SECTION 11 PACKAGING Outlines and Parameters ............................................................................................................................. 1 Product Tape and Reel Specifications ...................................................................................................... 58 Thermal Characteristics ............................................................................................................................ 60 Overview of Microchip Die/Wafer Support ................................................................................................ 62 2001 Microchip Technology Inc. DS00049R-page i Packaging Diagrams and Parameters CERAMIC SIDE BRAZED DUAL IN-LINE FAMILY 8-Lead Ceramic Side Brazed Dual In-line with Window (JW) - 300 mil ...............................................4 14-Lead Ceramic Side Brazed Dual In-line with Window (JW) - 300 mil ...........................................5 28-Lead Ceramic Side Brazed Dual In-line with Window (JW) - 300 mil ..............................................6 CERAMIC DUAL IN-LINE (CERDIP) FAMILY 18-Lead Ceramic Dual In-line with Window (JW) - 300 mil (CERDIP) 28-Lead Ceramic Dual In-line with Window (JW) - 300 mil (CERDIP) 28-Lead Ceramic Dual In-line with Window (JW) - 600 mil (CERDIP) 40-Lead Ceramic Dual In-line with Window (JW) - 600 mil (CERDIP) .................................................7 .................................................8 .................................................9 ...............................................10 CERAMIC CHIP CARRIER FAMILY 68-Lead Ceramic Leaded (CL) Chip Carrier with Window - Square (CERQUAD) .............................11 SMALL OUTLINE TRANSISTOR 3-Lead Plastic Transistor Outline (TO) (TO-92) .............................................................................12 3-Lead Plastic Small Outline Transistor (TT) (SOT23) ........................................................................13 5-Lead Plastic Small Outline Transistor (OT) (SOT23) .......................................................................14 Leadless Wedge Module Plastic Small Outline Transistor (WM) (SOT385) .......................................15 PLASTIC DUAL IN-LINE (PDIP) FAMILY 8-Lead Plastic Dual In-line (P) - 300 mil (PDIP) .................................................................................16 14-Lead Plastic Dual In-line (P) - 300 mil (PDIP) ...............................................................................17 16-Lead Plastic Dual In-line (P) - 300 mil (PDIP) ...............................................................................18 18-Lead Plastic Dual In-line (P) - 300 mil (PDIP) ..............................................................................19 20-Lead Plastic Dual In-line (P) - 300 mil (PDIP) ...............................................................................20 24-Lead Plastic Dual In-line (P) - 600 mil (PDIP) ..............................................................................21 24-Lead Skinny Plastic Dual In-line (SP) - 300 mil (PDIP) .................................................................22 28-Lead Skinny Plastic Dual In-line (SP) - 300 mil (PDIP) .................................................................23 28-Lead Plastic Dual In-line (P) - 600 mil (PDIP) ...............................................................................24 40-Lead Plastic Dual In-line (P) - 600 mil (PDIP) ...............................................................................25 64-Lead Shrink Plastic Dual In-line (SP) - 750 mil (PDIP) .................................................................26 PLASTIC LEADED CHIP CARRIER (PLCC) FAMILY 20-Lead Plastic Leaded Chip Carrier (L) - Square (PLCC) ................................................................27 28-Lead Plastic Leaded Chip Carrier (L) - Square (PLCC) ................................................................28 32-Lead Plastic Leaded Chip Carrier (L) - Rectangle (PLCC) ............................................................29 44-Lead Plastic Leaded Chip Carrier (L) - Square (PLCC) ................................................................30 68-Lead Plastic Leaded Chip Carrier (L) - Square (PLCC) ................................................................31 84-Lead Plastic Leaded Chip Carrier (L) - Square (PLCC) ................................................................32 DS00049R-page ii 2001 Microchip Technology Inc. Packaging Diagrams and Parameters PLASTIC SMALL OUTLINE (SOIC) FAMILY 8-Lead Plastic Small Outline (SN) - Narrow, 150 mil (SOIC) ............................................................. 33 14-Lead Plastic Small Outline (SL) - Narrow, 150 mil (SOIC) ............................................................ 34 16-Lead Plastic Small Outline (SL) - Narrow 150 mil (SOIC) ........................................................... 35 8-Lead Plastic Small Outline (SM) - Medium, 208 mil (SOIC) ........................................................... 36 16-Lead Plastic Small Outline (SO) - Wide, 300 mil (SOIC) ............................................................. 37 18-Lead Plastic Small Outline (SO) - Wide, 300 mil (SOIC) .............................................................. 38 20-Lead Plastic Small Outline (SO) - Wide, 300 mi (SOIC) ............................................................... 39 28-Lead Plastic Small Outline (SO) - Wide, 300 mil (SOIC) .............................................................. 40 PLASTIC MICRO LEADFRAME (MLF) FAMILY 8-Lead Plastic Micro Leadframe Package (MF) 6x5 mm Body (MLF-S) ............................................ 41 28-Lead Plastic Micro Leadframe Package (MF) 6x6 mm Body (MLF) ............................................. 43 PLASTIC MICRO SMALL OUTLINE (MSOP) FAMILY 8-Lead Plastic Micro Small Outline Package (MS) (MSOP) ............................................................... 45 PLASTIC SHRINK SMALL OUTLINE (SSOP) FAMILY 20-Lead Plastic Shrink Small Outline (SS) - 209 mil, 5.30 mm (SSOP) ........................................... 46 28-Lead Plastic Shrink Small Outline (SS) - 209 mil, 5.30 mm (SSOP) ............................................ 47 PLASTIC THIN SHRINK SMALL OUTLINE (TSSOP) FAMILY 8-Lead Plastic Thin Shrink Small Outline (ST) - 4.4 mm (TSSOP) .................................................... 48 14-Lead Plastic Thin Shrink Small Outline (ST) - 4.4 mm (TSSOP) .................................................. 49 20-Lead Plastic Thin Shrink Small Outline (ST) - 4.4 mm (TSSOP) .................................................. 50 PLASTIC THIN SMALL OUTLINE (TSOP) AND VERY SMALL OUTLINE (VSOP) FAMILY 28-Lead Plastic Thin Small Outline (TS) - 5 x 20 mm (TSOP) ........................................................... 51 28-Lead Plastic Very Small Outline (VS) - 8 x 13.4 mm (VSOP) ....................................................... 52 PLASTIC QUAD FLATPACK (MQFP) FAMILY 44-Lead Plastic Metric Quad Flatpack (PQ) 10x10x2 mm Body, 1.6/0.15 mm Lead Form (MQFP) .................................................................................................. 53 PLASTIC THIN QUAD FLATPACK (TQFP) FAMILY 44-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP) .................................................................................................. 54 64-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP) .................................................................................................. 55 80-Lead Plastic Thin Quad Flatpack (PT) 12x12x1 mm Body, 1.0/0.10 mm Lead Form (TQFP) .................................................................................................. 56 100-Lead Plastic Thin Quad Flatpack (PT) 14x14x1 mm Body, 1.0/0.10 mm Lead Form (TQFP) .................................................................................................. 