2001 Microchip Technology Inc. DS00049R-page i
Outlines and Parameters .............................................................................................................................1
Product Tape and Reel Specifications ......................................................................................................58
Thermal Characteristics ............................................................................................................................60
Overview of Microchip Die/Wafer Support ................................................................................................62
SECTION 11
PACKAGING
DS00049R-page ii 2001 Microchip Technology Inc.
Packaging Diagrams and Parameters
CERAMIC SIDE BRAZED DUAL IN-LINE FAMILY
8-Lead Ceramic Side Brazed Dual In-line with Window (JW) – 300 mil ...............................................4
14-Lead Ceramic Side Brazed Dual In-line with Window (JW) – 300 mil ...........................................5
28-Lead Ceramic Side Brazed Dual In-line with Window (JW) – 300 mil ..............................................6
CERAMIC DUAL IN-LINE (CERDIP) FAMILY
18-Lead Ceramic Dual In-line with Window (JW) – 300 mil (CERDIP) .................................................7
28-Lead Ceramic Dual In-line with Window (JW) – 300 mil (CERDIP) .................................................8
28-Lead Ceramic Dual In-line with Window (JW) – 600 mil (CERDIP) .................................................9
40-Lead Ceramic Dual In-line with Window (JW) – 600 mil (CERDIP) ...............................................10
CERAMIC CHIP CARRIER FAMILY
68-Lead Ceramic Leaded (CL) Chip Carrier with Window – Square (CERQUAD) .............................11
SMALL OUTLINE TRANSISTOR
3-Lead Plastic Transistor Outline (TO) (TO-92) .............................................................................12
3-Lead Plastic Small Outline Transistor (TT) (SOT23) ........................................................................13
5-Lead Plastic Small Outline Transistor (OT) (SOT23) .......................................................................14
Leadless Wedge Module Plastic Small Outline Transistor (WM) (SOT385) .......................................15
PLASTIC DUAL IN-LINE (PDIP) FAMILY
8-Lead Plastic Dual In-line (P) – 300 mil (PDIP) .................................................................................16
14-Lead Plastic Dual In-line (P) – 300 mil (PDIP) ...............................................................................17
16-Lead Plastic Dual In-line (P) – 300 mil (PDIP) ...............................................................................18
18-Lead Plastic Dual In-line (P) – 300 mil (PDIP) ..............................................................................19
20-Lead Plastic Dual In-line (P) – 300 mil (PDIP) ...............................................................................20
24-Lead Plastic Dual In-line (P) – 600 mil (PDIP) ..............................................................................21
24-Lead Skinny Plastic Dual In-line (SP) – 300 mil (PDIP) .................................................................22
28-Lead Skinny Plastic Dual In-line (SP) – 300 mil (PDIP) .................................................................23
28-Lead Plastic Dual In-line (P) – 600 mil (PDIP) ...............................................................................24
40-Lead Plastic Dual In-line (P) – 600 mil (PDIP) ...............................................................................25
64-Lead Shrink Plastic Dual In-line (SP) – 750 mil (PDIP) .................................................................26
PLASTIC LEADED CHIP CARRIER (PLCC) FAMILY
20-Lead Plastic Leaded Chip Carrier (L) – Square (PLCC) ................................................................27
28-Lead Plastic Leaded Chip Carrier (L) – Square (PLCC) ................................................................28
32-Lead Plastic Leaded Chip Carrier (L) – Rectangle (PLCC) ............................................................29
44-Lead Plastic Leaded Chip Carrier (L) – Square (PLCC) ................................................................30
68-Lead Plastic Leaded Chip Carrier (L) – Square (PLCC) ................................................................31
84-Lead Plastic Leaded Chip Carrier (L) – Square (PLCC) ................................................................32
2001 Microchip Technology Inc. DS00049R-page iii
Packaging Diagrams and Parameters
PLASTIC SMALL OUTLINE (SOIC) FAMILY
8-Lead Plastic Small Outline (SN) –Narr ow, 150 mil (SOIC) ...................... ...... ....... ...... ....... ...... .......33
14-Lead Plastic Small Outline (SL) –Narrow, 150 mil (SOIC) ............................................................34
16-Lead Plastic Small Outline (SL) –Narrow 150 mil (SOIC) ...........................................................35
8-Lead Plastic Small Outline (SM) – Medium, 208 mil (SOIC) ...........................................................36
16-Lead Plastic Small Outline (SO) – Wide, 300 mil (SOIC) .............................................................37
18-Lead Plastic Small Outline (SO) – Wide, 300 mil (SOIC) ..............................................................38
20-Lead Plastic Small Outline (SO) –Wide, 300 mi (SOIC) ...............................................................39
28-Lead Plastic Small Outline (SO) –Wide, 300 mil (SOIC) ..............................................................40
PLASTIC MICRO LEADFRAME (MLF) FAMILY
8-Lead Plastic Micro Leadframe Package (MF) 6x5 mm Body (MLF-S) ............................................41
28-Lead Plastic Micro Leadframe Package (MF) 6x6 mm Body (MLF) .............................................43
PLASTIC MICRO SMALL OUTLINE (MSOP) FAMILY
8-Lead Plastic Micro Small Outline Package (MS) (MSOP) ...............................................................45
PLASTIC SHRINK SMALL OUTLINE (SSOP) FAMILY
20-Lead Pl as tic Shr ink Smal l Ou tli ne (SS) – 209 mil, 5.30 mm (SSOP) ...........................................46
28-Lead Pl as tic Shr ink Smal l Ou tli ne (SS) – 209 mil, 5.30 mm (SSOP) ............................................47
PLASTIC THIN SHRINK SMALL OUTLINE (TSSOP) FAMILY
8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP) ....................................................48
14-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP) ..................................................49
20-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP) ..................................................50
PLASTIC THIN SMALL OUTLINE (TSOP) AND VERY SMALL OUTLINE (VSOP) FAMILY
28-Lead Pl as tic Thi n Small Ou tli ne (TS ) –5 x 20 mm (TSOP) ...........................................................51
28-Lead Plastic Very Small Outline (VS) – 8 x 13.4 mm (VSOP) .......................................................52
PLASTIC QUAD FLATPACK (MQFP) FAMILY
44-Lead Pl as tic Metr ic Quad Flat pac k (PQ ) 10x10 x2 mm Bod y,
1.6/0.15 mm Lead Form (MQFP) ..................................................................................................53
PLASTIC THIN QUAD FLATPACK (TQFP) FAMILY
44-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body,
1.0/0.10 mm Lead Form (TQFP) ..................................................................................................54
64-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body,
1.0/0.10 mm Lead Form (TQFP) ..................................................................................................55
80-Lead Plastic Thin Quad Flatpack (PT) 12x12x1 mm Body,
1.0/0.10 mm Lead Form (TQFP) ..................................................................................................56
100-Lead Plastic Thin Quad Flatpack (PT) 14x14x1 mm Body,
1.0/0.10 mm Lead Form (TQFP) ..................................................................................................57
2001 Microchip Technology Inc. DS00049R-page 1
PACKAGING
PART NUMBER SUFFIX DESIGNATIONS:
XXXXXXXXXX - XX X/XX XXX
QTP, SQTP or ROM Code; Special Requirements
Package:
1C = 1000pF COB Module, .75mm SM = 8-lead Small Outline (207 mil)
3C = 330pF COB Module, .45mm SN = 8-lead Small Outline (150 Mil)
L = Plastic Leaded Chip Carrier (PLCC) SO = Plastic Small Outline (SOIC) (300 mil)
P = Plastic DIP SP = Plastic Skinny DIP
S = Die in Waffle Pack SS = Plastic Shrink Small Outline (SSOP)
W = Die in Wafer Form ST = Thin Shrink Small Outline (4.4mm)
CB = Chip on Board (COB) TQ-92 = Transistor Outline
CL = Windowed CERQUAD TS = Thin Small Outline (8mm x 20mm)
JW = Windowed CERDIP TT = SOT-23-3 Small Outline Trans istor
ML = Micro Leadframe VS = Very Small Outline (8mm x 12mm)
OT = SOT-23-5 WB = Bumped Wafer (11 mil)
PQ = Plastic Quad Flatpack (PQFP) WF = Sawed Wafer on Frame (7 mil)
PT = Plastic Thin Quad Flatpack (TQFP) WF B = Bum ped, Sawed Wafer on Frame
SB = Bumped Die in Waffle Pack WM = SOT385 Leadless Module
SL = 14-lead Sm all Outline (150 mil)
Process Temperature:
Blank = 0°C to +70°C E (Extended) = -40°C to +125°C
I (Industrial) = -40°C to +85°C
Speed: OR Cryst al Frequency Designator for PICmicro® MCUs
-90 = 90 ns LP = DC to 20 MHz, High Speed Crystal Oscillator
-10 = 100 ns RC = DC to 2 MHz , X T and RC Oscillator Supp ort
-12 = 120 ns XT = D C t o 4 MH z Intern a l , XT a n d R C O s cilla t or
Support
-15 = 150 ns HS = DC to 200 kHz, LP Oscillator Support
-17 = 170 ns 02 = DC to 10 MHz, HS Oscillator Support
-20 = 200 ns 04 = DC to 20 M H z , High Sp e ed Cr y s t a l O s c i l l a t or
-25 = 250 ns 04 = DC to 2 MHz , X T and R C Oscill ator Supp ort
-30 = 300 ns 10 = DC to 4 MHz Inter na l , XT and RC Os c i l l a t o r
Support
Option:
T = Tape and Reel Shipments F = 200 µs
Blank= twc = 1ms X = Rotated pinout
Device Type: (Up to 10 digits)
AA = 1.8V EEPROM Memory LCE = Low Power CMOS/EPROM/EEPROM MCU
C = CMOS EPROM MCU LCR = Low Power CMOS ROM MCU
CE = CMOS EPROM/EEPROM MCU LCS = Low Power Security
CR = CMOS ROM MCU LF = Low Power FLASH MCU
F = FLASH MCU LV = Low Voltage
HC = High Speed 24 = 2-Wire (I2CTM)
HV = High Voltage 25 = SPITM
LC = Low Power CMOS EPROM MCU 93 = 3-Wire (Microwire®)
Outlines and Parameters
Packaging
DS00049R-page 2 2001 Microchip Technology Inc.
NOTES:
Packaging
2001 Microchip Technology Inc. DS00049R-page 3
NOTES:
2001 Microchip Technology Inc. DS00049R-page 4
Packaging Diagrams and Parameters
8-Lead Ceramic Side Brazed Dual In-line with Window (JW) – 300 mil
7.116.866.60.280.270.260ULid Width 11.6811.4311.18.460.450.440TLid Length 4.344.224.09.171.166.161WWindow Diameter 8.237.877.52.324.310.296
eB
Overall Row S pacing §0.510.460.41.020.018.016BLower Lead Width 1.521.401.27.060.055.050B1Upper Lead Widt h 0.300.250.20.012.010.008
c
Lead Thickness 3.813.563.30.150.140.130LTip to Seating Plane 13.4613.2112.95.530.520.510DOverall Length 7.627.377.11.300.290.280E1Package Width 1.140.890.64.045.035.025A1Standoff 3.633.122.62.143.123.103A2Top of Body to Seating Plane 4.704.193.68.185.165.145ATop to Seating Plane 2.54.100
p
Pitch 88
n
Number of Pins MAXNOMMINMAXNOMMINDimension Limits MILLIMETERSINCHES*Units
2
1
D
n
T
E1
U
W
c
eB
L
A2
B
B1
A
A1
p
* Controlling Parameter
§ Significant Characteristic
JEDC Equivalent: MS-015
Drawing No. C04-083
DS00049R-page 5 2001 Microch ip Technology Inc.
