MCIMX535DVV1C - Freescale Semiconductor

Freescale Semiconductor

Data Sheet: Advance Information

Document Number: IMX53CEC

Rev. 4.1, 2/2012

MCIMX53xD

Package Information

Plastic Package

Case TEPBGA-2 19 x 19 mm, 0.8 mm pitch

Case FC-PBGA 12 x 12 mm PoP, 0.4 mm pitch

Ordering Information

See Table 1 on page 3

This document contains information on a new product. Specifications and information herein

are subject to change without notice.

1 Introduction

The i.MX53xD multimedia application processor is

Freescale Semiconductor’s latest addition to a growing

family of multimedia-focused products offering high

performance processing optimized for lowest power

consumption.

The i.MX53xD processor features Freescale’s advanced

implementation of the ARM™ core, which operates at

clock speeds as high as 1.2 GHz and interfaces with

DDR2/LVDDR2-800, LPDDR2-800, or DDR3-800

DRAM memories. This device is suitable for

applications such as the following:

•Tablets

• Smart devices

• Netbooks (web tablets)

• Nettops (Internet desktop devices)

• Thin clients

• Media phones

• Internet monitors

• High-end mobile Internet devices (MID)

i.MX53xD Applications

Processors for Consumer

Products

1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 3

1.2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

2. Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

2.1. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

3. Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

3.1. Special Signal Considerations . . . . . . . . . . . . . . . 17

4. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 17

4.1. Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . 17

4.2. Power Supply Requirements and Restrictions . . . 25

4.3. I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 28

4.4. Output Buffer Impedance Characteristics . . . . . . 34

4.5. I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 38

4.6. System Modules Timing . . . . . . . . . . . . . . . . . . . . 45

4.7. External Peripheral Interfaces Parameters . . . . . . 67

4.8. XTAL Electrical Specifications . . . . . . . . . . . . . . 143

5. Boot Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . 144

5.1. Boot Mode Configuration Pins . . . . . . . . . . . . . . 144

5.2. Boot Devices Interfaces Allocation . . . . . . . . . . . 145

5.3. Power Setup During Boot . . . . . . . . . . . . . . . . . . 146

6. Package Information and Contact Assignments . . . . . 147

6.1. 19x19 mm Package Information . . . . . . . . . . . . . 147

6.2. 19 x 19 mm, 0.8 Pitch Ball Map . . . . . . . . . . . . . 166

6.3. 12 x 12 mm Package on Package (PoP) Information

170

7. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 198

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

2Freescale Semiconductor

Introduction

• High-end portable media players (PMP) with HD video capability

• Portable navigation devices (PND)

The flexibility of the i.MX53xD architecture allows for its use in a wide variety of applications. As the

heart of the application chipset, the i.MX53xD processor provides all the interfaces for connecting

peripherals, such as WLAN, Bluetooth™, GPS, hard drive, camera sensors, and dual displays.

Features of the i.MX53xD processor include the following:

• Applications processor—The i.MX53xD processors boost the capabilities of high-tier portable

applications by satisfying the ever increasing MIPS needs of operating systems and games.

Freescale’s Dynamic Voltage and Frequency Scaling (DVFS) provides significant power reduction,

allowing the device to run at lower voltage and frequency with sufficient MIPS for tasks such as

audio decode.

• Multilevel memory system—The multilevel memory system of the i.MX53xD is based on the L1

instruction and data caches, L2 cache, internal and external memory. The i.MX53xD supports

many types of external memory devices, including DDR2, low voltage DDR2, LPDDR2, DDR3,

NOR Flash, PSRAM, cellular RAM, NAND Flash (MLC and SLC), OneNAND™, and managed

NAND including eMMC up to rev 4.4.

• Smart speed technology—The i.MX53xD device has power management throughout the IC that

enables the rich suite of multimedia features and peripherals to consume minimum power in both

active and various low power modes. Smart speed technology enables the designer to deliver a

feature-rich product requiring levels of power far lower than industry expectations.

• Multimedia powerhouse—The multimedia performance of the i.MX53xD processor ARM core is

boosted by a multilevel cache system, Neon (including advanced SIMD, 32-bit single-precision

floating point support) and vector floating point coprocessors. The system is further enhanced by

a multi-standard hardware video codec, autonomous image processing unit (IPU), SD and HD720p

triple video (TV) encoder with triple video DAC, and a programmable smart DMA (SDMA)

controller.

• Powerful graphics acceleration—Graphics is the key to mobile game, navigation, web browsing,

and other applications. The i.MX53xD processors provide two independent, integrated graphics

processing units: an OpenGL® ES 2.0 3D graphics accelerator (33 Mtri/s, 200 Mpix/s, and

800 Mpix/s z-plane performance) and an OpenVG™ 1.1 2D graphics accelerator (200 Mpix/s).

• Interface flexibility—The i.MX53xD processor supports connection to a variety of interfaces,

including LCD controller for two displays and CMOS sensor interface, high-speed USB on-the-go

with PHY, plus three high-speed USB hosts, multiple expansion card ports (high-speed

MMC/SDIO host and others), 10/100 Ethernet controller, and a variety of other popular interfaces

(PATA, UART, I2C, and I2S serial audio, among others).

• Advanced security—The i.MX53xD processors deliver hardware-enabled security features that

enable secure e-commerce, digital rights management (DRM), information encryption, secure

boot, and secure software downloads. For detailed information about the i.MX53xD security

features contact a Freescale representative.

The i.MX53xD application processor is a follow-on to the i.MX51, with improved performance, power

efficiency, and multimedia capabilities.

Introduction

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 3

1.1 Ordering Information

Table 1 provides ordering information.

1.2 Features

The i.MX53xD multimedia applications processor (AP) is based on the ARM Platform, which has the

following features:

• MMU, L1 instruction and L1 data cache

• Unified L2 cache

• Maximum frequency of the core (including Neon, VFPv3 and L1 cache): 1–1.2 GHz

• Neon coprocessor (SIMD media processing architecture) and vector floating point (VFP-Lite)

coprocessor supporting VFPv3

• TrustZone

The memory system consists of the following components:

• Level 1 cache:

— Instruction (32 Kbyte)

— Data (32 Kbyte)

• Level 2 cache:

— Unified instruction and data (256 Kbyte)

• Level 2 (internal) memory:

— Boot ROM, including HAB (64 Kbyte)

— Internal multimedia/shared, fast access RAM (128 Kbyte)

— Secure/non-secure RAM (16 Kbyte)

• External memory interfaces:

— 16/32-bit DDR2-800, LV-DDR2-800 or DDR3-800 up to 2 Gbyte

— 32-bit LPDDR2

— 8/16-bit NAND SLC/MLC Flash, up to 66 MHz, 4/8/14/16-bit ECC

— 8/16-bit NOR Flash, PSRAM, and cellular RAM.

Table 1. Ordering Information

Part Number Mask Set Features

Case

Temperature

Range (°C)

Package1

1Case TEPBGA-2 and FC-PBGA are RoHS compliant, lead-free MSL (moisture sensitivity level) 3.

MCIMX535DVV1C N78C 1 GHz, full feature set -20 to +85 19 x 19 mm, 0.8 mm pitch BGA

Case TEPBGA-2

MCIMX535DVV2C N78C 1.2 GHz, full feature set -20 to +85 19 x 19 mm, 0.8 mm pitch BGA

Case TEPBGA-2

SCIMX538DZK1C N78C 1 GHz, full feature set -20 to +85 12 x 12 mm PoP, 0.4 mm pitch BGA

Case FC-PBGA

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

4Freescale Semiconductor

Introduction

— 32-bit multiplexed mode NOR Flash, PSRAM & cellular RAM.

— 8-bit Asynchronous (DTACK mode) EIM interface.

— All EIM pins are muxed on other interfaces (data with NFC pins). I/O muxing logic selects EIM

port, as primary muxing at system boot.

— Samsung OneNAND™ and managed NAND including eMMC up to rev 4.4 (in muxed I/O

mode)

The i.MX53xD system is built around the following system on chip interfaces:

• 64-bit AMBA AXI v1.0 bus—used by ARM platform, multimedia accelerators (such as VPU, IPU,

GPU3D, GPU2D) and the external memory controller (EXTMC) operating at 200 MHz.

• 32-bit AMBA AHB 2.0 bus—used by the rest of the bus master peripherals operating at 133 MHz.

• 32-bit IP bus—peripheral bus used for control (and slow data traffic) of the most system peripheral

devices operating at 66 MHz.

The i.MX53xD makes use of dedicated hardware accelerators to achieve state-of-the-art multimedia

performance. The use of hardware accelerators provides both high performance and low power

consumption while freeing up the CPU core for other tasks.

The i.MX53xD incorporates the following hardware accelerators:

• VPU, version 3—video processing unit

• GPU3D—3D graphics processing unit, OpenGL ES 2.0, version 3, 33 Mtri/s, 200 Mpix/s, and

800 Mpix/s z-plane performance, 256 Kbyte RAM memory

• GPU2D—2D graphics accelerator, OpenVG 1.1, version 1, 200 Mpix/s performance,

• IPU, version 3M—image processing unit

• ASRC—asynchronous sample rate converter

The i.MX53xD includes the following interfaces to external devices:

NOTE

Not all interfaces are available simultaneously, depending on I/O

multiplexer configuration.

• Hard disk drives:

— PATA, up to U-DMA mode 5, 100 MByte/s

— SATA I, 1.5 Gbps

•Displays:

— Five interfaces available. Total rate of all interfaces is up to 180 Mpixels/s, 24 bpp. Up to two

interfaces may be active at once.

— Two parallel 24-bit display ports. The primary port is up to 165 Mpix/s (for example,

UXGA at 60 Hz).

— LVDS serial ports: one dual channel port up to 165 Mpix/s or two independent single channel

ports up to 85 MP/s (for example, WXGA at 60 Hz) each.

— TV-out/VGA port up to 150 Mpix/s (for example, 1080p60).

• Camera sensors:

Introduction

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 5

— Two parallel 20-bit camera ports. Primary up to 180-MHz peak clock frequency, secondary up

to 120-MHz peak clock frequency.

• Expansion cards:

— Four SD/MMC card ports: three supporting 416 Mbps (8-bit i/f) and one enhanced port

supporting 832 Mbps (8-bit, eMMC 4.4).

•USB

— High-speed (HS) USB 2.0 OTG (up to 480 Mbps), with integrated HS USB PHY

— Three USB 2.0 (480 Mbps) hosts:

– High-speed host with integrated on-chip high-speed PHY

– Two high-speed hosts for external HS/FS transceivers through ULPI/serial, support IC-USB

• Miscellaneous interfaces:

— One-wire (OWIRE) port

— Three I2S/SSI/AC97 ports, supporting up to 1.4 Mbps, each connected to audio multiplexer

(AUDMUX) providing four external ports.

— Five UART RS232 ports, up to 4.0 Mbps each. One supports 8-wire, the other four support

4-wire.

— Two high speed enhanced CSPI (ECSPI) ports plus one CSPI port

— Three I2C ports, supporting 400 kbps

— Fast Ethernet controller, IEEE1588 V1 compliant, 10/100 Mbps

— Two controller area network (FlexCAN) interfaces, 1 Mbps each

— Sony Phillips Digital Interface (SPDIF), Rx and Tx

— Enhanced serial audio interface (ESAI), up to 1.4 Mbps each channel

— Key pad port (KPP)

— Two pulse-width modulators (PWM)

— GPIO with interrupt capabilities

The system supports efficient and smart power control and clocking:

• Supporting DVFS (dynamic voltage and frequency scaling) technique for low power modes

• Power gating SRPG (State Retention Power Gating) for ARM core and Neon

• Support for various levels of system power modes

• Flexible clock gating control scheme

• On-chip temperature monitor

• On-chip oscillator amplifier supporting 32.768 kHz external crystal

• On-chip LDO voltage regulators for PLLs

Security functions are enabled and accelerated by the following hardware:

• ARM TrustZone including the TZ architecture (separation of interrupts, memory mapping, and so

on)

• Secure JTAG controller (SJC)—Protecting JTAG from debug port attacks by regulating or blocking

the access to the system debug features

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

6Freescale Semiconductor

Introduction

• Secure real-time clock (SRTC)—Tamper resistant RTC with dedicated power domain and

mechanism to detect voltage and clock glitches

• Real-time integrity checker, version 3 (RTICv3)—RTIC type1, enhanced with SHA-256 engine

• SAHARAv4 Lite—Cryptographic accelerator that includes true random number generator

(TRNG)

• Security controller, version 2 (SCCv2)—Improved SCC with AES engine, secure/non-secure

RAM and support for multiple keys as well as TZ/non-TZ separation

• Central security unit (CSU)—Enhancement for the IIM (IC Identification Module). CSU is

configured during boot by e-fuses, and determines the security level operation mode as well as the

TrustZone (TZ) policy

• Advanced High Assurance Boot (A-HAB)—HAB with the following embedded enhancements:

SHA-256, 2048-bit RSA key, version control mechanism, warm boot, CSU, and TZ initialization

NOTE

The actual feature set depends on the part number as described in Table 1.

Functions such as video hardware acceleration with 2D and 3D hardware

graphics acceleration may not be enabled for specific part numbers.

Architectural Overview

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 7

2 Architectural Overview

The following subsections provide an architectural overview of the i.MX53xD processor system.

2.1 Block Diagram

Figure 1 shows the functional modules in the i.MX53xD processor system.

Figure 1. i.MX53xD System Block Diagram

NOTE

The numbers in brackets indicate number of module instances. For example,

PWM (2) indicates two separate PWM peripherals.

Application Processor

Smart DMA

(SDMA)

Shared Peripherals

AP Peripherals

ARM Cortex A8

Platform

Timers

CSPI

UART (4)

GPT

PWM (2)

EPIT (2)

GPIOx32 (7)

WDOG (2)

OWIRE

C(3)

IOMUXC

IIM

AUDMUX

KPP

Boot

ROM

SSI (2)

RTICv3

SCCv2

SRTC

CSU

Fuse Box

Debug

DAP

TPIU

FIRI

SAHARAv4

Lite

Security

TZIC

Image Processing

USB OTG +

3 HS Ports

CTI (2) ECSPI

Internal

USB PHY2

USB PHY1

External

Memory I/F

RAM

144 KB

Subsystem

(IPU)

TV-EncoderLDB

LCD

Display-1,2

Domain (AP)

Composite CVBS/ S-Video

Component RGB, YCC

(HD TV-Out / VGA)

SJC

Neon, VFPv3

L2 cache 256 KB

ETM, CTI0,1

L1 I/D cache

IrDA

XVR WLAN USB OTG

(dev/host)

JTAG

(IEEE1149.1)

Bluetooth

Keypad Access.

Conn.

MMC/SD

eMMC/eSD

GPS

RF/IF

RF / IF

IC’s

Audio,

Power

Mngmnt.

SPBA

FlexCAN (2)

Digital

Audio

CAN i/f

eSDHCv2 (3)

UART

SPDIF Rx/Tx

ASRC

Video

Proc. Unit

(VPU)

3D Graphics

Proc. Unit

(GPU3D)

G-Memory

256 KB

2D Graphics

Proc. Unit

(

GPU2D

)

AXI and AHB Switch Fabric

LVDS

(WSXGA+)

Battery Ctrl

Device

NOR/NAND

Flash

Ethernet

10/100

Mbps

FEC

(IEEE1588)

Camera

(2)

64 KB

Clock and Reset

PLL (4)

CCM

GPC

SRC

XTALOSC(2)

CAMP (2)

Temperature

Sensor

eSDHCv3

Camera

(2)

(EXTMC)

LCD

Display (2)

SSI

ECSPI

ESAI

P-ATA

SATA

+ Temp Mon

SATA /

P-ATA

HDD

DDR2/DDR3/

LPDDR2

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

8Freescale Semiconductor

Modules List

3 Modules List

The i.MX53xD processor contains a variety of digital and analog modules. Table 2 describes these

modules in alphabetical order.

Table 2. i.MX53xD Digital and Analog Blocks

Block

Mnemonic Block Name Subsystem Brief Description

ARM ARM Platform ARM The ARM CortexTM A8 platform consists of the ARM processor version r2p5

(with TrustZone) and its essential sub-blocks. It contains the 32 Kbyte L1

instruction cache, 32 Kbyte L1 data cache, Level 2 cache controller and a

256 Kbyte L2 cache. The platform also contains an event monitor and

debug modules. It also has a NEON coprocessor with SIMD media

processing architecture, a register file with 32/64-bit general-purpose

registers, an integer execute pipeline (ALU, Shift, MAC), dual

single-precision floating point execute pipelines (FADD, FMUL), a

load/store and permute pipeline and a non-pipelined vector floating point

(VFP Lite) coprocessor supporting VFPv3.

ASRC Asynchronous

Sample Rate

Converter

Multimedia

Peripherals

The asynchronous sample rate converter (ASRC) converts the sampling

rate of a signal associated to an input clock into a signal associated to a

different output clock. The ASRC supports concurrent sample rate

conversion of up to 10 channels of about -120 dB THD+N. The sample rate

conversion of each channel is associated to a pair of incoming and outgoing

sampling rates. The ASRC supports up to three sampling rate pairs.

AUDMUX Digital Audio

Multiplexer

Multimedia

Peripherals

The AUDMUX is a programmable interconnect for voice, audio, and

synchronous data routing between host serial interfaces (for example,

SSI1, SSI2, and SSI3) and peripheral serial interfaces (audio and voice

codecs). The AUDMUX has seven ports (three internal and four external)

with identical functionality and programming models. A desired connectivity

is achieved by configuring two or more AUDMUX ports.

CAMP-1

CAMP-2

Clock Amplifier Clocks,

Resets, and

Power Control

Clock amplifier

CCM

GPC

SRC

Clock Control

Module

Global Power

Controller

System Reset

Controller

Clocks,

Resets, and

Power Control

These modules are responsible for clock and reset distribution in the

system, as well as for system power management.

The system includes four PLLs.

CSPI

ECSPI-1

ECSPI-2

Configurable

SPI, Enhanced

CSPI

Connectivity

Peripherals

Full-duplex enhanced synchronous serial interface, with data rates

16-60 Mbit/s. It is configurable to support master/slave modes. In Master

mode it supports four slave selects for multiple peripherals.

CSU Central Security

Unit

Security The central security unit (CSU) is responsible for setting comprehensive

security policy within the i.MX53xD platform, and for sharing security

information between the various security modules. The security control

registers (SCR) of the CSU are set during boot time by the high assurance

boot (HAB) code and are locked to prevent further writing.

Modules List

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 9

DEBUG Debug System System

Control

The debug system provides real-time trace debug capability of both

instructions and data. It supports a trace protocol that is an integral part of

the ARM Real Time Debug solution (RealView).

Real-time tracing is controlled by specifying a set of triggering and filtering

resources, which include address and data comparators, three

cross-system triggers (CTI), counters, and sequencers.

debug access port (DAP)— The DAP provides real-time access for the

debugger without halting the core to system memory, peripheral register,

debug configuration registers and JTAG scan chains.

EXTMC External Memory

Controller

Connectivity

Peripherals

The EXTMC is an external and internal memory interface. It performs

arbitration between multi-AXI masters to multi-memory controllers, divided

into four major channels, fast memories (DDR2/DDR3/LPDDR2) channel,

slow memories (NOR-FLASH / PSRAM / NAND-FLASH etc.) channel,

internal memory (RAM, ROM) channel and graphical memory (GMEM)

channel.

In order to increase the bandwidth performance, the EXTMC separates the

buffering and the arbitration between different channels so parallel

accesses can occur. By separating the channels, slow accesses do not

interfere with fast accesses.

EXTMC Features:

• 64-bit and 32-bit AXI ports

• Enhanced arbitration scheme for fast channel, including dynamic master

priority, and taking into account which pages are open or closed and

what type (read or write) was the last access

• Flexible bank interleaving

• Support 16/32-bit DDR2-800 or DDR3-800 or LPDDR2.

• Support up to 2 GByte DDR memories.

• Support NFC, EIM signal muxing scheme.

• Support 8/16/32-bit Nor-Flash/PSRAM memories (sync and async

operating modes), at slow frequency. (8-bit is not supported on

D[23]-D[16]).

• Support 4/8/14/16-bit ECC, page sizes of 512-B, 2-KB and 4-KB

Nand-Flash (including MLC)

• Multiple chip selects (up to 4).

• Enhanced DDR memory controller, supporting access latency hiding

• Support watermark for security (internal and external memories)

EPIT-1

EPIT-2

Enhanced

Periodic Interrupt

Timer

Peripherals

Each EPIT is a 32-bit “set and forget” timer that starts counting after the

EPIT is enabled by software. It is capable of providing precise interrupts at

regular intervals with minimal processor intervention. It has a 12-bit

prescaler for division of input clock frequency to get the required time

setting for the interrupts to occur, and counter values can be programmed

on the fly.

ESAI Enhanced Serial

Audio Interface

Connectivity

Peripherals

The enhanced serial audio interface (ESAI) provides a full-duplex serial port

for serial communication with a variety of serial devices, including

industry-standard codecs, SPDIF transceivers, and other processors.

The ESAI consists of independent transmitter and receiver sections, each

section with its own clock generator.

The ESAI has 12 pins for data and clocking connection to external devices.

Table 2. i.MX53xD Digital and Analog Blocks (continued)

Block

Mnemonic Block Name Subsystem Brief Description

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

10 Freescale Semiconductor

Modules List

ESDHCV3-3 Ultra-High-

Speed eMMC /

SD Host

Controller

Connectivity

Peripherals

Ultra high-speed eMMC / SD host controller, enhanced to support eMMC

4.4 standard specification, for 832 MBps.

• Port 3 is specifically enhanced to support eMMC 4.4 specification, for

double data rate (832 Mbps, 8-bit port).

ESDHCV3 is backward compatible to ESDHCV2 and supports all the

features of ESDHCV2 as described below.

ESDHCV2-1

ESDHCV2-2

ESDHCv2-4

Enhanced

Multi-Media Card

Secure Digital

Host Controller

Enhanced multimedia card / secure digital host controller

• Ports 1, 2, and 4 are compatible with the “MMC System Specification”

version 4.3, full support and supporting 1, 4 or 8-bit data.

The generic features of the eSDHCv2 module, when serving as SD / MMC

host, include the following:

• Can be configured either as SD / MMC controller

• Supports eSD and eMMC standard, for SD/MMC embedded type cards

• Conforms to SD Host Controller Standard Specification, version 2.0, full

support.

• Compatible with the SD Memory Card Specification, version 1.1

• Compatible with the SDIO Card Specification, version 1.2

• Designed to work with SD memory, miniSD memory, SDIO, miniSDIO,

SD Combo, MMC and MMC RS cards

• Configurable to work in one of the following modes:

—SD/SDIO 1-bit, 4-bit

—MMC 1-bit, 4-bit, 8-bit

• Full/high speed mode.

• Host clock frequency variable between 32 kHz to 52 MHz

• Up to 200 Mbps data transfer for SD/SDIO cards using 4 parallel data

lines

• Up to 416 Mbps data transfer for MMC cards using 8 parallel data lines

FEC Fast Ethernet

Controller

Connectivity

Peripherals

The Ethernet media access controller (MAC) is designed to support both

10 Mbps and 100 Mbps Ethernet/IEEE Std 802.3™ networks. An external

transceiver interface and transceiver function are required to complete the

interface to the media.

The i.MX53xD also consists of HW assist for IEEE1588™ standard. See,

TSU and CE_RTC (IEEE1588) section for more details.

FIRI Fast Infrared

Interface

Connectivity

Peripherals

Fast infrared interface

FLEXCAN-1

FLEXCAN-2

Flexible

Controller Area

Network

Connectivity

Peripherals

The controller area network (CAN) protocol was primarily, but not

exclusively, designed to be used as a vehicle serial data bus. Meets the

following specific requirements of this application: real-time processing,

reliable operation in the EXTMC environment of a vehicle,

cost-effectiveness and required bandwidth. The FLEXCAN is a full

implementation of the CAN protocol specification, Version 2.0 B (ISO

11898), which supports both standard and extended message frames at

1 Mbps.

Table 2. i.MX53xD Digital and Analog Blocks (continued)

Block

Mnemonic Block Name Subsystem Brief Description

Modules List

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 11

GPIO-1

GPIO-2

GPIO-3

GPIO-4

GPIO-5

GPIO-6

GPIO-7

General Purpose

I/O Modules

System

Control

Peripherals

These modules are used for general purpose input/output to external ICs.

Each GPIO module supports up to 32 bits of I/O.

GPT General Purpose

Timer

Peripherals

Each GPT is a 32-bit “free-running” or “set and forget” mode timer with a

programmable prescaler and compare and capture register. A timer counter

value can be captured using an external event, and can be configured to

trigger a capture event on either the leading or trailing edges of an input

pulse. When the timer is configured to operate in “set and forget” mode, it is

capable of providing precise interrupts at regular intervals with minimal

processor intervention. The counter has output compare logic to provide the

status and interrupt at comparison. This timer can be configured to run

either on an external clock or on an internal clock.

GPU3D Graphics

Processing Unit

Multimedia

Peripherals

The GPU, version 3, provides hardware acceleration for 2D and 3D

graphics algorithms with sufficient processor power to run desk-top quality

interactive graphics applications on displays up to HD1080 resolution. It

supports color representation up to 32 bits per pixel. GPU enables

high-performance mobile 3D and 2D vector graphics at rates up to 33

Mtriangles/s, 200 Mpix/s, 800 Mpix/s (z).

GPU2D Graphics

Processing

Unit-2D

Multimedia

Peripherals

The GPU2D version 1, provides hardware acceleration for 2D graphic

algorithms with sufficient processor power to run desk-top quality

interactive graphics applications on displays up to HD1080 resolution.

I2C-1

I2C-2

I2C-3

I2C Controller Connectivity

Peripherals

I2C provides serial interface for controlling peripheral devices. Data rates of

up to 400 kbps are supported.

IIM IC Identification

Module

Security The IC identification module (IIM) provides an interface for reading,

programming, and/or overriding identification and control information stored

in on-chip fuse elements. The module supports electrically programmable

poly fuses (e-Fuses). The IIM also provides a set of volatile

software-accessible signals that can be used for software control of

hardware elements not requiring non-volatility. The IIM provides the primary

user-visible mechanism for interfacing with on-chip fuse elements. Among

the uses for the fuses are unique chip identifiers, mask revision numbers,

cryptographic keys, JTAG secure mode, boot characteristics, and various

control signals requiring permanent non-volatility. The IIM also provides up

to 28 volatile control signals. The IIM consists of a master controller, a

software fuse value shadow cache, and a set of registers to hold the values

of signals visible outside the module.

IIM interfaces to the electrical fuse array (split to banks). Enabled to set up

boot modes, security levels, security keys and many other system

parameters.

i.MX53xDA consists of 4 x 256-bit + 1 x 128-bit fuse-banks (total 1152 bits)

through IIM interface.

Table 2. i.MX53xD Digital and Analog Blocks (continued)

Block

Mnemonic Block Name Subsystem Brief Description

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

12 Freescale Semiconductor

Modules List

IOMUXC IOMUX Control System

Control

Peripherals

This module enables flexible I/O multiplexing. Each I/O pad has default as

well as several alternate functions. The alternate functions are software

configurable.

IPU Image

Processing Unit

Multimedia

Peripherals

Version 3M IPU enables connectivity to displays, relevant processing and

synchronization. It supports two display ports and two camera ports,

through the following interfaces:

• Legacy parallel interfaces

• Single/dual channel LVDS display interface

• Analog TV or VGA interfaces

The processing includes:

• Image enhancement—color adjustment and gamut mapping, gamma

correction and contrast enhancement

• Video/graphics combining

• Support for display backlight reduction

• Image conversion—resizing, rotation, inversion and color space

conversion

• Hardware de-interlacing support

• Synchronization and control capabilities, allowing autonomous

operation.

KPP Keypad Port Connectivity

Peripherals

The KPP supports an 8 ×8 external keypad matrix. The KPP features are

as follows:

• Open drain design

• Glitch suppression circuit design

• Multiple keys detection

• Standby key press detection

LDB LVDS Display

Bridge

Connectivity

Peripherals

LVDS display bridge is used to connect the IPU (image processing unit) to

external LVDS display interface. LDB supports two channels; each channel

has following signals:

• 1 clock pair

• 4 data pairs

On-chip differential drivers are provided for each pair.

OWIRE One-Wire

Interface

Connectivity

Peripherals

One-wire support provided for interfacing with an on-board EEPROM, and

smart battery interfaces, for example, Dallas DS2502.

PATA Parallel ATA Connectivity

Peripherals

The PATA block is a AT attachment host interface. Its main use is to interface

with hard disk drives and optical disc drives. It interfaces with the ATA-6

compliant device over a number of ATA signals. It is possible to connect a

bus buffer between the host side and the device side.

PWM-1

PWM-2

Pulse Width

Modulation

Connectivity

Peripherals

The pulse-width modulator (PWM) has a 16-bit counter and is optimized to

generate sound from stored sample audio images. It can also generate

tones. The PWM uses 16-bit resolution and a 4 x 16 data FIFO to generate

sound.

INTRAM Internal RAM Internal

Memory

Internal RAM, shared with VPU.

The on-chip memory controller (OCRAM) module, is an interface between

the system’s AXI bus, to the internal (on-chip) SRAM memory module. It is

used for controlling the 128 KB multimedia RAM, through a 64-bit AXI bus.

BOOTROM Boot ROM Internal

Memory

Supports secure and regular boot modes.

The ROM controller supports ROM patching.

Table 2. i.MX53xD Digital and Analog Blocks (continued)

Block

Mnemonic Block Name Subsystem Brief Description

Modules List

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 13

RTIC Run-Time

Integrity Checker

Security Protecting read only data from modification is one of the basic elements in

trusted platforms. The run-time integrity checker, version 3 (RTIC) block is

a data-monitoring device responsible for ensuring that the memory content

is not corrupted during program execution. The RTIC mechanism

periodically checks the integrity of code or data sections during normal OS

run-time execution without interfering with normal operation. The purpose

of the RTIC is to ensure the integrity of the peripheral memory contents,

protect against unauthorized external memory elements replacement and

assist with boot authentication.

SAHARA SAHARA

Security

Accelerator

Security SAHARA (symmetric/asymmetric hashing and random accelerator),

version 4, is a security coprocessor. It implements symmetric encryption

algorithms, (AES, DES, 3DES, RC4 and C2), public key algorithms (RSA

and ECC), hashing algorithms (MD5, SHA-1, SHA-224 and SHA-256), and

a hardware true random number generator. It has a slave IP Bus interface

for the host to write configuration and command information, and to read

status information. It also has a DMA controller, with an AHB bus interface,

to reduce the burden on the host to move the required data to and from

memory.

SATA Serial ATA Connectivity

Peripherals

SATA HDD interface, includes the SATA controller and the PHY. It is a

complete mixed-signal IP solution for SATA HDD connectivity.

SCCv2 Security

Controller, ver. 2

Security The security controller is a security assurance hardware module designed

to safely hold sensitive data, such as encryption keys, digital right

management (DRM) keys, passwords and biometrics reference data. The

SCCv2 monitors the system’s alert signal to determine if the data paths to

and from it are secure, that is, it cannot be accessed from outside of the

defined security perimeter. If not, it erases all sensitive data on its internal

RAM. The SCCv2 also features a key encryption module (KEM) that allows

non-volatile (external memory) storage of any sensitive data that is

temporarily not in use. The KEM utilizes a device-specific hidden secret key

and a symmetric cryptographic algorithm to transform the sensitive data

into encrypted data.

SDMA Smart Direct

Memory Access

System

Control

Peripherals

The SDMA is multi-channel flexible DMA engine. It helps in maximizing

system performance by off loading various cores in dynamic data routing.

The SDMA features list is as follows:

• Powered by a 16-bit instruction-set micro-RISC engine

• Multi-channel DMA supports up to 32 time-division multiplexed DMA

channels

• 48 events with total flexibility to trigger any combination of channels

• Memory accesses including linear, FIFO, and 2D addressing

• Shared peripherals between ARM and SDMA

• Very fast context-switching with two-level priority-based preemptive

multi-tasking

• DMA units with auto-flush and prefetch capability

• Flexible address management for DMA transfers (increment, decrement,

and no address changes on source and destination address)

• DMA ports can handle unidirectional and bidirectional flows (copy mode)

• Up to 8-word buffer for configurable burst transfers to / from the EXTMC

• Support of byte swapping and CRC calculations

• A library of scripts and API is available

Table 2. i.MX53xD Digital and Analog Blocks (continued)

Block

Mnemonic Block Name Subsystem Brief Description

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

14 Freescale Semiconductor

Modules List

SECRAM Secure /

Non-secure RAM

Internal

Memory

Secure / non-secure Internal RAM, controlled by SCC.

SJC Secure JTAG

Interface

System

Control

Peripherals

JTAG manipulation is a known hacker’s method of executing unauthorized

program code, getting control over secure applications, and running code in

privileged modes. The JTAG port provides a debug access to several

hardware blocks including the ARM processor and the system bus.

The JTAG port must be accessible during platform initial laboratory

bring-up, manufacturing tests and troubleshooting, as well as for software

debugging by authorized entities. However, in order to properly secure the

system, unauthorized JTAG usage should be strictly forbidden.

In order to prevent JTAG manipulation while allowing access for

manufacturing tests and software debugging, the i.MX53xD processor

incorporates a mechanism for regulating JTAG access. SJC provides four

different JTAG security modes that can be selected through an e-fuse

configuration.

SPBA Shared

Peripheral Bus

Arbiter

System

Control

Peripherals

SPBA (shared peripheral bus arbiter) is a two-to-one IP bus interface (IP

bus) arbiter.

SPDIF Sony Philips

Digital Interface

Multimedia

Peripherals

A standard digital audio transmission protocol developed jointly by the Sony

and Philips corporations. Both transmitter and receiver functionalists are

supported.

SRTC Secure Real

Time Clock

Security The SRTC incorporates a special system state retention register (SSRR)

that stores system parameters during system shutdown modes. This

NVCC_SRTC_POW. The NVCC_SRTC_POW can be energized

separately even if all other supply rails are shut down. This register is helpful

for storing warm boot parameters. The SSRR also stores the system

security state. In case of a security violation, the SSRR mark the event

(security violation indication).

SSI-1

SSI-2

SSI-3

I2S/SSI/AC97

Interface

Connectivity

Peripherals

The SSI is a full-duplex synchronous interface used on the i.MX53xDA

processor to provide connectivity with off-chip audio peripherals. The SSI

interfaces connect internally to the AUDMUX for mapping to external ports.

The SSI supports a wide variety of protocols (SSI normal, SSI network, I2S,

and AC-97), bit depths (up to 24 bits per word), and clock/frame sync

options.

Each SSI has two pairs of 8 x 24 FIFOs and hardware support for an

external DMA controller in order to minimize its impact on system

performance. The second pair of FIFOs provides hardware interleaving of

a second audio stream, which reduces CPU overhead in use cases where

two time slots are being used simultaneously.

Table 2. i.MX53xD Digital and Analog Blocks (continued)

Block

Mnemonic Block Name Subsystem Brief Description

Modules List

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 15

IPTP IEEE1588

Precision Time

Protocol

Connectivity

Peripherals

The IEEE 1588-2002 (version 1) standard defines a precision time protocol

(PTP) - which is a time-transfer protocol that enables synchronization of

networks (for example, Ethernet), to a high degree of accuracy and

precision.

The IEEE1588 hardware assist is composed of the two blocks: time stamp

unit and real time clock, which provide the timestamping protocol’s

functionality, generating and reading the needed timestamps.

The hardware-assisted implementation delivers more precise clock

synchronization at significantly lower CPU load compared to purely

software implementations.

Temperature

Monitor

(Part of SATA

Block)

System

Control

Peripherals

The temperature sensor is an internal module to the i.MX53xD that

monitors the die temperature. The monitor is capable in generating SW

interrupt, or trigger the CCM, to reduce the core operating frequency.

TVE TV Encoder Multimedia The TV encoder, version 2.1 is implemented in conjunction with the image

processing unit (IPU) allowing handheld devices to display captured still

images and video directly on a TV or LCD projector. It supports composite

PAL/NTSC, VGA, S-video, and component up to HD1080p analog video

outputs.

TZIC TrustZone Aware

Interrupt

Controller

ARM/Control The TrustZone interrupt controller (TZIC) collects interrupt requests from all

i.MX53xD sources and routes them to the ARM core. Each interrupt can be

configured as a normal or a secure interrupt. Software Force Registers and

software Priority Masking are also supported.

UART-1

UART-2

UART-3

UART-4

UART-5

UART Interface Connectivity

Peripherals

Each of the UART blocks supports the following serial data transmit/receive

protocols and configurations:

• 7 or 8-bit data words, 1 or 2 stop bits, programmable parity (even, odd,

or none)

• Programmable bit-rates up to 4 Mbps. This is a higher max baud rate

relative to the 1.875 Mbps, which is specified by the TIA/EIA-232-F

standard.

• 32-byte FIFO on Tx and 32 half-word FIFO on Rx supporting auto-baud

• IrDA 1.0 support (up to SIR speed of 115200 bps)

• Option to operate as 8-pins full UART, DCE, or DTE

USB USB Controller Connectivity

Peripherals

USB supports USB2.0 480 MHz, and contains:

• One high-speed OTG sub-block with integrated HS USB PHY

• One high-speed host sub-block with integrated HS USB PHY

• Two identical high-speed Host modules

The high-speed OTG module, which is internally connected to the HS USB

PHY, is equipped with transceiver-less logic to enable on-board USB

connectivity without USB transceivers

All the USB ports are equipped with standard digital interfaces (ULPI, HS

IC-USB) and transceiver-less logic to enable onboard USB connectivity

without USB transceivers.

Table 2. i.MX53xD Digital and Analog Blocks (continued)

Block

Mnemonic Block Name Subsystem Brief Description

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

16 Freescale Semiconductor

Modules List

VPU Video Processing

Unit

Multimedia

Peripherals

A high-performing video processing unit (VPU) version 3, which covers

many SD-level video decoders and SD-level encoders as a multi-standard

video codec engine as well as several important video processing such as

rotation and mirroring.

VPU Features:

• MPEG-2 decode, Mail-High profile, up to 1080i/p resolution, 40 Mbps bit

rate

• MPEG4/XviD decode, SP/ASP profile, up to 1080 i/p resolution, 40 Mbps

bit rate

• H.263 decode, P0/P3 profile, up to 16CIF resolution, 20 Mbps bit rate

• H.264 decode, BP/MP/HP profile, up to 1080 i/p resolution, 40 Mbps bit

rate

• VC1 decode, SP/MP/AP profile, up to 1080 i/p resolution, 40 Mbps bit

rate

• RV10 decode, 8/9/2010 profile, up to 1080 i/p resolution, 40 Mbps bit rate

• DivX decode, 3/4/5/6 profile, up to 1080 i/p resolution, 40 Mbps bit rate

• MJPEG decode, Baseline profile, up to 8192 x 8192 resolution,

40 Mpixel/s bit rate for 4:4:4 format

•MPEG2

1 encode, Main-Main profile, up to D1 resolution, 15 Mbps bit

rate

• MPEG4 encode, Simple profile, up to 720p resolution, 12 Mbps bit rate2

• H.263 encode, P0/P3 profile, up to 4CIF resolution, 8 Mbps bit rate2

• H.264 encode, Baseline profile, up to 720p resolution, 14 Mbps bit rate2

• MJPEG encode, Baseline profile, up to 8192 x 8192 resolution,

80 Mpixel/s bit rate for 4:2:2 format

WDOG-1 Watch Dog Timer

Peripherals

The watch dog timer supports two comparison points during each counting

period. Each of the comparison points is configurable to evoke an interrupt

to the ARM core, and a second point evokes an external event on the

WDOG line.

WDOG-2

(TZ)

Watch Dog

(TrustZone)

Timer

Peripherals

The TrustZone watchdog (TZ WDOG) timer module protects against

TrustZone starvation by providing a method of escaping normal mode and

forcing a switch to the TZ mode. TZ starvation is a situation where the

normal OS prevents switching to the TZ mode. This situation should be

avoided, as it can compromise the system’s security. Once the TZ WDOG

module is activated, it must be serviced by TZ software on a periodic basis.

If servicing does not take place, the timer times out. Upon a time-out, the

TZ WDOG asserts a TZ mapped interrupt that forces switching to the TZ

mode. If it is still not served, the TZ WDOG asserts a security violation

signal to the CSU. The TZ WDOG module cannot be programmed or

deactivated by a normal mode SW.

XTALOSC 24 MHz Crystal

Oscillator

Clocking Provides a crystal oscillator amplifier that supports a 24-MHz external

crystal

XTALOSC_

32K

32.768 kHz

Crystal Oscillator

I/F

Clocking Provides a crystal oscillator amplifier that supports a 32.768-kHz external

crystal.

1Video partially performed in hardware accelerator (70%) and partially in software.

2VPU can generate higher bit rate than the maximum specified by the corresponding standard.

Table 2. i.MX53xD Digital and Analog Blocks (continued)

Block

Mnemonic Block Name Subsystem Brief Description

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 17

3.1 Special Signal Considerations

The package contact assignments can be found in Section 6, “Package Information and Contact

Assignments.” Signal descriptions are defined in the i.MX53 Reference Manual. Special signal

considerations information is contained in Chapter 1 of i.MX53 System Development User's Guide

(MX53UG).

4 Electrical Characteristics

This section provides the device and module-level electrical characteristics for the i.MX53xD processor.

4.1 Chip-Level Conditions

This section provides the device-level electrical characteristics for the IC. See Table 3 for a quick reference

to the individual tables and sections.

4.1.1 Absolute Maximum Ratings

CAUTION

Stresses beyond those listed under Table 4 may affect reliability or cause

permanent damage to the device. These are stress ratings only. Functional

operation of the device at these or any other conditions beyond those

indicated in the Operating Ranges table is not implied.

Table 3. i.MX53xD Chip-Level Conditions

For these characteristics, … Topic appears …

Absolute Maximum Ratings Table 4 on page 17

TEPBGA-2 Package Thermal Resistance Data Table 5 on page 18

i.MX53xD Operating Ranges Table 7 on page 20

External Clock Sources Table 8 on page 22

Maximal Supply Currents Table 9 on page 23

USB Interface Current Consumption Table 10 on page 25

Table 4. Absolute Maximum Ratings

Parameter Description Symbol Min Max Unit

Peripheral Core Supply Voltage VCC -0.3 1.35 V

ARM Core Supply Voltage VDDGP -0.3 1.4 V

Supply Voltage UHVIO Supplies denoted as I/O Supply -0.5 3.6 V

Supply Voltage for non UHVIO Supplies denoted as I/O Supply -0.5 3.3 V

USB VBUS VBUS — 5.25 V

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

18 Freescale Semiconductor

Electrical Characteristics

4.1.2 Thermal Resistance

4.1.2.1 TEPBGA-2 Package Thermal Resistance

Table 5 provides the TEPBGA-2 package thermal resistance data.

Input voltage on USB_OTG_DP, USB_OTG_DN,

USB_H1_DP, USB_H1_DN pins

USB_DP/USB_DN -0.3 3.631V

Input/Output Voltage Range Vin/Vout -0.5 OVDD +0.32V

ESD Damage Immunity: Vesd V

• Human Body Model (HBM)

• Charge Device Model (CDM)

—

2000

500

Storage Temperature Range TSTORAGE -40 150 oC

1USB_DN and USB_DP can tolerate 5 V for up to 24 hours.

2The term OVDD in this section refers to the associated supply rail of an input or output. The association is described in

Table 112 on page 151. The maximum range can be superseded by the DC tables.

Table 5. TEPBGA-2 Package Thermal Resistance Data

Rating Board Symbol Value Unit

Junction to Ambient (natural convection)1, 2

1Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal

resistance.

2Per JEDEC JESD51-2 with the single layer board horizontal. Board meets JESD51-9 specification.

Single layer board

(1s)

RθJA 28 °C/W

Junction to Ambient (natural convection)1, 2, 3

3Per JEDEC JESD51-6 with the board horizontal.

Four layer board

(2s2p)

RθJA 16 °C/W

Junction to Ambient (at 200 ft/min)1, 3 Single layer board

(1s)

RθJMA 21 °C/W

Junction to Ambient (at 200 ft/min)1, 3 Four layer board

(2s2p)

RθJMA 13 °C/W

Junction to Board4

4Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on

the top surface of the board near the package.

—R

θJB 6°C/W

Junction to Case5

5Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method

1012.1).

—R

θJC 4°C/W

Junction to Package Top (natural convection)6

6Thermal characterization parameter indicating the temperature difference between package top and the junction temperature

per JEDEC JESD51-2.

—ΨJT 4°C/W

Table 4. Absolute Maximum Ratings (continued)

Parameter Description Symbol Min Max Unit

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 19

4.1.2.2 PoP Package Thermal Resistance

Table 6 provides the PoP package thermal resistance data.

Table 6. PoP Package Thermal Resistance Data1

1Calculated for just the i.MX53xD package, without the top mounted memory package.

Rating Board Symbol As

designed

Center

Array of

Pillars

used for

Ground

Unit

Junction to Ambient (natural convection)2, 3

2Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site

(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board

thermal resistance.

3Per JEDEC JESD51-2 with the single layer board horizontal. Board meets JESD51-9 specification.

Single layer board

(1s)

RθJA 45 45 °C/W

Junction to Ambient (natural convection)2, 3, 4

4Per JEDEC JESD51-6 with the board horizontal.

Four layer board

(2s2p)

RθJA 23 22 °C/W

Junction to Ambient (at 200 ft/min)2, 4 Single layer board

(1s)

RθJMA 36 35 °C/W

Junction to Ambient (at 200 ft/min)2, 4 Four layer board

(2s2p)

RθJMA 19 18 °C/W

Junction to Board5

5Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured

on the top surface of the board near the package.

—R

θJB 8.4 7.2 °C/W

Junction to Case6

6Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883

Method 1012.1).

—R

θJC <0.1 <0.1 °C/W

Junction to Package Top (natural convection)7

7Thermal characterization parameter indicating the temperature difference between package top and the junction

temperature per JEDEC JESD51-2.

—ΨJT 22°C/W

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

20 Freescale Semiconductor

Electrical Characteristics

4.1.3 Operating Ranges

Table 7 provides the operating ranges of i.MX53xD processor.

Table 7. i.MX53xD Operating Ranges

Symbol Parameter Minimum1Nominal2Maximum1Unit

VDDGP3

ARM core supply voltage

fARM ≤167 MHz

0.85 0.9 0.95 V

ARM core supply voltage

fARM ≤400 MHz

0.9 0.95 1.05 V

ARM core supply voltage

fARM ≤800 MHz

1.05 1.1 1.15 V

ARM core supply voltage

fARM ≤1000 MHz

1.2 1.25 1.3 V

ARM core supply voltage

fARM ≤1200 MHz4

1.30 1.35 1.40 V

ARM core supply voltage

Stop mode

0.8 0.85 1.3 V

VCC Peripheral supply voltage51.25 1.3 1.35 V

Peripheral supply voltage—Stop mode 0.9 0.95 1.35 V

VDDA6Memory arrays voltage 1.25 1.30 1.35 V

Memory arrays voltage—Stop mode 0.9 0.95 1.35 V

VDDAL16L1 Cache Memory arrays voltage 1.25 1.30 1.35 V

L1 Cache Memory arrays voltage—Stop mode 0.9 0.95 1.35 V

VDD_DIG_PLL7PLL Digital supplies—external regulator option 1.25 1.3 1.35 V

VDD_ANA_PLL8PLL Analog supplies—external regulator option 1.75 1.8 1.95 V

NVCC_CKIH ESD protection of the CKIH pins, FUSE read Supply

and 1.8V bias for the UHVIO pads

1.65 1.8 1.95 V

NVCC_LCD

NVCC_JTAG

GPIO digital power supplies 1.65 1.8 or

2.775

3.1 V

NVCC_LVDS LVDS interface Supply 2.25 2.5 2.75 V

NVCC_LVDS_BG LVDS Band Gap Supply 2.25 2.5 2.75 V

NVCC_EMI_DRAM DDR Supply DDR2 range 1.7 1.8 1.9 V

DDR Supply LPDDR2 range 1.14 1.2 1.3

DDR Supply LV-DDR2 range

1.47 1.55 1.63

1.42 1.5 1.58

DDR Supply DDR3 range 1.42 1.5 1.58

VDD_FUSE9Fusebox Program Supply (Write Only) 3.0 — 3.3 V

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 21

NVCC_NANDF

NVCC_SD1

NVCC_SD2

NVCC_PATA

NVCC_KEYPAD

NVCC_GPIO

NVCC_FEC

NVCC_EIM_MAIN

NVCC_EIM_SEC

NVCC_CSI

Ultra High voltage I/O (UHVIO) supplies: V

• UHVIO_L 1.65 1.8 1.95

• UHVIO_H 2.5 2.775 3.1

• UHVIO_UH 3.0 3.3 3.6

TVDAC_DHVDD10

TVDAC_AHVDDRGB10

TVE digital and analog power supply, TVE-to-DAC

level shifter supply, cable detector supply, analog

power supply to RGB channel

2.69 2.75 2.91 V

For GPIO use only, when TVE is not in use 1.65 1.8 or

2.775

3.1 V

NVCC_SRTC_POW SRTC Core and slow I/O Supply (GPIO)11 1.25 1.3 1.35 V

NVCC_RESET LVIO 1.65 1.8 or

2.775

3.1 V

USB_H1_VDDA25

USB_OTG_VDDA25

NVCC_XTAL

USB_PHY analog supply, oscillator amplifier analog

supply12

2.25 2.5 2.75 V

USB_H1_VDDA33

USB_OTG_VDDA33

USB PHY I/O analog supply 3.0 3.3 3.6 V

VBUS See Ta b l e 4 on page 17 and Ta bl e 1 0 5 on page 143

for details. Note that this is not a power supply.