57 2001 Microchip Technology Inc. DS00049R-page iii PACKAGING Outlines and Parameters PART NUMBER SUFFIX DESIGNATIONS: XXXXXXXXXX - XX X/XX XXX QTP, SQTP or ROM Code; Special Requirements Package: 1C = 1000pF COB Module, .75mm 3C = 330pF COB Module, .45mm L = Plastic Leaded Chip Carrier (PLCC) P = Plastic DIP S = Die in Waffle Pack W = Die in Wafer Form CB = Chip on Board (COB) CL = Windowed CERQUAD JW = Windowed CERDIP ML = Micro Leadframe OT = SOT-23-5 PQ = Plastic Quad Flatpack (PQFP) PT = Plastic Thin Quad Flatpack (TQFP) SB = Bumped Die in Waffle Pack SL = 14-lead Small Outline (150 mil) SM SN SO SP SS ST TQ-92 TS TT VS WB WF WFB WM Process Temperature: Blank = 0C to +70C I (Industrial) = -40C to +85C E (Extended) = -40C to +125C Speed: 2001 Microchip Technology Inc. -90 -10 -12 = 90 ns = 100 ns = 120 ns -15 -17 -20 -25 -30 = 150 ns = 170 ns = 200 ns = 250 ns = 300 ns OR = 8-lead Small Outline (207 mil) = 8-lead Small Outline (150 Mil) = Plastic Small Outline (SOIC) (300 mil) = Plastic Skinny DIP = Plastic Shrink Small Outline (SSOP) = Thin Shrink Small Outline (4.4mm) = Transistor Outline = Thin Small Outline (8mm x 20mm) = SOT-23-3 Small Outline Transistor = Very Small Outline (8mm x 12mm) = Bumped Wafer (11 mil) = Sawed Wafer on Frame (7 mil) = Bumped, Sawed Wafer on Frame = SOT385 Leadless Module Crystal Frequency Designator for PICmicro(R) MCUs LP = DC to 20 MHz, High Speed Crystal Oscillator RC = DC to 2 MHz, XT and RC Oscillator Support XT = DC to 4 MHz Internal, XT and RC Oscillator Support HS = DC to 200 kHz, LP Oscillator Support 02 = DC to 10 MHz, HS Oscillator Support 04 = DC to 20 MHz, High Speed Crystal Oscillator 04 = DC to 2 MHz, XT and RC Oscillator Support 10 = DC to 4 MHz Internal, XT and RC Oscillator Support Option: T = Tape and Reel Shipments Blank = twc = 1ms F X = 200 s = Rotated pinout Device Type: (Up to 10 digits) AA = 1.8V EEPROM Memory C = CMOS EPROM MCU CE = CMOS EPROM/EEPROM MCU CR = CMOS ROM MCU F = FLASH MCU HC = High Speed LCE LCR LCS LF LV 24 = Low Power CMOS/EPROM/EEPROM MCU = Low Power CMOS ROM MCU = Low Power Security = Low Power FLASH MCU = Low Voltage HV LC 25 93 = High Voltage = Low Power CMOS EPROM MCU = 2-Wire (I2CTM) = SPITM = 3-Wire (Microwire(R)) DS00049R-page 1 Packaging NOTES: DS00049R-page 2 2001 Microchip Technology Inc. Packaging NOTES: 2001 Microchip Technology Inc. DS00049R-page 3 Packaging Diagrams and Parameters 8-Lead Ceramic Side Brazed Dual In-line with Window (JW) - 300 mil E1 W T D 2 n 1 U A A2 L A1 c B1 eB Units Dimension Limits n p Number of Pins Pitch Top to Seating Plane Top of Body to Seating Plane Standoff Package Width Overall Length Tip to Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Row Spacing Window Diameter Lid Length Lid Width * Controlling Parameter Significant Characteristic JEDC Equivalent: MS-015 Drawing No. C04-083 2001 Microchip Technology Inc. p B A A2 A1 E1 D L c B1 B eB W T U MIN .145 .103 .025 .280 .510 .130 .008 .050 .016 .296 .161 .440 .260 INCHES* NOM 8 .100 .165 .123 .035 .290 .520 .140 .010 .055 .018 .310 .166 .450 .270 MAX .185 .143 .045 .300 .530 .150 .012 .060 .020 .324 .171 .460 .280 MILLIMETERS NOM 8 2.54 3.68 4.19 2.62 3.12 0.64 0.89 7.11 7.37 12.95 13.21 3.30 3.56 0.20 0.25 1.27 1.40 0.41 0.46 7.52 7.87 4.09 4.22 11.18 11.43 6.60 6.86 MIN MAX 4.70 3.63 1.14 7.62 13.46 3.81 0.30 1.52 0.51 8.23 4.34 11.68 7.11 DS00049R-page 4 Packaging Diagrams and Parameters 14-Lead Ceramic Side Brazed Dual In-line with Window (JW) - 300 mil E1 W T D 2 n 1 U A A2 L A1 c B1 eB Units Dimension Limits n p Number of Pins Pitch Top to Seating Plane Top of Body to Seating Plane Standoff Package Width Overall Length Tip to Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Row Spacing Window Diameter Lid Length Lid Width * Controlling Parameter Significant Characteristic JEDEC Equivalent: MS-015 Drawing No. C04-107 DS00049R-page 5 p B A A2 A1 E1 D L c B1 B eB W T U INCHES* NOM 14 .100 .142 .162 .100 .120 .025 .035 .280 .290 .693 .700 .130 .140 .008 .010 .052 .054 .016 .018 .296 .310 .161 .166 .440 .450 .260 .270 MIN MAX .182 .140 .045 .300 .707 .150 .012 .056 .020 .324 .171 .460 .280 MILLIMETERS NOM 14 2.54 3.61 4.11 2.54 3.05 0.64 0.89 7.11 7.37 17.60 17.78 3.30 3.56 0.20 0.25 1.32 1.37 0.41 0.46 7.52 7.87 4.09 4.22 11.18 11.43 6.60 6.86 MIN MAX 4.62 3.56 1.14 7.62 17.96 3.81 0.30 1.42 0.51 8.23 4.34 11.68 7.11 2001 Microchip Technology Inc. Packaging Diagrams and Parameters 28-Lead Ceramic Side Brazed Dual In-line with Window (JW) - 300 mil E1 W T D 2 n 1 U A A2 L A1 c B1 eB Units Dimension Limits n p Number of Pins Pitch Top to Seating Plane Top of Body to Seating Plane Standoff Package Width Overall Length Tip to Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Row Spacing Window Diameter Lid Length Lid Width * Controlling Parameter Significant Characteristic JEDEC Equivalent: MS-015 Drawing No. C04-084 2001 Microchip Technology Inc. p B A A2 A1 E1 D L c B1 B eB W T U INCHES* NOM 28 .100 .155 .177 .115 .135 .040 .050 .280 .290 1.386 1.400 .130 .140 .008 .010 .048 .050 .016 .018 .296 .310 .161 .166 .490 .500 .275 .285 MIN MAX .198 .155 .060 .300 1.414 .150 .012 .052 .020 .324 .171 .510 .295 MILLIMETERS NOM 28 2.54 3.94 4.48 2.92 3.43 1.02 1.27 7.11 7.37 35.20 35.56 3.30 3.56 0.20 0.25 1.22 1.27 0.41 0.46 7.52 7.87 4.09 4.22 12.45 12.70 6.99 7.24 MIN MAX 5.03 3.94 1.52 7.62 35.92 3.81 0.30 1.32 0.51 8.23 4.34 12.95 7.49 DS00049R-page 6 Packaging Diagrams and Parameters 18-Lead Ceramic Dual In-line with Window (JW) - 300 mil (CERDIP) E1 D W2 2 n 1 W1 E A2 A c L A1 eB B1 p B Units Dimension Limits n p Number of Pins Pitch Top to Seating Plane Ceramic Package Height Standoff Shoulder to Shoulder Width Ceramic Pkg. Width Overall Length Tip to Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Row Spacing Window Width Window Length * Controlling Parameter Significant Characteristic JEDEC Equivalent: MO-036 Drawing No. C04-010 DS00049R-page 7 A A2 A1 E E1 D L c B1 B eB W1 W2 MIN .170 .155 .015 .300 .285 .880 .125 .008 .050 .016 .345 .130 .190 INCHES* NOM 18 .100 .183 .160 .023 .313 .290 .900 .138 .010 .055 .019 .385 .140 .200 MAX .195 .165 .030 .325 .295 .920 .150 .012 .060 .021 .425 .150 .210 MILLIMETERS NOM 18 2.54 4.32 4.64 3.94 4.06 0.38 0.57 7.62 7.94 7.24 7.37 22.35 22.86 3.18 3.49 0.20 0.25 1.27 1.40 0.41 0.47 8.76 9.78 3.30 3.56 4.83 5.08 MIN MAX 4.95 4.19 0.76 8.26 7.49 23.37 3.81 0.30 1.52 0.53 10.80 3.81 5.33 2001 Microchip Technology Inc. Packaging Diagrams and Parameters 28-Lead Ceramic Dual In-line with Window (JW) - 300 mil (CERDIP) E1 D W2 2 n 1 W1 E A2 A c L Units Dimension Limits n p Number of Pins Pitch Top to Seating Plane Ceramic Package Height Standoff Shoulder to Shoulder Width Ceramic Pkg. Width Overall Length Tip to Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Row Spacing Window Width Window Length * Controlling Parameter Significant Characteristic JEDEC Equivalent: MO-058 Drawing No. C04-080 2001 Microchip Technology Inc. B1 B A1 eB A A2 A1 E E1 D L c B1 B eB W1 W2 MIN .170 .155 .015 .300 .285 1.430 .135 .008 .050 .016 .345 .130 .290 INCHES* NOM 28 .100 .183 .160 .023 .313 .290 1.458 .140 .010 .058 .019 .385 .140 .300 MAX .195 .165 .030 .325 .295 1.485 .145 .012 .065 .021 .425 .150 .310 p MILLIMETERS NOM 28 2.54 4.32 4.64 3.94 4.06 0.38 0.57 7.62 7.94 7.24 7.37 36.32 37.02 3.43 3.56 0.20 0.25 1.27 1.46 0.41 0.47 8.76 9.78 3.30 3.56 7.37 7.62 MIN MAX 4.95 4.19 0.76 8.26 7.49 37.72 3.68 0.30 1.65 0.53 10.80 3.81 7.87 DS00049R-page 8 Packaging Diagrams and Parameters 28-Lead Ceramic Dual In-line with Window (JW) - 600 mil (CERDIP) E1 W D 2 n 1 E A2 A L c eB A1 Units Dimension Limits n p Number of Pins Pitch Top to Seating Plane Ceramic Package Height Standoff Shoulder to Shoulder Width Ceramic Pkg. Width Overall Length Tip to Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Row Spacing Window Diameter * Controlling Parameter Significant Characteristic JEDEC Equivalent: MO-103 Drawing No. C04-013 DS00049R-page 9 B1 A A2 A1 E E1 D L c B1 B eB W p B MIN .195 .155 .015 .595 .514 1.430 .125 .008 .050 .016 .610 .270 INCHES* NOM 28 .100 .210 .160 .038 .600 .520 1.460 .138 .010 .058 .020 .660 .280 MAX .225 .165 .060 .625 .526 1.490 .150 .012 .065 .023 .710 .290 MILLIMETERS NOM 28 2.54 4.95 5.33 3.94 4.06 0.38 0.95 15.11 15.24 13.06 13.21 36.32 37.08 3.18 3.49 0.20 0.25 1.27 1.46 0.41 0.51 15.49 16.76 6.86 7.11 MIN MAX 5.72 4.19 1.52 15.88 13.36 37.85 3.81 0.30 1.65 0.58 18.03 7.37 2001 Microchip Technology Inc. Packaging Diagrams and Parameters 40-Lead Ceramic Dual In-line with Window (JW) - 600 mil (CERDIP) E1 W D 2 1 n E A2 A A1 c B1 B eB Units Dimension Limits n p Number of Pins Pitch Top to Seating Plane Ceramic Package Height Standoff Shoulder to Shoulder Width Ceramic Pkg. Width Overall Length Tip to Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Row Spacing Window Diameter * Controlling Parameter Significant Characteristic JEDEC Equivalent: MO-103 Drawing No. C04-014 2001 Microchip Technology Inc. A A2 A1 E E1 D L c B1 B eB W MIN .185 .155 .030 .595 .514 2.040 .135 .008 .050 .016 .610 .340 INCHES* NOM 40 .100 .205 .160 .045 .600 .520 2.050 .140 .011 .053 .020 .660 .350 MAX .225 .165 .060 .625 .526 2.060 .145 .014 .055 .023 .710 .360 p MILLIMETERS NOM 40 2.54 4.70 5.21 3.94 4.06 0.76 1.14 15.11 15.24 13.06 13.21 51.82 52.07 3.43 3.56 0.20 0.28 1.27 1.33 0.41 0.51 15.49 16.76 8.64 8.89 MIN MAX 5.72 4.19 1.52 15.88 13.36 52.32 3.68 0.36 1.40 0.58 18.03 9.14 DS00049R-page 10 Packaging Diagrams and Parameters 68-Lead Ceramic Leaded (CL) Chip Carrier with Window - Square (CERQUAD) E E1 #leads=n1 W n12 R D1 D A3 CH1 x 45 A2 A 45 B1 c p A1 B E2 D2 Units Dimension Limits n p Number of Pins Pitch Overall Height Package Thickness Standoff Side One Chamfer Dim. Corner Chamfer (1) Corner Radius (Others) Overall