCC falls below VLLOT (Low-
Line Output Threshold). This output can be used to generate an NMI (Non-Maskable Interrupt) to
provide an early warning of imminent power-failure.
B3 5 GND Ground reference for all signals.
A3 4 WDI Watchdog Input Transition Monitor: If no transition activity occurs for a period exceeding tWD
(Watchdog Timeout Period), reset is engaged.
A2 3 PFI Power-Fail Comparator Input. When PFI is less than VPFT (Power-Fail Reset Threshold), the PFO
goes low; otherwise, PFO remains high.
B2 6, 9 NC No Connect. Test input used at factory only. Leave floating.
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SNVS150E NOVEMBER 2000REVISED MARCH 2013
Block Diagram
Table Of Functions
Part Active Active Output Reset Watchdog Manual Power Fail Low Line
Number Low High (X = totem-pole) Timeout Timeout Reset Comparator Output
Reset Reset (Y = open-drain) Period Period
LM3710 x X, Y(1) Customized Customized x x x
LM3711 x X Customized Customized x x x
(1) Available upon request. Contact TI.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
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Absolute Maximum Ratings(1)(2)
Supply Voltage (VCC)0.3V to 6.0V
All Other Inputs 0.3V to VCC + 0.3V
ESD Ratings (3)
Human Body Model 1.5kV
Machine Model 150V
Power Dissipation (4)
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications and test
conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance
characteristics may degrade when the device is not operated under the listed conditions.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) The Human Body model is a 100 pF capacitor discharged through a 1.5 kresistor into each pin. The machine model is a 200pF
capacitor discharged directly into each pin.
(4) The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX), the junction-to-ambient thermal
resistance, θJ-A, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperture is calculated
using:
Where the value of θJ-A for the VSSOP-10 package is 195°C/W in a typical PC board mounting and the DSBGA package is 220°C/W.
Operating Ratings(1)
Temperature Range 40°C TJ85°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications and test
conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance
characteristics may degrade when the device is not operated under the listed conditions.
LM3710/LM3711 Series Electrical Characteristics
Limits in the standard typeface are for TJ= 25°C and limits in boldface type apply over full operating range. Unless otherwise
specified: VCC = +2.2V to 5.5V.
Symbol Parameter Conditions Min Typ Max Units
POWER SUPPLY
VCC Operating Voltage LM3710 1.0 5.5 V
Range: VCC LM3711 1.2 5.5
ICC VCC Supply Current All inputs = VCC; all outputs floating 28 50 µA
RESET THRESHOLD
VRST Reset Threshold VCC falling 0.5 +0.5
2 +2
VRST %
VCC falling: TA= 0°C to 70°C 1.5 +1.5
VRSTH Reset Threshold 0.0032•VRST mV
Hysteresis
tRP Reset Timeout Period Reset Timeout Period = E, J, N, S 11.4 2
Reset Timeout Period = F, K, P, T 20 28 40 ms
Reset Timeout Period = G, L, Q, U 140 200 280
Reset Timeout Period = H, M, R, V 1120 1600 2240
tRD VCCto Reset Delay VCCfalling at 1mV/µs 20 µs
RESET (LM3711)
VOL RESET VCC > 2.25V, ISINK = 900µA 0.3
VCC > 2.7V, ISINK = 1.2mA 0.3 V
VCC > 4.5V, ISINK = 3.2mA 0.4
VOH RESET VCC > 1.2V, ISOURCE = 50µA 0.8 VCC
VCC > 1.8V, ISOURCE = 150µA 0.8 VCC
VCC > 2.25V, ISOURCE = 300µA 0.8 VCC V
VCC > 2.7V, ISOURCE = 500µA 0.8 VCC
VCC > 4.5V, ISOURCE = 800µA VCC 1.5V
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SNVS150E NOVEMBER 2000REVISED MARCH 2013
LM3710/LM3711 Series Electrical Characteristics (continued)
Limits in the standard typeface are for TJ= 25°C and limits in boldface type apply over full operating range. Unless otherwise
specified: VCC = +2.2V to 5.5V.