Packaging Diagrams and Parameters
14-Lead Cerami c Side Brazed Dual In-line with Window (JW) – 300 mil
7.116.866.60.280.270.260ULid Wi dth 11.6811.4311.18.460.450.440TLi d Len gth 4.344.224.09.171.166.161WWindow Diameter 8.237.877.52.324.310.296eBOverall Row Spacing §0.510.460.41.020.018.016BLower Lead Width 1.421.371.32.056.054.052B1Upper Lea d Width 0.300.250.20.012.010.008
c
Lead Thickness 3.813.563.30.150.140.130LTip to Seating Plane 17.9617.7817.60.707.700.693DOvera ll Length 7.627.377.11.300.290.280E1Package Width 1.140.890.64.045.035.025A1Standoff 3.563.052.54.140.120.100A2Top of Body to Seating Plane 4.624.113.61.182.162.142ATop to Seating Plane 2.54.100
p
Pitch 1414
n
Number of Pins MAXNOMMINMAXNOMMINDimension Limits MILLIMETERSINCHES*Units
T
W
U
c
eB
2
1
D
n
E1
p
A2
L
A1
A
B1
B
* Controlling Parameter
§ Significant Characteristic
JEDEC Equivalent: MS-015
Drawing No. C04-107
2001 Microchip Technology Inc. DS00049R-page 6
Packaging Diagrams and Parameters
28-Lead Cerami c Side Brazed Dual In-line with Window (JW) – 300 mil
7.497.246.99.295.285.275ULid Width 12.9512.7012.45.510.500.490TLid Length 4.344.224.09.171.166.161WWindow Diameter 8.237.877.52.324.310.296
eB
Overall Row Spacing §0.510.460.41.020.018.016BLower Lead Width 1.321.271.22.052.050.048B1Upper Lead Width 0.300.250.20.012.010.008
c
Lead Thi ckne ss 3.813.563.30.150.140.130LTip to Seating Plane 35.9235.5635.201.4141.4001.386DOverall Length 7.627.377.11.300.290.280E1Package Width 1.521.271.02.060.050.040A1Standoff 3.943.432.92.155.135.115A2Top of Body to Seating Plane 5.034.483.94.198.177.155ATop to Seating Plane 2.54.100
p
Pitch 2828
n
Number of Pins MAXNOMMINMAXNOMMINDimen sion Li mits MILLIMETERSINCHES*Units
c
eB
2
1
D
n
T
W
U
E1
p
A2
L
A1
A
B1
B
* Controlling Parameter
§ Significant Characteristic
JEDEC Equivalent: MS-015
Drawing No. C04-084
DS00049R-page 7 2001 Microch ip Technology Inc.
Packaging Diagrams and Parameters
18-Lead Cerami c Dual In-line with Window (JW) – 300 mil (CERDIP)
3.30 3.56 3.81
5.335.084.83.210.200.190W2Window Length .150.140.130W1Wi ndow Width 10.809.788.76.425.385.345
eB
Overall Row S pacing §0.530.470.41.021.019.016BLower Lead Width 1.521.401.27.060.055.050B1Upper Lead Width 0.300.250.20.012.010.008
c
Lead Thickness 3.813.493.18.150.138.125LTip to Seating Plane 23.3722.8622.35.920.900.880DOverall Length 7.497.377.24.295.290.285E1Ceramic Pkg . Width 8.267.947.62.325.313.300EShoulder to Shoulder Width 0.760.570.38.030.023.015A1Standoff 4.194.063.94.165.160.155A2Ceramic Package Height 4.954.644.32.195.183.170ATop to Seating Plane 2.54.100
p
Pitch 1818
n
Number of Pins MAXNOMMINMAXNOMMINDimension Limits MILLIMETERSINCHES*Units
1
2
D
n
W2
E1
W1
c
eB
E
p
L
A2
B
B1
A
A1
* Controlling Parameter
§ Significant Characteristic
JEDEC Equivalent: MO-036
Drawing No. C04-010
2001 Microchip Technology Inc. DS00049R-page 8
Packaging Diagrams and Parameters
28-Lead Cerami c Dual In-line with Window (JW) – 300 mil (CERDIP)
3.30 3.56 3.81
7.877.627.37.310.300.290
W2
Window Len gth .150.140.130W1Window Width 10.809.788.76.425.385.345eBOverall Row Spacing §0.530.470.41.021.019.016BLower Lead Width 1.651.461.27.065.058.050B1Upper Lead Width 0.300.250.20.012.010.008
c
Lead Thickness 3.683.563.43.145.140.135LTip to Seating Plane 37.7237.0236.321.4851.4581.430DOverall Length 7.497.377.24.295.290.285E1Ceramic Pkg. Width 8.267.947.62.325.313.300EShoulder to Shoulder Width 0.760.570.38.030.023.015
A1
Standoff 4.194.063.94.165.160.155A2Ceramic Package Height 4.954.644.32.195.183.170ATop to Seating Plane 2.54.100
p
Pitch 2828
n
Numb er of Pins MAXNOMMINMAXNOMMINDimension Limits MILLIMETERSINCHES*Units
2
1
D
n
W2
W1
E1
E
eB p
A2
L
B1
B
A1
A
* Controlling Parameter
c
§ Significant Characteristic
JEDEC Equivalent: MO-058
Drawing No. C04-080
DS00049R-page 9 2001 Microch ip Technology Inc.
Packaging Diagrams and Parameters
28-Lead Cerami c Dual In-line with Window (JW) –600 mil (CERDIP)
7.377.116.86.290.280.270WWindow D iame ter 18.0316.7615.49.710.660.610eBOverall Row Spacing §0.580.510.41.023.020.016BLower Lead Width 1.651.461.27.065.058.050B1Upper Lead Width 0.300.250.20.012.010.008
c
Lead Thickness 3.813.493.18.150.138.125LTip to Seating Plane 37.8537.0836.321.4901.4601.430DOverall Length 13.3613.2113.06.526.520.514
E1
Ceramic Pkg. Width 15.8815.2415.11.625.600.595ESho uld er to Sh ould er W idth 1.520.950.38.060.038.015A1Standoff 4.194.063.94.165.160.155A2Ceramic Package Height 5.725.334.95.225.210.195ATop to Seating Plane 2.54.100
p
Pitch 2828
n
Numb er of Pins MAXNOMMINMAXNOMMINDimension Limits MILLIMETERSINCHES*Units
2
1
D
n
E1
W
c
E
eB p
A2
L
B1
B
A1
A
* Controlling Parameter
§ Significant Characteristic
JEDEC Equivalent: MO-103
Drawing No. C04-013
2001 Microchip Technology Inc. DS00049R-page 10
Packaging Diagrams and Parameters
40-Lead Cerami c Dual In-line with Window (JW) – 600 mil (CERDIP)
9.148.898.64.360.350.340WWindow Diameter 18.0316.7615.49.710.660.610
eB
Overall Row S pacing §0.580.510.41.023.020.016BLower Lead Width 1.401.331.27.055.053.050B1Upper Lead Width 0.360.280.20.014.011.008
c
Lead Thickness 3.683.563.43.145.140.135LT ip to Seating Plane 52.3252.0751.822.0602.0502.040DOverall Length 13.3613.2113.06.526.520.514E1Ceramic Pkg. Width 15.8815.2415.11.625.600.595EShoulder to Shoulder Width 1.521.140.76.060.045.030A1Standoff 4.194.063.94.165.160.155A2Ceramic Packag e Height 5.725.214.70.225.205.185ATop to Seating Plane 2.54.100
p
Pitch 4040
n
Number of Pins MAXNOMMINMAXNOMMINDimensi on Limit s MILLIMETERSINCHES*Units
2
1
D
n
c
eB
E
p
B1
B
* Controlling Parameter
§ Significant Characteristic
JEDEC Equivalent: MO-103
Drawing No. C04-014
E1
W
A2 A
A1
DS00049R-page 11 2001 Microchip Technology Inc.
Packaging Diagrams and Parameters
68-Lead Ceramic Leaded (CL) Chip Carrier with Window –Square (CERQUAD)
45°
A3
A
p
B1
B
D2
E2
E
E1
#leads=n1
9.919.659.40.390.380.370WWi n dow D iame ter 0.530.460.38.021.018.015BLower Lead Width 0.790.720.66.031.029.026B1Upper Lead Width 0.300.250.20.012.010.008
c
Lead Thickness 1717n1Pins each side 23.6223.1122.61.930.910.890D2Footprint Length 23.6223.1122.61.930.910.890E2Footprint Width 24.3324.1323.93.958.950.942D1Ceramic Package Length 24.3324.1323.93.958.950.942E1Ceramic Package Width 25.2225.1024.97.993.988.983DOverall Package Length 25.2225.1024.97.993.988.983EOverall Package Width 0.760.640.51.030.025.020RCorn er Radius ( Others) 1.271.020.76.050.040.030CH1Corner Chamfer (1) 1.020.890.76.040.035.030A3Side One Chamfer Dim. 1.271.020.76.050.040.030A1Standoff §3.943.483.00.155.137.118A2Package Thickness 4.704.454.19.185.175.165AOverall Height 1.27.050
p
Pitch 6868
n
Numb er of Pins MAXNOMMINMAXNOMMINDimension Limits MILLIMETERSINCHES*Units
2n 1
A2
A1
c
D1 D
* Controlling Parameter
W
R CH1 x 45°
§ Significant Characteristic
JEDEC Equivalent: MO-087
Drawing No. C04-097
2001 Microchip Technology Inc. DS00049R-page 12
Packaging Diagrams and Parameters
3-Lead Plastic Transistor Outline (TO) (TO-92)
432432
β
Mold Draft Angle Bottom 654654
α
0.560.480.41.022.019.016BLead Width 0.510.430.36.020.017.014
c
Lead Thickness
2.412.292.16.095.090.085RMolded Package Radius 4.954.644.32.195.183.170DOvera l l Length 4.954.714.45.195.186.175E1Overall Width 3.943.623.30.155.143.130ABottom to Package Flat 1.27.050
p
Pitch 33
n
Number of Pins MAXNOMMINMAXNOMMINDimension Li mits MILLIMETERSINCHES*Units
R
n
1
3
α
p
L
B
A
c
β
1
D
2
E1
Tip to Seating Plane L .500 .555 .610 12.70 14.10 15.49
*Controlling Parameter
Mold Draft Angle Top
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: TO-92
Drawing No. C04-101
DS00049R-page 13 2001 Microchip Technology Inc.