Package Width Overall Package Length Ceramic Package Width Ceramic Package Length Footprint Width Footprint Length Pins each side Lead Thickness Upper Lead Width Lower Lead Width Window Diameter * Controlling Parameter Significant Characteristic JEDEC Equivalent: MO-087 Drawing No. C04-097 DS00049R-page 11 A A2 A1 A3 CH1 R E D E1 D1 E2 D2 n1 c B1 B W MIN .165 .118 .030 .030 .030 .020 .983 .983 .942 .942 .890 .890 .008 .026 .015 .370 INCHES* NOM 68 .050 .175 .137 .040 .035 .040 .025 .988 .988 .950 .950 .910 .910 17 .010 .029 .018 .380 MAX .185 .155 .050 .040 .050 .030 .993 .993 .958 .958 .930 .930 .012 .031 .021 .390 MILLIMETERS NOM 68 1.27 4.19 4.45 3.00 3.48 0.76 1.02 0.76 0.89 0.76 1.02 0.51 0.64 24.97 25.10 24.97 25.10 23.93 24.13 23.93 24.13 22.61 23.11 22.61 23.11 17 0.20 0.25 0.66 0.72 0.38 0.46 9.40 9.65 MIN MAX 4.70 3.94 1.27 1.02 1.27 0.76 25.22 25.22 24.33 24.33 23.62 23.62 0.30 0.79 0.53 9.91 2001 Microchip Technology Inc. Packaging Diagrams and Parameters 3-Lead Plastic Transistor Outline (TO) (TO-92) E1 D n 1 L 1 2 3 B p c A R Units Dimension Limits n p MIN INCHES* NOM MAX MILLIMETERS NOM 3 1.27 3.30 3.62 4.45 4.71 4.32 4.64 2.16 2.29 12.70 14.10 0.36 0.43 0.41 0.48 4 5 2 3 MIN Number of Pins 3 Pitch .050 Bottom to Package Flat A .130 .143 .155 Overall Width E1 .175 .186 .195 Overall Length D .170 .183 .195 Molded Package Radius R .085 .090 .095 Tip to Seating Plane L .500 .555 .610 c Lead Thickness .014 .017 .020 Lead Width B .016 .019 .022 4 5 6 Mold Draft Angle Top Mold Draft Angle Bottom 2 3 4 *Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: TO-92 Drawing No. C04-101 2001 Microchip Technology Inc. MAX 3.94 4.95 4.95 2.41 15.49 0.51 0.56 6 4 DS00049R-page 12 Packaging Diagrams and Parameters 3-Lead Plastic Small Outline Transistor (TT) (SOT23) E E1 2 B p1 n D p 1 c A A2 A1 L Units Dimension Limits n p Number of Pins Pitch Outside lead pitch (basic) Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic p1 A A2 A1 E E1 D L c B MIN .035 .035 .000 .083 .047 .110 .014 0 .004 .015 0 0 INCHES* NOM 3 .038 .076 .040 .037 .002 .093 .051 .115 .018 5 .006 .017 5 5 MAX .044 .040 .004 .104 .055 .120 .022 10 .007 .020 10 10 MILLIMETERS NOM 3 0.96 1.92 0.89 1.01 0.88 0.95 0.01 0.06 2.10 2.37 1.20 1.30 2.80 2.92 0.35 0.45 0 5 0.09 0.14 0.37 0.44 0 5 0 5 MIN MAX 1.12 1.02 0.10 2.64 1.40 3.04 0.55 10 0.18 0.51 10 10 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: TO-236 Drawing No. C04-104 DS00049R-page 13 2001 Microchip Technology Inc. Packaging Diagrams and Parameters 5-Lead Plastic Small Outline Transistor (OT) (SOT23) E E1 p B p1 n D 1 c A L Units Dimension Limits n p Number of Pins Pitch Outside lead pitch (basic) Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic p1 A A2 A1 E E1 D L c B MIN .035 .035 .000 .102 .059 .110 .014 0 .004 .014 0 0 A2 A1 INCHES* NOM 5 .038 .075 .046 .043 .003 .110 .064 .116 .018 5 .006 .017 5 5 MAX .057 .051 .006 .118 .069 .122 .022 10 .008 .020 10 10 MILLIMETERS NOM 5 0.95 1.90 0.90 1.18 0.90 1.10 0.00 0.08 2.60 2.80 1.50 1.63 2.80 2.95 0.35 0.45 0 5 0.09 0.15 0.35 0.43 0 5 0 5 MIN MAX 1.45 1.30 0.15 3.00 1.75 3.10 0.55 10 0.20 0.50 10 10 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MO-178 Drawing No. C04-091 2001 Microchip Technology Inc. DS00049R-page 14 Packaging Diagrams and Parameters Leadless Wedge Module Plastic Small Outline Transistor (WM) (SOT385) E CH1 x 45 F D J TYP. CH2 x 45 A A1 TYP. Units Dimension Limits Overall Height A Bottom of Package to Chamfer A1 Overall Width E Overall Length D J Width at Tapered End Length of Flat F Chamfer Distance, Horizontal CH1 Chamfer Distance, Vertical CH2 Mold Draft Angle Top Mold Draft Angle Bottom MIN .114 .075 .236 .472 .173 .193 .039 .039 4 4 INCHES NOM .118 .079 .240 .476 .177 .197 .043 .043 6 6 MAX .120 .083 2.44 .480 .181 .200 .047 .047 8 8 MILLIMETERS* MIN NOM 2.90 3.00 1.90 2.00 6.00 6.10 12.00 12.10 4.40 4.50 4.90 5.00 1.00 1.10 1.00 1.10 4 6 4 6 MAX 3.05 2.10 6.20 12.20 4.60 5.10 1.20 1.20 8 8 *Controlling Parameter Notes: Dimensions D, E, F and J do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. Drawing No. C04-109 DS00049R-page 15 2001 Microchip Technology Inc. Packaging Diagrams and Parameters 8-Lead Plastic Dual In-line (P) - 300 mil (PDIP) E1 D 2 n 1 E A2 A L c A1 B1 p eB B Units Dimension Limits n p Number of Pins Pitch Top to Seating Plane Molded Package Thickness Base to Seating Plane Shoulder to Shoulder Width Molded Package Width Overall Length Tip to Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Row Spacing Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic A A2 A1 E E1 D L c B1 B eB MIN .140 .115 .015 .300 .240 .360 .125 .008 .045 .014 .310 5 5 INCHES* NOM MAX 8 .100 .155 .130 .170 .145 .313 .250 .373 .130 .012 .058 .018 .370 10 10 .325 .260 .385 .135 .015 .070 .022 .430 15 15 MILLIMETERS NOM 8 2.54 3.56 3.94 2.92 3.30 0.38 7.62 7.94 6.10 6.35 9.14 9.46 3.18 3.30 0.20 0.29 1.14 1.46 0.36 0.46 7.87 9.40 5 10 5 10 MIN MAX 4.32 3.68 8.26 6.60 9.78 3.43 0.38 1.78 0.56 10.92 15 15 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-018 2001 Microchip Technology Inc. DS00049R-page 16 Packaging Diagrams and Parameters 14-Lead Plastic Dual In-line (P) - 300 mil (PDIP) E1 D 2 n 1 E A2 A L c A1 B1 eB p B Units Dimension Limits n p MIN INCHES* NOM 14 .100 .155 .130 MAX MILLIMETERS NOM 14 2.54 3.56 3.94 2.92 3.30 0.38 7.62 7.94 6.10 6.35 18.80 19.05 3.18 3.30 0.20 0.29 1.14 1.46 0.36 0.46 7.87 9.40 5 10 5 10 MIN Number of Pins Pitch Top to Seating Plane A .140 .170 Molded Package Thickness A2 .115 .145 Base to Seating Plane A1 .015 Shoulder to Shoulder Width E .300 .313 .325 Molded Package Width E1 .240 .250 .260 Overall Length D .740 .750 .760 Tip to Seating Plane L .125 .130 .135 c Lead Thickness .008 .012 .015 Upper Lead Width B1 .045 .058 .070 Lower Lead Width B .014 .018 .022 eB Overall Row Spacing .310 .370 .430 Mold Draft Angle Top 5 10 15 Mold Draft Angle Bottom 5 10 15 * Controlling Parameter Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-005 DS00049R-page 17 MAX 4.32 3.68 8.26 6.60 19.30 3.43 0.38 1.78 0.56 10.92 15 15 2001 Microchip Technology Inc. Packaging Diagrams and Parameters 16-Lead Plastic Dual In-line (P) - 300 mil (PDIP) E1 D 2 1 n E A2 A L c A1 B1 eB p B Units Dimension Limits n p MIN INCHES* NOM 16 .100 .155 .130 MAX MILLIMETERS NOM 16 2.54 3.56 3.94 2.92 3.30 0.38 7.62 7.94 6.10 6.35 18.80 19.05 3.18 3.30 0.20 0.29 1.14 1.46 .036 0.46 7.87 9.40 5 10 5 10 MIN Number of Pins Pitch Top to Seating Plane A .140 .170 Molded Package Thickness A2 .115 .145 Base to Seating Plane A1 .015 Shoulder to Shoulder Width E .300 .313 .325 Molded Package Width E1 .240 .250 .260 Overall Length D .740 .750 .760 Tip to Seating Plane L .125 .130 .135 c Lead Thickness .008 .012 .015 Upper Lead Width B1 .045 .058 .070 Lower Lead Width B .014 .018 .022 Overall Row Spacing eB .310 .370 .430 Mold Draft Angle Top 5 10 15 Mold Draft Angle Bottom 5 10 15 * Controlling Parameter Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-017 2001 Microchip Technology Inc. MAX 4.32 3.68 8.26 6.60 19.30 3.43 0.38 1.78 0.56 10.92 15 15 DS00049R-page 18 Packaging Diagrams and Parameters 18-Lead Plastic Dual In-line (P) - 300 mil (PDIP) E1 D 2 n 1 E A2 A L c A1 B1 p B eB Units Dimension Limits n p MIN INCHES* NOM 18 .100 .155 .130 MAX MILLIMETERS NOM 18 2.54 3.56 3.94 2.92 3.30 0.38 7.62 7.94 6.10 6.35 22.61 22.80 3.18 3.30 0.20 0.29 1.14 1.46 0.36 0.46 7.87 9.40 5 10 5 10 MIN Number of Pins Pitch Top to Seating Plane A .140 .170 Molded Package Thickness A2 .115 .145 Base to Seating Plane A1 .015 Shoulder to Shoulder Width E .300 .313 .325 Molded Package Width E1 .240 .250 .260 Overall Length D .890 .898 .905 Tip to Seating Plane L .125 .130 .135 c Lead Thickness .008 .012 .015 Upper Lead Width B1 .045 .058 .070 Lower Lead Width B .014 .018 .022 Overall Row Spacing eB .310 .370 .430 Mold Draft Angle Top 5 10 15 Mold Draft Angle Bottom 5 10 15 * Controlling Parameter Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-007 DS00049R-page 19 MAX 4.32 3.68 8.26 6.60 22.99 3.43 0.38 1.78 0.56 10.92 15 15 2001 Microchip Technology Inc. Packaging Diagrams and Parameters 20-Lead Plastic Dual In-line (P) - 300 mil (PDIP) E1 D 2 n 1 E A2 A L c A1 B1 eB p B Units Dimension Limits n p MIN INCHES* NOM 20 .100 .155 .130 MAX MILLIMETERS NOM 20 2.54 3.56 3.94 2.92 3.30 0.38 7.49 7.87 6.10 6.35 26.04 26.24 3.05 3.30 0.20 0.29 1.40 1.52 0.36 0.46 7.87 9.40 5 10 5 10 MIN Number of Pins Pitch Top to Seating Plane A .140 .170 Molded Package Thickness A2 .115 .145 Base to Seating Plane A1 .015 Shoulder to Shoulder Width E .295 .310 .325 Molded Package Width E1 .240 .250 .260 Overall Length D 1.025 1.033 1.040 Tip to Seating Plane L .120 .130 .140 c Lead Thickness .008 .012 .015 Upper Lead Width B1 .055 .060 .065 Lower Lead Width B .014 .018 .022 Overall Row Spacing eB .310 .370 .430 Mold Draft Angle Top 5 10 15 