CONSUMER-II - STMicroelectronics

STPC® CONSUMER-II

X86 Core PC Compatible In formation Appliance System-on-Ch ip

Release 1.5 - January 29, 2002 1/93

Figure 0-1. Logic Diagram

■POWERFUL x86 PROCESSOR

■64-BIT SDRAM UMA CONTROLLER

■VGA & SVGA CRT CONTR OLLER

■135 MHz RAMDAC

■2D GRAPHICS ENGINE

■VIDEO INPUT PORT

■VIDE O PIPE LINE

- UP-SCALER

- VIDEO COLOUR SPACE CONVERTER

- CHROMA & COLOUR KEY SUPPORT

■TV O UT P U T

- THREE-LINE FLICKER FILTER

- ITU-R 601/656 SCAN CONVERTER

- NTSC / PAL COMPOSITE, RGB, S-VIDEO

■PCI MASTER / SLAVE / ARBITER

■ISA MASTER / SL AVE

■OPTI ONAL 1 6 - BIT LO CAL BU S INTERFACE

■EIDE CONTROLLER

■I²C INTERFACE

■IPC

- DMA CONTROLLER

- INTERRUPT CONTROLLER

- TIMER / COU NTERS

■POWER MANAGEMENT UNIT

■JTAG IEEE1149.1

DESCRIPTION

The STPC Co nsumer-II integrates a standard 5th

generation x86 core, a Synchronous DRAM

controller, a graphics subsystem, a video pipeline,

and support logic including PCI, ISA, and IDE

controllers to provide a single consumer

orientated PC compatible subsystem on a single

device.

The device is based on a tightly coupled Unified

Memory Architecture (UMA), sharing memory

between the CPU, the graphics and the video.

The STPC Consumer-II is packaged in a 388

Pla stic Ball Grid Array (PBGA).

PBGA388

STPC Consumer II

x86

Core

Host

I/F

SDRAM

CTRL

SVGA

VIP

PCI

m/s

CTR

PCI Bus

ISA

m/s

IPC PCI

m/s

ISA Bus

CRTC Cursor

Monitor

IDE

I/F

PMU

Video

Pipeline C Key

K Key

LUT

Local Bus

Encoder

TVO

JTAG

STPC® CONSUMER-II

2/93 Release 1.5 - Januar

29, 2002

■X86 Processor core

■Fully static 32-bit five-sta

e pipeline, x86

processo r fu lly PC compat i ble .

■Can access up to 4 GB of external memory.

■8 Kbyte unified instruction and data cache

with write back and write throu

h capability.

■Parallel processin

int e

ral floatin

point unit,

with automatic powe r down.

■Runs up to 100 MHz (x1) or 133 MHz (x2).

■Fu lly s tat ic de s i

n for dynamic clock control.

■Low power and syste m mana

ement modes.

■Optimized desi

n for 2.5 V operation.

■SDRAM Controller

■64-b it data bus.

■Up to 100 MHz SDRAM clock speed.

■Inte

rated system memory,

raphic frame

memory and video frame memory.

■Supp orts 2 MB up to 128 MB system

memory.

■Supp orts 16-, 64-, and 128-Mbi t SDRAMs.

■Supports 8, 16, 32, 64, and 128 MB DIMMs.

■Supp orts buffered, non buffered, and

istered DIMMs

■Four-line write buffers for CPU to SDRAM

and PCI to SDRAM cycles.

■Four-line read prefetch buffers for PCI

masters.

■Pro

ramm able latency

■Pro

ramm able timin

for SDRAM

parameters.

■Supports -8, -10, -12, -13, -15 memory parts

■Supp orts memory hole between 1 MB and

8 MB for PCI/ISA busses.

■2D Gra

hics Controller

■64-bit windows accelerator.

■Back war d co mp atib ility to SVG A sta ndards .

■Hardware acceleration for text, bitblts,

transparent blts and fills.

■Up to 64 x 64 bit

raphics hardware cursor .

■Up to 4MB lon

linear frame buffer.

■8-, 16-, 24- and 32-bit pi x els.

■Drivers availables for various OSes.

■CRT Controll er

■Inte

rated 135 MHz triple RAMDAC allowin

for 1280 x 1024 x 75 Hz display.

■Requires external frequency synthesizer and

reference sourc es.

■8-bit, 16-bit, 24-bit pixels.

■Interlaced or non-interlaced output .

■Requires no external frequency synthesizer .

■Requires only external reference source.

■Vide o In

ort

■Accepts video inputs in ITU-R 601 mode.

■Optional 2: 1 decim ator

■Stores captured video in off s ettin

area of

the onboard frame buffer.

■Video pass throu

h to the TV output for full

screen video im a

es.

■HSYNC and B/T

enerati on or lock onto

external video tim in

source.

■Vide o Pi

eline

■Two-tap interpolative horizontal filter.

■Tw o-tap interpolative vertical filter.

■Colour space conversion (RGB to YUV and

YUV to RGB).

■Pro

rammable window size.

■Chroma and colour keyin

for inte

rated

video overlay.

■Vide o Out

■NTSC-M; PAL-B, D, G, H, I, M, N encodin

■ITU-R 601 encodin

with pro

ramm able

colour subcarrier frequencies.

■ITU-R 656 video output si

nal interface.

■Four analo

outputs in two confi

urations:

- R,G,B + CVBS

- C,YS,CVBS1 + CVBS2

■Flicker-free interlaced output.

■Pro

ramm able two tap filter with

amma

correction or three tap flicker filter.

■Interlaced or non-interlaced operation mode.

■Pro

ressive to interlaced scan converter.

■Cross colour reduction by specific trap

filterin

on luma within CVBS flow.

■Power down mode av ailable on each DAC.

STPC® CONSUMER-II

Release 1.5 - January 29, 2002 3/93

■PCI Cont r oller

■Fully compliant with PCI 2.1 specification.

■Integrated PCI arbitration interface. Up to 3

maste rs can connect directly. External PAL

allows for greater than 3 masters.

■Tr ansla tion of PCI cycles to ISA bus.

■Transl at i on of ISA maste r init iated cycle to

PCI.

■Support for burst read/write f rom PCI master.

■PCI clock is 1/2, 1/3 or 1/4 cpu bus clock.

■IS A master/sl ave

■Generat es the ISA clock from either

14.318 MHz oscillator clock or PCI clock

■Supports programmable extra wait state for

ISA cycles

■Supports I/O recovery time for back to back

I/O cycle s.

■Fast Gate A20 a nd Fast reset.

■Supports the single ROM that C, D, or E.

blocks shares with F block BIOS ROM.

■Supp orts flash ROM.

■Supp orts ISA hidden refresh.

■Buffered DMA & ISA master cycles t o reduce

bandwidt h utilization of the PCI and Host

bus.

■Local Bus interface

■Multiplexed with ISA/DMA interface.

■Low latency asynchronous bus

■22-b it address bus.

■16-bit data bus with word steering capability.

■Program m able timing (Host clock granularity)

■Tw o Programm able Flash Chip Select.

■Four Programmable I/O Chip Select.

■Supp orts 32-bit Flash burst.

■Tw o-level hardware key protection for Flash

boot block protection.

■Supp orts two banks of 16 MB flash devices

with boot block shadowed to 0x000F0000.

■IDE Inte rface

■Supp orts PIO

■T ransfer Rates to 22 MBytes/sec

■Supp orts up to 4 IDE devices

■Concurrent channel operation (PIO modes) -

4 x 32-Bit Buffer FIFO s per channel

■Supp ort for PIO mode 3 & 4.

■Individual drive timing for all four IDE devices

■Supports both legacy & native IDE modes

■Supports hard drives larger than 528MB

■Supp ort for CD-ROM and tape peripherals

■Ba c k wa r d c o mpa ti b ilit y wi th I D E (ATA- 1 ).

■Drivers for Windows and other Operating

Systems

■Inte

rated Peri

heral Controller

■2X8237/AT compatible 7-channel DMA

controller.

■2X8259/AT compatible interrupt Controller .

16 interrupt inputs - ISA and PCI.

■Three 8254 com patible Timer/Counte rs.

■Co-processor error support logic.

■Power Mana

ement

■Four power saving mode s: On, Doze,

Standby, Suspend.

■Program m able system activity detector

■Supports Intel & Cyrix SMM and APM.

■Supp orts STOPCLK.

■Supports IO trap & restart.

■Independent peripheral time-out timer to

monitor hard disk, serial & parallel port.

■128K SM_RA M address sp ace from

0xA0000 to 0xB0000

■JTAG

■Boun dary Scan compa tible IEEE1149.1.

■Scan Chain control.

■Bypass register compatible IEEE1149.1.

■ID re gister compatible IEEE1149.1.

■RAM BIST control.

The STPC Consumer-II has undergone an errata fix upgrade. The different versions can be differenciated by the part

number. Both versions are pin to pin compatible and there are some software extensions that have been added to the

upgraded parts. The parts labeled STPCC5 are the upgraded parts and the differences are identified in both the Datash-

eet and Programming Manual. All parts labeled STPCC4 do not support the new features outlined in the documentation.

Where nor C4 nor C5 are specified, the information or feature applies to both versions.

STPC® CONSUMER-II

4/93 Release 1.5 - Januar

29, 2002

GENERAL DESCRIPTION

Release 1.5 - January 29, 2002 5/93

1. GENERAL DESCRIPTION

At the heart of the STPC Consumer-II is an

advanced 64-bit x86 processor block. It includes a

64-bit SDRAM controller, advanced 64-bit

accelerated graphics and video controller, a high

speed PCI local-bus controller and Industry

standard PC chip set functions (Interrupt

controller, DMA Co ntroller, Interval timer and ISA

bus).

The STPC Consumer-II has in addition, an EIDE

Controller, I2C I nterface, a Local Bus interface and

a JTAG interface.

1.1. ARCHITE CTURE

The STPC Consumer-II makes use of a tightly

coupled Unified Memory Architecture (UMA),

where the same memory array is used for CPU

main memory and graphics frame-buffer. This

means a reduction in total system memory for

system performances that are equal to that of a

comparable frame buffer and system memory

based system, and generally much better, due to

the higher memory bandwidth allowed by

attaching the graphics engine directly to the 64-bit

processor host interface running at the speed of

the processor bus rather than the traditional PCI

bus. The 64-bit wide memory array provides the

system with 528MB/s peak bandwidth. This allows

for higher resolution screens and greater color

depth.

The ‘standard’ PC chipset functions (DMA,

interrupt controller, timers, power management

logic) are integrated together with the x86

processor core; additional functions such as

communi cations ports a re ac ces sed by the S TPC

Consumer-II via internal ISA bus.

The PCI bus is the ma in data comm unication link

to the STPC Consumer-II chip. The STPC

Consumer-II translates appropriate host bus I/O

and Memory cycles onto the PCI bus. It also

supports generation of Configuration cycles on the

PCI bus. The STPC Consumer-II, as a PCI bus

agent (host brid ge class), fully complies with PCI

specification 2.1. The chip-set also implements

the PCI mandatory header registers in Type 0 P CI

configuration space for easy porting of P CI aware

system BIOS. The device contains a PCI

arbitration function for three external PCI devices.

The STPC Consum er-II ha s tw o functional blocks

sharing the same balls

: The ISA / IPC / IDE block

and the Local Bus / IDE bl ock (see Table 3). Any

board with the STPC Co nsume r-I I should be built

using only one of these two configurations. The

IDE pins are dynamically multiplexed in each of

the blocks in ISA mode only.

Configuration is do ne by ‘stra p option s’. It i s a set

of pull-up or pull-down resistors on the memory

data bus, checked on reset, which auto-configure

the STPC Consumer-II.

1.2. GRAPHICS FEATURES

Graphics functions are controlle d through t he on-

chip SVGA controller and the monitor display is

produced through the 2D graphics display engine.

This Graphics Engine is tuned to work with the

host CPU to provide a balanced graphics system

with a low silicon area cost. It performs limited

graphics drawing operations which include

hardware acceleration of text, b itblts, transparent

blts and fills. The results of these operations

change the contents of the on-screen or off-

screen frame buffer areas of SDRAM memory.

The frame buffer can occupy a space up to 4

Mbytes anyw here in the physical main memo ry.

The graphics resolution supported is a maximum

of 1280x1024 in 16M colors and 16M colors at

75Hz refresh rate, VGA and SVGA compatible.

Horizontal timin g field s are V GA c ompat ible while

the vertical fields are extended by one bit to

accommodat e above displa y resolution .

1.3. VI DEO FUNC TIONS

The STPC Consumer-II provides several

additional functions to handle MPEG or similar

video streams. The Video Input Port accepts an

encoded digital video stream in one of a number of

industry standard formats, decodes it, optionally

decimates it, and deposits it into an off screen

area of the f rame buffer. An interrupt reques t can

be generated when an entire field or frame has

been captured. The video output pipeline

incorporates a video-scaler and color space

converter function and provisions in the CRT

controller to display a video window. While

repainting the screen the CRT controller fetches

both the video as well as the normal non-video

frame buffer in two separate internal FIFOs. The

video stream can be color-space converted

(optionally) and smooth scaled. Smooth

interpolative scaling in both horizontal and vertical

direction are implemented. Color and Chroma key

functions are also implemented to allow mixing

video stream with non-video frame buffer.

The video output passes directly to the RAMDAC

for monitor output or through another optional

color space converter (RGB to 4:2:2 YCrCb) to the

programma ble anti-flicker filter. The flicker filter is

configured as either a two line filter with gamma

correction (primarily designed for DOS type text)

GENERAL DE SCRIPTION

6/93 Release 1.5 - Januar

29, 2002

or a 3 line flicker filter (primarily designed for

Windows type displays). The fliker filter is optional

and can be software disabled for use with large

screen area’s of video.

The Video output pipeline of the STPC Consumer-

II interfaces directly to the internal digital TV

encoder. It takes a 24 bit RGB non-interlaced pixel

stream and converts to a multiplexed 4:2:2 YCrCb

8 bit output stream, the logic includes a

progressive to interlaced scan converter and logic

to insert appropriate CCIR656 timing reference

codes into the output stream. It facilitates the high

quality display of VGA or full screen video streams

received via the Video input port to standard

NTSC or PAL televisions.

The digital PAL/NTSC encode r outputs interlaced

or non-interlaced video in PAL-B,D,G,H,I PAL-N,

PAL-M or NTSC-M standards and “NTSC- 4.43” is

also possible.

The four frame (for PAL) or 2 frame (for NTSC)

burst sequences are internally generated,

subcarrier generation being performed

numerically with CKREF as reference. Rise and

fall times of synchronisation tips and burst

envelope are internally controlled according to the

relevant ITU-R and SMPTE recomme ndations.

Video output signals are directed to four analog

output pins through internal D/A converters giving,

simultaneous R,G,B and composite CVBS

outputs.

1.4. ME MORY CONTROL LER

The STPC handles the mem ory data (DATA) bus

directly, controlling from 2 to 128 MBytes. The

SDRAM controller supports accesses to the

Memory Banks to/from the CPU (via the host),

from the VMI, to/fro m the CR TC, to th e VID EO &

to/from the GE. (Banks 0 to 3) which can be

populated with either single or double sided 72-bit

(4 bit parit y) DIMMs. Parity is not supported.

The SDRAM controller only supports 64 bit wide

Mem o r y Bank s.

Four Memory Banks (if DIMMS are used; Single

sided or two double-sided DIMMs) are supported

in the following configurations (see Table 1-1)

The SDRAM Controller supports buffered or

unbuffered SDRAM but not EDO or FPM modes.

SDRAMs must support Full Page Mode Type

access.

The STPC Memory Controller provides various

programmable SDRAM parameters to allow the

SDRAM interface to be optimized for different

processor bus speed s SDRAM speed grades and

CAS Latency.

1.5. IDE INTERFACE

An industry standard EIDE (ATA 2) controller is

built into the STPC Consumer-II. The IDE port is

capable of supporting a total of four devices.

1.6. PO WE R MANA GEMENT

The STPC Consum er-II core is compliant with the

Advanced Power Management (APM)

specification to provide a standard method by

which the BIOS can control the power used by

personal computers. The Power Management

Unit module (PMU) controls the power

consumption providing a comprehensive set of

features that control the power usage and

supports compliance with the United States

Environmental Protection Agency's Energy Star

Computer Program. The PMU provides following

hardware structures to assist the software in

managing the power consumption by th e system.