Packaging Diagrams and Parameters
3-Lead Plastic Small Outline Transistor (TT) (SOT23)
10501050
β
Mold Draft Angle Bottom 10501050
α
Mold Draft Angle Top 0.510.440.37.020.017.015BLead Width 0.180.140.09.007.006.004
c
Lead Thickness 10501050
φ
Foot Angle 0.550.450.35.022.018.014LFoot Length 3.042.922.80.120.115.110DOvera ll Len gth 1.401.301.20.055.051.047
E1
Molded Package Width 2.642.372.10.104.093.083EOverall Width 0.100.060.01.004.002.000A1Standoff §1.020.950.88.040.037.035A2Molded Package Thickness 1.121.010.89.044.040.035AOverall Height 1.92.076
p1
Outside lead pitch (basic) 0.96.038
p
Pitch 33
n
Number of Pins MAXNOMMINMAXNOMMINDimension Li mits MILLIMETERSINCHES*Units
2
1
p
D
B
n
E
E1
L
c
β
φ
α
A2
A
A1
p1
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: TO-236
Drawing No. C04-104
§ Significant Characteristic
2001 Microchip Technology Inc. DS00049R-page 14
Packaging Diagrams and Parameters
5-Lead Plastic Small Outline Transistor (OT) (SOT23)
10501050
β
Mold Draft Angle Bottom 10501050
α
Mold Draft Angle Top 0.500.430.35.020.017.014BLead Width 0.200.150.09.008.006.004
c
Lead Thickness 10501050
φ
Foot A ngle 0.550.450.35.022.018.014LFoot Length 3.102.952.80.122.116.110DOverall Length 1.751.631.50.069.064.059E1M old ed Packag e Width 3.002.802.60.118.110.102EOverall Width 0.150.080.00.006.003.000A1Standoff §1.301.100.90.051.043.035A2Mold ed Packag e Thickness 1.451.180.90.057.046.035AOverall Height 1.90.075
p1
Outside lead pitch (basic) 0.95.038
p
Pitch 55
n
Number of Pins MAXNOMMINMAXNOMMINDimension Limits MILLIMETERSINCHES*Units
1
p
D
B
n
E
E1
L
c
β
φ
α
A2
A
A1
p1
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-178
Drawing No. C04-091
§ Significant Characteristic
DS00049R-page 15 2001 Microchip Technology Inc.
Packaging Diagrams and Parameters
Leadless Wedge Module Plastic Small Outline Transistor (WM) (SOT385)
1.201.101.00CH2Chamfer Distance, Vertical
12.2012.1012.00.480.476.472DOverall Length 6.206.106.002.44.240.236EOverall Width
3.053.002.90.120.118.114AOverall Height MAXNOMMINMAXNOMMINDimension Limi ts MILLIMETERS*INCHESUnits
D
E
F
J
A
Width at Tapered End J.173 .177 .181 4.40 4.50 4.60
Length of Flat F .193 .197 .200 4.90 5.00 5.10
CH1 x 45 °
Chamfer Distance, Horizontal CH1 .039 .043 .047 1.00 1.10 1.20
CH2 x 45 °
.047.043.039
Bottom of Package to Chamfer 2.102.001.90.083.079.075A1
A1
α
β
TYP.
TYP.
468 864864
α
Mold Draft Angle Top
Mold Draft Angle Bottom β468
*Controlling Parameter
Notes:
Dimensions D, E, F and J do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254 mm) per side.
Drawing No. C04-109
2001 Microchip Technology Inc. DS00049R-page 16
Packaging Diagrams and Parameters
8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
B1
B
A1
A
L
A2
p
α
E
eB
β
c
E1
n
D
1
2
Units INCHES* MILLIMETERS
Dime nsio n Limits MIN NOM MAX MIN NOM MAX
Number of Pins n88
Pitch p.100 2.54
Top to Seating Plane A .140 .155 .170 3.56 3.94 4.32
Molded Package Thickness A2 .115 .130 .145 2.92 3.30 3.68
Base to Seating Plane A1 .015 0.38
Shoulder to Shoul der Width E .300 .313 .325 7.62 7.94 8.26
Molded Package Width E1 .240 .250 .260 6.10 6.35 6.60
Overall Length D .360 .373 .385 9.14 9.46 9.78
Tip to Seating Plane L .125 .130 .135 3.18 3.30 3.43
Lead Thickness c.008 .012 .015 0.20 0.29 0.38
Upper Lead Width B1 .045 .058 .070 1.14 1.46 1.78
Lower Lead Width B .014 .018 .022 0.36 0.46 0.56
Overall Row S pacing §eB .310 .370 .430 7.87 9.40 10.92
Mold Draft Angle Top α51015 51015
Mold Draft Angle Bottom β51015 51015
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
JEDEC Equivalent: MS-001
Drawing No. C04-018
.010” (0.254mm) per side.
§ Significant Characteristic
DS00049R-page 17 2001 Microchip Technology Inc.
Packaging Diagrams and Parameters
14-Lead Plastic Dual In-line (P) –300 mil (PDIP)
E1
n
D
1
2
eB
β
E
c
A
A1
B
B1
L
A2
p
α
Units INCHES* MILLIMETERS
Dimen sion Li mits MIN NOM MAX MI N NOM MAX
Number of Pins n14 14
Pitch p.100 2.54
Top to Seating Plane A .140 .155 .170 3.56 3.94 4.32
Molded Package Thickness A2 .115 .130 .145 2.92 3.30 3.68
Base to Seating Plane A1 .015 0.38
Shoulder to Shoulder Width E .300 .313 .3 25 7.62 7.94 8.26
Molded Package Width E1 .240 .250 .26 0 6.10 6.35 6.60
Overal l Length D .740 .750 .760 18.8 0 19.05 19.30
Tip to Seating Plane L .125 .130 .135 3.18 3.30 3.43
Lead Thickness c.008 .012 .015 0.20 0.29 0.38
Upper Lead Width B1 .045 .058 .070 1.14 1.46 1.78
Lower Lead Width B .014 .018 .022 0.36 0.46 0.56
Overall Row Spacing §eB .310 .370 .430 7.87 9.40 10.92
Mold Draft Angle Top α5 10 15 5 10 15
β5 10 15 5 10 15
Mold Draft Angle Bottom
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-005
§ Significant Characteristic
2001 Microchip Technology Inc. DS00049R-page 18
Packaging Diagrams and Parameters
16-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
1510515105
β
Mold Draft Angle Bottom 1510515105
α
Mold Draft Angle Top 10.929.407.87.430.370.310eBOverall Row Spacing §0.560.46.036.022.018.014BLower Lead Wid th 1.781.461.14.070.058.045B1Upper Lead Width 0.380.290.20.015.012.008
c
Lead Thickness 3.433.303.18.135.130.125LTip to Seating Plane 19.3019.0518.80.760.750.740DOverall Length 6.606.356.10.260.250.240E1M old ed Pa ckag e Width 8.267.947.62.325.313.300EShoulder to Shoulder Width 0.38.015A1Base to Seating Plane 3.683.302.92.145.130.115A2Mold ed Packag e Thick ness 4.323.943.56.170.155.140ATop to Seating Plane 2.54.100
p
Pitch 1616
n
Number of Pins MAXNOMMINMAXNOMMINDimension Limits MILLIMETERSINCHES*Units
2
1
D
n
E1
c
β
eB
E
α
p
L
A2
B
B1
A
A1
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-017
§ Significant Characteristic
DS00049R-page 19 2001 Microchip Technology Inc.
Packaging Diagrams and Parameters
18-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
1510515105
β
Mold Draft Angle Bottom 1510515105
α
Mold Draft Angle Top 10.929.407.87.430.370.310eBOverall Row Spacing §0.560.460.36.022.018.014BLower Le ad Width 1.781.461.14.070.058.045B1Upper Lead Width 0.380.290.20.015.012.008
c
Lead Thickness 3.433.303.18.135.130.125LTip to Seating Plane 22.9922.8022.61.905.898.890DOverall Length 6.606.356.10.260.250.240E1M old ed Pa ckag e Width 8.267.947.62.325.313.300EShoulder to Shoulder Width 0.38.015A1Base to Seating Plane 3.683.302.92.145.130.115A2Mold ed Packag e Thick ness 4.323.943.56.170.155.140ATop to Seating Plane 2.54.100
p
Pitch 1818
n
Number of Pins MAXNOMMINMAXNOMMINDimension Limits MILLIMETERSINCHES*Units
1
2
D
n
E1
c
eB
β
E
α
p
A2
L
B1
B
A
A1
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-007
§ Significant Characteristic
2001 Microchip Technology Inc. DS00049R-page 20
Packaging Diagrams and Parameters
20-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
1510515105
β
Mold Draft Angle Bottom 1510515105
α
Mold Draft Angle Top 10.929.407.87.430.370.310eBOverall Row Spacing §0.560.460.36.022.018.014BLower Le ad Width 1.651.521.40.065.060.055B1Upper Lead Width 0.380.290.20.015.012.008
c
Lead Thickness 3.563.303.05.140.130.120LTip to Seating Plane 26.4226.2426.041.0401.0331.025DOverall Length 6.606.356.10.260.250.240E1M old ed Pa ckag e Width 8.267.877.49.325.310.295EShoulder to Shoulder Width 0.38.015A1Base to Seating Plane 3.683.302.92.145.130.115A2M ol d ed Packag e Thickness 4.323.943.56.170.155.140ATop to Seating Plane 2.54.100
p
Pitch 2020
n
Number of Pins MAXNOMMINMAXNOMMINDimension Limits MILLIMETERSINCHES*Units
1
2
D
n
E1
c
β
eB
E
α
p
A2
L
B1
B
A
A1
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-019
§ Significant Characteristic
DS00049R-page 21 2001 Microchip Technology Inc.
Packaging Diagrams and Parameters
24-Lead Plastic Dual In-line (P) – 600 mil (PDIP)
1510515105
β
Mold Draft Angle Bottom 1510515105
α
Mold Draft Angle Top 17.2716.5115.75.680.650.620eBOverall Row Spacing §0.560.460.36.022.018.014BLower Lead Width 1.781.270.76.070.050.030B1Upper Lead Width 0.380.290.20.015.012.008
c
Lead Thickness 3.433.303.05.135.130.120LTip to Seating Plane 31.8831.7531.621.2551.2501.245DOverall Length 14.2213.8413.46.560.545.530E1M old ed Packag e Width 15.8815.2415.11.625.600.595EShoulder to Shoulder Width 0.38.015A1Base to Seating Plane 4.063.813.56.160.150.140A2M old ed Packag e Thickness 4.834.454.06.190.175.160ATop to Seating Plane 2.54.100
p
Pitch 2424
n
Number of Pins MAXNOMMINMAXNOMMINDimension Limits MILLIMETERSINCHES*Units
c
β
eB
E
2
1
D
n
E1
α
p
L
A2
B
A
A1 B1
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-011
Drawing No. C04-081
§ Significant Characteristic
2001 Microchip Technology Inc. DS00049R-page 22
Packaging Diagrams and Parameters
24-Lead Skinny Plastic Dual In-line (SP) – 300 mil (PDIP)
1510515105
β
Mold Draft Angle Bottom 1510515105
α
Mold Draft Angle Top 10.929.407.87.430.370.310eBOverall Row Spacing §0.560.460.36.022.018.014BLower Le ad Width 1.521.331.14.060.053.045B1Upper Lead Width 0.380.290.20.015.012.008
c
Lead Thickness 3.303.183.05.130.125.120LTip to Seating Plane 31.8831.7531.621.2551.2501.245DOverall Length 6.606.356.10.260.250.240E1M old ed Pa ckag e Width 8.267.877.49.325.310.295EShoulder to Shoulder Width 0.38.015
A1
Base to Seating Plane 3.683.302.92.145.130.115A2Mold ed Pa ckag e Thick ness 4.063.813.56.160.150.140ATop to Seating Plane 2.54.100
p
Pitch 2424
n
Number of Pins MAXNOMMINMAXNOMMINDimension Limits MILLIMETERSINCHES*Units
A2
2
1
D
n
E1
c
eB
E
β
α
p
L
B
B1
A
A1
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-001
Drawing No. C04-043
§ Significant Characteristic
DS00049R-page 23 2001 Microchip Technology Inc.