Mold Draft Angle Bottom 5 10 15 * Controlling Parameter Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-019 2001 Microchip Technology Inc. MAX 4.32 3.68 8.26 6.60 26.42 3.56 0.38 1.65 0.56 10.92 15 15 DS00049R-page 20 Packaging Diagrams and Parameters 24-Lead Plastic Dual In-line (P) - 600 mil (PDIP) E1 D 2 1 n E A2 A L c B1 A1 p B eB Units Dimension Limits n p MIN INCHES* NOM 24 .100 .175 .150 MAX MILLIMETERS NOM 24 2.54 4.06 4.45 3.56 3.81 0.38 15.11 15.24 13.46 13.84 31.62 31.75 3.05 3.30 0.20 0.29 0.76 1.27 0.36 0.46 15.75 16.51 5 10 5 10 MIN Number of Pins Pitch Top to Seating Plane A .160 .190 Molded Package Thickness A2 .140 .160 Base to Seating Plane A1 .015 Shoulder to Shoulder Width E .595 .600 .625 Molded Package Width E1 .530 .545 .560 Overall Length D 1.245 1.250 1.255 Tip to Seating Plane L .120 .130 .135 c Lead Thickness .008 .012 .015 Upper Lead Width B1 .030 .050 .070 Lower Lead Width B .014 .018 .022 Overall Row Spacing eB .620 .650 .680 Mold Draft Angle Top 5 10 15 Mold Draft Angle Bottom 5 10 15 * Controlling Parameter Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-011 Drawing No. C04-081 DS00049R-page 21 MAX 4.83 4.06 15.88 14.22 31.88 3.43 0.38 1.78 0.56 17.27 15 15 2001 Microchip Technology Inc. Packaging Diagrams and Parameters 24-Lead Skinny Plastic Dual In-line (SP) - 300 mil (PDIP) E1 D 2 n 1 E A2 A L c A1 p B1 B eB Units Dimension Limits n p MIN INCHES* NOM 24 .100 .150 .130 MAX MILLIMETERS NOM 24 2.54 3.56 3.81 2.92 3.30 0.38 7.49 7.87 6.10 6.35 31.62 31.75 3.05 3.18 0.20 0.29 1.14 1.33 0.36 0.46 7.87 9.40 5 10 5 10 MIN Number of Pins Pitch Top to Seating Plane A .140 .160 Molded Package Thickness A2 .115 .145 Base to Seating Plane .015 A1 Shoulder to Shoulder Width E .295 .310 .325 Molded Package Width E1 .240 .250 .260 Overall Length D 1.245 1.250 1.255 Tip to Seating Plane L .120 .125 .130 c Lead Thickness .008 .012 .015 Upper Lead Width B1 .045 .053 .060 Lower Lead Width B .014 .018 .022 Overall Row Spacing eB .310 .370 .430 Mold Draft Angle Top 5 10 15 Mold Draft Angle Bottom 5 10 15 * Controlling Parameter Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MO-001 Drawing No. C04-043 2001 Microchip Technology Inc. MAX 4.06 3.68 8.26 6.60 31.88 3.30 0.38 1.52 0.56 10.92 15 15 DS00049R-page 22 Packaging Diagrams and Parameters 28-Lead Skinny Plastic Dual In-line (SP) - 300 mil (PDIP) E1 D 2 n 1 E A2 A L c B1 A1 eB Units Number of Pins Pitch p B Dimension Limits n p INCHES* MIN NOM MILLIMETERS MAX MIN NOM 28 MAX 28 .100 2.54 Top to Seating Plane A .140 .150 .160 3.56 3.81 4.06 Molded Package Thickness A2 .125 .130 .135 3.18 3.30 3.43 Base to Seating Plane A1 .015 Shoulder to Shoulder Width E .300 .310 .325 7.62 7.87 8.26 Molded Package Width E1 .275 .285 .295 6.99 7.24 7.49 Overall Length D 1.345 1.365 1.385 34.16 34.67 35.18 Tip to Seating Plane .125 .130 .135 3.18 3.30 3.43 Lead Thickness L c .008 .012 .015 0.20 0.29 0.38 Upper Lead Width B1 .040 .053 .065 1.02 1.33 1.65 Lower Lead Width B .016 .019 .022 0.41 0.48 0.56 eB .320 .350 .430 8.13 8.89 10.92 5 10 15 5 10 15 5 10 15 5 10 15 Overall Row Spacing Mold Draft Angle Top Mold Draft Angle Bottom 0.38 * Controlling Parameter Significant Characteristic Notes: Dimension D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MO-095 Drawing No. C04-070 DS00049R-page 23 2001 Microchip Technology Inc. Packaging Diagrams and Parameters 28-Lead Plastic Dual In-line (P) - 600 mil (PDIP) E1 D 2 1 n E A2 A L c B1 A1 p B eB Units Dimension Limits n p MIN INCHES* NOM 28 .100 .175 .150 MAX MILLIMETERS NOM 28 2.54 4.06 4.45 3.56 3.81 0.38 15.11 15.24 12.83 13.84 35.43 36.32 3.05 3.30 0.20 0.29 0.76 1.27 0.36 0.46 15.75 16.51 5 10 5 10 MIN Number of Pins Pitch Top to Seating Plane A .160 .190 Molded Package Thickness A2 .140 .160 Base to Seating Plane A1 .015 Shoulder to Shoulder Width E .595 .600 .625 Molded Package Width E1 .505 .545 .560 Overall Length D 1.395 1.430 1.465 Tip to Seating Plane L .120 .130 .135 c Lead Thickness .008 .012 .015 Upper Lead Width B1 .030 .050 .070 Lower Lead Width B .014 .018 .022 eB Overall Row Spacing .620 .650 .680 Mold Draft Angle Top 5 10 15 Mold Draft Angle Bottom 5 10 15 * Controlling Parameter Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MO-011 Drawing No. C04-079 2001 Microchip Technology Inc. MAX 4.83 4.06 15.88 14.22 37.21 3.43 0.38 1.78 0.56 17.27 15 15 DS00049R-page 24 Packaging Diagrams and Parameters 40-Lead Plastic Dual In-line (P) - 600 mil (PDIP) E1 D 2 1 n E A2 A L c B1 A1 eB p B Units Dimension Limits n p MIN INCHES* NOM 40 .100 .175 .150 MAX MILLIMETERS NOM 40 2.54 4.06 4.45 3.56 3.81 0.38 15.11 15.24 13.46 13.84 51.94 52.26 3.05 3.30 0.20 0.29 0.76 1.27 0.36 0.46 15.75 16.51 5 10 5 10 MIN Number of Pins Pitch Top to Seating Plane A .160 .190 Molded Package Thickness A2 .140 .160 Base to Seating Plane A1 .015 Shoulder to Shoulder Width E .595 .600 .625 Molded Package Width E1 .530 .545 .560 Overall Length D 2.045 2.058 2.065 Tip to Seating Plane L .120 .130 .135 c Lead Thickness .008 .012 .015 Upper Lead Width B1 .030 .050 .070 Lower Lead Width B .014 .018 .022 Overall Row Spacing eB .620 .650 .680 Mold Draft Angle Top 5 10 15 Mold Draft Angle Bottom 5 10 15 * Controlling Parameter Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MO-011 Drawing No. C04-016 DS00049R-page 25 MAX 4.83 4.06 15.88 14.22 52.45 3.43 0.38 1.78 0.56 17.27 15 15 2001 Microchip Technology Inc. Packaging Diagrams and Parameters 64-Lead Shrink Plastic Dual In-line (SP) - 750 mil (PDIP) E1 D 2 1 n E A2 A c B1 eB A1 Units Dimension Limits n p p B MIN INCHES* NOM 64 .070 .188 .168 MAX MILLIMETERS NOM 64 1.78 4.45 4.76 3.94 4.25 0.51 19.05 19.30 16.76 17.02 57.40 57.66 3.05 3.24 0.20 0.25 0.76 1.02 0.38 0.47 19.30 19.81 5 10 5 10 MIN Number of Pins Pitch Top to Seating Plane A .175 .200 Molded Package Thickness .155 .180 A2 Base to Seating Plane A1 .020 Shoulder to Shoulder Width E .750 .760 .775 Molded Package Width E1 .660 .670 .680 Overall Length D 2.260 2.270 2.280 Tip to Seating Plane L .120 .128 .135 c Lead Thickness .008 .010 .012 Upper Lead Width B1 .030 .040 .050 Lower Lead Width B .015 .019 .022 eB Overall Row Spacing .760 .780 .800 Mold Draft Angle Top 5 10 15 Mold Draft Angle Bottom 5 10 15 * Controlling Parameter Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MO-021 Drawing No. C04-090 2001 Microchip Technology Inc. L MAX 5.08 4.57 19.69 17.27 57.91 3.43 0.30 1.27 0.56 20.32 15 15 DS00049R-page 26 Packaging Diagrams and Parameters 20-Lead Plastic Leaded Chip Carrier (L) - Square (PLCC) E E1 #leads=n1 D D1 n 1 2 CH1 x 45 CH2 x 45 A3 A2 35 A B1 c E2 A1 B p D2 Units Dimension Limits n p MIN INCHES* NOM 20 .050 5 .173 .153 .028 .049 .045 .015 .390 .390 .353 .353 .310 .310 .011 .029 .020 5 5 MAX MILLIMETERS NOM 20 1.27 5 4.19 4.39 3.68 3.87 0.51 0.71 1.07 1.24 1.02 1.14 0.25 0.38 9.78 9.91 9.78 9.91 8.89 8.97 8.89 8.97 7.16 7.87 7.16 7.87 0.20 0.27 0.66 0.74 0.33 0.51 0 5 0 5 MIN Number of Pins Pitch Pins per Side n1 Overall Height A .165 .180 Molded Package Thickness A2 .145 .160 Standoff A1 .020 .035 Side 1 Chamfer Height A3 .042 .056 Corner Chamfer 1 CH1 .040 .050 Corner Chamfer (others) CH2 .010 .020 Overall Width E .385 .395 Overall Length D .385 .395 Molded Package Width E1 .350 .356 Molded Package Length D1 .350 .356 Footprint Width .282 .338 E2 Footprint Length D2 .282 .338 c Lead Thickness .008 .013 Upper Lead Width .026 .032 B1 Lower Lead Width B .013 .021 Mold Draft Angle Top 0 10 Mold Draft Angle Bottom 0 10 * Controlling Parameter Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MO-047 Drawing No. C04-064 DS00049R-page 27 MAX 4.57 4.06 0.89 1.42 1.27 0.51 10.03 10.03 9.04 9.04 8.59 8.59 0.33 0.81 0.53 10 10 2001 Microchip Technology Inc. Packaging Diagrams and Parameters 28-Lead Plastic Leaded Chip Carrier (L) - Square (PLCC) E E1 #leads=n1 D1 D n 1 2 CH2 x 45 CH1 x 45 A3 A2 32 A B1 c B A1 p E2 Units Dimension Limits n p D2 INCHES* NOM 28 .050 7 .165 .173 .145 .153 .020 .028 .021 .026 .035 .045 .000 .005 .485 .490 .485 .490 .450 .453 .450 .453 .410 .420 .410 .420 .008 .011 .026 .029 .013 .020 0 5 0 5 MIN MAX MILLIMETERS NOM 28 1.27 7 4.19 4.39 3.68 3.87 0.51 0.71 0.53 0.66 0.89 1.14 0.00 0.13 12.32 12.45 12.32 12.45 11.43 11.51 11.43 11.51 10.41 10.67 10.41 10.67 0.20 0.27 0.66 0.74 0.33 0.51 0 5 0 5 MIN Number of Pins Pitch Pins per Side n1 Overall Height A .180 Molded Package Thickness A2 .160 Standoff A1 .035 Side 1 Chamfer Height A3 .031 Corner Chamfer 1 CH1 .055 Corner Chamfer (others) CH2 .010 Overall Width E .495 Overall Length D .495 Molded Package Width E1 .456 Molded Package Length D1 .456 Footprint Width E2 .430 Footprint Length D2 .430 c Lead Thickness .013 Upper Lead Width B1 .032 Lower Lead Width B .021 Mold Draft Angle Top 10 Mold Draft Angle Bottom 10 * Controlling Parameter Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MO-047 Drawing No. C04-026 2001 