MCP102/103/121/131 Micropower Voltage Supervisors Package Types SOT23-3/SC-70 RST 1 VDD 2 TO-92 3 VSS RST VDD VSS SOT23-3/SC-70 VSS 1 MCP103 * Ultra low supply current: 1.75 A (steady-state max.) * Precision monitoring options of: - 1.90V, 2.32V, 2.63V, 2.93V, 3.08V, 4.38V and 4.63V * Resets microcontroller in a power-loss event * RST pin (Active-low): - MCP121: Active-low, open-drain - MCP131: Active-low, open-drain with internal pull-up resistor - MCP102 and MCP103: Active-low, push-pull * Reset Delay Timer (120 ms delay, typ.) * Available in SOT23-3, TO-92 and SC-70 packages * Temperature Range: - Extended: -40C to +125C (except MCP1XX-195) - Industrial: -40C to +85C (MCP1XX-195 only) * Pb-free devices MCP102/121/131 Features 3 VDD RST 2 Block Diagram Applications VDD * Critical Microcontroller and Microprocessor Power-monitoring Applications * Computers * Intelligent Instruments * Portable Battery-powered Equipment R (1) Comparator + Reset Delay Circuit - Output Driver RST General Description The MCP102/103/121/131 are voltage supervisor devices designed to keep a microcontroller in reset until the system voltage has reached and stabilized at the proper level for reliable system operation. Table 1 shows the available features for these devices. TABLE 1: Band Gap Reference VSS Note 1: MCP131 Only DEVICE FEATURES Output Device Type Reset Package Pinout Delay (typ) (Pin # 1, 2, 3) Pull-up Resistor MCP102 Push-pull No MCP103 Push-pull No 120 ms Comment RST, VDD, VSS 120 ms VSS, RST, VDD 120 ms RST, VDD, VSS MCP131 Open-drain Internal (~95 k) 120 ms RST, VDD, VSS MCP111 Open-drain External No VOUT, VSS, VDD See MCP111/112 Data Sheet (DS21889) MCP112 Push-Pull No VOUT, VSS, VDD See MCP111/112 Data Sheet (DS21889) MCP121 Open-drain External No 2004-2013 Microchip Technology Inc. DS21906C-page 1 MCP102/103/121/131 1.0 ELECTRICAL CHARACTERISTICS Notice: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.0V Input current (VDD) . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 mA Output current (RST) . . . . . . . . . . . . . . . . . . . . . . . . . .10 mA Rated Rise Time of VDD . . . . . . . . . . . . . . . . . . . . . . 100V/s All inputs and outputs (except RST) w.r.t. VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.6V to (VDD + 1.0V) RST output w.r.t. VSS . . . . . . . . . . . . . . . . . . . -0.6V to 13.5V Storage temperature . . . . . . . . . . . . . . . . . . -65C to + 150C Ambient temp. with power applied . . . . . . . -40C to + 125C Maximum Junction temp. with power applied . . . . . . . . 150C ESD protection on all pins 2 kV DC CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, all limits are specified for: VDD = 1V to 5.5V, RPU = 100 k (MCP121 only), TA = -40C to +125C. Parameters Sym Min Typ Max Units Operating Voltage Range VDD 1.0 -- 5.5 V Specified VDD Value to RST low VDD 1.0 -- V IRST = 10 uA, VRST < 0.2V Operating Current IDD -- <1 1.75 A Reset Power-up Timer (tRPU) Inactive -- -- 20.0 A Reset Power-up Timer (tRPU) Active -- <1 1.75 A VDD > VTRIP and Reset Power-up Timer (tRPU) Inactive -- -- 75 A VDD < VTRIP and Reset Power-up Timer (tRPU) Inactive (Note 3) -- -- 90 A Reset Power-up Timer (tRPU) Active (Note 4) MCP102, MCP103, MCP121 MCP131 Note 1: 2: 3: 4: 5: 6: IDD Conditions Trip point is 1.5% from typical value. Trip point is 2.5% from typical value. RST output is forced low. There is a current through the internal pull-up resistor. This includes the current through the internal pull-up resistor and the reset power-up timer. This specification allows this device to be used in PIC(R) microcontroller applications that require In-Circuit Serial ProgrammingTM (ICSPTM) (see device-specific programming specifications for voltage requirements). This specification DOES NOT allow a continuos high voltage to be present on the open-drain output pin (VOUT). The total time that the VOUT pin can be above the maximum device operational voltage (5.5V) is 100s. Current into the VOUT pin should be limited to 2 mA and it is recommended that the device operational temperature be