Packaging Diagrams and Parameters
28-Lead Skinny Plastic Dual In-line (SP) – 300 mil (PDIP)
1510515105
β
Mold Draft Angle Bottom 1510515105
α
Mold Draft Angle Top 10.928.898.13.430.350.320eBOverall Row Spacing §0.560.480.41.022.019.016BLower Lead Width 1.651.331.02.065.053.040B1Upper Lead Width 0.380.290.20.015.012.008
c
Lead Thickness 3.433.303.18.135.130.125LTip to Seating Plane 35.1834.6734.161.3851.3651.345DOverall Len gth 7.497.246.99.295.285.275E1Molded Package Width 8.267.877.62.325.310.300EShoulder to Should er Width 0.38.015A1Base to Seating Plane 3.433.303.18.135.130.125
A2
Molded Package Th ickness 4.063.813.56.160.150.140ATop to Seating Plane 2.54.100
p
Pitch 2828
n
Number of Pins MAXNOMMINMAXNOMMINDimen sion Li mits MILLIMETERSINCHES*Units
2
1
D
n
E1
c
eB
β
E
α
p
L
A2
B
B1
A
A1
Notes:
JEDEC Equivalent: MO-095
Drawing No. C04-070
* Controlling Parameter
Dimension D and E1 do not incl ude mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254 mm ) per s ide.
§ Significant Characteristic
2001 Microchip Technology Inc. DS00049R-page 24
Packaging Diagrams and Parameters
28-Lead Plastic Dual In-line (P) – 600 mil (PDIP)
1510515105
β
Mold Draft Angle Bottom 1510515105
α
Mold Draft Angle Top 17.2716.5115.75.680.650.620
eB
Overall Row Spacing §0.560.460.36.022.018.014BLower Lead Width 1.781.270.76.070.050.030B1Upper Lead Width 0.380.290.20.015.012.008
c
Lead Thickness 3.433.303.05.135.130.120LTip to Seating Plane 37.2136.3235.431.4651.4301.395DOvera ll Length 14.2213.8412.83.560.545.505E1Molded Package Width 15.8815.2415.11.625.600.595EShoulder t o Shoulder Width 0.38.015A1Base to Seating Plane 4.063.813.56.160.150.140A2Molded Package Thickness 4.834.454.06.190.175.160ATop to Seating Plane 2.54.100
p
Pitch 2828
n
Number of Pins MAXNOMMINMAXNOMMINDimension Li mits MILLIMETERSINCHES*Units
2
1
D
n
E1
c
β
eB
E
α
p
L
A2
B
A1
A
B1
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-011
Drawing No. C04-079
§ Significant Characteristic
DS00049R-page 25 2001 Microchip Technology Inc.
Packaging Diagrams and Parameters
40-Lead Plastic Dual In-line (P) – 600 mil (PDIP)
1510515105
β
Mold Draft Angle Bottom 1510515105
α
Mold Draft Angle Top 17.2716.5115.75.680.650.620eBOverall Row Spacing §0.560.460.36.022.018.014BLo w er Lea d Width 1.781.270.76.070.050.030B1Upp er Lea d Width 0.380.290.20.015.012.008
c
Lead Thic kness 3.433.303.05.135.130.120LTip to Seating Plane 52.4552.2651.942.0652.0582.045DOverall Lengt h 14.2213.8413.46.560.545.530E1Molded Package Width 15.8815.2415.11.625.600.595EShoulder to Shoulder Width 0.38.015A1Base to Seating Plane 4.063.813.56.160.150.140A2Molded Package Thickness 4.834.454.06.190.175.160ATop to Seating Plane 2.54.100
p
Pitch 4040
n
Number of Pins MAXNOMMINMAXNOMMINDimension Limits MILLIMETERSINCHES*Units
A2
1
2
D
n
E1
c
β
eB
E
α
p
L
B
B1
A
A1
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-011
Drawing No. C04-016
§ Significant Characteristic
2001 Microchip Technology Inc. DS00049R-page 26
Packaging Diagrams and Parameters
64-Lead Shrink Plastic Dual In-line (SP) – 750 mil (PDIP)
1510515105
β
Mold Draft Angle Bottom 1510515105
α
Mold Draft Angle Top 20.3219.8119.30.800.780.760
eB
Overall Row Spacing §0.560.470.38.022.019.015BLower Lead Wid th 1.271.020.76.050.040.030B1Upper Lead Width 0.300.250.20.012.010.008
c
Lead Thickness 3.433.243.05.135.128.120LTip to Seating Plane 57.9157.6657.402.2802.2702.260DOverall Length 17.2717.0216.76.680.670.660E1Molded Pa ckag e Width 19.6919.3019.05.775.760.750EShoulder to Shoulder Width 0.51.020A1Base to Seating Plane 4.574.253.94.180.168.155
A2
Molded Pa ckag e Thick ness 5.084.764.45.200.188.175ATop to Seating Plane 1.78.070
p
Pitch 6464
n
Number of Pins MAXNOMMINMAXNOMMINDimension Limits MILLIMETERSINCHES*Units
A2
c
β
eB
E
1
2
D
n
E1
α
pL
B1
B
A
A1
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-021
Drawing No. C04-090
§ Significant Characteristic
DS00049R-page 27 2001 Microchip Technology Inc.
Packaging Diagrams and Parameters
20-Lead Plastic Leaded Chip Carrier (L) –Square (PLCC)
10501050
β
Mold Draft Angle Bottom 10501050
α
Mold Draft Angle Top 0.530.510.33.021.020.013BLower Lead Width 0.810.740.66.032.029.026
B1
Upper Lead Width 0.330.270.20.013.011.008
c
Lead Thickness
55n1P ins p er Side
8.597.877.16.338.310.282D2Footp rint Len gth 8.597.877.16.338.310.282
E2
Footp rin t W idth 9.048.978.89.356.353.350D1Molded Package Length 9.048.978.89.356.353.350E1Molded Package Width 10.039.919.78.395.390.385DOverall Length 10.039.919.78.395.390.385EOverall Width 0.510.380.25.020.015.010CH2Corner Chamfer (others) 1.271.141.02.050.045.040CH1Corner Chamfer 1 1.421.241.07.056.049.042A3Side 1 Chamfer Heig ht 0.51.020A1Standoff §4.063.873.68.160.153.145A2Molded Package Thickness 4.574.394.19.180.173.165AOverall Height
1.27.050
p
Pitch 2020
n
Number of Pins MAXNOMMINMAXNOMMINDimension Limits MILLIMETERSINCHES*Units
β
A2
cE2
2
D
D1
n
#leads=n1
E
E1
1
α
A3
A
B1
35°
B
p
D2
CH1 x 45°
A1
.028 .035 0.71 0.89
CH2 x 45°
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254 mm ) per si de.
JEDEC Equivalent: MO-047
Drawing No. C04-064
§ Significant Characteristic
2001 Microchip Technology Inc. DS00049R-page 28
Packaging Diagrams and Parameters
28-Lead Plastic Leaded Chip Carrier (L) –Square (PLCC)
10501050
β
Mold Draft Angle Bottom 10501050
α
Mold Draft Angle Top 0.530.510.33.021.020.013BLower Lead Width 0.810.740.66.032.029.026B1Upper Lead Width 0.330.270.20.013.011.008
c
Lead Thickness
77n1Pins per Side
10.9210.6710.41.430.420.410D2Footprint Length 10.9210.6710.41.430.420.410E2Footprint Width 11.5811.5111.43.456.453.450D1Molded Package Length 11.5811.5111.43.456.453.450E1Molded Package Width 12.5712.4512.32.495.490.485DOve ra l l Length 12.5712.4512.32.495.490.485EOverall Width 0.250.130.00.010.005.000CH2Corner Chamfer (others) 1.401.140.89.055.045.035CH1Corner Chamfer 1 0.790.660.53.031.026.021A3Side 1 Chamfer Height 0.51.020A1Standoff §4.063.873.68A2Molded Package Thickness 4.574.394.19.180.173.165AOverall Height
1.27.050
p
Pitch 2828
n
Number of Pins MAXNOMMINMAXNOMMINDimension Li m its MILLIMETERSINCHES*Units
A2
c
E2
2
DD1
n
#leads=n1
E
E1
1
A3
A
B1
32°
B
p
D2
CH1 x 45°CH2 x 45°
β
α
A1
.145 .153 .160
.028 .035 0.71 0.89
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-047
Drawing No. C04-026
§ Significant Characteristic
DS00049R-page 29 2001 Microchip Technology Inc.
Packaging Diagrams and Parameters
32-Lead Plastic Leaded Chip Carrier (L) – Rectangle (PLCC)
α
β
CH2 x 45°CH1 x 45°
10501050
β
Mold Draft Angle Bottom 10501050
α
Mold Draft Angle Top 0.530.430.33.021.017.013BLower Lead Width 0.810.740.66.032.029.026B1Upper Lead Width 0.330.250.20.013.010.008
c
Lead Thickness
99n2Pins along Length 77n1Pins along Width
13.7212.9512.19.540.510.480D2Footprint Length 11.1810.419.65.440.410.380E2Footprint Width 14.0513.9713.89.553.550.547D1Molded Package Length 11.5111.4311.35.453.450.447E1Mold ed Package Width 15.1114.9914.86.595.590.585DOverall Length 12.5712.4512.32.495.490.485EOverall Width 0.250.130.00.010.005.000CH2Corner Chamfer (others) 1.401.140.89.055.045.035CH1Corner Chamfer 1 0.790.660.53.031.026.021
A3
Side 1 Chamfer Height 0.51.020A1Standoff §A2Molded Package Thickness 3.563.373.18.140.133.125AOverall Height
1.27.050
p
Pitch 3232
n
Numb er of Pins MAXNOMMINMAXNOMMINDimension Limits MILLIMETERSINCHES*Units
A2
c
E2
2
DD1
n
#leads=n1
E
E1
1
A3
A1
A
B1
32°
Bp
D2
.105 .113 .120 2.67 2.87 3.05
.028 .035 0.71 0.89
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-016
Drawing No. C04-023
§ Significant Characteristic
2001 Microchip Technology Inc. DS00049R-page 30
Packaging Diagrams and Parameters
44-Lead Plastic Leaded Chip Carrier (L) – Square (PLCC)
CH2 x 45°CH1 x 45°
10501050
β
Mold Draft Angle Bottom 10501050
α
Mold Draft Angle Top 0.530.510.33.021.020.013B0.810.740.66.032.029.026B1Upper Lead Width 0.330.270.20.013.011.008
c
Lead Thickness
1111n1Pins per Side
16.0015.7514.99.630.620.590D2Footprint Length 16.0015.7514.99.630.620.590E2Footprint Width 16.6616.5916.51.656.653.650D1Molded Package Length 16.6616.5916.51.656.653.650E1Molded Package Width 17.6517.5317.40.695.690.685DOverall Length 17.6517.5317.40.695.690.685EOverall Width 0.250.130.00.010.005.000CH2Corner Chamfer (others) 1.271.141.02.050.045.040CH1Corner Chamfer 1 0.860.740.61.034.029.024A3Side 1 Chamfer Height 0.51.020A1Standoff §A2Molded Package Thickness 4.574.394.19.180.173.165AOverall Height
1.27.050
p
Pitch 4444
n
Number of Pins MAXNOMMINMAXNOMMINDime nsion Limits MILLIMETERSINCHES*Units
β
A2
c
E2
2
D
D1
n
#leads=n1
E
E1
1
α
p
A3
A
35°
B1
B
D2
A1
.145 .153 .160 3.68 3.87 4.06
.028 .035 0.71 0.89
Lower Lead Width
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-047
Drawing No. C04-048
§ Significant Characteristic
DS00049R-page 31 2001 Microchip Technology Inc.
