1. Product profile
1.1 General description
P-channel enhancement mode Field-Effect Transistor (FET) in a leadless ultra small
SOT883 (SC-101) Surface-Mounted Device (SMD) plastic package using Trench
MOSFET technology.
1.2 Features and benefits
Logic-level compatible
Very fast switching
Trench MOSFET technology
ESD protection up to 1 kV
AEC-Q101 qualified
1.3 Applications
Relay driver
High-speed line driver
High-side loadswitch
Switching circuits
1.4 Quick reference data
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for drain 1 cm2.
BSS84AKM
50 V, 230 mA P-channel Trench MOSFET
Rev. 1 — 23 May 2011 Product data sheet
SOT883
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
VDS drain-source voltage Tj=25°C ---50V
VGS gate-source voltage -20 - 20 V
IDdrain current VGS =-10V; T
amb =2C [1] ---230mA
Static characteristics
RDSon drain -so urce on-state
resistance VGS =-10V; I
D=-100mA;
Tj=2C -4.57.5
BSS84AKM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 1 — 23 May 2011 2 of 16
NXP Semiconductors BSS84AKM
50 V, 230 mA P-channel Tre nch MO SF ET
2. Pinning information
3. Ordering information
4. Marking
[1] % = placeholder for manufacturing site code
Table 2. Pinning information
Pin Symbol Description Simplified outline Graphic symbol
1 G gate
SOT883 (SOT883)
2Ssource
3 D drain 3
1
2
Transparent
top view
sym146
D
G
S
Table 3. Ordering information
Type number Package
Name Description Version
BSS84AKM SOT883 leadless ultra small plastic package; 3 solder lands;
body 1.0 x 0.6 x 0.5 mm SOT883
Table 4. Marking codes
Type number Marking code[1]
BSS84AKM ZA
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Product data sheet Rev. 1 — 23 May 2011 3 of 16
NXP Semiconductors BSS84AKM
50 V, 230 mA P-channel Tre nch MO SF ET
5. Limiting values
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for drain 1 cm2.
[2] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint.
[3] Measured between all pins.
Table 5. Limiting values
In accordance with the Absolute Maxi mum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VDS drain-source voltage Tj=2C - -50 V
VGS gate-source voltage -20 20 V
IDdrain current VGS =-10V; T
amb =2C [1] - -230 mA
VGS =-10V; T
amb = 100 °C [1] - -150 mA
IDM peak drain current Tamb = 25 °C; single pulse; tp10 µs - -0.9 A
Ptot total power dissipation Tamb =2C [2] - 340 mW
[1] - 715 mW
Tsp = 25 °C - 2700 mW
Tjjunction temperature -55 150 °C
Tamb ambient temperature -55 150 °C
Tstg storage temperature -65 150 °C
Source-drain diode
ISsource current Tamb =2C [1] - -230 mA
ESD maximum rating
VESD electrostatic discharge voltage HBM [3] - 1000 V
Fig 1. Normalized total power dissipation as a
function of junctio n temp erat u re Fig 2. Normalized continuous drain current as a
function of junction temp erat ure
Tj (°C)
-75 17512525 75-25
001aao121
40
80
120
Pder
(%)
0
Tj (°C)
-75 17512525 75-25
001aao122
40
80
120
Ider
(%)
0
BSS84AKM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 1 — 23 May 2011 4 of 16
NXP Semiconductors BSS84AKM
50 V, 230 mA P-channel Tre nch MO SF ET
IDM is single pulse
(1) tp = 1 ms
(2) DC; Tsp = 25 °C
(3) tp = 10 ms
(4) tp = 100 ms
(5) DC; Tamb = 25 °C; drain mountin g pad 1 cm2
Fig 3. Safe operating area; junction to ambient; continuous and peak drain currents as a function of drain-source
voltage
001aao138
VDS (V)
10-1 -102
-10-1
-1
-10-1
-10
ID
(A)
-10-2
(1)
(2)
(3)
(4)
(5)
BSS84AKM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 1 — 23 May 2011 5 of 16
NXP Semiconductors BSS84AKM
50 V, 230 mA P-channel Tre nch MO SF ET
6. Thermal characteristics
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for drain 1 cm2.