maintained between 0C to 70C (+25C preferred). For additional information, please refer to Figure 2-33. This parameter is established by characterization and not 100% tested. DS21906C-page 2 2004-2013 Microchip Technology Inc. MCP102/103/121/131 DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise indicated, all limits are specified for: VDD = 1V to 5.5V, RPU = 100 k (MCP121 only), TA = -40C to +125C. Parameters VDD Trip Point MCP1XX-195 Sym Min Typ Max Units VTRIP 1.872 1.900 1.929 V TA = +25C (Note 1) 1.853 1.900 1.948 V TA = -40C to +85C (Note 2) 2.285 2.320 2.355 V TA = +25C (Note 1) 2.262 2.320 2.378 V Note 2 2.591 2.630 2.670 V TA = +25C (Note 1) 2.564 2.630 2.696 V Note 2 2.886 2.930 2.974 V TA = +25C (Note 1) 2.857 2.930 3.003 V Note 2 3.034 3.080 3.126 V TA = +25C (Note 1) 3.003 3.080 3.157 V Note 2 4.314 4.380 4.446 V TA = +25C (Note 1) 4.271 4.380 4.490 V Note 2 4.561 4.630 4.700 V TA = +25C (Note 1) 4.514 4.630 4.746 V Note 2 MCP1XX-240 MCP1XX-270 MCP1XX-300 MCP1XX-315 MCP1XX-450 MCP1XX-475 VDD Trip Point Tempco TTPCO -- 100 -- ppm/C Threshold Hysteresis min. = 1%, max = 6%) VHYS 0.019 -- 0.114 V MCP1XX-240 0.023 -- 0.139 V MCP1XX-270 0.026 -- 0.158 V MCP1XX-300 0.029 -- 0.176 V MCP1XX-315 0.031 -- 0.185 V MCP1XX-450 0.044 -- 0.263 V MCP1XX-475 0.046 -- 0.278 V MCP1XX-195 Conditions TA = +25C RST Low-level Output Voltage VOL -- -- 0.4 V IOL = 500 A, VDD = VTRIP(MIN) RST High-level Output Voltage (MCP102 and MCP103 only) VOH VDD - 0.6 -- -- V IOH = 1 mA, For MCP102/MCP103 only (push-pull output) Internal Pull-up Resistor (MCP131 only) RPU -- 95 -- k Open-drain High Voltage on Output (MCP121 only) VODH -- -- 13.5 (5) V Open-drain Output Leakage Current (MCP121 only) IOD -- 0.1 -- A Note 1: 2: 3: 4: 5: 6: VDD = 5.5V VDD = 3.0V, Time voltage > 5.5V applied 100s, current into pin limited to 2 mA, 25C operation recommended (Note 5, Note 6) Trip point is 1.5% from typical value. Trip point is 2.5% from typical value. RST output is forced low. There is a current through the internal pull-up resistor. This includes the current through the internal pull-up resistor and the reset power-up timer. This specification allows this device to be used in PIC(R) microcontroller applications that require In-Circuit Serial ProgrammingTM (ICSPTM) (see device-specific programming specifications for voltage requirements). This specification DOES NOT allow a continuos high voltage to be present on the open-drain output pin (VOUT). The total time that the VOUT pin can be above the maximum device operational voltage (5.5V) is 100s. Current into the VOUT pin should be limited to 2 mA and it is recommended that the device operational temperature be maintained between 0C to 70C (+25C preferred). For additional information, please refer to Figure 2-33. This parameter is established by characterization and not 100% tested. 2004-2013 Microchip Technology Inc. DS21906C-page 3 MCP102/103/121/131 VTRIP 1V VDD tRPU tRPD VOH 1V VOL RST tRT FIGURE 1-1: Timing Diagram. AC CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, all limits are specified for: VDD = 1V to 5.5V, RPU = 100 k (MCP121 only), TA = -40C to +125C. Parameters Sym Min Typ Max Units VDD Detect to RST Inactive tRPU 80 120 180 ms Figure 1-1 and CL = 50 pF VDD Detect to RST Active tRPD -- 130 -- s VDD ramped from VTRIP(MAX) + 250 mV down to VTRIP(MIN) - 250 mV, per Figure 1-1, CL = 50 pF (Note 1) tRT -- 5 -- s For RST 10% to 90% of final value per Figure 1-1, CL = 50 pF (Note 1) RST Rise Time After RST Active (MCP102 and MCP103 only) Note 1: Conditions These parameters are for design guidance only and are not 100% tested. TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise noted, all limits are specified for: VDD = 1V to 5.5V, RPU = 100 k (MCP121 only), TA = -40C to +125C. Parameters Sym Min Typ Max Units Specified Temperature Range TA -40 Specified Temperature Range TA -40 Maximum Junction Temperature TJ Storage Temperature Range Conditions -- +85 C MCP1XX-195 -- +125 C Except MCP1XX-195 -- -- +150 C TA -65 -- +150 C Temperature Ranges Package Thermal