Packaging Diagrams and Parameters
68-Lead Plastic Leaded Chip Carrier (L) –Square (PLCC)
10501050
β
Mold Draft Angle Bottom 10501050
α
Mold Draft Angle Top 0.530.510.33.021.020.013BLower Lead Width 0.810.740.66.032.029.026B1Upper Lead Width 0.330.270.20.013.011.008
c
Lead Thickness
1717n1Pi ns per Side
23.6223.3722.61.930.920.890D2Footprint Length 23.6223.3722.61.930.920.890E2Footprint Width 24.3324.2324.13.958.954.950D1Molded Package Length 24.3324.2324.13.958.954.950E1Molded Package Width 25.2725.1525.02.995.990.985DOverall Length 25.2725.1525.02.995.990.985EOverall Width 0.250.130.00.010.005.000CH2Corner Chamfer (others) 1.271.141.02.050.045.040CH1Corner Chamfer 1 0.860.740.61.034.029.024A3Side 1 Chamfer Height 0.51.020A1Standoff §A2Molded Package Thickness 4.574.394.19.180.173.165AOverall Height
1.27.050
p
Pitch 68
n
Number of Pins MAXNOMMINMAXNOMMINDimension Limits MILLIMETERSINCHES*Units
β
A2
c
E2
2
DD1
n
#leads=n1
E
E1
1α
p
B
A3
A
B1
32°
D2
68
A1
.145 .153 .160 3.68 3.87 4.06
.028 .035 0.71 0.89
CH1 x 45 °
CH2 x 45°
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-047
Drawing No. C04-049
§ Significant Characteristic
2001 Microchip Technology Inc. DS00049R-page 32
Packaging Diagrams and Parameters
84-Lead Plastic Leaded Chip Carrier (L) –Square (PLCC)
10501050
β
Mold Draft Angle Bottom 10501050
α
Mold Draft Angle Top 0.530.510.33.021.020.013BLower Lead Width 0.810.740.66.032.029.026B1Upper Lead Width 0.330.270.20.013.011.008
c
Lead Thickness
1721n1Pins per Side
28.7028.1927.691.1301.1101.090D2Footprint Length 28.7028.1927.691.1301.1101.090E2Footprint Width 29.4129.3129.211.1581.1541.150D1Molded Package Length 29.4129.3129.211.1581.1541.150E1Molded Package Width 30.3530.2330.101.1951.1901.185DOverall Length 30.3530.2330.101.1951.1901.185EOverall Width 0.510.380.25.020.015.010CH2Corner Chamfer (others) 1.271.141.02.050.045.040CH1Corner Chamfer 1 1.271.141.02.050.045.040A3Side 1 Chamfer Height 0.51.020A1Standoff §A2Molded Package Thickness 4.574.394.19.180.173.165AOverall Height
1.27.050
p
Pitch 68
n
Number of Pins MAXNOMMINMAXNOMMINDimension Li mits MILLIMETERSINCHES*Units
β
A2
c
E2
2
DD1
n
#leads=n1
E
E1
1α
p
B
A3
A
B1
45°
D2
84
A1
.145 .153 .160 3.68 3.87 4.06
.028 .035 0.71 0.89
CH1 x 45°CH2 x 45°
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-047
Drawing No. C04-093
§ Significant Characteristic
DS00049R-page 33 2001 Microchip Technology Inc.
Packaging Diagrams and Parameters
8-Lead Plastic Small Outline (SN) –Narrow, 150 mil (SOIC)
Foot A ngle φ048048
1512015120
β
Mold Draft Angle Bottom 1512015120
α
Mold Draft Angle Top 0.510.420.33.020.017.013BLead Width 0.250.230.20.010.009.008
c
Lead Thickness
0.760.620.48.030.025.019LFoot Length 0.510.380.25.020.015.010hChamfer Distance 5.004.904.80.197.193.189DOverall Length 3.993.913.71.157.154.146E1M old ed Pa ckag e Width 6.206.025.79.244.237.228EOverall Width 0.250.180.10.010.007.004A1Standoff §1.551.421.32.061.056.052A2M old ed Packag e Thickness 1.751.551.35.069.061.053AOverall Height 1.27.050
p
Pitch 88
n
Numb er of Pin s MAXNOMMINMAXNOMMINDimension Limits MILLIMETERSINCHES*Units
2
1
D
n
p
B
E
E1
h
L
β
c
45°
φ
A2
α
A
A1
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
§ Significant Characteristic
2001 Microchip Technology Inc. DS00049R-page 34
Packaging Diagrams and Parameters
14-Lead Plastic Small Outline (SL) –Narrow, 150 mil (SOIC)
Foot A ngle φ048048
1512015120
β
Mold Draft Angle Bottom 1512015120
α
Mold Draft Angle Top 0.510.420.36.020.017.014BLead Width 0.250.230.20.010.009.008
c
Lead Thickness
1.270.840.41.050.033.016LFoot Length 0.510.380.25.020.015.010hChamfer Distance 8.818.698.56.347.342.337DOverall Length 3.993.903.81.157.154.150E1M old ed Pa ckag e Width 6.205.995.79.244.236.228EOverall Width 0.250.180.10.010.007.004A1Standoff §1.551.421.32.061.056.052A2M ol d ed Packag e Thickness 1.751.551.35.069.061.053AOverall Height 1.27.050
p
Pitch 1414
n
Number of Pins MAXNOMMINMAXNOMMINDimension Limits MILLIMETERSINCHES*Units
2
1
D
p
n
B
E
E1
h
L
c
β
45°
φ
α
A2
A
A1
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-065
§ Significant Characteristic
DS00049R-page 35 2001 Microchip Technology Inc.
Packaging Diagrams and Parameters
16-Lead Plastic Small Outline (SL) –Narrow 150 mil (SOIC)
Foot Angle φ048048
1512015120
β
Mold Draft Angle Bottom 1512015120
α
Mold Draft Angle Top 0.510.420.33.020.017.013BLead Width 0.250.230.20.010.009.008
c
Lead Thickness
1.270.840.41.050.033.016LFoot Length 0.510.380.25.020.015.010hCh amfer Distance 10.019.919.80.394.390.386DOverall Length 3.993.903.81.157.154.150E1Molded Package Width 6.206.025.79.244.237.228EOverall Width 0.250.180.10.010.007.004A1Standoff §1.551.441.32.061.057.052A2Molded Package Thickness 1.751.551.35.069.061.053AOverall Height 1.27.050
p
Pitch 1616
n
Number of Pins MAXNOMMINMAXNOMMINDimension Limits MILLIMETERSINCHES*Units
α
A2
E1
1
2
L
h
n
B
45°
E
p
D
φ
β
c
A1
A
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-108
§ Significant Characteristic
2001 Microchip Technology Inc. DS00049R-page 36
Packaging Diagrams and Parameters
8-Lead Plastic Small Outline (SM) – Medium, 208 mil (SOIC)
Foot A ngle φ048048
1512015120
β
Mold Draft Angle Bottom 1512015120
α
Mold Draft Angle Top 0.510.430.36.020.017.014BLead W idth 0.250.230.20.010.009.008
c
Lead Thickness
0.760.640.51.030.025.020LFoot Length 5.335.215.13.210.205.202DOverall Length 5.385.285.11.212.208.201E1M old ed Packag e Width 8.267.957.62.325.313.300EOverall Width 0.250.130.05.010.005.002A1Standoff §1.98.078
A2
Molded Pa ckag e Thick ness 2.03.080AOverall Height 1.27.050
p
Pitch 88
n
Number of Pins MAXNOMMINMAXNOMMINDimension Limits MILLIMETERSINCHES*Units
α
A2
A
A1
L
c
β
φ
2
1
D
n
p
B
E
E1
.070 .075
.069 .074 1.78
1.75 1.97
1.88
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
Drawing No. C04-056
§ Significant Characteristic
DS00049R-page 37 2001 Microchip Technology Inc.
Packaging Diagrams and Parameters
16-Lead Plastic Small Outline (SO) – Wide, 300 mil (SOIC)
Foot Angle φ048048
1512015120
β
Mold Draft Angle Bottom 1512015120
α
Mold Draft Angle Top 0.510.420.36.020.017.014BLead Width 0.330.280.23.013.011.009
c
Lead Thickness
1.270.840.41.050.033.016LFoot Length 0.740.500.25.029.020.010hChamfer Distance 10.4910.3010.10.413.406.398DOve ra ll Length 7.597.497.39.299.295.291E1Molded Package Width 10.6710.3410.01.420.407.394EOverall Width 0.300.200.10.012.008.004A1Standoff §2.392.312.24.094.091.088A2Molded Package Thickness 2.642.502.36.104.099.093AOverall Height 1.27.050
p
Pitch 1616
n
Number of Pins MAXNOMMINMAXNOMMINDimension Li mits MILLIMETERSINCHES*Units
L
β
c
φ
h
45°
1
2
D
p
n
B
E1
E
α
A2
A1
A
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-013
Drawing No. C04-102
§ Significant Characteristic
2001 Microchip Technology Inc. DS00049R-page 38
Packaging Diagrams and Parameters
18-Lead Plastic Small Outline (SO) – Wide, 300 mil (SOIC)
Foot A ngle φ048048
1512015120
β
Mold Draft Angle Bottom 1512015120
α
Mold Draft Angle Top 0.510.420.36.020.017.014BLead Width 0.300.270.23.012.011.009
c
Lead Thickness
1.270.840.41.050.033.016LFoot Length 0.740.500.25.029.020.010hChamfer Distance 11.7311.5311.33.462.454.446DOverall Length 7.597.497.39.299.295.291E1Molded Pa ckag e Width 10.6710.3410.01.420.407.394EOverall Width 0.300.200.10.012.008.004A1Standoff §2.392.312.24.094.091.088
A2
Molded Pa ckag e Thick ness 2.642.502.36.104.099.093AOverall Height 1.27.050
p
Pitch 1818
n
Number of Pins MAXNOMMINMAXNOMMINDimension Limits MILLIMETERSINCHES*Units
L
β
c
φ
h
45°
1
2
D
p
n
B
E1
E
α
A2
A1
A
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-013
Drawing No. C04-051
§ Significant Characteristic
DS00049R-page 39 2001 Microchip Technology Inc.
Packaging Diagrams and Parameters
20-Lead Plastic Small Outline (SO) –Wide, 300 mil (SOIC)
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per s ide.