Microchip Technology Inc. MAX 4.57 4.06 0.89 0.79 1.40 0.25 12.57 12.57 11.58 11.58 10.92 10.92 0.33 0.81 0.53 10 10 DS00049R-page 28 Packaging Diagrams and Parameters 32-Lead Plastic Leaded Chip Carrier (L) - Rectangle (PLCC) E E1 #leads=n1 D1 D n 1 2 CH1 x 45 CH2 x 45 A3 A2 A 32 c B1 B p E2 D2 Units Dimension Limits n p Number of Pins Pitch Pins along Width Pins along Length Overall Height Molded Package Thickness Standoff Side 1 Chamfer Height Corner Chamfer 1 Corner Chamfer (others) Overall Width Overall Length Molded Package Width Molded Package Length Footprint Width Footprint Length Lead Thickness Upper Lead Width Lower Lead Width Mold Draft Angle Top Mold Draft Angle Bottom A1 n1 n2 A A2 A1 A3 CH1 CH2 E D E1 D1 E2 D2 c B1 B INCHES* NOM 32 .050 7 9 .125 .133 .105 .113 .020 .028 .021 .026 .035 .045 .000 .005 .485 .490 .585 .590 .447 .450 .547 .550 .380 .410 .480 .510 .008 .010 .026 .029 .013 .017 0 5 0 5 MIN MAX .140 .120 .035 .031 .055 .010 .495 .595 .453 .553 .440 .540 .013 .032 .021 10 10 MILLIMETERS NOM 32 1.27 7 9 3.18 3.37 2.67 2.87 0.51 0.71 0.53 0.66 0.89 1.14 0.00 0.13 12.32 12.45 14.86 14.99 11.35 11.43 13.89 13.97 9.65 10.41 12.19 12.95 0.20 0.25 0.66 0.74 0.33 0.43 0 5 0 5 MIN MAX 3.56 3.05 0.89 0.79 1.40 0.25 12.57 15.11 11.51 14.05 11.18 13.72 0.33 0.81 0.53 10 10 * Controlling Parameter Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MO-016 Drawing No. C04-023 DS00049R-page 29 2001 Microchip Technology Inc. Packaging Diagrams and Parameters 44-Lead Plastic Leaded Chip Carrier (L) - Square (PLCC) E E1 #leads=n1 D1 D n 1 2 CH2 x 45 CH1 x 45 A3 A2 35 A B1 B c E2 Units Dimension Limits n p A1 p D2 INCHES* NOM 44 .050 11 .165 .173 .145 .153 .020 .028 .024 .029 .040 .045 .000 .005 .685 .690 .685 .690 .650 .653 .650 .653 .590 .620 .590 .620 .008 .011 .026 .029 .013 .020 0 5 0 5 MIN MAX MILLIMETERS NOM 44 1.27 11 4.19 4.39 3.68 3.87 0.51 0.71 0.61 0.74 1.02 1.14 0.00 0.13 17.40 17.53 17.40 17.53 16.51 16.59 16.51 16.59 14.99 15.75 14.99 15.75 0.20 0.27 0.66 0.74 0.33 0.51 0 5 0 5 MIN Number of Pins Pitch Pins per Side n1 Overall Height A .180 Molded Package Thickness A2 .160 Standoff A1 .035 Side 1 Chamfer Height A3 .034 Corner Chamfer 1 CH1 .050 Corner Chamfer (others) CH2 .010 Overall Width E .695 Overall Length D .695 Molded Package Width E1 .656 Molded Package Length D1 .656 Footprint Width E2 .630 Footprint Length D2 .630 c Lead Thickness .013 Upper Lead Width B1 .032 B .021 Lower Lead Width Mold Draft Angle Top 10 Mold Draft Angle Bottom 10 * Controlling Parameter Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MO-047 Drawing No. C04-048 2001 Microchip Technology Inc. MAX 4.57 4.06 0.89 0.86 1.27 0.25 17.65 17.65 16.66 16.66 16.00 16.00 0.33 0.81 0.53 10 10 DS00049R-page 30 Packaging Diagrams and Parameters 68-Lead Plastic Leaded Chip Carrier (L) - Square (PLCC) E E1 #leads=n1 D1 D CH2 x 45 n12 CH1 x 45 A3 A2 32 A c B1 p B A1 D2 E2 Units Dimension Limits n p MIN INCHES* NOM 68 .050 17 .173 .153 .028 .029 .045 .005 .990 .990 .954 .954 .920 .920 .011 .029 .020 5 5 MAX MILLIMETERS NOM 68 1.27 17 4.19 4.39 3.68 3.87 0.51 0.71 0.61 0.74 1.02 1.14 0.00 0.13 25.02 25.15 25.02 25.15 24.13 24.23 24.13 24.23 22.61 23.37 22.61 23.37 0.20 0.27 0.66 0.74 0.33 0.51 0 5 0 5 MIN Number of Pins Pitch Pins per Side n1 Overall Height A .165 .180 Molded Package Thickness A2 .145 .160 Standoff A1 .020 .035 Side 1 Chamfer Height A3 .024 .034 Corner Chamfer 1 CH1 .040 .050 Corner Chamfer (others) CH2 .000 .010 Overall Width E .985 .995 Overall Length D .985 .995 Molded Package Width E1 .950 .958 Molded Package Length D1 .950 .958 Footprint Width E2 .890 .930 Footprint Length D2 .890 .930 c Lead Thickness .008 .013 Upper Lead Width B1 .026 .032 Lower Lead Width B .013 .021 Mold Draft Angle Top 0 10 Mold Draft Angle Bottom 0 10 * Controlling Parameter Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MO-047 Drawing No. C04-049 DS00049R-page 31 MAX 4.57 4.06 0.89 0.86 1.27 0.25 25.27 25.27 24.33 24.33 23.62 23.62 0.33 0.81 0.53 10 10 2001 Microchip Technology Inc. Packaging Diagrams and Parameters 84-Lead Plastic Leaded Chip Carrier (L) - Square (PLCC) E E1 #leads=n1 D1 D n12 CH2 x 45 CH1 x 45 A3 A2 45 A c B1 B p A1 D2 E2 Units Dimension Limits n p INCHES* NOM 84 .050 21 .165 .173 .145 .153 .020 .028 .040 .045 .040 .045 .010 .015 1.185 1.190 1.185 1.190 1.150 1.154 1.150 1.154 1.090 1.110 1.090 1.110 .008 .011 .026 .029 .013 .020 0 5 0 5 MIN MAX MILLIMETERS NOM 68 1.27 17 4.19 4.39 3.68 3.87 0.51 0.71 1.02 1.14 1.02 1.14 0.25 0.38 30.10 30.23 30.10 30.23 29.21 29.31 29.21 29.31 27.69 28.19 27.69 28.19 0.20 0.27 0.66 0.74 0.33 0.51 0 5 0 5 MIN Number of Pins Pitch Pins per Side n1 Overall Height A .180 Molded Package Thickness A2 .160 Standoff A1 .035 Side 1 Chamfer Height A3 .050 Corner Chamfer 1 CH1 .050 Corner Chamfer (others) CH2 .020 Overall Width E 1.195 Overall Length D 1.195 Molded Package Width E1 1.158 Molded Package Length D1 1.158 Footprint Width E2 1.130 Footprint Length D2 1.130 c Lead Thickness .013 Upper Lead Width B1 .032 Lower Lead Width B .021 Mold Draft Angle Top 10 Mold Draft Angle Bottom 10 * Controlling Parameter Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MO-047 Drawing No. C04-093 2001 Microchip Technology Inc. MAX 4.57 4.06 0.89 1.27 1.27 0.51 30.35 30.35 29.41 29.41 28.70 28.70 0.33 0.81 0.53 10 10 DS00049R-page 32 Packaging Diagrams and Parameters 8-Lead Plastic Small Outline (SN) - Narrow, 150 mil (SOIC) E E1 p D 2 B n 1 h 45 c A2 A L Units Dimension Limits n p Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic A A2 A1 E E1 D h L c B MIN .053 .052 .004 .228 .146 .189 .010 .019 0 .008 .013 0 0 A1 INCHES* NOM 8 .050 .061 .056 .007 .237 .154 .193 .015 .025 4 .009 .017 12 12 MAX .069 .061 .010 .244 .157 .197 .020 .030 8 .010 .020 15 15 MILLIMETERS NOM 8 1.27 1.35 1.55 1.32 1.42 0.10 0.18 5.79 6.02 3.71 3.91 4.80 4.90 0.25 0.38 0.48 0.62 0 4 0.20 0.23 0.33 0.42 0 12 0 12 MIN MAX 1.75 1.55 0.25 6.20 3.99 5.00 0.51 0.76 8 0.25 0.51 15 15 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-057 DS00049R-page 33 2001 Microchip Technology Inc. Packaging Diagrams and Parameters 14-Lead Plastic Small Outline (SL) - Narrow, 150 mil (SOIC) E E1 p D 2 B n 1 h 45 c A2 A A1 L Units Dimension Limits n p Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic A A2 A1 E E1 D h L c B MIN .053 .052 .004 .228 .150 .337 .010 .016 0 .008 .014 0 0 INCHES* NOM 14 .050 .061 .056 .007 .236 .154 .342 .015 .033 4 .009 .017 12 12 MAX .069 .061 .010 .244 .157 .347 .020 .050 8 .010 .020 15 15 MILLIMETERS NOM 14 1.27 1.35 1.55 1.32 1.42 0.10 0.18 5.79 5.99 3.81 3.90 8.56 8.69 0.25 0.38 0.41 0.84 0 4 0.20 0.23 0.36 0.42 0 12 0 12 MIN MAX 1.75 1.55 0.25 6.20 3.99 8.81 0.51 1.27 8 0.25 0.51 15 15 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-065 2001 Microchip Technology Inc. DS00049R-page 34 Packaging Diagrams and Parameters 16-Lead Plastic Small Outline (SL) - Narrow 150 mil (SOIC) E E1 p D 2 B n 1 h 45 c A2 A L A1 Units Dimension Limits n p Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic A A2 A1 E E1 D h L c B INCHES* NOM 16 .050 .053 .061 .052 .057 .004 .007 .228 .237 .150 .154 .386 .390 .010 .015 .016 .033 0 4 .008 .009 .013 .017 0 12 0 12 MIN MAX .069 .061 .010 .244 .157 .394 .020 .050 8 .010 .020 15 15 MILLIMETERS NOM 16 1.27 1.35 1.55 1.32 1.44 0.10 0.18 5.79 6.02 3.81 3.90 9.80 9.91 0.25 0.38 0.41 0.84 0 4 0.20 0.23 0.33 0.42 0 12 0 12 MIN MAX 1.75 1.55 0.25 6.20 3.99 10.01 0.51 1.27 8 0.25 0.51 15 15 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-108 DS00049R-page 35 2001 Microchip Technology Inc. Packaging Diagrams and Parameters 8-Lead Plastic Small Outline (SM) - Medium, 208 mil (SOIC) E E1 p D 2 n 1 B c A2 A L Units Dimension Limits n p Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom A A2 A1 E E1 D L c B MIN .070 .069 .002 .300 .201 .202 .020 0 .008 .014 0 0 INCHES* NOM 8 .050 .075 .074 .005 .313 .208 .205 .025 4 .009 .017 12 12 A1 MAX .080 .078 .010 .325 .212 .210 .030 8 .010 .020 15 15 MILLIMETERS NOM 8 1.27 1.78 1.97 1.75 1.88 0.05 0.13 7.62 7.95 5.11 5.28 5.13 5.21 0.51 0.64 0 4 0.20 0.23 0.36 0.43 0 12 0 12 MIN MAX 2.03 1.98 0.25 8.26 5.38 5.33 0.76 8 0.25 0.51 15 15 * Controlling Parameter Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. Drawing No. C04-056 2001 Microchip Technology Inc. DS00049R-page 36 Packaging Diagrams and Parameters 16-Lead Plastic Small Outline (SO) - Wide, 300 mil (SOIC) E p E1 D 2 1 n B h 45 c A2 A L Units Dimension Limits n p Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic A A2 A1 E E1 D h L c B MIN .093 .088 .004 .394 .291 .398 .010 .016 0 .009 .014 0 0 A1 INCHES* NOM 16 .050 .099 .091 .008 .407 .295 .406 .020 .033 4 .011 .017 12 12 MAX .104 .094 .012 .420 .299 .413 .029 .050 8 .013 .020 15 15 MILLIMETERS NOM 16 1.27 2.36 2.50 2.24 2.31 0.10 0.20 10.01 10.34 7.39 7.49 10.10 10.30 0.25 0.50 0.41 0.84 0 4 0.23 0.28 0.36 0.42 