Resistances Thermal Resistance, 3L-SOT23 JA -- 336 -- C/W Thermal Resistance, 3L-SC-70 JA -- 340 -- C/W Thermal Resistance, 3L-TO-92 JA -- 131.9 -- C/W DS21906C-page 4 2004-2013 Microchip Technology Inc. MCP102/103/121/131 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, all limits are specified for: VDD = 1V to 5.5V, RPU = 100 k (MCP121 only; see Figure 4-1), TA = -40C to +125C. 16 MCP102-195 5.5V 5.0V 1.4 1.2 1 IDD (uA) 4.0V 0.8 0.6 0.4 2.8V 2.1V 1.7V 12 5.5V 10 5.0V 8 4.0V 6 4 1.0V 0.2 0 MCP102-195 14 2.8V 2.1V 2 Temperature (C) 2.9V 70 25 60 20 15 10 140 120 100 80 MCP131-315 5.5V 5.0V 4.5V 4.0V 3.3V 50 40 30 20 1.0V 5 10 3.3V, 4.0V, 5.0V, 5.5V Temperature (C) 140 120 100 80 60 40 Temperature (C) FIGURE 2-2: IDD vs. Temperature (Reset Power-up Timer Inactive) (MCP131-315). FIGURE 2-5: IDD vs. Temperature (Reset Power-up Timer Active) (MCP131-315). 16 MCP121-450 5.5V IDD (uA) 4.8V 4.6V 3.0V MCP121-450 14 5.0V 4.1V 20 0 -20 -40 140 120 100 80 60 40 20 0 -20 0 -40 0 12 5.5V 10 5.0V 4.8V 4.6V 8 6 4 1.0V 2 Temperature (C) FIGURE 2-3: IDD vs. Temperature (Reset Power-up Timer Inactive) (MCP121-450). 2004-2013 Microchip Technology Inc. 140 120 100 80 60 40 20 0 -20 -40 140 120 100 80 60 40 20 0 -20 0 -40 IDD (uA) 60 80 MCP131-315 IDD (uA) IDD (uA) FIGURE 2-4: IDD vs. Temperature (Reset Power-up Timer Active) (MCP102-195). 30 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 40 Temperature (C) FIGURE 2-1: IDD vs. Temperature (Reset Power-up Timer Inactive) (MCP102-195). 35 20 0 -20 -40 120 100 80 60 40 20 0 -20 -40 0 140 IDD (uA) 1.8 1.6 Temperature (C) FIGURE 2-6: IDD vs. Temperature (Reset Power-up Timer Active) (MCP121-450). DS21906C-page 5 MCP102/103/121/131 16 1.8 1.6 1.4 1.2 1 0.8 0.6 0.4 0.2 0 MCP102-195 MCP102-195 14 +25C +85C 0C 5.0 6.0 10 8 Device in Reset tRPU inactive 6 2 0 2.0 3.0 4.0 5.0 6.0 1.0 2.0 3.0 VDD (V) 4.0 VDD (V) FIGURE 2-7: IDD vs. VDD (Reset Power-up Timer Inactive) (MCP102-195). FIGURE 2-10: IDD vs.VDD (Reset Power-up Timer Active) (MCP102-195). 80 35 0C, +25C -40C MCP131-315 30 MCP131-315 70 60 20 IDD (uA) 25 IDD (uA) 0C +25C +70C +85C +125C 4 -40C 1.0 +70 15 +85C 10 +125C 5 -40C, 0C +25C +70C +85C +125C 5.0 6.0 Device in Reset tRPU inactive 50 40 30 20 0 10 -5 0 1.0 2.0 3.0 4.0 5.0 6.0 1.0 2.0 3.0 VDD (V) FIGURE 2-11: IDD vs.VDD (Reset Power-up Timer Active) (MCP131-315). MCP121-450 +125C +70C +85C 0C -40C +25C 1.0 2.0 3.0 4.0 5.0 6.0 VDD (V) FIGURE 2-9: IDD vs. VDD (Reset Power-up Timer Inactive) (MCP121-450). DS21906C-page 6 IDD (uA) 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 4.0 VDD (V) FIGURE 2-8: IDD vs. VDD (Reset Power-up Timer Inactive) (MCP131-315). IDD (uA) -40C 12 +125C IDD (uA) IDD (uA) Note: Unless otherwise indicated, all limits are specified for: VDD = 1V to 5.5V, RPU = 100 k (MCP121 only; see Figure 4-1), TA = -40C to +125C. 16 14 12 10 8 6 4 2 0 -2 -40C 0C +25C +70C +85C +125C MCP121-450 Device in Reset tRPU inactive 1.0 2.0 3.0 4.0 5.0 6.0 VDD (V) FIGURE 2-12: IDD vs.VDD (Reset Power-up Timer Active) (MCP121-450). 2004-2013 Microchip Technology Inc. MCP102/103/121/131 Note: Unless otherwise indicated, all limits are specified for: VDD = 1V to 5.5V, RPU = 100 k (MCP121; see Figure 4-1), TA = -40C to +125C. 0.050 0.045 0.040 0.035 0.030 0.025 0.020 0.015 0.010 0.005 MCP102-195 0.000 90 140 VTRIP, increasing VDD VTRIP, decreasing VDD -60 -10 40 MCP102-195 VDD = 1.7V 0.080 VOL (V) VHYS, Hysteresis 0.100 Hyst (V) VTRIP (V) 0.120 1.945 1.940 1.935 1.930 1.925 1.920 1.915 1.910 1.905 1.900 1.895 +70C +125C 0.060 +85C +25C 0.040 0.020 0C -40C 0.000 -0.020 0.00 0.25 0.50 0.75 1.00 IOL (mA) Temperature (C) FIGURE 2-13: VTRIP vs. Temperature vs. Hysteresis (MCP102-195). FIGURE 2-16: VOL vs. IOL (MCP102-195 @ VDD = 1.7V). 0.070 0.060 3.160 3.140 3.120 3.100 3.080 3.060 -60 MCP131-315 VDD = 2.9V 0.040 +85C 0.030 0.020 0C 0.010 0.000 0.00 0.25 4.400 4.350 4.300 0.050 Temperature (C) FIGURE 2-15: VTRIP vs. Temperature vs. Hysteresis (MCP121-450). 2004-2013 Microchip Technology Inc. MCP121-450 VDD = 4.1V 1.00 +85C +125C 0.040 VOL (V) 4.450 0.75 FIGURE 2-17: VOL vs. IOL (MCP131-315 @ VDD = 2.9V). 