————

VDD_REG13 Power supply input for the integrated linear

regulators

2.37 2.5 2.63 V

VP SATA PHY core power supply 1.25 1.3 1.35 V

VPH SATA PHY I/O supply voltage 2.25 2.5 2.75 V

Tj Junction temperature -20 9514 105 oC

1Voltage at the package power supply contact must be maintained between the minimum and maximum voltages. The design

must allow for supply tolerances and system voltage drops.

2The nominal values for the supplies indicate the target setpoint for a tolerance no tighter than ± 50 mV. Use of supplies with

a tighter tolerance allows reduction of the setpoint with commensurate power savings.

3A voltage transition is allowed for the required supply ramp up to the nominal value prior to achieving a clock speed increase.

Similarly, to accommodate a frequency reduction, a voltage transition is allowed for a supply ramp down to the nominal value

after the frequency is decreased.

4Only part number MCIMX535DVV2C supports frequency up to 1200 MHz.

5For BSDL mode, the minimum operating temperature is 20 oC and the maximum operating temperature is the maximum

temperature specified for the particular part grade.

6VDDA and VDDAL1 can be driven by the VDD_DIG_PLL internal regulator using external connections. When operating in this

configuration, the regulator is still operating at the default 1.2 V, as bootup start. During bootup initialization, software should

increase this regulator voltage to match VCC (1.3 V nominal) in order to reduce internal leakage current.

Table 7. i.MX53xD Operating Ranges (continued)

Symbol Parameter Minimum1Nominal2Maximum1Unit

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

22 Freescale Semiconductor

Electrical Characteristics

4.1.4 External Clock Sources

The i.MX53xD device has four external input system clocks, a low frequency (CKIL), a high frequency

(XTAL), and two general purpose CKIH1 and CKIH2 clocks.

The CKIL is used for low-frequency functions. It supplies the clock for wake-up circuit, power-down real

time clock operation, and slow system and watch-dog counters. The clock input can be connected to either

external oscillator or a crystal using internal oscillator amplifier.

The system clock input XTAL is used to generate the main system clock. It supplies the PLLs and other

peripherals. The system clock input can be connected to either external oscillator or a crystal using internal

oscillator amplifier.

CKIH1 and CKIH2 provide additional clock source option for peripherals that require specific and

accurate frequencies.

Table 8 shows the interface frequency requirements. See Chapter 1 of i.MX53 System Development

User's Guide (MX53UG) for additional clock and oscillator information.

7By default, VDD_DIG_PLL is driven from internal on-die 1.2 V linear regulator (LDO). In this case, there is no need driving this

supply externally. LDO output to VDD_DIG_PLL should be configured by software after power-up to 1.3 V output. A bypass

capacitor of minimal value 22 μF should be connected to this pad in any case whether it is driven internally or externally. Use

of the on-chip LDO is preferred. See i.MX53 System Development User’s Guide.

8By default, the VDD_ANA_PLL is driven from internal on-die 1.8 V linear regulator (LDO). In this case there is no need driving

this supply externally. A bypass capacitor of minimal value 22 μF should be connected to this pad in any case whether it is

driven internally or externally. Use of the on-chip LDO is preferred. See i.MX53 System Development User’s Guide.

9After fuses are programmed, Freescale strongly recommends the best practice of reading the fuses to verify that they are

written correctly. In Read mode, VDD_FUSE should be floated or grounded. Tying VDD_FUSE to a positive supply (3.0 V–3.3

V) increases the possibility of inadvertently blowing fuses and is not recommended in read mode.

10 If not using TVE module or other pads in this power domain for the product, the TVDAC_DHVDD and TVDAC_AHVDDRGB

can remain floating.

11 GPIO pad operational at low frequency

12 The analog supplies should be isolated in the application design. Use of series inductors is recommended.

13 VDD_REG is power supply input for the integrated linear regulators of VDD_ANA_PLL and VDD_DIG_PLL when they are

configured to the internal supply option. VDDR_REG still has to be tied to 2.5 V supply when VDD_ANA_PLL and

VDD_DIG_PLL are configured for external power supply mode although in this case it is not used as supply source.

14 For part number MCIMX535DVV1C, lifetime of 21,900 hours based on 95 oC junction temperature and nominal supply

voltages. For part number MCIMX535DVV2C, lifetime of 4,380 hours at 1.2 GHz frequency and lifetime of 17,520 hours at 1

GHz frequency, based on 95 oC junction temperature and nominal supply voltages.

Table 8. External Input Clock Frequency

Parameter Description Symbol Min Typ Max Unit

CKIL Oscillator1

1External oscillator or a crystal with internal oscillator amplifier.

fckil — 32.7682/32.0

2Recommended nominal frequency 32.768 kHz.

—kHz

CKIH1, CKIH2 Operating

Frequency

fckih1,

fckih2

See Table 33, "CAMP Electrical Parameters (CKIH1,

CKIH2)," on page 46

MHz

XTAL Oscillator fxtal 22 24 27 MHz

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 23

4.1.5 Maximal Supply Currents

Table 9 represents the maximal momentary current transients on power lines, and should be used for power

supply selection. Maximal currents higher by far than the average power consumption of typical use cases.

For typical power consumption information, refer to i.MX53xD power consumption application note.

Table 9. Maximal Supply Currents

Power Line Conditions Max Current Unit

VDDGP

1000 MHz ARM clock

at 1.27V, 105 oC

1700 mA

1200 MHz ARM clock

at 1.37V, 125 oC

2200 mA

VCC 800 mA

VDDA+VDDAL1 100 mA

VDD_DIG_PLL 10 mA

VP 20 mA

VDD_ANA_PLL 10 mA

MVCC_XTAL 25 mA

VDD_REG 325 mA

VDD_FUSE Fuse Write Mode

operation

120 mA

NVCC_EMI_DRAM

1.8V (DDR2) 800 mA

1.5V (DDR3) 650 mA

1.2V (LPDDR2) 250 mA

TVDAC_DHVDD + TVDAC_AHVDDRGB 200 mA

NVCC_SRTC_POW <1 mA

USB_H1_VDDA25 +

USB_OTG_VDDA25

50 mA

USB_H1_VDDA33 +

USB_OTG_VDDA33

20 mA

VPH 60 mA

NVCC_CKIH Use maximal I/O Eq1, N=4

NVCC_CSI Use maximal I/O Eq1, N=20

NVCC_EIM_MAIN Use maximal I/O Eq1, N=39

NVCC_EIM_SEC Use maximal I/O Eq1, N=16

NVCC_EMI_DRAM Use maximal I/O Eq1, N=78

NVCC_FEC Use maximal I/O Eq1, N=11

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

24 Freescale Semiconductor

Electrical Characteristics

NVCC_GPIO Use maximal I/O Eq1, N=13

NVCC_JTAG Use maximal I/O Eq1, N=6

NVCC_KPAD Use maximal I/O Eq1, N=11

NVCC_LCD Use maximal I/O Eq1, N=29

NVCC_LVDS Use maximal I/O Eq1, N=20

NVCC_LVDS_BG Use maximal I/O Eq1, N=1

NVCC_NANDF Use maximal I/O Eq1, N=8

NVCC_PATA Use maximal I/O Eq1, N=29

NVCC_REST Use maximal I/O Eq1, N=5

NVCC_SD1 Use maximal I/O Eq1, N=6

NVCC_SD2 Use maximal I/O Eq1, N=6

NVCC_XTAL Use maximal I/O Eq1, N=2

1General Equation for estimated, maximal power consumption of an I/O power supply:

Imax = N x C x V x (0.5 x F)

Where:

N - Number of I/O pins supplies by the power line

C - Equivalent external capacitive load

V - I/O voltage

(0.5 x F) - Data change rate. Up to 0.5 of the clock rate (F).

Table 9. Maximal Supply Currents (continued)

Power Line Conditions Max Current Unit

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 25

4.1.6 USB-OH-3 (OTG + 3 Host ports) Module and the Two USB PHY (OTG

and H1) Current Consumption

Table 10 shows the USB interface current consumption.

4.2 Power Supply Requirements and Restrictions

The system design must comply with power-up sequence, power-down sequence and steady state

guidelines as described in this section to guarantee the reliable operation of the device. Any deviation from

these sequences may result in the following situations:

• Excessive current during power-up phase

• Prevention of the device from booting

• Irreversible damage to the i.MX53xD processor (worst-case scenario)

4.2.1 Power-Up Sequence

The following observations should be considered:

•The consequent steps in power up sequence should not start before the previous step supplies have

been stabilized within 90-110% of their nominal voltage, unless stated otherwise.

•NVCC_SRTC_POW should remain powered ON continuously, to maintain internal real-time

clock status. Otherwise, it has to be powered ON together with VCC, or preceding VCC.

•The VCC should be powered ON together, or any time after NVCC_SRTC_POW.

•NVCC_CKIH should be powered ON after VCC is stable and before other I/O supplies

(NVCC_xxx) are powered ON.

Table 10. USB Interface Current Consumption

Parameter Conditions Typical at 25 °C Max Unit

Analog Supply 3.3 V

USB_H1_VDDA33

USB_OTG_VDDA33

Full Speed

RX 5.5 6 mA

TX 7 8

High Speed

RX 5 6

TX 5 6

Analog Supply 2.5 V

USB_H1_VDDA25

USB_OTG_VDDA25

Full Speed

RX 6.5 7 mA

TX 6.5 7

High Speed

RX 12 13

TX 21 22

Digital Supply

VCC (1.2 V)

Full Speed

RX 8 — mA

TX 8 —

High Speed

RX 8 —

TX 8 —

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

26 Freescale Semiconductor

Electrical Characteristics

•I/O Supplies (NVCC_xxx) below or equal to 2.8 V nom./3.1 V max. should not precede

NVCC_CKIH. They can start powering ON during NVCC_CKIH ramp-up, before it is

stabilized. Within this group, the supplies can be powered-up in any order.

Alternatively, the on-chip regulator VDD_ANA_PLL may be used to power NVCC_CKIH and

NVCC_RESET. In this case, the sequence defined in the “Interfacing the i.MX53 Processor

with LTC3589-1” section of the i.MX53 System Development User's Guide (MX53UG) must be

followed.

•I/O Supplies (NVCC_xxx) above 2.8 V nom./3.1 V max. should be powered ON only after

NVCC_CKIH is stable.

•In case VDD_DIG_PLL and VDD_ANA_PLL are powered ON from internal voltage regulator

(default case for i.MX53xD), there are no related restrictions on VDD_REG, as it is used as their

internal regulators power source.

If VDD_DIG_PLL and VDD_ANA_PLL are powered on externally, to reduce current leakage

during the power-up, it is recommended to activate the VDD_REG before or at the same time

with VDD_DIG_PLL and VDD_ANA_PLL. If this sequencing is not possible, make sure that

the 2.5 V VDD_REG supply shut-off output impedance is higher than 1 kΩ when it is inactive.

•VDD_REG supply is required to be powered ON to enable DDR operation. It must be powered

on after VCC and before NVCC_EMI_DRAM. The sequence should be:

VCC →VDD_REG →NVCC_EMI_DRAM

•NVCC_EIM_DRAM_2P5 PoP additional power line timing is the same as DVV_REG

•VDDA and VDDAL1 can be powered ON anytime before POR_B, regardless of any other power

signal.

•VDDGP can be powered ON anytime before POR_B, regardless of any other power signal.

•VP and VPH can be powered up together, or anytime after, the VCC. VP and VPH should come

before POR.

•TVDAC_DHVDD and TVDAC_AHVDDRGB should be powered from the same regulator. This

is due to ESD diode protection circuit, that may cause current leakage if one of the supplies is

powered ON before the other.

NOTE

The POR_B input must be immediately asserted at power-up and remain

asserted until after the last power rail reaches its working voltage.

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 27

Figure 2 shows the power-up sequence diagram.

Figure 2. Power-Up Detailed Sequence

1If fuse writing is required, VDD_FUSE should be powered ON after NVCC_CKIH is stable.

NOTE

Need to ensure that there is no back voltage (leakage) from any supply on

the board towards the 3.3 V supply (for example, from the parts that use

both 1.8 V and the 3.3 V supply).

NOTE

For further details on power-up sequence, see the “Setting up Power

Management” chapter of i.MX53 System Development User’s Guide

(MX53UG).

NVCC_CKIH

(in any order, after NVCC_CKIH

POR_B

Δt>0

VCC 90%

90%

(in any order, if needed)

Δt>0

90%

NVCC_SRTC_POW

(may remain ON) 90%

I/O Supplies below or equal to

I/O Supplies above 2.8 V nom./3.1 V max

2.8 V nom./3.1 V max.

90%

Δt>0

90%

Δt>0

VDD_REG

NVCC_EMI_DRAM

Δt>0

(in any order)

VP, VPH

Δt>0

90%

ramp up start, if needed)

(in any order)

VDDA,VDDAL1,VDDGP

Δt>0

90%

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

28 Freescale Semiconductor

Electrical Characteristics

4.2.2 Power-Down Sequence

Power-down sequence should follow one of the following two options:

• Option 1: Switch all supplies down simultaneously with further free discharge. A deviation of few

microseconds of actual power-down of the different power rails is acceptable.

• Option 2: Switch down supplies, in any order, keeping the following rules:

— NVCC_CKIH must be powered down at the same time or after the UHVIO I/O cell supplies

(for full supply list, refer to Table 7, Ultra High voltage I/O (UHVIO) supplies). A deviation of

few microseconds of actual power-down of the different power rails is acceptable.

— VDD_REG must be powered down at the same time or after NVCC_EMI_DRAM supply. A

deviation of few microseconds of actual power-down of the different power rails is acceptable.

— If all of the following conditions are met:

– VDD_REG is powered down to 0V (Not Hi-Z)

– VDD_DIG_PLL and VDD_ANA_PLL are provided externally,

– VDD_REG is powered down before VDD_DIG_PLL and VDD_ANA_PLL

Then the following rule should be kept: VDD_REG output impedance must be higher than 1

kW, when inactive.

4.2.3 Power Supplies Usage

• All I/O pins should not be externally driven while the I/O power supply for the pin (NVCC_xxx)

is off. This can cause internal latch-up and malfunctions due to reverse current flows. For

information about I/O power supply of each pin refer to “Power Rail” columns in pin list tables of

Section 6, “Package Information and Contact Assignments.”

• If not using SATA interface and the embedded thermal sensor, the VP and VPH should be

grounded. In particular, keeping VPH turned OFF while the VP is powered ON is not

recommended and might lead to excessive power consumption.

• When internal clock source is used for SATA temperature monitor the USB_PHY supplies and

PLL need to be active because they are providing the clock.

• If not using TVE the module, the TVDAC_DHVDD and TVDAC_AHVDDRGB can remain

floating. If only the GPIO pads in TVDAC_AHVDDRGB domain are in use, the supplies can be

set to GPIO pad voltage range (1.65 V to 3.1 V).

4.3 I/O DC Parameters

This section includes the DC parameters of the following I/O types:

• General Purpose I/O (GPIO)

• Double Data Rate 3 I/O (DDR3) for DDR2/LVDDR2, LPDDR2 and DDR3 modes

• Low Voltage I/O (LVIO)

• Ultra High Voltage I/O (UHVIO)

•LVDS I/O

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 29

NOTE

The term ‘OVDD’ in this section refers to the associated supply rail of an

input or output. The association is shown in Table 112.

Figure 3. Circuit for Parameters Voh and Vol for I/O Cells

4.3.1 General Purpose I/O (GPIO) DC Parameters

The parameters in Table 11 are guaranteed per the operating ranges in Table 7, unless otherwise noted.

Table 11 shows DC parameters for GPIO pads, operating at two supply ranges:

• 1.1 V to 1.3 V

• 1.65 V to 3.1 V

Table 11. GPIO I/O DC Electrical Characteristics

Parameter Symbol Test Conditions Min Typ Max Unit

High-level output voltage1Voh Iout = -0.8 mA OVDD - 0.15 — — V

Low-level output voltage1Vol Iout = 0.8 mA — — 0.15 V

High-Level DC input voltage1, 2VIH — 0.7 ×OVDD — OVDD V

Low-Level DC input voltage1, 2VIL — 0 — 0.3 ×OVDD V

Input Hysteresis VHYS OVDD = 1.875 V

OVDD = 2.775 V

0.25 0.34

0.45

—V

Schmitt trigger VT+2, 3 VT+ — 0.5 ×OVDD — — V

Schmitt trigger VT-2, 3 VT- — — — 0.5 ×OVDD V

Input current (no pull-up/down) Iin Vin = OVDD or 0 — — 10 μA

Input current (22 kΩ Pull-up) Iin Vin = 0 V

Vin = OVDD

——161

μA

Input current (47 kΩ Pull-up) Iin Vin = 0 V

Vin = OVDD

——76

μA

Input current (100 kΩ Pull-up) Iin Vin = 0 V

Vin= OVDD

——40

μA

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

30 Freescale Semiconductor

Electrical Characteristics

4.3.2 LPDDR2 I/O DC Parameters

The LPDDR2 I/O pads support DDR2/LVDDR2, LPDDR2, and DDR3 operational modes.

4.3.2.1 DDR2 Mode I/O DC Parameters

The DDR2 interface fully complies with JESD79-2E DDR2 JEDEC standard release April, 2008. The

parameters in Table 12 are guaranteed per the operating ranges in Table 7, unless otherwise noted.

Input current (100 kΩ Pull-down) Iin Vin = 0 V

Vin = OVDD

——10

μA

Keeper Circuit Resistance — 1304—kΩ

1Overshoot and undershoot conditions (transitions above OVDD and below GND) on switching pads must be held below 0.6 V,

and the duration of the overshoot/undershoot must not exceed 10% of the system clock cycle. Overshoot/ undershoot must

be controlled through printed circuit board layout, transmission line impedance matching, signal line termination, or other

methods. Non-compliance to this specification may affect device reliability or cause permanent damage to the device.

2To maintain a valid level, the transition edge of the input must sustain a constant slew rate (monotonic) from the current DC

level through to the target DC level, VIL or VIH. Monotonic input transition time is from 0.1 ns to 1 s.

3Hysteresis of 250 mV is guaranteed over all operating conditions when hysteresis is enabled.

4Use an off-chip pull resistor of less than 60 kΩ to override this keeper.

Table 12. DDR2 I/O DC Electrical Parameters1

1Note that the JEDEC SSTL_18 specification (JESD8-15a) for a SSTL interface for class II operation supersedes any

specification in this document.

Parameters Symbol Test Conditions Min Typ Max Unit

High-level output voltage2

2OVDD is the I/O power supply (1.7 V–1.9 V for DDR2)

Voh Ioh = -0.1 mA 0.9 x OVDD — — V

Low-level output voltage Vol Iol = 0.1 mA — — 0.1 x OVDD V

Input Reference Voltage Vref 0.49 x OVDD 0.5 x OVDD 0.51 x OVDD

DC input High Voltage (data pins) Vihd

(dc)

— Vref+0.125V — OVDD+0.3 V

DC input Low Voltage (data pins) Vild (dc) — -0.3 — Vref - 0.125V V

DC Input voltage range of each

differential input3

3Vin(dc) specifies the allowable DC voltage exertion of each differential input.

Vin (dc) — -0.3 — OVDD + 0.3 V

DC Differential input voltage required for

switching 4

Vid (dc) — 0.25 — OVDD + 0.6 V

Termination Voltage Vtt Vtt Vref - 0.04 Vref Vref + 0.04 V

Input current (no pull-up/down) Iin Vin = 0 V

Vin = OVDD

—

μA

Keeper Circuit Resistance — — — 1305—kΩ

Table 11. GPIO I/O DC Electrical Characteristics (continued)

Parameter Symbol Test Conditions Min Typ Max Unit

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 31

4.3.2.2 LPDDR2 Mode I/O DC Parameters

The LPDDR2 interface fully complies with JESD209-2B LPDDR2 JEDEC standard release June, 2009.

The parameters in Table 13 are guaranteed per the operating ranges in Table 7, unless otherwise noted.

4.3.2.3 DDR3 Mode I/O DC Parameters

The DDR3 interface fully complies with JESD79-3D DDR3 JEDEC standard release April, 2008. The

parameters in Table 14 are guaranteed per the operating ranges in Table 7, unless otherwise noted.

4Vid(dc) specifies the input differential voltage |Vtr-Vcp| required for switching, where Vtr is the “true” input level and Vcp is the

“complementary” input level. The minimum value is equal to Vih(dc) -Vil(dc).

5Use an off-chip pull resistor of less than 60 kΩ to override this keeper.

Table 13. LPDDR2 I/O DC Electrical Parameters1

1Note that the JEDEC LPDDR2 specification (JESD209_2B) supersedes any specification in this document.

Parameters Symbol Test Conditions Min Typ Max Unit

High-level output voltage Voh Ioh = -0.1 mA 0.9 x OVDD — — V

Low-level output voltage Vol Iol = 0.1 mA — — 0.1 x OVDD V

Input Reference Voltage Vref 0.49 x OVDD 0.5 x OVDD 0.51 x OVDD

DC input High Voltage Vih(dc) — Vref+0.13V — OVDD V

DC input Low Voltage Vil(dc) — OVSS — Vref - 0.13V V

Differential Input Logic High Vih(diff) 0.26 See Note2

2The single-ended signals need to be within the respective limits (Vih(dc) max, Vil(dc) min) for single-ended signals as well as

the limitations for overshoot and undershoot.

Differential Input Logic Low Vil(diff) See Note2-0.26

Input current (no pull-up/down) Iin Vin = 0 V

Vin = OVDD

—

μA

Pull-up/Pull-down impedance Mismatch -15 +15 %

240 Ω unit calibration resolution 10 Ω

Keeper Circuit Resistance — — — 1403

3Use an off-chip pull resistor of less than 60 kΩ to override this keeper.

—kΩ

Table 14. DDR3 I/O DC Electrical Parameters

Parameters Symbol Test Conditions Min Typ Max Unit

High-level output voltage Voh Ioh = -0.1 mA 0.8 x OVDD1——V

Low-level output voltage Vol Iol = 0.1 mA — — 0.2 x OVDD V

DC input Logic High VIH(dc) — Vref2+0.1 — OVDD V

DC input Logic Low VIL(dc) — OVSS — Vref-0.1 V

Differential input Logic High VIH(diff) — 0.2 — See Note3V

Differential input Logic Low VIL(diff) — See Note3—-0.2V

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

32 Freescale Semiconductor

Electrical Characteristics

4.3.3 Low Voltage I/O (LVIO) DC Parameters

The parameters in Table 15 are guaranteed per the operating ranges in Table 7, unless otherwise noted.

The LVIO pads operate only as inputs.

Over/undershoot peak Vpeak — — — 0.4 V

Over/undershoot area

(above OVDD or below OVSS)

Varea — — — 0.67 V-ns

Termination Voltage Vtt Vtt tracking OVDD/2 0.49 x OVDD Vref 0.51 x OVDD V

Input current (no pull-up/down) Iin VI = 0 V

VI=OVDD

—

μA

Pull-up/Pull-down impedance mismatch — Minimum impedance

configuration

—— 3Ω

240 Ω unit calibration resolution — — — — 10 Ω

Keeper Circuit Resistance — — — 1304—kΩ

1OVDD— I/O power supply (1.425 V–1.575 V for DDR3)

2Vref— DDR3 external reference voltage

3The single-ended signals need to be within the respective limits (Vih(dc) max, Vil(dc) min) for single-ended signals as well as

the limitations for overshoot and undershoot.

4Use an off-chip pull resistor of less than 60 kΩ to override this keeper.

Table 15. LVIO DC Electrical Characteristics

DC Electrical Characteristics Symbol Test Conditions Min Typ Max Unit

High-Level DC input voltage1, 2 Vih Ioh = -0.8 mA 0.7 ×OVDD — OVDD V

Low-Level DC input voltage1, 2 Vil Iol = 0.8 mA 0 — 0.3 ×OVDD V

Input Hysteresis Vhys OVDD = 1.875 V

OVDD = 2.775 V

0.35 0.62

1.27

—V

Schmitt trigger VT+2, 3 VT+ — 0.5 ×OVDD — — V

Schmitt trigger VT-2, 3 VT- — — — 0.5 ×OVDD V

Input current (no pull-up/down) Iin Vin = OVDD or 0 V — — 1 μA

Input current (22 kΩ Pull-up) Iin Vin = 0 V

Vin = OVDD

— — 161

μA

Input current (47 kΩ Pull-up) Iin Vin = 0 V

Vin = OVDD

——76

μA

Input current (100 kΩ Pull-up) Iin Vin = 0 V

Vin = OVDD

——36

μA

Input current (100 kΩ Pull-down) Iin Vin = 0 V

Vin = OVDD

—— 1

μA

Keeper Circuit Resistance — — 1304—kΩ

Table 14. DDR3 I/O DC Electrical Parameters (continued)

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 33

4.3.4 Ultra-High Voltage I/O (UHVIO) DC Parameters

The parameters in Table 16 are guaranteed per the operating ranges in Table 7, unless otherwise noted.

1Overshoot and undershoot conditions (transitions above OVDD and below GND) on switching pads must be held below 0.6 V,

and the duration of the overshoot/undershoot must not exceed 10% of the system clock cycle. Overshoot/undershoot must be

controlled through printed circuit board layout, transmission line impedance matching, signal line termination, or other

methods. Non-compliance to this specification may affect device reliability or cause permanent damage to the device.

2To maintain a valid level, the transition edge of the input must sustain a constant slew rate (monotonic) from the current DC

level through to the target DC level, VIL or VIH. Monotonic input transition time is from 0.1 ns to 1 s. VIL and VIH do not apply

when hysteresis is enabled.

3Hysteresis of 350 mV is guaranteed over all operating conditions when hysteresis is enabled.

4Use an off-chip pull resistor of less than 60 kΩ to override this keeper.

Table 16. UHVIO DC Electrical Characteristics

DC Electrical Characteristics Symbol Test Conditions Min Typ Max Unit

High-level output voltage1

1Overshoot and undershoot conditions (transitions above OVDD and below GND) on switching pads must be held below 0.6 V,

and the duration of the overshoot/undershoot must not exceed 10% of the system clock cycle. Overshoot/undershoot must

be controlled through printed circuit board layout, transmission line impedance matching, signal line termination, or other

methods. Non-compliance to this specification may affect device reliability or cause permanent damage to the device.

Voh Iout = -0.8 mA OVDD-0.15 — — V

Low-level output voltage1Vol Iout = 0.8 mA — — 0.15 V

High-Level DC input voltage1, 2

2 To maintain a valid level, the transitioning edge of the input must sustain a constant slew rate (monotonic) from the current

DC level to the target DC level, VIL or VIH. Monotonic input transition time is from 0.1 ns to 1 s. VIL and VIH do not apply

when hysteresis is enabled.

VIH — 0.7 ×OVDD — OVDD V

Low-Level DC input voltage1, 2VIL — 0 — 0.3 ×OVDD V

Input Hysteresis VHYS low voltage mode

high voltage mode

0.38

0.95

—0.43

1.33

Schmitt trigger VT+2, 3

3Hysteresis of 250 mV is guaranteed over all operating conditions when hysteresis is enabled.

VT+ — 0.5 ×OVDD — — V

Schmitt trigger VT-2, 3 VT- — — — 0.5 ×OVDD V

Input current (no pull-up/down) Iin Vin = OVDD or 0 V — — 1 μA

Input current (22 kΩ Pull-up) Iin Vin = 0

Vin = OVDD

— — 202

1μA

Input current (75 kΩ Pull-up) Iin Vin = 0

Vin = OVDD

——61

1μA

Input current (100 kΩ Pull-up) Iin Vin = 0

Vin = OVDD

——47

1μA

Input current (360 kΩ Pull-down) Iin Vin = 0

Vin = OVDD

—— 1

5.7

μA

Keeper Circuit Resistance — — — 1304

4Use an off-chip pull resistor of less than 60 kΩ to override this keeper.

—kΩ

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

34 Freescale Semiconductor

Electrical Characteristics

4.3.5 LVDS I/O DC Parameters

The LVDS interface complies with TIA/EIA 644-A standard. See TIA/EIA STANDARD 644-A,

“Electrical Characteristics of Low Voltage Differential Signaling (LVDS) Interface Circuits” for details.

Table 17 shows the Low Voltage Differential Signaling (LVDS) DC electrical characteristics. The

parameters in Table 17 are guaranteed per the operating ranges in Table 7, unless otherwise noted.

4.4 Output Buffer Impedance Characteristics

This section defines the I/O Impedance parameters of the i.MX53xD processor for the following I/O

types:

• General Purpose I/O (GPIO)

• Double Data Rate 3 I/O (DDR3) for DDR2/LVDDR2, LPDDR2, and DDR3 modes

• Ultra High Voltage I/O (UHVIO)

•LVDS I/O

NOTE

Output driver impedance is measured with “long” transmission line of

impedance Ztl attached to I/O pad and incident wave launched into

transmission lime. Rpu/Rpd and Ztl form a voltage divider that defines

specific voltage of incident wave relative to OVDD. Output driver

impedance is calculated from this voltage divider (see Figure 4).

Table 17. LVDS DC Electrical Characteristics

DC Electrical Characteristics Symbol Test Conditions Min Typ Max Unit

Output Differential Voltage VOD Rload = 100Ω between

padP and padN

250 350 450 mV

Output High Voltage VOH 1.25 1.375 1.6 V

Output Low Voltage VOL 0.9 1.025 1.25

Offset Voltage VOS 1.125 1.2 1.375

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 35

Figure 4. Impedance Matching Load for Measurement

ipp_do

Cload = 1p

Ztl Ω, L = 20 inches

predriver

PMOS (Rpu)

NMOS (Rpd)

pad

OVDD

OVSS

t,(ns)

U,(V)

OVDD

t,(ns)

VDD

Vin (do)

Vout (pad)

U,(V)

Vref

Rpu = Vovdd - Vref1

Vref1

× Ztl

Rpd = × Ztl

Vref2

Vovdd - Vref2

Vref1 Vref2

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

36 Freescale Semiconductor

Electrical Characteristics

4.4.1 GPIO Output Buffer Impedance

Table 18 shows the GPIO output buffer impedance.

4.4.2 DDR Output Driver Average Impedance

The DDR2/LVDDR2 interface fully complies with JESD79-2E DDR2 JEDEC standard release April,

2008. The DDR3 interface fully complies with JESD79-3D DDR3 JEDEC standard release April, 2008.

Table 18. GPIO Output Buffer Impedance

Parameter Symbol Test Conditions Min

Typ

Max Unit

OVDD 2.775 V OVDD 1.875 V

Output Driver

Impedance

Rpu Low Drive Strength, Ztl = 150 Ω

Medium Drive Strength, Ztl = 75 Ω

High Drive Strength, Ztl = 50 Ω

Max Drive Strength, Ztl = 37.5 Ω

104

150

250

125

Output Driver

Impedance

Rpd Low Drive Strength, Ztl = 150 Ω

Medium Drive Strength, Ztl = 75 Ω

High Drive Strength, Ztl = 50 Ω

Max Drive Strength, Ztl = 37.5 Ω

134

243

122

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 37

Table 19 shows DDR output driver average impedance of the i.MX53 processor.

Table 19. DDR Output Driver Average Impedance1

1Output driver impedance is controlled across PVTs (process, voltages, and temperatures) using calibration procedure and

pu_*cal, pd_*cal input pins.

Parameter Symbol Test Conditions

Drive strength (DSE)

Unit

000 001 010 011 100 101 110 111

Output

Driver

Impedance

Rdrv2

2Output driver impedance deviation (calibration accuracy) is ±5% (max/min impedance) across PVTs.

LPDDR1/DDR2 mode

NVCC_DRAM = 1.8 V

DDR_SEL = 00

Calibration resistance = 300 Ω3

3Calibration is done against external reference resistor. Value of the resistor should be varied depending on DDR mode and

DDR_SEL setting.

Hi-Z 300 150 100 75 60 50 43 Ω

DDR2 mode

NVCC_DRAM = 1.8 V

DDR_SEL = 01

Calibration resistance = 180 Ω3

Hi-Z 180 90 60 45 36 30 26

DDR2 mode

NVCC_DRAM = 1.8 V

DDR_SEL = 10

Calibration resistance = 200 Ω3

Hi-Z 200 100 66 50 40 33 28

DDR2 mode

NVCC_DRAM= 1.8 V

DDR_SEL = 11

Calibration resistance = 140 Ω3

Hi-Z 140 70 46 35 28 23 20

LPDDR2 mode

NVCC_DRAM= 1.2 V

DDR_SEL = 014

Calibration resistance = 160 Ω3

4If DDR_SEL = ‘01’ or DDR_SEL = ‘11’ are selected with NVCC_DRAM = 1.2 V for LPDDR2 operation, the external reference

resistor value must be 160 Ω for a correct ZQ calibration. In any case, reference resistors attached to the DDR memory

devices should be kept to 240 Ω per the JEDEC standard.

Hi-Z 160 80 53 40 32 27 23

LPDDR2 mode

NVCC_DRAM = 1.2 V

DDR_SEL = 10

Calibration resistance = 240 Ω3

Hi-Z 240 120 80 60 48 40 34

LPDDR2 mode

NVCC_DRAM = 1.2 V

DDR_SEL = 114

Calibration resistance = 160 Ω3

Hi-Z 160 80 53 40 32 27 23

DDR3 mode

NVCC_DRAM = 1.5 V

DDR_SEL = 00

Calibration resistance = 200 Ω3

Hi-Z 240 120 80 60 48 48 34

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

38 Freescale Semiconductor

Electrical Characteristics

4.4.3 UHVIO Output Buffer Impedance

Table 20 shows the UHVIO output buffer impedance.

4.4.4 LVDS I/O Output Buffer Impedance

The LVDS interface complies with TIA/EIA 644-A standard. See, TIA/EIA STANDARD 644-A,

“Electrical Characteristics of Low Voltage Differential Signaling (LVDS) Interface Circuits” for details.

4.5 I/O AC Parameters

This section includes the AC parameters of the following I/O types:

• General Purpose I/O (GPIO)

• Double Data Rate 3 I/O (DDR3) for DDR2/LVDDR2, LPDDR2 and DDR3 modes

• Low Voltage I/O (LVIO)

• Ultra High Voltage I/O (UHVIO)

•LVDS I/O

The load circuit and output transition time waveforms are shown in Figure 5 and Figure 6.

Figure 5. Load Circuit for Output

Figure 6. Output Transition Time Waveform

Table 20. UHVIO Output Buffer Impedance

Parameter Symbol Test Conditions

Min Typ Max

Unit

OVDD

1.95 V

OVDD

3.0 V

OVDD

1.875 V

OVDD

3.3 V

OVDD

1.65 V

OVDD

3.6 V

Output Driver

Impedance

Rpu Low Drive Strength, Ztl = 150 Ω

Medium Drive Strength, Ztl = 75 Ω

High Drive Strength, Ztl = 50 Ω

114

124

135

198

206

103

Output Driver

Impedance

Rpd Low Drive Strength, Ztl = 150 Ω

Medium Drive Strength, Ztl = 75 Ω

High Drive Strength, Ztl = 50 Ω

118

126

154

179

217

109

Test Point

From Output

Under Test

CL includes package, probe and fixture capacitance

OVDD

20%

80% 80%

20%

tr tf

Output (at pad)

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 39

4.5.1 GPIO I/O AC Electrical Characteristics

AC electrical characteristics for GPIO I/O in slow and fast modes are presented in the Table 21 and

Table 22, respectively. Note that the fast or slow I/O behavior is determined by the appropriate control bit

in the IOMUXC control registers.

Table 21. GPIO I/O AC Parameters Slow Mode

Parameter Symbol Test Condition Min Typ Max Unit

Output Pad Transition Times (Max Drive) tr, tf 15 pF

35 pF

— — 1.91/1.52

3.07/2.65

Output Pad Transition Times (High Drive) tr, tf 15 pF

35 pF

— — 2.22/1.81

3.81/3.42

Output Pad Transition Times (Medium Drive) tr, tf 15 pF

35 pF

— — 2.88/2.42

5.43/5.02

Output Pad Transition Times (Low Drive) tr, tf 15 pF

35 pF

— — 4.94/4.50

10.55/9.70

Output Pad Slew Rate (Max Drive)1

1tps is measured between VIL to VIH for rising edge and between VIH to VIL for falling edge.

tps 15 pF

35 pF

0.5/0.65

0.32/0.37

—— V/ns

Output Pad Slew Rate (High Drive)1tps 15 pF

35 pF

0.43/0.54

0.26/0.41

——

Output Pad Slew Rate (Medium Drive)1tps 15 pF

35 pF

0.34/0.41

0.18/0.2

——

Output Pad Slew Rate (Low Drive)1tps 15 pF

35 pF

0.20/0.22

0.09/0.1

——

Output Pad di/dt (Max Drive) tdit — — — 30 mA/ns

Output Pad di/dt (High Drive) tdit — — — 23

Output Pad di/dt (Medium drive) tdit — — — 15

Output Pad di/dt (Low drive) tdit — — — 7

Input Transition Times2

2Hysteresis mode is recommended for inputs with transition times greater than 25 ns.

trm — — — 25 ns

Table 22. GPIO I/O AC Parameters Fast Mode

Parameter Symbol Test

Condition Min Typ Max Unit

Output Pad Transition Times (Max Drive) tr, tf 15 pF

35 pF

— — 1.45/1.24

2.76/2.54

Output Pad Transition Times (High Drive) tr, tf 15 pF

35 pF

— — 1.81/1.59

3.57/3.33

Output Pad Transition Times (Medium

Drive)

tr, tf 15 pF

35 pF

— — 2.54/2.29

5.25/5.01

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

40 Freescale Semiconductor

Electrical Characteristics

4.5.2 LPDDR2 I/O AC Electrical Characteristics

The DDR2/LVDDR2 interface mode fully complies with JESD79-2E DDR2 JEDEC standard release

April, 2008. The DDR3 interface mode fully complies with JESD79-3D DDR3 JEDEC standard release

April, 2008.

Table 23 shows the AC parameters for LPDDR2 I/O operating in DDR2 mode.

Output Pad Transition Times (Low Drive) tr, tf 15 pF

35 pF

— — 4.82/4.5

10.54/9.95

Output Pad Slew Rate (Max Drive)1tps 15 pF

35 pF

0.69/0.78

0.36/0.39

—— V/ns

Output Pad Slew Rate (High Drive)1tps 15 pF

35 pF

0.55/0.62

0.28/0.30

—— V/ns

Output Pad Slew Rate (Medium Drive)1tps 15 pF

35 pF

0.39/0.44

0.19/0.20

—— V/ns

Output Pad Slew Rate (Low Drive)1tps 15 pF

35 pF

0.21/0.22

0.09/0.1

—— V/ns

Output Pad di/dt (Max Drive) tdit — — — 70 mA/ns

Output Pad di/dt (High Drive) tdit — — — 53 mA/ns

Output Pad di/dt (Medium drive) tdit — — — 35 mA/ns

Output Pad di/dt (Low drive) tdit — — — 18 mA/ns

Input Transition Times2trm — — — 25 ns

1tps is measured between VIL to VIH for rising edge and between VIH to VIL for falling edge.

2Hysteresis mode is recommended for inputs with transition time greater than 25 ns.

Table 23. LPDDR2 I/O DDR2 mode AC Characteristics1

1Note that the JEDEC SSTL_18 specification (JESD8-15a) for class II operation supersedes any specification in this

document.

Parameter Symbol Test Condition Min Typ Max Unit

AC input logic high Vih(ac) — Vref+0.25 — — V

AC input logic low Vil(ac) — — — Vref-0.25 V

AC differential input voltage2Vid(ac) — 0.5 — OVDD V

Input AC differential cross point voltage3Vix(ac) — Vref - 0.175 — Vref + 0.175 V

Output AC differential cross point voltage4Vox(ac) — Vref - 0.125 — Vref + 0.125 V

Single output slew rate tsr At 25 W to Vref 0.4 — 2 V/ns

Skew between pad rise/fall asymmetry +

skew caused by SSN

tSKD clk = 266 MHz

clk = 400 MHz

——0.2

0.1

Table 22. GPIO I/O AC Parameters Fast Mode (continued)

Parameter Symbol Test

Condition Min Typ Max Unit

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 41

Table 24 shows the AC parameters for LPDDR2 I/O operating in LPDDR2 mode.

Table 25 shows the AC parameters for LPDDR2 I/O operating in DDR3 mode.

2Vid(ac) specifies the input differential voltage | Vtr - Vcp | required for switching, where Vtr is the “true” input signal and Vcp

is the “complementary” input signal. The Minimum value is equal to Vih(ac) - Vil(ac).

3The typical value of Vix(ac) is expected to be about 0.5 x OVDD. and Vix(ac) is expected to track variation of OVDD. Vix(ac)

indicates the voltage at which differential input signal must cross.

4The typical value of Vox(ac) is expected to be about 0.5 x OVDD and Vox(ac) is expected to track variation in OVDD. Vox(ac)

indicates the voltage at which differential output signal must cross.

Table 24. LPDDR2 I/O LPDDR2 mode AC Characteristics1

1Note that the JEDEC LPDDR2 specification (JESD209_2B) supersedes any specification in this document.

Parameter Symbol Test Condition Min Typ Max Unit

AC input logic high Vih(ac) — Vref + 0.22 — OVDD V

AC input logic low Vil(ac) — 0 — Vref - 0.22 V

AC differential input high voltage2

2Vid(ac) specifies the input differential voltage | Vtr - Vcp | required for switching, where Vtr is the “true” input signal and Vcp

is the “complementary” input signal. The Minimum value is equal to Vih(ac) - Vil(ac).

Vidh(ac) — 0.44 — — V

AC differential input low voltage Vidl(ac) — — — 0.44 V

Input AC differential cross point voltage3

3The typical value of Vix(ac) is expected to be about 0.5 x OVDD. and Vix(ac) is expected to track variation of OVDD. Vix(ac)

indicates the voltage at which differential input signal must cross.

Vix(ac) Relative to OVDD/2 -0.12 — 0.12 V

Over/undershoot peak Vpeak — — — 0.35 V

Over/undershoot area (above OVDD

or below OVSS)

Varea 266 MHz — — 0.6 V-ns

Single output slew rate tsr 50 Ω to Vref. 5pF load.

Drive impedance= 40

Ω ± 30%

1.5 — 3.5 V/ns

50 Ω to Vref. 5 pF

load. Drive

impedance= 60 Ω ±

30%

1—2.5

Skew between pad rise/fall asymmetry +

skew caused by SSN

tSKD clk = 266 MHz

clk = 400 MHz

——0.2

0.1

Table 25. LPDDR2 I/O DDR3 mode AC Characteristics1

Parameter Symbol Test Condition Min Typ Max Unit

AC input logic high Vih(ac) — Vref + 0.175 — OVDD V

AC input logic low Vil(ac) — 0 — Vref - 0.175 V

AC differential input voltage2Vid(ac) — 0.35 — — V

Input AC differential cross point voltage3Vix(ac) — Vref - 0.15 — Vref + 0.15 V

Output AC differential cross point voltage4Vox(ac) — Vref - 0.15 — Vref + 0.15 V

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

42 Freescale Semiconductor

Electrical Characteristics

4.5.3 LVIO I/O AC Electrical Characteristics

AC electrical characteristics for LVIO I/O in slow and fast modes are presented in the Table 26 and

Table 27, respectively. Note that the fast or slow I/O behavior is determined by the appropriate control bit

in the IOMUXC control registers.

Single output slew rate tsr At 25 Ω to Vref 2.5 — 5 V/ns

Skew between pad rise/fall asymmetry +

skew caused by SSN

tSKD clk = 266 MHz

clk = 400 MHz

——0.2

0.1

1Note that the JEDEC JESD79_3C specification supersedes any specification in this document.

2Vid(ac) specifies the input differential voltage |Vtr-Vcp| required for switching, where Vtr is the “true” input signal and Vcp is

the “complementary” input signal. The Minimum value is equal to Vih(ac) - Vil(ac).

3The typical value of Vix(ac) is expected to be about 0.5 x OVDD. and Vix(ac) is expected to track variation of OVDD. Vix(ac)

indicates the voltage at which differential input signal must cross.

4The typical value of Vox(ac) is expected to be about 0.5 x OVDD and Vox(ac) is expected to track variation in OVDD. Vox(ac)

indicates the voltage at which differential output signal must cross.

Table 26. LVIO I/O AC Parameters in Slow Mode

Parameter Symbol Test Condition Min Typ Max Unit

Input Transition Times1

1Hysteresis mode is recommended for inputs with transition times greater than 25 ns.

trm — — — 25 ns

Table 25. LPDDR2 I/O DDR3 mode AC Characteristics1 (continued)

Parameter Symbol Test Condition Min Typ Max Unit

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 43

4.5.4 UHVIO I/O AC Electrical Characteristics

Table 28 shows the AC parameters for UHVIO I/O operating in low output voltage mode. Table 29

shows the AC parameters for UHVIO I/O operating in high output voltage mode.

Table 27. LVIO I/O AC Parameters in Fast Mode

Parameter Symbol Test

Condition Min Typ Max Unit

Input Transition Times1

1Hysteresis mode is recommended for inputs with transition time greater than 25 ns.

trm — — — 25 ns

Table 28. AC Electrical Characteristics of UHVIO Pad (Low Output Voltage Mode)

Parameter Symbol Test Condition Min Typ Max Unit

Output Pad Transition Times (High Drive) tr, tf 15 pF

35 pF

— — 1.59/1.69

3.05/3.30

Output Pad Transition Times (Medium Drive) tr, tf 15 pF

35 pF

— — 2.16/2.35

4.45/4.84

Output Pad Transition Times (Low Drive) tr, tf 15 pF

35 pF

— — 4.06/4.42

8.79/9.55

Output Pad Slew Rate (High Drive)1

1tps is measured between VIL to VIH for rising edge and between VIH to VIL for falling edge.

tps 15 pF

35 pF

0.63/0.59

0.33/0.30

—— V/ns

Output Pad Slew Rate (Medium Drive)1tps 15 pF

35 pF

0.46/0.42

0.22/0.21

——

Output Pad Slew Rate (Low Drive)1tps 15 pF

35 pF

0.25/0.23

0.11/0.11

——

Output Pad di/dt (High Drive) tdit — — — 43.6 mA/ns

Output Pad di/dt (Medium drive) tdit — — — 32.3

Output Pad di/dt (Low drive) tdit — — — 18.24

Input Transition Times2

2Hysteresis mode is recommended for inputs with transition times greater than 25 ns.

trm — — — 25 ns

Table 29. AC Electrical Characteristics of UHVIO Pad (High Output Voltage Mode)

Parameter Symbol Test Condition Min Typ Max Unit

Output Pad Transition Times (High Drive) tr, tf 15 pF

35 pF

— — 1.72/1.92

3.46/3.70

Output Pad Transition Times (Medium Drive) tr, tf 15 pF

35 pF

— — 2.38/2.56

5.07/5.25

Output Pad Transition Times (Low Drive) tr, tf 15 pF

35 pF

— — 4.55/4.58

10.04/9.94

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

44 Freescale Semiconductor

Electrical Characteristics

4.5.5 LVDS I/O AC Electrical Characteristics

The differential output transition time waveform is shown in Figure 7.

Figure 7. Differential LVDS Driver Transition Time Waveform

Table 30 shows the AC parameters for LVDS I/O.

Output Pad Slew Rate (High Drive)1tps 15 pF

35 pF

1.05/0.94

0.52/0.49

—— V/ns

Output Pad Slew Rate (Medium Drive)1tps 15 pF

35 pF

0.76/0.71

0.36/0.34

——

Output Pad Slew Rate (Low Drive)1tps 15 pF

35 pF

0.40/0.93

0.18/0.18

——

Output Pad di/dt (High Drive) tdit — — — 82.8 mA/ns

Output Pad di/dt (Medium drive) tdit — — — 65.6

Output Pad di/dt (Low drive) tdit — — — 43.1

Input Transition Times2trm — — — 25 ns

1tps is measured between VIL to VIH for rising edge and between VIH to VIL for falling edge.

2Hysteresis mode is recommended for inputs with transition times greater than 25 ns.

Table 30. AC Electrical Characteristics of LVDS Pad

Parameter Symbol Test Condition Min Typ Max Unit

Transition Low to High Time1

1Measurement levels are 20–80% from output voltage.

tTLH Rload = 100 Ω,

Cload = 2 pF

0.26 — 0.5 ns

Transition High to Low Time1tTHL 0.26 — 0.5

Operating Frequency f — — 300 — MHz

Offset voltage imbalance Vos — — — 150 mV

Table 29. AC Electrical Characteristics of UHVIO Pad (High Output Voltage Mode) (continued)

Parameter Symbol Test Condition Min Typ Max Unit

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 45

4.6 System Modules Timing

This section contains the timing and electrical parameters for the modules in the i.MX53xD processor.

4.6.1 Reset Timings Parameters

Figure 8 shows the reset timing and Table 31 lists the timing parameters.

Figure 8. Reset Timing Diagram

4.6.2 WDOG Reset Timing Parameters

Figure 9 shows the WDOG reset timing and Table 32 lists the timing parameters.

Figure 9. WATCHDOG_RST Timing Diagram

NOTE

CKIL is approximately 32 kHz. TCKIL is one period or approximately 30 μs.

4.6.3 Clock Amplifier Parameters (CKIH1, CKIH2)

The input to Clock Amplifier (CAMP) is internally ac-coupled allowing direct interface to a square wave

or sinusoidal frequency source. No external series capacitors are required.

Table 31. Reset Timing Parameters

ID Parameter Min Max Unit

CC1 Duration of RESET_IN to be qualified as valid (input slope = 5 ns) 50 — ns

Table 32. WATCHDOG_RST Timing Parameters

ID Parameter Min Max Unit

CC5 Duration of WATCHDOG_RESET Assertion 1 — TCKIL

RESET_IN

CC1

(Input)

WATCHDOG_RST

CC5

(Input)

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

46 Freescale Semiconductor

Electrical Characteristics

Table 33 shows the electrical parameters of CAMP.