0 12 0 12 MIN MAX 2.64 2.39 0.30 10.67 7.59 10.49 0.74 1.27 8 0.33 0.51 15 15 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-013 Drawing No. C04-102 DS00049R-page 37 2001 Microchip Technology Inc. Packaging Diagrams and Parameters 18-Lead Plastic Small Outline (SO) - Wide, 300 mil (SOIC) E p E1 D 2 B n 1 h 45 c A2 A L Units Dimension Limits n p Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom A A2 A1 E E1 D h L c B MIN .093 .088 .004 .394 .291 .446 .010 .016 0 .009 .014 0 0 A1 INCHES* NOM 18 .050 .099 .091 .008 .407 .295 .454 .020 .033 4 .011 .017 12 12 MAX .104 .094 .012 .420 .299 .462 .029 .050 8 .012 .020 15 15 MILLIMETERS NOM 18 1.27 2.36 2.50 2.24 2.31 0.10 0.20 10.01 10.34 7.39 7.49 11.33 11.53 0.25 0.50 0.41 0.84 0 4 0.23 0.27 0.36 0.42 0 12 0 12 MIN MAX 2.64 2.39 0.30 10.67 7.59 11.73 0.74 1.27 8 0.30 0.51 15 15 * Controlling Parameter Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-013 Drawing No. C04-051 2001 Microchip Technology Inc. DS00049R-page 38 Packaging Diagrams and Parameters 20-Lead Plastic Small Outline (SO) - Wide, 300 mil (SOIC) E E1 p D B 2 1 n h 45 c A2 A A1 L Units Dimension Limits n p Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic A A2 A1 E E1 D h L c B MIN .093 .088 .004 .394 .291 .496 .010 .016 0 .009 .014 0 0 INCHES* NOM 20 .050 .099 .091 .008 .407 .295 .504 .020 .033 4 .011 .017 12 12 MAX .104 .094 .012 .420 .299 .512 .029 .050 8 .013 .020 15 15 MILLIMETERS NOM 20 1.27 2.36 2.50 2.24 2.31 0.10 0.20 10.01 10.34 7.39 7.49 12.60 12.80 0.25 0.50 0.41 0.84 0 4 0.23 0.28 0.36 0.42 0 12 0 12 MIN MAX 2.64 2.39 0.30 10.67 7.59 13.00 0.74 1.27 8 0.33 0.51 15 15 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-013 Drawing No. C04-094 DS00049R-page 39 2001 Microchip Technology Inc. Packaging Diagrams and Parameters 28-Lead Plastic Small Outline (SO) - Wide, 300 mil (SOIC) E E1 p D B 2 1 n h 45 c A2 A L Units Dimension Limits n p Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Top Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic A A2 A1 E E1 D h L c B A1 MIN .093 .088 .004 .394 .288 .695 .010 .016 0 .009 .014 0 0 INCHES* NOM 28 .050 .099 .091 .008 .407 .295 .704 .020 .033 4 .011 .017 12 12 MAX .104 .094 .012 .420 .299 .712 .029 .050 8 .013 .020 15 15 MILLIMETERS NOM 28 1.27 2.36 2.50 2.24 2.31 0.10 0.20 10.01 10.34 7.32 7.49 17.65 17.87 0.25 0.50 0.41 0.84 0 4 0.23 0.28 0.36 0.42 0 12 0 12 MIN MAX 2.64 2.39 0.30 10.67 7.59 18.08 0.74 1.27 8 0.33 0.51 15 15 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-013 Drawing No. C04-052 2001 Microchip Technology Inc. DS00049R-page 40 Packaging Diagrams and Parameters 8-Lead Plastic Micro Leadframe Package (MF) 6x5 mm Body (MLF-S) E p B E1 n L R D1 1 D D2 PIN 1 ID EXPOSED METAL PADS 2 E2 TOP VIEW BOTTOM VIEW A2 A3 A A1 INCHES Units Dimension Limits Number of Pins MIN MILLIMETERS* NOM n MAX MIN NOM 8 MAX 8 Pitch p Overall Height A .033 .039 0.85 1.00 Molded Package Thickness A2 .026 .031 0.65 0.80 Standoff A1 .0004 .002 0.01 0.05 Base Thickness A3 .008 REF. 0.20 REF. 4.92 BSC .050 BSC .000 E .194 BSC Molded Package Length E1 .184 BSC Exposed Pad Length E2 Overall Width D Overall Length .152 .158 1.27 BSC 0.00 4.67 BSC .163 3.85 4.00 4.15 5.99 BSC .236 BSC 5.74 BSC Molded Package Width D1 Exposed Pad Width D2 .085 .091 .097 2.16 2.31 2.46 Lead Width B .014 .016 .019 0.35 0.40 0.47 Lead Length L .020 .024 .030 0.50 0.60 0.75 Tie Bar Width R Mold Draft Angle Top .226 BSC .356 .014 12 12 *Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC equivalent: pending Drawing No. C04-113 DS00049R-page 41 2001 Microchip Technology Inc. Packaging Diagrams and Parameters 8-Lead Plastic Micro Leadframe Package (MF) 6x5 mm Body (MLF-S) M SOLDER MASK M p B PACKAGE EDGE L Units Pitch Dimension Limits p MILLIMETERS* INCHES MIN NOM MAX MIN NOM MAX 1.27 BSC .050 BSC Pad Width B .014 .016 .019 0.35 0.40 Pad Length L .020 .024 .030 0.50 0.60 Pad to Solder Mask M .005 .006 0.13 0.47 0.75 0.15 *Controlling Parameter Drawing No. C04-2113 2001 Microchip Technology Inc. DS00049R-page 42 Packaging Diagrams and Parameters 28-Lead Plastic Micro Leadframe Package (MF) 6x6 mm Body (MLF) EXPOSED METAL PADS E E1 Q D1 D D2 p 2 1 B n R E2 CH x 45 L TOP VIEW BOTTOM VIEW A2 A A1 A3 Units Dimension Limits Number of Pins INCHES MIN n MILLIMETERS* NOM MIN MAX NOM MAX 28 28 Pitch p Overall Height A .033 .039 0.85 1.00 Molded Package Thickness A2 .026 .031 0.65 0.80 Standoff A1 .0004 .002 0.01 0.05 Base Thickness A3 .008 REF. 0.20 REF. 6.00 BSC .000 E .236 BSC Molded Package Width E1 .226 BSC Exposed Pad Width E2 Overall Width Overall Length 0.65 BSC .026 BSC .140 .146 0.00 5.75 BSC .152 3.55 .236 BSC D 3.70 3.85 6.00 BSC .226 BSC 5.75 BSC Molded Package Length D1 Exposed Pad Length D2 .140 .146 .152 3.55 3.70 Lead Width B .009 .011 .014 0.23 0.28 0.35 Lead Length L .020 .024 .030 0.50 0.60 0.75 Tie Bar Width R .005 .007 .010 0.13 0.17 0.23 Tie Bar Length Q .012 .016 .026 0.30 0.40 0.65 CH .009 .017 .024 0.24 0.42 0.60 Chamfer Mold Draft Angle Top 12 3.85 12 *Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC equivalent: pending Drawing No. C04-114 DS00049R-page 43 2001 Microchip Technology Inc. Packaging Diagrams and Parameters 28-Lead Plastic Micro Leadframe Package (MF) 6x6 mm Body (MLF) M B L M p PACKAGE EDGE SOLDER MASK Units Pitch Dimension Limits p INCHES MIN NOM MILLIMETERS* MAX MIN NOM MAX 0.65 BSC .026 BSC Pad Width B .009 .011 .014 0.23 0.28 0.35 Pad Length L .020 .024 .030 0.50 0.60 0.75 Pad to Solder Mask M .005 .006 0.13 0.15 *Controlling Parameter Drawing No. C04-2114 2001 Microchip Technology Inc. DS00049R-page 44 Packaging Diagrams and Parameters 8-Lead Plastic Micro Small Outline Package (MS) (MSOP) E E1 p D 2 B n 1 A2 A c A1 (F) L INCHES Units Number of Pins Pitch Dimension Limits n p Overall Height MILLIMETERS* NOM MIN MAX MIN NOM 8 .026 0.65 .044 A 1.18 .038 0.76 .006 0.05 .193 .200 .114 .118 .114 .118 L .016 .035 Foot Angle F Lead Thickness c .004 Lead Width B .010 Mold Draft Angle Top Mold Draft Angle Bottom Molded Package Thickness A2 .030 Standoff A1 .002 E .184 Molded Package Width E1 Overall Length D Foot Length Footprint (Reference) Overall Width MAX 8 0.86 0.97 4.67 4.90 .5.08 .122 2.90 3.00 3.10 .122 2.90 3.00 3.10 .022 .028 0.40 0.55 0.70 .037 .039 0.90 0.95 1.00 6 0 .006 .008 0.10 0.15 0.20 .012 .016 0.25 0.30 0.40 .034 0 0.15 6 7 7 7 7 *Controlling Parameter Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. Drawing No. C04-111 DS00049R-page 45 2001 Microchip Technology Inc. Packaging Diagrams and Parameters 20-Lead Plastic Shrink Small Outline (SS) - 209 mil, 5.30 mm (SSOP) E E1 p D B 2 1 n c A2 A L A1 Units Dimension Limits n p Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Lead Thickness Foot Angle Lead Width Mold Draft Angle Top Mold Draft Angle Bottom A A2 A1 E E1 D L c B MIN .068 .064 .002 .299 .201 .278 .022 .004 0 .010 0 0 INCHES* NOM 20 .026 .073 .068 .006 .309 .207 .284 .030 .007 4 .013 5 5 MAX .078 .072 .010 .322 .212 .289 .037 .010 8 .015 10 10 MILLIMETERS NOM 20 0.65 1.73 1.85 1.63 1.73 0.05 0.15 7.59 7.85 5.11 5.25 7.06 7.20 0.56 0.75 0.10 0.18 0.00 101.60 0.25 0.32 0 5 0 5 MIN MAX 1.98 1.83 0.25 8.18 5.38 7.34 0.94 0.25 203.20 0.38 10 10 * Controlling Parameter Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MO-150 Drawing No. C04-072 2001 Microchip Technology Inc. DS00049R-page 46 Packaging Diagrams and Parameters 28-Lead Plastic Shrink Small Outline (SS) - 209 mil, 5.30 mm (SSOP) E E1 p D B 2 1 n A c A2 A1 L Units Dimension Limits n p Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Lead Thickness Foot Angle Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic A A2 A1 E E1 D L c B MIN .068 .064 .002 .299 .201 .396 .022 .004 0 .010 0 0 INCHES NOM 28 .026 .073 .068 .006 .309 .207 .402 .030 .007 4 .013 5 5 MAX .078 .072 .010 .319 .212 .407 .037 .010 8 .015 10 10 MILLIMETERS* NOM MAX 28 0.65 1.73 1.85 1.98 1.63 1.73 1.83 0.05 0.15 0.25 7.59 7.85 8.10 5.11 5.25 5.38 10.06 10.20 10.34 0.56 0.75 0.94 0.10 0.18 0.25 0.00 101.60 203.20 0.25 0.32 0.38 0 5 10 0 5 10 MIN Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-150 Drawing No. C04-073 DS00049R-page 47 2001 Microchip Technology Inc. Packaging Diagrams and Parameters 8-Lead Plastic Thin Shrink Small Outline (ST) - 4.4 mm (TSSOP) E E1 p D 2 1 n B A c A1 A2 L Units Dimension Limits n p Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Molded Package Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic A A2 A1 E E1 D L c B MIN INCHES NOM MAX 8 .026 .033 .002 .246 .169 .114 .020 0 .004 .007 0 0 .035 .004 .251 .173 .118 .024 4 .006 .010 5 5 .043 .037 .006 .256 .177 .122 .028 8 .008 .012 10 10 MILLIMETERS* NOM MAX 8 0.65 1.10 0.85 0.90 0.95 0.05 0.10 0.15 6.25 6.38 6.50 4.30 4.40 4.50 2.90 3.00 3.10 0.50 0.60 0.70 0 4 8 0.09 0.15 0.20 0.19 0.25 0.30 0 5 10 0 5 10 MIN Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side. JEDEC