0.060 Hyst (V) VTRIP (V) 4.500 0.50 IOL (mA) FIGURE 2-14: VTRIP vs. Temperature vs. Hysteresis (MCP131-315). 0.190 0.180 0.170 VTRIP, increasing VDD 0.160 VHYS, Hysteresis 0.150 0.140 VTRIP, decreasing VDD 0.130 0.120 0.110 MCP121-450 0.100 -60 -20 20 60 100 140 -40C +25C Temperature (C) 4.550 +70C +125C 0.050 VOL (V) 3.180 VTRIP (V) 0.108 0.106 0.104 VHYS, Hysteresis 0.102 0.100 0.098 0.096 VTRIP, decreasing VDD 0.094 0.092 MCP131-315 0.090 -10 40 90 140 VTRIP, increasing VDD Hyst (V) 3.200 +70C 0.030 0.020 +25C 0.010 0C -40C 0.000 0.00 0.25 0.50 0.75 1.00 IOL (mA) FIGURE 2-18: VOL vs. IOL (MCP121-450 @ VDD = 4.1V). DS21906C-page 7 MCP102/103/121/131 Note: Unless otherwise indicated, all limits are specified for: VDD = 1V to 5.5V, RPU = 100 k (MCP121 only; see Figure 4-1), TA = -40C to +125C. 0.120 2.110 MCP102-195 VDD = 1.7 V VOL (V) 0.100 IOL = 0.50 mA 0.040 IOL = 0.25 mA 0.000 0 40 80 120 +125C 2.010 +85C +70C 1.950 0.00 +25C 0.25 0.50 0.75 1.00 IOL (mA) Temperature (C) FIGURE 2-22: VOH vs. IOL (MCP102-195 @ VDD = 2.1V). FIGURE 2-19: VOL vs. Temperature (MCP102-195 @ VDD = 1.7V). 0.070 IOL = 1.00 mA MCP131-315 VDD = 2.9V IOL = 0.75 mA 0.050 VOL (V) -40C 2.030 1.970 IOL = 0.00 mA -40 0C 2.050 1.990 0.020 0.060 2.070 IOL = 0.75 mA 0.080 0.060 MCP102-195 VDD = 2.1V 2.090 IOL = 1.00 mA VOH (V) 0.140 0.040 IOL = 0.50 mA 0.030 IOL = 0.25 mA 0.020 0.010 IOL = 0.00 mA 0.000 -40 0 40 80 120 Temperature (C) FIGURE 2-20: VOL vs. Temperature (MCP131-315 @ VDD = 2.9V). 0.060 0.050 MCP121-450 VDD = 4.1V IOL = 1.00 mA IOL = 0.75 mA VOL (V) 0.040 0.030 IOL = 0.50 mA 0.020 IOL = 0.25 mA 0.010 IOL = 0.00 mA 0.000 -40 0 40 80 120 Temperature (C) FIGURE 2-21: VOL vs. Temperature (MCP121-450 @ VDD = 4.1V). DS21906C-page 8 2004-2013 Microchip Technology Inc. MCP102/103/121/131 Note: Unless otherwise indicated, all limits are specified for: VDD = 1V to 5.5V, RPU = 100 k (MCP121 only; see Figure 4-1), TA = -40C to +125C. 300 VDD decreasing from: 5V - 1.7V VDD decreasing from: VTRIP(max) + 0.25V to VTRIP(min) - 0.25V 200 150 50 110 -40 -15 FIGURE 2-23: (MCP102-195). 10 35 60 Temperature (C) 85 VDD increasing from: 0V - 5.5V -40 110 FIGURE 2-26: (MCP102-195). 160 150 100 tRPU (s) VDD decreasing from: 5V - 2.7V 35 10 35 60 85 110 tRPD vs. Temperature 38 VDD increasing from: 0V - 5.5V -40 -15 37 FIGURE 2-27: (MCP131-315). 10 35 60 Temperature (C) MCP121-450 VDD increasing from: 0V - 4.8V 135 36.5 36 130 125 VDD increasing from: 0V - 5.0V 120 35.5 VDD increasing from: 0V - 5.0V VDD increasing from: 0V - 5.5V 35 110 tRPU vs. Temperature 140 VDD increasing from: 0V - 4.6V VDD increasing from: 0V - 4.8V 85 145 MCP121-450 tRPU (s) 37.5 MCP131-315 VDD increasing from: 0V - 4.5V Temperature (C) FIGURE 2-24: (MCP131-315). 110 130 100 -15 85 VDD increasing from: 0V - 4.0V 140 110 -40 60 tRPU vs. Temperature 120 VDD decreasing from: 5V - 0V 0 tRT (s) 10 VDD increasing from: 0V - 3.3V MCP131-315 200 150 -15 Temperature (C) tRPD vs. Temperature VDD decreasing from: VTRIP(max) + 0.25V to VTRIP(min) - 0.25V tRPD (s) VDD increasing from: 0V - 4.0V 100 250 50 VDD increasing from: 0V - 2.8V 130 120 VDD decreasing from: 5V - 0V VDD increasing from: 0V - 2.1V 140 100 0 MCP102-195 150 tRPU (s) tRPD (s) 250 160 MCP102-195 115 VDD increasing from: 0V - 5.5V 110 -40 -15 10 35 60 85 110 -40 -15 Temperature (C) FIGURE 2-25: (MCP121-450). tRPD vs. Temperature 2004-2013 Microchip Technology Inc. 10 35 60 85 110 Temperature (C) FIGURE 2-28: (MCP121-450). tRPU vs. Temperature DS21906C-page 9 MCP102/103/121/131 Note: Unless otherwise indicated, all limits are specified for: VDD = 1V to 5.5V, RPU = 100 k (MCP121 only; see Figure 4-1), TA = -40C to +125C. VDD increasing from: 0V - 2.1V 0.4 MCP102-195 VDD increasing from: 0V - 2.8V 0.35 tRT (s) 0.3 0.25 0.2 0.15 0.1 VDD increasing from: 0V - 4.0V VDD increasing from: 0V - 5.0V VDD increasing from: 0V - 5.5V 0.05 1400 Transient Duration (S) 0.45 MCP121-450 1200 1000 800 MCP102-195 600 400 200 0 -40 -15 10 35 60 85 MCP131-315 0 0.001 110 0.01 Temperature (C) FIGURE 2-29: (MCP102-195). 