4.6.4 DPLL Electrical Parameters

Table 34 shows the electrical parameters of digital phase-locked loop (DPLL).

Table 33. CAMP Electrical Parameters (CKIH1, CKIH2)

Parameter Min Typ Max Unit

Input frequency 8.0 — 40.0 MHz

VIL (for square wave input) 0 — 0.3 V

VIH (for square wave input)1

1NVCC_CKIH is the supply voltage of CAMP.

NVCC_CKIH - 0.25 — NVCC_CKIH V

Sinusoidal input amplitude 0.4 — VDD Vp-p

Output duty cycle 45 50 55 %

Table 34. DPLL Electrical Parameters

Parameter Test Conditions/Remarks Min Typ Max Unit

Reference clock frequency range1

1Device input range cannot exceed the electrical specifications of the CAMP, see Table 33.

—10—100MHz

Reference clock frequency range after

pre-divider

—10—40MHz

Output clock frequency range (dpdck_2) — 300 — 1025 MHz

Pre-division factor2

2The values specified here are internal to DPLL. Inside the DPLL, a “1” is added to the value specified by the user. Therefore,

the user has to enter a value “1” less than the desired value at the inputs of DPLL for PDF and MFD.

—1—16—

Multiplication factor integer part — 5 — 15 —

Multiplication factor numerator3

3The maximum total multiplication factor (MFI + MFN/MFD) allowed is 15. Therefore, if the MFI value is 15, MFN value must

be zero.

Should be less than denominator -67108862 — 67108862 —

Multiplication factor denominator2— 1 — 67108863 —

Output Duty Cycle — 48.5 50 51.5 %

Frequency lock time4

(FOL mode or non-integer MF)

———398 Tdpdref

Phase lock time — — — 100 µs

Frequency jitter5 (peak value) — — 0.02 0.04 Tdck

Phase jitter (peak value) FPL mode, integer and fractional MF — 2.0 3.5 ns

Power dissipation fdck = 300 MHz at avdd = 1.8 V,

dvdd = 1.2 V

fdck = 650 MHz at avdd = 1.8 V,

dvdd = 1.2 V

— — 0.65 (avdd)

0.92 (dvdd)

1.98 (avdd)

1.8 (dvdd)

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 47

4.6.5 NAND Flash Controller (NFC) Parameters

This section provides the relative timing requirements among various signals of NFC at the module level,

in each operational mode.

Timing parameters in Figure 10, Figure 11, Figure 12, Figure 13, Figure 15, and Table 36 show the default

NFC mode (asymmetric mode) using two Flash clock cycles per one access of RE_B and WE_B.

Timing parameters in Figure 10, Figure 11, Figure 12, Figure 14, Figure 15, and Table 36 show symmetric

NFC mode using one Flash clock cycle per one access of RE_B and WE_B.

With reference to the timing diagrams, a high is defined as 80% of signal value and low is defined as 20%

of signal value. All parameters are given in nanoseconds. The BGA contact load used in calculations is

20 pF (except for NF16— 40 pF) and there is maximum drive strength on all contacts.

All timing parameters are a function of T, which is the period of the flash_clk clock (“enfc_clk” at system

level). This clock frequency can be controlled by the user, configuring CCM (SoC clock controller). The

clock is derived from emi_slow_clk after single divider.

Figure 35 demonstrates several examples of clock frequency settings.

NOTE

A potential limitation for minimum clock frequency may exist for some

devices. When the clock frequency is too low, the data bus capturing might

occur after the specified trhoh (RE_B high to output hold) period. Setting the

clock frequency above 25.6 MHz (that is, T = 39 ns) guaranties a proper

operation for devices having trhoh > 15 ns. It is also recommended that the

NFC_FREQ_SEL Fuse be set accordingly to initiate the boot with

33.33 MHz clock.

4Tdpdref is the time period of the reference clock after predivider. According to the specification, the maximum lock time in FOL

mode is 398 cycles of divided reference clock when DPLL starts after full reset.

5Tdck is the time period of the output clock, dpdck_2.

Table 35. NFC Clock Settings Examples

emi_slow_clk (MHz) nfc_podf (Division Factor) enfc_clk (MHz) T-Clock Period (ns)

100 (Boot mode) 71

1Boot value NFC_FREQ_SEL Fuse High (burned)

14.29 70

2Boot value NFC_FREQ_SEL Fuse Low

33.33 30

133 4 33.33 30

3 44.333

3For RBB_MODE=1, using NANDF_RB0 signal for ready/busy indication. This mode require setting the delay line. See the

Reference Manual for details.

22.5

266

315

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

48 Freescale Semiconductor

Electrical Characteristics

Lower frequency operation can be supported for most available devices in

the market, relying on data lines Bus-Keeper logic. This depends on device

behavior on the data bus in the time interval between data output valid to

data output high-Z state. In NAND device parameters this period is marked

between trhoh and trhz (RE_B high to output high-Z). In most devices, the

data transition from valid value to high-Z occurs without going through

other states. Setting the data bus pads to Bus-Keeper mode in the IOMUXC

registers, keeps the data bus valid internally after the specified hold time,

allowing proper capturing with slower clock.

Figure 10. Command Latch Cycle Timing

Figure 11. Address Latch Cycle Timing

NFCLE

NFCE_B

NFWE_B

NFIO[7:0] command

NF9

NF8

NF1 NF2

NF5

NF3 NF4

NFCE_B

NFWE_B

NFALE

NFIO[7:0] Address

NF9

NF8

NF5

NF3 NF4

NF6

NF11

NF10

NF7

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 49

Figure 12. Write Data Latch Timing

Figure 13. Read Data Latch Timing, Asymmetric Mode

Figure 14. Read Data Latch Timing, Symmetric Mode

NFCE_B

NFWE_B

NFIO[15:0] Data to NF

NF9

NF8

NF5

NF3

NF11

NF10

NFCE_B

NFRE_B

NFRB_B

NFIO[15:0] Data from NF

NF13

NF15

NF14

NF17

NF12

NF16

NFCE_B

NFRE_B

NFRB_B

NFIO[15:0] Data from NF

NF13

NF15

NF14

NF12

NF16 NF18

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

50 Freescale Semiconductor

Electrical Characteristics

Figure 15. Other Timing Parameters

NFCLE

NFCE_B

NFRE_B

NFRB_B

NFWE_B

NF20

NF19

NF21

NF22

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 51

Table 36. NFC—Timing Characteristics

ID Parameter Symbol Asymmetric Mode Min Symmetric Mode

Min Max

NF1 NFCLE setup Time tCLS 2T + 0.1 2T + 0.1 —

NF2 NFCLE Hold Time tCLH T - 4.45 T - 4.45 —

NF31

1In case of NUM_OF_DEVICES is greater than 0 (for example, interleaved mode), then only during the data phase of

symmetric mode the setup time will equal 1.5T + 0.95.

NFCE_B Setup Time tCS 3T + 0.95 3T+0.95 —

NF4 NFCE_B Hold Time tCH 2T-5.55 1.5T-5.55 —

NF5 NFWE_B Pulse Width tWP T- 1.4 0.5T- 1.4 —

NF6 NFALE Setup Time tALS 2T + 0.1 2T + 0.1 —

NF7 NFALE Hold Time tALH T - 4.45 T - 4.45 —

NF8 Data Setup Time tDS T- 0.9 0.5T- 0.9 —

NF9 Data Hold Time tDH T - 5.55 0.5T - 5.55 —

NF10 Write Cycle Time tWC 2T T-0.5 —

NF11 NFWE_B Hold Time tWH T - 1.15 0.5T - 1.15 —

NF12 Ready to NFRE_B Low tRR 9T + 8.9 9T + 8.9 —

NF13 NFRE_B Pulse Width tRP 1.5T 0.5T-1 —

NF14 READ Cycle Time tRC 2T T —

NF15 NFRE_B High Hold Time tREH 0.5T - 1.15 0.5T - 1.15 —

NF162

2tDSR is calculated by the following formula:

Asymmetric mode: tDSR = tREpd + tDpd + 1/2T - Tdl3

Symmetric mode: tDSR = tREpd + tDpd - Tdl3

tREpd + tDpd = 11.2 ns (including clock skew)

where tREpd is RE propogation delay in the chip including I/O pad delay, and tDpd is Data propogation delay from I/O pad to

EXTMC including I/O pad delay.

tDSR can be used to determine tREA max parameter with the following formula: tREA = 1.5T - tDSR.

Data Setup on READ tDSR 11.2 + 0.5T - Tdl3

3Tdl is composed of 4 delay-line units each generates an equal delay with min 1.25 ns and max 1 aclk period (Taclk). Default

is 1/4 aclk period for each delay-line unit, so all 4 delay lines together generates a total of 1 aclk period. Taclk is

“emi_slow_clk” of the system, which default value is 7.5 ns (133 MHz).

11.2 - Tdl3—

NF174Data Hold on READ tDHR 0—2Taclk +T

NF185Data Hold on READ tDHR —Tdl

3- 11.2 2Taclk +T

NF19 CLE to RE delay tCLR 9T 9T —

NF20 CE to RE delay tCRE T - 3.45 T - 3.45 T + 0.3

NF21 WE high to RE low tWHR 10.5T 10.5T —

NF22 WE high to busy tWB ——6T

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

52 Freescale Semiconductor

Electrical Characteristics

4.6.6 External Interface Module (EIM)

The following subsections provide information on the EIM.

4.6.6.1 EIM Signal Cross Reference

Table 37 is a guide intended to help the user identify signals in the External Interface Module Chapter of

the Reference Manual which are identical to those mentioned in this data sheet.

4.6.6.2 EIM Interface Pads Allocation

EIM supports16-bit and 8-bit devices operating in address/data separate or multiplexed modes. In some

of the modes the EIM and the NAND FLASH have shared data bus. Table 38 provides EIM interface

pads allocation in different modes.

4NF17 is defined only in asymmetric operation mode.

NF17 max value is equivalent to max tRHZ value that can be used with NFC.

Taclk is “emi_slow_clk” of the system.

5NF18 is defined only in Symmetric operation mode.

tDHR (MIN) is calculated by the following formula: Tdl3 - (tREpd + tDpd)

where tREpd is RE propogation delay in the chip including I/O pad delay, and tDpd is Data propogation delay from I/O pad to

EXTMC including I/O pad delay.

NF18 max value is equivalent to max tRHZ value that can be used with NFC.

Taclk is “emi_slow_clk” of the system.

Table 37. EIM Signal Cross Reference

Reference Manual

EIM Chapter Nomenclature

Data Sheet Nomenclature,

Reference Manual External Signals and Pin Multiplexing Chapter,

and IOMUXC Controller Chapter Nomenclature

BCLK EIM_BCLK

CSx EIM_CSx

WE_B EIM_RW

OE_B EIM_OE

BEy_B EIM_EBx

ADV EIM_LBA

ADDR EIM_A[25:16], EIM_DA[15:0]

ADDR/M_DATA EIM_DAx (Addr/Data muxed mode)

DATA EIM_NFC_D (Data bus shared with NAND Flash)

EIM_Dx (dedicated data bus)

WAIT_B EIM_WAIT

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 53

Table 38. EIM Internal Module Multiplexing

Setup

Non Multiplexed Address/Data Mode Multiplexed

Address/Data mode

8 Bit 16 Bit 32 Bit 16 Bit 32 Bit

MUM = 0,

DSZ = 100

MUM = 0,

DSZ = 101

MUM = 0,

DSZ = 111

MUM = 0,

DSZ = 001

MUM = 0,

DSZ = 010

MUM = 0,

DSZ = 011

MUM = 1,

DSZ = 001

MUM = 1,

DSZ = 011

A[15:0] EIM_DA

[15:0]

EIM_DA

[15:0]

EIM_DA

[15:0]

EIM_DA

[15:0]

EIM_DA

[15:0]

EIM_DA

[15:0]

EIM_DA

[15:0]

EIM_DA

[15:0]

A[25:16] EIM_A

[25:16]

EIM_A

[25:16]

EIM_A

[25:16]

EIM_A

[25:16]

EIM_A

[25:16]

EIM_A

[24:16]1

1For 32-bit mode, the address range is A[24:0], due to address space allocation in memory map.

EIM_A

[25:16]

NANDF_D

[8:0]1

D[7:0],

EIM_EB

NANDF_D

[7:0]2

——NANDF_D

[7:0]2

2NANDF_D[7:0] multiplexed on ALT3 mode of PATA_DATA[7:0]

—NANDF_D

[7:0]

EIM_DA

[7:0]

EIM_DA

[7:0]

D[15:8],

EIM_EB

—NANDF_D

[15:8]3

—NANDF_D

[15:8]3

3NANDF_D[15:8] multiplexed on ALT3 mode of PATA_DATA[15:8]

—NANDF_D

[15:8]

EIM_DA

[15:8]

EIM_DA

[15:8]

D[23:16]

EIM_EB

————EIM_D

[23:16]

EIM_D

[23:16]

— NANDF_D

[7:0]

D[31:24]

EIM_EB

——EIM_D

[31:24]

—EIM_D

[31:24]

EIM_D

[31:24]

— NANDF_D

[15:8]

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

54 Freescale Semiconductor

Electrical Characteristics

4.6.6.3 General EIM Timing-Synchronous Mode

Figure 16, Figure 17, and Table 39 specify the timings related to the EIM module. All EIM output control

signals may be asserted and deasserted by an internal clock synchronized to the BCLK rising edge

according to corresponding assertion/negation control fields.

Figure 16. EIM Outputs Timing Diagram

Figure 17. EIM Inputs Timing Diagram

Table 39. EIM Bus Timing Parameters 1

ID Parameter

BCD = 0 BCD = 1 BCD = 2 BCD = 3

Min Max Min Max Min Max Min Max

WE1 BCLK Cycle time2t 2 x t 3 x t 4 x t

WE2 BCLK Low Level

Width

0.4 x t 0.8 x t 1.2 x t 1.6 x t

WE4

Address

CSx_B

WE_B

OE_B

BCLK

BEy_B

ADV_B

Output Data

...

WE5

WE6 WE7

WE8 WE9

WE10 WE11

WE12 WE13

WE14 WE15

WE16 WE17

WE3

WE2

WE1

Input Data

WAIT_B

BCLK

WE19

WE18

WE21

WE20

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i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 55

WE3 BCLK High Level

Width

0.4 x t 0.8 x t 1.2 x t 1.6 x t

WE4 Clock rise to

address valid3

-0.5 x t -

1.25

-0.5 x t +

1.75

-t - 1.25 -t + 1.75 -1.5 x t -

1.25

-1.5 x t

+1.75

-2 x t -

1.25

-2 x t +

1.75

WE5 Clock rise to

address invalid

0.5 x t -

1.25

0.5 x t + 1.75 t - 1.25 t + 1.75 1.5 x t -

1.25

1.5 x t +

1.75

2 x t -

1.25

2 x t + 1.75

WE6 Clock rise to

CSx_B valid

-0.5 x t -

1.25

-0.5 x t +

1.75

-t - 1.25 -t + 1.75 -1.5 x t -

1.25

-1.5 x t +

1.75

-2 x t -

1.25

-2 x t +

1.75

WE7 Clock rise to

CSx_B invalid

0.5 x t -

1.25

0.5 x t + 1.75 t - 1.25 t + 1.75 1.5 x t -

1.25

1.5 x t +

1.75

2 x t -

1.25

2 x t + 1.75

WE8 Clock rise to

WE_B Valid

-0.5 x t -

1.25

-0.5 x t +

1.75

-t - 1.25 -t + 1.75 -1.5 x t -

1.25

-1.5 x t +

1.75

-2 x t -

1.25

-2 x t +

1.75

WE9 Clock rise to

WE_B Invalid

0.5 x t -

1.25

0.5 x t + 1.75 t - 1.25 t + 1.75 1.5 x t -

1.25

1.5 x t +

1.75

2 x t -

1.25

2 x t + 1.75

WE10 Clock rise to OE_B

Valid

-0.5 x t -

1.25

-0.5 x t +

1.75

-t - 1.25 -t + 1.75 -1.5 x t -

1.25

-1.5 x t +

1.75

-2 x t -

1.25

-2 x t +

1.75

WE11 Clock rise to OE_B

Invalid

0.5 x t -

1.25

0.5 x t + 1.75 t - 1.25 t + 1.75 1.5 x t -

1.25

1.5 x t +

1.75

2 x t -

1.25

2 x t + 1.75

WE12 Clock rise to

BEy_B Valid

-0.5 x t -

1.25

-0.5 x t +

1.75

-t - 1.25 -t + 1.75 -1.5 x t -

1.25

-1.5 x t +

1.75

-2 x t -

1.25

-2 x t +

1.75

WE13 Clock rise to

BEy_B Invalid

0.5 x t -

1.25

0.5 x t + 1.75 t - 1.25 t + 1.75 1.5 x t -

1.25

1.5 x t +

1.75

2 x t -

1.25

2 x t + 1.75

WE14 Clock rise to

ADV_B Valid

-0.5 x t -

1.25

-0.5 x t +

1.75

-t - 1.25 -t + 1.75 -1.5 x t -

1.25

-1.5 x t +

1.75

-2 x t -

1.25

-2 x t +

1.75

WE15 Clock rise to

ADV_B Invalid

0.5 x t -

1.25

0.5 x t + 1.75 t - 1.25 t + 1.75 1.5 x t -

1.25

1.5 x t +

1.75

2 x t -

1.25

2 x t + 1.75

WE16 Clock rise to

Output Data Valid

-0.5 x t -

1.25

-0.5 x t +

1.75

-t - 1.25 -t + 1.75 -1.5 x t -

1.25

-1.5 x t +

1.75

-2 x t -

1.25

-2 x t +

1.75

WE17 Clock rise to

Output Data

Invalid

0.5 x t -

1.25

0.5 x t + 1.75 t - 1.25 t + 1.75 1.5 x t -

1.25

1.5 x t +

1.75

2 x t -

1.25

2 x t + 1.75

WE18 Input Data setup

time to Clock rise

2 — 4—————

WE19 Input Data hold

time from Clock

rise

2 — 2—————

WE20 WAIT_B setup

time to Clock rise

2 — 4—————

WE21 WAIT_B hold time

from Clock rise

2 — 2—————

Table 39. EIM Bus Timing Parameters (continued)1

ID Parameter

BCD = 0 BCD = 1 BCD = 2 BCD = 3

Min Max Min Max Min Max Min Max

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56 Freescale Semiconductor

Electrical Characteristics

4.6.6.4 Examples of EIM Synchronous Accesses

Figure 18 to Figure 21 provide few examples of basic EIM accesses to external memory devices with the

timing parameters mentioned previously for specific control parameters settings.

Figure 18. Synchronous Memory Read Access, WSC=1

1t is the maximal EIM logic (axi_clk) cycle time. The maximum allowed axi_clk frequency is 133 MHz, whereas the maximum

allowed BCLK frequency is 104 MHz. As a result, if BCD = 0, axi_clk must be ≤104 MHz. If BCD = 1, then 133 MHz is

allowed for axi_clk, resulting in a BCLK of 66.5 MHz. When the clock branch to EIM is decreased to 104 MHz, other busses

are impacted which are clocked from this source. See the CCM chapter of the i.MX53 Reference Manual for a detailed clock

tree description.

2BCLK parameters are being measured from the 50% point, that is, high is defined as 50% of signal value and low is defined

as 50% as signal value.

3For signal measurements “High” is defined as 80% of signal value and “Low” is defined as 20% of signal value.

Last Valid Address Address v1

D(v1)

BCLK

ADDR

DATA

WE_B

ADV_B

OE_B

BEy_B

CSx_B

WE4 WE5

WE6 WE7

WE10 WE11

WE13

WE12

WE14 WE15

WE18

WE19

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 57

Figure 19. Synchronous Memory, Write Access, WSC=1, WBEA=0, and WADVN=0

Figure 20. Muxed Address/Data (A/D) Mode, Synchronous Write Access, WSC=6, ADVA=0, ADVN=1, and

ADH=1

NOTE

In 32-bit muxed address/data (A/D) mode the 16 MSBs are driven on the

data bus.

Last Valid Address Address V1

D(V1)

BCLK

ADDR

DATA

WE_B

ADV_B

OE_B

BEy_B

CSx_B

WE4 WE5

WE6 WE7

WE8 WE9

WE12 WE13

WE14

WE15

WE16 WE17

Last

BCLK

ADDR/

WE_B

ADV_B

OE_B

BEy_B

CSx_B

Address V1 Write Data

Valid Addr

M_DATA

WE4

WE16

WE6

WE7

WE9

WE8

WE10

WE11

WE14 WE15

WE17

WE5

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58 Freescale Semiconductor

Electrical Characteristics

Figure 21. 16-Bit Muxed A/D Mode, Synchronous Read Access, WSC=7, RADVN=1, ADH=1, and OEA=0

4.6.6.5 General EIM Timing-Asynchronous Mode

Figure 22 through Figure 27, and Table 40 help to determine timing parameters relative to the chip select

(CS) state for asynchronous and DTACK EIM accesses with corresponding EIM bit fields and the timing

parameters mentioned above.

Asynchronous read and write access length in cycles may vary from what is shown in Figure 22 through

Figure 25 as RWSC, OEN, and CSN is configured differently. Refer to i.MX53xD RM for the EIM

programming model.

Last

BCLK

ADDR/

WE_B

ADV_B

OE_B

BEy_B

CSx_B

Address V1 Data

Valid Addr

M_DATA

WE5

WE6

WE7

WE14 WE15

WE10 WE11

WE12 WE13

WE18

WE19

WE4

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 59

Figure 22. Asynchronous Memory Read Access (RWSC = 5)

Figure 23. Asynchronous A/D Muxed Read Access (RWSC = 5)

Last Valid Address Address V1

D(V1)

ADDR/

DATA[7:0]

WE_B

ADV_B

OE_B

BEy_B

CSx_B

Next Address

WE39

WE35

WE37

WE32

WE36

WE38

WE43

WE40

WE31

WE44

INT_CLK

start of

access end of

access

MAXDI

MAXCSO

MAXCO

M_DATA

Addr. V1 D(V1)

ADDR/

WE_B

ADV_B

OE_B

BEy_B

CSx_B

WE39

WE35A

WE37

WE36

WE38

WE40A

WE31

WE44

INT_CLK

start of

access end of

access

MAXDI

MAXCSO

MAXCO

WE32A

M_DATA

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60 Freescale Semiconductor

Electrical Characteristics

Figure 24. Asynchronous Memory Write Access

Figure 25. Asynchronous A/D Muxed Write Access

Last Valid Address Address V1

D(V1)

ADDR

DATA

WE_B

ADV_B

OE_B

BEy_B

CSx_B

Next Address

WE31

WE39

WE33

WE45

WE32

WE40

WE34

WE46

WE42

WE41

WE_B

OE_B

BEy_B

CSx_B

WE33

WE45

WE34

WE46

WE42

Addr. V1 D(V1)

ADDR/

WE31

WE42

WE41

WE32A

M_DATA

ADV_B

WE39 WE40A

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 61

Figure 26. DTACK Read Access (DAP=0)

Figure 27. DTACK Write Access (DAP=0)

Last Valid Address Address V1

D(V1)

ADDR

DATA[7:0]

WE_B

ADV_B

OE_B

BEy_B

CSx_B

Next Address

WE39

WE35

WE37

WE32

WE36

WE38

WE43

WE40

WE31

WE44

DTACK

WE47

WE48

Last Valid Address Address V1

D(V1)

ADDR

DATA

WE_B

ADV_B

OE_B

BEy_B

CSx_B

Next Address

WE31

WE39

WE33

WE45

WE32

WE40

WE34

WE46

WE42

WE41

DTACK

WE47

WE48

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62 Freescale Semiconductor

Electrical Characteristics

Table 40. EIM Asynchronous Timing Parameters Table Relative Chip Select

Ref No. Parameter

Determination by

Synchronous measured

parameters 12

Min

Max

(If 133 MHz is

supported by SOC)

Unit

WE31 CSx_B valid to Address Valid WE4 - WE6 - CSA3— 3 - CSA ns

WE32 Address Invalid to CSx_B

invalid

WE7 - WE5 - CSN4 —3 - CSNns

WE32A(

muxed

A/D

CSx_B valid to Address Invalid t5 + WE4 - WE7 + (ADVN +

ADVA + 1 - CSA3)

-3 + (ADVN +

ADVA + 1 - CSA)

—ns

WE33 CSx_B Valid to WE_B Valid WE8 - WE6 + (WEA - CSA) — 3 + (WEA - CSA) ns

WE34 WE_B Invalid to CSx_B Invalid WE7 - WE9 + (WEN - CSN) — 3 - (WEN_CSN) ns

WE35 CSx_B Valid to OE_B Valid WE10 - WE6 + (OEA - CSA) — 3 + (OEA - CSA) ns

WE35A

(muxed

A/D)

CSx_B Valid to OE_B Valid WE10 - WE6 + (OEA + RADVN

+ RADVA + ADH + 1 - CSA)

-3 + (OEA +

RADVN+RADVA+

ADH+1-CSA)

3 + (OEA +

RADVN+RADVA+AD

H+1-CSA)

WE36 OE_B Invalid to CSx_B Invalid WE7 - WE11 + (OEN - CSN) — 3 - (OEN - CSN) ns

WE37 CSx_B Valid to BEy_B Valid

(Read access)

WE12 - WE6 + (RBEA - CSA) — 3 + (RBEA6 - CSA) ns

WE38 BEy_B Invalid to CSx_B Invalid

(Read access)

WE7 - WE13 + (RBEN - CSN) — 3 - (RBEN7- CSN) ns

WE39 CSx_B Valid to ADV_B Valid WE14 - WE6 + (ADVA - CSA) — 3 + (ADVA - CSA) ns

WE40 ADV_B Invalid to CSx_B

Invalid (ADVL is asserted)

WE7 - WE15 - CSN — 3 - CSN ns

WE40A

(muxed

A/D)

CSx_B Valid to ADV_B Invalid WE14 - WE6 + (ADVN + ADVA

+ 1 - CSA)

-3 + (ADVN +

ADVA + 1 - CSA)

3 + (ADVN + ADVA +

1 - CSA)

WE41 CSx_B Valid to Output Data

Valid

WE16 - WE6 - WCSA — 3 - WCSA ns

WE41A

(muxed

A/D)

CSx_B Valid to Output Data

Valid

WE16 - WE6 + (WADVN +

WADVA + ADH + 1 - WCSA)

—3 + (WADVN +

WADVA + ADH + 1 -

WCSA)

WE42 Output Data Invalid to CSx_B

Invalid

WE17 - WE7 - CSN — 3 - CSN ns

MAXCO Output max. delay from internal

driving ADDR/control FFs to

chip outputs.

10 — — ns

MAXCS

Output max. delay from CSx

internal driving FFs to CSx out.

10 — —

MAXDI DATA MAXIMUM delay from

chip input data to its internal FF

5——

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 63

4.6.7 DDR SDRAM Specific Parameters (DDR2/LVDDR2, LPDDR2, and

DDR3)

The DDR2/LVDDR2 interface fully complies with JESD79-2E – DDR2 JEDEC release April, 2008,

supporting DDR2-800 and LVDDR2-800.

The DDR3 interface fully complies with JESD79-3D – DDR3 JEDEC release April 2008 supporting

DDR3-800.

The LPDDR2 interface fully complies with JESD209-2B, supporting LPDDR2-800.

WE43 Input Data Valid to CSx_B

Invalid

MAXCO - MAXCSO + MAXDI MAXCO -

MAXCSO +

MAXDI

—ns

WE44 CSx_B Invalid to Input Data

invalid

00—ns

WE45 CSx_B Valid to BEy_B Valid

(Write access)

WE12 - WE6 + (WBEA - CSA) — 3 + (WBEA - CSA) ns

WE46 BEy_B Invalid to CSx_B Invalid

(Write access)

WE7 - WE13 + (WBEN - CSN) — -3 + (WBEN - CSN) ns

MAXDTI DTACK MAXIMUM delay from

chip dtack input to its internal

FF + 2 cycles for

synchronization

———

WE47 Dtack Active to CSx_B Invalid MAXCO - MAXCSO + MAXDTI MAXCO -

MAXCSO +

MAXDTI

—ns

WE48 CSx_B Invalid to Dtack invalid 0 0 — ns

1Parameters WE4... WE21 value see column BCD = 0 in Table 39.

2All config. parameters (CSA,CSN,WBEA,WBEN,ADVA,ADVN,OEN,OEA,RBEA & RBEN) are in cycle units.

3CS Assertion. This bit field determines when CS signal is asserted during read/write cycles.

4CS Negation. This bit field determines when CS signal is negated during read/write cycles.

5t is axi_clk cycle time.

6BE Assertion. This bit field determines when BE signal is asserted during read cycles.

7BE Negation. This bit field determines when BE signal is negated during read cycles.

Table 40. EIM Asynchronous Timing Parameters Table Relative Chip Select

Ref No. Parameter

Determination by

Synchronous measured

parameters 12

Min

Max

(If 133 MHz is

supported by SOC)

Unit

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

64 Freescale Semiconductor

Electrical Characteristics

Figure 28 and Table 41 show the address and control timing parameters for DDR2 and DDR3.

Figure 28. DDR SDRAM Address and Control Parameters for DDR2 and DDR3

Table 41. DDR SDRAM Timing Parameter Table1 2

1All timings are refer to Vref level cross point.

2 Reference load model is 25 Ω resistor from each of the DDR outputs to VDD_REF.

ID Parameter Symbol

SDCLK = 400 MHz

Units

Min Max

DDR1 SDRAM clock high-level width tCH 0.48 0.52 tCK

DDR2 SDRAM clock low-level width tCL 0.48 0.52 tCK

DDR4 CS, RAS, CAS, CKE, WE, ODT setup time tIS 0.6 — ns

DDR5 CS, RAS, CAS, CKE, WE, ODT hold time tIH 0.6 — ns

DDR6 Address output setup time tIS 0.6 — ns

DDR7 Address output hold time tIH 0.6 — ns

SDCLK

ADDR ROW/BA COL/BA

CAS

RAS

DDR1

DDR2

DDR4

DDR5

DDR6

DDR7

SDCLK

ODT/CKE

DDR4

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 65

Figure 29 and Table 42 show the address and control timing parameters for LPDDR2.

Figure 29. DDR SDRAM Address and Control Timing Parameters for LPDDR2

Figure 30 and Table 43 show the data write timing parameters.

Figure 30. DDR SDRAM Data Write Cycle

Table 42. DDR SDRAM Timing Parameter Table for LPDDR21 2

1All timings are refer to Vref level cross point.

2 Reference load model is 25 Ω resistor from each of the DDR outputs to VDD_REF.

ID Parameter Symbol

SDCLK = 400 MHz

Units

Min Max

LP1 SDRAM clock high-level width tCH 0.45 0.55 tCK

LP2 SDRAM clock low-level width tCL 0.45 0.55 tCK

LP3 CS, CKE setup time tIS 0.3 — ns

LP4 CS, CKE hold time tIH 0.3 — ns

LP3 CA setup time tIS 0.3 — ns

LP4 CA hold time tIH 0.3 — ns

CKE

LP4

LP3

LP4

LP3

LP2

LP3

LP1

SDCLK

SDCLK_B

DQS (output)

DQ (output)

DQM (output)

Data Data Data Data Data Data Data Data

DM DM DM DM DM DM DM DM

DDR17

DDR18 DDR18

DDR21

DDR23

DDR22

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

66 Freescale Semiconductor

Electrical Characteristics

Figure 31 and Table 44 show the data read timing parameters.

Figure 31. DDR SDRAM DQ vs. DQS and SDCLK Read Cycle

Table 43. DDR SDRAM Write Cycle 1 2 3

1All timings are refer to Vref level cross point.

2 Reference load model is 25 Ω resistor from each of the DDR outputs to VDD_REF.

3To receive the reported setup and hold values, write calibration should be performed in order to locate the DQS in the middle

of DQ window.

ID Parameter Symbol

SDCLK = 400 MHz

Unit

Min Max

DDR17 DQ and DQM setup time to DQS (differential strobe) tDS 0.285 — ns

DDR18 DQ and DQM hold time to DQS (differential strobe) tDH 0.285 — ns

DDR21 DQS latching rising transitions to associated clock edges tDQSS -0.25 +0.25 tCK

DDR22 DQS high level width tDQSH 0.45 0.55 tCK

DDR23 DQS low level width tDQSL 0.45 0.55 tCK

Table 44. DDR SDRAM Read Cycle 1

1To receive the reported setup and hold values, read calibration should be performed in order to locate the DQS in the middle

of DQ window.

ID Parameter Symbol

SDCLK = 400 MHz

Unit

Min Max

DDR26 Minimum required DQ valid window width

except from LPDDR2

—0.6 —ns

DDR26(LP

DDR2)

Minimum required DQ valid window width

for LPDDR2

—0.425 —ns

DDR27 DQS to DQ valid data — 0.275 0.475 ns

SDCLK

SDCLK_B

DQS (input)

DQ (input)

DATA

DATADATA

DATA

DATADATA

DDR26

DDR27

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 67

4.7 External Peripheral Interfaces Parameters

The following subsections provide information on external peripheral interfaces.

4.7.1 AUDMUX Timing Parameters

The AUDMUX provides a programmable interconnect logic for voice, audio and data routing between

internal serial interfaces (SSIs) and external serial interfaces (audio and voice codecs). The AC timing of

AUDMUX external pins is governed by the SSI module. For more information, see the respective SSI

electrical specifications found within this document.

4.7.2 CSPI and ECSPI Timing Parameters

This section describes the timing parameters of the CSPI and ECSPI blocks. The CSPI and ECSPI have

separate timing parameters for master and slave modes. The nomenclature used with the CSPI / ECSPI

modules and the respective routing of these signals is shown in Table 45.

4.7.2.1 CSPI Master Mode Timing

Figure 32 depicts the timing of CSPI in master mode. Table 46 lists the CSPI master mode timing

characteristics.

Figure 32. CSPI/ECSPI Master Mode Timing Diagram

Table 45. CSPI Nomenclature and Routing

Block Instance I/O Access

ECSPI-1 GPIO, KPP, DISP0_DAT, CSI0_DAT and EIM_D through IOMUXC

ECSPI-2 DISP0_DAT, CSI0_DAT and EIM through IOMUXC

CSPI DISP0_DAT, EIM_A/D, SD1 and SD2 through IOMUXC

CS1

CS7

CS2

CS4

CS6 CS5

CS8 CS9

SCLK

SSx

MOSI

MISO

RDY

CS10

CS3

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

68 Freescale Semiconductor

Electrical Characteristics

4.7.2.2 CSPI Slave Mode Timing

Figure 33 depicts the timing of CSPI in slave mode. Timing characteristics were not available at the time

of publication.

Figure 33. CSPI/ECSPI Slave Mode Timing Diagram

Table 46. CSPI Master Mode Timing Parameters

ID Parameter Symbol Min Max Unit

CS1 SCLK Cycle Time tclk 60 — ns

CS2 SCLK High or Low Time tSW 26 — ns

CS3 SCLK Rise or Fall1

1See specific I/O AC parameters Section 4.5, “I/O AC Parameters”

tRISE/FALL ——ns

CS4 SSx pulse width tCSLH 26 — ns

CS5 SSx Lead Time (Slave Select setup

time)

tSCS 26 — ns

CS6 SSx Lag Time (SS hold time) tHCS 26 — ns

CS7 MOSI Propagation Delay

(CLOAD =20pF)

tPDmosi -1 21 ns

CS8 MISO Setup Time tSmiso 5—ns

CS9 MISO Hold Time tHmiso 5—ns

CS10 RDY to SSx Time2

2SPI_RDY is sampled internally by ipg_clk and is asynchronous to all other CSPI signals.

tSDRY 5—ns

CS1

CS7 CS8

CS2

CS4

CS6 CS5

CS9

SCLK

SSx

MISO

MOSI

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 69

4.7.2.3 ECSPI Master Mode Timing

Figure 32 depicts the timing of ECSPI in master mode. Table 47 lists the ECSPI master mode timing

characteristics.

4.7.2.4 ECSPI Slave Mode Timing

Figure 33 depicts the timing of ECSPI in slave mode. Table 48 lists the ECSPI slave mode timing

characteristics.

Table 47. ECSPI Master Mode Timing Parameters

ID Parameter Symbol Min Max Unit

CS1 SCLK Cycle Time—Read

SCLK Cycle Time—Write

tclk 30

—ns

CS2 SCLK High or Low Time—Read

SCLK High or Low Time—Write

tSW 14

—ns

CS3 SCLK Rise or Fall1

1See specific I/O AC parameters Section 4.5, “I/O AC Parameters”

tRISE/FALL ——ns

CS4 SSx pulse width tCSLH Half SCLK period — ns

CS5 SSx Lead Time (CS setup time) tSCS 5—ns

CS6 SSx Lag Time (CS hold time) tHCS 5—ns

CS7 MOSI Propagation Delay (CLOAD =20pF) t

PDmosi -0.5 2.5 ns

CS8 MISO Setup Time tSmiso 8.5 — ns

CS9 MISO Hold Time tHmiso 0—ns

CS10 RDY to SSx Time2

2SPI_RDY is sampled internally by ipg_clk and is asynchronous to all other CSPI signals.

tSDRY 5—ns

Table 48. ECSPI Slave Mode Timing Parameters

ID Parameter Symbol Min Max Unit

CS1 SCLK Cycle Time–Read

SCLK Cycle Time–Write

tclk 15

—ns

CS2 SCLK High or Low Time–Read

SCLK High or Low Time–Write

tSW 7

—ns

CS4 SSx pulse width tCSLH Half SCLK period — ns

CS5 SSx Lead Time (CS setup time) tSCS 5—ns

CS6 SSx Lag Time (CS hold time) tHCS 5—ns

CS7 MOSI Setup Time tSmosi 4—ns

CS8 MOSI Hold Time tHmosi 4—ns

CS9 MISO Propagation Delay (CLOAD =20pF) t

PDmiso 417ns

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

70 Freescale Semiconductor

Electrical Characteristics

4.7.3 Enhanced Serial Audio Interface (ESAI) Timing Parameters

The ESAI consists of independent transmitter and receiver sections, each section with its own clock

generator. Table 49 shows the interface timing values. The number field in the table refers to timing signals

found in Figure 34 and Figure 35.

Table 49. Enhanced Serial Audio Interface (ESAI) Timing

No. Characteristics1’2,3

Symbol Expression3Min Max Condition4Unit

62 Clock cycle5tSSICC 4 × Tc

4 × Tc

30.0

—

i ck

63 Clock high period

• For internal clock —2 × Tc − 9.0 6 — —

• For external clock — 2 × Tc15 — —

64 Clock low period

• For internal clock —2 × Tc − 9.0 6 — —

• For external clock — 2 × Tc15 — —

65 SCKR rising edge to FSR out (bl) high —

—

17.0

7.0

x ck

i ck a

66 SCKR rising edge to FSR out (bl) low —

—

17.0

7.0

x ck

i ck a

67 SCKR rising edge to FSR out (wr) high6—

—

19.0

9.0

x ck

i ck a

68 SCKR rising edge to FSR out (wr) low6—

—

19.0

9.0

x ck

i ck a

69 SCKR rising edge to FSR out (wl) high —

—

16.0

6.0

x ck

i ck a

70 SCKR rising edge to FSR out (wl) low —

—

17.0

7.0

x ck

i ck a

71 Data in setup time before SCKR (SCK in synchronous

mode) falling edge

—

12.0

19.0

—

x ck

i ck

72 Data in hold time after SCKR falling edge —

—

3.5

9.0

—

x ck

i ck

73 FSR input (bl, wr) high before SCKR falling edge6—

—

2.0

12.0

—

x ck

i ck a

74 FSR input (wl) high before SCKR falling edge —

—

2.0

12.0

—

x ck

i ck a

75 FSR input hold time after SCKR falling edge —

—

2.5

8.5

—

x ck

i ck a

78 SCKT rising edge to FST out (bl) high —

—

18.0

8.0

x ck

i ck

79 SCKT rising edge to FST out (bl) low —

—

20.0

10.0

x ck

i ck

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 71

80 SCKT rising edge to FST out (wr) high6—

—

20.0

10.0

x ck

i ck

81 SCKT rising edge to FST out (wr) low6 —

—

22.0

12.0

x ck

i ck

82 SCKT rising edge to FST out (wl) high —

—

19.0

9.0

x ck

i ck

83 SCKT rising edge to FST out (wl) low —

—

20.0

10.0

x ck

i ck

84 SCKT rising edge to data out enable from high

impedance

—

22.0

17.0

x ck

i ck

86 SCKT rising edge to data out valid —

—

18.0

13.0

x ck

i ck

87 SCKT rising edge to data out high impedance 77 —

—

21.0

16.0

x ck

i ck

89 FST input (bl, wr) setup time before SCKT falling edge6—

—

2.0

18.0

—

x ck

i ck

90 FST input (wl) setup time before SCKT falling edge —

—

2.0

18.0

—

x ck

i ck

91 FST input hold time after SCKT falling edge —

—

4.0

5.0

—

x ck

i ck

95 HCKR/HCKT clock cycle — 2 x TC15 — — ns

96 HCKT input rising edge to SCKT output — — — 18.0 — ns

97 HCKR input rising edge to SCKR output — — — 18.0 — ns

1VCORE_VDD= 1.00 ± 0.10V

Tj = -40 °C to 125 °C

CL= 50 pF

2i ck = internal clock

x ck = external clock

i ck a = internal clock, asynchronous mode

(asynchronous implies that SCKT and SCKR are two different clocks)

i ck s = internal clock, synchronous mode

(synchronous implies that SCKT and SCKR are the same clock)

3bl = bit length

wl = word length

wr = word length relative

4SCKT(SCKT pin) = transmit clock

SCKR(SCKR pin) = receive clock

FST(FST pin) = transmit frame sync

FSR(FSR pin) = receive frame sync

HCKT(HCKT pin) = transmit high frequency clock

HCKR(HCKR pin) = receive high frequency clock

5For the internal clock, the external clock cycle is defined by Icyc and the ESAI control register.

Table 49. Enhanced Serial Audio Interface (ESAI) Timing (continued)

No. Characteristics1’2,3

Symbol Expression3Min Max Condition4Unit

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

72 Freescale Semiconductor

Electrical Characteristics

Figure 34. ESAI Transmitter Timing

6The word-relative frame sync signal waveform relative to the clock operates in the same manner as the bit-length frame sync

signal waveform, but it spreads from one serial clock before the first bit clock (like the bit length frame sync signal), until the

second-to-last bit clock of the first word in the frame.

7Periodically sampled and not 100% tested.

SCKT

(Input/Output)

FST (Bit)

Out

FST (Word)

Out

Data Out

FST (Bit) In

FST (Word) In

62 64

78 79

82 83

8686

90 91

Last BitFirst Bit

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 73

Figure 35. ESAI Receiver Timing

SCKR

(Input/Output)

FSR (Bit)

Out

FSR (Word)

Out

Data In

FSR (Bit)

FSR (Word)

69 70

74 75

First Bit Last Bit

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

74 Freescale Semiconductor

Electrical Characteristics

4.7.4 Enhanced Secured Digita l Host Controller(eSDHCv2/v3) AC timing

This section describes the electrical information of the eSDHCv2/v3, which includes SD/eMMC4.3

(Single Data Rate) timing and eMMC4.4 (Dual Date Rate) timing.

4.7.4.1 SD/eMMC4.3 (Single Data Rate) AC Timing

Figure 36 depicts the timing of SD/eMMC4.3, and Table 50 lists the SD/eMMC4.3 timing characteristics.

Figure 36. SD/eMMC4.3 Timing

Table 50. SD/eMMC4.3 Interface Timing Specification

ID Parameter Symbols Min Max Unit

Card Input Clock

SD1 Clock Frequency (Low Speed) fPP10 400 kHz

Clock Frequency (SD/SDIO Full Speed/High Speed) fPP20 25/50 MHz

Clock Frequency (MMC Full Speed/High Speed) fPP30 20/52 MHz

Clock Frequency (Identification Mode) fOD 100 400 kHz

SD2 Clock Low Time tWL 7—ns

SD3 Clock High Time tWH 7—ns

SD4 Clock Rise Time tTLH —3ns

SD5 Clock Fall Time tTHL —3ns

eSDHC Output/Card Inputs CMD, DAT (Reference to CLK)

SD6 eSDHCv2 Output Delay (port 1, 2, and 4) tOD -3.5 3.5 ns

eSDHCv3 Output Delay (port 3) tOD -4.5 4.5 ns

SD1

SD3

SD5

SD4

SD7

CMD

output from eSDHCv2 to card DAT1

......

DAT7

DAT0

CMD

input from card to eSDHCv2 DAT1

......

DAT7

DAT0

SCK

SD2

SD8

SD6

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 75

4.7.4.2 eMMC4.4 (Dual Data Rate) eSDHCv3 AC Timing

Figure 37 depicts the timing of eMMC4.4. Table 51 lists the eMMC4.4 timing characteristics. Be aware

that only DATA is sampled on both edges of the clock (not applicable to CMD).

Figure 37. eMMC4.4 Timing

eSDHC Input/Card Outputs CMD, DAT (Reference to CLK)

SD7 eSDHC Input Setup Time tISU 2.5 — ns

SD8 eSDHC Input Hold Time4tIH 2.5 — ns

1In low speed mode, card clock must be lower than 400 kHz, voltage ranges from 2.7 to 3.6 V.

2In normal (full) speed mode for SD/SDIO card, clock frequency can be any value between 0–25 MHz. In high-speed mode,

clock frequency can be any value between 0–50 MHz.

3In normal (full) speed mode for MMC card, clock frequency can be any value between 0–20 MHz. In high-speed mode, clock

frequency can be any value between 0–52 MHz.

4To satisfy hold timing, the delay difference between clock input and cmd/data input must not exceed 2 ns.

Table 51. eMMC4.4 Interface Timing Specification

ID Parameter Symbols Min Max Unit

Card Input Clock

SD1 Clock Frequency (MMC Full Speed/High Speed) fPP 052MHz

eSDHC Output / Card Inputs CMD, DAT (Reference to CLK)

SD2 eSDHC Output Delay tOD -4.5 4.5 ns

Table 50. SD/eMMC4.3 Interface Timing Specification (continued)

ID Parameter Symbols Min Max Unit

SD1

SD2

SD3

output from eSDHCv3 to card DAT1

......

DAT7

DAT0

input from card to eSDHCv3 DAT1

......

DAT7

DAT0

SCK

SD4

SD2

......

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

76 Freescale Semiconductor

Electrical Characteristics

4.7.5 FEC AC Timing Parameters

This section describes the electrical information of the Fast Ethernet Controller (FEC) module. The FEC

is designed to support both 10 and 100 Mbps Ethernet/IEEE 802.3 networks. An external transceiver

interface and transceiver function are required to complete the interface to the media. The FEC supports

the 10/100 Mbps MII (18 pins in total) and the 10 Mbps (only 7-wire interface, which uses 7 of the MII

pins), for connection to an external Ethernet transceiver. For the pin list of MII and 7-wire, see the i.MX53

Reference Manual.

This section describes the AC timing specifications of the FEC. The MII signals are compatible with

transceivers operating at a voltage of 3.3 V.

4.7.5.1 MII Receive Signal Timing

The MII receive signal timing involves the FEC_RXD[3:0], FEC_RX_DV, FEC_RX_ER, and

FEC_RX_CLK signals. The receiver functions correctly up to a FEC_RX_CLK maximum frequency of

25 MHz + 1%. There is no minimum frequency requirement but the processor clock frequency must

exceed twice the FEC_RX_CLK frequency. Table 52 lists the MII receive channel signal timing

parameters and Figure 38 shows MII receive signal timings.

eSDHC Input / Card Outputs CMD, DAT (Reference to CLK)

SD3 eSDHC Input Setup Time tISU 2.5 — ns

SD4 eSDHC Input Hold Time tIH 2.5 — ns

Table 52. MII Receive Signal Timing

No. Characteristics1 2

1FEC_RX_DV, FEC_RX_CLK, and FEC_RXD0 have same timing in 10 Mbps 7-wire interface mode.

2Test conditions: 25pF on each output signal.

Min Max Unit

M1 FEC_RXD[3:0], FEC_RX_DV, FEC_RX_ER to FEC_RX_CLK setup 5 — ns

M2 FEC_RX_CLK to FEC_RXD[3:0], FEC_RX_DV, FEC_RX_ER hold 5 — ns

M3 FEC_RX_CLK pulse width high 35% 65% FEC_RX_CLK period

M4 FEC_RX_CLK pulse width low 35% 65% FEC_RX_CLK period

Table 51. eMMC4.4 Interface Timing Specification (continued)

ID Parameter Symbols Min Max Unit

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 77

Figure 38. MII Receive Signal Timing Diagram

4.7.5.2 MII Transmit Signal Timing

The MII transmit signal timing affects the FEC_TXD[3:0], FEC_TX_EN, FEC_TX_ER, and

FEC_TX_CLK signals. The transmitter functions correctly up to a FEC_TX_CLK maximum frequency

of 25 MHz + 1%. There is no minimum frequency requirement. In addition, the processor clock frequency

must exceed twice the FEC_TX_CLK frequency.

Table 53 lists MII transmit channel timing parameters. Figure 39 shows MII transmit signal timing

diagram for the values listed in Table 53.

Table 53. MII Transmit Signal Timing

Num Characteristic1 2

1FEC_TX_EN, FEC_TX_CLK, and FEC_TXD0 have the same timing in 10 Mbps 7-wire interface mode.

2Test conditions: 25pF on each output signal.