JEDEC Equivalent: MS-013
Drawing No. C04-094
Foot Angle φ048048
1512015120
β
Mold Draft Angle Bottom 1512015120
α
Mold Draft Angle Top 0.510.420.36.020.017.014BLead Width 0.330.280.23.013.011.009
c
Lead Thickness
1.270.840.41.050.033.016LFoot Length 0.740.500.25.029.020.010hChamfer Distance 13.0012.8012.60.512.504.496DOverall Length 7.597.497.39.299.295.291E1Molded Package Width 10.6710.3410.01.420.407.394EOverall Width 0.300.200.10.012.008.004A1Standoff §2.392.312.24.094.091.088A2Molded Package Thickn ess 2.642.502.36.104.099.093AOverall Height 1.27.050
p
Pitch 2020
n
Number of Pins MAXNOMMINMAXNOMMINDimen si on Limi ts MILLIMETERSINCHES*Units
h
L
c
β
45°
φ
1
2
D
p
n
B
E
E1
α
A2
A
A1
§ Significant Characteristic
2001 Microchip Technology Inc. DS00049R-page 40
Packaging Diagrams and Parameters
28-Lead Plastic Small Outline (SO) –Wide, 300 mil (SOIC)
Foot Angle Top φ048048
1512015120
β
Mold Draft Angle Bottom 1512015120
α
Mold Draft Angle Top 0.510.420.36.020.017.014BLead Width 0.330.280.23.013.011.009
c
Lead Thickness
1.270.840.41.050.033.016LFoot Length 0.740.500.25.029.020.010hChamfer Distance 18.0817.8717.65.712.704.695DOverall Length 7.597.497.32.299.295.288E1Molded Package Width 10.6710.3410.01.420.407.394EOverall Width 0.300.200.10.012.008.004A1Standoff §2.392.312.24.094.091.088A2Molded Package Thickness 2.642.502.36.104.099.093AOverall Height 1.27.050
p
Pitch 2828
n
Number of Pins MAXNOMMINMAXNOMMINDimension Limits MILLIMETERSINCHES*Units
2
1
D
p
n
B
E
E1
L
c
β
45°
h
φ
A2
α
A
A1
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-013
Drawing No. C04-052
§ Significant Characteristic
DS00049R-page 41 2001 Microchip Technology Inc.
Packaging Diagrams and Parameters
8-Lead Plastic Micro Leadframe Package (MF) 6x5 mm Body (MLF-S)
NOM
.050 BSC
INCHES
.194 BSC
.184 BSC
.226 BSC
.236 BSC
.008 REF.
DOveral l Width
JEDEC equivalent: pending
Notes:
Drawing No. C04-113
Molded Package Width
Lead Width
*Controlling Parameter
Mold Draft Angle Top
Tie Bar Width
Lead Length R
α
B
L
D1
.014
.020
Dimension Limits
Molded Package Thickness
Pitch
Overall Height
Overal l Length
Molded Package Length
Base Thickness
Standoff
Number of Pins
A3
E1
E
A2
A1
A
.000
Units
n
p
MIN
TOP VIEW
12
A2
A
5.99 BSC
.019
12
.030
.014
.016
.024 0.35
0.50 .356
0.40
0.60
5.74 BSC
12
0.47
0.75
MILLIMETERS*
.039
.002
.031
.026
.0004
.033
0.00
8MAX MIN
1.27 BSC
0.20 REF.
4.92 BSC
4.67 BSC
0.85
0.01
0.65 0.80
0.05
1.00
MAXNOM 8
BOTTOM VIEW
n
E
E1
PIN 1
p
B
Exposed Pa d Len gth E2
Exposed Pa d Wid th D2 .085 .091 .097 2.16 2.31 2.46
.152 .158 .163 3.85 4.00 4.15
EXPOSED
METAL
PADS
D2
E2
A1
A3
α
L
ID
D1 D
R
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
2001 Microchip Technology Inc. DS00049R-page 42
Packaging Diagrams and Parameters
8-Lead Plastic Micro Leadframe Package (MF) 6x5 mm Body (MLF-S)
Pad Width
*Controlling Parameter
Drawing No. C04-2113
B .014.016.0190.350.400.47
Pitch MAX
Units
Dimension Limits
p
INCHES
.050 BSC
MIN NOM MAX
MILLIMETERS*
MIN 1.27 BSC
NOM
Pad Length
Pad to Solder Mask L .020.024.0300.500.600.75
M.005 .0060.13 0.15
L
M
M
B
SOLDER
MASK
p
PACKAGE
EDGE
DS00049R-page 43 2001 Microchip Technology Inc.
Packaging Diagrams and Parameters
28-Lead Plastic Micro Leadframe Package (MF) 6x6 mm Body (MLF)
Lead Width
*Con tro ll ing Pa ra me ter
Notes:
Mold Draft Angle Top
B
α
.009
12
.011 .014 0.23
12
0.28 0.35
D
Pitch
Number of Pins
Overall Width
Standoff
Molded Package Length
Overal l Length
Molded Package Width
Molded Package Thickness
Overall Height
MAX
Units
Dimension Limits
A2
A1
E1
D
D1
E
n
p
A.026
.236 BSC
.000
.226 BSC
INCHES
.026 BSC
MIN 28
NOM MAX
0.65
.031
.002 0.00
6.00 BSC
5.75 BSC
MILLIMETERS*
.039
MIN 28
0.65 BSC
NOM
0.80
0.05
1.00
E
E1
n
1
2
D1
A
A2
EXPOSED
METAL
PADS
BOTTOM VIEW
.008 REF.Base Thickness A3 0.20 REF.
TOP VI EW
0.85.033
.0004 0.01
.236 BSC
.226 BSC 6.00 BSC
5.75 BSC
Q
L
Lead Length
Tie Bar Width L .020.024.0300.500.600.75
R .005.007.0100.130.170.23
T ie Bar Length Q.012 .016 .026 0.30 0.40 0.65
Chamfer CH .009.017.0240.240.420.60
R
p
A1
A3
α
CH x 45
B
D2
E2
E2
D2
Exposed Pa d Width
Exposed Pa d Len gth .140 .146 .152 3.55 3.70 3.85
.140 .146 .152 3.55 3.70 3.85
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC equivalent: pending
Drawing No. C04-114
2001 Microchip Technology Inc. DS00049R-page 44
Packaging Diagrams and Parameters
28-Lead Plastic Micro Leadframe Package (MF) 6x6 mm Body (MLF)
Pad Width
*Controlling Parameter
Drawing No. C04-2114
B .009 .011 .014 0.23 0.28 0.35
Pitch MAX
Units
Dimension Limits
p
INCHES
.026 BSC
MIN NOM MAX
MILLIMETERS*
MIN 0.65 BSC
NOM
Pad Length
Pad to Sol der Mask L .020 .024 .030 0.50 0.60 0.75
M .005 .006 0.13 0.15
L
p
M
M B
PACKAGE
EDGE
SOLDER
MASK
DS00049R-page 45 2001 Microchip Technology Inc.
Packaging Diagrams and Parameters
8-Lead Plastic Micro Small Outline Package (MS) (MSOP)
p
A
A1
A2
D
L
c
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
.037.035FFootprint (Reference)
exceed .010" (0.254mm) per side.
Notes:
Drawing No. C04-111
*Controlling Parameter
Mold Draft Angle Top
Mold Draft Angle Bottom
Foot A ngle
Lead Width
Lead Thickness
β
α
c
B
φ
7
7
.004
.010
0.006
.012
(F)
β
Dimension Limits
Overall Height
Molded Packag e Thickness
Molded Package Width
Overall Length
Foot Length
Standoff §
Overall Width
Numb er of Pin s
Pitch A
L
E1
D
A1
E
A2
.016
.114
.114 .022
.118
.118
.002
.030
.193
.034
MIN
p
n
Units
.026
NOM 8
INCHES
1.000.950.90.039
0.15
0.30
.008
.016
60.10
0.25
0
7
7
0.20
0.40
6
MILLIMETERS*
0.65
0.86
3.00
3.00
0.55
4.90
.044
.122
.028
.122
.038
.006
0.40
2.90
2.90
0.05
0.76
MINMAX NOM
1.18
0.70
3.10
3.10
0.15
0.97
MAX
8
α
E1
E
Bn 1
2
φ
§ Significant Characteristic
.184 .200 4.67 .5.08
2001 Microchip Technology Inc. DS00049R-page 46
Packaging Diagrams and Parameters
20-Lead Plastic Shrink Small Outline (SS) – 209 mil, 5.30 mm (SSOP)
10501050
β
Mold Draft Angle Bottom 10501050
α
Mold Draft Angle Top 0.380.320.25.015.013.010BLead Width 203.20101.600.00840
φ
Foot Angle 0.250.180.10.010.007.004
c
Lead Thickness 0.940.750.56.037.030.022LFoot Length 7.347.207.06.289.284.278DOverall Length 5.385.255.11.212.207.201E1Molded Package Width 8.187.857.59.322.309.299EOverall Width 0.250.150.05.010.006.002A1Standoff §1.831.731.63.072.068.064A2Molded Package Thickness 1.981.851.73.078.073.068AOverall Height 0.65.026
p
Pitch 2020
n
Number of Pins MAXNOMMINMAXNOMMINDimension Limits MILLIMETERSINCHES*Units
2
1
D
p
n
B
E
E1
L
c
β
φ
α
A2
A
A1
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-150
Drawing No. C04-072
§ Significant Characteristic
DS00049R-page 47 2001 Microchip Technology Inc.
Packaging Diagrams and Parameters
28-Lead Plastic Shrink Small Outline (SS) – 209 mil, 5.30 mm (SSOP)
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-150
Drawing No. C04-073
10501050Mold Draft Angle Bottom 10501050
α
Mold Draft Angle Top 0.380.320.25.015.013.010BLead Width 203.20101.600.00840
φ
Foot Angle 0.250.180.10.010.007.004
c
Lead Thickness 0.940.750.56.037.030.022LFoot Length 10.3410.2010.06.407.402.396DOverall Length 5.385.255.11.212.207.201E1Molded Package Width 8.107.857.59.319.309.299EOverall Width 0.250.150.05.010.006.002A1Standoff §1.831.731.63.072.068.064A2Molded Packa ge Thickn ess 1.981.851.73.078.073.068AOverall Height 0.65.026
p
Pitch 2828
n
Number of Pins MAXNOMMINMAXNOMMINDimen si on Limi ts MILLIMETERS*INCHESUnits
2
1
D
p
n
B
E1
E
L
β
c
φ
α
A2
A1
A
β
§ Significant Characteristic
2001 Microchip Technology Inc. DS00049R-page 48
Packaging Diagrams and Parameters
8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)
10501050
β
Mold Draft Angle Bottom 10501050
α
Mold Draft Angle Top 0.300.250.19.012.010.007BLead Width 0.200.150.09.008.006.004
c
Lead Thickness
0.700.600.50.028.024.020LFoot Length 3.103.002.90.122.118.114DMolded Package Length 4.504.404.30.177.173.169E1Mold ed Packag e Width 6.506.386.25.256.251.246EOverall Width 0.150.100.05.006.004.002
A1
Standoff §0.950.900.85.037.035.033A2M old ed Package Thickness 1.10.043AOverall Height 0.65.026
p
Pitch 88
n
Number of Pins MAXNOMMINMAXNOMMINDimension Limits MILLIMETERS*INCHESUnits
α
A2
A
A1
L
c
β
φ
1
2D
n
p
B
E
E1
Foot A ngle φ048048
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.005” (0.127mm) per s ide.
JEDEC Equivalent: MO-153
Drawing No. C04-086
§ Significant Characteristic
DS00049R-page 49 2001 Microchip Technology Inc.