0.1 VTRIP(Min) - VDD 1 10 FIGURE 2-32: Transient Duration vs. VTRIP (min) - VDD. tRT vs. Temperature 10m 1m 100 10 1 100n 10n 1n 100p 10p 1p 100f VDD increasing from: 0V - 5.0V VDD increasing from: 0V - 5.5V 1.00E-03 Open-Drain Leakage (A) tRT (s) 1.00E-02 45 43 41 39 37 35 33 31 29 27 25 VDD increasing from: 0V - 4.5V VDD increasing from: 0V - 3.3V VDD increasing from: 0V - 4.0V -40 -15 10 tRT (s) 37 1.00E-06 +125C 1.00E-07 1.00E-08 1.00E-09 1.00E-10 +25C - 40C 1.00E-11 1.00E-13 35 60 85 110 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Pull-Up Voltage (V) tRT vs. Temperature 38 37.5 1.00E-05 1.00E-12 MCP131-315 Temperature (C) FIGURE 2-30: (MCP131-315). 1.00E-04 FIGURE 2-33: Open-Drain Leakage Current vs. Voltage Applied to VOUT Pin (MCP121-195). MCP121-450 VDD increasing from: 0V - 4.6V VDD increasing from: 0V - 4.8V 36.5 36 35.5 VDD increasing from: 0V - 5.0V VDD increasing from: 0V - 5.5V 35 -40 -15 10 35 60 85 110 Temperature (C) FIGURE 2-31: (MCP121-450). DS21906C-page 10 tRT vs. Temperature 2004-2013 Microchip Technology Inc. MCP102/103/121/131 3.0 PIN DESCRIPTION The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE Pin No. MCP102 MCP121 MCP131 MCP103 1 1 Symbol RST Function Output State VDD Falling: H = VDD > VTRIP L = VDD < VTRIP VDD Rising: H = VDD > VTRIP + VHYS L = VDD < VTRIP + VHYS 2 3 VDD Positive power supply 3 2 VSS Ground reference 2004-2013 Microchip Technology Inc. DS21906C-page 11 MCP102/103/121/131 4.0 APPLICATION INFORMATION 4.1 For many of today's microcontroller applications, care must be taken to prevent low-power conditions that can cause many different system problems. The most common causes are brown-out conditions, where the system supply drops below the operating level momentarily. The second most common cause is when a slowly decaying power supply causes the microcontroller to begin executing instructions without sufficient voltage to sustain volitile memory (RAM), thus producing indeterminate results. Figure 4-1 shows a typical application circuit. The MCP102/103/121/131 are voltage supervisor devices designed to keep a microcontroller in reset until the system voltage has reached and stabilized at the proper level for reliable system operation. These devices also operate as protection from brown-out conditions. VDD 0.1 F VDD VDD RPU MCP1XX PIC(R) Microcontroller MCLR (Reset input) (Active-low) RST VSS VSS Note 1: Resistor RPU may be required with the MCP121 due to the open-drain output. Resistor RPU may not be required with the MCP131 due to the internal pull-up resistor. The MCP102 and MCP103 do not require the external pull-up resistor. FIGURE 4-1: Typical Application Circuit. RST Operation The RST output pin operation determines how the device can be used and indicates when the system should be forced into reset. To accomplish this, an internal voltage reference is used to set the voltage trip point (VTRIP). Additionally, there is a hysteresis on this trip point. When the falling edge of VDD crosses this voltage threshold, the reset power-down timer (TRPD) starts. When this delay timer times out, the RST pin is forced low. When the rising-edge of VDD crosses this voltage threshold, the reset power-up timer (TRPU) starts. When this delay timer times out, the RST pin is forced high, TRPU is active and there is additional system current. The actual voltage trip point (VTRIPAC) will be between the minimum trip point (VTRIPMIN) and the maximum trip point (VTRIPMAX). The hysteresis on this trip point and the delay timer (TRPU) are to remove any "jitter" that would occur on the RST pin when the device VDD is at the trip point. Figure 4-2 shows the waveform of the RST pin as determined by the VDD voltage, while Table 4-1 shows the state of the RST pin. The VTRIP specification is for falling VDD voltages. When the VDD voltage is rising, the RST will not be driven high until VDD is at VTRIP + VHYS. Once VDD has crossed the voltage trip point, there is also a minimal delay time (TRPD) before the RST pin is driven low. TABLE 4-1: RST