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Rth(j-a) thermal resistance from junction to ambient in free air [1] - 310 360 K/W
[2] - 150 175 K/W
Rth(j-sp) thermal resistance from junction to solder point - - 40 K/W
FR4 PCB, standard footprint
Fig 4. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
FR4 PCB, mounting pad for drain 1 cm2
Fig 5. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
017aaa109
t
p
(s)
10
3
10
2
10
3
10110
2
10
1
10
2
10
3
Z
th(j-a)
(K/W)
10
duty cycle = 1
0.75
0.5
0.33
0.25 0.2
0.05
0.02
0.01
0
0.1
017aaa110
t
p
(s)
10
3
10
2
10
3
10110
2
10
1
10
2
10
3
Z
th(j-a)
(K/W)
10
duty cycle = 1
0.75
0.5 0.33
0.25 0.2
0
0.1
0.02
0.01
0.05
BSS84AKM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 1 — 23 May 2011 6 of 16
NXP Semiconductors BSS84AKM
50 V, 230 mA P-channel Tre nch MO SF ET
7. Characteristics
Table 7. Characteristics
Symbol Parameter Conditions Min Typ Max Unit
Static characteristics
V(BR)DSS drain-source breakdown
voltage ID= -10 µA; VGS =0V; T
j=25°C -50--V
VGSth gate-source threshold
voltage ID=-25A; V
DS =V
GS; Tj= 25 °C -1.1 -1.6 -2.1 V
IDSS drain leakage current VDS =-50V; V
GS =0V; T
j=25°C ---1µA
VDS =-50V; V
GS =0V; T
j=150°C ---2µA
IGSS gate leakage current VGS =-20V; V
DS =0V; T
j= 25 °C - - -10 µA
VGS =20V; V
DS =0V; T
j= 25 °C - - -10 µA
RDSon drain-source on-state
resistance VGS =-10V; I
D= -100 mA; Tj=2C - 4.5 7.5
VGS =-10V; I
D= -100 mA; Tj= 150 °C - 8 13.5
VGS =-5V; I
D= -100 mA; Tj=2C - 5.7 8.5
gfs forward transconductance VDS =-10V; I
D= -100 mA; Tj= 25 °C - 150 - mS
Dynamic characteristics
QG(tot) total gate charge VDS =-25V; I
D= -200 mA; VGS =-5V;
Tj=2C - 0.26 0.35 nC
QGS gate-source charge - 0.12 - nC
QGD gate-drain charge - 0.09 - nC
Ciss input capacitance VDS = -25 V; f = 1 MHz; VGS =0V;
Tj=2C - 2436pF
Coss output capacitance - 4.5 - pF
Crss reverse transfer
capacitance -1.3-pF
td(on) turn-on delay time VDS =-30V; R
L=250; VGS =-10V;
RG(ext) =6; Tj=2C - 1326ns
trrise time - 11 - ns
td(off) turn-off delay time - 48 96 ns
tffall time - 25 - ns
Source-drain diode
VSD source-drain voltage IS=-115mA; V
GS =0V; T
j= 25 °C -0.48 -0.85 -1.2 V
BSS84AKM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 1 — 23 May 2011 7 of 16
NXP Semiconductors BSS84AKM
50 V, 230 mA P-channel Tre nch MO SF ET
Tj = 25 °C Tj = 25 °C; VDS = -5 V
(1) minimum values
(2) typical values
(3) maximum values
Fig 6. Outp ut characteristics; drain current as a
function of drain-source volta ge; typ ical values Fig 7. Sub-threshold drain current as a function of
gate-source voltage
Tj = 25 °C
(1) VGS = -3.0 V
(2) VGS = -3.5 V
(3) VGS = -4.0 V
(4) VGS = -5.0 V
(5) VGS = -10.0 V
ID = -200 mA
(1) Tj = 150 °C
(2) Tj = 25 °C
Fig 8. Drain-source on-state resistance as a function
of drain current; typical values Fig 9. Dr ain-source on-state resistance as a function
of gate-source voltage; typical value s
VDS (V)
0-4-3-1 -2
001aao124
-0.10
-0.05
-0.15
-0.20
ID
(A)
0
-3.5 V
-3.0 V
-2.5 V
VGS = -10 V -4.0 V
001aao125
-10-4
-10-5
-10-3
ID
(A)
-10-6
VGS (V)
0 -2.5-2.0-1.0 -1.5-0.5
(1) (2) (3)
ID (A)
0 -0.4-0.3-0.1 -0.2
001aao126
4
8
12
RDSon
(Ω)
0
(1) (2) (3)
(4)
(5)
VGS (V)
0 -10-8-4 -6-2
001aao127
6
10
14
RDSon
(Ω)
2
(1)
(2)
BSS84AKM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 1 — 23 May 2011 8 of 16
NXP Semiconductors BSS84AKM
50 V, 230 mA P-channel Tre nch MO SF ET
VDS > ID x RDSon
(1) Tj = 25 °C
(2) Tj = 150 °C