- System Activity Detecti on.

- Three power down timers.

- Doze timer for detecting lack of system activity

for short durations.

- Stand-by timer for detecting lack of system

activity for medium durations

- Suspend timer for detecting lack of system

activity f or long durations.

- House-keeping activity detection.

- House-keeping timer to cope with short bursts

of house-keeping activity while dozing or in stand-

by state.

Table 1-1. Mem ory configu rations

Memory

Bank size Number Organisa

tion Device

Size

1Mx64 4 1Mx16

16Mbits2Mx64 8 2Mx8

4Mx64 16 4Mx4

4Mx64 4 2Mx16x2

64Mbits

8Mx64 8 4Mx8x2

16Mx64 16 8Mx4x2

4Mx64 4 1Mx16x4

8Mx64 8 2Mx8x4

32Mx64 16 4Mx4x4

16Mx64 8 2Mx16x2 128Mbits

32Mx64 16 4Mx8x4

Table 1-1. Mem ory configu rations

Memory

Bank size Number Organisa

tion Device

Size

GENERAL DESCRIPTION

Release 1.5 - January 29, 2002 7/93

- Peripheral activity detection.

- Peripheral timer for detecting lack of peripheral

activity

- SUSP# modulation to adjust the system

performance in various power down states of the

system including full power on state.

- Power control outputs to disable power from

different planes of the board.

Lack of system activity for progressively longer

period of times is detected by the three power

down timers. These timers can generate SMI

interrupts to CPU so that the SMM software can

put the system in decreasing states of power

consumption. Alternatively, system activity in a

power down state can generate SMI interrupt to

allow the software to bring the system back up to

full power on state. The chip-set supports up to

three power down states: Doze state, Stand-by

state and Suspend mode. These correspond to

decreasing levels of power savings.

Power down puts the STPC Consumer-II into

suspend mode. The processor completes

execution of the current instruction, any pending

decoded instructions and associated bus cycles.

During the suspend mode, internal clocks are

stopped. Removing power down, the processor

resumes instruction fetching and begins execution

in the instruction stream at the point it had

stopped. Becaus e of the static nature of the c ore,

no internal data is lost.

1.7. JTAG

JTA G stands for Joint Test Action Group and is the

popular name for IEEE Std. 1149.1, Standard Test

Access Port and Boundary-Scan A rchitec-ture.

This built-in circuitry is used to assist in the test,

maintenance and s upport of functional circuit

bl ocks. The circuitry includes a standard interface

through which instructions and test data are

communicated. A set of test features is defined,

including a boundar y -sc an registe r so that a

component is able to respond to a minimum set of

te st instructions .

GENERAL DE SCRIPTION

8/93 Release 1.5 - Januar

29, 2002

Figure 1-1. Functional description.

x86

Core

Host

I/F

SDRAM

I/F

SVGA

VIP

PCI m/s

Local

Bus I/F

PCI BUS

ISA

m/s

IPC

82C206 PCI m/s

ISA Bus

CRTC

HW Cursor

Monitor

- Pixel formating

- Sc aler

- Col our Spac e CVT

IDE

I/F

PMU

Video Pipeline

Colour Key

Chroma Key

LUT

Local Bu s

NTSC/PAL

Encoder

TVO

- CSC

- FF

- CCIR

CCIR Input

JTAG

GENERAL DESCRIPTION

Release 1.5 - January 29, 2002 9/93

1.8. CLOCK TREE

The STPC Atlas integrates many features and

generates all its clocks from a single 14MHz

oscillator. This results in multiple clock domains as

described in Figure 1-2.

The speed of the PLLs is either fixed (DEVCLK),

either programmable by strap option (HCLK)

either programmab le by sof tware (DCLK, MCLK ).

When in synchronized mode, MCLK speed is fixed

to HCLKO speed and HCLKI is generated from

MCLKI.

Figure 1-2. STPC C onsumer-I I clock architecture

IPC

SDRAM controller

North Bridge

14.31818 MHz

XTALO XTALI

OSC14M ISACLK

1/4

DEVCLK

(24MHz)

PLL

(14MHz)

1/2

HCLK

PLL

PCICLKI PCICLKO

South Bridge

1/2

1/3

HCLK

DCLK

PLL MCLK

PLL

DCLK MCLKIMCLKO

CRTC,Video,TV

CPU x1

VCLK

VIP

Local Bus

Host

ISA HCLKI

HCLKO

GENERAL DE SCRIPTION

10/93 Release 1.5 - Januar

29, 2002

Figure 1-3. Typical ISA-base d Application.

Monitor

Video

SVGA

CCIR601

CCIR656

S-VHS

RGB

PAL

NTSC

STPC Consumer-II

ISA

PCI

4x 16-bit SDRAMs

Super I/O

2x EIDE

Flash

Keyboard / Mouse

Seri a l Port s

Parall el Port

Floppy

IRQ

DMA.REQ

DMA.ACK

DMUX

MUX

RTC

PIN DESCRIPTION

Release 1.5 - January 29, 2002 11/93

2. PIN DESCRIPTION

2.1. INT RODUCT ION

The STPC Consumer-II integrates most of the

functionality of the PC architecture. As a result,

many of the traditional interconnections between

the host PC microprocessor and the peripheral

devices are totally internal to the STPC

Consumer-II. This offers improved performance

due to t he tight coupling of t he processor core and

these peripherals. As a result, many of the

external pin connections are m ade directly to the

on-chip peripheral functions.

Figure 2-1 shows t he STPC Consum er-II exte rnal

interfaces. It defines the main buses and their

functions. Table 2-1 describes the physical

implementation, listing signal type and

functionality. Table 2-2 provides a full pin listing

and description of pins. Table 2-7 provides a full

listing of pin locations of the STPC Consumer-II

package by physical connection. Note: Several interface pins are multiplexed with

other functions, refer to Table 2-4 and Table 2-5

for further details

Table 2-1. Signal Description

Group name Qty

Basic Clocks reset & Xtal (SYS) 7

SDRAM Controller 95

PCI interface 56

ISA 79 89IDE 34

Local Bus 49

Video Input 9

TV Output 12

VGA Monitor interface 8

Grounds 71

VDD 26

Miscellaneous 9

Unconnected 6

Total Pin Count 388

Figure 2-1. STPC Cons umer-I I Extern al Interfaces

PCI

x86

SDRAM VGA VIP TV SYS ISA/IDE/LB

95 8 9 12 56 789

STPC CO NSUM ER-II

PIN DESCRIPTION

12/93 Release 1.5 - Januar

29, 2002

Ta bl e 2 -2 . Def i ni t io n of Si gn a l Pin s

Signal Name Dir Buffer Type2Description Qty

BASIC CLOCKS AND RESETS

SYSRSETI# I SCHMITT_FT System Power Good Input 1

SYSRSTO# O BD8STRP_FT System Reset Output 1

XTALI I ANA 14.3 MHz Crystal Input- External

Oscillator Input 1

XTALO I/O OSCI13B 14.3 MHz Crystal Output 1

HCLK I/O BD4STRP_FT Host Clock (Test) 1

DEV_CLK O BT8TRP_TC 24 MHz Peripheral Clock (floppy drive) 1

DCLK I/O BD4STRP_FT 27-135 MHz Graphics Dot Clock 1

VDD_xxx_PLL1VDDCO Power Supply for PLL Clocks

SDRAM CONTROLLER

MCLKI I TLCHT_TC Memory Clock Input 1

MCLKO O BT8TRP_TC Memory Clock Output 1

CS#[1:0] O BD8STRP_TC DIMM Chip Select 2

CS2# / MA11 O BD16STARUQP_TC DIMM Chip Select / Memory Address 1

CS3# / MA12 / BA1 O BD16STARUQP_TC DIMM Chip Select / Memory Address /

Bank Address 1

BA[0] O BD8STRP_TC Bank Address 1

MA[10:0] O BD16STARUQP_TC Memory Row & Column Address 12

MD[63:49] I/O BD8STRUP_FT Memory Data 15

MD[48:1] I/O BD8TRP_TC Memory Data 48

MD[0] I/O BD8STRUP_FT Memory Data 1

RAS#[1:0] O BD16STARUQP_TC Row Address Strobe 2

CAS#[1:0] O BD16STARUQP_TC Column Address Strobe 2

MWE# O BD16STARUQP_TC Write Enable 1

DQM[7:0] O BD8STRP_TC Data Input/Output Mask 8

PCI CONTROLLER

PCI_CLKI I TLCHT_FT 33 MHz PCI Input Clock 1

PCI_CLKO O BT8TRP_TC 33 MHz PCI O/P Clk (from internal PLL) 1

AD[31:0] I/O BD8PCIARP_FT PCI Address / Data 32

CBE[3:0] I/O BD8PCIARP_FT Bus Commands / Byte Enables 4

FRAME# I/O BD8PCIARP_FT Cycle Frame 1

IRDY# I/O BD8PCIARP_FT Initiator Ready 1

TRDY# I/O BD8PCIARP_FT Target Ready 1

LOCK# I TLCHT_FT PCI Lock 1

DEVSEL# I/O BD8PCIARP_FT Device Select 1

STOP# I/O BD8PCIARP_FT Stop Transaction 1

PAR I/O BD8PCIARP_FT Parity Signal Transactions 1

SERR# O BD8PCIARP_FT System Error 1

PCIREQ#[2:0] I BD8PCIARP_FT PCI Request 3

PCIGNT#[2:0] O BD8PCIARP_FT PCI Grant 3

PCI_INT#[3:0] I BD4STRUP_FT PCI Interrupt Request 4

Note1: These pins are must be connected to the 2.5 V power supply. They must not be connected to the 3.3 V supply.

Note2: See Table 2-3 for buffer type descriptions

PIN DESCRIPTION

Release 1.5 - January 29, 2002 13/93

ISA INTERFACE

ISA_CLK O BT8TRP_TC ISA Clock Output

Multiplexer Select Line For IPC 1

ISA_CLK2X O BT8TRP_TC ISA Clock x2 Output

Multiplexer Select Line For IPC 1

OSC14M O BD8STRP_FT ISA bus synchronisation clock 1

LA[23:17] O BD8STRUP_FT Unlatched Address 7

SA[19:0] I/O BD 8STR UP_F T Latched Addre ss 20

SD[15:0] I/O BD8STRP_FT Data Bus 16

ALE O BD4STRP_FT Address Latch Enable 1

MEMR#, MEM W# I/O BD 8STR UP_F T Memory Read and Write 2

SMEMR#, SMEMW# O BD8STRP_FT System MemoryRead and Write 2

IOR#, IOW# I/O BD8STRUP_FT I/O Read and Write 2

MCS16#, IOCS16# I BD4STRUP_FT Memory and I/O ChipSelect16 2

BHE# O BD8STRUP_FT System Bus High Enable 1

ZWS# I BD4STRP_FT Zero Wait State 1

REF# O BD8STRP_FT Refresh Cycle. 1

MASTER# I BD4STRUP_FT Add On Card Owns Bus 1

AEN O BD8STR UP_F T Address Enab le 1

IOCHCK# I BD4STR UP_F T I/O Channel Check. 1

IOCHRDY I/O BD8STR UP_F T I/O Channel Read 1

ISAOE# O BD 4STR P_FT ISA/IDE Selec tion 1

GPIOCS# I/O BD4STRP_FT General Purpose Chip Select 1

IRQ_MUX[3:0] I BD4STRP_FT Time-Multiplexed Interrupt Request 4

DREQ_MUX[1:0] I BD4STRP_FT Time-Multiplexed DMA Request 2

DACK_ENC[2:0] O BD4STRP_FT Encoded DMA Acknowledge 3

TC O BD4STRP_FT ISA Terminal Count 1

RTCAS O BD4STRP_FT Real Time Clock Address Strobe 1

RMRTCCS# I/O BD4STRP_FT ROM/RTC Chip Select 1

KBCS# I/O BD4STRP_FT Keyboard Chip Select 1

RTCRW# I/O BD4STRP_FT RTC Read/Write 1

RTCDS# I/O BD4STRP_FT RTC Data Strobe 1

LOCAL BUS INTERFACE

PA[23:0] O BD 4STRP_FT Add ress Bus 24

PD[15:0] I/O BD8STRP_FT Data Bus 16

PRD1#,PRD0# O BD4STRUP_FT Peripheral Read Control 2

PWR1#,PWR0# O BD4STRUP_FT Peripheral Write Control 2

PRDY I BD8STRUP_FT Data Ready 1

FCS1#, FCS0# O BD4STRP_FT Flash Chip Select 2

IOCS#[3 :0] O BD 8STR UP_F T I/O Chip Select 4

IDE CONTROLLER

DA[2:0] O BD 8STR UP_F T Address Bus 3

DD[15:0] I/O BD8STRUP_FT Data Bus 16

Ta bl e 2 -2 . Def i ni t io n of Si gn a l Pin s

Signal Name Dir Buffer Type2Description Qty

Note1: These pins are must be connected to the 2.5 V power supply. They must not be connected to the 3.3 V supply.

Note2: See Table 2-3 for buffer type descriptions

PIN DESCRIPTION

14/93 Release 1.5 - Januar

29, 2002

PCS3#,PCS1#,SCS3#,SCS1# O BD8STRUP_FT Primary & Secondary Chip Selects 4

DIORDY O BD8STRUP_FT Data I/O Ready 1

PIRQ, SIRQ I BD4STRP_FT Primary & Secondary Interrupt Request 2

PDRQ, SDRQ I BD4STRP_FT Primary & Secondary DMA Request 2

PDACK#, SDACK# O BD8STRP_FT Primary & Secondary DMA Acknowledge 2

PDIOR#, SDIOR# O BD8STRUP_FT Primary & Secondary I/O Channel Read 2

PDIOW#, SDIOW# O BD8STRUP_FT Primary & Secondary I/O Channel Write 2

VGA CONTROLLER

RED, GREEN, BLUE O VDDCO Analog Red, Green, Blue 3

VSYNC O BD4STRP_FT Vertical Sync 1

HSYNC O BD4STRP_FT Horizontal Sync 1

VREF_DAC1I ANA DAC Voltage reference 1

RSET I ANA Res istor Set 1

COMP I ANA Compensation 1

COL_SEL O BD4STRP_FT Colour Select 1

VIDEO INPUT PORT

VCLK I BD8STRP_FT 27-33 MHz Video Input Port Clock 1

VIN[7:0] I BD4STRP_FT CCIR 601 or 656 YUV Video Data Input 8

ANALOG TV OUTPUT PORT

RED_TV, GREEN_TV, BLUE_TV O VDDCO Analog RGB or S-VHS outputs 3

CVBS O VDDCO Analog video composite output 1

IREF1_TV I ANA Reference current of CVBS DAC 1

VREF1_TV I ANA Reference voltage of CVBS DAC 1

IREF2_TV I ANA Reference current of RGB DAC 1

VREF2_TV I ANA Reference voltage of RGB DAC 1

VSSA_TV I Analog Vss for DAC 1

VDDA_TV I VDDCO Analog Vdd for DAC 1

VCS I/O BD4STRP_FT Composite Synchro

Horizontal Line Synchro 1

ODD_EVEN I/O BD4STRP_FT Frame Synchronisation 1

MISCELLANEOUS

SPKRD O BD4STRP_FT Speaker Device Output 1

SCL I/O BD4STRUP_FT I²C Interface - Clock

Can be used for VGA DDC[1] signal 1

SDA I/O BD4STRUP_FT I²C Interface - Data

Can be used for VGA DDC[0] signal 1

SCAN_ENABLE I TLCHTD_TC Reserved (Test pin) 1

TCLK I TLCHT_FT Test Clock 1

TDI I TLCHT_FT Test Data Input 1

TMS I TLCHT_FT Test Mode Set 1

TDO O BT8TRP_TC Test Data output 1

Ta bl e 2 -2 . Def i ni t io n of Si gn a l Pin s

Signal Name Dir Buffer Type2Description Qty

Note1: These pins are must be connected to the 2.5 V power supply. They must not be connected to the 3.3 V supply.

