ERM8 SERIES
(0.80 mm) .0315"
ERM8–060–05.0–L–DV–TR
ERM8–013–05.0–S–DV–DS–L–TR
ERM8–030–02.0–S–DV–TR
Hot Swap
option
Designed for Rugged
Micro pitch applications
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
(0.80)
.0315
(1.32)
.052
DIA
No. of Positions x
(0.80) .0315 + (6.00) .236
–L & –EGP = No. of Positions x
(0.80) .0315 + (9.00) .354
(1.07)
.042
02
01
B
A
(5.60)
.220
(3.20)
.126
(10.80)
.425
(3.25)
.128
(1.10)
.043
(5.60)
.220
(8.91)
.351
–L –EGP
RUGGED HIGH-SPEED HEADER
–DS
= Differential Pair
(–05.0 lead style only)
(–010, –013, –025, –049 Positions only)
–L
= Latching
(–05.0 & –09.0 lead styles only)
(Not available with –EGP option)
–EGP
= Extended Guide Post
(–05.0 lead style only)
(Not available with –L option)
–DSP
= Differential Pair
with Extended Guide Post
(–05.0 lead styles only)
(–013 & –025 Positions only)
–K
= (4.00 mm) .157" DIA
Polyimide Film Pick & Place Pad
–005, –010, –011,
–013, –020, –025,
–030, –035, –040, –049,
–050, –060, –070, –075,
–100
(Available with –09.0 lead style only)
(Not available with –L & –EGP option)
For complete specifications and
recommended PCB layouts see
www.samtec.com?ERM8
Insulator Material:
Black LCP
Terminal Material:
Phosphor Bronze
Plating:
Au or Sn over
50 µ" (1.27 µm) Ni
Current Rating:
2.2 A per per pin
(2 pins powered)
Operating Temp Range:
-55 °C to +125 °C
Voltage Rating:
225 VAC / 318 VDC
RoHS Compliant:
Ye s
For complete scope of
recognitions see
www.samtec.com/quality
FILE NO. E111594
Lead–Free Solderable:
Ye s
SMT Lead Coplanarity:
(0.10 mm) .004" max (005-030)
(0.12 mm) .005" max (040-060)*
(0.15 mm) .006" max (070-100)*
*(.004" stencil solutions
may be available; contact
IPG@samtec.com)
Notes:
Patented
Some lengths, styles and
options are non-standard,
non-returnable.
MATED HEIGHT*
ERM8
LEAD
STYLE
ERF8 LEAD STYLE
–05.0 –07.0 –09.0
–02.0 (7.00) .276 (9.00) .354 (11.00) .453
–05.0 (10.00) .394 (12.00) .472 (14.00) .551
–08.0 (13.00) .512 (15.00) .591 (17.00) .669
–09.0 (14.00) .551 (16.00) .629 (18.00) .709
*Processing conditions will affect mated height.
EXTENDED LIFE
PRODUCT
10 YEAR MFG
WITH 30 µ" GOLD
HIGH MATING
CYCLES
–TR
= Tape &
Reel
Packaging
(Not available
with 100
positions)
LEAD
STYLE A B
–02.0 (1.61) .063 (5.97) .235
–05.0 (4.61) .181 (8.91) .351
–08.0 (7.61) .300 (11.91) .469
–09.0 (8.61) .339 (12.91) .508
APPLICATIONS
STANDARD POS. PART NOs. SERIES
NEXUS5001™.
org POWER.org™
11 ASP-137968-01 ERM8-DV
17 ASP-137972-01 ERM8-DV
ARM/HSSTP 20 ASP-130365-01 ERM8-DV
NEXUS5001™.
org POWER.org™
23 ASP-130366-01 ERM8-DV
35 ASP-135020-01 ERM8-DV
SPECIFICATIONS
RECOGNITIONS
PROCESSING
F-219 (Rev 14MAR19)
POWER/SIGNAL
APPLICATION
Compatible with
UMPT/UMPS for flexible
two-piece power/signal solutions
HIGH-SPEED CHANNEL PERFORMANCE
ERM8/ERF8 @ 7 mm
Mated Stack Height
Rating based on Samtec
reference channel.
For full SI performance data visit
Samtec.com or contact SIG@samtec.com
(1.50 mm)
.059"
NOMINAL
WIPE
Board Mates:
ERF8
Cable Mates:
ERCD, ERDP
Specify
LEAD
STYLE
from
chart
ERM8 POSITIONS
PER ROW TR
PLATING
OPTION
OTHER
OPTION
LEAD
STYLE DV
–L
= 10 µ"
(0.25 µm)
Gold on
contact,
Matte Tin
on tail
–S
= 30 µ"
(0.76 µm)
Gold on
contact,
Matte Tin
on tail