Packaging Diagrams and Parameters
14-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)
840840
φ
Foot A ngle
10501050
β
Mold Draft Angle Bottom 10501050
α
Mold Draft Angle Top 0.300.250.19.012.010.007BLead Width 0.200.150.09.008.006.004
c
Lead Thickness
0.700.600.50.028.024.020LFoot Length 5.105.004.90.201.197.193DMolded Package Length 4.504.404.30.177.173.169E1M old ed Packag e Width 6.506.386.25.256.251.246EOverall Width 0.150.100.05.006.004.002A1Standoff §0.950.900.85.037.035.033
A2
Molded Pa ckag e Thick ness 1.10.043AOverall Height 0.65.026
p
Pitch 1414
n
Number of Pins MAXNOMMINMAXNOMMINDimension Limits MILLIMETERS*INCHESUnits
L
β
c
φ
2
1
D
n
B
p
E1
E
α
A2A1
A
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.005” (0.127mm) per side.
JEDEC Equivalent: MO-153
Drawing No. C04-087
§ Significant Characteristic
2001 Microchip Technology Inc. DS00049R-page 50
Packaging Diagrams and Parameters
20-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)
Foot A ngle φ048048
10501050
β
Mold Draft Angle Bottom 10501050
α
Mold Draft Angle Top 0.300.250.19.012.010.007BLead Width 0.200.150.09.008.006.004
c
Lead Thickness
0.700.600.50.028.024.020LFoot Length 6.606.506.40.260.256.252DMolded Package Length 4.504.404.30.177.173.169E1Mol d ed Packag e Width 6.506.386.25.256.251.246EOverall Width 0.150.100.05.006.004.002A1Standoff §0.950.900.85.037.035.033A2M old ed Pa ckag e Thick ness 1.10.043AOverall Height 0.65.026
p
Pitch 2020
n
Number of Pins MAXNOMMINMAXNOMMINDimension Limits MILLIMETERS*INCHESUnits
1
2
D
p
n
B
E1
E
L
β
c
φ
α
A2
A1
A
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.005” (0.127mm) per side.
JEDEC Equivalent: MO-153
Drawing No. C04-088
§ Significant Characteristic
DS00049R-page 51 2001 Microchip Technology Inc.
Packaging Diagrams and Parameters
28-Lead Plastic Thin Small Outline (TS) –5 x 20 mm (TSOP)
.020
A1
A
A2
α
φ
β
c
L
E
p
Bn
D
1
2
Units INCHES MILLIMETERS*
Dimension Limits MIN NOM MAX MIN NOM MAX
Number of Pins n28 28
Pitch p0.50
Overall Height A .051 1.30
Molded Pa ckag e Thick ness A2 .037 .039 .041 0.95 1. 00 1.05
Standoff §A1 .002 .006 .010 0.05 0.15 0.25
Overall Width E .780 .787 .795 19.80 20.00 20.20
Mold ed Packag e Width E 1 .720 .7 24 .72 8 18.30 1 8.4 0 18.50
Molded Pa ckag e Len gth D .307 .315 .323 7.80 8. 00 8.2 0
Foot Length L .020 .024 .028 0.50 0.60 0.70
Lead Thickness c.004 .006 .008 0.10 0.15 0.20
Lead Width B .006 .008 .010 0.15 0.20 0.25
Mold Draft Angle Top α0 5 10 0 5 10
Mold Draft Angle Bottom β0 5 10 0 5 10
840840
φ
Foot A ngle
3 x p
.039 .045 0.99 1.14
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.005” (0.127mm) per side.
EIAJ Equivalent: IC-74-2-3
Drawing No. C04-067
§ Significant Characteristic
E1
2001 Microchip Technology Inc. DS00049R-page 52
Packaging Diagrams and Parameters
28-Lead Plastic Very Small Outline (VS) – 8 x 13.4 mm (VSOP)
Foot A ngle φ035035
10501050
β
Mold Draft Angle Bottom 10501050
α
Mold Draft Angle Top 0.230.200.17.009.008.007BLead Width 0.160.150.14.006.006.006
c
Lead Thickness
0.700.500.30.028.020.012LFoot Length 8.108.007.90.319.315.311DMolded Package Length 11.9011.8011.70.469.465.461E1Mold ed Pa ckag e Width 13.6013.4013.20.535.528.520EOverall Width 0.05.002A1Standoff §1.051.000.95.041.039.037A2Mol d ed Packag e Thick ness 1.29.051AOverall Height 0.55.022
p
Pitch 2828
n
Number of Pins MAXNOMMINMAXNOMMINDimension Limits MILLIMETERS*INCHESUnits
A2
α
A
A1
L
β
c
φ
12
nD
p
B
E
E1
.045
.005 .010
1.14
0.13 0.25
.039 0.99
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.005” (0.127mm) per side.
Drawing No. C04-075
§ Significant Characteristic
DS00049R-page 53 2001 Microchip Technology Inc.
Packaging Diagrams and Parameters
44-Lead Plastic Metric Quad Flatpack (PQ) 10x10x2 mm Body, 1.6/0.15 mm Lead Form (MQFP)
* Controlling Parameter
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-022
Drawing No. C04-071
B
D1
E
CH
1510515105
β
Mold Draft Angle Bottom 1510515105
α
Mold Draft Angle Top
0.450.380.30.018.015.012Lead Width 0.230.180.13.009.007.005
c
Lead Thickness
1111n1Pins per Side
10.1010.009.90.398.394.390Molded Package Length 10.1010.009.90.398.394.390E1Molded Package Width 13.4513.2012.95.530.520.510DOvera l l Length 13.4513.2012.95.530.520.510Overall Width 73.5073.50
φ
Foot Angle
1.030.880.73.041.035.029LFoot Length 0.250.150.05.010.006.002A1Standoff §2.102.031.95.083.080.077A2Molded Package Thickness 2.35.093AOverall Height
0.80.031
p
Pitch 4444
n
Number of Pins MAXNOMMINMAXNOMMINDi m en sion Limi ts MILLIMETERS*INCHESUnits
2
1
n
D1 D
B
p
E
E1
#leads=n1
c
βφ
α
A2
A
CH x 45°
L
Pin 1 Corner Chamfer
Footprint (Reference) (F) .063 1.60
.025 .035 .045 0.64 0.89 1.14
(F)
A1
.079 .086 2.00 2.18
§ Significant Characteristic
2001 Microchip Technology Inc. DS00049R-page 54
Packaging Diagrams and Parameters
44-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
* Controlling Parameter
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-026
Drawing No. C04-076
1.140.890.64.045.035.025CHPin 1 Corner Chamfer
1.00.039
(F)
Footprint (Reference)
(F)
A
A1 A2
α
E
E1
#leads=n1
p
B
D1 D
n
1
2
φ
c
βL
Units INCHES MILLIMETERS*
Dim ension Limits MIN NOM MAX MIN NOM MAX
Numb er of Pin s n44 44
Pitch p.031 0.80
Overall Height A .039 .043 .047 1.00 1.10 1.20
Molded Package Thickness A2 .037 .039 .041 0.95 1.00 1.05
Standoff §A1 .002 .004 .006 0.05 0.10 0.15
Foot Length L .018 .024 .030 0.45 0.60 0.75
Foot A ngle φ03.5 7 03.5 7
Overall Width E .463 .472 .482 11.75 12.00 12.25
Overall Length D .463 .472 .482 11.75 12.00 12.25
Molded Package Width E1 .390 .394 .398 9.90 10.00 10.10
Molded Package Length D1 .390 .394 .398 9.90 10.00 10.10
Pins per Side n1 11 11
Lead Thickness c.004 .006 .008 0.09 0.15 0.20
Lead Width B .012 .015 .017 0.3 0 0.38 0.44
Mold Draft Angle Top α51015 51015
Mold Draft Angle Bottom β51015 51015
CH x 45°
§ Significant Characteristic
DS00049R-page 55 2001 Microchip Technology Inc.
Packaging Diagrams and Parameters
64-Lead Plastic Thin Quad Flatpack (PT) 10x10x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
* Controlling Parameter
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-026
Drawing No. C04-085
1510515105
β
Mold Draft Angle Bottom 1510515105
α
Mold Draft Angle Top
0.270.220.17.011.009.007BLead W idth 0.230.180.13.009.007.005
c
Lead Thic kness
1616n1Pins per Side
10.1010.009.90.398.394.390D1Molded Package Length 10.1010.009.90.398.394.390E1Molded Package Width 12.2512.0011.75.482.472.463DOver all Lengt h 12.2512.0011.75.482.472.463EOverall Width 73.5073.50
φ
Foot Angl e
0.750.600.45.030.024.018LFoot Length 0.250.150.05.010.006.002A1Standoff §1.051.000.95.041.039.037A2Molded Package Thickness 1.201.101.00.047.043.039AOverall Height
0.50.020
p
Pitch 6464
n
Number of Pins MAXNOMMINMAXNOMMINDimension Limi ts MILLIMETERS*INCHESUnits
c
2
1
n
DD1
B
p
#leads=n1
E1
E
A2
A1
A
L
CH x 45°
β
φ
α
(F)
Footprint (Reference) (F) .039 1.00
Pin 1 Corner Chamfer CH .025 .035 .045 0.64 0.89 1.14
§ Significant Characteristic
2001 Microchip Technology Inc. DS00049R-page 56
Packaging Diagrams and Parameters
80-Lead Plastic Thin Quad Flatpack (PT) 12x12x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
* Controlling Parameter
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-026
Drawing No. C04-092
1.101.00.043.039
1.140.890.64.045.035.025CHPin 1 Corner Chamfer
1.00.039
(F)
Footprint (Reference)
(F)
E
E1
#leads=n1
p
B
D1 D
n
1
2
φ
c
βL
A
A1 A2
α
Units INCHES MILLIMETERS*
Dimen sion Li mits MIN NOM MAX MI N NOM MAX
Number of Pins n80 80
Pitch p.020 0.50
Overall Height A .047 1.20
Molded Package Thickness A2 .037 .039 .041 0.95 1.00 1.05
Standoff §A1 .002 .004 .006 0.05 0.10 0.15
Foot Length L .018 .024 .030 0.45 0.60 0.75
Foot Angle φ03.5 7 03.5 7
Overall Width E .541 .551 .561 13.75 14.00 14.25
Overal l Length D . 541 .5 51 .561 13.75 14.00 1 4.2 5
Molded Package Width E1 .463 .472 .482 11.75 12.00 12.25
Molded Package Length D1 .463 .472 .482 11.75 12.00 12.25
Pins per Side n1 20 20
Lead Thickness c.004 .006 .008 0.09 0.15 0.20
Lead Width B .007 .009 .011 0.17 0.22 0.27
Mold Draft Angle Top α5 10 15 5 10 15
Mold Draft Angle Bottom β5 10 15 5 10 15
CH x 45°
§ Significant Characteristic
DS00049R-page 57 2001 Microchip Technology Inc.
Packaging Diagrams and Parameters
100-Lead Plastic Thin Quad Flatpack (PT) 14x14x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
.630 BSC
NOM
INCHES
.630 BSC
.551 BSC
.551 BSC
Overall Width
Overall Length
Foot Angle
Foo t Length
Pins per Side
Overall Height
Number of Pins
Lead Width
Drawing No. C04-110
Lead Thickness
Molded Package Thickness
*Controlling Parameter
JEDEC Equivalent: MS-026
Mold Draft Angle Bottom
Mold Dr aft Angle Top
Molded Package Width
Molded Package Length
Footpri nt (Ref ere nce )
Notes:
Pitch
Standoff §
11
β
Dimension Limits
α
B
D1
E1
c
φ
D
E
(F)
L
11
.007
.004
.018
0
MIN
A
A1
A2
n1
p
Units
n
.037
.002
2
n
1
12
1112 13
12
.009
3.5
.039
.024
.011
.008
13
.030
7
25
.020
.039
100
.041
.006
.047
MAX
16.00 BSC
16.00 BSC
14.00 BSC
14.00 BSC
0.17
0.09
11
0.45
0
0.22
12
1.00
0.60
3.5
MILLIMETERS*
0.95
0.05
MIN
0.50
1.00
25
NOM100
13
0.27
0.20
13
0.75
7
1.05
0.15
1.20
MAX
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254 mm) per side.