Symbol Parameter Conditions Min Typ Max Units
ILKG Output Leakage VRESET = 5.5V 1.0 µA
Current
RESET (LM3710)
VOL RESET VCC > 1.0V, ISINK = 50µA 0.3
VCC > 1.2V, ISINK = 100µA 0.3
VCC > 2.25V, ISINK = 900µA 0.3
VCC > 2.7V, ISINK = 1.2mA 0.3 V
VCC > 4.5V, ISINK = 3.2mA 0.4
VOH RESET VCC > 2.25V, ISOURCE = 300µA 0.8 VCC
VCC > 2.7V, ISOURCE = 500µA 0.8 VCC
VCC > 4.5V, ISOURCE = 800µA VCC 1.5V
WDI
WDI Watchdog Input 1 +1 µA
Current
WDITWatchdog Input 0.2•VCC 1.225 0.8•VCC V
Threshold
tWD Watchdog Timeout Watchdog Timeout Period = E, F, G, H 4.3 6.2 9.3
Period Watchdog Timeout Period = J, K, L, M 71 102 153 ms
Watchdog Timeout Period = N, P, Q, R 1120 1600 2400
Watchdog Timeout Period = S, T, U, V 17900 25600 38400
PFI/MR
VPFT PFI Input Threshold 1.200 1.225 1.250 V
VMRT MR Input Threshold MR, Low 0.8 V
MR, High 2.0
VPFTH/ PFI/MR Threshold PFI/MR falling: VCC = VRST MAX to 5.5V 0.0032•VRST mV
VMRTH Hysteresis
IPFI Input Current 75 75 nA
(PFI only)
RMR MR Pull-up 35 56 75 k
Resistance
tMD MR to Reset Delay 12 µS
tMR MR Pulse Width 25 µS
PFO, LLO
VOL PFO, LLO Output VCC > 2.25V, ISINK = 900µA 0.3
Voltage VCC > 2.7V, ISINK = 1.2mA 0.3
VCC > 4.5V, ISINK = 3.2mA 0.4 V
VOH VCC > 2.25V, ISOURCE = 300µA 0.8 VCC
VCC > 2.7V, ISOURCE = 500µA 0.8 VCC
VCC > 4.5V, ISOURCE = 800µA VCC 1.5V
LLO OUTPUT
VLLOT LLO Output 1.01•VRST 1.02•VRST 1.03•VRST V
Threshold
(VLLO VRST, VCC
falling)
VLLOTH Low-Line Comparator 0.0032•VRST mV
Hysteresis
tCD Low-Line Comparator VCC falling at 1mV/µs 20 µs
Delay
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0
10
20
30
40
50
60
70
80
10 1000
Maximum Transient Duration (Ps)
Reset Comparator Overdrive (mV)
VRST - VCC
100
190
195
200
205
210
215
-40 Temperature (°C)
Reset Timeout Period (ms)
25 85
Reset Timeout Period (ms)
Supply Voltage (V)
180
185
190
195
200
205
210
215
220
3.0 3.5 44.5 55.5 6
Normalized Threshold Voltage (%)
Temperature (°C)
0.5
0.3
0.1
-0.5
-40 25 85
-0.3
-0.1
0
-0.4
-0.2
0.2
0.4
15
20
25
5
10
30
0
Supply Voltage (V)
Supply Current (PA)
12345
LM3710, LM3711
SNVS150E NOVEMBER 2000REVISED MARCH 2013
www.ti.com
Typical Performance Characteristics
Supply Current vs Supply Voltage 3.3V Supply Current vs Temperature
Figure 3. Figure 4.
Normalized Reset Threshold Voltage vs Temperature Reset Timeout Period vs VCC
Figure 5. Figure 6.
Max. Transient Duration vs Reset Comparator Overdrive
Reset Timeout Period vs Temperature (VCC = 3.3V)
Figure 7. Figure 8.
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5
5.2
5.4
5.6
5.8
6
6.2
6.4
6.6
6.8
7
-40 25 85
Temperature (RC)
Watchdog Timeout Period (ms)
25
27
29
31
33
35
37
39
-40 -20 020 40 60 80
Temperature (oC)
Propagation Delay (Ps)
LM3710, LM3711
www.ti.com
SNVS150E NOVEMBER 2000REVISED MARCH 2013
Typical Performance Characteristics (continued)
Watchdog Timeout Period vs Temperature
(tWD programmed as 6.2ms) Low-Line Comparator Propagation Delay vs Temperature
Figure 9. Figure 10.
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CIRCUIT INFORMATION
RESET OUTPUT
The Reset input of a µP initializes the device into a known state. The LM3710/LM3711 microprocessor
supervisory circuits assert a forced reset output to prevent code execution errors during power-up, power-down,
and brownout conditions.