Note2: See Table 2-3 for buffer type descriptions

PIN DESCRIPTION

Release 1.5 - January 29, 2002 15/93

Table 2-3. Buffer Type Descriptions

Buffer Description

ANA Analog pad buffer

OSCI13B Oscillator, 13 MHz, HCMOS

BT8TRP_TC Tri-State output buffer, 8 mA drive capability, Schmitt trigger with slew rate control and P, TC

BD4STRP_FT LVTTL Bi-Directional, 4 mA drive capability, Schmitt trigger, 5V tolerant

BD4STRUP_FT LVTTL Bi-Directional, 4 mA drive capability, Schmitt trigger, Pull-Up, 5V tolerant

BD8STRP_FT LVTTL Bi-Directional, 8 mA drive capability, Schmitt trigger, 5V tolerant

BD8STRUP_FT LVTTL Bi-Directional, 8 mA drive capability, Schmitt trigger, Pull-Up, 5V tolerant

BD8STRP_TC LVTTL Bi-Directional, 8 mA drive capability, Schmitt trigger

BD8TRP_TC LVTTL Bi-Directional, 8 mA drive capability, Schmitt trigger

BD8PCIARP_FT LVTTL Bi-Directional, 8 mA drive capability, PCI compatible, 5V tolerant

BD16STARUQP_TC LVTTL Bi-Directional, 16 mA drive capability, Schmitt trigger

SCHMITT_FT LVTTL Input, Schmitt trigger, 5V tolerant

TLCHT_FT LVTTL Input, 5V tolerant

TLCHT_TC LVTTL Input

TLCHTD_TC LVTTL Input, Pull-Down

VDDCO Internal supply for core only power pad

PIN DESCRIPTION

16/93 Release 1.5 - Januar

29, 2002

2.2. SIGN AL DESCRIPTIONS

2.2 .1. BASIC CLOCKS AND RESETS

SYSRSTI#

System Re se t/Power g ood.

This input

is low when the reset switch is depressed.

Otherwise, it reflects the power supply power

good signal. This input is asynchronous to all

clocks, and acts as a negative active reset. The

reset circuit initiates a hard reset on the rising

edge of this signal.

SYSRSTO#

Reset Output to System.

This is the

system reset signal and is used to reset the r est of

the components (not on Host bus) in the system.

The ISA bus reset is an externally inverted

buffered version of this output and the PCI bus

reset is an externally buffered version of this

output.

XTALI

14.3 MHz Crystal Input

XTALO

14.3 MHz Crystal Output.

These pins are

provided for the c onnection of an external 14.318

MHz crystal to provide the reference c lock for the

internal frequency synthesizer, from which all

other clock signals are generated.

The 14.318 MHz series-cut fundamental (not

overtone) mode quartz crystal must have an

Equivalent Series Resistance (ESR, sometimes

referred to as Rm) of les s then 50 Ohms (typically

8 Ohms) and a shunt capacitance (Co) of less

than 7 pF. Balance capacitors of 16 pF should

also be added, one connected to each pin.

In the e ve nt of an ex tern al osc illato r prov iding the

master clock signal to the STPC Consumer-II

device, t he LVTT L signal should b e con nected to

XTALI.

HCLK

Host Clock.

This clock supplies the CPU

and the host related blocks. This clock can be

doubled inside the CPU and is intended to operate

in the range of 25 M Hz to 1 00 MH z. This c lock is

generated in ternally from a P LL bu t can be driven

dire ctly from the exte rna l syst e m.

DEV_CLK

24 MHz Peripheral Clock.

This 24 MHz

signal is provi ded as a conveni ence for t he system

integration of a Floppy Disk driver function in an

external chip.

DCLK

135 MHz Dot Clock.

This is the dot clock,

which drives graphics di splay cycles. I ts frequency

can go from 8 M H z (us ing inte rnal PLL) up to 135

MHz, and it is req uired to have a wors t case du ty

cycle of 60-40.

This signal is driven either by the internal pll (VGA)

or by an external 27 MHz oscillator (when the

composite vid eo output is enabled ). Th e direction

can be controlled by a strap option or an internal

2.2.2. SDRAM CONTROLLER

MCLKO

Memory Clock Output.

This clock is

driving the DIMMs on board and is generated from

an internal PLL. The default value is 66 MHz.

MCLKI

Memory Clock Input.

This clock is driving

the SDRAM controller, the graphics engine and

display controller. This input should be a buffered

version of the MCLKO signal with the track lengths

between the buffer and the pin matched with the

track lengths between the buffer and the DIMMs.

CS#[1:0]

Chip Select

These signals are used to

disable or enabl e device op eration by m asking or

enabling all SDRAM inputs except MCLK, CKE,

and DQM.

CS#[2]/MA[11]

Chip Select/Bank Address

This

pin is CS#[2] in the case when 16-Mbit devices are

used. For all other densities, it becomes MA[11].

CS#[3]/MA[12]/BA[1]

Chip Select/Memory

Address/Bank Address

This pin is CS#[3] in the

case when 16-Mbit devices are used. For all other

densities, it becomes MA[12] when two internal

banks devices are used and BA[1] when four

internal bank devices are used.

MA[10:0]

Memory Address.

Multiplexed row and

column address lines.

BA[0]

Memory Bank Address.

MD[63:0]

Memory Dat a.

This is the 64-bit memory

data bus. MD[40-0] are read by the device strap

option registers during rising edge of SYSRSTI#.

RAS#[1:0]

Row Address Strobe.

There are two

active-low row address strobe output signals. The

RAS# signals drive the memory devices directly

without any external buffering.

CAS#[1:0]

Column Address Strobe.

There are

two active-low column address strobe output

signals. The CAS# signals drive the memory

devices directly without any external buffering.

MWE#

Write Enable.

Write enable specifies

whether the memory access is a read (MWE# = H)

or a write (MWE# = L).

DQM#[7:0]

Data Mask.

Makes data output Hi-Z

after the clock and masks the SDRAM outputs.

Blocks SDRAM data input when DQM active.

2.2.3. PCI CONTROLLER

PCI_CLKI

33 MHz PCI I nput Clock .

This signal is

the PCI bus clock input and should be driven from

the PCI_CLKO pin.

PIN DESCRIPTION

Release 1.5 - January 29, 2002 17/93

PCI_CLKO

33 MHz P CI Out put Clock.

Th is is t he

maste r PCI bus clo ck outpu t.

AD[31:0]

PCI Address/Data.

This is the 32-bit

multiplexed address and data bus of the PCI. This

bus is driven by the master during the address

phase a nd t he da ta phase of wri te transactions. It

is driven by the target during the data phase of

read transactions.

CBE#[3:0]

Bus Commands/Byte Enables.

These

are the multiplexed command and byte enable

signals of the PCI bus. During the addres s phase

they define the command and during the data

phase they carry the byte enable information.

These pins are inputs when a PCI master other

than the STPC Consumer-II owns the bus and

outputs when the STPC Consumer-II owns the

bus.

FRAME#

Cycle Frame.

This is the frame signal of

the PCI bus. It is an input when a PCI master owns

the bus and is an output when STPC Consumer-II

owns the PCI bus.

IRDY#

Initiator Ready.

This is the initiator ready

signal of the PCI bus. It i s used as an output when

th e STP C Consumer-II init iates a b us cycle on the

PCI bus. It is used as an input during the PCI

cycles targeted to the STPC Consumer-II to

determine when the current PCI master is ready to

complete the current transaction.

TRDY#

Target Ready.

This is the target ready

signal of the PCI bus. It is driven as an output

when the STPC Consumer-II is the target of the

current bus transaction. It is used as an input

when STPC Consumer-II initiates a cycle on the

PCI bus.

LOCK#

PCI Lock.

This is the lock signal of the PCI

bus and is used to implement the exclusive bus

operations when acting as a PCI target agent.

DEVSEL#

I/O Device Select.

This signal is used

as an input wh en the STPC Consumer-II initiates

a bus cycle on the PCI bus to determine if a PCI

slave device has dec oded itself to be the target of

the curr ent transaction. It i s asserted as an output,

either when the STPC Consumer-II is the target of

the current PCI transaction, or when no other

device asserts DEVSEL# prior to the subtractive

decode phase of the current PCI transa ction.

STOP#

Stop Transaction.

Stop is used to

implement the disconnect, retry and abort protocol

of the PCI bus. It is used as an input for the bus

cycles initiated by the STPC Consumer-II and is

used as an output when a PCI master cycle is

targeted to the STPC Consume r-II.

PAR

Parity Signal Transactions.

This i s the parity

signal of the PCI bus. This signal is used to

guarantee even parity across AD[31:0],

CBE#[3:0], and PAR. This signal is driven by the

master during the address phas e and data phase

of write transactions. It is driven by the target

during data phase of read transactions (its

assertion is identical to that of the AD bus delayed

by one PCI clo ck cycle).

SERR#

System Error.

This is the system error

signal of the PCI bus. It may, if enabled, be

asserted fo r one PCI clock cycle if targe t aborts a

STPC Consumer-II initiated PCI transaction. Its

assertion by either the STPC Consumer-II or by

another P CI bu s agent will t rigger the assertion of

NMI to the host CPU. This is an open drain output.

PCIREQ#[2:0]

PCI R equest.

These a re the t hree

external PCI master request pins. They indicates

to the PCI arbiter that external agents desire use

of the bus .

PCIGNT#[2:0]

PCI Grant.

These pins indicate that

the PCI bus has been granted to the master

requesting it on its PCI REQ #.

PCI_INT#[3:0]

PCI Interrupt Request.

These are

the PCI bus interrupt s ign als.

2.2.4. ISA INTERFACE

ISA_CLK, ISA_CLKX2

ISA Clock x1, x2.

These

pins generate the Clock signal for the ISA bus and

a Doubled Clock signal. They are also used as the

multiplexer control lines for the Interrupt Controller

Interrupt input lines. ISA_CLK is generated from

either PCICLK/4 or OSC14M/ 2.

OSC14M

ISA bus synchronisation clock Output.

This is the buffered 14.318 MH z clock for the ISA

bus.

LA[23:17]

Unlatched Address .

When the IS A bus

is active, these pins are ISA Bus unlatched

address for 16-bit devices. When ISA bus is

accessed by any cycle initiated from PCI bus,

these pi ns are in o utput mode. When an ISA bus

master owns the bus, these pins are in input

mode.

SA[19:0]

ISA Address Bus.

System address bus

of ISA on 8-bit slot. These pins are used as an

input when an ISA bus master owns the bus and

are outputs at all other times.

SD[15:0]

I/O Data Bus.

These pins are the

external data bus to the ISA bus.

ALE

Address Latch Enable.

This is the address

latch enable output of the ISA bus and is asserted

by the STPC Consumer-II to indicate that LA23-

17, SA19-0, AEN and SBHE# signals are valid.

The ALE is driven high during refresh, DMA

PIN DESCRIPTION

18/93 Release 1.5 - Januar

29, 2002

master or an ISA master cycles by the STPC

Consumer-II. ALE is driven low after reset.

MEMR#

Memory Read.

This is the memory read

command signal of the ISA bus. It is used as an

input when an ISA master owns the bus and is an

output at all other times.

The MEMR# signal is active during refresh.

MEMW#

Memory Write.

This is the memory write

command signal of the ISA bus. It is used as an

input when an ISA master owns the bus and is an

output at all other times.

SMEMR#

System Memory Read.

The STPC

Consumer-II generates SMEMR# signal of the

ISA bus only when the address is below one

megabyte or the cycle is a refres h cycle.

SMEMW#

System Memory Write.

The STPC

Consumer-II generates the SMEMW# signal of

the ISA bus only when the address is below one

megabyte.

IOR#

I/O Read.

This is the IO read command

signal of the ISA bus. It is an input when an ISA

master own s the bus an d is an out put at al l other

times.

IOW#

I/O Write.

This is the IO write command

signal of the ISA bus. It is an input when an ISA

master own s the bus an d is an out put at al l other

times.

MCS16#

Memory Chip Select16.

This is the

decode of LA23-17 address pins of the ISA

address bus without any qualification of the

command signal lines. MCS16# is always an

input. The STPC Consumer-II ignores this signal

during IO and refresh cycles.

IOCS16#

IO Chip Select16.

This signal is the

decode of SA15-0 address pins of the ISA

address bus without any qualification of the

command signals. The STPC Consumer-II does

not drive IOCS16# (similar to PC-AT design). An

ISA master access to an internal register of the

STPC Consumer-II is executed as an extended 8-

bit IO cycle.

BHE#

System Bus High Enable.

This signal, when

asserted, indicates that a data byte is being

transferred on SD15-8 lines. It is used as an input

when an ISA master owns the bus and is an

output at all other times.

ZWS#

Zero W ait Stat e.

This signal, when assert-

ed by an addressed device, indicates that the cur-

rent cycle can be shortened.

REF#

Refresh Cycle.

This is the refresh command

signal of the ISA bus. It is driven as an output

when the STPC Consumer-II performs a refresh

cycle on the ISA bu s. It is used as an input when

an ISA master owns the bus and is used to trigger

a refresh cycle.

The STPC Consumer-II performs a pseudo

hidden refresh. It requests the host bus for two

host clocks to drive the refresh address and

capture it in externa l buffers. The ho st bus is t hen

relinquished while the refresh cycle continues on

the ISA bus.

MASTER#

Add On Card Owns Bus.

This signal is

active when an ISA device has been granted bus

ownership.

AEN

Address Enable.

Address E nable is enabled

when the DMA controller is the bus owner to

indicate that a DMA transfer will occur. The

enabling of the signal indicates to IO devices to

ignore the IOR#/IOW# signal during DMA

transfers.

IOCHCK#

IO C hannel Che ck.

IO Cha nnel Check

is enabled by any ISA device to signal an error

condition that can not be corrected. The NMI

signal becomes active on seeing IOCHCK# active

if the corres po nding bit in Port B is enabled.

IOCHRDY

Channel Ready.

IOCHRDY is the IO

channel ready signal of the ISA bus and is driven

as an output in response to an ISA master cycle

targeted to the host bus or an internal register of

the STPC Consumer-II. The STPC Consumer-II

monitors this signal as an input when performing

an ISA cycle on behalf of the host CPU, DMA

master or refresh.

ISA masters which do not monitor IOCHRDY are

not guaranteed to work with the STPC Consumer-

II since the access to the system memory can be

considerably delay ed due UMA arch itecture.

ISAOE#

Bidirectional OE Control.

This signal

controls the OE signal of the external transceiver

that connects the IDE DD bus and IS A SA bus.

GPIOCS#

I/O Ge neral Purpo se Chip Select.

This

output signal is used b y the external latch o n ISA

bus to latch the data on t he SD[7:0] bus. The latch

can be use by PMU unit to control the external

peripheral devices or any other desired function.

IRQ_MUX[3:0]

Multiplexed Interrupt Request.

These are the ISA bus interrupt signals. They

have to be encoded before connection to the

STPC Cons um er-II using ISACLK and I SACLK X2

as the input selection strobes.

Note that IRQ8B, which by convention is

connected to the RTC, is inverted before being

sent to the interrupt controller, so that it may be

connected directly to the IRQ pin of the RTC.

DREQ_MUX[1:0]

ISA Bus Multiplexed DMA

Request.

These are the ISA bus DMA request

signals. They are to be encoded before

connection to the STPC Consumer-II using

PIN DESCRIPTION

Release 1.5 - January 29, 2002 19/93

ISACLK and ISACLKX2 as the input selection

strobes.

DACK_ENC[2:0]

DMA Acknowledge.

These are

the ISA b us DMA ac knowledge sig nals. They are

encoded by the STPC Consum er-II before ou tput

and should be decoded externally using ISACLK

and ISACLKX 2 as the control strobes.

ISA Terminal Count.

This is t he terminal count

output of the DMA controller and is connected to

the TC line of the ISA bus. It is asserted during the

last DMA transfer, when the byte count expires.

RTCAS

Real time clock address strobe.

This sig-

nal is asserted for any I/O write to port 70H.

RMRTCCS#

ROM/Real Time clock chip select.

This signal is asserted if a ROM access is

decoded during a memory cycle. It should be

combined with MEMR# or MEMW# signals to

properly access the ROM. During a IO cycle, this

signal is asserted if access to the Real Time Clock

(RTC) is decoded. It should be combined with IOR

or IOW# signals to properly access the real time

clock.