§ Significant Characteristic
E
E1
#leads=n1
p
B
D1 D
c
βLφ
(F)
A
A1 A2
α
2001 Microchip Technology Inc. DS00049R-page 58
PACKAGING
FIGURE 1: EMBOSSED CARRIER DIMENSIONS (8, 12,16, AND 24 mm TAPE ONLY)
TABLE 1: CARRIER TAPE/CAVITY DIMENSIONS
Top
Cover
Tape
K0
P
W
B0
A0
Case
Outline Package
Type
Carrier
Dimensions Cavity
Dimensions Output
Quantity
Units
Reel
Diamete r in
mm
W
mm P
mm A0
mm B0
mm K0
mm
SN SOIC .150”8L 12 8 6.4 5.2 2.1 3300 330
SO SOIC .300” 18L 24
24 12
16 10.9
11.1 13.3
12.0 3.0
2.8 1600
1100 330
330
SO SOIC .300”20L 24 12 10.9 13.3 3.0 1600 330
SO SOIC .300”28L 24
24 12
12 10.9
11.1 18.3
18.5 3.0
3.0 1600
1600 330
330
L PLCC 28L 24 16 13.0 13.0 4.9 750 330
L PLCC 32L 24 16 13.1 15.5 3.9 900 330
L PLCC 44L 32
32 24
24 18.0
18.0 18.0
18.0 4.9
5.0 500
500 330
L PLCC 68L 44 32 25.6 25.6 5.8 300 330
SM SOIC .208”8L 16 12 8.3 5.7 2.3 2100 330
SL SOIC .150”14L 16 8 6.5 9.5 2.1 2600 330
TS TSOP 28L/
32L 32 16 8.6 20.6 2.1 1500 330
SS SSOP 20L 16 12 8.4 7.7 2.5 1600 330
SS SSOP 28L 24 12 8.4 10.9 2.4 2100 330
PQ MQFP 44L 24 24 14.2 14.2 2.8 900 330
PT TQFP 44L/
64L 24 16 12.35 12.35 2.2 1200 330
VS VSOP 28L 24 12 8.7 13.9 2.1 2500 330
Product Ta pe and Reel Specifications
Packaging
DS00049R-page 59 2001 Microchip Technology Inc.
FIGURE 2: MECHANICAL POLARIZATION (PCC AND LCC DEVICES)
FIGURE 3: MECHANIC AL POLARIZATION (SOIC DEVICES)
1.0 DIMENSIONS AND
TOLERANCES
All component taping diagrams, dimensions, toler-
ances, and component positioning requirements are
those which are specified per EIA Standard EIA-481,
current revision.
For the 8-lead SOIC EIAJ Type II Package and 16 mm
Carrier Tape width, the component taping diagrams,
dimensions, tolerances, and component positioning
requirements are those which are specified per EIAJ
Standard RC-1009B, current revision.
Pin No. 1 to be
on Circular
Sprocket Hole Side
of Tape.
User Direction Feed
Note 1: Top view shown with cover t ap e remov ed .
2: Only single sprocket tape shown - polarization for double sprocket tape (32 mm and wider) is the
same as shown.
User Direction of Feed
Note 1: Top view shown with cover tape removed.
2: Only single sprocket tape shown – polarized for double sprocket tape (32 mm and wider) is the
same as shown.
2001 Microchip Technology Inc. DS00049R-page 60
PACKAGING
THERMAL CHARACTERISTICS
Characteristic Symbol Value Unit
Average Junction Temperature TJTA + (PD x Θja) °C
Ambient Temperatu re TAUser-determined °C
Total Power Dissi pation1 PDPINT + PI/OW
Device Internal Power Dissipation PINT IDD X VDD W
I/O Pin Power Dissipation PI/OUser-determined W
Thermal Characteristics
Packaging
DS00049R-page 61 2001 Microchip Technology Inc.
THERMAL RESISTANCE
Note 1: Approximate value, disregarding PI/O.
2: All ther mal resist ance va lues are estima ted and are depen dent on die and materials us ed. Variables includ e
die and leadfr ame paddle sizes. Relative values are taken in st ill air.
Item Leads Package Package Body ΘJc
(°C/W) ΘJa
(°C/W)
Package Thermal
Resistance(2)
8PDIP.300”41.2 84.6
14 PDIP .300”32.5 69.8
16 PDIP .300”34.1 69.9
18 PDIP .300”29.4 65.9
20 PDIP .300”28.1 62.4
24 PDIP .600”21 63
28 PDIP .600”31.4 59.1
28 SPDIP .300”29 60
40 PDIP .600”24.7 47.2
8SOIC.150”38.8 163
8SOIC.208”27.98 117.55
16 SOIC .300”24.8 89.6
18 SOIC .300”24.6 63.6
20 SOIC .300”24.2 85.2
28 SOIC .300”23.8 80.2
8MSOP.118”39.1 206.3
8 TSSOP 4.4mm 36.6 123.7
14 TSSOP 4.4mm 31.7 100.4
20 TSSOP 4.4mm 17 90.2
28 TSSOP 4.4mm 13.3 75.5
20 SSOP .209”32.2 108.1
28 SSOP .209”23.9 89.4
3 SOT23 110.12 336
5 SOT23 81 255.9
3 TO-92 66.3 131.9
20 PLCC 37.6 62.5
28 PLCC 25.4 50.4
32 PLCC 22.7 52.4
44 PLCC 20.6 45.4
68 PLCC 16.1 39.3
84 PLCC 11.4 35.8
44 TQFP 10x10x1mm 14.5 45.79
64 TQFP 10x10x1mm 24.4 76.6
80 TQFP 12x12x1mm 24.4 69.4
100 TQFP 14x14x1mm 24.4 50
44 MQFP 10x10x2mm 14.8 57.8
2001 Microchip Technology Inc. DS00049R-page 62
PACKAGING
INTRODUCTION
Microchip Technology Inc. devices are available in
wafer form and in die form. All products sold in die or
wafers have been characterized and qualified accord-
ing to the requirements of Microchip Technology Inc.
Specifications SPI-41014, “Characterization and Qual-
ification of Integrated Circuits,” and QCI-39000, “World-
wide Quality Conformance Requirements.”
PRODUCT INTEGRITY
Product supplied in die or wafer form are fully tested
and characterized. Die or Wafers are inspected to
Microchip Technology Inc. Specification, QCI-30014.
ORDERING INFORMATION
Die sales must be conducted by contacting your
Microchip Sales Office.
To order or obtain information (on pricing or delivery)
for a specific device, use one of the following part
numbers:
Devices in Waffle Pack
DEVICE_NUMBER/S
Devices in Wafer form
DEVICE_NUMBER/W
DEVICE_NUMBER/WF
where DEVICE_NUMBER is the device that you
require. The S specifies die in a waffle pack while a W
specif ies w a fer sa les , and WF s pec if ies s aw n wafer on
frames.
ELECTRICAL SPECIFICATIONS
The functional and electrical specifications of Microchi p
device s in die form are identic al to those o f a pack aged
version. Please refer to individual data sheets for
complete details.
QTP
Quick-Turnaround-Production (QTP) applies only to
EPROM and EEPROM microcontrollers.
With QTP devices, the program memory array is only
tested against the code provided. This method ensures
that the device will operate correctly as programmed,
but does not ensure that every progra m memory bit can
be programmed to ev ery stat e.
EPROM
EPROM devices are supplied as fully erased
programmable parts that are UV erasable and re-
programmable by the user (except for QTP and SQTP
devices).
EEPROM
EEPROM devic es may not be sup plied in a fu lly erased
state, but are re prog rammabl e by t he us er ( except for
QTP and SQTP devices).
ROM
ROM devices are supplied as fully programmed parts
(program memory only). These are not
reprogrammable by the user.
DIE MECHANICAL SPECIFICATIONS
Refer to the individual data sheet for these
specifications.
CAUTION
Some EEPROM devices use EPROM cells for
device configuration. Exposure to ultra-violet
light must be avoided. Exposure to ultra-violet
light ma y cause the de vice to opera te improper ly .
Extreme care is urged in the handling and
assembly of these products since they are
susceptible to damage from electro-static
discharge.
Note: Do not erase QTP devices and program
them with a different code.
Overview of Microchip Die/Wafer Su pp ort
Packaging
DS00049R-page 63 2001 Microchip Technology Inc.
BOND PAD COORDIN ATES
The die fig ures have a ssociat ed bond p ad coordin ates.
These coordinates assist in the attaching of the bond
wire to th e die . Al l th e dim en si ons o f th es e c oo rdin ate s
are in micrometers (µm) unless otherwise specified.
The origin for the coordinates is the center of the die,
as shown in Figure 1. Refer to the Microchip Die S pec-
ific ation sheet for openin gs and pitch.
FIGURE 1: DIE COORDINATE ORIGIN
The die is capable of thermosonic gold or ultrasonic
wire bon ding. Die meet the mi nimum condit ions of MIL-
STD 883, Method 2011 on “Bond S tren gth (Des tructive
Bond Pull Test)”. The Bond Pad metallization is silicon
doped al uminum.
SUBSTRATE BONDING
Substrate bonding may be required on certain product
familie s. For more in formation refer to the die spe cifica-
tion sheet.
SHIPPING OPTIONS
Die Form Shi pping
Microc hip pro duc t i n d ie form c an be s hi ppe d i n w a f fl e-
pack. The waffle pack has sufficient cavity area to
restrain the die, whil e maint ain ing their ori ent ation. Li nt
free paper inserts are placed over the waffle packs, and
each pack is secured with a plastic locking clip. Groups
of waf fle p acks are asse mbled in to set s for shi pment. A
label with lot number, quantity, and part number is
attached.
These waffle packs are hermetically sealed in bags.
Wafer Form
Product s may also be shipped in wafer form (see order-
ing information). W afers are shipped in a wafer tub. The
tub is padded with non-conductive foam. Lint free
paper inserts are placed around each wafer. A label
with lot number, quantity, and part number is attached.
Sawn Wafer on Frames
Products may also be shipped on wafer frames. W afers
are mounted on plastic frames and 100% sawn
through. Saw n wafer on fram es may be shipped in bulk
(25 wafers per carrier) or in a single wafer in a carrier.
A label with lot number, quantity, and part number is
attached w ith each shipment.
Stor age Procedures
Temperature and humidity grea tly affec t the storage li fe
of die. It is recommended that the die be used as soon
as possible after receipt.
Upon receipt, the sealed bags should be stored in a
cool and dry environment (25°C and 25% relative
humidi ty). In these con ditions, sealed bags have a shelf
life of 12 months. Temperatures or humidities greater
than these will reduce the storage life.
Once a bag containing waffle packs has been opened,
the devices should be assembled and encapsulated
within 48 hours (assuming, 25°C and 25% humidity).
Origin (0,0)
DIE
Bottom Left
(x,y) †Top Right
(x,y) †
† All dimensions in µm unless specified otherwise.