RESET is ensured valid for VCC > 1V. Once VCC exceeds the reset threshold, an internal timer maintains the
output for the reset timeout period. After this interval, reset goes high. The LM3710 offers an active-low RESET;
The LM3711 offers an active-high RESET.
Any time VCC drops below the reset threshold (such as during a brownout), the reset activates. When VCC again
rises above the reset threshold, the internal timer starts. Reset holds until VCC exceeds the reset threshold for
longer than the reset timeout period. After this time, reset releases.
The Manual Reset input (MR) will initiate a forced reset also. See the MANUAL RESET INPUT (MR) section.
RESET THRESHOLD
The LM3710/LM3711 family is available with a reset voltage of 3.08V. Other reset thresholds in the 2.20V to
5.0V range, in steps of 10 mV, are available; contact Texas Instruments for details.
MANUAL RESET INPUT (MR)
Many µP-based products require a manual reset capability, allowing the operator to initiate a reset. The MR input
is fully debounced and provides an internal 56 kpull-up. When the MR input is pulled below VMRT (1.225V) for
more than 25 µs, reset is asserted after a typical delay of 12 µs. Reset remains active as long as MR is held low,
and releases after the reset timeout period expires after MR rises above VMRT. Use MR with digital logic to assert
or to daisy chain supervisory circuits. It may be used as another low-line comparator by adding a buffer.
POWER-FAIL COMPARATOR (PFI/PFO)
The PFI is compared to a 1.225V internal reference, VPFT. If PFI is less than VPFT, the Power Fail Output PFO
drops low. The power-fail comparator signals a falling power supply, and is driven typically by an external voltage
divider that senses either the unregulated supply or another system supply voltage. The voltage divider generally
is chosen so the voltage at PFI drops below VPFT several milliseconds before the main supply voltage drops
below the reset threshold, providing advanced warning of a brownout.
The voltage threshold is set by R1and R2and is calculated as follows:
(1)
Note this comparator is completely separate from the rest of the circuitry, and may be employed for other
functions as needed.
LOW-LINE OUTPUT (LLO)
The low-line output comparator is typically used to provide a non-maskable interrupt to a µP when VCC begins
falling. LLO monitors VCC and goes low when VCC falls below VLLOT (typically 1.02 VRST) with hysteresis of
0.0032 VRST.
WATCHDOG TIMER INPUT (WDI)
The watchdog timer input monitors one of the microprocessor's output lines for activity. Each time a transition
occurs on this monitored line, the watchdog counter is reset. However, if no transition occurs and the timeout
period is reached, the LM3710/LM3711 assumes that the microprocessor has locked up and the reset output is
activated.
WDI is a high impedance input.
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SNVS150E NOVEMBER 2000REVISED MARCH 2013
SPECIAL PRECAUTIONS FOR THE DSBGA PACKAGE
As with most integrated circuits, the LM3710 and LM3711 are sensitive to exposure from visible and infrared (IR)
light radiation. Unlike a plastic encapsulated IC, the DSBGA package has very limited shielding from light, and
some sensitivity to light reflected from the surface of the PC board or long wavelength IR entering the die from
the side may be experienced. This light could have an unpredictable affect on the electrical performance of the
IC. Care should be taken to shield the device from direct exposure to bright visible or IR light during operation.
DSBGA MOUNTING
The DSBGA package requires specific mounting techniques which are detailed in TI Application Note AN-1112
(SNVA009). Referring to the section Surface Mount Assembly Considerations, it should be noted that the pad
style which must be used with the 9-pin package is the NSMD (non-solder mask defined) type.
For best results during assembly, alignment ordinals on the PC board may be used to facilitate placement of the
DSBGA device.
Timing Diagrams
Figure 11. LM3710/LM3711 Reset Time with MR and WDI
Figure 12. LLO Output
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GND GND
VCC
PFI PP
INT
R1
R2
RESET
RESET
LLO
PFO
MR
VIN1
VIN2
Active Data Line
WDI
R2
+ 1Power-Fail Reset Threshold, VPFT = 1.225 (
(
. R1
LM3710, LM3711
SNVS150E NOVEMBER 2000REVISED MARCH 2013
www.ti.com
Figure 13. PFI Comparator Timing Diagram
Typical Application Circuits
Figure 14. Monitoring Two Critical Supplies And Dataline
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Product Folder Links: LM3710 LM3711
System
Regulator 0.1Pceramic
3.3V
R1
R2
VCC
GND
PFI
RESET
MR
PFO
RESET
INT
PP
R1
R2
+ 1Power-Fail Reset Threshold, VPFT = 1.225 (
(
.