Min Max Unit

M5 FEC_TX_CLK to FEC_TXD[3:0], FEC_TX_EN, FEC_TX_ER invalid 5 — ns

M6 FEC_TX_CLK to FEC_TXD[3:0], FEC_TX_EN, FEC_TX_ER valid — 20 ns

M7 FEC_TX_CLK pulse width high 35% 65% FEC_TX_CLK period

M8 FEC_TX_CLK pulse width low 35% 65% FEC_TX_CLK period

FEC_RX_CLK (input)

FEC_RXD[3:0] (inputs)

FEC_RX_DV

FEC_RX_ER

M1 M2

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78 Freescale Semiconductor

Electrical Characteristics

Figure 39. MII Transmit Signal Timing Diagram

4.7.5.3 MII Async Inputs Signal Timing (FEC_CRS and FEC_COL)

Table 54 lists MII asynchronous inputs signal timing information. Figure 40 shows MII asynchronous

input timings listed in Table 54.

Figure 40. MII Async Inputs Timing Diagram

4.7.5.4 MII Serial Management Channel Timing (FEC_MDIO and FEC_MDC)

Table 55 lists MII serial management channel timings. Figure 41 shows MII serial management channel

timings listed in Table 55. The MDC frequency should be equal to or less than 2.5 MHz to be compliant

with the IEEE 802.3 MII specification. However, the FEC can function correctly with a maximum MDC

frequency of 15 MHz.

Table 54. MII Async Inputs Signal Timing

Num Characteristic 1

1Test conditions: 25pF on each output signal.

Min Max Unit

M92

2FEC_COL has the same timing in 10 Mbit 7-wire interface mode.

FEC_CRS to FEC_COL minimum pulse width 1.5 — FEC_TX_CLK period

Table 55. MII Transmit Signal Timing

ID Characteristics1Min Max Unit

M10 FEC_MDC falling edge to FEC_MDIO output invalid (minimum propagation delay) 0 — ns

M11 FEC_MDC falling edge to FEC_MDIO output valid (max propagation delay) — 5 ns

M12 FEC_MDIO (input) to FEC_MDC rising edge setup 18 — ns

FEC_TX_CLK (input)

FEC_TXD[3:0] (outputs)

FEC_TX_EN

FEC_TX_ER

FEC_CRS, FEC_COL

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 79

Figure 41. MII Serial Management Channel Timing Diagram

4.7.5.5 RMII Mode Timing

In RMII mode, FEC_TX_CLK is used as the REF_CLK which is a 50 MHz ±50 ppm continuous reference

clock. FEC_RX_DV is used as the CRS_DV in RMII, and other signals under RMII mode include

FEC_TX_EN, FEC_TXD[1:0], FEC_RXD[1:0] and optional FEC_RX_ER.

The RMII mode timings are shown in Table 56 and Figure 42.

M13 FEC_MDIO (input) to FEC_MDC rising edge hold 0 — ns

M14 FEC_MDC pulse width high 40

60% FEC_MDC period

M15 FEC_MDC pulse width low 40

60% FEC_MDC period

1Test conditions: 25pF on each output signal.

Table 56. RMII Signal Timing

No. Characteristics1Min Max Unit

M16 REF_CLK(FEC_TX_CLK) pulse width high 35% 65% REF_CLK period

M17 REF_CLK(FEC_TX_CLK) pulse width low 35% 65% REF_CLK period

M18 REF_CLK to FEC_TXD[1:0], FEC_TX_EN invalid 2 — ns

M19 REF_CLK to FEC_TXD[1:0], FEC_TX_EN valid — 16 ns

Table 55. MII Transmit Signal Timing (continued)

ID Characteristics1Min Max Unit

FEC_MDC (output)

FEC_MDIO (output)

M14

M15

M10

M11

M12 M13

FEC_MDIO (input)

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

80 Freescale Semiconductor

Electrical Characteristics

Figure 42. RMII Mode Signal Timing Diagram

4.7.6 Flexible Controller Area Network (FLEXCAN) AC Electrical

Specifications

The electrical characteristics are related to the CAN transceiver external to i.MX53xD such as MC33902

from Freescale.The i.MX53xD has two CAN modules available for systems design. Tx and Rx ports for

both modules are multiplexed with other I/O pins. See the IOMUXC chapter of the i.MX53 Reference

Manual to see which pins expose Tx and Rx pins; these ports are named TXCAN and RXCAN,

respectively.

M20 FEC_RXD[1:0], CRS_DV(FEC_RX_DV), FEC_RX_ER to

REF_CLK setup

4—ns

M21 REF_CLK to FEC_RXD[1:0], FEC_RX_DV, FEC_RX_ER

hold

2—ns

1Test conditions: 25pF on each output signal.

Table 56. RMII Signal Timing (continued)

No. Characteristics1Min Max Unit

REF_CLK (input)

FEC_TX_EN

M16

M17

M18

M19

M20 M21

FEC_RXD[1:0]

FEC_TXD[1:0] (output)

FEC_RX_ER

CRS_DV (input)

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 81

4.7.7 I2C Module Timing Parameters

This section describes the timing parameters of the I2C module. Figure 43 depicts the timing of I2C

module, and Table 57 lists the I2C module timing characteristics.

Figure 43. I2C Bus Timing

Table 57. I2C Module Timing Parameters

ID Parameter

Standard Mode

Supply Voltage =

1.65 V–1.95 V, 2.7 V–3.3 V

Fast Mode

Supply Voltage =

2.7 V–3.3 V Unit

Min Max Min Max

IC1 I2CLK cycle time 10 — 2.5 — µs

IC2 Hold time (repeated) START condition 4.0 — 0.6 — µs

IC3 Set-up time for STOP condition 4.0 — 0.6 — µs

IC4 Data hold time 01

1A device must internally provide a hold time of at least 300 ns for I2DAT signal in order to bridge the undefined region of the

falling edge of I2CLK.

3.452

2The maximum hold time has only to be met if the device does not stretch the LOW period (ID no IC5) of the I2CLK signal.

010.92µs

IC5 HIGH Period of I2CLK Clock 4.0 — 0.6 — µs

IC6 LOW Period of the I2CLK Clock 4.7 — 1.3 — µs

IC7 Set-up time for a repeated START condition 4.7 — 0.6 — µs

IC8 Data set-up time 250 — 1003

3A Fast-mode I2C-bus device can be used in a Standard-mode I2C-bus system, but the requirement of Set-up time (ID No IC7)

of 250 ns must be met. This automatically is the case if the device does not stretch the LOW period of the I2CLK signal.

If such a device does stretch the LOW period of the I2CLK signal, it must output the next data bit to the I2DAT line

max_rise_time (IC9) + data_setup_time (IC7) = 1000 + 250 = 1250 ns (according to the Standard-mode I2C-bus specification)

before the I2CLK line is released.

—ns

IC9 Bus free time between a STOP and START condition 4.7 — 1.3 — µs

IC10 Rise time of both I2DAT and I2CLK signals — 1000 20 + 0.1Cb4

4Cb = total capacitance of one bus line in pF.

300 ns

IC11 Fall time of both I2DAT and I2CLK signals — 300 20 + 0.1Cb4300 ns

IC12 Capacitive load for each bus line (Cb) — 400 — 400 pF

IC10 IC11 IC9

IC2 IC8 IC4 IC7 IC3

IC6

IC10

IC5

IC11 START STOP START

START

I2DAT

I2CLK

IC1

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

82 Freescale Semiconductor

Electrical Characteristics

4.7.8 Image Processing Unit (IPU) Module Parameters

The purpose of the IPU is to provide comprehensive support for the flow of data from an image sensor

and/or to a display device. This support covers all aspects of these activities:

• Connectivity to relevant devices—cameras, displays, graphics accelerators, and TV encoders.

• Related image processing and manipulation: sensor image signal processing, display processing,

image conversions, and other related functions.

• Synchronization and control capabilities, such as avoidance of tearing artifacts.

4.7.8.1 IPU Sensor Interface Signal Mapping

The IPU supports a number of sensor input formats. Table 58 defines the mapping of the Sensor Interface

Pins used for various supported interface formats.

Table 58. Camera Input Signal Cross Reference, Format and Bits per Cycle

Signal

Name1

1CSIx stands for CSI1 or CSI2

RGB565

8 bits

2 cycles

RGB5652

8 bits

3 cycles

RGB6663

8 bits

3 cycles

RGB888

8 bits

3 cycles

YCbCr

8 bits

2 cycles

RGB5654

16 bits

2 cycles

YCbCr5

16 bits

1 cycle

YCbCr6

16 bits

1 cycle

YCbCr7

20 bits

1 cycle

CSIx_DAT0 — — — — — — — 0 C[0]

CSIx_DAT1 — — — — — — — 0 C[1]

CSIx_DAT2 — — — — — — — C[0] C[2]

CSIx_DAT3 — — — — — — — C[1] C[3]

CSIx_DAT4 — — — — — B[0] C[0] C[2] C[4]

CSIx_DAT5 — — — — — B[1] C[1] C[3] C[5]

CSIx_DAT6 — — — — — B[2] C[2] C[4] C[6]

CSIx_DAT7 — — — — — B[3] C[3] C[5] C[7]

CSIx_DAT8 — — — — — B[4] C[4] C[6] C[8]

CSIx_DAT9 — — — — — G[0] C[5] C[7] C[9]

CSIx_DAT10 — — — — — G[1] C[6] 0 Y[0]

CSIx_DAT11 — — — — — G[2] C[7] 0 Y[1]

CSIx_DAT12 B[0], G[3] R[2],G[4],B[2] R/G/B[4] R/G/B[0] Y/C[0] G[3] Y[0] Y[0] Y[2]

CSIx_DAT13 B[1], G[4] R[3],G[5],B[3] R/G/B[5] R/G/B[1] Y/C[1] G[4] Y[1] Y[1] Y[3]

CSIx_DAT14 B[2], G[5] R[4],G[0],B[4] R/G/B[0] R/G/B[2] Y/C[2] G[5] Y[2] Y[2] Y[4]

CSIx_DAT15 B[3], R[0] R[0],G[1],B[0] R/G/B[1] R/G/B[3] Y/C[3] R[0] Y[3] Y[3] Y[5]

CSIx_DAT16 B[4], R[1] R[1],G[2],B[1] R/G/B[2] R/G/B[4] Y/C[4] R[1] Y[4] Y[4] Y[6]

CSIx_DAT17 G[0], R[2] R[2],G[3],B[2] R/G/B[3] R/G/B[5] Y/C[5] R[2] Y[5] Y[5] Y[7]

CSIx_DAT18 G[1], R[3] R[3],G[4],B[3] R/G/B[4] R/G/B[6] Y/C[6] R[3] Y[6] Y[6] Y[8]

CSIx_DAT19 G[2], R[4] R[4],G[5],B[4] R/G/B[5] R/G/B[7] Y/C[7] R[4] Y[7] Y[7] Y[9]

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i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 83

4.7.8.2 Sensor Interface Timings

There are three camera timing modes supported by the IPU.

4.7.8.2.1 BT.656 and BT.1120 Video Mode

Smart camera sensors, which include imaging processing, usually support video mode transfer. They use

an embedded timing syntax to replace the SENSB_VSYNC and SENSB_HSYNC signals. The timing

syntax is defined by the BT.656/BT.1120 standards.

This operation mode follows the recommendations of ITU BT.656/ ITU BT.1120 specifications. The only

control signal used is SENSB_PIX_CLK. Start-of-frame and active-line signals are embedded in the data

stream. An active line starts with a SAV code and ends with a EAV code. In some cases, digital blanking

is inserted in between EAV and SAV code. The CSI decodes and filters out the timing-coding from the data

stream, thus recovering SENSB_VSYNC and SENSB_HSYNC signals for internal use. On BT.656 one

component per cycle is received over the SENSB_DATA bus. On BT.1120 two components per cycle are

received over the SENSB_DATA bus.

4.7.8.2.2 Gated Clock Mode

The SENSB_VSYNC, SENSB_HSYNC, and SENSB_PIX_CLK signals are used in this mode. See

Figure 44.

Figure 44. Gated Clock Mode Timing Diagram

A frame starts with a rising edge on SENSB_VSYNC (all the timings correspond to straight polarity of the

corresponding signals). Then SENSB_HSYNC goes to high and hold for the entire line. Pixel clock is valid

as long as SENSB_HSYNC is high. Data is latched at the rising edge of the valid pixel clocks.

2The MSB bits are duplicated on LSB bits implementing color extension

3The two MSB bits are duplicated on LSB bits implementing color extension

4RGB 16 bits— Supported in two ways: (1) As a “generic data” input, with no on-the-fly processing; (2) With on-the-fly

processing, but only under some restrictions on the control protocol.

5YCbCr 16 bits— Supported as a “generic-data” input, with no on-the-fly processing.

6YCbCr 16 bits— Supported as a sub-case of the YCbCr, 20 bits, under the same conditions (BT.1120 protocol).

7YCbCr, 20 bits— Supported only within the BT.1120 protocol (syncs embedded within the data stream).

SENSB_VSYNC

SENSB_HSYNC

SENSB_PIX_CLK

SENSB_DATA[19:0] invalid

1st byte

n+1th frame

invalid

1st byte

nth frame

Active Line

Start of Frame

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

84 Freescale Semiconductor

Electrical Characteristics

SENSB_HSYNC goes to low at the end of line. Pixel clocks then become invalid and the CSI stops

receiving data from the stream. For next line the SENSB_HSYNC timing repeats. For next frame the

SENSB_VSYNC timing repeats.

4.7.8.2.3 Non-Gated Clock Mode

The timing is the same as the gated-clock mode (described in Section 4.7.8.2.2, “Gated Clock Mode,”)

except for the SENSB_HSYNC signal, which is not used (see Figure 45). All incoming pixel clocks are

valid and cause data to be latched into the input FIFO. The SENSB_PIX_CLK signal is inactive (states

low) until valid data is going to be transmitted over the bus.

Figure 45. Non-Gated Clock Mode Timing Diagram

The timing described in Figure 45 is that of a typical sensor. Some other sensors may have a slightly

different timing. The CSI can be programmed to support rising/falling-edge triggered SENSB_VSYNC;

active-high/low SENSB_HSYNC; and rising/falling-edge triggered SENSB_PIX_CLK.

4.7.8.3 Electrical Characteristics

Figure 46 depicts the sensor interface timing. SENSB_MCLK signal described here is not generated by

the IPU. Table 59 lists the sensor interface timing characteristics.

Figure 46. Sensor Interface Timing Diagram

SENSB_VSYNC

SENSB_PIX_CLK

SENSB_DATA[19:0] invalid

1st byte

n+1th frame

invalid

1st byte

nth frame

Start of Frame

IP3

SENSB_DATA,

SENSB_VSYNC,

IP2 1/IP1

SENSB_PIX_CLK

(Sensor Output)

SENSB_HSYNC

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 85

4.7.8.4 IPU Display Interface Signal Mapping

The IPU supports a number of display output video formats. Table 60 defines the mapping of the Display

Interface Pins used during various supported video interface formats.

Table 59. Sensor Interface Timing Characteristics

ID Parameter Symbol Min Max Unit

IP1 Sensor output (pixel) clock frequency Fpck 0.01 180 MHz

IP2 Data and control setup time Tsu 2 — ns

IP3 Data and control holdup time Thd 1 — ns

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

86 Freescale Semiconductor

Electrical Characteristics

Table 60. Video Signal Cross-Reference

i.MX53xD LCD

Comment1

Port Name

(x=0, 1)

RGB,

Signal

Name

(General)

RGB/TV Signal Allocation (Example) Smart

16-bit

RGB

18-bit

RGB

24 Bit

RGB

8-bit

YCrCb2

16-bit

YCrCb

20-bit

YCrCb

Signal

Name

DISPx_DAT0 DAT[0] B[0] B[0] B[0] Y/C[0] C[0] C[0] DAT[0] The restrictions are as follows:

a) There are maximal three

continuous groups of bits that

could be independently mapped to

the external bus.

Groups should not be overlapped.

b) The bit order is expressed in

each of the bit groups, for example

B[0] = least significant blue pixel

bit

DISPx_DAT1 DAT[1] B[1] B[1] B[1] Y/C[1] C[1] C[1] DAT[1]

DISPx_DAT2 DAT[2] B[2] B[2] B[2] Y/C[2] C[2] C[2] DAT[2]

DISPx_DAT3 DAT[3] B[3] B[3] B[3] Y/C[3] C[3] C[3] DAT[3]

DISPx_DAT4 DAT[4] B[4] B[4] B[4] Y/C[4] C[4] C[4] DAT[4]

DISPx_DAT5 DAT[5] G[0] B[5] B[5] Y/C[5] C[5] C[5] DAT[5]

DISPx_DAT6 DAT[6] G[1] G[0] B[6] Y/C[6] C[6] C[6] DAT[6]

DISPx_DAT7 DAT[7] G[2] G[1] B[7] Y/C[7] C[7] C[7] DAT[7]

DISPx_DAT8 DAT[8] G[3] G[2] G[0] — Y[0] C[8] DAT[8]

DISPx_DAT9 DAT[9] G[4] G[3] G[1] — Y[1] C[9] DAT[9]

DISPx_DAT10 DAT[10] G[5] G[4] G[2] — Y[2] Y[0] DAT[10]

DISPx_DAT11 DAT[11] R[0] G[5] G[3] — Y[3] Y[1] DAT[11]

DISPx_DAT12 DAT[12] R[1] R[0] G[4] — Y[4] Y[2] DAT[12]

DISPx_DAT13 DAT[13] R[2] R[1] G[5] — Y[5] Y[3] DAT[13]

DISPx_DAT14 DAT[14] R[3] R[2] G[6] — Y[6] Y[4] DAT[14]

DISPx_DAT15 DAT[15] R[4] R[3] G[7] — Y[7] Y[5] DAT[15]

DISPx_DAT16 DAT[16] — R[4] R[0] — — Y[6] —

DISPx_DAT17 DAT[17] — R[5] R[1] — — Y[7] —

DISPx_DAT18 DAT[18] — — R[2] — — Y[8] —

DISPx_DAT19 DAT[19] — — R[3] — — Y[9] —

DISPx_DAT20 DAT[20] — — R[4] — — — —

DISPx_DAT21 DAT[21] — — R[5] — — — —

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 87

DISPx_DAT22 DAT[22] — — R[6] — — — — —

DISPx_DAT23 DAT[23] — — R[7] — — — — —

DIx_DISP_CLK PixCLK — —

DIx_PIN1 — VSYNC_IN May be required for anti-tearing

DIx_PIN2 HSYNC — —

DIx_PIN3 VSYNC — VSYNC out

DIx_PIN4 — — Additional frame/row synchronous

signals with programmable timing

DIx_PIN5 — —

DIx_PIN6 — —

DIx_PIN7 — —

DIx_PIN8 — —

DIx_D0_CS — CS0 —

DIx_D1_CS — CS1 Alternate mode of PWM output for

contrast or brightness control

DIx_PIN11 — WR —

DIx_PIN12 — RD —

DIx_PIN13 — RS1 Register select signal

DIx_PIN14 — RS2 Optional RS2

DIx_PIN15 DRDY/DV DRDY Data validation/blank, data enable

DIx_PIN16 — — Additional data synchronous

signals with programmable

features/timing

DIx_PIN17 Q —

1 Signal mapping (both data and control/synchronization) is flexible. The table provides examples.

2This mode works in compliance with recommendation ITU-R BT.656. The timing reference signals (frame start, frame end, line

start, and line end) are embedded in the 8-bit data bus. Only video data is supported, transmission of non-video related data

during blanking intervals is not supported.

Table 60. Video Signal Cross-Reference (continued)

i.MX53xD LCD

Comment1

Port Name

(x=0, 1)

RGB,

Signal

Name

(General)

RGB/TV Signal Allocation (Example) Smart

16-bit

RGB

18-bit

RGB

24 Bit

RGB

8-bit

YCrCb2

16-bit

YCrCb

20-bit

YCrCb

Signal

Name

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

88 Freescale Semiconductor

Electrical Characteristics

NOTE

Table 60 provides information for both the Disp0 and Disp1 ports. However,

Disp1 port has reduced pinout depending on IOMUXC configuration and

therefore may not support all the above configurations. See the IOMUXC

table for details.

4.7.8.5 IPU Display Interface Timing

The IPU Display Interface supports two kinds of display accesses: synchronous and asynchronous. There

are two groups of external interface pins to provide synchronous and asynchronous controls accordantly.

4.7.8.5.1 Synchronous Controls

The synchronous control changes its value as a function of a system or of an external clock. This control

has a permanent period and a permanent wave form.

There are special physical outputs to provide synchronous controls:

• The ipp_disp_clk is a dedicated base synchronous signal that is used to generate a base display

(component, pixel) clock for a display.

• The ipp_pin_1– ipp_pin_7 are general purpose synchronous pins, that can be used to provide

HSYNC, VSYNC, DRDY or any else independent signal to a display.

The IPU has a system of internal binding counters for internal events (such as HSYNC/VSYCN and so on)

calculation. The internal event (local start point) is synchronized with internal DI_CLK. A suitable control

starts from the local start point with predefined UP and DOWN values to calculate control’s changing

points with half DI_CLK resolution. A full description of the counters system can be found in the IPU

chapter of the i.MX53 Reference Manual.

4.7.8.5.2 Asynchronous Controls

The asynchronous control is a data-oriented signal that changes its value with an output data according to

additional internal flags coming with the data.

There are special physical outputs to provide asynchronous controls, as follows:

• The ipp_d0_cs and ipp_d1_cs pins are dedicated to provide chip select signals to two displays.

• The ipp_pin_11– ipp_pin_17 are general purpose asynchronous pins, that can be used to provide

WR. RD, RS or any other data oriented signal to display.

NOTE

The IPU has independent signal generators for asynchronous signals

toggling. When a DI decides to put a new asynchronous data in the bus, a

new internal start (local start point) is generated. The signals generators

calculate predefined UP and DOWN values to change pins states with half

DI_CLK resolution.

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 89

4.7.8.6 Synchronous Interfaces to Standard Active Matrix TFT LCD Panels

4.7.8.6.1 IPU Display Operating Signals

The IPU uses four control signals and data to operate a standard synchronous interface:

• IPP_DISP_CLK—Clock to display

• HSYNC—Horizontal synchronization

• VSYNC—Vertical synchronization

• DRDY—Active data

All synchronous display controls are generated on the base of an internally generated “local start point”.

The synchronous display controls can be placed on time axis with DI’s offset, up and down parameters.

The display access can be whole number of DI clock (Tdiclk) only. The IPP_DATA can not be moved

relative to the local start point. The data bus of the synchronous interface is output direction only.

4.7.8.6.2 LCD Interface Functional Description

Figure 47 depicts the LCD interface timing for a generic active matrix color TFT panel. In this figure

signals are shown with negative polarity. The sequence of events for active matrix interface timing is:

• DI_CLK internal DI clock, used for calculation of other controls.

• IPP_DISP_CLK latches data into the panel on its negative edge (when positive polarity is selected).

In active mode, IPP_DISP_CLK runs continuously.

• HSYNC causes the panel to start a new line. (Usually IPP_PIN_2 is used as HSYNC.)

• VSYNC causes the panel to start a new frame. It always encompasses at least one HSYNC pulse.

(Usually IPP_PIN_3 is used as VSYNC.)

• DRDY acts like an output enable signal to the CRT display. This output enables the data to be

shifted onto the display. When disabled, the data is invalid and the trace is off.

(DRDY can be used either synchronous or asynchronous generic purpose pin as well.)

Figure 47. Interface Timing Diagram for TFT (Active Matrix) Panels

123 mm-1

HSYNC

VSYNC

HSYNC

LINE 1 LINE 2 LINE 3 LINE 4 LINE n-1 LINE n

DRDY

IPP_DISP_CLK

IPP_DATA

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90 Freescale Semiconductor

Electrical Characteristics

4.7.8.6.3 TFT Panel Sync Pulse Timing Diagrams

Figure 48 depicts the horizontal timing (timing of one line), including both the horizontal sync pulse and

the data. All the parameters shown in the figure are programmable. All controls are started by

corresponding internal events—local start points. The timing diagrams correspond to inverse polarity of

the IPP_DISP_CLK signal and active-low polarity of the HSYNC, VSYNC, and DRDY signals.

Figure 48. TFT Panels Timing Diagram—Horizontal Sync Pulse

Figure 49 depicts the vertical timing (timing of one frame). All parameters shown in the figure are

programmable.

Figure 49. TFT Panels Timing Diagram—Vertical Sync Pulse

DI clock

VSYNC

HSYNC

DRDY

D0 D1

IP5o

IP13o

IP9o

IP8o IP8

IP9

IP10

IP7

IP5

IP6

local start point

IPP_DISP_CLK

IPP_DATA

IP14

VSYNC

HSYNC

DRDY

Start of frame End of frame

IP12

IP15

IP13

IP11

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 91

Table 61 shows timing characteristics of signals presented in Figure 48 and Figure 49.

Table 61. Synchronous Display Interface Timing Characteristics (Pixel Level)

ID Parameter Symbol Value Description Unit

IP5 Display interface clock period Tdicp (1) Display interface clock. IPP_DISP_CLK ns

IP6 Display pixel clock period Tdpcp DISP_CLK_PER_PIXEL

× Tdicp

Time of translation of one pixel to display,

DISP_CLK_PER_PIXEL—number of pixel

components in one pixel (1.n). The

DISP_CLK_PER_PIXEL is virtual

parameter to define Display pixel clock

period.

The DISP_CLK_PER_PIXEL is received by

DC/DI one access division to n

components.

IP7 Screen width time Tsw (SCREEN_WIDTH)

× Tdicp

SCREEN_WIDTH—screen width in,

interface clocks. horizontal blanking

included.

The SCREEN_WIDTH should be built by

suitable DI’s counter2.

IP8 HSYNC width time Thsw (HSYNC_WIDTH) HSYNC_WIDTH—Hsync width in DI_CLK

with 0.5 DI_CLK resolution. Defined by DI’s

counter.

IP9 Horizontal blank interval 1 Thbi1 BGXP × Tdicp BGXP—width of a horizontal blanking

before a first active data in a line (in

interface clocks). The BGXP should be built

by suitable DI’s counter.

IP10 Horizontal blank interval 2 Thbi2 (SCREEN_WIDTH -

BGXP - FW) × Tdicp

Width a horizontal blanking after a last

active data in a line (in interface clocks)

FW—with of active line in interface clocks.

The FW should be built by suitable DI’s

counter.

IP12 Screen height Tsh (SCREEN_HEIGHT)

× Tsw

SCREEN_HEIGHT— screen height in lines

with blanking.

The SCREEN_HEIGHT is a distance

between 2 VSYNCs.

The SCREEN_HEIGHT should be built by

suitable DI’s counter.

IP13 VSYNC width Tvsw VSYNC_WIDTH VSYNC_WIDTH—Vsync width in DI_CLK

with 0.5 DI_CLK resolution. Defined by DI’s

counter

IP14 Vertical blank interval 1 Tvbi1 BGYP × Tsw BGYP—width of first Vertical

blanking interval in line.The BGYP should

be built by suitable DI’s counter.

IP15 Vertical blank interval 2 Tvbi2 (SCREEN_HEIGHT -

BGYP - FH) × Tsw

Width of second Vertical

blanking interval in line.The FH should be

built by suitable DI’s counter.

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92 Freescale Semiconductor

Electrical Characteristics

The maximal accuracy of UP/DOWN edge of controls is:

IP5o Offset of IPP_DISP_CLK Todicp DISP_CLK_OFFSET

× Tdiclk

DISP_CLK_OFFSET—offset of

IPP_DISP_CLK edges from local start

point, in DI_CLK×2

(0.5 DI_CLK Resolution)

Defined by DISP_CLK counter

IP13o Offset of VSYNC Tovs VSYNC_OFFSET

× Tdiclk

VSYNC_OFFSET—offset of Vsync edges

from a local start point, when a Vsync

should be active, in DI_CLK×2

(0.5 DI_CLK Resolution).The

VSYNC_OFFSET should be built by

suitable DI’s counter.

IP8o Offset of HSYNC Tohs HSYNC_OFFSET

× Tdiclk

HSYNC_OFFSET—offset of Hsync edges

from a local start point, when a Hsync

should be active, in DI_CLK×2

(0.5 DI_CLK Resolution).The

HSYNC_OFFSET should be built by

suitable DI’s counter.

IP9o Offset of DRDY Todrdy DRDY_OFFSET

× Tdiclk

DRDY_OFFSET—offset of DRDY edges

from a suitable local start point, when a

corresponding data has been set on the

bus, in DI_CLK×2

(0.5 DI_CLK Resolution)

The DRDY_OFFSET should be built by

suitable DI’s counter.

1Display interface clock period immediate value.

DISP_CLK_PERIOD—number of DI_CLK per one Tdicp. Resolution 1/16 of DI_CLK.

DI_CLK_PERIOD—relation of between programing clock frequency and current system clock frequency

Display interface clock period average value.

2DI’s counter can define offset, period and UP/DOWN characteristic of output signal according to programed parameters of the

counter. Same of parameters in the table are not defined by DI’s registers directly (by name), but can be generated by

corresponding DI’s counter. The SCREEN_WIDTH is an input value for DI’s HSYNC generation counter. The distance

between HSYNCs is a SCREEN_WIDTH.

Table 61. Synchronous Display Interface Timing Characteristics (Pixel Level) (continued)

ID Parameter Symbol Value Description Unit

Tdicp

Tdiclk DISP_CLK_PERIOD

DI_CLK_PERIOD

----------------------------------------------------

× for integer DISP_CLK_PERIOD

DI_CLK_PERIOD

----------------------------------------------------,

Tdiclk floor DISP_CLK_PERIOD

DI_CLK_PERIOD

---------------------------------------------------- 0.5 0.5±+

⎝⎠

⎛⎞

for fractional DISP_CLK_PERIOD

DI_CLK_PERIOD

----------------------------------------------------,

⎩

⎪

⎨

⎪

⎧

Tdicp Tdiclk DISP_CLK_PERIOD

DI_CLK_PERIOD

----------------------------------------------------

×=

Accuracy 0.5 Tdiclk

×()0.62ns±=

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 93

The maximal accuracy of UP/DOWN edge of IPP_DATA is:

The DISP_CLK_PERIOD, DI_CLK_PERIOD parameters are programmed through the registers.

Figure 50 depicts the synchronous display interface timing for access level. The DISP_CLK_DOWN and

DISP_CLK_UP parameters are set through the Register. Table 62 lists the synchronous display interface

timing characteristics.

Figure 50. Synchronous Display Interface Timing Diagram—Access Level

Table 62. Synchronous Display Interface Timing Characteristics (Access Level)

ID Parameter Symbol Min Typ1

1The exact conditions have not been finalized, but will likely match the current customer requirement for their specific display.

These conditions may be chip specific.

Max Unit

IP16 Display interface clock

low time

Tckl Tdicd-Tdicu-1.24 Tdicd2-Tdicu3Tdicd-Tdicu+1.24 ns

IP17 Display interface clock

high time

Tckh Tdicp-Tdicd+Tdicu-1.24 Tdicp-Tdicd+Tdicu Tdicp-Tdicd+Tdicu+1.2 ns

IP18 Data setup time Tdsu Tdicd-1.24 Tdicu — ns

IP19 Data holdup time Tdhd Tdicp-Tdicd-1.24 Tdicp-Tdicu — ns

IP20o Control signals offset

times (defines for each

pin)

Tocsu Tocsu-1.24 Tocsu Tocsu+1.24 ns

IP20 Control signals setup

time to display

interface clock

(defines for each pin)

Tcsu Tdicd-1.24-Tocsu%Tdicp Tdicu — ns

Accuracy Tdiclk 0.62ns±=

IP19 IP18

IP20

VSYNC

IP17IP16

DRDY

HSYNC

other controls

IP20o

local start point

Tdicd

Tdicu

IPP_DISP_CLK

IPP_DATA

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94 Freescale Semiconductor

Electrical Characteristics

4.7.8.7 Interface to a TV Encoder (TVDAC)

The interface has an 8-bit data bus, transferring a single 8-bit value (Y/U/V) in each cycle. The timing of

the interface is described in Figure 51.

NOTE

• The frequency of the clock DISP_CLK is 27 MHz (within 10%)

• The HSYNC, VSYNC signals are active low.

• The DRDY signal is shown as active high.

• The transition to the next row is marked by the negative edge of the

HSYNC signal. It remains low for a single clock cycle.

• The transition to the next field/frame is marked by the negative edge of

the VSYNC signal. It remains low for at least one clock cycles.

— At a transition to an odd field (of the next frame), the negative edges

of VSYNC and HSYNC coincide.

— At a transition is to an even field (of the same frame), they do not

coincide.

• The active intervals—during which data is transferred—are marked by

the HSYNC signal being high.

2Display interface clock down time

3Display interface clock up time where CEIL(X) rounds the elements of X to the nearest integers towards infinity.

Tdicd 1

---T

diclk ceil×2 DISP_CLK_DOWN×

DI_CLK_PERIOD

-----------------------------------------------------------

⎝⎠

⎛⎞

Tdicu 1

---T

diclk ceil×2 DISP_CLK_UP×

DI_CLK_PERIOD

------------------------------------------------

⎝⎠

⎛⎞

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 95

Figure 51. TV Encoder Interface Timing Diagram

HSYNC

VSYNC

Cb Y CrCb Y Cr Y

Pixel Data Timing

Line and Field Timing - NTSC

Even Field Odd Field

Odd Field Even Field

624621

311308

Line and Field Timing - PAL

HSYNC

DRDY

VSYNC

HSYNC

DRDY

VSYNC

Even Field Odd Field

Odd Field Even Field

1523

262261

DRDY

HSYNC

DRDY

VSYNC

HSYNC

VSYNC

524 525 2 3 4 10

263 264 265 266 267 268 269 273

622 623 625 1 2 23

309 310 312 313 314 336

316315

DRDY

DISP_CLK

IPP_DATA

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

96 Freescale Semiconductor

Electrical Characteristics

4.7.8.7.1 TVEv2 TV Encoder Performance Specifications

The TV encoder output specifications are shown in Table 63. All the parameters in the table are defined

under the following conditions:

•R

set = 1.05 kΩ±1%, resistor on TVDAC_VREF pin to GND

•R

load = 37.5 Ω±1%, output load to the GND

Table 63. TV Encoder Video Performance Specifications

Parameter Conditions Min Typ Max Unit

DAC STATIC PERFORMANCE

Resolution1——10—Bits

Integral Nonlinearity (INL)2— — 1 2 LSBs

Differential Nonlinearity (DNL) 2— — 0.6 1 LSBs

Channel-to-channel gain matching2——2—%

Full scale output voltage2Rset = 1.05 kΩ±1%

Rload = 37.5 Ω±1% 1.24 1.306 1.37 V

DAC DYNAMIC PERFORMANCE

Spurious Free Dynamic Range (SFDR) Fout = 3.38 MHz

Fsamp = 216 MHz

—59— dBc

Spurious Free Dynamic Range (SFDR) Fout = 8.3 MHz

Fsamp = 297 MHz

—54— dBc

VIDEO PERFORMANCE IN SD MODE2

Short Term Jitter (Line to Line) — — 2.5 — ±ns

Long Term Jitter (Field to Field) — — 3.5 — ±ns

Frequency Response 0–4.0 MHz -0.1 — 0.1 dB

5.75 MHz -0.7 — 0 dB

Luminance Nonlinearity — — 0.5 — ±%

Differential Gain — — 0.35 — %

Differential Phase — — 0.6 — Degrees

Signal-to-Noise Ratio (SNR) Flat field full bandwidth — 75 — dB

Hue Accuracy — — 0.8 — ±Degrees

Color Saturation Accuracy — — 1.5 — ±%

Chroma AM Noise — — -70 — dB

Chroma PM Noise — — -47 — dB

Chroma Nonlinear Phase — — 0.5 — ±Degrees

Chroma Nonlinear Gain — — 2.5 — ±%

Chroma/Luma Intermodulation — — 0.1 — ±%

Chroma/Luma Gain Inequality — — 1.0 — ±%

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 97

4.7.8.8 Asynchronous Interfaces

The following sections describes the types of asynchronous interfaces.

4.7.8.8.1 Standard Parallel Interfaces

The IPU has four signal generator machines for asynchronous signal. Each machine generates IPU’s

internal control levels (0 or 1) by UP and DOWN that are defined in registers. Each asynchronous pin has

a dynamic connection with one of the signal generators. This connection is redefined again with a new

display access (pixel/component). The IPU can generate control signals according to system 80/68

requirements. The burst length is received as a result from predefined behavior of the internal signal

generator machines.

The access to a display is realized by the following:

• CS (IPP_CS) chip select

• WR (IPP_PIN_11) write strobe

• RD (IPP_PIN_12) read strobe

• RS (IPP_PIN_13) Register select (A0)

Both system 80 and system 68k interfaces are supported for all described modes as depicted in Figure 52,

Figure 53, Figure 54, and Figure 55. The timing images correspond to active-low IPP_CS, WR and RD

signals.

Each asynchronous access is defined by an access size parameter. This parameter can be different between

different kinds of accesses. This parameter defines a length of windows, when suitable controls of the

current access are valid. A pause between two different display accesses can be guaranteed by programing

suitable access sizes. There are no minimal/maximal hold/setup times hard defined by DI. Each control

signal can be switched at any time during access size.

Chroma/Luma Delay Inequality — — 1.0 — ±ns

VIDEO PERFORMANCE IN HD MODE2

Luma Frequency Response 0–30 MHz -0.2 — 0.2 dB

Chroma Frequency Response 0–15 MHz, YCbCr 422 mode -0.2 — 0.2 dB

Luma Nonlinearity — — 3.2 — %

Chroma Nonlinearity — — 3.4 — %

Luma Signal-to-Noise Ratio 0–30 MHz — 62 — dB

Chroma Signal-to-Noise Ratio 0–15 MHz — 72 — dB

1Guaranteed by design.

2Guaranteed by characterization.

Table 63. TV Encoder Video Performance Specifications (continued)

Parameter Conditions Min Typ Max Unit

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

98 Freescale Semiconductor

Electrical Characteristics

Figure 52. Asynchronous Parallel System 80 Interface (Type 1) Timing Diagram

Burst access mode with sampling by CS signal

Single access mode (all control signals are not active for one display interface clock after each display access)

IPP_CS

IPP_DATA

IPP_CS

IPP_DATA

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 99

Figure 53. Asynchronous Parallel System 80 Interface (Type 2) Timing Diagram

Burst access mode with sampling by WR/RD signals

Single access mode (all control signals are not active for one display interface clock after each display access)

IPP_CS

IPP_DATA

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

100 Freescale Semiconductor

Electrical Characteristics

Figure 54. Asynchronous Parallel System 68k Interface (Type 1) Timing Diagram

(READ/WRITE)

(ENABLE)

(READ/WRITE)

(ENABLE)

Burst access mode with sampling by CS signal

Single access mode (all control signals are not active for one display interface clock after each display access)

IPP_CS

IPP_DATA

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 101

Figure 55. Asynchronous Parallel System 68k Interface (Type 2) Timing Diagram

Display operation can be performed with IPP_WAIT signal. The DI reacts to the incoming IPP_WAIT

signal with 2 DI_CLK delay. The DI finishes a current access and a next access is postponed until

IPP_WAIT release. Figure 56 shows timing of the parallel interface with IPP_WAIT control.

(READ/WRITE)

(ENABLE)

(READ/WRITE)

(ENABLE)

Burst access mode with sampling by ENABLE signal

Single access mode (all control signals are not active for one display interface clock after each display access)

IPP_CS

IPP_DATA

IPP_CS

IPP_DATA

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

102 Freescale Semiconductor

Electrical Characteristics

Figure 56. Parallel Interface Timing Diagram—Read Wait States

4.7.8.8.2 Asynchronous Parallel Interface Timing Parameters

Figure 57 depicts timing of asynchronous parallel interfaces based on the system 80 and system 68k

interfaces. Table 65 shows timing characteristics at display access level. All timing diagrams are based

on active low control signals (signals polarity is controlled through the DI_DISP_SIG_POL register).

DI clock

IPP_DATA

IPP_WAIT

IPP_DATA_IN

waiting

IP39

IPP_CS

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 103

Figure 57. Asynchronous Parallel Interface Timing Diagram

Table 64. Asynchronous Display Interface Timing Parameters (Pixel Level)

ID Parameter Symbol Value Description Unit

IP28a Address Write system cycle time Tcycwa ACCESS_SIZE_# predefined value in DI REGISTER ns

IP28d Data Write system cycle time Tcycwd ACCESS_SIZE_# predefined value in DI REGISTER ns

IP29 RS start Tdcsrr UP# RS strobe switch, predefined value

in DI REGISTER

IP30 CS start Tdcsc UP# CS strobe switch, predefined value

in DI REGISTER

IP31 CS hold Tdchc DOWN# CS strobe release, predefined

value in DI REGISTER

—

IP32 RS hold Tdchrr DOWN# RS strobe release, predefined

value in DI REGISTER

—

IP35 Write start Tdcsw UP# write strobe switch, predefined

value in DI REGISTER

IP36 Controls hold time for write Tdchw DOWN# write strobe release, predefined

value in DI REGISTER

DI clock

A0 D0 D1

PP_DATA_IN D2 D3

local start point

IP27

IP28d

IP28a

local start point

IP37

IP33

IP35

IP38

IP34

IP36

IP29

IP31

IP32

IP47 IP30

IPP_CS

IPP_DATA

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

104 Freescale Semiconductor

Electrical Characteristics

Table 65. Asynchronous Parallel Interface Timing Parameters (Access Level)

ID Parameter Symbol Min Typ1

1The exact conditions have not been finalized, but will likely match the current customer requirement for their specific display.

These conditions may be chip specific.

Max Unit

IP28 Write system cycle time Tcycw Tdicpw - 1.24 Tdicpw2

2Display period value for write

ACCESS_SIZE is predefined in REGISTER.

Tdicpw+1.24 ns

IP29 RS start Tdcsrr Tdicurs - 1.24 Tdicurs Tdicurs+1.24 ns

IP30 CS start Tdcsc Tdicucs - 1.24 Tdicur Tdicucs+1.24 ns

IP31 CS hold Tdchc Tdicdcs - Tdicucs - 1.24 Tdicdcs3-Tdicucs4

3Display control down for CS

DISP_DOWN is predefined in REGISTER.

4Display control up for CS

DISP_UP is predefined in REGISTER.

Tdicdcs - Tdicucs+1.24 ns

IP32 RS hold Tdchrr Tdicdrs - Tdicurs - 1.24 Tdicdrs5-Tdicurs6

5Display control down for RS

DISP_DOWN is predefined in REGISTER.

6Display control up for RS

DISP_UP is predefined in REGISTER.

Tdicdrs - Tdicurs+1.24 ns

IP35 Controls setup time for

write

Tdcsw Tdicuw - 1.24 Tdicuw Tdicuw+1.24 ns

IP36 Controls hold time for

write

Tdchw Tdicdw - Tdicuw - 1.24 Tdicpw7-Tdicuw8Tdicdw-Tdicuw+1.24 ns

IP38 Slave device data hold

time8

Troh Tdrp - Tlbd - Tdicdr+1.2

— Tdicpr-Tdicdr-1.24 ns

Tdicpw TDI_CLK ceil×DI_ACCESS_SIZE_#

DI_CLK_PERIOD

-----------------------------------------------------

Tdicdcs 1

---T

DI_CLK ceil×2 DISP_DOWN_#×

DI_CLK_PERIOD

--------------------------------------------------

⎝⎠

⎛⎞

Tdicucs 1

---T

DI_CLK ceil×2 DISP_UP_#×

DI_CLK_PERIOD

----------------------------------------------

⎝⎠

⎛⎞

Tdicdrs 1

---T

DI_CLK ceil×2 DISP_DOWN_#×

DI_CLK_PERIOD

--------------------------------------------------

⎝⎠

⎛⎞

Tdicurs 1

---T

DI_CLK ceil×2DISP_UP_#×

DI_CLK_PERIOD

----------------------------------------------

⎝⎠

⎛⎞

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 105

4.7.9 LVDS Display Bridge (LDB) Module Parameters

The LVDS interface complies with TIA/EIA 644-A standard. For more details, see TIA/EIA STANDARD

644-A, “Electrical Characteristics of Low Voltage Differential Signaling (LVDS) Interface Circuits”.

4.7.10 One-Wire (OWIRE) Timing Parameters

Figure 58 depicts the RPP timing, and Table 66 lists the RPP timing parameters.

Figure 58. Reset and Presence Pulses (RPP) Timing Diagram

7Display control down for read

DISP_DOWN is predefined in REGISTER.

8Display control up for write

DISP_UP is predefined in REGISTER.

Table 66. RPP Sequence Delay Comparisons Timing Parameters

ID Parameters Symbol Min Typ Max Unit

OW1 Reset Time Low tRSTL 480 511 —1

1In order not to mask signaling by other devices on the 1-Wire bus, tRSTL + tR should always be less than 960 µs.

µs

OW2 Presence Detect High tPDH 15 — 60 µs

OW3 Presence Detect Low tPDL 60 — 240 µs

OW4 Reset Time High

(includes recovery time)

tRSTH 480 512 — µs

Tdicdrw 1

---T

DI_CLK ceil×2 DISP_DOWN_#×

DI_CLK_PERIOD

--------------------------------------------------

⎝⎠

⎛⎞

Tdicuw 1

---T

DI_CLK ceil×2DISP_UP_#×

DI_CLK_PERIOD

----------------------------------------------

⎝⎠

⎛⎞

One-Wire bus

One Wire Device Tx

“Presence Pulse”

(BATT_LINE)

One-WIRE Tx

“Reset Pulse”

OW1

OW2

OW3

OW4

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

106 Freescale Semiconductor

Electrical Characteristics

Figure 59 depicts Write 0 Sequence timing, and Table 67 lists the timing parameters.

Figure 59. Write 0 Sequence Timing Diagram

Figure 60 depicts Write 1 Sequence timing, Figure 61 depicts the Read Sequence timing, and Table 68

lists the timing parameters.

Figure 60. Write 1 Sequence Timing Diagram

Figure 61. Read Sequence Timing Diagram

Table 67. WR0 Sequence Timing Parameters

ID Parameter Symbol Min Typ Max Unit

OW5 Write 0 Low Time tLOW0 60 100 120 µs

OW6 Transmission Time Slot tSLOT OW5 117 120 µs

Recovery time tREC 1——µs

OW5

OW6

One-Wire bus

(BATT_LINE)

tREC

OW7

OW8

One-Wire bus

(BATT_LINE)

tSU

OW8

OW10

One-Wire bus

(BATT_LINE)

OW9 OW11

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 107

4.7.11 Pulse Width Modulator (PWM) Timing Parameters

This section describes the electrical information of the PWM. The PWM can be programmed to select one

of three clock signals as its source frequency. The selected clock signal is passed through a prescaler before

being input to the counter. The output is available at the pulse-width modulator output (PWMO) external

pin.

Figure 62 depicts the timing of the PWM, and Table 69 lists the PWM timing parameters.

Figure 62. PWM Timing

Table 68. WR1 /RD Timing Parameters

ID Parameter Symbol Min Typ Max Unit

OW7 Write 1 Low Time tLOW1 1515µs

OW8 Transmission Time Slot tSLOT 60 117 120 µs

Read Data Setup tSU ——1µs

OW9 Read Low Time tLOWR 1515µs

OW10 Read Data Valid tRDV —15—µs

OW11 Release Time tRELEASE 0—45µs

Table 69. PWM Output Timing Parameter

Ref. No. Parameter Min Max Unit

1 System CLK frequency1

1CL of PWMO = 30 pF

0 ipg_clk MHz

2a Clock high time 12.29 — ns

2b Clock low time 9.91 — ns

3a Clock fall time — 0.5 ns

3b Clock rise time — 0.5 ns

4a Output delay time — 9.37 ns

4b Output setup time 8.71 — ns

System Clock

2a 1

PWM Output

3a 4b

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

108 Freescale Semiconductor

Electrical Characteristics

4.7.12 PATA Timing Parameters

This section describes the timing parameters of the Parallel ATA module which are compliant with

ATA/ATAPI-6 specification.

Parallel ATA module can work on PIO/Multi-Word DMA/Ultra DMA transfer modes. Each transfer mode

has different data transfer rate, Ultra DMA mode 4 data transfer rate is up to 100MB/s. Parallel ATA

module interface consist of a total of 29 pins. Some pins act on different function in different transfer

mode. There are different requirements of timing relationships among the function pins conform with

ATA/ATAPI-6 specification and these requirements are configurable by the ATA module registers.

Table 70 and Figure 63 define the AC characteristics of all the PATA interface signals in all data transfer

modes.

Figure 63. PATA Interface Signals Timing Diagram

The user must use level shifters for 5.0 V compatibility on the ATA interface. The i.MX53xD PATA

interface is 3.3 V compatible.

The use of bus buffers introduces delay on the bus and skew between signal lines. These factors make it

difficult to operate the bus at the highest speed (UDMA-5) when bus buffers are used. If fast UDMA mode

operation is needed, this may not be compatible with bus buffers.

Another area of attention is the slew rate limit imposed by the ATA specification on the ATA bus.

According to this limit, any signal driven on the bus should have a slew rate between 0.4 and 1.2 V/ns with

a 40 pF load. Not many vendors of bus buffers specify slew rate of the outgoing signals.

When bus buffers are used, the ata_data bus buffer is special. This is a bidirectional bus buffer, so a

direction control signal is needed. This direction control signal is ata_buffer_en. When its high, the bus

should drive from host to device. When its low, the bus should drive from device to host. Steering of the

signal is such that contention on the host and device tri-state busses is always avoided.

Table 70. AC Characteristics of All Interface Signals

ID Parameter Symbol Min Max Unit

SI1 Rising edge slew rate for any signal on ATA interface1

1SRISE and SFALL shall meet this requirement when measured at the sender’s connector from 10–90% of full signal

amplitude with all capacitive loads from 15–40 pF where all signals have the same capacitive load value.

Srise —1.25V/ns

SI2 Falling edge slew rate for any signal on ATA interface1Sfall —1.25V/ns

SI3 Host interface signal capacitance at the host connector Chost —20pF

ATA Interface Signals

SI1SI2

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 109

In the timing equations, some timing parameters are used. These parameters depend on the

implementation of the i.MX53xD PATA interface on silicon, the bus buffer used, the cable delay and

cable skew. Table 71 shows ATA timing parameters.