KBCS#

Keyboard Chip Select.

This signal is

asserted if a keyboard access is decoded during a

I/O cycle .

RTCRW#

Real Time Clock RW.

This pin is a multi-

function pin. When ISAOE# is active, this signal is

used as RTCRW#. This signal is as serted for any

I/O write t o port 71H.

RTCDS#

Real Time Clock DS

. This pin is a multi-

function pin. When ISAOE# is active, this signal is

used as RTCDS#. This signal is asserted for any I /

O read to port 71H. Its polarity complies with the

DS pin of the MT48T86 RTC device when

configured with Intel timings.

Note: RMRTCCS#, KBCS#, RTCRW# and

RTCDS# signals must be ORed externally with

ISAOE# and then connected to the external

device. An LS244 or equivalent function can be

used if OE# is connected to ISAOE# and the

output is provided with a weak pull-up resistor as

shown in Figure 6-10.

2.2.5. LOCAL BUS INTERFACE

PA[23:0]

Address Bus Output.

PD[15:0]

Data Bus.

This is the 16-bit data bus.

D[7:0] is the L SB and P D[15:8] is the MSB.

PRD#[1:0]

Read Control output.

PRD0# i s used to

read the LSB and PRD1# to read the MSB.

PWR#[1:0]

Write Control output.

PWR0# is used

to write the LS B and PWR1# to write the MSB.

PRDY

Data Ready input.

This signal is used to

create wait states on the bus. When high, it

completes the current cycle.

FCS#[1:0]

Flash Chip Select output.

These are

the Programmable Chip Select signals for up to

two banks of Flash memory.

IOCS#[3:0]

I/O Chip Select out put.

These are t he

Programmable Chip Select signals for up to four

ext e rnal I/O device s.

2.2.6. IDE INTERFACE

SCS1#, SCS3#

Secondary Chip Select.

These

signals are used as the active high secondary

master & slave IDE chip select signals. These

signals must be externally ANDed with the

ISAOE# signal before driving the IDE devices to

guarantee it is active only when ISA bus is idle.

DA[2:0]

Address.

These signals are connected to

DA[2:0] of IDE devices directly or through a buffer.

If the toggling of s ignals are to be m asked du ring

ISA bus cycles, they can be extern ally ORed with

ISAOE# before being connected to the IDE

devices.

DD[15:0]

Databus.

When the IDE bus is active,

they serve as IDE signals DD[11:0]. IDE devices

are connected to SA [19:8] directly and ISA bus is

connected to these pins through two LS245

transceivers as described in F igure 6-10.

PCS1#, PCS3#

Primary Chip Select.

These

signals are used as the active high primary master

& slave IDE chip select signals. These signals

must be externally ANDed with the ISAOE# signal

before driving the IDE devices to guarantee it is

active only when ISA bus is id le.

DIORDY

Busy/Re ady.

This pin serves as IDE

signal DIORDY.

PIRQ

Primary Interrupt Request.

SIRQ

Secondary Interrupt Reques t.

Interrupt request from IDE channel s.

PDRQ

Primary DMA Request.

SDRQ

Secondary DMA Request.

DMA request from IDE channels.

PDACK#

Primary DMA Acknowledge.

SDACK#

Secondary DMA Acknowledge.

DMA acknowledg e to IDE channels.

PDIO R#, PD IOW#

Primary I/O Read & Write.

SDIO R#, SD IOW#

Secondary I/O Read & Write

Primary & Secondary channel read & write.

PIN DESCRIPTION

20/93 Release 1.5 - Januar

29, 2002

2.2.7. VGA CONTROLLER

RED, GREEN, BLUE

RGB Video Out put s.

These

are the three analog colour outputs from the

RAMDACs. These signals are sensitive to

interference, therefore they need to be properly

shielded.

VSYNC

Vertical Synchronisation Pulse.

This is

the vertical synchronization signal from the VGA

controller.

HSYNC

Horizontal Synchroni sa tion Pulse.

Th is is

the horizontal synchronization signal from the

VGA controller.

VREF_DAC

DAC Voltage reference.

An external

voltage reference is connected to this pin to bias

the DAC.

RSET

Resistor Current Set.

This reference

current input to the RAMDAC is used to set the

full-scale output of the RAMDAC.

COMP

Compensation.

This is the RAMDAC

compensation pin. Normally, an external capacitor

(typically 10nF) is connected between this pin and

VDD to damp oscillations .

2.2.8 . VID EO IN PU T POR T

VCLK

Pixel Clock Input.

This signal is used to

synchronise data being transferred from an

external video device to either the frame buffer, or

alternatively out the TV output in bypass mode.

This pin can be sourc ed from STP C i f n o exte rnal

VCLK is detected, or can be i nput from an external

video clock source.

VIN[7:0]

YUV Vi deo Data I nput CCIR 601 or 656.

Time multiplexed 4:2:2 luminance and

chrominance data as defined in ITU-R Rec601-2

and Rec656 (except for TTL input levels). This bus

typically carries a stream of Cb,Y,Cr,Y digital

video at VCLK frequency, clocked on the rising

edge (by default) of VCLK.

2.2.9 . AN AL OG TV OUT PUT PO R T

RED_TV / C_TV

Analog video outputs

synchronized with CVBS.

This output is current-

driven and must be connected to analog ground

over a load resistor (RLOAD). Following the load

resistor, a simple analog low pass filter is

recommended. In S-VHS mode, this is the

Chrominance Out put.

GREEN_TV / Y_TV

Analog video outputs

synchronized with CVBS.

This output is current-

driven and must be connected to analog ground

over a load resistor (RLOAD). Following the load

resistor, a simple analog low pass filter is

recommended. In S-VHS mode, this is the

Luminance Out put.

BLUE_TV / CVBS

Analog video outputs

synchronized with CVBS.

This output is current-

driven and must be connected to analog ground

over a load resistor (RLOAD). Following the load

resistor, a simple analog low pass filter is

recommended. In S-VHS mode, this is a second

composite output .

CVBS

Analog video composite output (luminance/

chrominance).

CVBS is current-driven and must

be connected to analog ground over a load

resistor (RLOAD). Following the load resistor, a

simple analog low pass filter is recommende d.

IREF1_TV

Re f. curre nt

for CVBS 10-bit DAC.

IREF2_TV

Re fe re nce c urr ent

for RGB 10-bit DA C.

VR EF1_T V

Ref. voltage

for CVBS 10-bit DAC.

Connect to analog ground.

VREF2_TV

Reference voltage

for RGB 10-bit

DAC. Connect to analog ground.

VSSA_TV

Analog V

for DACs.

VDDA_TV

Analog V

for DACs.

JTAG Signals

VCS

Line synchronisation Output.

This pin is an

input in O DDEV+HSYNC or VS YNC + HSYN C or

VSYNC slave modes and an output in all other

modes (master/slave)

ODD_EVEN

Fram e Synchronisat ion O utput.

This

pin supports the Frame synchronisation signal. It

is an input in slave modes, except when sync is

extracted from YCrCbdata, and an output in

master mode and when sync is extracted from

YCrCb data

The signal is synchronous to rising edge of DCLK.

The default polarity for thi s pin is:

- odd (not-top) field: LOW level

- even (bottom) field: HIGH level

2.2.10. MISCELLA NEOU S

SPKRD

Speaker Drive.

This the output to the

speaker. It i s an AND of the counter 2 output with

bit 1 of Port 61, and drives an external speaker

driver. This output should be connected to 7407

type high voltage driver.

SCL , SDA I²C Interface

These bidirectional pins

are connected to CRTC register 3Fh to implement

DDC capabilities. They conform to I2C electrical

specifications, they have open-collector output

drivers which are internally connected to VDD

through pull-up resistors.

PIN DESCRIPTION

Release 1.5 - January 29, 2002 21/93

They can be used for the DDC1 (SCL) and DDC0

(SDA) lines of t he VG A interface.

SCAN_ENABLE

Reserved

. The pin is reserved

for Test and Miscellaneous functions.

COL_SEL

C olour Select.

Can be used for Picture

in Picture function. Note however that this signal,

brought out from the video pip eline, is not in sync

with the VG A output signals, i.e. the V GA signals

run fou r clock cycl e s afte r th e Col_ Sel si g nal.

VDD_CORE

2.5 V Power Supply.

These power

pins are nece ssary to supply the core with 2.5 V.

TCLK

Test clock

TDI

Tes t data input

TMS

Tes t mode input

TDO

Test data output

PIN DESCRIPTION

22/93 Release 1.5 - Januar

29, 2002

Tab le 2-4. ISA / IDE Dynamic Multiplexing

ISA BUS

(ISAOE# = 0) IDE

(ISAOE# = 1)

RMRTCCS# DD[15]

KBCS# DD[14]

RTCRW# DD[13]

RTCDS# DD[12]

SA[19:8] DD[11:0]

LA[23] SCS3#

LA[22] SCS1#

SA[21] PCS3#

SA[20] PCS1#

LA[19:17] DA[2:0]

IOCHRDY DIORDY

Table 2-5. ISA / Local Bus Pin Sharing

ISA / IPC LOCAL BUS

SD[15:0] PD[15:0]

DREQ_MUX[1:0] PA[21:20]

SMEMR# PA[19]

MEMW# PA[18]

BHE# PA[17]

AEN PA[16]

ALE PA[15]

MEMR# PA[14]

IOR# PA[13]

IOW# PA[12]

REF# PA[11]

IOCHCK# PA[10]

GPIOCS# PA[9]

ZWS# PA[8]

SA[7:4] PA[7:4]

TC, DACK_ENC[2:0] PA[3:0]

SA[3] PRDY

ISAOE#,SA[2:0] IOCS#[3:0]

DEV_CLK, RTCAS FCS#[1:0]

IOCS16#, MASTER# PRD#[1:0]

SMEMW#, MCS16# PWR#[1:0]

Table 2-6. Signal value on Reset

Signal Name SYSRSTI# active SYSRSTI# inactive

SYSRSTO# active release of SYSRSTO#

BASIC CLOCKS AND RESETS

XTALO 14MHz

ISA_CLK Low 7MHz

ISA_CLK2X 14MHz

OSC14M 14MHz

DEV_CLK 24MHz

HCLK Oscillating at the speed defined by the strap options.

PCI_CLKO HCLK divided by 2 or 3, depending on the strap options.

DCLK 17MHz

MEMORY CONTROLLER

MCLKO 66MHz if asynchonous mode, HCLK speed if synchronized mode.

CS#[3:1] High

CS#[0] High

SDRAM init sequen ce:

Write Cycles

MA[10:0], BA[0] 0x00

RAS#[1:0], CAS#[1:0] High

MWE#, DQM[7:0] High

MD[63:0] Input

PCI INTERFACE

AD[31:0] 0x0000

First prefetch cycles

when not in Local Bus mode.

CBE[3:0], PAR Low

FRAME#, TRDY#, IRDY# Input

STOP#, DEVS EL# In put

PERR#, SERR # Input

PIN DESCRIPTION

Release 1.5 - January 29, 2002 23/93

PCI_GNT#[2:0] High

ISA BUS INTERFACE

ISAOE# High Low

RMRTCCS# Hi-Z First prefetch cycles

when in ISA or PCMCIA mode.

Address start is 0xFFFFF0

LA[23:17] Unknown 0x00

SA[19:0] 0xFFFXX 0xFFF03

SD[15:0] Unknown 0xFF

BHE#, MEMR# Unknown High

MEMW#, SMEMR#, SMEMW#, IOR#, IOW# Unknown High

REF# Unknown High

ALE, AEN Low

DACK_ENC[2:0] Input 0x04

TC Input Low

GPIOCS# Hi-Z High

RTCDS#, RTCRW#, KBCS# Hi-Z

RTCAS Unknown Low

LOCAL BUS INTERFACE

PA[24:0] Unknown

First prefetch cycles

PD[15:0] Unknown 0xFF

PRD# Unknown High

PBE#[1:0], FCS0#, FCS_0H# High

FCS_0L#, FCS1#, FCS_1H#, FCS_1L# High

PWR#, IOCS#[7:0] High

IDE CONTROLLER

DD[15:0] 0xFF

DA[2:0] Unknown Low

PCS1, PCS3, SCS1, SCS3 Unknown Low

PDACK#, SDACK# High

PDIOR#, PDIOW#, SDIOR#, SDIOW# High

VGA CONTROLLER

RED, GREEN, BLUE Black

VSYNC, HSYN C Lo w

COL_SEL Unknown

TV OUTPUT

RED_TV, GREEN_TV, BLUE_TV Black

CVBS Black

VCS Low

ODD_EVEN Low

I2C INTERFACE

SCL / DDC[1] Input

SDA / DDC[0] Input

JTAG

TDO High

MISCELLANEOUS

SPKRD Low

Table 2-6. Signal value on Reset

Signal Name SYSRSTI# active SYSRSTI# inactive

SYSRSTO# active release of SYSRSTO#

PIN DESCRIPTION

24/93 Release 1.5 - Januar

29, 2002

Table 2-7. Pinout.

Pin # Pin name

AF3 SYSRSETI#

AE4 SYSRSETO#

A3 XTALI

C4 XTALO

G23 HCLK

H24 DEV_CLK

AD11 DCLK

AF15 MCLKI

AB23 MCLKO

AE16 MA[0]

AD15 MA[1]

AF16 MA[2]

AE17 MA[3]

AD16 MA[4]

AF17 MA[5]

AE18 MA[6]

AD17 MA[7]

AF18 MA[8]3

AE19 MA[9]3

AE20 MA[10]

AC19 MA[11]/BA[0]

AF22 CS#[0]

AD21 CS#[1]

AE24 CS#[2]/MA[11]

AD23 CS#[3]/MA[12]/BA[1]

AF23 RAS#[0]

AD22 RAS#[1]

AE21 CAS#[0]

AC20 CAS#[1]

AF20 DQM#[0]

AD19 DQM#[1]

AF21 DQM#[2]

AD20 DQM#[3]

AE22 DQM#[4]

AE23 DQM#[5]

AF19 DQM#[6]

AD18 DQM#[7]

AC22 MWE#

R1 MD[0]3

T2 MD[1]3

R3 MD[2]

T1 MD[3]

R4 MD[4]

U2 MD[5]

T3 MD[6]

U1 MD[7]

U4 MD[8]

V2 MD[9]

U3 MD[10]

V1 MD[11]

W2 MD[12]

V3 MD[13]

Y2 MD[14]

W4 MD[15]

Y1 MD[16]

W3 MD[17]

AA2 MD[18]

Y4 MD[19]

AA1 MD[20]

Y3 MD[21]

AB2 MD[22]

AB1 MD[23]

AA3 MD[24]

AB4 MD[25]

AC1 MD[26]

AB3 MD[27]

AD2 MD[28]

AC3 MD[29]

AD1 MD[30]

AF2 MD[31]

AF24 MD[32]

AE26 MD[33]

AD25 MD[34]

AD26 MD[35]

AC25 MD[36]

AC24 MD[37]

AC26 MD[38]

AB25 MD[39]

AB24 MD[40]

AB26 MD[41]

AA25 MD[42]

Y23 MD[43]

AA24 MD[44]

AA26 MD[45]

Y25 MD[46]

Y26 MD[47]

Y24 MD[48]

W25 MD[49]3

V23 MD[50]3

W26 MD[51]3

W24 MD[52]3

V25 MD[53]3

V26 MD[54]3

U25 MD[55]3

V24 MD[56]3

U26 MD[57]3

U23 MD[58]3

Pin # Pin name T25 MD[59]3

U24 MD[60]3

T26 MD[61]3

R25 MD[62]3

R26 MD[63]3

F24 PCI_CLKI

D25 PCI_CLKO

B20 AD[0]

C20 AD[1]

B19 AD[2]

A19 AD[3]

C19 AD[4]

B18 AD[5]

A18 AD[6]

B17 AD[7]

C18 AD[8]

A17 AD[9]

D17 AD[10]

B16 AD[11]

C17 AD[12]

B15 AD[13]

A15 AD[14]

C16 AD[15]

B14 AD[16]

D15 AD[17]

A14 AD[18]

B13 AD[19]

D13 AD[20]

A13 AD[21]

C14 AD[22]

B12 AD[23]

C13 AD[24]

A12 AD[25]

C12 AD[26]