PIN STATES State of RST Pin when: Device VDD < VTRIP VDD > Ouput Driver VTRIP + VHYS MCP102 L H Push-pull MCP103 L H Push-pull (1) Open-drain (1) Open-drain (2) MCP121 L H MCP131 L H (2) Note 1: Requires External Pull-up resistor 2: Has Internal Pull-up resistor VDD VTRIPAC + VHYSAC VTRIPMAX VTRIPAC VTRIPMIN VTRIPAC 1V RST tRPU tRPD FIGURE 4-2: DS21906C-page 12 < 1V is outside the device specifications tRPD tRPU RST Operation as Determined by the VTRIP and VHYS. 2004-2013 Microchip Technology Inc. MCP102/103/121/131 Negative Going VDD Transients The minimum pulse width (time) required to cause a reset may be an important criteria in the implementation of a Power-on Reset (POR) circuit. This time is referred to as transient duration, defined as the amount of time needed for these supervisory devices to respond to a drop in VDD. The transient duration time is dependant on the magnitude of VTRIP - VDD. Generally speaking, the transient duration decreases with increases in VTRIP - VDD. Figure 4-3 shows a typical transient duration vs. reset comparator overdrive, for which the MCP102/103/121/131 will not generate a reset pulse. It shows that the farther below the trip point the transient pulse goes, the duration of the pulse required to cause a reset gets shorter. Figure 2-32 shows the transient response characteristics for the MCP102/103/121/131. A 0.1 F bypass capacitor, mounted as close as possible to the VDD pin, provides additional transient immunity (refer to Figure 4-1). Supply Voltage 5V 0V 4.3 Reset Power-up Timer (tRPU) Figure 4-4 illustrates the device current states. While the system is powering down, the device has a low current. This current is dependent on the device VDD and trip point. When the device VDD rises through the voltage trip point (VTRIP), an internal timer starts. This timer consumes additional current until the RST pin is driven (or released) high. This time is known as the Reset Power-up Time (tRPU). Figure 4-4 shows when tRPU is active (device consuming additional current). VDD VTRIP RST tRPU VTRIP(MAX) VTRIP(MIN) VTRIP(MIN) - VDD Reset Power-up Timer Inactive tTRANS Reset Power-up Timer Active 4.2 Reset Power-up Timer Inactive Time (s) See Figures 2-1, 2-2 and 2-3 FIGURE 4-3: Example of Typical Transient Duration Waveform. See Figures 2-1, 2-2 and 2-3 See Figures 2-4, 2-5 and 2-6 FIGURE 4-4: Waveform. 4.3.1 Reset Power-up Timer EFFECT OF TEMPERATURE ON RESET POWER-UP TIMER (TRPU) The Reset Power-up timer time-out period (tRPU) determines how long the device remains in the reset condition. This is affected by both VDD and temperature. Typical responses for different VDD values and temperatures are shown in Figures 2-26, 2-27 and 2-28. 2004-2013 Microchip Technology Inc. DS21906C-page 13 MCP102/103/121/131 Using in PIC(R) Microcontroller, ICSPTM Applications (MCP121 only) 4.4 Figure 4-5 shows the typical application circuit for using the MCP121 for voltage superviory function when the PIC microcontroller will be programmed via the ICSP feature. Additional information is available in TB087, "Using Voltage Supervisors with PIC(R) Microcontroller Systems which Implement In-Circuit Serial ProgrammingTM", DS91087. Note: It is recommended that the current into the RST pin be current limited by a 1 k resistor. VDD/VPP 0.1F RPU VDD MCP121 RST VSS 1 k VDD PIC(R) MCU MCLR (Reset Input) (Active-low) VSS FIGURE 4-5: Typical Application Circuit for PIC(R) Microcontroller with the ICSPTM feature. DS21906C-page 14 2004-2013 Microchip Technology Inc. MCP102/103/121/131 5.0 PACKAGING INFORMATION 5.1 Package Marking Information 3-Lead TO-92 Example: MCP102 195I e3 TO^^ 547256 XXXXXX XXXXXX XXXXXX YWWNNN Example: MCP1xx = 3-Pin SOT-23 Part Number MCP102 MCP103 MCP121 MCP131 XXNN Legend: XX...X Y WW NNN e3 * Note: MCP1xxT-195I/TT JGNN TGNN LGNN KGNN MCP1xxT-240ETT JHNN THNN LHNN KHNN MCP1xxT-270E/TT JJNN TJNN LJNN KJNN MCP1xxT-300E/TT JKNN TKNN LKNN KKNN MCP1xxT-315E/TT JLNN TLNN LLNN KLNN MCP1xxT-450E/TT JMNN TMNN LMNN KMNN MCP1xxT-475E/TT JPNN TPNN LPNN KPNN Customer-specific information Year