Fig 10. Transfer characteristics: drain current as a
function of gate-source voltage; typical values Fig 11. Normalized drain-source on-state resistance as
a function of junctio n temperature; typical
values
ID = -0.25 mA; VDS = VGS
(1) maximum values
(2) typical values
(3) minimum values
f = 1 MHz, VGS = 0 V
(1) Ciss
(2) Coss
(3) Crss
Fig 12. Gate-source threshold voltage as a function of
junction temperature Fig 13. Input, output and reverse transfer capacitances
as a function of drain-source voltage; typical
values
VGS (V)
0-4-3-1 -2
001aao128
-0.10
-0.05
-0.15
-0.20
ID
(A)
0
(1)
(1)
(2)
(2)
Tj (°C)
-60 180120060
001aao129
1.0
0.5
1.5
2.0
a
0
Tj (°C)
-60 180120060
001aao130
-1
-2
-3
VGS(th)
(V)
0
(1)
(2)
(3)
001aao131
VDS (V)
-10-1 -102
-10-1
10
102
C
(pF)
1
(1)
(2)
(3)
BSS84AKM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 1 — 23 May 2011 9 of 16
NXP Semiconductors BSS84AKM
50 V, 230 mA P-channel Tre nch MO SF ET
ID = -0.2 A; VDS = -25 V; Tamb = 25 °C
Fig 14. Gate-source voltage as a function of gate
charge; typical values Fig 15. Gate charge waveform definitions
VGS = 0 V
(1) Tj = 150 °C
(2) Tj = 25 °C
Fig 16. Source current as a functio n of so urce-drain voltage; typical valu es
001aao132
QG (nC)
0 0.60.40.2
-4
-6
-2
-8
-10
VGS
(V)
0
003aaa508
VGS
VGS(th)
QGS1 QGS2
QGD
VDS
QG(tot)
ID
QGS
VGS(pl)
VSD (V)
0 -1.2-0.8-0.4
001aao133
-0.1
-0.2
-0.3
IS
(A)
0
(1) (2)
BSS84AKM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 1 — 23 May 2011 10 of 16
NXP Semiconductors BSS84AKM
50 V, 230 mA P-channel Tre nch MO SF ET
8. Test information
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - St re ss te st qu alif ication for discrete semiconductors, and is
suitable for use in auto motive applications.
Fig 17. Duty cycle definition
t1
t2
P
t
006aaa812
duty cycle δ =
t1
t2
BSS84AKM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 1 — 23 May 2011 11 of 16
NXP Semiconductors BSS84AKM
50 V, 230 mA P-channel Tre nch MO SF ET
9. Package outline
Fig 18. Package outline SOT883 (SOT883)
UNIT A1
max.
A(1) bb
1e1
eLL
1
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 0.50
0.46
0.20
0.12
0.55
0.47
0.03 0.62
0.55 0.35 0.65
DIMENSIONS (mm are the original dimensions)
Note
1. Including plating thickness
0.30
0.22
0.30
0.22
SOT883 SC-101 03-02-05
03-04-03
DE
1.02
0.95
L
E
2
3
1
b
b1
A1
A
D
L1
0 0.5 1 mm
scale
L
eadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.5 mm SOT88
3
e
e1
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Product data sheet Rev. 1 — 23 May 2011 12 of 16
NXP Semiconductors BSS84AKM
50 V, 230 mA P-channel Tre nch MO SF ET
10. Soldering
Fig 19. Reflow soldering footprint for SOT883 (SOT883)
solder lands
solder resist
occupied area
solder paste
sot883_
fr
1.3
0.3
0.6 0.7
0.4
0.9
0.3
(2×)
0.4
(2×)
0.25
(2×)
R0.05 (12×)
0.7
Dimensions in mm
BSS84AKM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 1 — 23 May 2011 13 of 16
NXP Semiconductors BSS84AKM
50 V, 230 mA P-channel Tre nch MO SF ET
11. Revision history
Table 8. Revision history
Document ID Release date Data sheet status Change notice Supersedes
BSS84AKM v.1 20110523 Product data sheet - -
BSS84AKM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 1 — 23 May 2011 14 of 16
NXP Semiconductors BSS84AKM
50 V, 230 mA P-channel Tre nch MO SF ET
12. Legal information
12.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term 'short data sheet' is explained in section "Definitions".