Equivalent: MO-153 Drawing No. C04-086 2001 Microchip Technology Inc. DS00049R-page 48 Packaging Diagrams and Parameters 14-Lead Plastic Thin Shrink Small Outline (ST) - 4.4 mm (TSSOP) E E1 p D 2 1 n B A c A1 L Units Dimension Limits n p Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Molded Package Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic A A2 A1 E E1 D L c B MIN .033 .002 .246 .169 .193 .020 0 .004 .007 0 0 INCHES NOM 14 .026 .035 .004 .251 .173 .197 .024 4 .006 .010 5 5 A2 MAX .043 .037 .006 .256 .177 .201 .028 8 .008 .012 10 10 MILLIMETERS* NOM MAX 14 0.65 1.10 0.85 0.90 0.95 0.05 0.10 0.15 6.25 6.38 6.50 4.30 4.40 4.50 4.90 5.00 5.10 0.50 0.60 0.70 0 4 8 0.09 0.15 0.20 0.19 0.25 0.30 0 5 10 0 5 10 MIN Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side. JEDEC Equivalent: MO-153 Drawing No. C04-087 DS00049R-page 49 2001 Microchip Technology Inc. Packaging Diagrams and Parameters 20-Lead Plastic Thin Shrink Small Outline (ST) - 4.4 mm (TSSOP) E p E1 D B 2 n 1 A c L Units Dimension Limits n p Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Molded Package Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom A A2 A1 E E1 D L c B MIN .033 .002 .246 .169 .252 .020 0 .004 .007 0 0 A2 A1 INCHES NOM 20 .026 .035 .004 .251 .173 .256 .024 4 .006 .010 5 5 MAX .043 .037 .006 .256 .177 .260 .028 8 .008 .012 10 10 MILLIMETERS* NOM MAX 20 0.65 1.10 0.85 0.90 0.95 0.05 0.10 0.15 6.25 6.38 6.50 4.30 4.40 4.50 6.40 6.50 6.60 0.50 0.60 0.70 0 4 8 0.09 0.15 0.20 0.19 0.25 0.30 0 5 10 0 5 10 MIN * Controlling Parameter Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side. JEDEC Equivalent: MO-153 Drawing No. C04-088 2001 Microchip Technology Inc. DS00049R-page 50 Packaging Diagrams and Parameters 28-Lead Plastic Thin Small Outline (TS) - 5 x 20 mm (TSOP) E E1 3xp p D 2 1 n B A c A2 A1 L Units Dimension Limits n p Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Molded Package Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic A A2 A1 E E1 D L c B MIN .039 .037 .002 .780 .720 .307 .020 0 .004 .006 0 0 INCHES NOM 28 .020 .045 .039 .006 .787 .724 .315 .024 4 .006 .008 5 5 MAX .051 .041 .010 .795 .728 .323 .028 8 .008 .010 10 10 MILLIMETERS* NOM MAX 28 0.50 0.99 1.14 1.30 0.95 1.00 1.05 0.05 0.15 0.25 19.80 20.00 20.20 18.30 18.40 18.50 7.80 8.00 8.20 0.50 0.60 0.70 0 4 8 0.10 0.15 0.20 0.15 0.20 0.25 0 5 10 0 5 10 MIN Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side. EIAJ Equivalent: IC-74-2-3 Drawing No. C04-067 DS00049R-page 51 2001 Microchip Technology Inc. Packaging Diagrams and Parameters 28-Lead Plastic Very Small Outline (VS) - 8 x 13.4 mm (VSOP) E E1 p 2 1 D n B A c L Units Dimension Limits n p Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Molded Package Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic A A2 A1 E E1 D L c B MIN .039 .037 .002 .520 .461 .311 .012 0 .006 .007 0 0 INCHES NOM 28 .022 .045 .039 .005 .528 .465 .315 .020 3 .006 .008 5 5 A1 MAX .051 .041 .010 .535 .469 .319 .028 5 .006 .009 10 10 A2 MILLIMETERS* NOM MAX 28 0.55 0.99 1.14 1.29 0.95 1.00 1.05 0.13 0.25 0.05 13.20 13.40 13.60 11.70 11.80 11.90 7.90 8.00 8.10 0.30 0.50 0.70 0 3 5 0.14 0.15 0.16 0.17 0.20 0.23 0 5 10 0 5 10 MIN Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side. Drawing No. C04-075 2001 Microchip Technology Inc. DS00049R-page 52 Packaging Diagrams and Parameters 44-Lead Plastic Metric Quad Flatpack (PQ) 10x10x2 mm Body, 1.6/0.15 mm Lead Form (MQFP) E E1 #leads=n1 p D1 D 2 1 B n CH x 45 c A L Units Dimension Limits n p Number of Pins Pitch Pins per Side Overall Height Molded Package Thickness Standoff Foot Length Footprint (Reference) Foot Angle Overall Width Overall Length Molded Package Width Molded Package Length Lead Thickness Lead Width Pin 1 Corner Chamfer Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic n1 A A2 A1 L (F) E D E1 D1 c B CH MIN .079 .077 .002 .029 0 .510 .510 .390 .390 .005 .012 .025 5 5 A1 (F) INCHES NOM 44 .031 11 .086 .080 .006 .035 .063 3.5 .520 .520 .394 .394 .007 .015 .035 10 10 MAX .093 .083 .010 .041 7 .530 .530 .398 .398 .009 .018 .045 15 15 A2 MILLIMETERS* NOM 44 0.80 11 2.00 2.18 1.95 2.03 0.05 0.15 0.73 0.88 1.60 0 3.5 12.95 13.20 12.95 13.20 9.90 10.00 9.90 10.00 0.13 0.18 0.30 0.38 0.64 0.89 5 10 5 10 MIN MAX 2.35 2.10 0.25 1.03 7 13.45 13.45 10.10 10.10 0.23 0.45 1.14 15 15 Notes: Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-022 Drawing No. C04-071 DS00049R-page 53 2001 Microchip Technology Inc. Packaging Diagrams and Parameters 44-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP) E E1 #leads=n1 p D1 D 2 1 B n CH x 45 A c L A1 A2 (F) Units Dimension Limits n p Number of Pins Pitch Pins per Side Overall Height Molded Package Thickness Standoff Foot Length Footprint (Reference) Foot Angle Overall Width Overall Length Molded Package Width Molded Package Length Lead Thickness Lead Width Pin 1 Corner Chamfer Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic n1 A A2 A1 L (F) E D E1 D1 c B CH MIN .039 .037 .002 .018 0 .463 .463 .390 .390 .004 .012 .025 5 5 INCHES NOM 44 .031 11 .043 .039 .004 .024 .039 3.5 .472 .472 .394 .394 .006 .015 .035 10 10 MAX .047 .041 .006 .030 7 .482 .482 .398 .398 .008 .017 .045 15 15 MILLIMETERS* NOM 44 0.80 11 1.00 1.10 0.95 1.00 0.05 0.10 0.45 0.60 1.00 0 3.5 11.75 12.00 11.75 12.00 9.90 10.00 9.90 10.00 0.09 0.15 0.30 0.38 0.64 0.89 5 10 5 10 MIN MAX 1.20 1.05 0.15 0.75 7 12.25 12.25 10.10 10.10 0.20 0.44 1.14 15 15 Notes: Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-026 Drawing No. C04-076 2001 Microchip Technology Inc. DS00049R-page 54 Packaging Diagrams and Parameters 64-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP) E E1 #leads=n1 p D1 D 2 1 B n CH x 45 A c A2 L A1 (F) Units Dimension Limits n p Number of Pins Pitch Pins per Side Overall Height Molded Package Thickness Standoff Foot Length Footprint (Reference) Foot Angle Overall Width Overall Length Molded Package Width Molded Package Length Lead Thickness Lead Width Pin 1 Corner Chamfer Mold Draft Angle Top Mold Draft Angle Bottom n1 A A2 A1 L (F) E D E1 D1 c B CH MIN .039 .037 .002 .018 0 .463 .463 .390 .390 .005 .007 .025 5 5 INCHES NOM 64 .020 16 .043 .039 .006 .024 .039 3.5 .472 .472 .394 .394 .007 .009 .035 10 10 MAX .047 .041 .010 .030 7 .482 .482 .398 .398 .009 .011 .045 15 15 MILLIMETERS* NOM 64 0.50 16 1.00 1.10 0.95 1.00 0.05 0.15 0.45 0.60 1.00 0 3.5 11.75 12.00 11.75 12.00 9.90 10.00 9.90 10.00 0.13 0.18 0.17 0.22 0.64 0.89 5 10 5 10 MIN MAX 1.20 1.05 0.25 0.75 7 12.25 12.25 10.10 10.10 0.23 0.27 1.14 15 15 * Controlling Parameter Significant Characteristic Notes: Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-026 Drawing No. C04-085 DS00049R-page 55 2001 Microchip Technology Inc. Packaging Diagrams and Parameters 80-Lead Plastic Thin Quad Flatpack (PT) 12x12x1 mm Body, 1.0/0.10 mm Lead Form (TQFP) E E1 #leads=n1 p D1 D 2 1 B n CH x 45 A c L A2 A1 (F) Units Dimension Limits n p Number of Pins Pitch Pins per Side Overall Height Molded Package Thickness Standoff Foot Length Footprint (Reference) Foot Angle Overall Width Overall Length Molded Package Width Molded Package Length Lead Thickness Lead Width Pin 1 Corner Chamfer Mold Draft Angle Top Mold Draft Angle Bottom n1 A A2 A1 L (F) E D E1 D1 c B CH MIN .039 .037 .002 .018 0 .541 .541 .463 .463 .004 .007 .025 5 5 INCHES NOM 80 .020 20 .043 .039 .004 .024 .039 3.5 .551 .551 .472 .472 .006 .009 .035 10 10 MAX .047 .041 .006 .030 7 .561 .561 .482 .482 .008 .011 .045 15 15 MILLIMETERS* NOM 80 0.50 20 1.00 1.10 0.95 1.00 0.05 0.10 0.45 0.60 1.00 0 3.5 13.75 14.00 13.75 14.00 11.75 12.00 11.75 12.00 0.09 0.15 0.17 0.22 0.64 0.89 5 10 5 10 MIN MAX 1.20 1.05 0.15 0.75 7 14.25 14.25 12.25 12.25 0.20 0.27 1.14 15 15 * Controlling Parameter Significant Characteristic Notes: Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-026 Drawing No. C04-092 2001 Microchip Technology Inc. DS00049R-page 56 Packaging Diagrams and Parameters 100-Lead Plastic Thin Quad Flatpack (PT) 14x14x1 mm Body, 1.0/0.10 mm Lead Form (TQFP) E E1 #leads=n1 p D D1 B 2 1 n A c L A2 A1 (F) Units Number of Pins Pitch Dimension Limits n p Overall Height A Molded Package Thickness A2 .037 Standoff A1 .002 L (F) .018 Footprint (Reference) Foot Angle Overall Width MIN NOM MAX 100 100 .020 0.50 25 25 n1 MAX NOM Pins per Side Foot Length MILLIMETERS* INCHES MIN .047 1.20 .039 .041 0.95 .006 0.05 .024 .030 0.45 1.00 0.15 0.60 3.5 7 0 3.5 E .630 BSC 16.00 BSC Overall Length D .630 BSC 16.00 BSC Molded Package Width E1 .551 BSC 14.00 BSC Molded Package Length D1 c .551 BSC Lead Thickness .004 0.75 1.00 .039 0 1.05 7 14.00 BSC .008 0.09 0.20 .007 .009 .011 0.17 0.22 0.27 Mold Draft Angle Top B 11 12 13 11 12 13 Mold Draft Angle Bottom 11 12 13 11 12 13 Lead Width *Controlling Parameter Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-026 Drawing No. C04-110 DS00049R-page 57 2001 Microchip Technology Inc. PACKAGING Product Tape and Reel Specifications FIGURE 1: EMBOSSED CARRIER DIMENSIONS (8, 12,16, AND 24 mm TAPE ONLY) Top Cover Tape A0 W B0 K0 P TABLE 1: Case Outline CARRIER TAPE/CAVITY DIMENSIONS Carrier Dimensions Package Type W mm P mm Cavity Dimensions A0 mm B0 mm K0 mm Output Quantity Units Reel Diameter in mm SN SOIC .150" 8L 12 8 6.4 5.2 2.1 3300 330 SO SOIC .300" 18L 24 24 12 16 10.9 11.1 13.3 12.0 3.0 2.8 1600 1100 330 330 SO SOIC .300" 20L 24 12 10.9 13.3 3.0 1600 330 SO SOIC .300" 28L 24 24 12 12 10.9 11.1 18.3 18.5 3.0 3.0 1600 1600 330 330 L PLCC 28L 24 16 13.0 13.0 4.9 750 330 L PLCC 32L 24 16 13.1 15.5 3.9 900 330 L PLCC 44L 32 32 24 24 18.0 18.0 18.0 18.0 4.9 5.0 500 500 330 L PLCC 68L 44 32 25.6 25.6 5.8 300 330 SM SOIC .208" 8L 16 12 8.3 5.7 2.3 2100 330 SL SOIC .150" 14L 16 8 6.5 9.5 2.1 2600 330 TS TSOP 28L/ 32L 32 16 8.6 20.6 2.1 1500 330 SS SSOP 20L 16 12 8.4 7.7 2.5 1600 330 SS SSOP 28L 24 12 8.4 10.9 2.4 2100 330 PQ MQFP 44L 24 24 14.2 14.2 2.8 900 330 PT TQFP 44L/ 64L 24 16 12.35 12.35 2.2 1200 330 VS VSOP 28L 24 12 8.7 13.9 2.1 2500 330 2001 Microchip Technology Inc. DS00049R-page 58 Packaging FIGURE 2: MECHANICAL POLARIZATION (PCC AND LCC DEVICES) Pin No. 1 to be on Circular Sprocket Hole Side of Tape. User Direction Feed Note 1: Top view shown with cover tape removed. 