A11 AD[27]

D12 AD[28]

B10 AD[29]

C11 AD[30]

A10 AD[31]

D10 CBE[0]

C10 CBE[1]

A9 CBE[2]

B8 CBE[3]

A8 FRAME#

B7 TRDY#

D8 IRDY#

A7 STOP#

C8 DEVSEL#

B6 PAR

Pin # Pin name

PIN DESCRIPTION

Release 1.5 - January 29, 2002 25/93

D7 SERR#

A6 LOCK#

D20 PCI_REQ#[0]

C21 PCI_REQ#[1]

A21 PCI_REQ#[2]

C22 PCI_GNT#[0]

A22 PCI_GNT#[1]

B21 PCI_GNT#[2]

A5 PCI_INT#[0]

C6 PCI_INT#[1]

B4 PCI_INT#[2]

D5 PCI_INT#[3]

F2 LA[17]/DA[0[

G4 LA[18]/DA[1]

F3 LA[19]/DA[2]

F1 LA[20]/PCS1#

G2 LA[21]/PCS3#

G1 LA[22]/SCS1#

H2 LA[23]/SCS3#

J4 SA[0]

H1 SA[1]

H3 SA[2]

J2 SA[3]

J1 SA[4]

K2 SA[5]

J3 SA[6]

K1 SA[7]

K4 SA[8]

L2 SA[9]

K3 SA[10]

L1 SA[11]

M2 SA[12]

M1 SA[13]

L3 SA[14]

N2 SA[15]

M4 SA[16]

M3 SA[17]

P2 SA[18]

P4 SA[19]

K25 SD[0]

L24 SD[1]

K26 SD[2]

K23 SD[3]

J25 SD[4]

K24 SD[5]

J26 SD[6]

H25 SD[7]

H26 SD[8]

Pin # Pin name J24 SD[9]

G25 SD[10]

H23 SD[11]

D24 SD[12]

C26 SD[13]

A25 SD[14]

B24 SD[15]

AD4 ISA_CLK

AF4 ISA_CLK2X

C9 OSC14M

P25 ALE

AE8 ZWS#

R23 BHE#

P26 MEMR#

R24 MEMW#

N25 SMEMR#

N23 SMEMW#

N26 IOR#

P24 IOW#

N24 MCS16#

M26 IOCS16#

M25 MASTER#

L25 REF#

M24 AEN

L26 IOCHCK#

T24 IOCHRDY

M23 ISAOE#

A4 RTCAS

P3 RTCDS#

R2 RTCRW#

P1 RMRTCCS#

AE3 GPIOCS#

G26 PA[22]3

A20 PA[23]3

B1 PIRQ

C2 SIRQ

C1 PDRQ

D2 SDRQ

D3 PDACK#

D1 SDACK#

E2 PDIOR#

E4 PDIOW#

E3 SDIOR#

E1 SDIOW#

E23 IRQ_MUX[0]

D26 IRQ_MUX[1]

Pin # Pin name E24 IRQ_MUX[2]

C25 IRQ_MUX[3]

A24 DREQ_MUX[0]

B23 DREQ_MUX[1]

C23 DACK_ENC[0]

A23 DACK_ENC[1]

B22 DACK_ENC[2]

D22 TC

N3 KBCS#

AF9 RED

AE9 GREEN

AD8 BLUE

AC5 VSYNC

AE5 HSYNC

AC10 VREF_DAC

AE10 RSET

AD7 COMP

AE15 VCLK

AD5 VIN[0]

AF7 VIN[1]

AF5 VIN[2]

AE6 VIN[3]

AC7 VIN[4]

AD6 VIN[5]

AF6 VIN[6]

AE7 VIN[7]

AD10 RED_TV

AF11 GREEN_TV

AE12 BLUE_TV

AE13 VCS

AC12 ODD_EVEN

AF14 CVBS

AE11 IREF1_TV

AF12 VREF1_TV

AE14 IREF2_TV

AC14 VREF2_TV

C5 SPKRD

B5 SCL

C7 SDA

B3 SCAN_ENABLE

C15 COL_SEL

G3 TCLK

N1 TMS

W1 TDI

Pin # Pin name

PIN DESCRIPTION

26/93 Release 1.5 - Januar

29, 2002

Note1; These pins must be

connected to the 2.5 V power

supply. They must not be

connected to the 3.3 V supply.

AC2 TDO

AD12 VDDA_TV

AF8 VDD_DAC1

G24 VDD_CPUCLK_PLL1

AD13 VDD_DCLK_PLL1

F25 VDD_DEVCLK_PLL1

AC17 VDD_MCLKI_PLL1

AC15 VDD_MCLKO_PLL1

F26 VDD_HCLK_PLL1

E25 VDD_SKEW_PLL1

D11 VDD_CORE1

L23 VDD_CORE1

T4 VDD_CORE1

AC6 VDD_CORE1

D6 VDD

D16 VDD

D21 VDD

F4 VDD

F23 VDD

AC11 VDD

AC16 VDD

AC21 VDD

AA4 VDD

AA23 VDD

T23 VDD

L4 VDD

AF13 VSSA_TV

AC9 VSS_DAC1

A1:2 VSS

A26 VSS

B2 VSS

B25:26 VSS

C3 VSS

C24 VSS

D4 VSS

D9 VSS

D14 VSS

D19 VSS

D23 VSS

H4 VSS

J23 VSS

L11:16 VSS

M11:16 VSS

N4 VSS

N11:16 VSS

Pin # Pin name P11:16 VSS

P23 VSS

R11:16 VSS

T11:16 VSS

V4 VSS

W23 VSS

AC4 VSS

AC8 VSS

AC13 VSS

AC18 VSS

AC23 VSS

AD3 VSS

AD14 COMPENSATION_VS

AD24 VSS

AE1:2 VSS

AE25 VSS

AF1 VSS

AF25 VSS

AF26 VSS

A16

Unconnected

B11

Unconnected

D18

Unconnected

E26

Unconnected

AD9

Unconnected

AF10

Unconnected

Pin # Pin name

STRAP OPT IONS

Release 1.5 - January 29, 2002 27/93

3. STRAP OPTIONS

This chapter defines the STPC Consumer-II Strap

Options and their location. Some strap options are

left programmable for future versions of silicon. .

Table 3-1. Strap Options

Signal Designation Actual Settings1Set to ’0’ Set to ’1’

MD1 Reserved Pull up - -

MD2 HCLK PLL Speed User defined see Section 3.1.4. bit 6

MD3 User defined see Section 3.1.4. bit 7

MD4 PCICLKO Divisi on User defined see Section 3.1.3. bit 1

MD5 MCLK/HCLK Sync (see Section 3.1.1.) User defined Async Sync

MD6 PCICLKO frequency User defined see Section 3.1.1. bit 6

MD7 Reserved Pull down - -

MD10 Reserved Pull down - -

MD11 Reserved Pull down - -

MD14 Reserved Pull up - -

MD16 Reserved Pull up - -

MD17 PCI_CLKO Divisor User defined see Section 3.1.3. bit 1

MD18 Reserved Pull-up - -

MD19 Reserved Pull-up - -

MD20 DCLK Pad Direction User defined Input Output

MD21 Reserved Pull up - -

MD22 Reserved Pull up - -

MD23 Reserved Pull up - -

MD24 HCLK PLL Speed User defined see Section 3.1.4. bit 3

MD25 User defined see Section 3.1.4. bit 4

MD26 User defined see Section 3.1.4. bit 5

MD27 Reserved Pull down - -

MD28 Reserved Pull down - -

MD29 Reserved Pull down - -

MD30 Reserved Pull down - -

MD40 CPU Mode (see Section 3.1.3.) User defined X1 X2

MD41 Reserved Pull down - -

MD42 Reserved Pull up - -

MD43 Reserved Pull down - -

MD44 Bus select (see Section 3.1.1.) User defined ISA Local Bus

MD45 Reserved Pull down - -

MD46 Reserved Pull up - -

MD47 Reserved Pull down - -

MD48 Reserved Pull up - -

TC Reserved Pull up - -

DACK_ENC[2:0] Reserved Pull up - -

Note1: Where a strap is represented by a ’Pull up’ or ’Pull down’, these have to be adhered to. If it is represented as a ’-

’ it can be left unconnected. Where ’User defined’, the strap is set by the user.

STRAP OPT IONS

28/93 Release 1.5 - Januar

29, 2002

3.1. PO WER-ON STRAP REGISTER DESCRIPTIONS

3.1 .1. ADPC ST RAP REGISTER 0 CONFIGURAT ION

Strap0

Access = 0022h/0023h Regoffset = 04Ah

76543210

MD[7] MD[6] See Table

below MD[4] Rsv See Table

below See Table

belowl

This register defaults to the values sampled on MD[7:4] pins after reset

Bit Number Sampled Mnemonic Description

Bits 7-6 MD[7:6 ]

PCICLK PLL set-up: The value sampled on MD[7:6] controls the

PCICL K PLL program ming accordi ng to PCICL K frequency .

MD7 MD6

0 0 PCICLK frequency between 16 & 32 MHz

0 1 PCICLK frequency between 32 & 64 MHz

1 X Reserved

Bit 5

MD[5] For the parts referenced STPCC4, see section Section 3.1.1.bit 2.

MD[44]

For the parts referenced STPCC5, this strap selects betwen Loc al

Bus or ISA mode.

0 = ISA Mode

1 = Local Bus Mode

This strap is not readable in a register for the STPCC4.

Bit 4 MD[4]

PCICLK division: This bit reflects the value sampled on [MD4] and is

used together with MD[17] to select the PCICLK frequency.

MD4 MD17

0 X PCI Clock output = HCLK / 4

1 0 PCI Clock output = HCLK / 3

1 1 PCI Clock output = HCLK / 2

Bits 2

Rsv For the parts referenced STPCC4 These bits are reserved

MD[5]

Host Memory synchronization. This bit reflects the value sampled on

MD[5] and controls the MCLK/HCLK synchronization.

0: MCLK and HCLK not synchronized

1: MCLK and HCLK synchronized for improved system performance.

Bit 1-0

Rsv For the parts referenced STPCC4 These bits are reserved

MD[4,17]

For the parts referenced STPCC5.

These bits reflect the values sampled on M D[17 ] pin and

controls the PCI clock output in conjunct ion with MD[4], as

follows:

MD4 MD17

0 X PCI Clock output = HCLK / 4

1 0 PCI Clock output = HCLK / 3

1 1 PCI Clock output = HCLK / 2

STRAP OPT IONS

Release 1.5 - January 29, 2002 29/93

3.1 .2. ADPC ST RAP REGISTER 1 CONFIGURAT ION

Strap1

Access = 0022h/0023h Regoffset = 04Bh

76543210

Rsv Rsv Rsv Rsv Rsv

This register defaults to the values sampled on MD[13:10] pins after reset

Bit Number Sampled Mnemonic Description

Bits 7-6 Rsv Reserved

Bits 5-2 MD [13:1 0] Res erved

Bits 1-0 Rsv Reserved

STRAP OPT IONS

30/93 Release 1.5 - Januar

29, 2002

3.1 .3. ADPC ST RAP REGISTER 2 CONFIGURAT ION

Strap2

Access = 0022h/0023h Regoffset = 04Ch

76543210

See Table

below Rsv MD[20] MD[19] MD[18] See Table

below Rsv

This register defaults to the values sampled on MD pins after reset

Bit Number Sampled Mnemonic Description

Bits 7

Rsv For the parts referenced STPCC4, Reserved

MD[40]

For the parts referenced STPCC5, this bit reflects the value sampled on

MD[40] is used is used to set the clock multiplication factor of the 486

core, as follows:

MD[40]

0 DX (X1)

1 DX2 (X2)

This strap is not readable in a register for the STPCC4.

Bit 6-5 Rsv Reserved

Bits 4 MD[20]

This bit reflects the value sampled on MD[20] pin and controls

the Dot clock (DCLK) source as follows:

0: External. DCLK pin is an input.

1: Internal. DCLK pin is an output and is connected to the

internal frequency synthesizer output. Note this bit is writeable

as well as readable.

Bit 3 Rsv Reserved

Bit 2 Rsv Reserved

Bit 1 MD[17] For the parts referenced STPCC4, see section Section 3.1.1.bits 1:0.

Rsv For the parts referenced STPCC5.This bit is reserved and not connected

Bit 0 Rsv Res erved

STRAP OPT IONS

Release 1.5 - January 29, 2002 31/93

3.1.4. CPC STRAP REGISTER 0 CONFIGURATION

Table 3-1. HCLK Frequency Programming

HCLK_Strap

Access = 0022h/0023h Regoffset = 05Fh

76543210

MD[3} MD[2] MD[26] MD[25] MD[24] Rsv

This register defaults to the values sampled on MD pins after reset

Bit Number Sampled Mnemonic Description

Bits 7-3 MD[3:2] & MD[26:24] These pins reflect the values sampled on MD[3:2] and

MD[26 :24] pins respectively and control the Host clock

frequency synthesizer as shown in Table 3-1

Bits 2-0 Rsv Reserved

MD[3] MD[2] MD[26] MD[25] MD[24] HCLK Speed

00000 25 MHz

00001 50 MHz

00010 60 MHz

00011 66 MHz

01001 75 MHz

10011 90 MHz

11001 100 MHz

STRAP OPT IONS

32/93 Release 1.5 - Januar

29, 2002

ELEC TR ICAL SPECIFIC ATIONS

Release 1.5 - January 29, 2002 33/93

4. ELECTRICAL SPECIFICATIONS

4.1. INT RODUCT ION

The electrical specifications in this chapter are

valid for the STPC Consumer-II.

4.2. ELE CTRICAL CONNECTIONS

4.2.1. POWER/GROUND CONNECTIONS/

DECOUPLING

Due to the high frequency of operation of the

STPC Consumer-II, it is necessary to install and

test this device using standard high frequency

techniques. The high clock frequencies used in

the STPC Consumer-II and its output buffer

circuits can cause transient power surges when

several output buffers switch output levels

simultaneously. These effects can be minimized

by filtering the DC power leads with low-

inductance decoupling capacitors, using low

impedance wiring, and by utilizing all of the VSS

and VDD pins.

4.2.2 . U NUS ED INPU T PINS

No unused input pin should be left unconnected

unless they have an integrated pull-up or pull-

down. Connect active-low i nputs to VDD through a

20 kΩ (±10%) pull-up resistor and active-high

inputs to VSS. For bi-directionnal active-high

inputs, connect to VSS through a 20 kΩ (±10%)

pull-up resistor to prevent spurious operation.

4.2.3 . R ESERVED DESIGNATED PINS

Pins designated as reserved should be left dis-

connected. Connecting a reserved pin to a pull-up

resistor, pull-down resistor, or an active signal

could cause unexpected results and possible

circuit malfunctions.

4.3. ABSOLU TE MAXIMUM RATINGS

The following table lists the absolute maximum

ratings for the STPC Consumer-II device.

Stresses beyond those listed under Table 4-1

limits may cause permanent damage to the

device. These are stress ratings only and do not

imply that operation under any conditions other

than those specified in section "Operating

Conditions".

Exposure to conditions beyond those outlined in

Table 4-1 may (1) reduce device reliability and (2)

result in premature failure even when there is no

immediately apparent sign of failure. Prolonged

exposure to conditions at or near the absolute

maximum ratings (Table 4-1) may also result in

reduced useful life and reliability.

4.3.1. 5V TOLERANCE

The STPC is capable of running with I/O syste ms

that operate at 5 V such as P CI and ISA devices.

Certain pins of the STPC tolerate inputs up to

5.5 V. Above this limit the component is likely to

sustain permanent damage. .

Note 1: The figures specified apply to the Tcase of a

STPC device that is soldered to a board, as detailed in

the Design Guidelines Section, for Commercial and In-

dustrial temperature ranges.