Table 71. PATA Timing Parameters

Name Description Value/

Contributing Factor1

1Values provided where applicable.

T Bus clock period (AHB_CLK_ROOT) Peripheral clock frequency

(7.5 ns for 133 MHz clock)

ti_ds Set-up time ata_data to ata_iordy edge (UDMA-in only)

UDMA0

UDMA1

UDMA2, UDMA3

UDMA4

UDMA5

15 ns

10 ns

7 ns

5 ns

4 ns

ti_dh Hold time ata_iordy edge to ata_data (UDMA-in only)

UDMA0, UDMA1, UDMA2, UDMA3, UDMA4

UDMA5

5.0 ns

4.6 ns

tco Propagation delay bus clock L-to-H to

ata_cs0, ata_cs1, ata_da2, ata_da1, ata_da0, ata_dior, ata_diow, ata_dmack,

ata_data, ata_buffer_en

12.0 ns

tsu Set-up time ata_data to bus clock L-to-H 8.5 ns

tsui Set-up time ata_iordy to bus clock H-to-L 8.5 ns

thi Hold time ata_iordy to bus clock H to L 2.5 ns

tskew1 Max difference in propagation delay bus clock L-to-H to any of following signals

ata_cs0, ata_cs1, ata_da2, ata_da1, ata_da0, ata_dior, ata_diow, ata_dmack,

ata_data (write), ata_buffer_en

7ns

tskew2 Max difference in buffer propagation delay for any of following signals:

ata_cs0, ata_cs1, ata_da2, ata_da1, ata_da0, ata_dior, ata_diow, ata_dmack,

ata_data (write), ata_buffer_en

Transceiver

tskew3 Max difference in buffer propagation delay for any of following signals ata_iordy,

ata_data (read)

Transceiver

tbuf Max buffer propagation delay Transceiver

tcable1 Cable propagation delay for ata_data Cable

tcable2 Cable propagation delay for control signals ata_dior, ata_diow, ata_iordy,

ata_dmack

Cable

tskew4 Max difference in cable propagation delay between ata_iordy and ata_data (read) Cable

tskew5 Max difference in cable propagation delay between (ata_dior, ata_diow,

ata_dmack) and ata_cs0, ata_cs1, ata_da2, ata_da1, ata_da0, ata_data(write)

Cable

tskew6 Max difference in cable propagation delay without accounting for ground bounce Cable

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

110 Freescale Semiconductor

Electrical Characteristics

4.7.12.1 PIO Mode Read Timing

Figure 64 shows timing for PIO read. Table 72 lists the timing parameters for PIO read.

Figure 64. PIO Read Timing Diagram

Table 72. PIO Read Timing Parameters

ATA

Parameter

from Figure 64 Value Controlling

Variable

t1 t1 t1(min) = time_1 x T - (tskew1 + tskew2 + tskew5) time_1

t2 (read) t2r t2(min) = time_2r x T - (tskew1 + tskew2 + tskew5) time_2r

t9 t9 t9(min) = time_9 x T - (tskew1 + tskew2 + tskew6) time_9

t5 t5 t5(min) = tco + tsu + tbuf + tbuf+ tcable1 + tcable2 time_2 (affects tsu and

tco)

t6 t6 0 —

tA tA tA(min) = (1.5 + time_ax) x T - (tco + tsui + tcable2 + tcable2 + 2 x tbuf) time_ax

trd trd1 trd1(max) = (-trd)+ (tskew3 + tskew4)

trd1(min) = (time_pio_rdx - 0.5) x T - (tsu + thi)

(time_pio_rdx - 0.5) x T > tsu + thi + tskew3 + tskew4

time_pio_rdx

t0 — t0(min) = (time_1 + time_2r+ time_9) x T time_1, time_2r, time_9

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 111

Figure 65 shows timing for PIO write. Table 73 lists the timing parameters for PIO write.

Figure 65. Multi-word DMA (MDMA) Timing

Table 73. PIO Write Timing Parameters

ATA

Paramete

Parameter

from Figure 65 Value Controlling

Variable

t1 t1 t1(min) = time_1 x T - (tskew1 + tskew2 + tskew5) time_1

t2 (write) t2w t2(min) = time_2w x T - (tskew1 + tskew2 + tskew5) time_2w

t9 t9 t9(min) = time_9 x T - (tskew1 + tskew2 + tskew6) time_9

t3 — t3(min) = (time_2w - time_on) x T - (tskew1 + tskew2 +tskew5) If not met, increase

time_2w

t4 t4 t4(min) = time_4 x T - tskew1 time_4

tA tA tA = (1.5 + time_ax) x T - (tco + tsui + tcable2 + tcable2 + 2 x tbuf) time_ax

t0 — t0(min) = (time_1 + time_2 + time_9) x T time_1, time_2r,

time_9

— — Avoid bus contention when switching buffer on by making ton long enough —

— — Avoid bus contention when switching buffer off by making toff long enough —

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

112 Freescale Semiconductor

Electrical Characteristics

Figure 66 shows timing for MDMA read, Figure 67 shows timing for MDMA write, and Table 74 lists

the timing parameters for MDMA read and write.

Figure 66. MDMA Read Timing Diagram

Figure 67. MDMA Write Timing Diagram

Table 74. MDMA Read and Write Timing Parameters

ATA

Parameter

Parameter from

Figure 66 (Read),

Figure 67 (Write)

Value Controlling

Variable

tm, ti tm tm(min) = ti(min) = time_m x T - (tskew1 + tskew2 + tskew5) time_m

td td, td1 td1(min) = td(min) = time_d x T - (tskew1 + tskew2 + tskew6) time_d

tk tk1tk(min) = time_k x T - (tskew1 + tskew2 + tskew6) time_k

t0 — t0(min) = (time_d + time_k) x T time_d, time_k

tg(read) tgr tgr(min-read) = tco + tsu + tbuf + tbuf + tcable1 + tcable2

tgr(min-drive) = td - te(drive)

time_d

tf(read) tfr tfr(min) = 5 ns —

tg(write) — tg(min-write) = time_d x T - (tskew1 + tskew2 + tskew5) time_d

tf(write) — tf(min-write) = time_k x T - (tskew1 + tskew2 + tskew6) time_k

tL — tL (max) = (time_d + time_k - 2)×T - (tsu + tco + 2×tbuf + 2×tcable2) time_d,

time_k2

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 113

4.7.12.2 Ultra DMA (UDMA) Input Timing

Figure 68 shows timing when the UDMA in transfer starts, Figure 69 shows timing when the UDMA in

host terminates transfer, Figure 70 shows timing when the UDMA in device terminates transfer, and

Table 75 lists the timing parameters for UDMA in burst.

Figure 68. UDMA in Transfer Starts Timing Diagram

tn, tj tkjn tn= tj= tkjn = time_jn x T - (tskew1 + tskew2 + tskew6) time_jn

—ton

toff

ton = time_on × T - tskew1

toff = time_off × T - tskew1

—

1tk1 in the MDMA figures (Figure 66 and Figure 67) equals (tk - 2 x T).

2tk1 in the MDMA figures equals (tk – 2 x T).

Table 74. MDMA Read and Write Timing Parameters (continued)

ATA

Parameter

Parameter from

Figure 66 (Read),

Figure 67 (Write)

Value Controlling

Variable

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

114 Freescale Semiconductor

Electrical Characteristics

Figure 69. UDMA in Host Terminates Transfer Timing Diagram

Figure 70. UDMA in Device Terminates Transfer Timing Diagram

Table 75. UDMA in Burst Timing Parameters

ATA

Parameter

from

Figure 68,

Figure 69, and

Figure 70

Description Controlling Variable

tack tack tack (min) = (time_ack × T) - (tskew1 + tskew2) time_ack

tenv tenv tenv (min) = (time_env × T) - (tskew1 + tskew2)

tenv (max) = (time_env × T) + (tskew1 + tskew2)

time_env

tds tds1 tds - (tskew3) - ti_ds > 0 tskew3, ti_ds, ti_dh

should be low enough

tdh tdh1 tdh - (tskew3) - ti_dh > 0

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 115

4.7.12.3 UDMA Output Timing

Figure 71 shows timing when the UDMA out transfer starts, Figure 72 shows timing when the UDMA out

host terminates transfer, Figure 73 shows timing when the UDMA out device terminates transfer, and

Table 76 lists the timing parameters for UDMA out burst.

Figure 71. UDMA Out Transfer Starts Timing Diagram

tcyc tc1 (tcyc - tskew) > T T big enough

trp trp trp (min) = time_rp × T - (tskew1 + tskew2 + tskew6) time_rp

—tx1

1(time_rp × T) - (tco + tsu + 3T + 2 ×tbuf + 2×tcable2) > trfs (drive) time_rp

tmli tmli1 tmli1 (min) = (time_mlix + 0.4) × T time_mlix

tzah tzah tzah (min) = (time_zah + 0.4) × T time_zah

tdzfs tdzfs tdzfs = (time_dzfs × T) - (tskew1 + tskew2) time_dzfs

tcvh tcvh tcvh = (time_cvh ×T) - (tskew1 + tskew2) time_cvh

—ton

toff2

ton = time_on × T - tskew1

toff = time_off × T - tskew1

—

1There is a special timing requirement in the ATA host that requires the internal DIOW to go only high 3 clocks after the last

active edge on the DSTROBE signal. The equation given on this line tries to capture this constraint.

2Make ton and toff big enough to avoid bus contention.

Table 75. UDMA in Burst Timing Parameters (continued)

ATA

Parameter

from

Figure 68,

Figure 69, and

Figure 70

Description Controlling Variable

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

116 Freescale Semiconductor

Electrical Characteristics

Figure 72. UDMA Out Host Terminates Transfer Timing Diagram

Figure 73. UDMA Out Device Terminates Transfer Timing Diagram

Table 76. UDMA Out Burst Timing Parameters

ATA

Parameter

from

Figure 71,

Figure 72,

Figure 73

Value Controlling

Variable

tack tack tack (min) = (time_ack × T) - (tskew1 + tskew2) time_ack

tenv tenv tenv (min) = (time_env × T) - (tskew1 + tskew2)

tenv (max) = (time_env × T) + (tskew1 + tskew2)

time_env

tdvs tdvs tdvs = (time_dvs × T) - (tskew1 + tskew2) time_dvs

tdvh tdvh tdvs = (time_dvh × T) - (tskew1 + tskew2) time_dvh

tcyc tcyc tcyc = time_cyc × T - (tskew1 + tskew2) time_cyc

t2cyc — t2cyc = time_cyc × 2 × T time_cyc

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 117

4.7.13 SATA PHY Parameters

This section describes SATA PHY electrical specifications.

4.7.13.1 Reference Clock Electrical and Jitter Specifications

The refclk signal is differential and supports frequencies of 25 MHz or 50-156.25 MHz (100 MHz and

125 MHz are common frequencies). The frequency is pin-selectable (for more information about the

signal, see “Per-Transceiver Control and Status Signals” in the SATA PHY chapter in the Reference

Manual).

Table 77 provides the SATA PHY reference clock specifications.

trfs1 trfs trfs = 1.6 × T + tsui + tco + tbuf + tbuf —

— tdzfs tdzfs = time_dzfs × T - (tskew1) time_dzfs

tss tss tss = time_ss × T - (tskew1 + tskew2) time_ss

tmli tdzfs_mli tdzfs_mli =max (time_dzfs, time_mli) × T - (tskew1 + tskew2) —

tli tli1 tli1 > 0 —

tli tli2 tli2 > 0 —

tli tli3 tli3 > 0 —

tcvh tcvh tcvh = (time_cvh ×T) - (tskew1 + tskew2) time_cvh

—ton

toff

ton = time_on × T - tskew1

toff = time_off × T - tskew1

—

Table 77. Reference Clock Specifications

Parameters Test Conditions Min Max Unit

Differential peak voltage (typically 0.71 V) — 350 850 mV

Common mode voltage

(refclk_p + refclk_m) / 2

— 175 2,000 mV

Total phase jitter For information about total

phase jitter, see following

section

—3ps RMS

Minimum/maximum duty cycle — 40 60 % UI

Frequency range — 25 156.25 MHz

Table 76. UDMA Out Burst Timing Parameters (continued)

ATA

Parameter

from

Figure 71,

Figure 72,

Figure 73

Value Controlling

Variable

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

118 Freescale Semiconductor

Electrical Characteristics

4.7.13.1.1 Reference Clock Jitter Measurement

The total phase jitter on the reference clock is specified at 3 ps RMS. There are numerous ways to measure

the reference clock jitter, one of which is as follows.

Using a high-speed sampling scope (20 GSamples/s), 1 million samples of the differential reference clock

are taken, and the zero-crossing times of each rising edge are calculated. From the zero-crossing data, an

average reference clock period is calculated. This average reference clock period is subtracted from each

sequential, instantaneous period to find the difference between each reference clock rising edge and the

ideal placement to produce the phase jitter sequence. The power spectral density (PSD) of the phase jitter

is calculated and integrated after being weighted with the transfer function shown in Figure 74. The square

root of the resultant integral is the RMS total phase jitter.

Figure 74. Weighting Function for RMS Phase Jitter Calculation

4.7.13.2 Transmitter and Receiver Characteristics

The SATA PHY meets or exceeds the electrical compliance requirements defined in the SATA

specification. The following subsections provide values obtained from a combination of simulations and

silicon characterization.

NOTE

The tables in the following sections indicate any exceptions to the SATA

specification or aspects of the SATA PHY that exceed the standard, as well

as provide information about parameters not defined in the standard.

4.7.13.2.1 SATA PHY Transmitter Characteristics

Table 78 provides specifications for SATA PHY transmitter characteristics.

Table 78. SATA2 PHY Transmitter Characteristics

Parameters Symbol Min Typ Max Unit

Transmit common mode voltage VCTM 0.4 — 0.6 V

Transmitter pre-emphasis accuracy (measured

change in de-emphasized bit)

— -0.5 — 0.5 dB

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 119

4.7.13.2.2 SATA PHY Receiver Characteristics

Table 79 provides specifications for SATA PHY receiver characteristics.

4.7.13.3 SATA_REXT Reference Resistor Connection

The impedance calibration process requires connection of reference resistor 191 Ω.1% precision resistor

on SATA_REXT pad to ground.

Resistor calibration consists of learning which state of the internal Resistor Calibration register causes an

internal, digitally trimmed calibration resistor to best match the impedance applied to the SATA_REXT

pin. The calibration register value is then supplied to all Tx and Rx termination resistors.

During the calibration process (for a few tens of microseconds), up to 0.3 mW can be dissipated in the

external SATA_REXT resistor. At other times, no power is dissipated by the SATA_REXT resistor.

4.7.13.4 SATA Connectivity When Not in Use

NOTE

The Temperature Sensor is part of the SATA module. If SATA IP is disabled,

the Temperature Sensor will not work as well. Temperature Sensor

functionality is important in supporting high performance applications

without overheating the device (at high ambient temp).

When both SATA and thermal sensor are not required, connect VP and VPH supplies to ground. The rest

of the ports, both inputs and outputs (SATA_REFCLKM, SATA_REFCLKP, SATA_REXT, SATA_RXM,

SATA_RXP, SATA_TXM) can be left floating. It is not recommended to turn off the VPH while the VP is

active.

When SATA is not in use but thermal sensor is still required, both VP and VPH supplies must be powered

on according to their nominal voltage levels. The reference clock input frequency must fall within the

specified range of 25 MHz to 156.25 MHz. SATA_REXT does not need to be connected, as the

termination impedance is not of consequence.

Table 79. SATA PHY Receiver Characteristics

Parameters Symbol Min Typ Max Unit

Minimum Rx eye height (differential peak-to-peak) VMIN_RX_EYE_HEIGHT — — 175 mV

Tolerance PPM -400 — 400 ppm

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

120 Freescale Semiconductor

Electrical Characteristics

4.7.14 SCAN JTAG Controller (SJC) Timing Parameters

Figure 75 depicts the SJC test clock input timing. Figure 76 depicts the SJC boundary scan timing.

Figure 77 depicts the SJC test access port. Signal parameters are listed in Table 80.

Figure 75. Test Clock Input Timing Diagram

Figure 76. Boundary Scan (JTAG) Timing Diagram

TCK

(Input) VM VM

VIH VIL

SJ1

SJ2 SJ2

SJ3

TCK

(Input)

Data

Inputs

Data

Outputs

Data

Outputs

Data

Outputs

VIH

VIL

Input Data Valid

Output Data Valid

SJ4 SJ5

SJ6

SJ7

SJ6

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 121

Figure 77. Test Access Port Timing Diagram

Figure 78. TRST Timing Diagram

Table 80. JTAG Timing

ID Parameter1,2

All Frequencies

Unit

Min Max

SJ0 TCK frequency of operation 1/(3•TDC)10.001 22 MHz

SJ1 TCK cycle time in crystal mode 45 — ns

SJ2 TCK clock pulse width measured at VM222.5 — ns

SJ3 TCK rise and fall times — 3 ns

SJ4 Boundary scan input data set-up time 5 — ns

SJ5 Boundary scan input data hold time 24 — ns

SJ6 TCK low to output data valid — 40 ns

SJ7 TCK low to output high impedance — 40 ns

SJ8 TMS, TDI data set-up time 5 — ns

TCK

(Input)

TDI

(Input)

TDO

(Output)

TDO

(Output)

TDO

(Output)

VIH

VIL

Input Data Valid

Output Data Valid

TMS

SJ8 SJ9

SJ10

SJ11

SJ10

TCK

(Input)

TRST

(Input)

SJ13

SJ12

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

122 Freescale Semiconductor

Electrical Characteristics

4.7.15 SPDIF Timing Parameters

The Sony/Philips Digital Interconnect Format (SPDIF) data is sent using the bi-phase marking code. When

encoding, the SPDIF data signal is modulated by a clock that is twice the bit rate of the data signal.

Table 81 and Figures , show SPDIF timing parameters for the Sony/Philips Digital Interconnect Format

(SPDIF), including the timing of the modulating Rx clock (SRCK) for SPDIF in Rx mode and the timing

of the modulating Tx clock (STCLK) for SPDIF in Tx mode.

SJ9 TMS, TDI data hold time 25 — ns

SJ10 TCK low to TDO data valid — 44 ns

SJ11 TCK low to TDO high impedance — 44 ns

SJ12 TRST assert time 100 — ns

SJ13 TRST set-up time to TCK low 40 — ns

1TDC = target frequency of SJC

2VM = mid-point voltage

Table 81. SPDIF Timing Parameters

Characteristics Symbol

Timing Parameter Range

Units

Min Max

SPDIFIN Skew: asynchronous inputs, no specs apply — — 0.7 ns

SPDIFOUT output (Load = 50pf)

•Skew

• Transition rising

• Transition falling

—

1.5

24.2

31.3

SPDIFOUT1 output (Load = 30pf)

•Skew

• Transition rising

• Transition falling

—

1.5

13.6

18.0

Modulating Rx clock (SRCK) period srckp 40.0 — ns

SRCK high period srckph 16.0 — ns

SRCK low period srckpl 16.0 — ns

Modulating Tx clock (STCLK) period stclkp 40.0 — ns

STCLK high period stclkph 16.0 — ns

STCLK low period stclkpl 16.0 — ns

Table 80. JTAG Timing (continued)

ID Parameter1,2

All Frequencies

Unit

Min Max

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 123

Figure 79. SPDIF Timing Diagram

Figure 80. STCLK Timing

4.7.16 SSI Timing Parameters

This section describes the timing parameters of the SSI module. The connectivity of the serial

synchronous interfaces are summarized in Table 82.

NOTE

• The terms WL and BL used in the timing diagrams and tables refer to

Word Length (WL) and Bit Length (BL).

• The SSI timing diagrams use generic signal names wherein the names

used in the i.MX53 Reference Manual are channel specific signal

names. For example, a channel clock referenced in the IOMUXC

chapter as AUD3_TXC appears in the timing diagram as TXC.

Table 82. AUDMUX Port Allocation

Port Signal Nomenclature Type and Access

AUDMUX port 1 SSI 1 Internal

AUDMUX port 2 SSI 2 Internal

AUDMUX port 3 AUD3 External— AUD3 I/O

AUDMUX port 4 AUD4 External— EIM or CSPI1 I/O through IOMUXC

AUDMUX port 5 AUD5 External— EIM or SD1 I/O through IOMUXC

AUDMUX port 6 AUD6 External— EIM or DISP2 through IOMUXC

AUDMUX port 7 SSI 3 Internal

SRCK

(Output)

VMVM

srckp

srckph

srckpl

STCLK

(Input)

VMVM

stclkp

stclkph

stclkpl

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

124 Freescale Semiconductor

Electrical Characteristics

4.7.16.1 SSI Transmitter Timing with Internal Clock

Figure 81 depicts the SSI transmitter internal clock timing and Table 83 lists the timing parameters for the

SSI transmitter internal clock.

Figure 81. SSI Transmitter Internal Clock Timing Diagram

Table 83. SSI Transmitter Timing with Internal Clock

ID Parameter Min Max Unit

Internal Clock Operation

SS1 (Tx/Rx) CK clock period 81.4 — ns

SS2 (Tx/Rx) CK clock high period 36.0 — ns

SS3 (Tx/Rx) CK clock rise time — 6.0 ns

SS4 (Tx/Rx) CK clock low period 36.0 — ns

SS5 (Tx/Rx) CK clock fall time — 6.0 ns

SS6 (Tx) CK high to FS (bl) high — 15.0 ns

SS8 (Tx) CK high to FS (bl) low — 15.0 ns

SS10 (Tx) CK high to FS (wl) high — 15.0 ns

SS12 (Tx) CK high to FS (wl) low — 15.0 ns

SS14 (Tx/Rx) Internal FS rise time — 6.0 ns

SS15 (Tx/Rx) Internal FS fall time — 6.0 ns

SS16 (Tx) CK high to STXD valid from high impedance — 15.0 ns

SS19

SS1

SS2 SS4

SS3

SS5

SS6 SS8

SS10 SS12

SS14

SS18

SS15

SS17

SS16

SS43

SS42

Note: SRXD input in synchronous mode only

TXC

TXFS (wl)

(Output)

TXFS (bl)

(Output)

RXD

(Input)

TXD

(Output)

: SRXD input in synchronous mode only

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 125

NOTE

• All the timings for the SSI are given for a non-inverted serial clock

polarity (TSCKP/RSCKP = 0) and a non-inverted frame sync

(TFSI/RFSI = 0). If the polarity of the clock and/or the frame sync have

been inverted, all the timing remains valid by inverting the clock signal

STCK/SRCK and/or the frame sync STFS/SRFS shown in the tables

and in the figures.

• All timings are on Audiomux Pads when SSI is being used for data

transfer.

• The terms WL and BL refer to Word Length (WL) and Bit Length (BL).

• “Tx” and “Rx” refer to the Transmit and Receive sections of the SSI.

• For internal Frame Sync operation using external clock, the FS timing is

same as that of Tx Data (for example, during AC97 mode of operation).

SS17 (Tx) CK high to STXD high/low — 15.0 ns

SS18 (Tx) CK high to STXD high impedance — 15.0 ns

SS19 STXD rise/fall time — 6.0 ns

Synchronous Internal Clock Operation

SS42 SRXD setup before (Tx) CK falling 10.0 — ns

SS43 SRXD hold after (Tx) CK falling 0.0 — ns

SS52 Loading — 25.0 pF

Table 83. SSI Transmitter Timing with Internal Clock (continued)

ID Parameter Min Max Unit

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

126 Freescale Semiconductor

Electrical Characteristics

4.7.16.2 SSI Receiver Timing with Internal Clock

Figure 82 depicts the SSI receiver internal clock timing and Table 84 lists the timing parameters for the

receiver timing with the internal clock

Figure 82. SSI Receiver Internal Clock Timing Diagram

Table 84. SSI Receiver Timing with Internal Clock

ID Parameter Min Max Unit

Internal Clock Operation

SS1 (Tx/Rx) CK clock period 81.4 — ns

SS2 (Tx/Rx) CK clock high period 36.0 — ns

SS3 (Tx/Rx) CK clock rise time — 6.0 ns

SS4 (Tx/Rx) CK clock low period 36.0 — ns

SS5 (Tx/Rx) CK clock fall time — 6.0 ns

SS7 (Rx) CK high to FS (bl) high — 15.0 ns

SS9 (Rx) CK high to FS (bl) low — 15.0 ns

SS11 (Rx) CK high to FS (wl) high — 15.0 ns

SS13 (Rx) CK high to FS (wl) low — 15.0 ns

SS20 SRXD setup time before (Rx) CK low 10.0 — ns

SS21 SRXD hold time after (Rx) CK low 0.0 — ns

SS50

SS48

SS1

SS4SS2

SS51

SS20

SS21

SS49

SS7 SS9

SS11 SS13

SS47

SS3

SS5

TXC

(Output)

TXFS (bl)

(Output)

TXFS (wl)

(Output)

RXD

(Input)

RXC

(Output)

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 127

NOTE

• All the timings for the SSI are given for a non-inverted serial clock

polarity (TSCKP/RSCKP = 0) and a non-inverted frame sync

(TFSI/RFSI = 0). If the polarity of the clock and/or the frame sync have

been inverted, all the timing remains valid by inverting the clock signal

STCK/SRCK and/or the frame sync STFS/SRFS shown in the tables

and in the figures.

• All timings are on Audiomux Pads when SSI is being used for data

transfer.

• “Tx” and “Rx” refer to the Transmit and Receive sections of the SSI.

• The terms WL and BL refer to Word Length (WL) and Bit Length (BL).

• For internal Frame Sync operation using external clock, the FS timing is

same as that of Tx Data (for example, during AC97 mode of operation).

Oversampling Clock Operation

SS47 Oversampling clock period 15.04 — ns

SS48 Oversampling clock high period 6.0 — ns

SS49 Oversampling clock rise time — 3.0 ns

SS50 Oversampling clock low period 6.0 — ns

SS51 Oversampling clock fall time — 3.0 ns

Table 84. SSI Receiver Timing with Internal Clock (continued)

ID Parameter Min Max Unit

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

128 Freescale Semiconductor

Electrical Characteristics

4.7.16.3 SSI Transmitter Timing with External Clock

Figure 83 depicts the SSI transmitter external clock timing and Table 85 lists the timing parameters for

the transmitter timing with the external clock

Figure 83. SSI Transmitter External Clock Timing Diagram

Table 85. SSI Transmitter Timing with External Clock

ID Parameter Min Max Unit

External Clock Operation

SS22 (Tx/Rx) CK clock period 81.4 — ns

SS23 (Tx/Rx) CK clock high period 36.0 — ns

SS24 (Tx/Rx) CK clock rise time — 6.0 ns

SS25 (Tx/Rx) CK clock low period 36.0 — ns

SS26 (Tx/Rx) CK clock fall time — 6.0 ns

SS27 (Tx) CK high to FS (bl) high -10.0 15.0 ns

SS29 (Tx) CK high to FS (bl) low 10.0 — ns

SS31 (Tx) CK high to FS (wl) high -10.0 15.0 ns

SS33 (Tx) CK high to FS (wl) low 10.0 — ns

SS37 (Tx) CK high to STXD valid from high impedance — 15.0 ns

SS38 (Tx) CK high to STXD high/low — 15.0 ns

SS45

SS33

SS24

SS26

SS25

SS23

Note: SRXD Input in Synchronous mode only

SS31

SS29

SS27

SS22

SS44

SS39

SS38

SS37

SS46

TXC

(Input)

TXFS (bl)

(Input)

TXFS (wl)

(Input)

TXD

(Output)

RXD

(Input)

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 129

NOTE

• All the timings for the SSI are given for a non-inverted serial clock

polarity (TSCKP/RSCKP = 0) and a non-inverted frame sync

(TFSI/RFSI = 0). If the polarity of the clock and/or the frame sync have

been inverted, all the timing remains valid by inverting the clock signal

STCK/SRCK and/or the frame sync STFS/SRFS shown in the tables

and in the figures.

• All timings are on Audiomux Pads when SSI is being used for data

transfer.

• “Tx” and “Rx” refer to the Transmit and Receive sections of the SSI.

• The terms WL and BL refer to Word Length (WL) and Bit Length (BL).

• For internal Frame Sync operation using external clock, the FS timing is

same as that of Tx Data (for example, during AC97 mode of operation).

SS39 (Tx) CK high to STXD high impedance — 15.0 ns

Synchronous External Clock Operation

SS44 SRXD setup before (Tx) CK falling 10.0 — ns

SS45 SRXD hold after (Tx) CK falling 2.0 — ns

SS46 SRXD rise/fall time — 6.0 ns

Table 85. SSI Transmitter Timing with External Clock (continued)

ID Parameter Min Max Unit

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

130 Freescale Semiconductor

Electrical Characteristics

4.7.16.4 SSI Receiver Timing with External Clock

Figure 84 depicts the SSI receiver external clock timing and Table 86 lists the timing parameters for the

receiver timing with the external clock.

Figure 84. SSI Receiver External Clock Timing Diagram

Table 86. SSI Receiver Timing with External Clock

ID Parameter Min Max Unit

External Clock Operation

SS22 (Tx/Rx) CK clock period 81.4 — ns

SS23 (Tx/Rx) CK clock high period 36 — ns

SS24 (Tx/Rx) CK clock rise time — 6.0 ns

SS25 (Tx/Rx) CK clock low period 36 — ns

SS26 (Tx/Rx) CK clock fall time — 6.0 ns

SS28 (Rx) CK high to FS (bl) high -10 15.0 ns

SS30 (Rx) CK high to FS (bl) low 10 — ns

SS32 (Rx) CK high to FS (wl) high -10 15.0 ns

SS34 (Rx) CK high to FS (wl) low 10 — ns

SS35 (Tx/Rx) External FS rise time — 6.0 ns

SS36 (Tx/Rx) External FS fall time — 6.0 ns

SS40 SRXD setup time before (Rx) CK low 10 — ns

SS41 SRXD hold time after (Rx) CK low 2 — ns

SS24

SS34

SS35

SS30

SS28

SS26

SS25

SS23

SS40

SS22

SS32

SS36

SS41

TXC

TXFS (bl)

TXFS (wl)

RXD

(Input)

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 131

NOTE

• All the timings for the SSI are given for a non-inverted serial clock

polarity (TSCKP/RSCKP = 0) and a non-inverted frame sync

(TFSI/RFSI = 0). If the polarity of the clock and/or the frame sync have

been inverted, all the timing remains valid by inverting the clock signal

STCK/SRCK and/or the frame sync STFS/SRFS shown in the tables

and in the figures.

• All timings are on Audiomux Pads when SSI is being used for data

transfer.

• “Tx” and “Rx” refer to the Transmit and Receive sections of the SSI.

• The terms WL and BL refer to Word Length (WL) and Bit Length (BL).

• For internal Frame Sync operation using external clock, the FS timing is

same as that of Tx Data (for example, during AC97 mode of operation).

4.7.17 UART I/O Configuration and Timing Parameters

4.7.17.1 UART RS-232 I/O Configuration in Different Modes

The i.MX53xD UART interfaces can serve both as DTE or DCE device. This can be configured by the

DCEDTE control bit (default 0 — DCE mode). Table 87 shows the UART I/O configuration based on

the enabled mode.

4.7.17.2 UART RS-232 Serial Mode Timing

The following sections describe the electrical information of the UART module in the RS-232 mode.

4.7.17.2.1 UART Transmitter

Figure 85 depicts the transmit timing of UART in the RS-232 serial mode, with 8 data bit/1 stop bit format.

Table 88 lists the UART RS-232 serial mode transmit timing characteristics.

Table 87. UART I/O Configuration vs. Mode

Port

DTE Mode DCE Mode

Direction Description Direction Description

RTS Output RTS from DTE to DCE Input RTS from DTE to DCE

CTS Input CTS from DCE to DTE Output CTS from DCE to DTE

DTR Output DTR from DTE to DCE Input DTR from DTE to DCE

DSR Input DSR from DCE to DTE Output DSR from DCE to DTE

DCD Input DCD from DCE to DTE Output DCD from DCE to DTE

RI Input RING from DCE to DTE Output RING from DCE to DTE

TXD_MUX Input Serial data from DCE to DTE Output Serial data from DCE to DTE

RXD_MUX Output Serial data from DTE to DCE Input Serial data from DTE to DCE

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

132 Freescale Semiconductor

Electrical Characteristics

Figure 85. UART RS-232 Serial Mode Transmit Timing Diagram

4.7.17.2.2 UART Receiver

Figure 86 depicts the RS-232 serial mode receive timing with 8 data bit/1 stop bit format. Table 89 lists

serial mode receive timing characteristics.

Figure 86. UART RS-232 Serial Mode Receive Timing Diagram

4.7.17.3 UART IrDA Mode Timing

The following subsections give the UART transmit and receive timings in IrDA mode.

4.7.17.3.3 UART IrDA Mode Transmitter

Figure 87 depicts the UART IrDA mode transmit timing, with 8 data bit/1 stop bit format. Table 90 lists

the transmit timing characteristics.

Table 88. RS-232 Serial Mode Transmit Timing Parameters

ID Parameter Symbol Min Max Units

UA1 Transmit Bit Time tTbit 1/Fbaud_rate1 -

Tref_clk2

1Fbaud_rate: Baud rate frequency. The maximum baud rate the UART can support is (ipg_perclk frequency)/16.

2Tref_clk: The period of UART reference clock ref_clk (ipg_perclk after RFDIV divider).

1/Fbaud_rate +

Tref_clk

—

Table 89. RS-232 Serial Mode Receive Timing Parameters

ID Parameter Symbol Min Max Units

UA2 Receive Bit Time1

1The UART receiver can tolerate 1/(16 x Fbaud_rate) tolerance in each bit. But accumulation tolerance in one frame must not

exceed 3/(16 x Fbaud_rate).

tRbit 1/Fbaud_rate2 - 1/(16

x Fbaud_rate)

2Fbaud_rate: Baud rate frequency. The maximum baud rate the UART can support is (ipg_perclk frequency)/16.

1/Fbaud_rate +

1/(16 x Fbaud_rate)

—

Bit 1 Bit 2Bit 0 Bit 4 Bit 5 Bit 6 Bit 7

TXD

(output) Bit 3

Start

Bit STOP

BIT

Start

Bit

Possible

Parity

Bit

Par Bit

UA1

UA1 UA1

UA1

Bit 1 Bit 2Bit 0 Bit 4 Bit 5 Bit 6 Bit 7

RXD

(input) Bit 3

Start

Bit STOP

BIT

Start

Bit

Possible

Parity

Bit

Par Bit

UA2 UA2

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 133

Figure 87. UART IrDA Mode Transmit Timing Diagram

4.7.17.3.4 UART IrDA Mode Receiver

Figure 88 depicts the UART IrDA mode receive timing, with 8 data bit/1 stop bit format. Table 91 lists the

receive timing characteristics.

Figure 88. UART IrDA Mode Receive Timing Diagram

Table 90. IrDA Mode Transmit Timing Parameters

ID Parameter Symbol Min Max Units

UA3 Transmit Bit Time in IrDA mode tTIRbit 1/Fbaud_rate1 -

Tref_clk2

1Fbaud_rate: Baud rate frequency. The maximum baud rate the UART can support is (ipg_perclk frequency)/16.

2Tref_clk: The period of UART reference clock ref_clk (ipg_perclk after RFDIV divider).

1/Fbaud_rate + Tref_clk —

UA4 Transmit IR Pulse Duration tTIRpulse (3/16) x (1/Fbaud_rate)

- Tref_clk

(3/16) x (1/Fbaud_rate)

+ Tref_clk

—

Table 91. IrDA Mode Receive Timing Parameters

ID Parameter Symbol Min Max Units

UA5 Receive Bit Time1 in IrDA mode

1 The UART receiver can tolerate 1/(16 x Fbaud_rate) tolerance in each bit. But accumulation tolerance in one frame must not

exceed 3/(16 x Fbaud_rate).

tRIRbit 1/Fbaud_rate2 - 1/(16

x Fbaud_rate)

2Fbaud_rate: Baud rate frequency. The maximum baud rate the UART can support is (ipg_perclk frequency)/16.

1/Fbaud_rate + 1/(16 x

Fbaud_rate)

—

UA6 Receive IR Pulse Duration tRIRpulse 1.41 us (5/16) x (1/Fbaud_rate)—

Bit 1 Bit 2

Bit 0 Bit 4 Bit 5 Bit 6 Bit 7

TXD

(output)

Bit 3

Start

Bit

STOP

BIT

Possible

Parity

Bit

UA3 UA3 UA3 UA3

UA4

Bit 1 Bit 2

Bit 0 Bit 4 Bit 5 Bit 6 Bit 7

RXD

(input)

Bit 3

Start

Bit

STOP

BIT

Possible

Parity

Bit

UA5 UA5 UA5 UA5

UA6

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

134 Freescale Semiconductor

Electrical Characteristics

4.7.18 USB-OH-3 Parameters

This section describes the electrical parameters of the USB OTG port and USB HOST ports. For on-chip

USB PHY parameters see Section 4.7.19, “USB PHY Parameters.”

4.7.18.1 Serial Interface

In order to support four serial different interfaces, the USB serial transceiver can be configured to operate

in one of four modes:

• DAT_SE0 bidirectional, 3-wire mode

• DAT_SE0 unidirectional, 6-wire mode

• VP_VM bidirectional, 4-wire mode

• VP_VM unidirectional, 6-wire mode

4.7.18.1.1 DAT_SE0 Bidirectional Mode

Figure 89. USB Transmit Waveform in DAT_SE0 Bidirectional Mode

Table 92. Signal Definitions — DAT_SE0 Bidirectional Mode

Name Direction Signal Description

USB_TXOE_B Out Transmit enable, active low

USB_DAT_VP Out

TX data when USB_TXOE_B is low

Differential RX data when USB_TXOE_B is high

USB_SE0_VM Out

SE0 drive when USB_TXOE_B is low

SE0 RX indicator when USB_TXOE_B is high

USB_DAT_VP

USB_SE0_VM US1

US2

Transmit

US4

USB_TXOE_B US3

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 135

Figure 90. USB Receive Waveform in DAT_SE0 Bidirectional Mode

Table 93. Definitions of USB Waveform in DAT_SE0 Bi — Directional Mode

No. Parameter Signal Name Direction Min Max Unit Conditions /

Reference Signal

US1 TX Rise/Fall Time USB_DAT_VP Out — 5.0 ns 50 pF

US2 TX Rise/Fall Time USB_SE0_VM Out — 5.0 ns 50 pF

US3 TX Rise/Fall Time USB_TXOE_B Out — 5.0 ns 50 pF

US4 TX Duty Cycle USB_DAT_VP Out 49.0 51.0 % —

US7 RX Rise/Fall Time USB_DAT_VP In — 3.0 ns 35 pF

US8 RX Rise/Fall Time USB_SE0_VM In — 3.0 ns 35 pF

US8

US7

USB_DAT_VP

USB_SE0_VM

USB_TXOE_B

Receive

USB_SE0_VM

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

136 Freescale Semiconductor

Electrical Characteristics

4.7.18.1.2 DAT_SE0 Unidirectional Mode

Figure 91. USB Transmit Waveform in DAT_SE0 Unidirectional Mode

Table 94. Signal Definitions — DAT_SE0 Unidirectional Mode

Name Direction Signal Description

USB_TXOE_B Out Transmit enable, active low

USB_DAT_VP Out TX data when USB_TXOE_B is low

USB_SE0_VM Out SE0 drive when USB_TXOE_B is low

USB_VP1 In Buffered data on DP when USB_TXOE_B is high

USB_VM1 In Buffered data on DM when USB_TXOE_B is high

USB_DAT_VP

USB_SE0_VM

US9

US10

Transmit

US12

USB_TXOE_B

US11

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 137

Figure 92. USB Receive Waveform in DAT_SE0 Unidirectional Mode

Table 95. USB Port Timing Specification in DAT_SE0 Unidirectional Mode

No. Parameter Signal Name Signal

Source Min Max Unit Condition /

Reference Signal

US9 TX Rise/Fall Time USB_DAT_VP Out — 5.0 ns 50 pF

US10 TX Rise/Fall Time USB_SE0_VM Out — 5.0 ns 50 pF

US11 TX Rise/Fall Time USB_TXOE_B Out — 5.0 ns 50 pF

US12 TX Duty Cycle USB_DAT_VP Out 49.0 51.0 % —

US15 RX Rise/Fall Time USB_VP1 In — 3.0 ns 35 pF

US16 RX Rise/Fall Time USB_VM1 In — 3.0 ns 35 pF

US16US15

USB_DAT_VP

USB_TXOE_B

Receive

USB_SE0_VM

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

138 Freescale Semiconductor

Electrical Characteristics

4.7.18.1.3 VP_VM Bidirectional Mode

Figure 93. USB Transmit Waveform in VP_VM Bidirectional Mode

Figure 94. USB Receive Waveform in VP_VM Bidirectional Mode

Table 96. Signal Definitions — VP_VM Bidirectional Mode

Name Direction Signal Description

USB_TXOE_B Out Transmit enable, active low

USB_DAT_VP Out (Tx)

In (Rx)

TX VP data when USB_TXOE_B is low

RX VP data when USB_TXOE_B is high

USB_SE0_VM Out (Tx)

In (Rx)

TX VM data when USB_TXOE_B low

RX VM data when USB_TXOE_B high

USB_DAT_VP

USB_SE0_VM

US18

US19

Transmit

USB_TXOE_B

US20

US22

US21

US22

USB_DAT_VP

USB_SE0_VM

US26

US28 US27

Receive

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 139

4.7.18.1.4 VP_VM Unidirectional Mode

Figure 95. USB Transmit Waveform in VP_VM Unidirectional Mode

Table 97. USB Port Timing Specification in VP_VM Bidirectional Mode

No. Parameter Signal Name Direction Min Max Unit Condition /

Reference Signal

US18 TX Rise/Fall Time USB_DAT_VP Out —5.0 ns 50 pF

US19 TX Rise/Fall Time USB_SE0_VM Out —5.0 ns 50 pF

US20 TX Rise/Fall Time USB_TXOE_B Out —5.0 ns 50 pF

US21 TX Duty Cycle USB_DAT_VP Out 49.0 51.0 % —

US22 TX Overlap USB_SE0_VM Out -3.0 +3.0 ns USB_DAT_VP

US26 RX Rise/Fall Time USB_DAT_VP In —3.0 ns 35 pF

US27 RX Rise/Fall Time USB_SE0_VM In —3.0 ns 35 pF

US28 RX Skew USB_DAT_VP In -4.0 +4.0 ns USB_SE0_VM

Table 98. Signal Definitions — VP_VM Unidirectional Mode

Name Direction Signal Description

USB_TXOE_B Out Transmit enable, active low

USB_DAT_VP Out TX VP data when USB_TXOE_B is low

USB_SE0_VM Out TX VM data when USB_TXOE_B is low

USB_VP1 In RX VP data when USB_TXOE_B is high

USB_VM1 In RX VM data when USB_TXOE_B is high

USB_DAT_VP

USB_SE0_VM

US30

US31

Transmit

USB_TXOE_B

US32

US34

US33

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

140 Freescale Semiconductor

Electrical Characteristics

Figure 96. USB Receive Waveform in VP_VM Unidirectional Mode

Table 99. USB Timing Specification in VP_VM Unidirectional Mode

No. Parameter Signal Direction Min Max Unit Conditions /

Reference Signal

US30 TX Rise/Fall Time USB_DAT_VP Out — 5.0 ns 50 pF

US31 TX Rise/Fall Time USB_SE0_V

Out — 5.0 ns 50 pF

US32 TX Rise/Fall Time USB_TXOE_

Out — 5.0 ns 50 pF

US33 TX Duty Cycle USB_DAT_VP Out 49.0 51.0 % —

US34 TX Overlap USB_SE0_V

Out -3.0 3.0 ns USB_DAT_VP

US38 RX Rise/Fall Time USB_VP1 In — 3.0 ns 35 pF

US39 RX Rise/Fall Time USB_VM1 In — 3.0 ns 35 pF

US40 RX Skew USB_VP1 In -4.0 +4.0 ns USB_VM1

US38

USB_VM1

Receive

USB_TXOE_B

US40

US39

USB_VP1

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 141

4.7.18.2 Parallel Interface (Normal ULPI) Timing

Electrical and timing specifications of Parallel Interface (Normal ULPI) for Host Port2 and Port3 are

presented in the subsequent sections.

Figure 97. USB Transmit/Receive Waveform in Parallel Mode

4.7.19 USB PHY Parameters

This section describes the USB-OTG PHY and the USB Host port PHY parameters.

4.7.19.1 USB PHY AC Parameters

Table 102 lists the AC timing parameters for USB PHY.

Table 100. Signal Definitions — Parallel Interface (Normal ULPI)

Name Direction Signal Description

USB_Clk In Interface clock. All interface signals are synchronous to Clock.

USB_Data[7:0] I/O Bi-directional data bus, driven low by the link during idle. Bus

ownership is determined by Dir.

USB_Dir In Direction. Control the direction of the Data bus.

USB_Stp Out Stop. The link asserts this signal for 1 clock cycle to stop the

data stream currently on the bus.

USB_Nxt In Next. The PHY asserts this signal to throttle the data.

Table 101. USB Timing Specification for Normal ULPI Mode

ID Parameter Min Max Unit Conditions /

Reference Signal

US15 Setup Time (Dir&Nxt in, Data in) 6.0 — ns 10 pF

US16 Hold Time (Dir&Nxt in, Data in) 0.0 — ns 10 pF

US17 Output Delay Time (Stp out, Data out — 9.0 ns 10 pF

USB_Stp

USB_Dir/Nxt

US17

US16

USB_Data

US15

US16

US15

US17

USB_Clk

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

142 Freescale Semiconductor

Electrical Characteristics

4.7.19.2 USB PHY Additional Electrical Parameters

Table 103 lists the parameters for additional electrical characteristics for USB PHY.

4.7.19.3 USB PHY System Clocking (SYSCLK)

Table 104 lists the USB PHY system clocking parameters.

Table 102. USB PHY AC Timing Parameters

Parameter Conditions Min Typ Max Unit

trise 1.5 Mbps

12 Mbps

480 Mbps

0.5

—300

tfall 1.5 Mbps

12 Mbps

480 Mbps

0.5

—300

Jitter 1.5 Mbps

12 Mbps

480 Mbps

——10

0.2

Table 103. Additional Electrical Characteristics for USB PHY

Parameter Conditions Min Typ Max Unit

Vcm DC

(dc level measured at receiver connector)

HS Mode

LS/FS Mode

-0.05

0.8

—0.5

2.5

Crossover Voltage LS Mode

FS Mode

1.3

—2

Power supply ripple noise

(analog 3.3 V)

< 160 MHz -50 0 50 mV

Power supply ripple noise

(analog 2.5 V)

<1.2MHz

>1.2MHz

-10

-50

Power supply ripple noise

(Digital 1.2 V)

All conditions -50 0 50 mV

Table 104. USB PHY System Clocking Parameters

Parameter Conditions Min Typ Max Unit

Clock deviation Reference Clock

frequency 24 MHz

-150 — 150 ppm

Rise/fall time — — — 200 ps

Jitter (peak-peak) < 1.2 MHz 0 — 50 ps

Jitter (peak-peak) > 1.2 MHz 0 — 100 ps

Duty-cycle Reference Clock

frequency 24 MHz

40 — 60 %

Electrical Characteristics

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 143

4.7.19.4 USB PHY Voltage Thresholds

Table 105 lists the USB PHY voltage thresholds.

4.7.19.5 USB PHY Termination

USB driver impedance in FS and HS modes is 45 Ω±10% (steady state). No external resistors required.

4.8 XTAL Electrical Specifications

Table 106 shows the XTALOSC electrical specifications.

Table 107 shows the XTALOSC_32K electrical specifications.

4.9 Integrated LDO Voltage Regulators Parameters

The PLL supplies VDD_DIG_PLL and VDD_ANA_PLL can be powered ON from internal LDO voltage

regulator (default case). In this case VDD_REG is used as internal regulator’s power source. The

regulator’s output can be used as a supply for other domains such as VDDA and VDDAL1.

Table 108 shows the VDD_DIG_PLL and VDD_ANA_PLL Integrated Voltage Regulators Parameters.

Table 105. VBUS Comparators Thresholds

Parameter Conditions Min Typ Max Unit

A-Device Session Valid — 0.8 1.4 2.0 V

B-Device Session Valid — 0.8 1.4 4.0 V

B-Device Session End — 0.2 0.45 0.8 V

VBUS Valid Comparator Threshold1

1For VBUS maximum rating, see Table 4 on page 17

—4.44.64.75V

Table 106. XTALOSC Electrical Specifications

Parameter Min Typ Max Units

Frequency 22 24 27 MHz

Table 107. XTALOSC_32K Electrical Specifications

Parameter Min Typ Max Units

Frequency — 32.768/32.01

1Recommended nominal frequency 32.768 kHz.

—kHz

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

144 Freescale Semiconductor

Boot Mode Configuration

5 Boot Mode Configuration

This section provides information on boot mode configuration pins allocation and boot devices interfaces

allocation.

5.1 Boot Mode Configuration Pins

Table 109 provides boot options, functionality, fuse values, and associated pins. Several input pins are also

sampled at reset and can be used to override fuse values, depending on the value of BT_FUSE_SEL fuse.

The boot option pins are in effect when BT_FUSE_SEL fuse is ‘0’ (cleared, which is the case for an

unblown fuse). For detailed boot mode options configured by the boot mode pins, please refer to the

i.MX53xD Fuse Map document and Boot chapter in i.MX53 Reference Manual.

Table 108. LDO Voltage Regulators Electrical Specifications

Parameter Symbol Min Typ Max Units

VDD_DIG_PLL functional Voltage

Range1

1 VDD_DIG_PLL and VDD_ANA_PLL voltages are programmable, but should not be set outside the target functional range

for proper PLL operation.