[3] The p r oduct status of device(s) described in this document may hav e c hanged since this documen t was published and may differ in case of multiple devices. The latest product
status information is available on the Internet at URL http://www.nxp.com.
12.2 Definitions
Preview — The document is a preview version only. The document is still
subject to formal approval, which may result in modificat ions or additions.
NXP Semiconductors does not give any representations or warranties as to
the accuracy or completeness of informati on included herein and shall have
no liability for the consequences of use of such info rmation.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liab ility for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and tit le. A short data sh eet is intended
for quick reference only and shou ld not b e relied u pon to cont ain det ailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semicond uctors sales
office. In case of any inconsistency or conflict wit h the short data sheet, the
full data sheet shall pre va il.
Product specificat io nThe information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to off er functions and qualities beyond those described in the
Product data sheet.
12.3 Disclaimers
Limited warranty and liability — Information in this d ocument is be lieved to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warrant ies, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incide ntal,
punitive, special or consequ ential damages (including - wit hout limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ ag gregate and cumulative l iability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersed es an d r eplaces all inf ormation supplied pri or
to the publication hereof.
Suitability for useNXP Semiconductors product s are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in perso nal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Quick reference dataThe Quick reference data i s an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and ope ration of their applications
and products using NXP Semiconductors product s, and NXP Semiconductors
accepts no liability for any assistance with applicati ons or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suit able and fit for the custome r’s applications and
products planned, as well as fo r the planned application and use of
customer’s third party customer(s). Custo mers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party custo m er(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Document status [1] [2] Product status [3] Definition
Objective [short] data sheet Development This document contai ns data from the objective specification for product development.
Preliminary [shor t] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
BSS84AKM All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 1 — 23 May 2011 15 of 16
NXP Semiconductors BSS84AKM
50 V, 230 mA P-channel Tre nch MO SF ET
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document ma y be interpret ed or
construed as an of fer to se ll product s that is op en for accept ance or the grant ,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) d escribed herein may
be subject to export control regulat i ons. Export might require a prior
authorization from national authorities.
12.4 Trademarks
Notice: All referenced b rands, produc t names, service names and trademarks
are the property of their respective ow ners.
Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV,
FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE,
ITEC, Labelution, MIFARE, MIF ARE Plus, MIFARE Ultralight, MoReUse,
QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET,
TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V.
HD Radio and HD Radio logo — are trademarks of iBiquity Digital
Corporation.
13. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NXP Semiconductors BSS84AKM
50 V, 230 mA P-channel Tre nch MO SF ET
© NXP B.V. 2011. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 23 May 2011
Document identifier: BSS84AKM
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
14. Contents
1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . .1
1.1 General description . . . . . . . . . . . . . . . . . . . . . .1
1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . .1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . .1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . .2
3 Ordering information. . . . . . . . . . . . . . . . . . . . . .2
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .3
6 Thermal characteristics . . . . . . . . . . . . . . . . . . .5
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . .6
8 Test information. . . . . . . . . . . . . . . . . . . . . . . . .10
8.1 Quality information . . . . . . . . . . . . . . . . . . . . . .10
9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . .11
10 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
11 Revision history. . . . . . . . . . . . . . . . . . . . . . . . .13
12 Legal information. . . . . . . . . . . . . . . . . . . . . . . .14
12.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . .14
12.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
12.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . .14
12.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .15
13 Contact information. . . . . . . . . . . . . . . . . . . . . .15