Raw Supply
(Battery)
Active Data
Line
WDI
VCC
RESET
3.3V
1.8
V
107k
332k
VI/O VCORE
FAULT (Normally High)
GND
PFI
PFO
RESET
Active Data Line
WDI
MR
GND
VCC
PFI
MR PFO
RESET
RESET
3.3V
1.8V
107k
332k
VI/O Vcore
3.3k
WDI
Active Data Line
LM3710, LM3711
www.ti.com
SNVS150E NOVEMBER 2000REVISED MARCH 2013
Figure 15. Monitoring Two Supplies plus Manual Reset And Dataline
Figure 16. Monitoring Dual Supplies plus External Fault Input And Dataline
Note: MR input with its 1.225V nominal threshold, may monitor an additional supply voltage. An internal 56 kpull-up
resistor is included on this input.
Figure 17. Microprocessor Supervisor with Early Warning Detector
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VCC
GND
PFI
RESET
WDI
OUTPUT
+3.3 to 5V
tRP
tWD
Period = tRP + tWD
LM3710, LM3711
SNVS150E NOVEMBER 2000REVISED MARCH 2013
www.ti.com
Figure 18. LM3710 Long Period oscillator
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SNVS150E NOVEMBER 2000REVISED MARCH 2013
REVISION HISTORY
Changes from Revision D (March 2013) to Revision E Page
Changed layout of National Data Sheet to TI format .......................................................................................................... 12
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PACKAGE OPTION ADDENDUM
www.ti.com 6-Feb-2020
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM3710XKMM-463/NOPB ACTIVE VSSOP DGS 10 1000 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM R74B
LM3710XQMM-308/NOPB ACTIVE VSSOP DGS 10 1000 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM -40 to 85 R37B
LM3710YQMM-232/NOPB ACTIVE VSSOP DGS 10 1000 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM R77B
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
PACKAGE OPTION ADDENDUM
www.ti.com 6-Feb-2020
Addendum-Page 2
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM3710XKMM-463/NOPB VSSOP DGS 10 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM3710XQMM-308/NOPB VSSOP DGS 10 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM3710YQMM-232/NOPB VSSOP DGS 10 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 2-Sep-2015
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM3710XKMM-463/NOPB VSSOP DGS 10 1000 210.0 185.0 35.0
LM3710XQMM-308/NOPB VSSOP DGS 10 1000 210.0 185.0 35.0
LM3710YQMM-232/NOPB VSSOP DGS 10 1000 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 2-Sep-2015
Pack Materials-Page 2
www.ti.com
PACKAGE OUTLINE
C
TYP
5.05
4.75
1.1 MAX
8X 0.5
10X 0.27
0.17
2X
2
0.15
0.05
TYP
0.23
0.13
0 - 8
0.25
GAGE PLANE
0.7
0.4
A
NOTE 3
3.1
2.9
B
NOTE 4
3.1
2.9
4221984/A 05/2015
VSSOP - 1.1 mm max heightDGS0010A
SMALL OUTLINE PACKAGE
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-187, variation BA.
110
0.1 C A B
6
5
PIN 1 ID
AREA
SEATING PLANE
0.1 C
SEE DETAIL A
DETAIL A
TYPICAL
SCALE 3.200
www.ti.com
EXAMPLE BOARD LAYOUT
(4.4)
0.05 MAX
ALL AROUND 0.05 MIN
ALL AROUND
10X (1.45)
10X (0.3)
8X (0.5)
(R )
TYP
0.05
4221984/A 05/2015
VSSOP - 1.1 mm max heightDGS0010A
SMALL OUTLINE PACKAGE
SYMM
SYMM
LAND PATTERN EXAMPLE
SCALE:10X
1
56
10
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
NOT TO SCALE
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
www.ti.com
EXAMPLE STENCIL DESIGN
(4.4)
8X (0.5)
10X (0.3)
10X (1.45)
(R ) TYP0.05
4221984/A 05/2015
VSSOP - 1.1 mm max heightDGS0010A
SMALL OUTLINE PACKAGE
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SYMM
SYMM
1
56
10
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:10X
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