Table 4-1. Absolute Maximum Ratings

Symbol Parameter Minimum Maximum Units

VDDx DC Supply Voltage -0.3 4.0 V

VCORE DC Supply Voltage for Core -0.3 2.7 V

VI, VODigital Input and Output Voltage -0.3 VDD + 0.3 V

V5T 5Volt Tolerance -0.3 5.5 V

VESD ESD Capacity (Human body mode) - 2000 °C

TSTG Storage Temperature -40 +150

TOPER Operating Temperature (Note 1) 0 +85 °C

-40 +115 °C

PTOT Maximum Power Dissipation (package) - 4.8 W

ELECTRICAL SPECIFICA TIONS

34/93 Release 1.5 - Januar

29, 2002

4.4. DC CH ARACTERISTICS

Table 4-2. DC Characteristics

Symbol Parameter Test conditions Min Typ Max Unit

VDD Operating Voltage 3.0 3.3 3.6 V

VCORE Operating Voltage 2.45 2.5 2.7 V

PDD Supply Power 3.0V < VDD < 3.6V 0.18 W

PCORE Supply Power 2.45V < VCORE < 2.7V 2.90 W

VIL Input Low Voltage Except XTALI -0.3 0.8 V

XTALI -0.3 0.8 V

VIH Input High Voltage Except XTALI 2.1 VDD+0.3 V

XTALI 2.35 VDD+0.3 V

ILK Input Leakage Current Input, I/O -5 5 µA

Integrated Pull up/down 50 KΩ

Table 4-3. PAD buffers DC Characteristics

Buffer Type I/O

count VIH min

(V) VIL max

(V) VOH min

(V) VOL max

(V) IOL min

(mA) IOH max

(mA) Cload max

(pF) Derating

(ps/pF)1CIN

(pF)

ANA 8 2.35 0.9 - - - - - - -

OSCI13B 1 2.1 0.8 2.4 0.4 2 - 2 50 - -

BT8TRP_TC 5 - - 2.4 0.4 8 - 8 200 21 6.89

BD4STRP_FT 50 2 0.8 2.4 0.4 4 - 4 100 42 5.97

BD4STRUP_FT 10 2 0.8 2.4 0.4 4 - 4 100 41 5.97

BD8STRP_FT 26 2 0.8 2.4 0.4 8 - 8 200 23 5.96

BD8STRUP_FT 40 2 0.8 2.4 0.4 8 - 8 200 23 5.96

BD8STRP_TC 10 2 0.8 2.4 0.4 8 - 8 200 21 7.02

BD8TRP_TC 60 2 0.8 2.4 0.4 8 - 8 200 21 7.03

BD8PCIARP_FT 49 0.5*VDD 0.3*VDD 0.9*VDD 0.1*VDD 1.5 - 0.5 200 15 6.97

BD16STARUQP_TC 19 2 0.8 2.4 0.4 16 -16 400 12 9.34

SCHMITT_FT 1 2 0.8 - - - - - - 5.97

TLCHT_FT 5 2 0.8 - - - - - - 5.97

TLCHT_TC 1 2 0.8 - - - - - - 5.97

TLCHTD_TC 1 2 0.8 - - - - - - 5.97

Note 1: time to output variation depending on the capacitive load.

Table 4-4. RAMDAC DC Specification

Symbol Parameter Min Max

Vref_dac Voltage Reference 1.00 V 1.24 V

INL Integrated Non Linear Error - 3 LSB

DNL Differentiated Non Linear Error - 1 LSB

BLC Black Level Current 1.0 mA 2.0 mA

WLC White Level Current 15.00 mA 18.50 mA

ELEC TR ICAL SPECIFIC ATIONS

Release 1.5 - January 29, 2002 35/93

Note 1: PCI clock at 33MHz

Table 4-5. VGA RAMDAC Power Consumption

DCLK

(MHz)

DAC mode

(State)

PMax (mW)

VDD_DAC = 2.45V VDD_DAC = 2.7V

- Shutdown 0 0

6.25 - 135 Active 150 180

Table 4-6. 2.5V Power Con sump tions (VCORE + VDD_x_PLL + VDD_DAC)

HCLK

(MHz) CPUCLK

(MHz) MCLK

(MHz) Mode DCLK

(MHz) PMU

(State) PMax (W)

V2.5V=2.45V V2.5V=2.7V

66 66 (x1) 66 SYN C Stopped Stop Clock 0.6 0.9

Full Speed 1.4 1.8

135 Stop Clock 0.9 1.2

Full Speed 1.7 2.3

100 100 (x1) 100 SYNC Stopped Stop Clock 0.8 1.1

Full Speed 1.5 2.0

135 Stop Clock 1.5 1.9

Full Speed 2.1 2.7

66 133 (x2) 66 SYNC Stopped Stop Clock 0.7 0.9

Full Speed 1.7 2.1

135 Stop Clock 0.9 1.2

Full Speed 1.9 2.5

66 133 (x2) 100 ASYNC Stopped Stop Clock 0.8 1.1

Full Speed 1.6 2.1

135 Stop Clock 1.5 1.9

Full Speed 2.3 2.9

Table 4-7. 3.3V Power Con sump tions (VDD)

HCLK

(MHz) CPUCLK

(MHz) MCLK

(MHz) DCLK

(MHz) PMU

(State) PMax

(mW)

66 66 (x1) 66 6.26 Full Speed 90

135 160

100 100 (x1) 100 6.26 Full Speed 115

135 180

66 133 (x2) 66 6.26 Full Speed 100

135 165

66 133 (x2) 100 6.26 Full Speed 115

135 180

Ta bl e 4 -8 . PLL P owe r C on s um p t io ns

PLL name PMax (mW)

VDD_PLL = 2.45V VDD_PLL = 2.7V

VDD_DCLK_PLL 5 10

VDD_DEVCLK_PLL 5 10

VDD_HCLKI_PLL 5 10

VDD_HCLKO_PLL 5 10

VDD_MCLKI_PLL 5 10

VDD_MCLKO_PLL 5 10

VDD_PCICLK_PLL 5 10

ELECTRICAL SPECIFICA TIONS

36/93 Release 1.5 - Januar

29, 2002

4.5. AC CH ARACTERISTICS

This section lists the AC characteristics of the

STPC interfaces including output delays, input

setup requirements, input hold requirements and

output float delays. These measurements are

based on the measurement points identified in

Figure 4-1 and Figure 4-2. The rising clock edge

reference level VREF and other reference levels

are shown in Table 4-9 below. Input or output

signals must cross these levels during testing.

Figure 4-1 shows output delay (A and B) and input

setup and hold times (C and D). Input setup and

hold times (C and D) are specified minimums,

defining the smallest acceptable sampling window

a synchronous input signal must be stable for

correct operation.

No te: Re fe r to F igure 4-1.

Table 4-9. Drive Level and Measurement Points for Switching Characteristics

Symbol Value Units

VREF 1.5 V

VIHD 2.5 V

VILD 0.0 V

Figure 4-1. Drive Level and Measurement Points for Switching Character istics

CLK: VRef

VILD

VIHD

LEGEND: A - Maximum Output Delay Specification

B - Minimum Output Delay Specification

C - Minimum Input Setup Specification

D - Minimum Input Hold Specification

VRef

Valid

OUTPUTS:

INPUTS:

Output n Output n+1

Input

MAX

MIN

Ref

VILD

VIHD

ELEC TR ICAL SPECIFIC ATIONS

Release 1.5 - January 29, 2002 37/93

Figure 4-2. CLK Timing Measurement Points

CLK T5 T4T3

VRef

VIL (MAX)

VIH (MIN)

LEGEND: T1 - One Clock Cycle

T2 - Minimum Time at VIH

T3 - Minimum Time at VIL

T4 - Clock Fall Time

T5 - Clock Rise Time

NOTE; All sIgnals are sampled on the rising edge of the CLK.

ELECTRICAL SPECIFICA TIONS

38/93 Release 1.5 - Januar

29, 2002

4.5.1. POWER ON SEQUENCE

Figure 4-3 describes the power-on sequence of

the STPC, also called cold reset.

There is no dependency between the different

power supplies and there is no constraint on their

rising time.

SYSRSTI # as no c onstraint on its rising e dge but

must stay active until power supplies are all within

specifications, a margin of 10µs is even

recommended to let the STPC PLLs and strap

options stabilize.

Strap Options are continuously sampled during

SYSRSTI# low and must remain stable. Once

SYSRSTI# is high, they MUST NOT CHANGE

until SYSRSTO# goes high.

Bus activity starts only few clock cycles after the

release of SYSRSTO#. The toggling signals

depend on the STPC configuration .

In ISA m ode, activity is visibl e on PCI prior to the

ISA bus as the controller is part of the south

bridge.

In Local Bus mode, the PCI bus is not accessed

and the Flash Chip Select is the control signal to

mon itor.

Fi gure 4-3 . Powe r - on tim i ng di agra m

S trap Option s

Power Supplie s

SYSRSTI#

SYSRSTO#

14 M H z

1.6 V

VALID CONFIGURATION

> 1 0 us

HCLK

PCI_CLK

2.3 m s

ISACLK

ELEC TR ICAL SPECIFIC ATIONS

Release 1.5 - January 29, 2002 39/93

4.5.2 RESET SEQUENCE

Figure 4-4 describes the reset sequence of the

STPC, also call e d warm reset.

The constraints on the strap options and the bus

activities are the same as for the cold reset.

The SYSRSTI# pulse duration must be long

enough to have all the strap options stabilized and

must be adjusted depending on resistor values.

It is mandatory to have a clean reset pulse without

glitches as the STPC could then sample invalid

strap option setting and enter into an umpredi cta-

ble mode.

While SYSRSTI# is active, t h e PCI clock PLL runs

in open loop mode at a speed of few 100’s KHz.

ure 4-4. Reset timin

dia

ram

S trap Optio ns

SYSRSTI#

SYSRSTO#

14 MHz

VALID CONFIGURATIO N

HCLK

PCI_CLK

2.3 m s

ISACLK

1.6 V

MD[63:0]

ELECTRICAL SPECIFICA TIONS

40/93 Release 1.5 - Januar

29, 2002

4.5.3. SDRAM INTE RFA CE

Figure 4-5, Table 4-10 lists th e AC character istics

of the SDRAM interface.

For correct operation, the programmable read

clock delay (RDCLK) must be activated for the

CRTC and the delay set to the minimum. This is

done by setting the Latch_CRTC_Data_In bit in

the SDRAM Controller register 0 and clear the

bits[3:0] in register 1.

The PC133 memory is recommended to reach

100MHz operation.

Figure 4-5. SDRAM Timing Diagram

MCLKI

STPC.output

STPC.input

MCLKx Tdelay

Tsetup

Thold

Toutp ut ( min)

Toutput (max)

Tcycle

Thigh Tlow

Table 4-10. SDRAM Bus AC Timin g

Name Parameter Min Typ Max Unit

Tcycle MCLKI Cycle Time 10 ns

Thigh MCLKI High Time 4 ns

Tlow MCLKI Low Time 4 ns

MCLKI Rising Time 1 ns

MCLKI Falling Time 1 ns

Tdela

MCLKx to MCLKI dela

-0.9 ns

Toutput MCLKI to Outputs Valid 5.2 7 ns

MCLKI to DQM[ ] Outputs Valid 6.5 8.8 ns

MCLKI to MD[ ] Outputs Valid 6.5 8.8 ns

Tsetup MD[63:0] setup to MCKLI 3.75 4.0 ns

Thold MD[63:0] hold from MCKLI 1.3 2.5 ns

Note: These timing are for a load of 50pF.

ELEC TR ICAL SPECIFIC ATIONS

Release 1.5 - January 29, 2002 41/93

4.5 .4. PCI INT ERFACE

Table 4-11 lists the AC characteristics of the PCI

interface.

Table 4-11. PCI Bus AC Timing

Name Parameter Min Typ Max Unit

HCLK to PCICLKO delay (MD[30:27] = 0000) ns

HCLK to PCICLKI delay 2.9 4.3 5.8 ns

PCICLKO Cycle Time 30 ns

PCICLKO High Time ns

PCICLKO Low Time ns

PCICLKI Cycle Time 30 ns

PCICLKI High Time ns

PCICLKI Low Time ns

PCICLKI Rising Time ns

PCICLKI Falling Time ns

PCICLKI to any output 5.9 - 15.8 ns

PCICLKI to PCI_GNT#[2:0] 6.8 - 16.8 ns

Setup to PCICKLI 2.2 - - ns

FRAME# Setup to PCICKLI 2.9 - - ns

PCI_REQ#[2:0] Setup to PCICKLI 7.2 - - ns

Hold from PCICLKI 4.8 - - ns

ELECTRICAL SPECIFICA TIONS

42/93 Release 1.5 - Januar

29, 2002

4.5.5 IP C INTERFACE

Table 4-12 lists the AC characteristics of the IPC

interface. Figure 4-6. IPC timing diagram

ISACLK

IRQ_MUX[3:0]

DREQ_MUX[1:0]

ISACLK2X Tdly

Tsetup

Table 4-12. IPC Interface AC Timings

Name Parameter Min Max Unit

Tdly ISACLK2X to ISACLK delay nS

ISACLK2X to DACK_ENC[2:0] valid nS

ISACLK2X to TC valid nS

Tsetup IRQ_MUX[3:0] Input setup to ISACLK2X 0 - nS

Tsetup DREQ_MUX[1:0] Input setup to ISACLK2X 0 - nS

ELEC TR ICAL SPECIFIC ATIONS

Release 1.5 - January 29, 2002 43/93

4.5.6 ISA INTERFACE AC TIMING CHARACTERISTICS

Table 4-7 and Table 4-13 list the AC characteris-

tics of the ISA interfac e.

Figure 4-7 ISA Cycle (ref Table 4-13)

Note 1: Stands for SMEMR#, SMEMW#, MEMR#, MEMW#, IOR# & IOW#.

The clock has not been represented as it is dependent on the ISA Slave mode.

Valid AENx

Valid Address

Valid Address, SBHE*

V.Dat

VALID DATA

57 27

56 29

918

ALE

AEN

LA [23:17]

SA [19:0]

CONTROL (Note 1)