VVID_DIG_PLL 1.15 1.2 1.3 V

VDD_ANA_PLL functional Voltage

Range1

VVDD_ANA_PLL 1.7 1.8 1.95 V

VDD_DIG_PLL and VDD_ANA_PLL

accuracy

———±3%

VDD_DIG_PLL power-supply rejection

ratio2

2The gain or attenuation from the input supply variation to the output of the LDO (by design).

——-18—dB

VDD_ANA_PLL power-supply rejection

ratio2

——-15—dB

Output current3

3The limitation is for sum of the VDD_DIG_PLL and VDD_ANA_PLL current.

IVID_DIG_PLL+

IVDD_ANA_PLL

— — 125 mA

Table 109. Fuses and Associated Pins Used for Boot

Pin Direction at

Reset eFuse Name Details

BOOT_MODE[1] Input N/A Boot Mode selection

BOOT_MODE[0] Input

Boot Mode Configuration

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 145

5.2 Boot Devices Interfaces Allocation

Table 110 lists the interfaces that can be used by the boot process in accordance with the specific boot

mode configuration. The table also describes the interface’s specific modes and IOMUXC allocation,

which are configured during boot when appropriate.

EIM_A22 Input BOOT_CFG1[7]/Test Mode Selection Boot Options, Pin value overrides fuse

settings for BT_FUSE_SEL = ‘0’.

Signal Configuration as Fuse Override

Input at Power Up. These are special I/O

lines that control the boot up configuration

during product development. In production,

the boot configuration can be controlled by

fuses.

EIM_A21 Input BOOT_CFG1[6]/Test Mode Selection

EIM_A20 Input BOOT_CFG1[5]/Test Mode Selection

EIM_A19 Input BOOT_CFG1[4]

EIM_A18 Input BOOT_CFG1[3]

EIM_A17 Input BOOT_CFG1[2]

EIM_A16 Input BOOT_CFG1[1]

EIM_LBA Input BOOT_CFG1[0]

EIM_EB0 Input BOOT_CFG2[7]

EIM_EB1 Input BOOT_CFG2[6]

EIM_DA0 Input BOOT_CFG2[5]

EIM_DA1 Input BOOT_CFG2[4]

EIM_DA2 Input BOOT_CFG2[3]

EIM_DA3 Input BOOT_CFG2[2]

EIM_DA4 Input BOOT_CFG3[7]

EIM_DA5 Input BOOT_CFG3[6]

EIM_DA6 Input BOOT_CFG3[5]

EIM_DA7 Input BOOT_CFG3[4]

EIM_DA8 Input BOOT_CFG3[3]

EIM_DA9 Input BOOT_CFG3[2]

EIM_DA10 Input BOOT_CFG3[1]

Table 110. Interfaces Allocation During Boot

Interface IP Instance Allocated Pads During Boot Comment

SPI CSPI EIM_A25, EIM_D21, EIM_D22, EIM_D28 Only SS1 is supported

SPI ECSPI-1 EIM_D[19:16] Only SS1 is supported

SPI ECSPI-2 CSI_DAT[10:8], EIM_LBA Only SS1 is supported

Table 109. Fuses and Associated Pins Used for Boot (continued)

Pin Direction at

Reset eFuse Name Details

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

146 Freescale Semiconductor

Boot Mode Configuration

5.3 Power Setup During Boot

By default, VDD_DIG_PLL is driven from internal on-die 1.2 V linear regulator (LDO). In order to

achieve the standard operating mode (see VDD_DIG_PLL on Table 7), LDO output to VDD_DIG_PLL

should be configured by software by boot code after power-up to 1.3 V output. This is done by

programming the PLL1P2_VREG bits.

EIM EIM EIM • Lower 16-bit data bus A/D

multiplexed or upper 16 bit data bus

non multiplexed

• Only CS0 is supported.

NAND Flash EXTMC NAND • 8/16-bit

• NAND data can be muxed either over

EIM data or PATA data

• Only CS0 is supported

SD/MMC eSDHCv2-1 PATA_DATA[11:8], SD1_DATA[3:0], SD1_CMD,

SD1_CLK

1, 4, or 8 bit

SD/MMC eSDHCv2-2 PATA_DATA[15:12], SD2_CLK, SD2_CMD,

SD2_DATA[3:0]

1, 4, or 8 bit

SD/MMC eSDHCv3-3 PATA_RESET_B, PATA_IORDY, PATA_DA_0,

PATA_ DATA [3 :0 ] , PATA _ DATA[ 1 1 : 8 ]

1, 4, or 8 bit

SD/MMC eSDHCv2-4 PATA_DA1, PATA_DA_2, PATA_DATA[7:4],

PATA _ DATA[ 1 5 : 1 2]

1, 4, or 8 bit

I2C I2C-1 EIM_D21, EIM_D28 —

I2C I2C-2 EIM_D16, EIM_EB2 —

I2C I2C-3 EIM_D[18:17] —

PATA PATA PATA _ D I OW, PATA_ D M AC K , PATA _ D M A R Q ,

PATA_ B U F F E R _ E N , PATA _I N T R Q , PATA _ D I O R ,

PATA_RESET_B, PATA_IORDY, PATA_DA_[2:0],

PATA _C S _ [ 1 : 0 ] , PATA _ DATA [ 1 5 : 0 ]

—

SATA SATA_PHY SATA_TXM, SATA_TXP, SATA_RXP, SATA_RXM,

SATA_REXT, SATA_REFCLKM, SATA_REFCLKP

—

UART UARTv2-1 CSI0_DAT[11:10] RXD/TXD only

UART UARTv2-2 PATA_DMARQ, PATA_BUFFER_EN RXD/TXD only

UART UARTv2-3 EIM_D24, EIM_D25 RXD/TXD only

UART UARTv2-4 CSI0_DAT[13:12] RXD/TXD only

UART UARTv2-5 CSI0_DAT[15:14] RXD/TXD only

USB USB-OTG

PHY

USB_H1_GPANAIO

USB_H1_RREFEXT

USB_H1_DP

USB_H1_DN

USB_H1_VBUS

—

Table 110. Interfaces Allocation During Boot (continued)

Interface IP Instance Allocated Pads During Boot Comment

Package Information and Contact Assignments

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 147

6 Package Information and Contact Assignments

This section includes the contact assignment information and mechanical package drawing.

6.1 19x19 mm Package Information

This section contains the outline drawing, signal assignment map, ground/power reference ID (by ball grid

location) for the 19 ×19 mm, 0.8 mm pitch package.

6.1.1 Case TEPBGA-2, 19 x 19 mm, 0.8 mm Pitch, 23 x 23 Ball Matrix

Figure 98 shows the top view of the 19×19 mm package, Figure 99 shows the bottom view and the ball

location (529 solder balls) of the 19×19 mm package, and Figure 100 shows the side view of the 19×19

mm package.

Figure 98. 19 x 19 mm Package Top View

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

148 Freescale Semiconductor

Package Information and Contact Assignments

Figure 99. 19 x 19 mm Package, 529 Solder Balls, Bottom View

Figure 100. 19 x 19 mm Package Side View

Package Information and Contact Assignments

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 149

The following notes apply to Figure 98, Figure 99, and Figure 100.

1. All dimensions are in millimeters.

2. Dimensions and tolerancing per ASME Y14.5M1–994.

6.1.2 19 x 19 mm Signal Assignments, Power Rails, and I/O

Table 111 shows the device connection list for ground, power, sense, and reference contact signals.

Table 112 displays an alpha-sorted list of the signal assignments including associated power supplies. The

table also includes out of reset pad state. Table 113 shows the package ball map.

6.1.2.1 19 x 19 mm Ground, Power, Sense, and Reference Contact Assignments

Table 111 shows the device connection list for ground, power, sense, and reference contact signals

alpha-sorted by name.

Table 111. 19 x 19 mm Ground, Power, Sense, and Reference Contact Assignments

Contact Name Package Contact Assignment(s)

DDR_VREF L17

GND A1, A11, A13, A18, A2, A22, A23, AA11, AA15, AA20, AA21, AB1, AB18, AB2, AB22, AB23,

AC1, AC18, AC2, AC22, AC23, B1, B11, B13, B18, B23, C12, C20, C21, D19, E19, F19, F20,

F21, F22, G19, G7, H10, H12, H8, J11, J13, J15, J17, J20, J9, K10, K12, K14, K16, K21, K8,

L11, L13, L15, L7, L9, M10, M12, M14, M16, M8, N11, N13, N15, N9, P10, P12, P14, P16,

P21, P7, P8, R11, R13, R15, R17, R20, R9, T10, T14, T16, T8, U15, U19, V15, V18, V19,

V20, V21, V22, W19, Y14, Y15, Y19

NVCC_CKIH G17

NVCC_CSI R7

NVCC_EIM_MAIN U10, U9

NVCC_EIM_SEC U7

NVCC_EMI_DRAM H18, K17, N17, P17, T18

NVCC_FEC F11

NVCC_GPIO F8

NVCC_JTAG G9

NVCC_KEYPAD F7

NVCC_LCD J6, J7

NVCC_LVDS U13

NVCC_LVDS_BG U14

NVCC_NANDF T12

NVCC_PATA N7

NVCC_RESET H16

NVCC_SD1 H15

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

150 Freescale Semiconductor

Package Information and Contact Assignments

Table 112 displays an alpha-sorted list of the signal assignments including power rails. The table also

includes out of reset pad state.

NVCC_SD2 H14

NVCC_SRTC_POW V11

NVCC_XTAL V12

SVCC B22

SVDDGP B2

TVDAC_AHVDDRGB U17, V16

TVDAC_DHVDD U16

USB_H1_VDDA25 F13

USB_H1_VDDA33 G13

USB_OTG_VDDA25 F14

USB_OTG_VDDA33 G14

VCC H13, J14, J16, K13, K15, L14, L16, M11, M13, M15, M9, N10, N12, N14, N16, N8, P11, P13,

P15, P9, R10, R12, R14, R16, R8, T11, T13, T15, T17, T7, T9, U18, U8

VDDA G12, M17, M7, U12

VDDAL1 F9

VDD_ANA_PLL G16

VDD_DIG_PLL H17

VDD_FUSE G15

VDDGP G10, G11, G8, H11, H7, H9, J10, J12, J8, K11, K7, K9, L10, L12, L8

VDD_REG G18

VP A15, B15

VPH A9, B9

Table 111. 19 x 19 mm Ground, Power, Sense, and Reference Contact Assignments (continued)

Contact Name Package Contact Assignment(s)

Package Information and Contact Assignments

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 151

Table 112. 19 x 19 mm Signal Assignments, Power Rails, and I/O

Contact Name

Package

Contact

Assign

ment

Power Rail I/O Buffer

Type

Out of Reset Condition1

Alt.

Mode

Block Instance

Block I/O Direction Config./

Value

BOOT_MODE

C18 NVCC_RESET LVIO ALT0 SRC src_BOOT_MOD

E[0]

Input 100 KΩ PD

BOOT_MODE

B20 NVCC_RESET LVIO ALT0 SRC src_BOOT_MOD

E[1]

Input 100 KΩ PD

CKIH1 B21 NVCC_CKIH ANALOG ALT0 CAMP-

camp1_CKIH Input Analog

CKIH2 D18 NVCC_CKIH ANALOG ALT0 CAMP-

camp2_CKIH Input Analog

CKIL AB10 NVCC_SRTC_POW ANALOG — SRCT CKIL — —

CSI0_DAT10 R5 NVCC_CSI UHVIO ALT1 GPIO-5 gpio5_GPIO[28] Input 100 KΩ PU

CSI0_DAT11 T2 NVCC_CSI UHVIO ALT1 GPIO-5 gpio5_GPIO[29] Input 100 KΩ PU

CSI0_DAT12 T3 NVCC_CSI UHVIO ALT1 GPIO-5 gpio5_GPIO[30] Input 360 KΩ PD

CSI0_DAT13 T6 NVCC_CSI UHVIO ALT1 GPIO-5 gpio5_GPIO[31] Input 360 KΩ PD

CSI0_DAT14 U1 NVCC_CSI UHVIO ALT1 GPIO-6 gpio6_GPIO[0] Input 360 KΩ PD

CSI0_DAT15 U2 NVCC_CSI UHVIO ALT1 GPIO-6 gpio6_GPIO[1] Input 360 KΩ PD

CSI0_DAT16 T4 NVCC_CSI UHVIO ALT1 GPIO-6 gpio6_GPIO[2] Input 360 KΩ PD

CSI0_DAT17 T5 NVCC_CSI UHVIO ALT1 GPIO-6 gpio6_GPIO[3] Input 360 KΩ PD

CSI0_DAT18 U3 NVCC_CSI UHVIO ALT1 GPIO-6 gpio6_GPIO[4] Input 360 KΩ PD

CSI0_DAT19 U4 NVCC_CSI UHVIO ALT1 GPIO-6 gpio6_GPIO[5] Input 360 KΩ PD

CSI0_DAT4 R1 NVCC_CSI UHVIO ALT1 GPIO-5 gpio5_GPIO[22] Input 100 KΩ PU

CSI0_DAT5 R2 NVCC_CSI UHVIO ALT1 GPIO-5 gpio5_GPIO[23] Input 360 KΩ PD

CSI0_DAT6 R6 NVCC_CSI UHVIO ALT1 GPIO-5 gpio5_GPIO[24] Input 100 KΩ PU

CSI0_DAT7 R3 NVCC_CSI UHVIO ALT1 GPIO-5 gpio5_GPIO[25] Input 100 KΩ PU

CSI0_DAT8 T1 NVCC_CSI UHVIO ALT1 GPIO-5 gpio5_GPIO[26] Input 100 KΩ PU

CSI0_DAT9 R4 NVCC_CSI UHVIO ALT1 GPIO-5 gpio5_GPIO[27] Input 360 KΩ PD

CSI0_DATA_E

P3 NVCC_CSI UHVIO ALT1 GPIO-5 gpio5_GPIO[20] Input 100 KΩ PU

CSI0_MCLK P2 NVCC_CSI UHVIO ALT1 GPIO-5 gpio5_GPIO[19] Input 100 KΩ PU

CSI0_PIXCLK P1 NVCC_CSI UHVIO ALT1 GPIO-5 gpio5_GPIO[18] Input 100 KΩ PU

CSI0_VSYNC P4 NVCC_CSI UHVIO ALT1 GPIO-5 gpio5_GPIO[21] Input 100 KΩ PU

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

152 Freescale Semiconductor

Package Information and Contact Assignments

DI0_DISP_CL

H4 NVCC_LCD GPIO ALT1 GPIO-4 gpio4_GPIO[16] Input 100 KΩ PU

DI0_PIN15 E4 NVCC_LCD GPIO ALT1 GPIO-4 gpio4_GPIO[17] Input 100 KΩ PU

DI0_PIN2 D3 NVCC_LCD GPIO ALT1 GPIO-4 gpio4_GPIO[18] Input 100 KΩ PU

DI0_PIN3 C2 NVCC_LCD GPIO ALT1 GPIO-4 gpio4_GPIO[19] Input 100 KΩ PU

DI0_PIN4 D2 NVCC_LCD GPIO ALT1 GPIO-4 gpio4_GPIO[20] Input 100 KΩ PU

DISP0_DAT0 J5 NVCC_LCD GPIO ALT1 GPIO-4 gpio4_GPIO[21] Input 100 KΩ PD

DISP0_DAT1 J4 NVCC_LCD GPIO ALT1 GPIO-4 gpio4_GPIO[22] Input 100 KΩ PD

DISP0_DAT10 G3 NVCC_LCD GPIO ALT1 GPIO-4 gpio4_GPIO[31] Input 100 KΩ PU

DISP0_DAT11 H5 NVCC_LCD GPIO ALT1 GPIO-5 gpio5_GPIO[5] Input 100 KΩ PD

DISP0_DAT12 H1 NVCC_LCD GPIO ALT1 GPIO-5 gpio5_GPIO[6] Input 100 KΩ PU

DISP0_DAT13 E1 NVCC_LCD GPIO ALT1 GPIO-5 gpio5_GPIO[7] Input 100 KΩ PU

DISP0_DAT14 F2 NVCC_LCD GPIO ALT1 GPIO-5 gpio5_GPIO[8] Input 100 KΩ PU

DISP0_DAT15 F3 NVCC_LCD GPIO ALT1 GPIO-5 gpio5_GPIO[9] Input 100 KΩ PU

DISP0_DAT16 D1 NVCC_LCD GPIO ALT1 GPIO-5 gpio5_GPIO[10] Input 100 KΩ PU

DISP0_DAT17 F5 NVCC_LCD GPIO ALT1 GPIO-5 gpio5_GPIO[11] Input 100 KΩ PU

DISP0_DAT18 G4 NVCC_LCD GPIO ALT1 GPIO-5 gpio5_GPIO[12] Input 100 KΩ PU

DISP0_DAT19 G5 NVCC_LCD GPIO ALT1 GPIO-5 gpio5_GPIO[13] Input 100 KΩ PU

DISP0_DAT2 H2 NVCC_LCD GPIO ALT1 GPIO-4 gpio4_GPIO[23] Input 100 KΩ PD

DISP0_DAT20 F4 NVCC_LCD GPIO ALT1 GPIO-5 gpio5_GPIO[14] Input 100 KΩ PU

DISP0_DAT21 C1 NVCC_LCD GPIO ALT1 GPIO-5 gpio5_GPIO[15] Input 100 KΩ PU

DISP0_DAT22 E3 NVCC_LCD GPIO ALT1 GPIO-5 gpio5_GPIO[16] Input 100 KΩ PU

DISP0_DAT23 C3 NVCC_LCD GPIO ALT1 GPIO-5 gpio5_GPIO[17] Input 100 KΩ PU

DISP0_DAT3 F1 NVCC_LCD GPIO ALT1 GPIO-4 gpio4_GPIO[24] Input 100 KΩ PD

DISP0_DAT4 G2 NVCC_LCD GPIO ALT1 GPIO-4 gpio4_GPIO[25] Input 100 KΩ PD

DISP0_DAT5 H3 NVCC_LCD GPIO ALT1 GPIO-4 gpio4_GPIO[26] Input 100 KΩ PD

DISP0_DAT6 G1 NVCC_LCD GPIO ALT1 GPIO-4 gpio4_GPIO[27] Input 100 KΩ PD

DISP0_DAT7 H6 NVCC_LCD GPIO ALT1 GPIO-4 gpio4_GPIO[28] Input 100 KΩ PD

DISP0_DAT8 G6 NVCC_LCD GPIO ALT1 GPIO-4 gpio4_GPIO[29] Input 100 KΩ PU

Table 112. 19 x 19 mm Signal Assignments, Power Rails, and I/O (continued)

Contact Name

Package

Contact

Assign

ment

Power Rail I/O Buffer

Type

Out of Reset Condition1

Alt.

Mode

Block Instance

Block I/O Direction Config./

Value

Package Information and Contact Assignments

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 153

DISP0_DAT9 E2 NVCC_LCD GPIO ALT1 GPIO-4 gpio4_GPIO[30] Input 100 KΩ PU

DRAM_A0 M19 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_A[0] Output Low

DRAM_A1 L21 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_A[1] Output Low

DRAM_A10 K19 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_A[10

]

Output Low

DRAM_A11 L22 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_A[11

]

Output Low

DRAM_A12 L20 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_A[12

]

Output Low

DRAM_A13 L23 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_A[13

]

Output Low

DRAM_A14 N18 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_A[14

]

Output Low

DRAM_A15 M18 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_A[15

]

Output Low

DRAM_A2 M20 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_A[2] Output Low

DRAM_A3 N20 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_A[3] Output Low

DRAM_A4 K20 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_A[4] Output Low

DRAM_A5 N21 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_A[5] Output Low

DRAM_A6 M22 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_A[6] Output Low

DRAM_A7 N22 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_A[7] Output Low

DRAM_A8 N23 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_A[8] Output Low

DRAM_A9 M21 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_A[9] Output Low

DRAM_CALIB

RATION

M23 NVCC_EMI_DRAM special — — (used in DRAM

driver calibration.

See Special

Signal

Considerations

{add xref} above)

Input —

DRAM_CAS L18 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_CAS Output High

DRAM_CS0 K18 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_CS[

Output High

DRAM_CS1 P19 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_CS[

Output High

Table 112. 19 x 19 mm Signal Assignments, Power Rails, and I/O (continued)

Contact Name

Package

Contact

Assign

ment

Power Rail I/O Buffer

Type

Out of Reset Condition1

Alt.

Mode

Block Instance

Block I/O Direction Config./

Value

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

154 Freescale Semiconductor

Package Information and Contact Assignments

DRAM_D0 H20 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_D[0] Output High

DRAM_D1 G21 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_D[1] Output High

DRAM_D10 E22 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_D[10

]

Output High

DRAM_D11 D20 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_D[11

]

Output High

DRAM_D12 E23 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_D[12

]

Output High

DRAM_D13 C23 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_D[13

]

Output High

DRAM_D14 F23 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_D[14

]

Output High

DRAM_D15 C22 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_D[15

]

Output High

DRAM_D16 U20 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_D[16

]

Output High

DRAM_D17 T21 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_D[17

]

Output High

DRAM_D18 U21 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_D[18

]

Output High

DRAM_D19 R21 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_D[19

]

Output High

DRAM_D2 J21 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_D[2] Output High

DRAM_D20 U23 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_D[20

]

Output High

DRAM_D21 R22 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_D[21

]

Output High

DRAM_D22 U22 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_D[22

]

Output High

DRAM_D23 R23 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_D[23

]

Output High

DRAM_D24 Y20 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_D[24

]

Output High

DRAM_D25 W21 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_D[25

]

Output High

Table 112. 19 x 19 mm Signal Assignments, Power Rails, and I/O (continued)

Contact Name

Package

Contact

Assign

ment

Power Rail I/O Buffer

Type

Out of Reset Condition1

Alt.

Mode

Block Instance

Block I/O Direction Config./

Value

Package Information and Contact Assignments

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 155

DRAM_D26 Y21 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_D[26

]

Output High

DRAM_D27 W22 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_D[27

]

Output High

DRAM_D28 AA23 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_D[28

]

Output High

DRAM_D29 V23 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_D[29

]

Output High

DRAM_D3 G20 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_D[3] Output High

DRAM_D30 AA22 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_D[30

]

Output High

DRAM_D31 W23 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_D[31

]

Output High

DRAM_D4 J23 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_D[4] Output High

DRAM_D5 G23 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_D[5] Output High

DRAM_D6 J22 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_D[6] Output High

DRAM_D7 G22 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_D[7] Output High

DRAM_D8 E21 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_D[8] Output High

DRAM_D9 D21 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_D[9] Output High

DRAM_DQM0 H21 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_DQ

M[0]

Output Low

DRAM_DQM1 E20 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_DQ

M[1]

Output Low

DRAM_DQM2 T20 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_DQ

M[2]

Output Low

DRAM_DQM3 W20 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_DQ

M[3]

Output Low

DRAM_RAS J19 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_RAS Output High

DRAM_RESE

P18 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_RES

Output Low

DRAM_SDBA

R19 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_SDB

A[0]

Output Low

DRAM_SDBA

P20 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_SDB

A[1]

Output Low

Table 112. 19 x 19 mm Signal Assignments, Power Rails, and I/O (continued)

Contact Name

Package

Contact

Assign

ment

Power Rail I/O Buffer

Type

Out of Reset Condition1

Alt.

Mode

Block Instance

Block I/O Direction Config./

Value

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

156 Freescale Semiconductor

Package Information and Contact Assignments

DRAM_SDBA

N19 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_SDB

A[2]

Output Low

DRAM_SDCK

H19 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_SDC

KE[0]

Output Low

DRAM_SDCK

T19 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_SDC

KE[1]

Output Low

DRAM_SDCL

K_0

K23 NVCC_EMI_DRAM DDR3CLK ALT0 EXTMC emi_DRAM_SDC

LK0

Output Floating

DRAM_SDCL

K_0_B

K22 NVCC_EMI_DRAM DDR3CLK ALT0 EXTMC emi_DRAM_SDC

LK0_B

Output Floating

DRAM_SDCL

K_1

P22 NVCC_EMI_DRAM DDR3CLK ALT0 EXTMC emi_DRAM_SDC

LK1

Output Floating

DRAM_SDCL

K_1_B

P23 NVCC_EMI_DRAM DDR3CLK ALT0 EXTMC emi_DRAM_SDC

LK1_B

Output Floating

DRAM_SDOD

J18 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_ODT

[0]

Output Low

DRAM_SDOD

R18 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_ODT

[1]

Output Low

DRAM_SDQS

H23 NVCC_EMI_DRAM DDR3CLK ALT0 EXTMC emi_DRAM_SDQ

S[0]

Input Low

DRAM_SDQS

0_B

H22 NVCC_EMI_DRAM DDR3CLK ALT0 EXTMC emi_DRAM_SDQ

S_B[0]

Input High

DRAM_SDQS

D23 NVCC_EMI_DRAM DDR3CLK ALT0 EXTMC emi_DRAM_SDQ

S[1]

Input Low

DRAM_SDQS

1_B

D22 NVCC_EMI_DRAM DDR3CLK ALT0 EXTMC emi_DRAM_SDQ

S_B[1]

Input High

DRAM_SDQS

T22 NVCC_EMI_DRAM DDR3CLK ALT0 EXTMC emi_DRAM_SDQ

S[2]

Input Low

DRAM_SDQS

2_B

T23 NVCC_EMI_DRAM DDR3CLK ALT0 EXTMC emi_DRAM_SDQ

S_B[2]

Input High

DRAM_SDQS

Y22 NVCC_EMI_DRAM DDR3CLK ALT0 EXTMC emi_DRAM_SDQ

S[3]

Input Low

DRAM_SDQS

3_B

Y23 NVCC_EMI_DRAM DDR3CLK ALT0 EXTMC emi_DRAM_SDQ

S_B[3]

Input High

DRAM_SDWE L19 NVCC_EMI_DRAM DDR3 ALT0 EXTMC emi_DRAM_SD

Output High

Table 112. 19 x 19 mm Signal Assignments, Power Rails, and I/O (continued)

Contact Name

Package

Contact

Assign

ment

Power Rail I/O Buffer

Type

Out of Reset Condition1

Alt.

Mode

Block Instance

Block I/O Direction Config./

Value

Package Information and Contact Assignments

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 157

ECKIL AC10 NVCC_SRTC_POW ANALOG — SRTC ECKIL {no block

I/O by this name

in RM}

——

EIM_A16 AA5 NVCC_EIM_MAIN UHVIO ALT0 EXTMC emi_EIM_A[16] Output2—

EIM_A17 V7 NVCC_EIM_MAIN UHVIO ALT0 EXTMC emi_EIM_A[17] Output2—

EIM_A18 AB3 NVCC_EIM_MAIN UHVIO ALT0 EXTMC emi_EIM_A[18] Output2—

EIM_A19 W7 NVCC_EIM_MAIN UHVIO ALT0 EXTMC emi_EIM_A[19] Output2—

EIM_A20 Y6 NVCC_EIM_MAIN UHVIO ALT0 EXTMC emi_EIM_A[20] Output2—

EIM_A21 AA4 NVCC_EIM_MAIN UHVIO ALT0 EXTMC emi_EIM_A[21] Output2—

EIM_A22 AA3 NVCC_EIM_MAIN UHVIO ALT0 EXTMC emi_EIM_A[22] Output2—

EIM_A23 V6 NVCC_EIM_MAIN UHVIO ALT0 EXTMC emi_EIM_A[23] Output —

EIM_A24 Y5 NVCC_EIM_MAIN UHVIO ALT0 EXTMC emi_EIM_A[24] Output —

EIM_A25 W6 NVCC_EIM_MAIN UHVIO ALT0 EXTMC emi_EIM_A[25] Output —

EIM_BCLK W11 NVCC_EIM_MAIN UHVIO ALT0 EXTMC emi_EIM_BCLK Output —

EIM_CS0 W8 NVCC_EIM_MAIN UHVIO ALT0 EXTMC emi_EIM_CS[0] Output —

EIM_CS1 Y7 NVCC_EIM_MAIN UHVIO ALT0 EXTMC emi_EIM_CS[1] Output —

EIM_D16 U6 NVCC_EIM_SEC UHVIO ALT1 GPIO-3 gpio3_GPIO[16] Input 100 KΩ PU

EIM_D17 U5 NVCC_EIM_SEC UHVIO ALT1 GPIO-3 gpio3_GPIO[17] Input 100 KΩ PU

EIM_D18 V1 NVCC_EIM_SEC UHVIO ALT1 GPIO-3 gpio3_GPIO[18] Input 100 KΩ PU

EIM_D19 V2 NVCC_EIM_SEC UHVIO ALT1 GPIO-3 gpio3_GPIO[19] Input 100 KΩ PU

EIM_D20 W1 NVCC_EIM_SEC UHVIO ALT1 GPIO-3 gpio3_GPIO[20] Input 100 KΩ PU

EIM_D21 V3 NVCC_EIM_SEC UHVIO ALT1 GPIO-3 gpio3_GPIO[21] Input 100 KΩ PU

EIM_D22 W2 NVCC_EIM_SEC UHVIO ALT1 GPIO-3 gpio3_GPIO[22] Input 360 KΩ PD

EIM_D23 Y1 NVCC_EIM_SEC UHVIO ALT1 GPIO-3 gpio3_GPIO[23] Input 100 KΩ PU

EIM_D24 Y2 NVCC_EIM_SEC UHVIO ALT1 GPIO-3 gpio3_GPIO[24] Input 100 KΩ PU

EIM_D25 W3 NVCC_EIM_SEC UHVIO ALT1 GPIO-3 gpio3_GPIO[25] Input 100 KΩ PU

EIM_D26 V5 NVCC_EIM_SEC UHVIO ALT1 GPIO-3 gpio3_GPIO[26] Input 100 KΩ PU

EIM_D27 V4 NVCC_EIM_SEC UHVIO ALT1 GPIO-3 gpio3_GPIO[27] Input 100 KΩ PU

EIM_D28 AA1 NVCC_EIM_SEC UHVIO ALT1 GPIO-3 gpio3_GPIO[28] Input 100 KΩ PU

EIM_D29 AA2 NVCC_EIM_SEC UHVIO ALT1 GPIO-3 gpio3_GPIO[29] Input 100 KΩ PU

Table 112. 19 x 19 mm Signal Assignments, Power Rails, and I/O (continued)

Contact Name

Package

Contact

Assign

ment

Power Rail I/O Buffer

Type

Out of Reset Condition1

Alt.

Mode

Block Instance

Block I/O Direction Config./

Value

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

158 Freescale Semiconductor

Package Information and Contact Assignments

EIM_D30 W4 NVCC_EIM_SEC UHVIO ALT1 GPIO-3 gpio3_GPIO[30] Input 100 KΩ PU

EIM_D31 W5 NVCC_EIM_SEC UHVIO ALT1 GPIO-3 gpio3_GPIO[31] Input 360 KΩ PD

EIM_DA0 Y8 NVCC_EIM_MAIN UHVIO ALT0 EXTMC emi_NAND_EIM

_DA[0]

Input2100 KΩ PU

EIM_DA1 AC4 NVCC_EIM_MAIN UHVIO ALT0 EXTMC emi_NAND_EIM

_DA[1]

Input2100 KΩ PU

EIM_DA10 AB7 NVCC_EIM_MAIN UHVIO ALT0 EXTMC emi_NAND_EIM

_DA[10]

Input2100 KΩ PU

EIM_DA11 AC6 NVCC_EIM_MAIN UHVIO ALT0 EXTMC emi_NAND_EIM

_DA[11]

Input 100 KΩ PU

EIM_DA12 V10 NVCC_EIM_MAIN UHVIO ALT0 EXTMC emi_NAND_EIM

_DA[12]

Input 100 KΩ PU

EIM_DA13 AC7 NVCC_EIM_MAIN UHVIO ALT0 EXTMC emi_NAND_EIM

_DA[13]

Input 100 KΩ PU

EIM_DA14 Y10 NVCC_EIM_MAIN UHVIO ALT0 EXTMC emi_NAND_EIM

_DA[14]

Input 100 KΩ PU

EIM_DA15 AA9 NVCC_EIM_MAIN UHVIO ALT0 EXTMC emi_NAND_EIM

_DA[15]

Input 100 KΩ PU

EIM_DA2 AA7 NVCC_EIM_MAIN UHVIO ALT0 EXTMC emi_NAND_EIM

_DA[2]

Input2100 KΩ PU

EIM_DA3 W9 NVCC_EIM_MAIN UHVIO ALT0 EXTMC emi_NAND_EIM

_DA[3]

Input2100 KΩ PU

EIM_DA4 AB6 NVCC_EIM_MAIN UHVIO ALT0 EXTMC emi_NAND_EIM

_DA[4]

Input2100 KΩ PU

EIM_DA5 V9 NVCC_EIM_MAIN UHVIO ALT0 EXTMC emi_NAND_EIM

_DA[5]

Input2100 KΩ PU

EIM_DA6 Y9 NVCC_EIM_MAIN UHVIO ALT0 EXTMC emi_NAND_EIM

_DA[6]

Input2100 KΩ PU

EIM_DA7 AC5 NVCC_EIM_MAIN UHVIO ALT0 EXTMC emi_NAND_EIM

_DA[7]

Input2100 KΩ PU

EIM_DA8 AA8 NVCC_EIM_MAIN UHVIO ALT0 EXTMC emi_NAND_EIM

_DA[8]

Input2100 KΩ PU

EIM_DA9 W10 NVCC_EIM_MAIN UHVIO ALT0 EXTMC emi_NAND_EIM

_DA[9]

Input2100 KΩ PU

EIM_EB0 AC3 NVCC_EIM_MAIN UHVIO ALT0 EXTMC emi_EIM_EB[0] Output2—

Table 112. 19 x 19 mm Signal Assignments, Power Rails, and I/O (continued)

Contact Name

Package

Contact

Assign

ment

Power Rail I/O Buffer

Type

Out of Reset Condition1

Alt.

Mode

Block Instance

Block I/O Direction Config./

Value

Package Information and Contact Assignments

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 159

EIM_EB1 AB5 NVCC_EIM_MAIN UHVIO ALT0 EXTMC emi_EIM_EB[1] Output2—

EIM_EB2 Y3 NVCC_EIM_MAIN UHVIO ALT1 GPIO-2 gpio2_GPIO[30] Input 100 KΩ PU

EIM_EB3 Y4 NVCC_EIM_MAIN UHVIO ALT1 GPIO-2 gpio2_GPIO[31] Input 100 KΩ PU

EIM_LBA AA6 NVCC_EIM_MAIN UHVIO ALT0 EXTMC emi_EIM_LBA Output2—

EIM_OE V8 NVCC_EIM_MAIN UHVIO ALT0 EXTMC emi_EIM_OE Output —

EIM_RW AB4 NVCC_EIM_MAIN UHVIO ALT0 EXTMC emi_EIM_RW Output —

EIM_WAIT AB9 NVCC_EIM_MAIN UHVIO ALT0 EXTMC emi_EIM_WAIT Output —

EXTAL AB11 NVCC_XTAL ANALOG — EXTAL

OSC

EXTAL — —

FASTR_ANA E18 NVCC_CKIH ANALOG — — (reserved, tie to

ground)

——

FASTR_DIG E17 NVCC_CKIH ANALOG — — (reserved, tie to

ground)

——

FEC_CRS_DV D11 NVCC_FEC UHVIO ALT1 GPIO-1 gpio1_GPIO[25] Input 100 KΩ PU

FEC_MDC E10 NVCC_FEC UHVIO ALT1 GPIO-1 gpio1_GPIO[31] Input 100 KΩ PU

FEC_MDIO D12 NVCC_FEC UHVIO ALT1 GPIO-1 gpio1_GPIO[22] Input 100 KΩ PU

FEC_REF_CL

E12 NVCC_FEC UHVIO ALT1 GPIO-1 gpio1_GPIO[23] Input 100 KΩ PU

FEC_RX_ER F12 NVCC_FEC UHVIO ALT1 GPIO-1 gpio1_GPIO[24] Input 100 KΩ PU

FEC_RXD0 C11 NVCC_FEC UHVIO ALT1 GPIO-1 gpio1_GPIO[27] Input 100 KΩ PU

FEC_RXD1 E11 NVCC_FEC UHVIO ALT1 GPIO-1 gpio1_GPIO[26] Input 100 KΩ PU

FEC_TX_EN C10 NVCC_FEC UHVIO ALT1 GPIO-1 gpio1_GPIO[28] Input 360 KΩ PD

FEC_TXD0 F10 NVCC_FEC UHVIO ALT1 GPIO-1 gpio1_GPIO[30] Input 100 KΩ PU

FEC_TXD1 D10 NVCC_FEC UHVIO ALT1 GPIO-1 gpio1_GPIO[29] Input 100 KΩ PU

GPIO_0 C8 NVCC_GPIO UHVIO ALT1 GPIO-1 gpio1_GPIO[0] Input 360 KΩ PD

GPIO_1 B7 NVCC_GPIO UHVIO ALT1 GPIO-1 gpio1_GPIO[1] Input 360 KΩ PD

GPIO_10 W16 TVDAC_AHVDDRG

GPIO ALT0 GPIO-4 gpio4_GPIO[0] Input 100 KΩ PU

GPIO_11 V17 TVDAC_AHVDDRG

GPIO ALT0 GPIO-4 gpio4_GPIO[1] Input 100 KΩ PU

GPIO_12 W17 TVDAC_AHVDDRG

GPIO ALT0 GPIO-4 gpio4_GPIO[2] Input 100 KΩ PU

Table 112. 19 x 19 mm Signal Assignments, Power Rails, and I/O (continued)

Contact Name

Package

Contact

Assign

ment

Power Rail I/O Buffer

Type

Out of Reset Condition1

Alt.

Mode

Block Instance

Block I/O Direction Config./

Value

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

160 Freescale Semiconductor

Package Information and Contact Assignments

GPIO_13 AA18 TVDAC_AHVDDRG

GPIO ALT0 GPIO-4 gpio4_GPIO[3] Input 100 KΩ PU

GPIO_14 W18 TVDAC_AHVDDRG

GPIO ALT0 GPIO-4 gpio4_GPIO[4] Input 100 KΩ PU

GPIO_16 C6 NVCC_GPIO UHVIO ALT1 GPIO-7 gpio7_GPIO[11] Input 360 KΩ PD

GPIO_17 A3 NVCC_GPIO UHVIO ALT1 GPIO-7 gpio7_GPIO[12] Input 360 KΩ PD

GPIO_18 D7 NVCC_GPIO UHVIO ALT1 GPIO-7 gpio7_GPIO[13] Input 360 KΩ PD

GPIO_19 B4 NVCC_KEYPAD UHVIO ALT1 GPIO-4 gpio4_GPIO[5] Input3100 KΩ PU

GPIO_2 C7 NVCC_GPIO UHVIO ALT1 GPIO-1 gpio1_GPIO[2] Input 360 KΩ PD

GPIO_3 A6 NVCC_GPIO UHVIO ALT1 GPIO-1 gpio1_GPIO[3] Input 360 KΩ PD

GPIO_4 D8 NVCC_GPIO UHVIO ALT1 GPIO-1 gpio1_GPIO[4] Input 100 KΩ PU

GPIO_5 A5 NVCC_GPIO UHVIO ALT1 GPIO-1 gpio1_GPIO[5] Input 360 KΩ PD

GPIO_6 B6 NVCC_GPIO UHVIO ALT1 GPIO-1 gpio1_GPIO[6] Input 360 KΩ PD

GPIO_7 A4 NVCC_GPIO UHVIO ALT1 GPIO-1 gpio1_GPIO[7] Input 360 KΩ PD

GPIO_8 B5 NVCC_GPIO UHVIO ALT1 GPIO-1 gpio1_GPIO[8] Input 360 KΩ PD

GPIO_9 E8 NVCC_GPIO UHVIO ALT1 GPIO-1 gpio1_GPIO[9] Input 100 KΩ PU

JTAG_MOD C9 NVCC_JTAG GPIO ALT0 SJC sjc_MOD Input 100 KΩ PU

JTAG_TCK D9 NVCC_JTAG GPIO ALT0 SJC sjc_TCK Input 100 KΩ PD

JTAG_TDI B8 NVCC_JTAG GPIO ALT0 SJC sjc_TDI Input 47 KΩ PU

JTAG_TDO A7 NVCC_JTAG GPIO ALT0 SJC sjc_TDO Input Keeper

JTAG_TMS A8 NVCC_JTAG GPIO ALT0 SJC sjc_TMS Input 47 KΩ PU

JTAG_TRSTB E9 NVCC_JTAG GPIO ALT0 SJC sjc_TRSTB Input 47 KΩ PU

KEY_COL0 C5 NVCC_KEYPAD UHVIO ALT1 GPIO-4 gpio4_GPIO[6] Input4100 KΩ PU

KEY_COL1 E7 NVCC_KEYPAD UHVIO ALT1 GPIO-4 gpio4_GPIO[8] Input 100 KΩ PU

KEY_COL2 C4 NVCC_KEYPAD UHVIO ALT1 GPIO-4 gpio4_GPIO[10] Input 100 KΩ PU

KEY_COL3 F6 NVCC_KEYPAD UHVIO ALT1 GPIO-4 gpio4_GPIO[12] Input 100 KΩ PU

KEY_COL4 E5 NVCC_KEYPAD UHVIO ALT1 GPIO-4 gpio4_GPIO[14] Input 100 KΩ PU

KEY_ROW0 B3 NVCC_KEYPAD UHVIO ALT1 GPIO-4 gpio4_GPIO[7] Input 360 KΩ PD

KEY_ROW1 D6 NVCC_KEYPAD UHVIO ALT1 GPIO-4 gpio4_GPIO[9] Input 100 KΩ PU

KEY_ROW2 D5 NVCC_KEYPAD UHVIO ALT1 GPIO-4 gpio4_GPIO[11] Input 100 KΩ PU

Table 112. 19 x 19 mm Signal Assignments, Power Rails, and I/O (continued)

Contact Name

Package

Contact

Assign

ment

Power Rail I/O Buffer

Type

Out of Reset Condition1

Alt.

Mode

Block Instance

Block I/O Direction Config./

Value

Package Information and Contact Assignments

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 161

KEY_ROW3 D4 NVCC_KEYPAD UHVIO ALT1 GPIO-4 gpio4_GPIO[13] Input 100 KΩ PU

KEY_ROW4 E6 NVCC_KEYPAD UHVIO ALT1 GPIO-4 gpio4_GPIO[15] Input 360 KΩ PD

LVDS_BG_RE

AA14 NVCC_LVDS_BG ANALOG — LDB LVDS_BG_RES — —

LVDS0_CLK_

AB16 NVCC_LVDS LVDS ALT0 GPIO-7 gpio7_GPI[25] Input Floating

LVDS0_CLK_

AC16 NVCC_LVDS LVDS ALT0 GPIO-7 gpio7_GPI[24] Input Floating

LVDS0_TX0_

Y17 NVCC_LVDS LVDS ALT0 GPIO-7 gpio7_GPI[31] Input Floating

LVDS0_TX0_P AA17 NVCC_LVDS LVDS ALT0 GPIO-7 gpio7_GPI[30] Input Floating

LVDS0_TX1_

AB17 NVCC_LVDS LVDS ALT0 GPIO-7 gpio7_GPI[29] Input Floating

LVDS0_TX1_P AC17 NVCC_LVDS LVDS ALT0 GPIO-7 gpio7_GPI[28] Input Floating

LVDS0_TX2_

Y16 NVCC_LVDS LVDS ALT0 GPIO-7 gpio7_GPI[27] Input Floating

LVDS0_TX2_P AA16 NVCC_LVDS LVDS ALT0 GPIO-7 gpio7_GPI[26] Input Floating

LVDS0_TX3_

AB15 NVCC_LVDS LVDS ALT0 GPIO-7 gpio7_GPI[23] Input Floating

LVDS0_TX3_P AC15 NVCC_LVDS LVDS ALT0 GPIO-7 gpio7_GPI[22] Input Floating

LVDS1_CLK_

AA13 NVCC_LVDS LVDS ALT0 GPIO-6 gpio6_GPI[27] Input Floating

LVDS1_CLK_

Y13 NVCC_LVDS LVDS ALT0 GPIO-6 gpio6_GPI[26] Input Floating

LVDS1_TX0_

AC14 NVCC_LVDS LVDS ALT0 GPIO-6 gpio6_GPI[31] Input Floating

LVDS1_TX0_P AB14 NVCC_LVDS LVDS ALT0 GPIO-6 gpio6_GPI[30] Input Floating

LVDS1_TX1_

AC13 NVCC_LVDS LVDS ALT0 GPIO-6 gpio6_GPI[29] Input Floating

LVDS1_TX1_P AB13 NVCC_LVDS LVDS ALT0 GPIO-6 gpio6_GPI[28] Input Floating

LVDS1_TX2_

AC12 NVCC_LVDS LVDS ALT0 GPIO-6 gpio6_GPI[25] Input Floating

LVDS1_TX2_P AB12 NVCC_LVDS LVDS ALT0 GPIO-6 gpio6_GPI[24] Input Floating

Table 112. 19 x 19 mm Signal Assignments, Power Rails, and I/O (continued)

Contact Name

Package

Contact

Assign

ment

Power Rail I/O Buffer

Type

Out of Reset Condition1

Alt.

Mode

Block Instance

Block I/O Direction Config./

Value

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

162 Freescale Semiconductor

Package Information and Contact Assignments

LVDS1_TX3_

AA12 NVCC_LVDS LVDS ALT0 GPIO-6 gpio6_GPI[23] Input Floating

LVDS1_TX3_P Y12 NVCC_LVDS LVDS ALT0 GPIO-6 gpio6_GPI[22] Input Floating

NANDF_ALE Y11 NVCC_NANDF UHVIO ALT1 GPIO-6 gpio6_GPIO[8] Input 100 KΩ PU

NANDF_CLE AA10 NVCC_NANDF UHVIO ALT1 GPIO-6 gpio6_GPIO[7] Input 100 KΩ PU

NANDF_CS0 W12 NVCC_NANDF UHVIO ALT1 GPIO-6 gpio6_GPIO[11] Input 100 KΩ PU

NANDF_CS1 V13 NVCC_NANDF UHVIO ALT1 GPIO-6 gpio6_GPIO[14] Input 100 KΩ PU

NANDF_CS2 V14 NVCC_NANDF UHVIO ALT1 GPIO-6 gpio6_GPIO[15] Input 100 KΩ PU

NANDF_CS3 W13 NVCC_NANDF UHVIO ALT1 GPIO-6 gpio6_GPIO[16] Input 100 KΩ PU

NANDF_RB0 U11 NVCC_NANDF UHVIO ALT1 GPIO-6 gpio6_GPIO[10] Input 100 KΩ PU

NANDF_RE_B AC8 NVCC_EIM_MAIN UHVIO ALT1 GPIO-6 gpio6_GPIO[13] Input 100 KΩ PU

NANDF_WE_

AB8 NVCC_EIM_MAIN UHVIO ALT1 GPIO-6 gpio6_GPIO[12] Input 100 KΩ PU

NANDF_WP_

AC9 NVCC_NANDF UHVIO ALT1 GPIO-6 gpio6_GPIO[9] Input 100 KΩ PU

PATA _ B U F F E

R_EN

K4 NVCC_PATA UHVIO ALT1 GPIO-7 gpio7_GPIO[1] Input 100 KΩ PU

PATA_CS_0 L5 NVCC_PATA UHVIO ALT1 GPIO-7 gpio7_GPIO[9] Input 100 KΩ PU

PATA_CS_1 L2 NVCC_PATA UHVIO ALT1 GPIO-7 gpio7_GPIO[10] Input 100 KΩ PU

PATA_DA_0 K6 NVCC_PATA UHVIO ALT1 GPIO-7 gpio7_GPIO[6] Input 100 KΩ PU

PATA_DA_1 L3 NVCC_PATA UHVIO ALT1 GPIO-7 gpio7_GPIO[7] Input 100 KΩ PU

PATA_DA_2 L4 NVCC_PATA UHVIO ALT1 GPIO-7 gpio7_GPIO[8] Input 100 KΩ PU

PATA_DATA0 L1 NVCC_PATA UHVIO ALT1 GPIO-2 gpio2_GPIO[0] Input 100 KΩ PU

PATA_DATA1 M1 NVCC_PATA UHVIO ALT1 GPIO-2 gpio2_GPIO[1] Input 100 KΩ PU

PATA_DATA10 N4 NVCC_PATA UHVIO ALT1 GPIO-2 gpio2_GPIO[10] Input 100 KΩ PU

PATA_DATA11 M6 NVCC_PATA UHVIO ALT1 GPIO-2 gpio2_GPIO[11] Input 100 KΩ PU

PATA_DATA12 N5 NVCC_PATA UHVIO ALT1 GPIO-2 gpio2_GPIO[12] Input 100 KΩ PU

PATA_DATA13 N6 NVCC_PATA UHVIO ALT1 GPIO-2 gpio2_GPIO[13] Input 100 KΩ PU

PATA_DATA14 P6 NVCC_PATA UHVIO ALT1 GPIO-2 gpio2_GPIO[14] Input 100 KΩ PU

PATA_DATA15 P5 NVCC_PATA UHVIO ALT1 GPIO-2 gpio2_GPIO[15] Input 100 KΩ PU

Table 112. 19 x 19 mm Signal Assignments, Power Rails, and I/O (continued)

Contact Name

Package

Contact

Assign

ment

Power Rail I/O Buffer

Type

Out of Reset Condition1

Alt.