code (last digit of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 2004-2013 Microchip Technology Inc. DS21906C-page 15 MCP102/103/121/131 Package Marking Information (Continued) Example: MCP1xx = 3-Pin SC-70 Part Number MCP102 MCP103 MCP121 MCP131 XXN YWW Top Side Bottom Side MCP1xxT-195I/LB BGN FGN DGN CGN MCP1xxT-240E/LB BHN FHN DHN CHN MCP1xxT-270E/LB BJN FJN DJN CJN MCP1xxT-300E/LB BKN FKN DKN CKN MCP1xxT-315E/LB BLN FLN DLN CLN MCP1xxT-450E/LB BMN FMN DMN CMN MCP1xxT-475E/LB BPN FPN DPN CPN OR Example: MCP1xx = Part Number MCP102 MCP103 MCP121 MCP131 XXNN Top Side DS21906C-page 16 MCP1xxT-195I/LB BGNN FGNN DGNN CGNN MCP1xxT-240E/LB BHNN FHNN DHNN CHNN MCP1xxT-270E/LB BJNN FJNN DJNN CJNN MCP1xxT-300E/LB BKNN FKNN DKNN CKNN MCP1xxT-315E/LB BLNN FLNN DLNN CLNN MCP1xxT-450E/LB BMNN FMNN DMNN CMNN MCP1xxT-475E/LB BPNN FPNN DPNN CPNN 2004-2013 Microchip Technology Inc. MCP102/103/121/131 3-Lead Plastic Small Outline Transistor (TT) (SOT-23) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging E E1 2 B p1 n D p 1 c A A1 L Units Dimension Limits n Number of Pins p Pitch p1 Outside lead pitch (basic) Overall Height A Molded Package Thickness A2 Standoff A1 Overall Width E Molded Package Width E1 Overall Length D Foot Length L Foot Angle c Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic A2 B MIN .035 .035 .000 .083 .047 .110 .014 0 .004 .015 0 0 INCHES* NOM 3 .038 .076 .040 .037 .002 .093 .051 .115 .018 5 .006 .017 5 5 MAX .044 .040 .004 .104 .055 .120 .022 10 .007 .020 10 10 MILLIMETERS NOM 3 0.96 1.92 0.89 1.01 0.88 0.95 0.01 0.06 2.10 2.37 1.20 1.30 2.80 2.92 0.35 0.45 0 5 0.09 0.14 0.37 0.44 0 5 0 5 MIN MAX 1.12 1.02 0.10 2.64 1.40 3.04 0.55 10 0.18 0.51 10 10 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: TO-236 Drawing No. C04-104 2004-2013 Microchip Technology Inc. DS21906C-page 17 MCP102/103/121/131 3-Lead Plastic Small Outline Transistor (LB) (SC-70) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging E E1 2 B p1 3 D p 1 a A2 A c b A1 L Units Dimension Limits Number of Pins Pitch Outside lead pitch (basic) Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom p p1 A A2 A1 E E1 D L c B a b INCHES MIN 3 .026 BSC. .051 BSC. .031 .031 .000 .071 .045 .071 .004 .003 .006 8 8 MAX .043 .039 .0004 .094 .053 .089 .016 .010 .016 12 12 MILLIMETERS* MIN MAX 3 0.65 BSC. 1.30 BSC. 0.80 1.10 0.80 1.00 0.00 .010 1.80 2.40 1.15 1.35 1.80 2.25 0.10 0.41 0.08 0.25 0.15 0.40 8 12 8 12 *Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side. JEITA (EIAJ) Equivalent: SC70 Drawing No. C04-104 DS21906C-page 18 2004-2013 Microchip Technology Inc. MCP102/103/121/131 3-Lead Plastic Transistor Outline (TO) (TO-92) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging E1 D n 1 L 1 2 3 B p c A R Units Dimension Limits n p MIN INCHES* NOM MAX MILLIMETERS NOM 3 1.27 3.30 3.62 4.45 4.71 4.32 4.64 2.16 2.29 12.70 14.10 0.36 0.43 0.41 0.48 4 5 2 3 MIN Number of Pins 3 Pitch .050 Bottom to Package Flat A .130 .143 .155 Overall Width E1 .175 .186 .195 Overall Length D .170 .183 .195 Molded Package Radius R .085 .090 .095 Tip to Seating Plane L .500 .555 .610 c Lead Thickness .014 .017 .020 Lead Width B .016 .019 .022 Mold Draft Angle Top 4 5 6 Mold Draft Angle Bottom 2 3 4 *Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: TO-92 Drawing No. C04-101 2004-2013 Microchip Technology Inc. MAX 3.94 4.95 4.95 2.41 15.49 0.51 0.56 6 4 DS21906C-page 19 MCP102/103/121/131 5.2 Product Tape and Reel Specifications FIGURE 5-1: EMBOSSED CARRIER DIMENSIONS (8, 12, 16 AND 24 MM TAPE ONLY) Top Cover Tape A0 W B0 K0 P TABLE 1: CARRIER TAPE/CAVITY DIMENSIONS Case Outline Carrier Dimensions Package Type W mm Cavity Dimensions P mm A0 mm B0 mm K0 mm Output Quantity Units Reel Diameter in mm TT SOT-23 3L 8 4 3.15 2.77 1.22 3000 180 LB SC-70 3L 8 4 2.4 2.4 1.19 3000 180 FIGURE 5-2: 3-LEAD SOT-23/SC70 DEVICE TAPE AND REEL SPECIFICATIONS User Direction of Feed Device Marking W PIN 1 P Standard Reel Component Orientation DS21906C-page 20 2004-2013 Microchip Technology Inc. MCP102/103/121/131 FIGURE 5-3: TO-92 DEVICE TAPE AND REEL SPECIFICATIONS User Direction of Feed P Device Marking MARK MARK MARK FACE FACE FACE Seal Tape Back Tape Note: W Bent leads are for Tape and Reel only. 2004-2013 Microchip Technology Inc. DS21906C-page 21 MCP102/103/121/131 NOTES: DS21906C-page 22 2004-2013 Microchip Technology Inc. MCP102/103/121/131 APPENDIX A: REVISION HISTORY Revision C (January 2013) * Added a note to each package outline drawing. Revision B (March 2005) The following is the list of modifications: 1. 