IOCS16#

MCS16#

IOCHRDY

READ DATA

WRITE DATA

Table 4-13. IS A Bus AC Timing

Name Parameter Min Max Units

2 LA[23:17] valid before ALE# negated 5T Cycles

3 LA[23:17] valid before MEMR#, MEMW# asserted

3a Memory access to 16-bit ISA Slave 5T Cycles

3b Memory access to 8-bit ISA Slave 5T Cycles

9 SA[19:0] & SBHE valid before ALE# negated 1T Cycles

10 SA[19:0] & SBHE valid before MEMR#, MEMW# asserted

10a Memory access to 16-bit ISA Slave 2T Cycles

10b Memory access to 8-bit ISA Slave 2T Cycles

10 SA[19:0] & SHBE valid before SMEMR#, SMEMW# asserted

10c Memory access to 16-bit ISA Slave 2T Cycle

Note: The signal numbering refers to Table 4-7

ELECTRICAL SPECIFICA TIONS

44/93 Release 1.5 - Januar

29, 2002

10d Memory access to 8-bit ISA Slave 2T Cycle

10e SA[19:0] & SBHE valid before IOR#, IOW# asserted 2T Cycles

11 ISACLK2X to IOW# valid

11a Memory access to 16-bit ISA Slave - 2BCLK 2T Cycles

11b Memory access to 16-bit ISA Slave - Standard 3BCLK 2T Cycles

11c Memory access to 16-bit ISA Slave - 4BCLK 2T Cycles

11d Memory access to 8-bit ISA Slave - 2BCLK 2T Cycles

11e Memory access to 8-bit ISA Slave - Standard 3BCLK 2T Cycles

12 ALE# asserted before ALE# negated 1T Cycles

13 ALE# asserted before MEMR#, MEMW# asserted

13a Memory Access to 16-bit ISA Slave 2T Cycles

13b Memory Access to 8-bit ISA Slave 2T Cycles

13 ALE# asserted before SMEMR#, SMEMW# asserted

13c Memory Access to 16-bit ISA Slave 2T Cycles

13d Memory Access to 8-bit ISA Slave 2T Cycles

13e ALE# asserted before IOR#, IOW# asserted 2T Cycles

14 ALE# asserted before AL[23:17]

14a Non compresse d 15T Cyc les

14b Compressed 15T Cycles

15 ALE# asserted before MEMR#, MEMW#, SMEMR#, SMEMW# negated

15a Memory Access to 16-bit ISA Slave- 4 BCLK 11T Cycles

15e Memory Access to 8-bit ISA Slave- Standard Cycle 11T Cycles

18a ALE# negated before LA[23:17] invalid (non compressed) 14T Cycles

18a ALE# negated before LA[23:17] invalid (compressed) 14T Cycles

22 MEMR#, MEMW# asserted before LA[23:17]

22a Memory access to 16-bit ISA Slave. 13T Cycles

22b Memory access to 8-bit ISA Slave. 13T Cycles

23 MEMR#, MEMW# asserted before MEMR#, MEMW# negated

23b Memory access to 16-bit ISA Slave Standard cycle 9T Cycles

23e Memory access to 8-bit ISA Slave Standard cycle 9T Cycles

23 SMEMR#, SMEMW# asserted before SMEMR#, SMEMW# negated

23h Memory access to 16-bit ISA Slave Standard cycle 9T Cycles

23l Memory access to 16-bit ISA Slave Standard cycle 9T Cycles

23 IOR#, IOW# asserted before IOR#, IOW# negated

23o Memory access to 16-bit ISA Slave Standard cycle 9T Cycles

23r Memory access to 8-bit ISA Slave Standard cycle 9T Cycles

24 MEMR#, MEMW# asserted before SA[19:0]

24b Memory access to 16-bit ISA Slave Standard cycle 10T Cycles

24d Memory access to 8-bit ISA Slave - 3BLCK 10T Cycles

24e Memory access to 8-bit ISA Slave Standard cycle 10T Cycles

24f Memory access to 8-bit ISA Slave - 7BCLK 10T Cycles

24 SMEMR#, SMEMW# asserted before SA[19:0]

24h Memory access to 16-bit ISA Slave Standard cycle 10T Cycles

24i Memory access to 16-bit ISA Slave - 4BCLK 10T Cycles

24k Memory access to 8-bit ISA Slave - 3BCLK 10T Cycles

24l Memory access to 8-bit ISA Slave Standard cycle 10T Cycles

Table 4-13. IS A Bus AC Timing

Name Parameter Min Max Units

Note: The si

nal numberin

refers to Table 4-7

ELEC TR ICAL SPECIFIC ATIONS

Release 1.5 - January 29, 2002 45/93

24 IOR#, IOW# asserted before SA[19:0]

24o I/O access to 16-bit ISA Slave Standard cycle 19T Cycles

24r I/O access to 16-bit ISA Slave Standard cycle 19T Cycles

25 MEMR#, MEMW# asserted before next ALE# asserted

25b Memory access to 16-bit ISA Slave Standard cycle 10T Cycles

25d Memory access to 8-bit ISA Slave Standard cycle 10T Cycles

25 SMEMR#, SMEMW# asserted before next ALE# asserted

25e Memory access to 16-bit ISA Slave - 2BCLK 10T Cycles

25f Memory access to 16-bit ISA Slave Standard cycle 10T Cycles

25h Memory access to 8-bit ISA Slave Standard cycle 10T Cycles

25 IOR#, IOW# asserted before next ALE# asserted

25i I/O access to 16-bit ISA Slave Standard cycle 10T Cycles

25k I/O access to 16-bit ISA Slave Standard cycle 10T Cycles

26 MEMR#, MEMW# asserted before next MEMR#, MEMW# asserted

26b Memory access to 16-bit ISA Slave Standard cycle 12T Cycles

26d Memory access to 8-bit ISA Slave Standard cycle 12T Cycles

26 SMEMR#, SMEMW# asserted before next SMEMR#, SMEMW# asserted

26f Memory access to 16-bit ISA Slave Standard cycle 12T Cycles

26h Memory access to 8-bit ISA Slave Standard cycle 12T Cycles

26 IOR#, IOW# asserted before next IOR#, IOW# asserted

26i I/O access to 16-bit ISA Slave Standard cycle 12T Cycles

26k I/O access to 8-bit ISA Slave Standard cycle 12T Cycles

28 Any command negated to MEMR#, SMEMR#, MEMR#, SMEMW# asserted

28a Memory access to 16-bit ISA Slave 3T Cycles

28b Memory access to 8-bit ISA Slave 3T Cycles

28 Any command negated to IOR#, IOW# asserted

28c I/O access to ISA Slave 3T Cycles

29a MEMR#, MEMW# negated before next ALE# asserted 1T Cycles

29b SMEMR#, SMEMW# negated before next ALE# asserted 1T Cycles

29c IOR#, IOW# negated before next ALE# asserted 1T Cycles

33 LA[23:17] valid to IOCHRDY negated

33a Memory access to 16-bit ISA Slave - 4 BCLK 8T Cycles

33b Memory access to 8-bit ISA Slave - 7 BCLK 14T Cycles

34 LA [23:1 7] valid to read data valid

34b Memory access to 16-bit ISA Slave Standard cycle 8T Cycles

34e Memory access to 8-bit ISA Slave Standard cycle 14T Cycles

37 ALE# asserted to IOCHRDY# negated

37a Memory access to 16-bit ISA Slave - 4 BCLK 6T Cycles

37b Memory access to 8-bit ISA Slave - 7 BCLK 12T Cycles

37c I/O access to 16-bit ISA Slave - 4 BCLK 6T Cycles

37d I/O access to 8-bit ISA Slave - 7 BCLK 12T Cycles

38 ALE# asserted to read data valid

38b Memory access to 16-bit ISA Slave Standard Cycle 4T Cycles

38e Memory access to 8-bit ISA Slave Standard Cycle 10T Cycles

38h I/O access to 16-bit ISA Slave Standard Cycle 4T Cycles

38l I/O access to 8-bit ISA Slave Standard Cycle 10T Cycles

Table 4-13. IS A Bus AC Timing

Name Parameter Min Max Units

Note: The signal numbering refers to Table 4-7

ELECTRICAL SPECIFICA TIONS

46/93 Release 1.5 - Januar

29, 2002

41 SA[19:0] SBHE valid to IOCHRDY negated

41a Memory access to 16-bit ISA Slave 6T Cycles

41b Memory access to 8-bit ISA Slave 12T Cycles

41c I/O access to 16-bit ISA Slave 6T Cycles

41d I/O access to 8-bit ISA Slave 12T Cycles

42 SA[19:0] SBHE valid to read data valid

42b Memory access to 16-bit ISA Slave Standard cycle 4T Cycles

42e Memory access to 8-bit ISA Slave Standard cycle 10T Cycles

42h I/O access to 16-bit ISA Slave Standard cycle 4T Cycles

42l I/O access to 8-bit ISA Slave Standard cycle 10T Cycles

47 MEMR#, MEMW#, SMEMR#, SMEMW#, IOR#, IOW# asserted to IOCHRDY negated

47a Memory access to 16-bit ISA Slave 2T Cycles

47b Memory access to 8-bit ISA Slave 5T Cycles

47c I/O access to 16-bit ISA Slave 2T Cycles

47d I/O access to 8-bit ISA Slave 5T Cycles

48 MEMR#, SMEMR#, IOR# asserted to read data valid

48b Memory access to 16-bit ISA Slave Standard Cycle 2T Cycles

48e Memory access to 8-bit ISA Slave Standard Cycle 5T Cycles

48h I/O access to 16-bit ISA Slave Standard Cycle 2T Cycles

48l I/O access to 8-bit ISA Slave Standard Cycle 5T Cycles

54 IOCHRDY asserted to read data valid

54a Memory access to 16-bit ISA Slave 1T(R)/2T(W) Cycles

54b Memory access to 8-bit ISA Slave 1T(R)/2T(W) Cycles

54c I/O access to 16-bit ISA Slave 1T(R)/2T(W) Cycles

54d I/O access to 8-bit ISA Slave 1T(R)/2T(W) Cycles

55a IOCHRDY asserted to MEMR#, MEMW#, SMEMR#, SMEMW#,

IOR#, IOW# negated 1T Cycles

55b IOCHRY asserted to MEMR#, SMEMR# negated (refresh) 1T Cycles

56 IOCHRDY asserted to next ALE# asserted 2T Cycles

57 IOCHRDY asserted to SA[19:0], SBHE invalid 2T Cycles

58 MEMR#, IOR#, SMEMR# negated to read data invalid 0T Cycles

59 MEMR#, IOR#, SMEMR# negated to data bus float 0T Cycles

61 Write data before MEMW# asserted

61a Memory access to 16-bit ISA Slave 2T Cycles

61b Memory access to 8-bit ISA Slave (Byte copy at end of

start) 2T Cycles

61 Write data before SMEMW# asserted

61c Memory access to 16-bit ISA Slave 2T Cycles

61d Memory access to 8-bit ISA Slave 2T Cycles

61 Write Data valid before IOW# asserted

61e I/O access to 16-bit ISA Slave 2T Cycles

61f I/O access to 8-bit ISA Slave 2T Cycles

64a MEMW# negated to write data invalid - 16-bit 1T Cycles

64b MEMW# negated to write data invalid - 8-bit 1T Cycles

64c SMEMW# negated to write data invalid - 16-bit 1T Cycles

64d SMEMW# negated to write data invalid - 8-bit 1T Cycles

Table 4-13. IS A Bus AC Timing

Name Parameter Min Max Units

Note: The si

nal numberin

refers to Table 4-7

ELEC TR ICAL SPECIFIC ATIONS

Release 1.5 - January 29, 2002 47/93

64e IOW# negated to write data invalid 1T Cycles

64f MEMW# negated to copy data float, 8-bit ISA Slave, odd Byte

by ISA Master 1T Cycles

64g IOW# negated to copy data float, 8-bit ISA Slave, odd Byte by

ISA Master 1T Cycles

Table 4-13. IS A Bus AC Timing

Name Parameter Min Max Units

Note: The signal numbering refers to Table 4-7

ELECTRICAL SPECIFICA TIONS

48/93 Release 1.5 - Januar

29, 2002

4.5.7. LOCAL BUS INTE RFACE

Figure 4-3 to Figure 4-11 and Table 4-15 list the

AC characteristics of the Local Bus interface.

Figure 4-8. Synchronous Read Cycle

PA [ ] b u s

CSx#

PRD#[1:0]

PD[15:0]

HCLK

Tsetup Tactive Thold

Figure 4-9. Asynchrono us Read Cycle

PA [ ] b u s

CSx#

PRD#[1:0]

PD[15:0]

HCLK

Tsetup Tend Thold

PRDY

ELEC TR ICAL SPECIFIC ATIONS

Release 1.5 - January 29, 2002 49/93

Figure 4 -1 0. S ynchronous Wri t e Cy c le

PA [ ] b u s

CSx#

PWR#[1:0]

PD[15:0]

HCLK

Tsetup Tactive Thold

Figure 4-11. Asynchronous Write Cycle

PA [ ] b u s

CSx#

PWR#[1:0]

PD[15:0]

HCLK

Tsetup Tend Thold

PRDY

ELECTRICAL SPECIFICA TIONS

50/93 Release 1.5 - Januar

29, 2002

The Table 4-14 below refers to Vh, Va, Vs which

are the register value for Setup time, A ctive Time and Hold time, as described in the Programming

Manual.

Table 4-14. L ocal Bus cycle lengh t

Cycle Tsetup Tactive Thold Tend Unit

Memory (FCSx#) 4 + Vh 2 + Va 4 + Vs 4 HCLK

Peripheral (IOCSx#) 8 + Vh 3 + Va 4 + Vs 4 HCLK

Table 4-15. Local Bus Interface AC Timing

Name Parameters Min Max Units

HCLK to PA bus - 15 nS

HCLK to PD bus - 15 nS

HCLK to FCS#[1:0] - 15 nS

HCLK to IOCS#[3:0] - 15 nS

HCLK to PWR#[1:0] - 15 nS

HCLK to PRD#[1:0] - 15 nS

PD[15:0] Input setup to HCLK - 4 nS

PD[15:0] Input hold to HCLK 2 - nS

PRDY Input setup to HCLK - 4 nS

PRDY Input hold to HCLK 2 - nS

ELEC TR ICAL SPECIFIC ATIONS

Release 1.5 - January 29, 2002 51/93

4.5 .8 VGA INTERF ACE

Table 4-16 lists the AC characteristics of the VGA

interface. Table 4-16. Graphics Adapter (VG A) AC Timing

Name Parameter Min Max Unit

DCLK (input) Cycle Time ns

DCLK (input) High Time ns

DCLK (input) Low Time ns

DCLK (input) Rising Time ns

DCLK (input) Falling Time ns

DCLK (input) to R,G,B valid ns

DCLK (input) to HSYNC valid ns

DCLK (input) to VSYNC valid ns

DCLK (input) to COL_SEL valid ns

DCLK (output) Cycle Time ns

DCLK (output) High Time ns

DCLK (output) Low Time ns

DCLK (output) to R,G,B valid ns

DCLK (output) to HSYNC valid ns

DCLK (output) to VSYNC valid ns

DCLK (output) to COL_SEL valid ns

ELECTRICAL SPECIFICA TIONS

52/93 Release 1.5 - Januar

29, 2002

4.5.9 VIDEO INPUT PORT

Table 4-17 lists the AC characteristics of the VIP

interface. Table 4-17. Video Input AC Timings

Name Parameter Min Max Unit

VCLK Cycle Time ns

VCLK High Time ns

VCLK Low Time ns

VCLK Rising Time ns

VCLK Falling Time ns

VIN[7:0] setup to VCLK ns

VIN[7:0] hold from VCLK ns

ODD_EVEN setup to VCLK ns

ODD_EVEN hold from VCLK ns

VCS setup to VCLK ns

VCS hold from VCLK ns

ELEC TR ICAL SPECIFIC ATIONS

Release 1.5 - January 29, 2002 53/93

4.5.10 IDE INTERFACE

Table 4-18 lists the AC characteristics of the IDE

interface.

4.5.11 JTAG INTERFACE

Figure 4-12 and Table 4-17 list the AC

characteristics of the JTAG interface.

Table 4-18. I DE Interface Timing

Name Parameters Min Max Units

DD[15:0] setup to PIOR#/SIOR# falling 15 - ns

DD[15:0} hold to PIOR#/SIOR# falling 0 - ns

Figure 4-12. JTAG timing diagram

Table 4-19. JTAG AC Timin gs

Name Parameter Min Max Unit

Treset TRST pulse width 1 Tcycle

Tcycle TCLK period 400 ns

TCLK rising time 20 ns

TCLK falling time 20 ns

TCK

STPC.input

TRST Treset

Tcycle

STPC.output

TMS,TDI

TDO

Tjset Tjhld

Tjout

Tpset Tphld

Tpout

ELECTRICAL SPECIFICA TIONS

54/93 Release 1.5 - Januar

29, 2002

Tjset TMS setup time 200 ns

Tjhld TMS hold time 200 ns

Tjset TDI setup time 200 ns

Tjhld TDI hold time 200 ns

Tjout TCLK to TDO valid 30 ns

Tpset STPC pin setup time 30 ns

Tphld STPC pin hold time 30 ns

Tpout TCLK to STPC pin valid 30 ns

Table 4-19. JTAG AC Timin gs

ELEC TR ICAL SPECIFIC ATIONS

Release 1.5 - January 29, 2002 55/93

4.5.12 INTENSIONNALY BLANK

ELECTRICAL SPECIFICA TIONS

56/93 Release 1.5 - Januar

29, 2002

MECHANICAL DATA

Release 1.5 - January 29, 2002 57/93

5. ME CHANIC AL DA TA

5.1. 388-PIN PACKAGE DIMENS ION

The pin numbering for the STPC 388-pin Plastic

BGA package is shown in Figure 5-1.

Dimensions are shown in Figure 5-2, Table 5-1

and Figure 5-3, Table 5-2.