Mode

Block Instance

Block I/O Direction Config./

Value

Package Information and Contact Assignments

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 163

PATA_DATA2 L6 NVCC_PATA UHVIO ALT1 GPIO-2 gpio2_GPIO[2] Input 100 KΩ PU

PATA_DATA3 M2 NVCC_PATA UHVIO ALT1 GPIO-2 gpio2_GPIO[3] Input 100 KΩ PU

PATA_DATA4 M3 NVCC_PATA UHVIO ALT1 GPIO-2 gpio2_GPIO[4] Input 100 KΩ PU

PATA_DATA5 M4 NVCC_PATA UHVIO ALT1 GPIO-2 gpio2_GPIO[5] Input 100 KΩ PU

PATA_DATA6 N1 NVCC_PATA UHVIO ALT1 GPIO-2 gpio2_GPIO[6] Input 100 KΩ PU

PATA_DATA7 M5 NVCC_PATA UHVIO ALT1 GPIO-2 gpio2_GPIO[7] Input 100 KΩ PU

PATA_DATA8 N2 NVCC_PATA UHVIO ALT1 GPIO-2 gpio2_GPIO[8] Input 100 KΩ PU

PATA_DATA9 N3 NVCC_PATA UHVIO ALT1 GPIO-2 gpio2_GPIO[9] Input 100 KΩ PU

PATA_DIOR K3 NVCC_PATA UHVIO ALT1 GPIO-7 gpio7_GPIO[3] Input 100 KΩ PU

PATA_DIOW J3 NVCC_PATA UHVIO ALT1 GPIO-6 gpio6_GPIO[17] Input 100 KΩ PU

PATA_DMACK J2 NVCC_PATA UHVIO ALT1 GPIO-6 gpio6_GPIO[18] Input 100 KΩ PU

PATA_DMARQ J1 NVCC_PATA UHVIO ALT1 GPIO-7 gpio7_GPIO[0] Input 100 KΩ PU

PATA_INTRQ K5 NVCC_PATA UHVIO ALT1 GPIO-7 gpio7_GPIO[2] Input 100 KΩ PU

PATA_IORDY K1 NVCC_PATA UHVIO ALT1 GPIO-7 gpio7_GPIO[5] Input 100 KΩ PU

PATA _ R E S E T

K2 NVCC_PATA UHVIO ALT1 GPIO-7 gpio7_GPIO[4] Input 100 KΩ PU

PMIC_ON_RE

W14 NVCC_SRTC_POW GPIO ALT0 SRTC srtc_SRTCALAR

Output —

PMIC_STBY_

REQ

W15 NVCC_SRTC_POW GPIO ALT0 CCM ccm_PMIC_VST

BY_REQ

Output —

POR_B C19 NVCC_RESET LVIO ALT0 SRC src_POR_B Input 100 KΩ PU

RESET_IN_B A21 NVCC_RESET LVIO ALT0 SRC src_RESET_B Input 100 KΩ PU

SATA_REFCL

A14 VPH ANALOG — SATA SATA_REFCLKM — —

SATA_REFCL

B14 VPH ANALOG — SATA SATA_REFCLKP — —

SATA_REXT C13 VPH ANALOG — SATA SATA_REXT — —

SATA_RXM A12 VPH ANALOG — SATA SATA_RXM — —

SATA_RXP B12 VPH ANALOG — SATA SATA_RXP — —

SATA_TXM B10 VPH ANALOG — SATA SATA_TXM — —

SATA_TXP A10 VPH ANALOG — SATA SATA_TXP — —

Table 112. 19 x 19 mm Signal Assignments, Power Rails, and I/O (continued)

Contact Name

Package

Contact

Assign

ment

Power Rail I/O Buffer

Type

Out of Reset Condition1

Alt.

Mode

Block Instance

Block I/O Direction Config./

Value

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

164 Freescale Semiconductor

Package Information and Contact Assignments

SD1_CLK E16 NVCC_SD1 UHVIO ALT1 GPIO-1 gpio1_GPIO[20] Input 100 KΩ PU

SD1_CMD F18 NVCC_SD1 UHVIO ALT1 GPIO-1 gpio1_GPIO[18] Input 100 KΩ PU

SD1_DATA0 A20 NVCC_SD1 UHVIO ALT1 GPIO-1 gpio1_GPIO[16] Input 100 KΩ PU

SD1_DATA1 C17 NVCC_SD1 UHVIO ALT1 GPIO-1 gpio1_GPIO[17] Input 100 KΩ PU

SD1_DATA2 F17 NVCC_SD1 UHVIO ALT1 GPIO-1 gpio1_GPIO[19] Input 100 KΩ PU

SD1_DATA3 F16 NVCC_SD1 UHVIO ALT1 GPIO-1 gpio1_GPIO[21] Input 100 KΩ PU

SD2_CLK E14 NVCC_SD2 UHVIO ALT1 GPIO-1 gpio1_GPIO[10] Input 100 KΩ PU

SD2_CMD C15 NVCC_SD2 UHVIO ALT1 GPIO-1 gpio1_GPIO[11] Input 100 KΩ PU

SD2_DATA0 D13 NVCC_SD2 UHVIO ALT1 GPIO-1 gpio1_GPIO[15] Input 100 KΩ PU

SD2_DATA1 C14 NVCC_SD2 UHVIO ALT1 GPIO-1 gpio1_GPIO[14] Input 100 KΩ PU

SD2_DATA2 D14 NVCC_SD2 UHVIO ALT1 GPIO-1 gpio1_GPIO[13] Input 100 KΩ PU

SD2_DATA3 E13 NVCC_SD2 UHVIO ALT1 GPIO-1 gpio1_GPIO[12] Input 100 KΩ PU

TEST_MODE D17 NVCC_RESET LVIO ALT0 tcu_TEST_MOD

Input 100 KΩ PD

TVCDC_IOB_

BACK

AB19 TVDAC_AHVDDRG

ANALOG — TVE TVCDC_IOB_BA

——

TVCDC_IOG_

BACK

AC20 TVDAC_AHVDDRG

ANALOG — TVE TVCDC_IOG_BA

——

TVCDC_IOR_

BACK

AB21 TVDAC_AHVDDRG

ANALOG — TVE TVCDC_IOR_BA

——

TVDAC_COM

AA19 TVDAC_AHVDDRG

ANALOG — TVE TVDAC_COMP — —

TVDAC_IOB AC19 TVDAC_AHVDDRG

ANALOG — TVE TVDAC_IOB — —

TVDAC_IOG AB20 TVDAC_AHVDDRG

ANALOG — TVE TVDAC_IOG — —

TVDAC_IOR AC21 TVDAC_AHVDDRG

ANALOG — TVE TVDAC_IOR — —

TVDAC_VREF Y18 TVDAC_AHVDDRG

ANALOG — TVE TVDAC_VREF — —

USB_H1_DN B17 USB_H1_VDDA25,

USB_H1_VDDA33

ANALOG50 — USB USB_H1_DN — —

Table 112. 19 x 19 mm Signal Assignments, Power Rails, and I/O (continued)

Contact Name

Package

Contact

Assign

ment

Power Rail I/O Buffer

Type

Out of Reset Condition1

Alt.

Mode

Block Instance

Block I/O Direction Config./

Value

Package Information and Contact Assignments

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 165

NOTE

KEY_COL0 and GPIO_19 act as output for diagnostic signals during

power-on reset.

USB_H1_DP A17 USB_H1_VDDA25,

USB_H1_VDDA33

ANALOG50 — USB USB_H1_DP — —

USB_H1_GPA

NAIO

A16 USB_H1_VDDA25,

USB_H1_VDDA33

ANALOG25 — USB USB_H1_GPANA

——

USB_H1_RRE

FEXT

B16 USB_H1_VDDA25,

USB_H1_VDDA33

ANALOG25 — USB USB_H1_RREFE

——

USB_H1_VBU

D15 USB_H1_VDDA25,

USB_H1_VDDA33

ANALOG50 — USB USB_H1_VBUS — —

USB_OTG_D

A19 USB_OTG_VDDA25,

USB_OTG_VDDA33

ANALOG50 — USB USB_OTG_DN — —

USB_OTG_DP B19 USB_OTG_VDDA25,

USB_OTG_VDDA33

ANALOG50 — USB USB_OTG_DP — —

USB_OTG_G

PA N A I O

F15 USB_OTG_VDDA25,

USB_OTG_VDDA33

ANALOG25 — USB USB_OTG_GPA

NAIO

——

USB_OTG_ID C16 USB_OTG_VDDA25,

USB_OTG_VDDA33

ANALOG25 — USB USB_OTG_ID — —

USB_OTG_R

REFEXT

D16 USB_OTG_VDDA25,

USB_OTG_VDDA33

ANALOG25 — USB USB_OTG_RRE

FEXT

——

USB_OTG_VB

E15 USB_OTG_VDDA25,

USB_OTG_VDDA33

ANALOG50 — USB USB_OTG_VBU

——

XTAL AC11 NVCC_XTAL ANALOG — XTALO

XTAL — —

1The state immediately after reset and before ROM firmware or software has executed.

2During power-on reset, this port acts as input for fuse override. See Section 5.1, “Boot Mode Configuration Pins” for details.

For appropriate resistor values, see Chapter 1 of i.MX53 System Development User's Guide (MX53UG).

3During power-on reset, this port acts as output for diagnostic signal INT_BOOT

4During power-on reset, this port acts as output for diagnostic signal ANY_PU_RST

Table 112. 19 x 19 mm Signal Assignments, Power Rails, and I/O (continued)

Contact Name

Package

Contact

Assign

ment

Power Rail I/O Buffer

Type

Out of Reset Condition1

Alt.

Mode

Block Instance

Block I/O Direction Config./

Value

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

166 Freescale Semiconductor

Package Information and Contact Assignments

6.2 19 x 19 mm, 0.8 Pitch Ball Map

Table 113 shows the 19 × 19 mm, 0.8 pitch ball map.

Table 113. 19 x 19 mm, 0.8 Pitch Ball Map

GND

GPIO_17

GPIO_7

GPIO_5

GPIO_3

JTAG_TDO

JTAG_TMS

VPH

SATA_TXP

GND

SATA_RXM

GND

SATA_REFCLKM

USB_H1_GPANAIO

USB_H1_DP

GND

USB_OTG_DN

SD1_DATA0

RESET_IN_B

GND

SVDDGP

KEY_ROW0

GPIO_19

GPIO_8

GPIO_6

GPIO_1

JTAG_TDI

VPH

SATA_TXM

GND

SATA_RXP

GND

SATA_REFCLKP

USB_H1_RREFEXT

USB_H1_DN

GND

USB_OTG_DP

BOOT_MODE1

CKIH1

SVCC

GND

DISP0_DAT21

DI0_PIN3

DISP0_DAT23

KEY_COL2

KEY_COL0

GPIO_16

GPIO_2

GPIO_0

JTAG_MOD

FEC_TX_EN

FEC_RXD0

GND

SATA_REXT

SD2_DATA1

SD2_CMD

USB_OTG_ID

SD1_DATA1

BOOT_MODE0

POR_B

GND

DRAM_D15

DRAM_D13

DISP0_DAT16

DI0_PIN4

DI0_PIN2

KEY_ROW3

KEY_ROW2

KEY_ROW1

GPIO_18

GPIO_4

JTAG_TCK

FEC_TXD1

FEC_CRS_DV

FEC_MDIO

SD2_DATA0

SD2_DATA2

USB_H1_VBUS

USB_OTG_RREFEXT

TEST_MODE

CKIH2

GND

DRAM_D11

DRAM_D9

DRAM_SDQS1_B

DRAM_SDQS1

DISP0_DAT13

DISP0_DAT9

DISP0_DAT22

DI0_PIN15

KEY_COL4

KEY_ROW4

KEY_COL1

GPIO_9

JTAG_TRSTB

FEC_MDC

FEC_RXD1

FEC_REF_CLK

SD2_DATA3

SD2_CLK

USB_OTG_VBUS

SD1_CLK

FASTR_DIG

FASTR_ANA

GND

DRAM_DQM1

DRAM_D8

DRAM_D10

DRAM_D12

Package Information and Contact Assignments

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 167

DISP0_DAT3

DISP0_DAT14

DISP0_DAT15

DISP0_DAT20

DISP0_DAT17

KEY_COL3

NVCC_KEYPAD

NVCC_GPIO

VDDAL1

FEC_TXD0

NVCC_FEC

FEC_RX_ER

USB_H1_VDDA25

USB_OTG_VDDA25

USB_OTG_GPANAIO

SD1_DATA3

SD1_DATA2

SD1_CMD

GND

DRAM_D14

DISP0_DAT6

DISP0_DAT4

DISP0_DAT10

DISP0_DAT18

DISP0_DAT19

DISP0_DAT8

GND

VDDGP

NVCC_JTAG

VDDGP

VDDA

USB_H1_VDDA33

USB_OTG_VDDA33

VDD_FUSE

VDD_ANA_PLL

NVCC_CKIH

VDD_REG

GND

DRAM_D3

DRAM_D1

DRAM_D7

DRAM_D5

DISP0_DAT12

DISP0_DAT2

DISP0_DAT5

DI0_DISP_CLK

DISP0_DAT11

DISP0_DAT7

VDDGP

GND

VDDGP

GND

VDDGP

GND

VCC

NVCC_SD2

NVCC_SD1

NVCC_RESET

VDD_DIG_PLL

NVCC_EMI_DRAM

DRAM_SDCKE0

DRAM_D0

DRAM_DQM0

DRAM_SDQS0_B

DRAM_SDQS0

PATA_DMARQ

PATA _ D M AC K

PATA _ D I OW

DISP0_DAT1

DISP0_DAT0

NVCC_LCD

VDDGP

GND

VDDGP

GND

VDDGP

GND

VCC

GND

VCC

GND

DRAM_SDODT0

DRAM_RAS

GND

DRAM_D2

DRAM_D6

DRAM_D4

PATA _ I O R DY

PATA_RESET_B

PATA _ D I O R

PATA _ BU F F E R _ E N

PATA_INTRQ

PATA_ DA _ 0

VDDGP

GND

VDDGP

GND

VDDGP

GND

VCC

GND

VCC

GND

NVCC_EMI_DRAM

DRAM_CS0

DRAM_A10

DRAM_A4

GND

DRAM_SDCLK_0_B

DRAM_SDCLK_0

PATA _ DATA 0

PATA _ C S _ 1

PATA _ DA _ 1

PATA _ DA _ 2

PATA _ C S _ 0

PATA _ DATA 2

GND

VDDGP

GND

VDDGP

GND

VDDGP

GND

VCC

GND

VCC

DDR_VREF

DRAM_CAS

DRAM_SDWE

DRAM_A12

DRAM_A1

DRAM_A11

DRAM_A13

Table 113. 19 x 19 mm, 0.8 Pitch Ball Map

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

168 Freescale Semiconductor

Package Information and Contact Assignments

PATA _ DATA 1

PATA _ DATA 3

PATA _ DATA 4

PATA _ DATA 5

PATA _ DATA 7

PATA_ DATA 1 1

VDDA

GND

VCC

GND

VCC

GND

VCC

GND

VCC

GND

VDDA

DRAM_A15

DRAM_A0

DRAM_A2

DRAM_A9

DRAM_A6

DRAM_CALIBRATION

PATA _ DATA 6

PATA _ DATA 8

PATA _ DATA 9

PATA _ DATA 1 0

PATA _ DATA 1 2

PATA _ DATA 1 3

NVCC_PATA

VCC

GND

VCC

GND

VCC

GND

VCC

GND

VCC

NVCC_EMI_DRAM

DRAM_A14

DRAM_SDBA2

DRAM_A3

DRAM_A5

DRAM_A7

DRAM_A8

CSI0_PIXCLK

CSI0_MCLK

CSI0_DATA_EN

CSI0_VSYNC

PATA_ DATA 1 5

PATA_ DATA 1 4

GND

VCC

GND

VCC

GND

VCC

GND

VCC

GND

NVCC_EMI_DRAM

DRAM_RESET

DRAM_CS1

DRAM_SDBA1

GND

DRAM_SDCLK_1

DRAM_SDCLK_1_B

CSI0_DAT4

CSI0_DAT5

CSI0_DAT7

CSI0_DAT9

CSI0_DAT10

CSI0_DAT6

NVCC_CSI

VCC

GND

VCC

GND

VCC

GND

VCC

GND

VCC

GND

DRAM_SDODT1

DRAM_SDBA0

GND

DRAM_D19

DRAM_D21

DRAM_D23

CSI0_DAT8

CSI0_DAT11

CSI0_DAT12

CSI0_DAT16

CSI0_DAT17

CSI0_DAT13

VCC

GND

VCC

GND

VCC

NVCC_NANDF

VCC

GND

VCC

GND

VCC

NVCC_EMI_DRAM

DRAM_SDCKE1

DRAM_DQM2

DRAM_D17

DRAM_SDQS2

DRAM_SDQS2_B

CSI0_DAT14

CSI0_DAT15

CSI0_DAT18

CSI0_DAT19

EIM_D17

EIM_D16

NVCC_EIM_SEC

VCC

NVCC_EIM_MAIN

NANDF_RB0

VDDA

NVCC_LVDS

NVCC_LVDS_BG

GND

TVDAC_DHVDD

TVDAC_AHVDDRGB

VCC

GND

DRAM_D16

DRAM_D18

DRAM_D22

DRAM_D20

Table 113. 19 x 19 mm, 0.8 Pitch Ball Map

Package Information and Contact Assignments

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 169

EIM_D18

EIM_D19

EIM_D21

EIM_D27

EIM_D26

EIM_A23

EIM_A17

EIM_OE

EIM_DA5

EIM_DA12

NVCC_SRTC_POW

NVCC_XTAL

NANDF_CS1

NANDF_CS2

GND

TVDAC_AHVDDRGB

GPIO_11

GND

DRAM_D29

EIM_D20

EIM_D22

EIM_D25

EIM_D30

EIM_D31

EIM_A25

EIM_A19

EIM_CS0

EIM_DA3

EIM_DA9

EIM_BCLK

NANDF_CS0

NANDF_CS3

PMIC_ON_REQ

PMIC_STBY_REQ

GPIO_10

GPIO_12

GPIO_14

GND

DRAM_DQM3

DRAM_D25

DRAM_D27

DRAM_D31

EIM_D23

EIM_D24

EIM_EB2

EIM_EB3

EIM_A24

EIM_A20

EIM_CS1

EIM_DA0

EIM_DA6

EIM_DA14

NANDF_ALE

LVDS1_TX3_P

LVDS1_CLK_P

GND

LVDS0_TX2_N

LVDS0_TX0_N

TVDAC_VREF

GND

DRAM_D24

DRAM_D26

DRAM_SDQS3

DRAM_SDQS3_B

EIM_D28

EIM_D29

EIM_A22

EIM_A21

EIM_A16

EIM_LBA

EIM_DA2

EIM_DA8

EIM_DA15

NANDF_CLE

GND

LVDS1_TX3_N

LVDS1_CLK_N

LVDS_BG_RES

GND

LVDS0_TX2_P

LVDS0_TX0_P

GPIO_13

TVDAC_COMP

GND

DRAM_D30

DRAM_D28

GND

EIM_A18

EIM_RW

EIM_EB1

EIM_DA4

EIM_DA10

NANDF_WE_B

EIM_WAIT

CKIL

EXTAL

LVDS1_TX2_P

LVDS1_TX1_P

LVDS1_TX0_P

LVDS0_TX3_N

LVDS0_CLK_N

LVDS0_TX1_N

GND

TVCDC_IOB_BACK

TVDAC_IOG

TVCDC_IOR_BACK

GND

EIM_EB0

EIM_DA1

EIM_DA7

EIM_DA11

EIM_DA13

NANDF_RE_B

NANDF_WP_B

ECKIL

XTAL

LVDS1_TX2_N

LVDS1_TX1_N

LVDS1_TX0_N

LVDS0_TX3_P

LVDS0_CLK_P

LVDS0_TX1_P

GND

TVDAC_IOB

TVCDC_IOG_BACK

TVDAC_IOR

GND

Table 113. 19 x 19 mm, 0.8 Pitch Ball Map

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

170 Freescale Semiconductor

Package Information and Contact Assignments

6.3 12 x 12 mm Package on Package (PoP) Information

This section contains the outline drawing, signal assignment map, ground/power reference ID (by ball grid

location) for the 12 x 12 mm, 0.4 mm pitch PoP package.

6.3.1 Case PoP, 0.4 mm Pitch, 12 x 12 Ball Matrix

Figure 101. 12x12 mm PoP Top View

Package Information and Contact Assignments

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 171

Figure 102. 12 x 12 mm PoP, Bottom View

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

172 Freescale Semiconductor

Package Information and Contact Assignments

Figure 103. 12 x 12 mm PoP, Side View

The following notes apply to Figure 101, Figure 102, and Figure 103.

1All dimensions are in millimeters.

2Dimensions and tolerancing per ASME Y14.5M–1994.

3Terminal position designation per JESD 95-1, SPP-010

4Compliant to JESD 95-1 design guide 4.22, no exact variation, and with exception to dimension ‘A’

5Raw solder ball size during assembly is 0.25mm

6.3.2 12x 12 PoP Signal Assignments, Power Rails, and I/O

Table 114 and Table 115 show the device connection list for ground, power, sense, and reference contact

signals.

Table 118 displays an alpha-sorted list of the signal assignments including associated power supplies. The

table also includes out of reset pad state. Table 119 and Table 120 show the package ball maps.

Package Information and Contact Assignments

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 173

6.3.2.1 12 x 12 mm PoP Ground, Power, Sense, and Reference Contact

Assignments

Table 114 and Table 115 show the device connection list for ground, power, sense, and reference contact

signals alpha-sorted by name.

Table 114. 12 x 12 mm PoP Bottom Ground, Power, Sense, and Reference Contact Assignments

Contact Name Contact Assignment

DDR_VREF U23

GND A1, A2, A28, A29, B1, B2, B28, B29, C17, L14, L15, L16, M14, M15, M16, N14, N15, N16,

P11,P12, P13, P17, P18, P19, R11, R12, R13, R17, R18, R19, T11,T12, T13, T17, T18,

T19, U14, U15, U16, V14, V15, V16, W14,W15, W16, AH1, AH15, AH29, AJ1, AJ2, AJ15,

AJ28, AJ29

NVCC_CKIH AD22

NVCC_CSI J6

NVCC_EIM_MAIN G9

NVCC_EIM_SEC G6

NVCC_EMI_DRAM F24, G24, H24, K24, L24, N24, P24, R24, U24, V24, W24, AC24, AD24

NVCC_EMI_DRAM_2P5 K23,Y24

NVCC_FEC AC14

NVCC_GPIO AD9

NVCC_JTAG AD11

NVCC_KEYPAD AD6

NVCC_LCD W7, Y7

NVCC_LVDS F19

NVCC_LVDS_BG F18

NVCC_NANDF G12

NVCC_PATA N6

NVCC_RESET AD18

NVCC_SD1 AC20

NVCC_SD2 AC16

NVCC_SRTC_POW F13

NVCC_XTAL F14

POP_VACC AG14

POP_VCCMM C8, L3

POP_VCCQMM C11

POP_VCCQMM1 H3

POP_VDD1 C3, C13, C26, T3, T27, AG6, AG26

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

174 Freescale Semiconductor

Package Information and Contact Assignments

POP_VDD2 C14, C27, D3, P27, W3, AF3, AG12, AG27

POP_VDDCA AA3, AD3, AG10

POP_VDDMM AG13

POP_VDDQ C16, C20, C24, E27, J27, N27, W27, AB27, AF27, AG16, AG20, AG24

POP_ZQ U3

SVCC AH28

SVDDGP AH2

TVDAC_AHVDDRGB G22, G23

TVDAC_DHVDD F23

TVDAC_VREF A27

USB_H1_VDDA25 AD19

USB_H1_VDDA33 AC18

USB_OTG_VDDA25 AC19

USB_OTG_VDDA33 AD20

VCC L11, L12, L13, L17, L18, L19, M11, M12, M13, M17, M18, M19, N11, N12, N13, N17, N18,

N19, U17, U18, U19, V17, V18,V19, W17, W18, W19

VDD_ANA_PLL AC22

VDD_DIG_PLL AC23

VDD_FUSE AC21

VDD_REG AD23

VDDA F16, M6, R6, T24, AD14

VDDAL1 AC8

VDDGP U11, U12, U13, V11, V12, V13, W11, W12, W13

VP AH19, AJ19

VPH AH13, AJ13

Table 115. 12 x 12 mm PoP Top Ground, Power, Sense, and Reference Contact Assignments

Contact Name Contact Assignment

DDR_VREF P2, M22

GND A12, A15, A18, A21, B5, B8, B10, C1, C23, F2, F23, J2, J23, M2, M23, P23,

R1, U23, V1, Y23,AA1, AB7, AB11, AC5, AC9, AC12, AC15, AC18, AC21

POP_VACC AC11

Table 114. 12 x 12 mm PoP Bottom Ground, Power, Sense, and Reference Contact Assignments (continued)

Contact Name Contact Assignment

Package Information and Contact Assignments

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 175

6.3.2.2 PoP Memory Support and Signal Cross Reference

Support is provided for 8- and 16-bit MLC NAND Flash mounted on the top of the package. To ensure

JESD209 compliance, dedicated PCB connections are required per Table 116. With NAND flash selected

as the boot source, NANDF_CLE and the EIM signals are configured as outputs. The PATA signals are

configured as inputs with weak pull-ups (default) which allows the NANDF_CLE and the EIM signals to

drive them. Note that the 16-bit NAND flash is on the EIM bus only.

EIM_DA[4:7] and EIM_DA[12:15] are assigned to top balls and require no PCB connections.

POP_VCCMM A6, J1

POP_VCCQMM A9

POP_VCCQMM1 F1

POP_VDD1 A11, A20, B3, N2, N22,AB5, AC20

POP_VDD2 B11, B21, C2, L22, R2, AA2, AB10, AB21

POP_VDDCA U2, W2, AC8

POP_VDDMM AC10

POP_VDDQ B13, B16, B19, D22, G22, K22, R22, V22, AA22, AB13, AB16, AB19

POP_ZQ P1

Table 116. Additional PCB connections for PoP NAND Flash

Suggested

PCB Net

Name

First i.MX53

I/O on Net

Second

i.MX53 I/O on

Net

Associated

Top Ball

Required for

8-bit NAND

Flash?

Required for 16-bit

NAND Flash?

NANDF_CLE NANDF_CLE PATA _ DA_ 0 PATA _ D A _ 0 Ye s Ye s

NANDF_D0 EIM_DA10 PATA_ DATA0 PATA _ D ATA 0 Ye s Ye s

NANDF_D1 EIM_DA2 PATA _ DATA1 PATA _ D ATA 1 Ye s Ye s

NANDF_D2 EIM_DA11 PATA_ DATA2 PATA _ D ATA 2 Ye s Ye s

NANDF_D3 EIM_DA3 PATA _ DATA3 PATA _ D ATA 3 Ye s Ye s

NANDF_D8 EIM_DA8 PATA _ DATA8 PATA _ D ATA 8 No Ye s

NANDF_D9 EIM_DA0 PATA _ DATA9 PATA _ D ATA 9 No Ye s

NANDF_D10 EIM_DA9 PATA _ DATA1 0 PATA _ D ATA 1 0 No Ye s

NANDF_D11 EIM_DA1 PATA _ DATA1 1 PATA _ D ATA 1 1 No Ye s

Table 115. 12 x 12 mm PoP Top Ground, Power, Sense, and Reference Contact Assignments (continued)

Contact Name Contact Assignment

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

176 Freescale Semiconductor

Package Information and Contact Assignments

To support eMMC per the JESD209 option, top ball signals per Table 117 are provided. IOMUX mode

ALT2 is invoked for these I/O.

i.MX53 PoP supports 16- and 32-bit LPDDR2-800 per JESD209 with no additional PCB digital signal

connections. No signal cross reference is needed. The designer must ensure that the PCB routes power to

POP_VDD1, POP_VDD2, POP_VDDQ, POP_VDDCA, POP_VACC, and POP_VCCQMM,

POP_VCCMM, and POP_VDDMM. Appropriate discrete components must be employed for POP_ZQ,

DRAM_CALIBRATION, DDR_VREF, and POP_VCCQMM1.

6.3.2.3 PoP 12 x 12 mm, Signal Assignments, Power Rails, and I/O

Table 118 displays an alpha-sorted list of the signal assignments including power rails. The table also

includes out of reset pad state.

Table 117. Additional Top Ball Connections for PoP eMMC

eMMC Signal on Port eSDHC3 Associated Top Ball

RST PATA _ DA 0

CLK PATA _ I O R DY

CMD PATA_RESETB

Table 118. PoP 12 x 12 mm Signal Assignments, Power Rails, and I/O

Contact Name

PoP Bottom

Package Contact

Assignment

PoP Top

Package Contact

Assignment

Power Rail I/O Buffer

Type

Out of Reset Condition1

Alt.

Mode Function Direct

ion

Config./

Value

BOOT_MODE0 AA28 — NVCC_RESET LVIO ALT0 src_BOOT_MODE[0

]

Input 100 KΩ PD

BOOT_MODE1 AB29 — NVCC_RESET LVIO ALT0 src_BOOT_MODE[1

]

Input 100 KΩ PD

CKIH1 AC29 — NVCC_CKIH ANALOG ALT0 camp1_CKIH Input Analog

CKIH2 AC28 — NVCC_CKIH ANALOG ALT0 camp2_CKIH Input Analog

CKIL G13 — NVCC_SRTC_POW ANALOG — CKIL — —

CSI0_DAT10 R2 — NVCC_CSI UHVIO ALT1 gpio5_GPIO[28] Input 100 KΩ PU

CSI0_DAT11 R7 — NVCC_CSI UHVIO ALT1 gpio5_GPIO[29] Input 100 KΩ PU

CSI0_DAT12 U1 — NVCC_CSI UHVIO ALT1 gpio5_GPIO[30] Input 360 KΩ PD

CSI0_DAT13 R1 — NVCC_CSI UHVIO ALT1 gpio5_GPIO[31] Input 360 KΩ PD

CSI0_DAT14 T1 — NVCC_CSI UHVIO ALT1 gpio6_GPIO[0] Input 360 KΩ PD

CSI0_DAT15 P1 — NVCC_CSI UHVIO ALT1 gpio6_GPIO[1] Input 360 KΩ PD

CSI0_DAT16 M1 — NVCC_CSI UHVIO ALT1 gpio6_GPIO[2] Input 360 KΩ PD

CSI0_DAT17 N1 — NVCC_CSI UHVIO ALT1 gpio6_GPIO[3] Input 360 KΩ PD

Package Information and Contact Assignments

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 177

CSI0_DAT18 L2 — NVCC_CSI UHVIO ALT1 gpio6_GPIO[4] Input 360 KΩ PD

CSI0_DAT19 L1 — NVCC_CSI UHVIO ALT1 gpio6_GPIO[5] Input 360 KΩ PD

CSI0_DAT4 T7 — NVCC_CSI UHVIO ALT1 gpio5_GPIO[22] Input 100 KΩ PU

CSI0_DAT5 R3 — NVCC_CSI UHVIO ALT1 gpio5_GPIO[23] Input 360 KΩ PD

CSI0_DAT6 P7 — NVCC_CSI UHVIO ALT1 gpio5_GPIO[24] Input 100 KΩ PU

CSI0_DAT7 N7 — NVCC_CSI UHVIO ALT1 gpio5_GPIO[25] Input 100 KΩ PU

CSI0_DAT8 U2 — NVCC_CSI UHVIO ALT1 gpio5_GPIO[26] Input 100 KΩ PU

CSI0_DAT9 P3 — NVCC_CSI UHVIO ALT1 gpio5_GPIO[27] Input 360 KΩ PD

CSI0_DATA_EN P6 — NVCC_CSI UHVIO ALT1 gpio5_GPIO[20] Input 100 KΩ PU

CSI0_MCLK T6 — NVCC_CSI UHVIO ALT1 gpio5_GPIO[19] Input 100 KΩ PU

CSI0_PIXCLK U6 — NVCC_CSI UHVIO ALT1 gpio5_GPIO[18] Input 100 KΩ PU

CSI0_VSYNC U7 — NVCC_CSI UHVIO ALT1 gpio5_GPIO[21] Input 100 KΩ PU

DI0_DISP_CLK AF2 — NVCC_LCD GPIO ALT1 gpio4_GPIO[16] Input 100 KΩ PU

DI0_PIN15 AH6 — NVCC_LCD GPIO ALT1 gpio4_GPIO[17] Input 100 KΩ PU

DI0_PIN2 AD7 — NVCC_LCD GPIO ALT1 gpio4_GPIO[18] Input 100 KΩ PU

DI0_PIN3 AC7 — NVCC_LCD GPIO ALT1 gpio4_GPIO[19] Input 100 KΩ PU

DI0_PIN4 AC6 — NVCC_LCD GPIO ALT1 gpio4_GPIO[20] Input 100 KΩ PU

DISP0_DAT0 AD1 — NVCC_LCD GPIO ALT1 gpio4_GPIO[21] Input 100 KΩ PD

DISP0_DAT1 AC3 — NVCC_LCD GPIO ALT1 gpio4_GPIO[22] Input 100 KΩ PD

DISP0_DAT10 AG2 — NVCC_LCD GPIO ALT1 gpio4_GPIO[31] Input 100 KΩ PU

DISP0_DAT11 AE3 — NVCC_LCD GPIO ALT1 gpio5_GPIO[5] Input 100 KΩ PD

DISP0_DAT12 AC1 — NVCC_LCD GPIO ALT1 gpio5_GPIO[6] Input 100 KΩ PU

DISP0_DAT13 AH3 — NVCC_LCD GPIO ALT1 gpio5_GPIO[7] Input 100 KΩ PU

DISP0_DAT14 AG3 — NVCC_LCD GPIO ALT1 gpio5_GPIO[8] Input 100 KΩ PU

DISP0_DAT15 AH4 — NVCC_LCD GPIO ALT1 gpio5_GPIO[9] Input 100 KΩ PU

DISP0_DAT16 AG5 — NVCC_LCD GPIO ALT1 gpio5_GPIO[10] Input 100 KΩ PU

DISP0_DAT17 AB6 — NVCC_LCD GPIO ALT1 gpio5_GPIO[11] Input 100 KΩ PU

DISP0_DAT18 AJ4 — NVCC_LCD GPIO ALT1 gpio5_GPIO[12] Input 100 KΩ PU

DISP0_DAT19 AA7 — NVCC_LCD GPIO ALT1 gpio5_GPIO[13] Input 100 KΩ PU

DISP0_DAT2 AC2 — NVCC_LCD GPIO ALT1 gpio4_GPIO[23] Input 100 KΩ PD

Table 118. PoP 12 x 12 mm Signal Assignments, Power Rails, and I/O (continued)

Contact Name

PoP Bottom

Package Contact

Assignment

PoP Top

Package Contact

Assignment

Power Rail I/O Buffer

Type

Out of Reset Condition1

Alt.

Mode Function Direct

ion

Config./

Value

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

178 Freescale Semiconductor

Package Information and Contact Assignments

DISP0_DAT20 AJ5 — NVCC_LCD GPIO ALT1 gpio5_GPIO[14] Input 100 KΩ PU

DISP0_DAT21 AB7 — NVCC_LCD GPIO ALT1 gpio5_GPIO[15] Input 100 KΩ PU

DISP0_DAT22 AH5 — NVCC_LCD GPIO ALT1 gpio5_GPIO[16] Input 100 KΩ PU

DISP0_DAT23 AJ6 — NVCC_LCD GPIO ALT1 gpio5_GPIO[17] Input 100 KΩ PU

DISP0_DAT3 AE2 — NVCC_LCD GPIO ALT1 gpio4_GPIO[24] Input 100 KΩ PD

DISP0_DAT4 AF1 — NVCC_LCD GPIO ALT1 gpio4_GPIO[25] Input 100 KΩ PD

DISP0_DAT5 AE1 — NVCC_LCD GPIO ALT1 gpio4_GPIO[26] Input 100 KΩ PD

DISP0_DAT6 AD2 — NVCC_LCD GPIO ALT1 gpio4_GPIO[27] Input 100 KΩ PD

DISP0_DAT7 AG1 — NVCC_LCD GPIO ALT1 gpio4_GPIO[28] Input 100 KΩ PD

DISP0_DAT8 AG4 — NVCC_LCD GPIO ALT1 gpio4_GPIO[29] Input 100 KΩ PU

DISP0_DAT9 AJ3 — NVCC_LCD GPIO ALT1 gpio4_GPIO[30] Input 100 KΩ PU

DRAM_A0 W23 AC6 NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_A[0] Output Low

DRAM_A1 Y23 AB6 NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_A[1] Output Low

DRAM_A10 M28 — NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_A[10] Output Low

DRAM_A11 J29 — NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_A[11] Output Low

DRAM_A12 L28 — NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_A[12] Output Low

DRAM_A13 M27 — NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_A[13] Output Low

DRAM_A14 L27 — NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_A[14] Output Low

DRAM_A15 D27 — NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_A[15] Output Low

DRAM_A2 V23 AC7 NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_A[2] Output Low

DRAM_A3 L23 AB8 NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_A[3] Output Low

DRAM_A4 AA24 AB9 NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_A[4] Output Low

DRAM_A5 M23 W1 NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_A[5] Output Low

DRAM_A6 P23 V2 NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_A[6] Output Low

DRAM_A7 N23 U1 NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_A[7] Output Low

DRAM_A8 M24 T2 NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_A[8] Output Low

DRAM_A9 T23 T1 NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_A[9] Output Low

DRAM_CALIBR

AT I O N

R23 — NVCC_EMI_DRAM CALIBRATI

DRAM_CALIBRATI

Input —

DRAM_CAS AA23 — NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_CAS Output High

Table 118. PoP 12 x 12 mm Signal Assignments, Power Rails, and I/O (continued)

Contact Name

PoP Bottom

Package Contact

Assignment

PoP Top

Package Contact

Assignment

Power Rail I/O Buffer

Type

Out of Reset Condition1

Alt.

Mode Function Direct

ion

Config./

Value

Package Information and Contact Assignments

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 179

DRAM_CS0 AB23 AB3 NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_CS[0] Output High

DRAM_CS1 J24 AB4 NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_CS[1] Output High

DRAM_D0 T29 W22 NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_D[0] Output High

DRAM_D1 V27 AA23 NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_D[1] Output High

DRAM_D10 AG22 AC13 NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_D[10] Output High

DRAM_D11 AG29 AC17 NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_D[11] Output High

DRAM_D12 AG23 AB14 NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_D[12] Output High

DRAM_D13 AF29 AB15 NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_D[13] Output High

DRAM_D14 AG28 AB12 NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_D[14] Output High

DRAM_D15 AJ27 AC16 NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_D[15] Output High

DRAM_D16 D29 C22 NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_D[16] Output High

DRAM_D17 E29 E23 NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_D[17] Output High

DRAM_D18 D28 D23 NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_D[18] Output High

DRAM_D19 F28 G23 NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_D[19] Output High

DRAM_D2 R29 U22 NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_D[2] Output High

DRAM_D20 F27 F22 NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_D[20] Output High

DRAM_D21 G27 H22 NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_D[21] Output High

DRAM_D22 E28 E22 NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_D[22] Output High

DRAM_D23 F29 H23 NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_D[23] Output High

DRAM_D24 F21 A17 NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_D[24] Output High

DRAM_D25 C19 A14 NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_D[25] Output High

DRAM_D26 G21 B17 NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_D[26] Output High

DRAM_D27 G18 A13 NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_D[27] Output High

DRAM_D28 G20 B15 NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_D[28] Output High

DRAM_D29 F17 B12 NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_D[29] Output High

DRAM_D3 U27 Y22 NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_D[3] Output High

DRAM_D30 F20 A16 NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_D[30] Output High

DRAM_D31 G19 B14 NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_D[31] Output High

DRAM_D4 R27 T23 NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_D[4] Output High

DRAM_D5 R28 V23 NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_D[5] Output High

Table 118. PoP 12 x 12 mm Signal Assignments, Power Rails, and I/O (continued)

Contact Name

PoP Bottom

Package Contact

Assignment

PoP Top

Package Contact

Assignment

Power Rail I/O Buffer

Type

Out of Reset Condition1

Alt.

Mode Function Direct

ion

Config./

Value

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

180 Freescale Semiconductor

Package Information and Contact Assignments

DRAM_D6 P29 T22 NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_D[6] Output High

DRAM_D7 T28 W23 NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_D[7] Output High

DRAM_D8 AF28 AC14 NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_D[8] Output High

DRAM_D9 AE29 AB17 NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_D[9] Output High

DRAM_DQM0 N28 N23 NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_DQM[0

]

Output Low

DRAM_DQM1 AD27 AB20 NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_DQM[1

]

Output Low

DRAM_DQM2 H29 L23 NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_DQM[2

]

Output Low

DRAM_DQM3 C23 B20 NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_DQM[3

]

Output Low

DRAM_RAS M29 — NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_RAS Output High

DRAM_RESET J28 — NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_RESET Output Low

DRAM_SDBA0 H27 — NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_SDBA[

Output Low

DRAM_SDBA1 K27 — NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_SDBA[

Output Low

DRAM_SDBA2 K28 — NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_SDBA[

Output Low

DRAM_SDCKE0 AB24 AC3 NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_SDCK

E[0]

Output Low

DRAM_SDCKE1 F22 AC4 NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_SDCK

E[1]

Output Low

DRAM_SDCLK_

H23 Y2 NVCC_EMI_DRAM DDR3CLK ALT0 emi_DRAM_SDCLK

Output Floating

DRAM_SDCLK_

1_B

J23 Y1 NVCC_EMI_DRAM DDR3CLK ALT0 emi_DRAM_SDCLK

1_B

Output Floating

DRAM_SDODT

L29 — NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_ODT[0] Output Low

DRAM_SDODT

H28 — NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_ODT[1] Output Low

DRAM_SDQS0 N29 R23 NVCC_EMI_DRAM DDR3CLK ALT0 emi_DRAM_SDQS[

Input Low

Table 118. PoP 12 x 12 mm Signal Assignments, Power Rails, and I/O (continued)

Contact Name

PoP Bottom

Package Contact

Assignment

PoP Top

Package Contact

Assignment

Power Rail I/O Buffer

Type

Out of Reset Condition1

Alt.

Mode Function Direct

ion

Config./

Value

Package Information and Contact Assignments

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 181

DRAM_SDQS0_

P28 P22 NVCC_EMI_DRAM DDR3CLK ALT0 emi_DRAM_SDQS_

B[0]

Input High

DRAM_SDQS1 AE28 AB18 NVCC_EMI_DRAM DDR3CLK ALT0 emi_DRAM_SDQS[

Input Low

DRAM_SDQS1_

AE27 AC19 NVCC_EMI_DRAM DDR3CLK ALT0 emi_DRAM_SDQS_

B[1]

Input High

DRAM_SDQS2 G28 J22 NVCC_EMI_DRAM DDR3CLK ALT0 emi_DRAM_SDQS[

Input Low

DRAM_SDQS2_

G29 K23 NVCC_EMI_DRAM DDR3CLK ALT0 emi_DRAM_SDQS_

B[2]

Input High

DRAM_SDQS3 C22 B18 NVCC_EMI_DRAM DDR3CLK ALT0 emi_DRAM_SDQS[

Input Low

DRAM_SDQS3_

C21 A19 NVCC_EMI_DRAM DDR3CLK ALT0 emi_DRAM_SDQS_

B[3]

Input High

DRAM_SDWE K29 — NVCC_EMI_DRAM DDR3 ALT0 emi_DRAM_SDWE Output High

ECKIL G14 — NVCC_SRTC_POW ANALOG ECKIL — —

EIM_A16 A7 — NVCC_EIM_MAIN UHVIO ALT0 emi_EIM_A[16] Output

—

EIM_A17 G8 — NVCC_EIM_MAIN UHVIO ALT0 emi_EIM_A[17] Output

—

EIM_A18 F8 — NVCC_EIM_MAIN UHVIO ALT0 emi_EIM_A[18] Output

—

EIM_A19 A6 — NVCC_EIM_MAIN UHVIO ALT0 emi_EIM_A[19] Output

—

EIM_A20 B7 — NVCC_EIM_MAIN UHVIO ALT0 emi_EIM_A[20] Output

—

EIM_A21 C6 — NVCC_EIM_MAIN UHVIO ALT0 emi_EIM_A[21] Output

—

EIM_A22 C2 — NVCC_EIM_MAIN UHVIO ALT0 emi_EIM_A[22] Output

—

EIM_A23 B3 — NVCC_EIM_MAIN UHVIO ALT0 emi_EIM_A[23] Output —

EIM_A24 A4 — NVCC_EIM_MAIN UHVIO ALT0 emi_EIM_A[24] Output —

EIM_A25 A3 — NVCC_EIM_MAIN UHVIO ALT0 emi_EIM_A[25] Output —

EIM_BCLK F11 — NVCC_EIM_MAIN UHVIO ALT0 emi_EIM_BCLK Output —

EIM_CS0 G10 — NVCC_EIM_MAIN UHVIO ALT0 emi_EIM_CS[0] Output —

Table 118. PoP 12 x 12 mm Signal Assignments, Power Rails, and I/O (continued)

Contact Name

PoP Bottom

Package Contact

Assignment

PoP Top

Package Contact

Assignment

Power Rail I/O Buffer

Type

Out of Reset Condition1

Alt.

Mode Function Direct

ion

Config./

Value

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

182 Freescale Semiconductor

Package Information and Contact Assignments

EIM_CS1 C4 — NVCC_EIM_MAIN UHVIO ALT0 emi_EIM_CS[1] Output —

EIM_D16 H1 — NVCC_EIM_SEC UHVIO ALT1 gpio3_GPIO[16] Input 100 KΩ PU

EIM_D17 G3 — NVCC_EIM_SEC UHVIO ALT1 gpio3_GPIO[17] Input 100 KΩ PU

EIM_D18 H2 — NVCC_EIM_SEC UHVIO ALT1 gpio3_GPIO[18] Input 100 KΩ PU

EIM_D19 G2 — NVCC_EIM_SEC UHVIO ALT1 gpio3_GPIO[19] Input 100 KΩ PU

EIM_D20 M7 — NVCC_EIM_SEC UHVIO ALT1 gpio3_GPIO[20] Input 100 KΩ PU

EIM_D21 H6 — NVCC_EIM_SEC UHVIO ALT1 gpio3_GPIO[21] Input 100 KΩ PU

EIM_D22 G1 — NVCC_EIM_SEC UHVIO ALT1 gpio3_GPIO[22] Input 360 KΩ PD

EIM_D23 F1 — NVCC_EIM_SEC UHVIO ALT1 gpio3_GPIO[23] Input 100 KΩ PU

EIM_D24 F9 — NVCC_EIM_SEC UHVIO ALT1 gpio3_GPIO[24] Input 100 KΩ PU

EIM_D25 E1 — NVCC_EIM_SEC UHVIO ALT1 gpio3_GPIO[25] Input 100 KΩ PU

EIM_D26 D1 — NVCC_EIM_SEC UHVIO ALT1 gpio3_GPIO[26] Input 100 KΩ PU

EIM_D27 C10 — NVCC_EIM_SEC UHVIO ALT1 gpio3_GPIO[27] Input 100 KΩ PU

EIM_D28 D2 — NVCC_EIM_SEC UHVIO ALT1 gpio3_GPIO[28] Input 100 KΩ PU

EIM_D29 C7 — NVCC_EIM_SEC UHVIO ALT1 gpio3_GPIO[29] Input 100 KΩ PU

EIM_D30 C1 — NVCC_EIM_SEC UHVIO ALT1 gpio3_GPIO[30] Input 100 KΩ PU

EIM_D31 F7 — NVCC_EIM_SEC UHVIO ALT1 gpio3_GPIO[31] Input 360 KΩ PD

EIM_DA0 K1 — NVCC_EIM_MAIN UHVIO ALT0 emi_NAND_EIM_D

A[0]

Input2100 KΩ PU

EIM_DA1 G11 — NVCC_EIM_MAIN UHVIO ALT0 emi_NAND_EIM_D

A[1]

Input2100 KΩ PU

EIM_DA10 L7 — NVCC_EIM_MAIN UHVIO ALT0 emi_NAND_EIM_D

A[10]

Input2100 KΩ PU

EIM_DA11 K7 — NVCC_EIM_MAIN UHVIO ALT0 emi_NAND_EIM_D

A[11]

Input 100 KΩ PU

EIM_DA12 E2 D1 NVCC_EIM_MAIN UHVIO ALT0 emi_NAND_EIM_D

A[12]

Input 100 KΩ PU

EIM_DA13 F2 E1 NVCC_EIM_MAIN UHVIO ALT0 emi_NAND_EIM_D

A[13]

Input 100 KΩ PU

EIM_DA14 J2 G1 NVCC_EIM_MAIN UHVIO ALT0 emi_NAND_EIM_D

A[14]

Input 100 KΩ PU

EIM_DA15 K2 H1 NVCC_EIM_MAIN UHVIO ALT0 emi_NAND_EIM_D

A[15]

Input 100 KΩ PU

Table 118. PoP 12 x 12 mm Signal Assignments, Power Rails, and I/O (continued)

Contact Name

PoP Bottom

Package Contact

Assignment

PoP Top

Package Contact

Assignment

Power Rail I/O Buffer

Type

Out of Reset Condition1

Alt.