2. 3. 4. 5. Added Section 4.4 "Using in PIC(R) Microcontroller, ICSPTM Applications (MCP121 only)" on using the MCP121 in PIC microcontroller ICSP applications. Added VODH specifications in Section 1.0 "Electrical Characteristics" (for ICSP applications). Added Figure 2-33. Updated SC-70 package markings and added Pb-free marking information to Section 5.0 "Packaging information". Added Appendix A: "Revision History". Revision A (August 2004) * Original Release of this Document. 2004-2013 Microchip Technology Inc. DS21906C-page 23 MCP102/103/121/131 NOTES: DS21906C-page 24 l 2004-2013 Microchip Technology Inc. MCP102/103/121/131 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device - X / XX Examples: a) Tape/Reel Monitoring Temperature Package Range Option Options Device: Monitoring Options: Temperature Range: Package: XXX X MCP102: MicroPower Voltage Supervisor, push-pull MCP102T: MicroPower Voltage Supervisor, push-pull (Tape and Reel) MCP103: MicroPower Voltage Supervisor, push-pull MCP103T: MicroPower Voltage Supervisor, push-pull (Tape and Reel) MCP121 MicroPower Voltage Supervisor, open-drain MCP121T: MicroPower Voltage Supervisor, open-drain (Tape and Reel) MCP131 MicroPower Voltage Supervisor, open-drain MCP131T: MicroPower Voltage Supervisor, open-drain (Tape and Reel) 195 240 270 300 315 450 475 = = = = = = = 1.90V 2.32V 2.63V 2.93V 3.08V 4.38V 4.63V I E = -40C to +85C (MCP11X-195 only) = -40C to +125C (Except MCP11X-195 only) b) a) b) a) b) TT = SOT-23B, 3-lead LB = SC-70, 3-lead TO = TO-92, 3-lead a) b) 2004-2013 Microchip Technology Inc. MCP102T-195I/TT: Tape and Reel, 1.95V MicroPower Voltage Supervisor, push-pull, -40C to +85C, SOT-23B-3 package. MCP102-300E/TO: 3.00V MicroPower Voltage Supervisor, push-pull, -40C to +125C, TO-92-3 package. MCP103T-270E/TT: Tape and Reel, 2.70V MicroPower Voltage Supervisor, push-pull, -40C to +125C, SOT-23B-3 package. MCP103T-475E/LB: Tape and Reel, 4.75V MicroPower Voltage Supervisor, push-pull, -40C to +125C, SC-70-3 package. MCP121T-315I/LB: Tape and Reel, 3.15V MicroPower Voltage Supervisor, open-drain, -40C to +125C, SC-70-3 package. MCP121-300E/TO: 3.00V MicroPower Voltage Supervisor, open-drain, -40C to +125C, TO-92-3 package. MCP131T-195I/TT: Tape and Reel, 1.95V MicroPower Voltage Supervisor, open-drain, -40C to +85C, SOT-23B-3 package. MCP131-300E/TO: 3.00V MicroPower Voltage Supervisor, open-drain, -40C to +125C, TO-92-3 package. DS21906C-page 25 MCP102/103/121/131 NOTES: DS21906C-page 26 2004-2013 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: * Microchip products meet the specification contained in their particular Microchip Data Sheet. * Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. * There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. * Microchip is willing to work with the customer who is concerned about the integrity of their code. * Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MTP, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. Analog-for-the-Digital Age, Application Maestro, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. & KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. (c) 2004-2012, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 9781620769157 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == 2004-2012 Microchip Technology Inc. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company's quality system processes and procedures are for its PIC(R) MCUs and dsPIC(R) DSCs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 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