2: Only single sprocket tape shown - polarization for double sprocket tape (32 mm and wider) is the same as shown. FIGURE 3: MECHANICAL POLARIZATION (SOIC DEVICES) User Direction of Feed Note 1: Top view shown with cover tape removed. 2: Only single sprocket tape shown - polarized for double sprocket tape (32 mm and wider) is the same as shown. 1.0 DIMENSIONS AND TOLERANCES All component taping diagrams, dimensions, tolerances, and component positioning requirements are those which are specified per EIA Standard EIA-481, current revision. For the 8-lead SOIC EIAJ Type II Package and 16 mm Carrier Tape width, the component taping diagrams, dimensions, tolerances, and component positioning requirements are those which are specified per EIAJ Standard RC-1009B, current revision. DS00049R-page 59 2001 Microchip Technology Inc. PACKAGING Thermal Characteristics THERMAL CHARACTERISTICS Characteristic Symbol Value Unit Average Junction Temperature TJ TA + (PD x ja) C Ambient Temperature TA User-determined C PD PINT + PI/O W Device Internal Power Dissipation PINT IDD X VDD W I/O Pin Power Dissipation PI/O User-determined W Total Power Dissipation1 2001 Microchip Technology Inc. DS00049R-page 60 Packaging THERMAL RESISTANCE Item Package Thermal Resistance(2) Leads Package Package Body Jc (C/W) Ja (C/W) 8 PDIP .300" 41.2 84.6 14 PDIP .300" 32.5 69.8 16 PDIP .300" 34.1 69.9 18 PDIP .300" 29.4 65.9 20 PDIP .300" 28.1 62.4 24 PDIP .600" 21 63 28 PDIP .600" 31.4 59.1 28 SPDIP .300" 29 60 40 PDIP .600" 24.7 47.2 8 SOIC .150" 38.8 163 8 SOIC .208" 27.98 117.55 16 SOIC .300" 24.8 89.6 18 SOIC .300" 24.6 63.6 20 SOIC .300" 24.2 85.2 28 SOIC .300" 23.8 80.2 8 MSOP .118" 39.1 206.3 8 TSSOP 4.4mm 36.6 123.7 14 TSSOP 4.4mm 31.7 100.4 20 TSSOP 4.4mm 17 90.2 28 TSSOP 4.4mm 13.3 75.5 20 SSOP .209" 32.2 108.1 28 SSOP .209" 23.9 89.4 3 SOT23 110.12 336 5 SOT23 81 255.9 3 TO-92 66.3 131.9 20 PLCC 37.6 62.5 28 PLCC 25.4 50.4 32 PLCC 22.7 52.4 44 PLCC 20.6 45.4 68 PLCC 16.1 39.3 84 PLCC 11.4 35.8 44 TQFP 10x10x1mm 14.5 45.79 64 TQFP 10x10x1mm 24.4 76.6 80 TQFP 12x12x1mm 24.4 69.4 100 TQFP 14x14x1mm 24.4 50 44 MQFP 10x10x2mm 14.8 57.8 Note 1: Approximate value, disregarding PI/O. 2: All thermal resistance values are estimated and are dependent on die and materials used. Variables include die and leadframe paddle sizes. Relative values are taken in still air. DS00049R-page 61 2001 Microchip Technology Inc. PACKAGING Overview of Microchip Die/Wafer Support INTRODUCTION ELECTRICAL SPECIFICATIONS Microchip Technology Inc. devices are available in wafer form and in die form. All products sold in die or wafers have been characterized and qualified according to the requirements of Microchip Technology Inc. Specifications SPI-41014, "Characterization and Qualification of Integrated Circuits," and QCI-39000, "Worldwide Quality Conformance Requirements." The functional and electrical specifications of Microchip devices in die form are identical to those of a packaged version. Please refer to individual data sheets for complete details. PRODUCT INTEGRITY Product supplied in die or wafer form are fully tested and characterized. Die or Wafers are inspected to Microchip Technology Inc. Specification, QCI-30014. CAUTION QTP Quick-Turnaround-Production (QTP) applies only to EPROM and EEPROM microcontrollers. With QTP devices, the program memory array is only tested against the code provided. This method ensures that the device will operate correctly as programmed, but does not ensure that every program memory bit can be programmed to every state. Note: Do not erase QTP devices and program them with a different code. Some EEPROM devices use EPROM cells for device configuration. Exposure to ultra-violet light must be avoided. Exposure to ultra-violet light may cause the device to operate improperly. EPROM Extreme care is urged in the handling and assembly of these products since they are susceptible to damage from electro-static discharge. EPROM devices are supplied as fully erased programmable parts that are UV erasable and reprogrammable by the user (except for QTP and SQTP devices). ORDERING INFORMATION EEPROM Die sales must be conducted by contacting your Microchip Sales Office. EEPROM devices may not be supplied in a fully erased state, but are reprogrammable by the user (except for QTP and SQTP devices). To order or obtain information (on pricing or delivery) for a specific device, use one of the following part numbers: Devices in Waffle Pack DEVICE_NUMBER/S Devices in Wafer form DEVICE_NUMBER/W DEVICE_NUMBER/WF where DEVICE_NUMBER is the device that you require. The S specifies die in a waffle pack while a W specifies wafer sales, and WF specifies sawn wafer on frames. 2001 Microchip Technology Inc. ROM ROM devices are supplied as fully programmed parts (program memory only). These are not reprogrammable by the user. DIE MECHANICAL SPECIFICATIONS Refer to the specifications. individual data sheet for these DS00049R-page 62 Packaging BOND PAD COORDINATES SHIPPING OPTIONS The die figures have associated bond pad coordinates. These coordinates assist in the attaching of the bond wire to the die. All the dimensions of these coordinates are in micrometers (m) unless otherwise specified. The origin for the coordinates is the center of the die, as shown in Figure 1. Refer to the Microchip Die Specification sheet for openings and pitch. Die Form Shipping FIGURE 1: DIE COORDINATE ORIGIN Microchip product in die form can be shipped in wafflepack. The waffle pack has sufficient cavity area to restrain the die, while maintaining their orientation. Lint free paper inserts are placed over the waffle packs, and each pack is secured with a plastic locking clip. Groups of waffle packs are assembled into sets for shipment. A label with lot number, quantity, and part number is attached. These waffle packs are hermetically sealed in bags. Origin (0,0) DIE Wafer Form Products may also be shipped in wafer form (see ordering information). Wafers are shipped in a wafer tub. The tub is padded with non-conductive foam. Lint free paper inserts are placed around each wafer. A label with lot number, quantity, and part number is attached. Sawn Wafer on Frames Bottom Left (x,y) Top Right (x,y) All dimensions in m unless specified otherwise. The die is capable of thermosonic gold or ultrasonic wire bonding. Die meet the minimum conditions of MILSTD 883, Method 2011 on "Bond Strength (Destructive Bond Pull Test)". The Bond Pad metallization is silicon doped aluminum. SUBSTRATE BONDING Substrate bonding may be required on certain product families. For more information refer to the die specification sheet. Products may also be shipped on wafer frames. Wafers are mounted on plastic frames and 100% sawn through. Sawn wafer on frames may be shipped in bulk (25 wafers per carrier) or in a single wafer in a carrier. A label with lot number, quantity, and part number is attached with each shipment. Storage Procedures Temperature and humidity greatly affect the storage life of die. It is recommended that the die be used as soon as possible after receipt. Upon receipt, the sealed bags should be stored in a cool and dry environment (25C and 25% relative humidity). In these conditions, sealed bags have a shelf life of 12 months. Temperatures or humidities greater than these will reduce the storage life. Once a bag containing waffle packs has been opened, the devices should be assembled and encapsulated within 48 hours (assuming, 25C and 25% humidity). DS00049R-page 63 2001 Microchip Technology Inc.