Mode Function Direct

ion

Config./

Value

Package Information and Contact Assignments

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 183

EIM_DA2 F10 — NVCC_EIM_MAIN UHVIO ALT0 emi_NAND_EIM_D

A[2]

Input2100 KΩ PU

EIM_DA3 A8 — NVCC_EIM_MAIN UHVIO ALT0 emi_NAND_EIM_D

A[3]

Input2100 KΩ PU

EIM_DA4 E3 D2 NVCC_EIM_MAIN UHVIO ALT0 emi_NAND_EIM_D

A[4]

Input2100 KΩ PU

EIM_DA5 F3 E2 NVCC_EIM_MAIN UHVIO ALT0 emi_NAND_EIM_D

A[5]

Input2100 KΩ PU

EIM_DA6 J3 G2 NVCC_EIM_MAIN UHVIO ALT0 emi_NAND_EIM_D

A[6]

Input2100 KΩ PU

EIM_DA7 K3 H2 NVCC_EIM_MAIN UHVIO ALT0 emi_NAND_EIM_D

A[7]

Input2100 KΩ PU

EIM_DA8 A10 — NVCC_EIM_MAIN UHVIO ALT0 emi_NAND_EIM_D

A[8]

Input2100 KΩ PU

EIM_DA9 K6 — NVCC_EIM_MAIN UHVIO ALT0 emi_NAND_EIM_D

A[9]

Input2100 KΩ PU

EIM_EB0 J1 — NVCC_EIM_MAIN UHVIO ALT0 emi_EIM_EB[0] Output

—

EIM_EB1 G7 — NVCC_EIM_MAIN UHVIO ALT0 emi_EIM_EB[1] Output

—

EIM_EB2 J7 — NVCC_EIM_MAIN UHVIO ALT1 gpio2_GPIO[30] Input 100 KΩ PU

EIM_EB3 F6 — NVCC_EIM_MAIN UHVIO ALT1 gpio2_GPIO[31] Input 100 KΩ PU

EIM_LBA A5 — NVCC_EIM_MAIN UHVIO ALT0 emi_EIM_LBA Output

—

EIM_OE A9 — NVCC_EIM_MAIN UHVIO ALT0 emi_EIM_OE Output —

EIM_RW H7 — NVCC_EIM_MAIN UHVIO ALT0 emi_EIM_RW Output —

EIM_WAIT L6 — NVCC_EIM_MAIN UHVIO ALT0 emi_EIM_WAIT Output —

EXTAL G15 — NVCC_XTAL ANALOG — EXTAL — —

FASTR_ANA AD29 — NVCC_CKIH ANALOG — FASTR_ANA — —

FASTR_DIG AD28 — NVCC_CKIH ANALOG — FASTR_DIG — —

FEC_CRS_DV Y27 — NVCC_FEC UHVIO ALT1 gpio1_GPIO[25] Input 100 KΩ PU

FEC_MDC U28 — NVCC_FEC UHVIO ALT1 gpio1_GPIO[31] Input 100 KΩ PU

FEC_MDIO AA29 — NVCC_FEC UHVIO ALT1 gpio1_GPIO[22] Input 100 KΩ PU

FEC_REF_CLK Y29 — NVCC_FEC UHVIO ALT1 gpio1_GPIO[23] Input 100 KΩ PU

Table 118. PoP 12 x 12 mm Signal Assignments, Power Rails, and I/O (continued)

Contact Name

PoP Bottom

Package Contact

Assignment

PoP Top

Package Contact

Assignment

Power Rail I/O Buffer

Type

Out of Reset Condition1

Alt.

Mode Function Direct

ion

Config./

Value

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

184 Freescale Semiconductor

Package Information and Contact Assignments

FEC_RX_ER Y28 — NVCC_FEC UHVIO ALT1 gpio1_GPIO[24] Input 100 KΩ PU

FEC_RXD0 W28 — NVCC_FEC UHVIO ALT1 gpio1_GPIO[27] Input 100 KΩ PU

FEC_RXD1 W29 — NVCC_FEC UHVIO ALT1 gpio1_GPIO[26] Input 100 KΩ PU

FEC_TX_EN V29 — NVCC_FEC UHVIO ALT1 gpio1_GPIO[28] Input 360 KΩ PD

FEC_TXD0 U29 — NVCC_FEC UHVIO ALT1 gpio1_GPIO[30] Input 100 KΩ PU

FEC_TXD1 V28 — NVCC_FEC UHVIO ALT1 gpio1_GPIO[29] Input 100 KΩ PU

GPIO_0 AD12 — NVCC_GPIO UHVIO ALT1 gpio1_GPIO[0] Input 360 KΩ PD

GPIO_1 AH12 — NVCC_GPIO UHVIO ALT1 gpio1_GPIO[1] Input 360 KΩ PD

GPIO_10 B25 — TVDAC_AHVDDRG

GPIO ALT0 gpio4_GPIO[0] Input 100 KΩ PU

GPIO_11 B26 — TVDAC_AHVDDRG

GPIO ALT0 gpio4_GPIO[1] Input 100 KΩ PU

GPIO_12 A26 — TVDAC_AHVDDRG

GPIO ALT0 gpio4_GPIO[2] Input 100 KΩ PU

GPIO_13 C25 — TVDAC_AHVDDRG

GPIO ALT0 gpio4_GPIO[3] Input 100 KΩ PU

GPIO_14 B27 — TVDAC_AHVDDRG

GPIO ALT0 gpio4_GPIO[4] Input 100 KΩ PU

GPIO_16 AH10 — NVCC_GPIO UHVIO ALT1 gpio7_GPIO[11] Input 360 KΩ PD

GPIO_17 AC10 — NVCC_GPIO UHVIO ALT1 gpio7_GPIO[12] Input 360 KΩ PD

GPIO_18 AC9 — NVCC_GPIO UHVIO ALT1 gpio7_GPIO[13] Input 360 KΩ PD

GPIO_19 AJ10 — NVCC_KEYPAD UHVIO ALT1 gpio4_GPIO[5] Input3100 KΩ PU

GPIO_2 AG11 — NVCC_GPIO UHVIO ALT1 gpio1_GPIO[2] Input 360 KΩ PD

GPIO_3 AC12 — NVCC_GPIO UHVIO ALT1 gpio1_GPIO[3] Input 360 KΩ PD

GPIO_4 AH11 — NVCC_GPIO UHVIO ALT1 gpio1_GPIO[4] Input 100 KΩ PU

GPIO_5 AJ11 — NVCC_GPIO UHVIO ALT1 gpio1_GPIO[5] Input 360 KΩ PD

GPIO_6 AJ12 — NVCC_GPIO UHVIO ALT1 gpio1_GPIO[6] Input 360 KΩ PD

GPIO_7 AC11 — NVCC_GPIO UHVIO ALT1 gpio1_GPIO[7] Input 360 KΩ PD

GPIO_8 AD10 — NVCC_GPIO UHVIO ALT1 gpio1_GPIO[8] Input 360 KΩ PD

GPIO_9 AC13 — NVCC_GPIO UHVIO ALT1 gpio1_GPIO[9] Input 100 KΩ PU

JTAG_MOD AD15 — NVCC_JTAG GPIO ALT0 sjc_MOD Input 100 KΩ PU

JTAG_TCK AD13 — NVCC_JTAG GPIO ALT0 sjc_TCK Input 100 KΩ PD

Table 118. PoP 12 x 12 mm Signal Assignments, Power Rails, and I/O (continued)

Contact Name

PoP Bottom

Package Contact

Assignment

PoP Top

Package Contact

Assignment

Power Rail I/O Buffer

Type

Out of Reset Condition1

Alt.

Mode Function Direct

ion

Config./

Value

Package Information and Contact Assignments

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 185

JTAG_TDI AC15 — NVCC_JTAG GPIO ALT0 sjc_TDI Input 47 KΩ PU

JTAG_TDO AG15 — NVCC_JTAG GPIO ALT0 sjc_TDO Input Keeper

JTAG_TMS AD16 — NVCC_JTAG GPIO ALT0 sjc_TMS Input 47 KΩ PU

JTAG_TRSTB AC17 — NVCC_JTAG GPIO ALT0 sjc_TRSTB Input 47 KΩ PU

KEY_COL0 AG9 — NVCC_KEYPAD UHVIO ALT1 gpio4_GPIO[6] Input4100 KΩ PU

KEY_COL1 AJ9 — NVCC_KEYPAD UHVIO ALT1 gpio4_GPIO[8] Input 100 KΩ PU

KEY_COL2 AG8 — NVCC_KEYPAD UHVIO ALT1 gpio4_GPIO[10] Input 100 KΩ PU

KEY_COL3 AJ8 — NVCC_KEYPAD UHVIO ALT1 gpio4_GPIO[12] Input 100 KΩ PU

KEY_COL4 AH7 — NVCC_KEYPAD UHVIO ALT1 gpio4_GPIO[14] Input 100 KΩ PU

KEY_ROW0 AH9 — NVCC_KEYPAD UHVIO ALT1 gpio4_GPIO[7] Input 360 KΩ PD

KEY_ROW1 AH8 — NVCC_KEYPAD UHVIO ALT1 gpio4_GPIO[9] Input 100 KΩ PU

KEY_ROW2 AJ7 — NVCC_KEYPAD UHVIO ALT1 gpio4_GPIO[11] Input 100 KΩ PU

KEY_ROW3 AG7 — NVCC_KEYPAD UHVIO ALT1 gpio4_GPIO[13] Input 100 KΩ PU

KEY_ROW4 AD8 — NVCC_KEYPAD UHVIO ALT1 gpio4_GPIO[15] Input 360 KΩ PD

LVDS_BG_RES C18 — NVCC_LVDS_BG ANALOG — LVDS_BG_RES — —

LVDS0_CLK_N B19 — NVCC_LVDS LVDS ALT0 gpio7_GPI[25] Input Floating

LVDS0_CLK_P A19 — NVCC_LVDS LVDS ALT0 gpio7_GPI[24] Input Floating

LVDS0_TX0_N B22 — NVCC_LVDS LVDS ALT0 gpio7_GPI[31] Input Floating

LVDS0_TX0_P A22 — NVCC_LVDS LVDS ALT0 gpio7_GPI[30] Input Floating

LVDS0_TX1_N A21 — NVCC_LVDS LVDS ALT0 gpio7_GPI[29] Input Floating

LVDS0_TX1_P B21 — NVCC_LVDS LVDS ALT0 gpio7_GPI[28] Input Floating

LVDS0_TX2_N B20 — NVCC_LVDS LVDS ALT0 gpio7_GPI[27] Input Floating

LVDS0_TX2_P A20 — NVCC_LVDS LVDS ALT0 gpio7_GPI[26] Input Floating

LVDS0_TX3_N B18 — NVCC_LVDS LVDS ALT0 gpio7_GPI[23] Input Floating

LVDS0_TX3_P A18 — NVCC_LVDS LVDS ALT0 gpio7_GPI[22] Input Floating

LVDS1_CLK_N A15 — NVCC_LVDS LVDS ALT0 gpio6_GPI[27] Input Floating

LVDS1_CLK_P B15 — NVCC_LVDS LVDS ALT0 gpio6_GPI[26] Input Floating

LVDS1_TX0_N B17 — NVCC_LVDS LVDS ALT0 gpio6_GPI[31] Input Floating

LVDS1_TX0_P A17 — NVCC_LVDS LVDS ALT0 gpio6_GPI[30] Input Floating

LVDS1_TX1_N A16 — NVCC_LVDS LVDS ALT0 gpio6_GPI[29] Input Floating

Table 118. PoP 12 x 12 mm Signal Assignments, Power Rails, and I/O (continued)

Contact Name

PoP Bottom

Package Contact

Assignment

PoP Top

Package Contact

Assignment

Power Rail I/O Buffer

Type

Out of Reset Condition1

Alt.

Mode Function Direct

ion

Config./

Value

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

186 Freescale Semiconductor

Package Information and Contact Assignments

LVDS1_TX1_P B16 — NVCC_LVDS LVDS ALT0 gpio6_GPI[28] Input Floating

LVDS1_TX2_N A14 — NVCC_LVDS LVDS ALT0 gpio6_GPI[25] Input Floating

LVDS1_TX2_P B14 — NVCC_LVDS LVDS ALT0 gpio6_GPI[24] Input Floating

LVDS1_TX3_N A13 — NVCC_LVDS LVDS ALT0 gpio6_GPI[23] Input Floating

LVDS1_TX3_P B13 — NVCC_LVDS LVDS ALT0 gpio6_GPI[22] Input Floating

NANDF_ALE N3 L2 NVCC_NANDF UHVIO ALT1 gpio6_GPIO[8] Input 100 KΩ PU

NANDF_CLE G16 — NVCC_NANDF UHVIO ALT1 gpio6_GPIO[7] Input 100 KΩ PU

NANDF_CS0 P2 M1 NVCC_NANDF UHVIO ALT1 gpio6_GPIO[11] Input 100 KΩ PU

NANDF_CS1 A11 — NVCC_NANDF UHVIO ALT1 gpio6_GPIO[14] Input 100 KΩ PU

NANDF_CS2 C12 — NVCC_NANDF UHVIO ALT1 gpio6_GPIO[15] Input 100 KΩ PU

NANDF_CS3 A12 — NVCC_NANDF UHVIO ALT1 gpio6_GPIO[16] Input 100 KΩ PU

NANDF_RB0 C15 — NVCC_NANDF UHVIO ALT1 gpio6_GPIO[10] Input 100 KΩ PU

NANDF_RE_B M3 K2 NVCC_EIM_MAIN UHVIO ALT1 gpio6_GPIO[13] Input 100 KΩ PU

NANDF_WE_B M2 K1 NVCC_EIM_MAIN UHVIO ALT1 gpio6_GPIO[12] Input 100 KΩ PU

NANDF_WP_B T2 N1 NVCC_NANDF UHVIO ALT1 gpio6_GPIO[9] Input 100 KΩ PU

PATA_BUFFER_

V6 — NVCC_PATA UHVIO ALT1 gpio7_GPIO[1] Input 100 KΩ PU

PATA_CS_0 AA2 — NVCC_PATA UHVIO ALT1 gpio7_GPIO[9] Input 100 KΩ PU

PATA_CS_1 AB1 — NVCC_PATA UHVIO ALT1 gpio7_GPIO[10] Input 100 KΩ PU

PATA_DA_0 N2 L1 NVCC_PATA UHVIO ALT1 gpio7_GPIO[6] Input 100 KΩ PU

PATA_DA_1 AB2 — NVCC_PATA UHVIO ALT1 gpio7_GPIO[7] Input 100 KΩ PU

PATA_DA_2 Y3 — NVCC_PATA UHVIO ALT1 gpio7_GPIO[8] Input 100 KΩ PU

PATA_DATA0 B9 A7 NVCC_PATA UHVIO ALT1 gpio2_GPIO[0] Input 100 KΩ PU

PATA_DATA1 B8 B6 NVCC_PATA UHVIO ALT1 gpio2_GPIO[1] Input 100 KΩ PU

PATA_DATA10 B10 A8 NVCC_PATA UHVIO ALT1 gpio2_GPIO[10] Input 100 KΩ PU

PATA_DATA11 C9 B7 NVCC_PATA UHVIO ALT1 gpio2_GPIO[11] Input 100 KΩ PU

PATA_DATA12 Y1 — NVCC_PATA UHVIO ALT1 gpio2_GPIO[12] Input 100 KΩ PU

PATA_DATA13 AA1 — NVCC_PATA UHVIO ALT1 gpio2_GPIO[13] Input 100 KΩ PU

PATA_DATA14 W1 — NVCC_PATA UHVIO ALT1 gpio2_GPIO[14] Input 100 KΩ PU

PATA_DATA15 V1 — NVCC_PATA UHVIO ALT1 gpio2_GPIO[15] Input 100 KΩ PU

Table 118. PoP 12 x 12 mm Signal Assignments, Power Rails, and I/O (continued)

Contact Name

PoP Bottom

Package Contact

Assignment

PoP Top

Package Contact

Assignment

Power Rail I/O Buffer

Type

Out of Reset Condition1

Alt.

Mode Function Direct

ion

Config./

Value

Package Information and Contact Assignments

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 187

PATA_DATA2 B6 A5 NVCC_PATA UHVIO ALT1 gpio2_GPIO[2] Input 100 KΩ PU

PATA_DATA3 C5 B4 NVCC_PATA UHVIO ALT1 gpio2_GPIO[3] Input 100 KΩ PU

PATA_DATA4 Y2 — NVCC_PATA UHVIO ALT1 gpio2_GPIO[4] Input 100 KΩ PU

PATA_DATA5 V3 — NVCC_PATA UHVIO ALT1 gpio2_GPIO[5] Input 100 KΩ PU

PATA_DATA6 V2 — NVCC_PATA UHVIO ALT1 gpio2_GPIO[6] Input 100 KΩ PU

PATA_DATA7 W2 — NVCC_PATA UHVIO ALT1 gpio2_GPIO[7] Input 100 KΩ PU

PATA_DATA8 B12 A10 NVCC_PATA UHVIO ALT1 gpio2_GPIO[8] Input 100 KΩ PU

PATA_DATA9 B11 B9 NVCC_PATA UHVIO ALT1 gpio2_GPIO[9] Input 100 KΩ PU

PATA_DIOR AB3 — NVCC_PATA UHVIO ALT1 gpio7_GPIO[3] Input 100 KΩ PU

PATA_DIOW AA6 — NVCC_PATA UHVIO ALT1 gpio6_GPIO[17] Input 100 KΩ PU

PATA_DMACK Y6 — NVCC_PATA UHVIO ALT1 gpio6_GPIO[18] Input 100 KΩ PU

PATA_DMARQ W6 — NVCC_PATA UHVIO ALT1 gpio7_GPIO[0] Input 100 KΩ PU

PATA_INTRQ V7 — NVCC_PATA UHVIO ALT1 gpio7_GPIO[2] Input 100 KΩ PU

PATA_IORDY B5 A4 NVCC_PATA UHVIO ALT1 gpio7_GPIO[5] Input 100 KΩ PU

PATA_RESET_B B4 A3 NVCC_PATA UHVIO ALT1 gpio7_GPIO[4] Input 100 KΩ PU

PMIC_ON_REQ F12 — NVCC_SRTC_POW GPIO ALT0 srtc_SRTCALARM Output —

PMIC_STBY_R

G17 — NVCC_SRTC_POW GPIO ALT0 ccm_PMIC_VSTBY

_REQ

Output —

POR_B AC27 — NVCC_RESET LVIO ALT0 src_POR_B Input 100 KΩ PU

RESET_IN_B AB28 — NVCC_RESET LVIO ALT0 src_RESET_B Input 100 KΩ PU

SATA_REFCLK

AJ18 — VPH ANALOG — SATA_REFCLKM — —

SATA_REFCLK

AH18 — VPH ANALOG — SATA_REFCLKP — —

SATA_REXT AJ17 — VPH ANALOG — SATA_REXT — —

SATA_RXM AH16 — VPH ANALOG — SATA_RXM — —

SATA_RXP AJ16 — VPH ANALOG — SATA_RXP — —

SATA_TXM AH14 — VPH ANALOG — SATA_TXM — —

SATA_TXP AJ14 — VPH ANALOG — SATA_TXP — —

SD1_CLK AJ26 — NVCC_SD1 UHVIO ALT1 gpio1_GPIO[20] Input 100 KΩ PU

SD1_CMD AH26 — NVCC_SD1 UHVIO ALT1 gpio1_GPIO[18] Input 100 KΩ PU

Table 118. PoP 12 x 12 mm Signal Assignments, Power Rails, and I/O (continued)

Contact Name

PoP Bottom

Package Contact

Assignment

PoP Top

Package Contact

Assignment

Power Rail I/O Buffer

Type

Out of Reset Condition1

Alt.

Mode Function Direct

ion

Config./

Value

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

188 Freescale Semiconductor

Package Information and Contact Assignments

SD1_DATA0 AH27 — NVCC_SD1 UHVIO ALT1 gpio1_GPIO[16] Input 100 KΩ PU

SD1_DATA1 AG25 — NVCC_SD1 UHVIO ALT1 gpio1_GPIO[17] Input 100 KΩ PU

SD1_DATA2 AH25 — NVCC_SD1 UHVIO ALT1 gpio1_GPIO[19] Input 100 KΩ PU

SD1_DATA3 AJ25 — NVCC_SD1 UHVIO ALT1 gpio1_GPIO[21] Input 100 KΩ PU

SD2_CLK AG19 — NVCC_SD2 UHVIO ALT1 gpio1_GPIO[10] Input 100 KΩ PU

SD2_CMD AD21 — NVCC_SD2 UHVIO ALT1 gpio1_GPIO[11] Input 100 KΩ PU

SD2_DATA0 AH17 — NVCC_SD2 UHVIO ALT1 gpio1_GPIO[15] Input 100 KΩ PU

SD2_DATA1 AG17 — NVCC_SD2 UHVIO ALT1 gpio1_GPIO[14] Input 100 KΩ PU

SD2_DATA2 AD17 — NVCC_SD2 UHVIO ALT1 gpio1_GPIO[13] Input 100 KΩ PU

SD2_DATA3 AG18 — NVCC_SD2 UHVIO ALT1 gpio1_GPIO[12] Input 100 KΩ PU

TEST_MODE AA27 — NVCC_RESET LVIO ALT0 tcu_TEST_MODE Input 100 KΩ PD

TVCDC_IOB_B

ACK

B23 — TVDAC_AHVDDRG

ANALOG — TVCDC_IOB_BACK — —

TVCDC_IOG_B

ACK

A24 — TVDAC_AHVDDRG

ANALOG — TVCDC_IOG_BAC

——

TVCDC_IOR_B

ACK

C28 — TVDAC_AHVDDRG

ANALOG — TVCDC_IOR_BACK — —

TVDAC_COMP A25 — TVDAC_AHVDDRG

ANALOG — TVDAC_COMP — —

TVDAC_IOB A23 — TVDAC_AHVDDRG

ANALOG — TVDAC_IOB — —

TVDAC_IOG B24 — TVDAC_AHVDDRG

ANALOG — TVDAC_IOG — —

TVDAC_IOR C29 — TVDAC_AHVDDRG

ANALOG — TVDAC_IOR — —

USB_H1_DN AH21 — USB_H1_VDDA25,

USB_H1_VDDA33

ANALOG5

— USB_H1_DN — —

USB_H1_DP AJ21 — USB_H1_VDDA25,

USB_H1_VDDA33

ANALOG5

— USB_H1_DP — —

USB_H1_GPAN

AIO

AJ20 — USB_H1_VDDA25,

USB_H1_VDDA33

ANALOG2

— USB_H1_GPANAIO — —

USB_H1_RREF

EXT

AH20 — USB_H1_VDDA25,

USB_H1_VDDA33

ANALOG2

— USB_H1_RREFEX

——

Table 118. PoP 12 x 12 mm Signal Assignments, Power Rails, and I/O (continued)

Contact Name

PoP Bottom

Package Contact

Assignment

PoP Top

Package Contact

Assignment

Power Rail I/O Buffer

Type

Out of Reset Condition1

Alt.

Mode Function Direct

ion

Config./

Value

Package Information and Contact Assignments

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 189

6.3.3 12 x 12 mm PoP, 0.4 Pitch Ball Maps

Table 119 shows the 12 × 12 mm, 0.4 pitch top ball map.

Table 120 shows the 12 × 12 mm, 0.4 pitch bottom ball map.

USB_H1_VBUS AJ22 — USB_H1_VDDA25,

USB_H1_VDDA33

ANALOG5

— USB_H1_VBUS — —

USB_OTG_DN AJ23 — USB_OTG_VDDA25

USB_OTG_VDDA33

ANALOG5

— USB_OTG_DN — —

USB_OTG_DP AH23 — USB_OTG_VDDA25

USB_OTG_VDDA33

ANALOG5

— USB_OTG_DP — —

USB_OTG_GPA

NAIO

AH24 — USB_OTG_VDDA25

USB_OTG_VDDA33

ANALOG2

— USB_OTG_GPANAI

——

USB_OTG_ID AH22 — USB_OTG_VDDA25

USB_OTG_VDDA33

ANALOG2

— USB_OTG_ID — —

USB_OTG_RRE

FEXT

AJ24 — USB_OTG_VDDA25

USB_OTG_VDDA33

ANALOG2

— USB_OTG_RREFE

——

USB_OTG_VBU

AG21 — USB_OTG_VDDA25

USB_OTG_VDDA33

ANALOG5

— USB_OTG_VBUS — —

XTAL F15 — NVCC_XTAL ANALOG — XTAL — —

1The state immediately after reset and before ROM firmware or software has executed.

2During power-on reset this port acts as input for fuse override, ~33KΩ PU/PD recommended to set the value. See Section 5.1,

“Boot Mode Configuration Pins” for details.

3During power-on reset this port acts as output for diagnostic signal INT_BOOT

4During power-on reset this port acts as output for diagnostic signal ANY_PU_RST

Table 118. PoP 12 x 12 mm Signal Assignments, Power Rails, and I/O (continued)

Contact Name

PoP Bottom

Package Contact

Assignment

PoP Top

Package Contact

Assignment

Power Rail I/O Buffer

Type

Out of Reset Condition1

Alt.

Mode Function Direct

ion

Config./

Value

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

190 Freescale Semiconductor

Package Information and Contact Assignments

Table 119. PoP 12 × 12 mm, 0.4 Pitch Top Ball Map

PATA _ R E S E T _ B

PATA _ I O R DY

PATA _ DATA 2

POP_VCCMM

PATA _ DATA 0

PATA _ DATA 1 0

POP_VCCQMM

PATA _ DATA 8

POP_VDD1

GND

DRAM_D27

DRAM_D25

GND

DRAM_D30

DRAM_D24

GND

DRAM_SDQS3_B

POP_VDD1

GND

POP_VDD1

PATA_ DATA 3

GND

PATA_ DATA 1

PATA_ DATA 1 1

GND

PATA_ DATA 9

GND

POP_VDD2

DRAM_D29

POP_VDDQ

DRAM_D31

DRAM_D28

POP_VDDQ

DRAM_D26

DRAM_SDQS3

POP_VDDQ

DRAM_DQM3

POP_VDD2

GND

POP_VDD2

DRAM_D16

GND

EIM_DA12

EIM_DA4

POP_VDDQ

DRAM_D18

EIM_DA13

EIM_DA5

DRAM_D22

DRAM_D17

POP_VCCQMM1

GND

DRAM_D20

GND

EIM_DA14

EIM_DA6

POP_VDDQ

DRAM_D19

EIM_DA15

EIM_DA7

DRAM_D21

DRAM_D23

Package Information and Contact Assignments

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 191

POP_VCCMM

GND

DRAM_SDQS2

GND

NANDF_WE_B

NANDF_RE_B

POP_VDDQ

DRAM_SDQS2_B

PATA _ DA _ 0

NANDF_ALE

POP_VDD2

DRAM_DQM2

NANDF_CS0

GND

DDR_VREF

GND

NANDF_WP_B

POP_VDD1

DRAM_DQM0

POP_ZQ

DDR_VREF

DRAM_SDQS0_B

GND

POP_VDD2

POP_VDDQ

DRAM_SDQS0

Table 119. PoP 12 × 12 mm, 0.4 Pitch Top Ball Map (continued)

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

192 Freescale Semiconductor

Package Information and Contact Assignments

DRAM_A9

DRAM_A8

DRAM_D6

DRAM_D4

DRAM_A7

POP_VDDCA

DRAM_D2

GND

DRAM_A6

POP_VDDQ

DRAM_D5

DRAM_A5

POP_VDDCA

DRAM_D0

DRAM_D7

DRAM_SDCLK_1_B

DRAM_SDCLK_1

DRAM_D3

GND

POP_VDD2

POP_VDDQ

DRAM_D1

DRAM_CS0

DRAM_CS1

POP_VDD1

DRAM_A1

GND

DRAM_A3

DRAM_A4

POP_VDD2

GND

DRAM_D14

POP_VDDQ

DRAM_D12

DRAM_D13

POP_VDDQ

DRAM_D9

DRAM_SDQS1

POP_VDDQ

DRAM_DQM1

POP_VDD2

DRAM_SDCKE0

DRAM_SDCKE1

GND

DRAM_A0

DRAM_A2

POP_VDDCA

GND

POP_VDDMM

POP_VACC

GND

DRAM_D10

DRAM_D8

GND

DRAM_D15

DRAM_D11

GND

DRAM_SDQS1_B

POP_VDD1

GND

Table 119. PoP 12 × 12 mm, 0.4 Pitch Top Ball Map (continued)

Package Information and Contact Assignments

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 193

Table 120. PoP 12 × 12 mm, 0.4 Pitch Bottom Ball Map

GND

EIM_A25

EIM_A24

EIM_LBA

EIM_A19

EIM_A16

EIM_DA3

EIM_OE

EIM_DA8

NANDF_CS1

NANDF_CS3

LVDS1_TX3_N

LVDS1_TX2_N

LVDS1_CLK_N

LVDS1_TX1_N

LVDS1_TX0_P

LVDS0_TX3_P

LVDS0_CLK_P

LVDS0_TX2_P

LVDS0_TX1_N

LVDS0_TX0_P

TVDAC_IOB

TVCDC_IOG_BACK

TVDAC_COMP

GPIO_12

TVDAC_VREF

GND

EIM_A23

PATA_RESET_B

PATA _ I O R DY

PATA _ DATA 2

EIM_A20

PATA _ DATA 1

PATA _ DATA 0

PATA _ DATA 1 0

PATA _ DATA 9

PATA _ DATA 8

LVDS1_TX3_P

LVDS1_TX2_P

LVDS1_CLK_P

LVDS1_TX1_P

LVDS1_TX0_N

LVDS0_TX3_N

LVDS0_CLK_N

LVDS0_TX2_N

LVDS0_TX1_P

LVDS0_TX0_N

TVCDC_IOB_BACK

TVDAC_IOG

GPIO_10

GPIO_11

GPIO_14

GND

EIM_D30

EIM_A22

POP_VDD1

EIM_CS1

PATA _ DATA 3

EIM_A21

EIM_D29

POP_VCCMM

PATA _ DATA 1 1

EIM_D27

POP_VCCQMM

NANDF_CS2

POP_VDD1

POP_VDD2

NANDF_RB0

POP_VDDQ

GND

LVDS_BG_RES

DRAM_D25

POP_VDDQ

DRAM_SDQS3_B

DRAM_SDQS3

DRAM_DQM3

POP_VDDQ

GPIO_13

POP_VDD1

POP_VDD2

TVCDC_IOR_BACK

TVDAC_IOR

EIM_D26

EIM_D28

POP_VDD2

DRAM_A15

DRAM_D18

DRAM_D16

EIM_D25

EIM_DA12

EIM_DA4

POP_VDDQ

DRAM_D22

DRAM_D17

EIM_D23

EIM_DA13

EIM_DA5

EIM_EB3

EIM_D31

EIM_A18

EIM_D24

EIM_DA2

EIM_BCLK

PMIC_ON_REQ

NVCC_SRTC_POW

NVCC_XTAL

XTAL

VDDA

DRAM_D29

NVCC_LVDS_BG

NVCC_LVDS

DRAM_D30

DRAM_D24

DRAM_SDCKE1

TVDAC_DHVDD

NVCC_EMI_DRAM

DRAM_D20

DRAM_D19

DRAM_D23

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

194 Freescale Semiconductor

Package Information and Contact Assignments

EIM_D22

EIM_D19

EIM_D17

NVCC_EIM_SEC

EIM_EB1

EIM_A17

NVCC_EIM_MAIN

EIM_CS0

EIM_DA1

NVCC_NANDF

CKIL

ECKIL

EXTAL

NANDF_CLE

PMIC_STBY_REQ

DRAM_D27

DRAM_D31

DRAM_D28

DRAM_D26

TVDAC_AHVDDRGB

NVCC_EMI_DRAM

DRAM_D21

DRAM_SDQS2

DRAM_SDQS2_B

EIM_D16

EIM_D18

POP_VCCQMM1

EIM_D21

EIM_RW

DRAM_SDCLK_1

NVCC_EMI_DRAM

DRAM_SDBA0

DRAM_SDODT1

DRAM_DQM2

EIM_EB0

EIM_DA14

EIM_DA6

NVCC_CSI

EIM_EB2

DRAM_SDCLK_1_B

DRAM_CS1

POP_VDDQ

DRAM_RESET

DRAM_A11

EIM_DA0

EIM_DA15

EIM_DA7

EIM_DA9

EIM_DA11

NVCC_EMI_DRAM_2P5

NVCC_EMI_DRAM

DRAM_SDBA1

DRAM_SDBA2

DRAM_SDWE

CSI0_DAT19

CSI0_DAT18

POP_VCCMM

EIM_WAIT

EIM_DA10

VCC

GND

VCC

DRAM_A3

NVCC_EMI_DRAM

DRAM_A14

DRAM_A12

DRAM_SDODT0

CSI0_DAT16

NANDF_WE_B

NANDF_RE_B

VDDA

EIM_D20

VCC

GND

VCC

DRAM_A5

DRAM_A8

DRAM_A13

DRAM_A10

DRAM_RAS

Table 120. PoP 12 × 12 mm, 0.4 Pitch Bottom Ball Map (continued)

Package Information and Contact Assignments

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 195

CSI0_DAT17

PATA _ DA _ 0

NANDF_ALE

NVCC_PATA

CSI0_DAT7

VCC

GND

VCC

DRAM_A7

NVCC_EMI_DRAM

POP_VDDQ

DRAM_DQM0

DRAM_SDQS0

CSI0_DAT15

NANDF_CS0

CSI0_DAT9

CSI0_DATA_EN

CSI0_DAT6

GND

DRAM_A6

NVCC_EMI_DRAM

POP_VDD2

DRAM_SDQS0_B

DRAM_D6

CSI0_DAT13

CSI0_DAT10

CSI0_DAT5

VDDA

CSI0_DAT11

GND

DRAM_CALIBRATION

NVCC_EMI_DRAM

DRAM_D4

DRAM_D5

DRAM_D2

CSI0_DAT14

NANDF_WP_B

POP_VDD1

CSI0_MCLK

CSI0_DAT4

GND

DRAM_A9

VDDA

POP_VDD1

DRAM_D7

DRAM_D0

CSI0_DAT12

CSI0_DAT8

POP_ZQ

CSI0_PIXCLK

CSI0_VSYNC

VDDGP

GND

VCC

DDR_VREF

NVCC_EMI_DRAM

DRAM_D3

FEC_MDC

FEC_TXD0

PATA _ DATA 1 5

PATA _ DATA 6

PATA _ DATA 5

PATA_BUFFER_EN

PATA _ I N T R Q

VDDGP

GND

VCC

DRAM_A2

NVCC_EMI_DRAM

DRAM_D1

FEC_TXD1

FEC_TX_EN

Table 120. PoP 12 × 12 mm, 0.4 Pitch Bottom Ball Map (continued)

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

196 Freescale Semiconductor

Package Information and Contact Assignments

PATA _ DATA 1 4

PATA _ DATA 7

POP_VDD2

PATA_DMARQ

NVCC_LCD

VDDGP

GND

VCC

DRAM_A0

NVCC_EMI_DRAM

POP_VDDQ

FEC_RXD0

FEC_RXD1

PATA _ DATA 1 2

PATA _ DATA 4

PATA _ DA _ 2

PATA _ D M AC K

NVCC_LCD

DRAM_A1

NVCC_EMI_DRAM_2P5

FEC_CRS_DV

FEC_RX_ER

FEC_REF_CLK

PATA _ DATA 1 3

PATA _ C S _ 0

POP_VDDCA

PATA _ D I OW

DISP0_DAT19

DRAM_CAS

DRAM_A4

TEST_MODE

BOOT_MODE0

FEC_MDIO

PATA_ C S _ 1

PATA_ DA _ 1

PATA _ D I O R

DISP0_DAT17

DISP0_DAT21

DRAM_CS0

DRAM_SDCKE0

POP_VDDQ

RESET_IN_B

BOOT_MODE1

DISP0_DAT12

DISP0_DAT2

DISP0_DAT1

DI0_PIN4

DI0_PIN3

VDDAL1

GPIO_18

GPIO_17

GPIO_7

GPIO_3

GPIO_9

NVCC_FEC

JTAG_TDI

NVCC_SD2

JTAG_TRSTB

USB_H1_VDDA33

USB_OTG_VDDA25

NVCC_SD1

VDD_FUSE

VDD_ANA_PLL

VDD_DIG_PLL

NVCC_EMI_DRAM

POR_B

CKIH2

CKIH1

DISP0_DAT0

DISP0_DAT6

POP_VDDCA

NVCC_KEYPAD

DI0_PIN2

KEY_ROW4

NVCC_GPIO

GPIO_8

NVCC_JTAG

GPIO_0

JTAG_TCK

VDDA

JTAG_MOD

JTAG_TMS

SD2_DATA2

NVCC_RESET

USB_H1_VDDA25

USB_OTG_VDDA33

SD2_CMD

NVCC_CKIH

VDD_REG

NVCC_EMI_DRAM

DRAM_DQM1

FASTR_DIG

FASTR_ANA

Table 120. PoP 12 × 12 mm, 0.4 Pitch Bottom Ball Map (continued)

Package Information and Contact Assignments

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 197

DISP0_DAT5

DISP0_DAT3

DISP0_DAT11

DRAM_SDQS1_B

DRAM_SDQS1

DRAM_D9

DISP0_DAT4

DI0_DISP_CLK

POP_VDD2

POP_VDDQ

DRAM_D8

DRAM_D13

DISP0_DAT7

DISP0_DAT10

DISP0_DAT14

DISP0_DAT8

DISP0_DAT16

POP_VDD1

KEY_ROW3

KEY_COL2

KEY_COL0

POP_VDDCA

GPIO_2

POP_VDD2

POP_VDDMM

POP_VACC

JTAG_TDO

POP_VDDQ

SD2_DATA1

SD2_DATA3

SD2_CLK

POP_VDDQ

USB_OTG_VBUS

DRAM_D10

DRAM_D12

POP_VDDQ

SD1_DATA1

POP_VDD1

POP_VDD2

DRAM_D14

DRAM_D11

GND

SVDDGP

DISP0_DAT13

DISP0_DAT15

DISP0_DAT22

DI0_PIN15

KEY_COL4

KEY_ROW1

KEY_ROW0

GPIO_16

GPIO_4

GPIO_1

VPH

SATA_TXM

GND

SATA_RXM

SD2_DATA0

SATA_REFCLKP

USB_H1_RREFEXT

USB_H1_DN

USB_OTG_ID

USB_OTG_DP

USB_OTG_GPANAIO

SD1_DATA2

SD1_CMD

SD1_DATA0

SVCC

GND

DISP0_DAT9

DISP0_DAT18

DISP0_DAT20

DISP0_DAT23

KEY_ROW2

KEY_COL3

KEY_COL1

GPIO_19

GPIO_5

GPIO_6

VPH

SATA_TXP

GND

SATA_RXP

SATA_REXT

SATA_REFCLKM

USB_H1_GPANAIO

USB_H1_DP

USB_H1_VBUS

USB_OTG_DN

USB_OTG_RREFEXT

SD1_DATA3

SD1_CLK

DRAM_D15

GND

Table 120. PoP 12 × 12 mm, 0.4 Pitch Bottom Ball Map (continued)

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

198 Freescale Semiconductor

Revision History

7 Revision History

Table 121 provides a revision history for this data sheet.

Table 121. i.MX53xD Data Sheet Document Revision History

Rev.

Number Date Substantive Change(s)

Rev 4.1 02/2012 • In Table 1, "Ordering Information," on page 3, changed the part number PCIMX538DZK1C to

SCIMX538DZK1C.

Revision History

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 199

Rev 4 11/2011 • In Section 1, “Introduction,” changed 1 GHz to 1.2 GHz in the second paragraph and updated the

bulleted list after the second paragraph.

•In Table 1, "Ordering Information," on page 3:

—Removed part numbers “PCIMX535DVV1C” and “MCIMX538DZK1C”

—Added a new part number “MCIMX535DVV2C”

—Updated package information for part number “PCIMX538DZK1C”

—Updated the second footnote

•In Section 1.2, “Features,” changed “Target frequency” to “Maximum frequency” and 1 GHz to 1–1.2

GHz in the third bullet item of the first bulleted list.

•In Table 2, "i.MX53xD Digital and Analog Blocks," on page 8, removed “Sorenson H.263 decode,

4CIF resolution, 8 Mbps bit rate” from VPU brief description.

•In Table 4, "Absolute Maximum Ratings," on page 17, changed the maximum voltage for VDDGP

from 1.35V to 1.4V.

•In Table 7, "i.MX53xD Operating Ranges," on page 20:

—Added a row and a footnote for “ARM core supply voltage fARM ≤ 1200 MHz” parameter of VDDGP

—Added a new footnote for “Peripheral supply voltage” parameter of VCC

—Updated the footnote for “Junction temperature” parameter

•In Table 9, "Maximal Supply Currents," on page 23, made the following two changes for VDDGP:

—Changed the test condition “1000 MHz ARM clock” to “1000 MHz ARM Clock at 1.27V, 105 oC”

—Added a new row for VDDGP corresponding to 1200 MHz (1.2 GHz)

• Added a note after Section 4.2.1, “Power-Up Sequence,” cross-referencing i.MX53 System

Development User’s Guide.

•In Table 11, "GPIO I/O DC Electrical Characteristics," on page 29:

—Changed test condition “Iout = -1 mA” to “Iout = -0.8 mA” in the first row

—Removed test condition “Iout= specified Ioh Drive” from the first row

—Removed “0.8 x OVDD” from the Min column of the first row

—Changed test condition “Iout = 1 mA” to “Iout = 0.8 mA” in the second row

—Removed test condition “Iout= specified Iol Drive” from the second row

—Removed “0.2 x OVDD” from the Max column of the second row

—Removed rows 3–6

—Changed the max value for Iin at condition “Vin = OVDD or 0” in row 12 from 2 μA to 10 μA

—Changed the max value for Iin at condition “Vin = OVDD” in rows 13–15 from 2 μA to 10 μA

—Changed the max value for Iin at condition “Vin = 0 V” in row 15 from 36 μA to 40 μA

—Changed the max value for Iin at condition “Vin = 0 V” in row 16 from 2 μA to 10 μA

—Changed the max value for Iin at condition “Vin = OVDD” in row 16 from 36 μA to 40 μA

•In Table 12, "DDR2 I/O DC Electrical Parameters," on page 30:

—Added test condition “Ioh = -0.1 mA” in the first row

—Added test condition “Iol = 0.1 mA” in the second row

—Removed rows 3–4

•In Section 4, “Electrical Characteristics,” removed the note appearing after the first paragraph.

•In Section 4.2.1, “Power-Up Sequence,” updated the fifth bullet item.

•In Section 4.3.2.2, “LPDDR2 Mode I/O DC Parameters,” added the sentence “The parameters in

Ta b l e 1 3 are guaranteed per the operating ranges in Ta b l e 7 , unless otherwise noted.” before

Ta b l e 1 3 .

•In Table 13, "LPDDR2 I/O DC Electrical Parameters," on page 31:

—Added test condition “Ioh = -0.1 mA” in the first row

—Added test condition “Iol = 0.1 mA” in the second row

Table 121. i.MX53xD Data Sheet Document Revision History (continued)

Rev.

Number Date Substantive Change(s)

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

200 Freescale Semiconductor

Revision History

Rev 4

(continued)

11/2011 • In Table 14, "DDR3 I/O DC Electrical Parameters," on page 31:

—Added test condition “Ioh = -0.1 mA” in the first row

—Added test condition “Iol = 0.1 mA” in the second row

•In Table 15, "LVIO DC Electrical Characteristics," on page 32:

—Added test condition “Ioh = -0.8 mA” in the first row

—Added test condition “Iol = 0.8 mA” in the second row

•In Table 16, "UHVIO DC Electrical Characteristics," on page 33:

—Changed test condition “Iout = -1 mA” to “Iout = -0.8 mA” in the first row

—Removed test condition “Iout= specified Ioh Drive” from the first row

—Removed “0.8 x OVDD” from the Min column of the first row

—Changed test condition “Iout = 1 mA” to “Iout = 0.8 mA” in the second row

—Removed test condition “Iout= specified Iol Drive” from the second row

—Removed “0.2 x OVDD” from the Max column of the second row

—Removed rows 3–6

•In Section 4.3.5, “LVDS I/O DC Parameters,” added the sentence “The parameters in Ta b l e 1 7 are

guaranteed per the operating ranges in Ta b l e 7 , unless otherwise noted.” before Ta b l e 1 7 .

•In Table 17, "LVDS DC Electrical Characteristics," on page 34, changed test condition “Rload=100Ω

padP, –padN” to “Rload = 100Ω between padP and padN”.

•In Table 36, " NFC—Timing Characteristics," on page 51, corrected footnote number for Tdl.

•In Table 50, "SD/eMMC4.3 Interface Timing Specification," on page 74, updated eSDHC output delay.

•In Table 51, "eMMC4.4 Interface Timing Specification," on page 75, updated eSDHC output delay.

•In Table 63, "TV Encoder Video Performance Specifications," on page 96, changed test condition

“Fout = 9.28 MHz” for SFDR to “Fout = 8.3 MHz”.

•In Table 118, "PoP 12 x 12 mm Signal Assignments, Power Rails, and I/O," on page 176, removed

the DRAM_SDCLK_0 and DRAM_SDCLK_0_B rows.

Rev 3 06/2011 • In Section 4.1.1, “Absolute Maximum Ratings,” updated the caution note on page 17.

•In Table 116, "Additional PCB connections for PoP NAND Flash," on page 175, updated the second

and third column headings.

Table 121. i.MX53xD Data Sheet Document Revision History (continued)

Rev.

Number Date Substantive Change(s)

Revision History

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

Freescale Semiconductor 201

Rev 2 05/2011 • In Table 1, "Ordering Information," on page 3, deleted the row for part number PCIMX535DVV1B,

added a row for MCIMX538DZK1C and updated the PCIMX538DZK1C row.

• Updated the note on page 6 in Section 1.2, “Features.”

• Added 167 MHz ARM specification to Table 7, "i.MX53xD Operating Ranges," on page 20.

• Modified VDD_FUSE design best practice footnote on Table 7, "i.MX53xD Operating Ranges," on

page 20.

• Changed VDD_FUSE max current to 120 mA in Table 9, "Maximal Supply Currents," on page 23.

• Deleted the last row of Table 10, "USB Interface Current Consumption," on page 25.

• Added Section 4.1.2.2, “PoP Package Thermal Resistance,” according to package design report.

• Made changes related to text, tables, and figures in Section 4.6.7, “DDR SDRAM Specific Parameters

(DDR2/LVDDR2, LPDDR2, and DDR3). Changes include adding LPDDR2 waves, updating timings

by ACCZ test results, and changing note about DDR load model.

• Removed the Standard Serial Interfaces section.

•In Table 11, "GPIO I/O DC Electrical Characteristics," on page 29, changed input current with no

pull-up/down from 250/120 nA to 2 μA, all input currents with pull-up from 0.12 μΑ to 2 μA when Vin

= OVDD, and input current with pull-down from 0.25 μA to 2 μA when Vin = 0.

•In Tab le 1 2 , Ta b l e 1 3 , and Ta bl e 1 4 , changed input current from the nA range to 1 μA.

•In Table 15, "LVIO DC Electrical Characteristics," on page 32, changed input current with no

pull-up/down from 250/120 nA to 1 μA, all input currents with pull-up from 0.12 μΑ to 1 μA when Vin

= OVDD, and input current with pull-down from 0.25 μA to 1 μA when Vin = 0.

•In Table 16, "UHVIO DC Electrical Characteristics," on page 33, changed input current with no

pull-up/down from 300/63 nA to 1 μA, all input currents with pull-up from 0.06 μΑ to 1 μA when Vin =

OVDD, and input current with pull-down from 0.3 μA to 1 μA when Vin = 0.

• Updated keeper values in Ta bl e 1 1 through Tab le 1 6 .

• Fixed titles of Figure 18 through Figure 26, to fit original EIM AC spec.

• Updated Figure 2, "Power-Up Detailed Sequence," on page 27.

• Added Figure 27, "DTACK Write Access (DAP=0)," on page 61.

• Added Table 19, "DDR Output Driver Average Impedance," on page 37.

• Deleted the second footnote of Table 33, "CAMP Electrical Parameters (CKIH1, CKIH2)," on page 46.

• Deleted the Revision 1.0 EIM Internal Module Multiplexing table.

• Deleted the CKIL Electrical Specifications table.

• Deleted the CSPI Slave Mode Timing Parameters table .

• Updated the last paragragh of Section 4.7.8.6.1, “IPU Display Operating Signals.”

• Changed the title of the Section 4.4.2, “DDR Output Driver Average Impedance,” from “LPDDR2 I/O

Output Buffer Impedance.”

• Added Section 6.3.2.2, “PoP Memory Support and Signal Cross Reference.”

• Updated Table 36, " NFC—Timing Characteristics," on page 51.

• Removed the “Differential pulse skew” row from Table 30, "AC Electrical Characteristics of LVDS

Pad," on page 44.

• Updated Table 64, "Asynchronous Display Interface Timing Parameters (Pixel Level)," on page 103.

• Updated Table 65, "Asynchronous Parallel Interface Timing Parameters (Access Level)," on page

104.

• Updated Table 101, "USB Timing Specification for Normal ULPI Mode," on page 141.

• Updated the second footnote on Table 112, "19 x 19 mm Signal Assignments, Power Rails, and I/O,"

on page 151.

Table 121. i.MX53xD Data Sheet Document Revision History (continued)

Rev.

Number Date Substantive Change(s)

i.MX53xD Applications Processors for Consumer Products, Rev. 4.1

202 Freescale Semiconductor

Revision History

Rev 1 03/2011 • Updated the first sentence of Section 3.1, “Special Signal Considerations.”

• Deleted two tables, “Special Signal Considerations” and “JTAG Controller Interface Summary,” in

Section 3.1, “Special Signal Considerations.”

• Updated Table 7, "i.MX53xD Operating Ranges," on page 20.

• Changed VDDGP voltages as follows:

— 400 MHz from 1.35 to 1.05 V maximum.

— 800 MHz from 1.0/1.05/1.1 to 1.05/1.1/1.15 V minimum/nominal/maximum.

— Stop mode from 0.9/0.95/1.1 to 0.8/0.85/1.3 V minimum/nominal/maximum.

• Added statements to footnotes 5 and 6.

• Added footnote on voltage ramping.

•In Section 1, “Introduction,” the second bullet item changed from “Smartbooks” to “Smart mobile

devices.”

•In Table 1, "Ordering Information," on page 3, added two new rows for part numbers

PCIMX535DVV1C and MCIMX535DVV1C.

Rev 0 02/2011 Initial release.

Table 121. i.MX53xD Data Sheet Document Revision History (continued)

Rev.

Number Date Substantive Change(s)

Document Number: IMX53CEC

Rev. 4.1

2/2012

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