Figure 5-1. 388-Pin PBGA P ackag e - Top View

135791113151719212325

2 4 6 8 10 12 14 16 18 20 22 24 26

135791113151719212325

2468101214161820222426

MECHANICAL DATA

58/93 Release 1.5 - Januar

29, 2002

Figure 5-2. 388-pin PBGA Package - PCB Dimensions

Table 5-1. 388-pin PBGA Package - PCB Dimensions

Symbols mm inches

Min Typ Max Min Typ Max

A 34.95 35.00 35.05 1.375 1.378 1.380

B 1.22 1.27 1.32 0.048 0.050 0.052

C 0.58 0.63 0.68 0.023 0.025 0.027

D 1.57 1.62 1.67 0.062 0.064 0.066

E 0.15 0.20 0.25 0.006 0.008 0.001

F 0.05 0.10 0.15 0.002 0.004 0.006

G 0.75 0.80 0.85 0.030 0.032 0.034

Detail

A1 Ball Pad Corner

MECHANICAL DATA

Release 1.5 - January 29, 2002 59/93

Figure 5-3. 388-pin PBGA Package - Dimensio ns

Table 5-2. 388-pin PBGA Packag e - Dimensions

Symbols mm inches

Min Typ Max Min Typ Max

A 0.50 0.56 0.62 0.020 0.022 0.024

B 1.12 1.17 1.22 0.044 0.046 0.048

C 0.60 0.76 0.92 0.024 0.030 0.036

D 0.52 0.53 0.54 0.020 0.021 0.022

E 0.63 0.78 0.93 0.025 0.031 0.037

F 0.60 0.63 0.66 0.024 0.025 0.026

G 30.0 11.8

Solderball Solderball after collapse

MECHANICAL DATA

60/93 Release 1.5 - Januar

29, 2002

5.2. 388-PIN PACKAGE THERMAL DATA

The 388-pin PBGA package has a Power

Dissipation Capability of 4.5W. This increases to

6W when used with a Heatsink.

The structure in shown in Fi

ure 5-4.

Thermal dissipation options are illustrated in

ure 5-5 and Fi

ure 5-6.

Figure 5-4. 388-Pin PBGA stru cture

Thermal balls

Power & Ground layersSignal layers

Figure 5-5. Thermal Dissipation Without Heatsink

Ambient

Board

Case

Junction

Board

Ambient

Case

Junction

Board

Rca

Rjc

Rjb

Rba

1258.5

Rja = 13 °C/W

Airflow = 0

Board dimensions:

The PBGA is centred on board

Copper thickness:

- 17µm for internal layers

- 34µm for external layers

- 10.2 cm x 12.7 cm

- 4 layers (2 for signals, 1 GND, 1VCC)

There are no other devices

1 via pad per ground ball (8-mil wire)

40% copper on signal layers

Board temperature taken at the centrecentre b

MECHANICAL DATA

Release 1.5 - January 29, 2002 61/93

Figure 5-6. Thermal Dissip ation With Heatsink

Board

Ambient

Case

Junction

Board

Ambient

Case

Junction

Board

Rca

Rjc

Rjb

Rba

508.5

Rja = 9.5 °C/W

Airflow = 0

Board dimensions:

The PBGA is centred on board

Copper thickness:

- 17µm for internal layers

- 34µm for external layers

- 10.2 cm x 12.7 cm

- 4 layers (2 for signals, 1 GND, 1VCC)

There are no other devices

Heat sink is 11.1°C/W

1 via pad per ground ball (8-mil wire)

40% copper on signal layers

Board temperature taken at the centre balls

MECHANICAL DATA

62/93 Release 1.5 - Januar

29, 2002

5.3. SO LDERING RECOMMENDA TIONS

High quality, low defect soldering requires

identifying the optimum temperature profile for

reflowing the solder paste, therefore optimizing

the process. The heating and cooling rise rates

must be compatible with the solder paste and

components. A typical profile consists of a

preheat, dryout, reflow and cooling sections.

The most critical parameter in the preheat

section

is to minimize the rate of temperature rise

to less than 2°C / second, in order to minimize

thermal shock on the semi-conductor

components.

Dryout section is used primarily to ensure that

the solder pa ste is fully dried b efore hitting reflow

temperatures.

Solder reflow is accomplished in the reflow zone,

where the solder paste is elevated to a

temperature greater than the melting point of the

solder. Melting temperat ure mu st be exceeded by

approximately 20°C to ensure quality reflow.

In reality the prof ile is not a line, but rather a range

of temperatures all solder joints must be

exposed. The total temperature deviation from

component thermal mismatch, oven loading and

oven uniformity must be within the band.

Figure 5-7. Reflow soldering temperatur e range

Temperature (

C )

Time ( s )

PREHEAT DRYOUT REFLOW COOLING

240

250

200

150

100

DESIGN GUIDELINES

Release 1.5 - January 29, 2002 63/93

6. DESIGN GUIDELINES

6.1. TYPICAL APPLICATIONS

The STPC Consumer-II is well suited for many

applications. Some of the possible

implementations are described below.

6.1.1. WEB BOX

A web box is an analog set top box providing

internet browsing capability to a TV set. It has a

TV output for connecting to the TV set, a modem

for internet connection, a smartcard interface for

the ISP access control, and an infrared interface

for the remote control or the keyboard.

Figure 6-1. Web Box

STPC

TV OUTPUT

CONSUMER-II

SDRAM 64

FLASH

MODEM

AUDIO

PCI

IDE / PCI

SmartCard

R,G,B, CSYNC

S-VHS

CVBS

VIP

STV2310

SCART 1

SCART 2

microphone

Infrared

Printer port

Local B us

ISA Bus

glue logic

DESIGN GUIDELINES

64/93 Release 1.5 - Januar

29, 2002

6.2. STP C CONFIGURATION

The STPC is a very flexible product thanks to

decoupled clock domains and to strap options

enabling a user-optimized conf iguration.

As some trade off are often necessary, it is

important to do an analysis of the application

needs prior to design a system based on this

product. The applicative constraints are usually

the following:

- CPU performance

- graphics / video performances

- power consumption

- PCI bandwidth

- booting time

- EMC

Some other elements can help to tune the choice:

- Code size of CPU Consuming tasks

- Data size and locat ion

On the STPC side, the configurable parameters

are the following:

- synchronous / asynchronous mode

- HCLK speed

- MCLK speed

- CPU cl ock ratio (x1 , x2)

- Local Bus / ISA bus

6.2.1. LOCAL BUS / ISA BUS

The selection b etwe en the IS A b us a nd th e Local

Bus is relatively simple. The first one is a standard

bus but slow. The Local Bus is fast and

programmable but doesn't support any DMA nor

external master mechanisms. The Table 6-1

below summa rize the selection:

Before implementing a function requiring DMA

capability on the ISA bus, it is recommended to

check if it exists on PCI, or if it can be

implemented differently, in order to use the local

bus mode.

6.2.2. CLOCK CONFIGURATION

The CPU clock and the memory clock are

independent unless the "synchronous mode"

strap option is set (see the STRAP OPTIONS

chapter). The potential clock configurations are

then relatively limited as listed in Table 6-2.

The advantage of the synchronous mode

compared to the asynchronous mode is a lower

latency when accessing SDRAM from the CPU or

the PCI (saves 4 MCLK cycles for the first a ccess

of the burst). For the same CPU to Memory

transfer performance, MCLK as to be roughly

higher by 20MHz between SYNC and ASYNC

modes (example: 66MHz SYNC = 96MHz

ASYNC).

In all cases, use SDRAM with CAS Latency

equals to 2 (CL2) for the best performances .

The advantage of the asynchronous mode is the

capability to reprogram the MCLK speed on the

fly. This could help for applications were power

consumption must be optimized.

Regarding PCI bandwidth, the best is to have

HCLK at 100MHz as it gives twice the bandwidth

compared to HCLK at 66MHz .

The last, and more complex, information to

consider is the behaviou r of the software. In case

high CPU or FPU computation is needed, it is

sometime better to be in DX2-133/MCLK=66

synchronous mode than DX2-133/MCLK=100

asynchronous mod e. This depends on the locality

of the number crunching code and the amount of

data manipulated.

The Table 6-3 below gives some examples. The

right column correspond to the configuration

number as described in Table 6-2:

Obviously, the values for HCLK or MCLK can be

reduced compared to Table 6-2 in case there is no

need to push the device at its limits, or when

avoiding to use specific frequency ranges (FM

radio band for example).

Table 6-1. Bus m o de selecti on

Need Selection

Legacy I/O device (Floppy, ...), Super I/O ISA Bus

DMA capability (Soundblaster) ISA Bus

Flash, SRAM, basic I/O device Local Bus

Fast boot Local Bus

Boot flash of 4MB or more Local Bus

Programmable Chip Select Local Bus

Table 6-2. Main STPC modes

CMode HCLK

MHz CPU clock

clock ratio MCLK

MHz

1 Synchronous 66 133 (x2) 66

2 Asynchronous 66 133 (x2) 100

3 Synchronous 100 100 (x1) 100

Table 6-3. Clock mode selection

Constraints C

Need CPU power

Critical code fits into L1 cache 1

Need CPU power

Code or data does not fit into L1 cache 3

Need high PCI bandwitdh 3

Need flexible SDRAM speed 2

DESIGN GUIDELINES

Release 1.5 - January 29, 2002 65/93

6.3. ARCHITE CTURE RECOMMENDATIONS

This section describes the recommend

implementations for the STPC interfaces. For

more details, download the Reference

Schematics from the STPC web site.

6.3.1. POWER DECOUPLING

An appropriate decoupling of the various STPC

power pins is mandatory for optimum behaviour.

When insufficient, the integrity of the signals is

deteriorated, the stability of the system is reduced

and EMC is increas ed.

6.3.1.1. PLL decoupling

This is the most important as the STPC clocks are

generated from a single 14MHz stage using

multiple PLLs which are highly sensitive analog

cells. The freque ncies to filter are the 25-50 KHz

range which correspond to the internal loop

bandwidth of the PLL and the 10 to 100 MHz

frequency of the output. PLL power pins can be

tied together to simplify the board layout.

6.3.1.2. Decoupling of 3.3V and Vcore

A power plane for each of these supplies with one

decoupling capacitance for each power pin is the

minimum. The use of multiple capacitances with

values in decade is the best (for example: 10pF,

1nF, 100nF, 10uF), the smallest value, the closest

to the power pin. Connecting the various digital

power planes through capacitances will reduce

furthermore the overall impedance and electrical

noise.

6.3.2. 1 4MHZ OS CILLAT OR STAGE

The 14.31818 MHz oscillator stage can be

implemented using a quartz, which is the

preferred and cheaper solution, or using an

external 3.3V oscillator.

The crystal must be used in its series-cut

fundamental mode and not in overtone mode. It

must have an Equivalent Series Resistance (ESR,

sometimes referred to as Rm) of less than 50

Ohms (typically 8 Ohms) and a shunt capacitance

(Co) of less than 7 pF. The ba lance capa citors of

16 pF must be added, one connected to each pin,

as described in F igure 6-3.

In the e ve nt of an ex tern al osc illato r prov iding the

master clock s ig nal to t he ST PC Atl as dev ice, t he

LVTTL signal should be connected to XTALI, as

described in Figure 6-3.

As this clock is the reference for all the other on-

chip generated clocks, it is strongly

recommended to shield this stage, including

the 2 wires going to the STPC balls, in order to

reduce the jitter to the minimum and reach the

optimum system stability.

Figure 6-2. P L L deco up ling

VDD_PLL

VSS_PLL

PWR

100nF 47uF

GND

Connect i ons must be as shor t as po ssibl e

Figure 6-3. 14.31818 MHz stage

15pF15pF

XTALOXTALI XTALOXTALI

3.3V

DESIGN GUIDELINES

66/93 Release 1.5 - Januar

29, 2002

6.3.3. SDRAM

The STPC provides all the signals for SDRAM

control. Up to 128 MBytes of main memory are

supported. All Banks must be 64 bits wide. Up to 4

memory banks are available when using 16Mbit

devices. Only up to 2 banks can be connected

when using 64M bit and 128Mbit c omponents due

to the r eallocation of CS2# and CS3# signals. This

is described in Table 6-4 and Table 6-5.

Graphics memory resides at the beginning of

Bank 0. Host memory begins at the top of graphics

memory and extends to the top of populated

SDRAM. Bank 0 must always be populated.

ure 6-4, Fi

ure 6-5 and Fi

ure 6-6 show some

typical implementations.

The purpose of the serial resistors is to reduce

signal oscillation and EMI by filtering line

reflections. The capacitance in Fi

ure 6-4 has a

filtering effect too, while it is us ed for propagat ion

delay compens ation in the 2 other figures.

Figure 6-4. One Mem ory Bank with 4 Chips (16-bit)

CS0#

BA[1:0]

MA[12:0]

WE#

RAS0#

DQM[7:0]

MCLKI

MCLKO

DQM[7:6]

Reference Knot

CAS0#

MD[63:48] DQM[5:4]

MD[47:32] DQM[3:2]

MD[31:16] DQM[1:0]

MD[15:0]

MD[63:0]

MCLKA

MCLKBMCLKCMCLKD

10pF

Length(MCLKI) = Length(MCLKy) with y = {A,B,C,D}

DESIGN GUIDELINES

Release 1.5 - January 29, 2002 67/93

Figure 6-5. One Memory Banks with 8 Chips (8-bit)

Figure 6-6. Two M emory Banks wi th 8 Chips (8-bit)

CS0#

BA[1:0]

MA[12:0]

WE#

RAS0#

DQM[7:0]

MCLKI

MCLKO

DQM[7]

CAS0#

MD[63:56] DQM[0]

MD[7:0]

MD[63:0]

10pF Length(MCLKI) = Length(MCLKy) with y = {A,B,C,D,E,F,G,H}

DQM[1]

MD[15:8]

BCDEFG

CY2305

CS1#

BA[1:0]

MA[12:0]

WE#

RAS0#

DQM[7:0]

MCLKI

MCLKO

DQM[7]

CAS0#

MD[63:56] DQM[0]

MD[7:0]

MD[63:0]

22pF Length(MCLKI) = Length(MCLKyx) with

DQM[1]

MD[15:8]

CS0#

x = {0,1}

y = {A,B,C,D,E,F,G,H}

CY2305

DESIGN GUIDELINES

68/93 Release 1.5 - Januar

29, 2002

For other implementations like 32-bit SDRAM

devices, refers to the SDRAM controller signal multiplexing and address mapping described in

the following Table 6-4 and T able 6-5.

6.3.4. PCI BUS

The PCI bus is always active and the following

control signals must be pulled-up to 3.3V or 5V

through 2K2 resistors even if this bus is not

connected to an external device: FRAME#,

TRDY#, IRDY#, STOP#, DEVSEL#, LOCK#,

SERR#, PCI_REQ#[2:0].

PCI_CLKO must be connected to PCI_CLKI

through a 10 to 33 Ohms resistor. Fi

ure 6-7

shows a typical implement ation.

For more information on layout constraints, go to

the place and route recommendations sectio n.

Ta bl e 6 -4 . DIM M Pi no ut

SDRAM Density 16 Mbit 64/128 Mbit 64/128 Mbit STPC I/F

Internal Banks 2 Banks 2 Banks 4 Banks

DIMM Pin Number

... MA[10:0] MA[10:0] MA[10:0] MA[10:0]

123 - MA11 MA11 CS2# (MA11)

126 - MA12 - CS3# (MA12)

39 - - BA1 (MA1 2) CS3 # (BA1)

122 BA0 (MA11) BA0 (MA13) BA0 (MA13) BA0

Table 6-5. Address Mapp ing

Address Mapping: 16 Mbit - 2 internal banks

STPC I/F BA0 MA10 MA9 MA8 MA7 MA6 MA5 MA4 MA3 MA2 MA1 MA0

RAS Address A11 A22 A21 A2 A19 A18 A17 A16 A15 A14 A13 A12

CAS Address A11 0 A24 A23 A10 A9 A8 A7 A6 A5 A4 A3

Address Mapping: 64/128 Mbit - 2 internal banks

STPC I/F BA0 MA12 MA11 MA10 MA9 MA8 MA7 MA6 MA5 MA4 MA3 MA2 MA1 MA0

RAS Address A11 A24 A23 A22 A21 A20 A19 A18 A17 A16 A15 A14 A13 A12

CAS AddressA110 0 0 A26A25A10A9A8A7A6A5A4A3

Address Mapping: 64/128 Mbit - 4 internal banks

STPC I/F BA0 BA1 MA11 MA10 MA9 MA8 MA7 MA6 MA5 MA4 MA3 MA2 MA1 MA0

RAS Address A11 A12 A24 A23 A22 A21 A20 A19 A18 A17 A16 A15 A14 A13

CAS Address A11 A12 0 0 A26 A25 A10 A9 A8 A7 A6 A5 A4 A3

Figu re 6-7 . Typ ic a l PC I cloc k routi ng

PCICLKI

PCICLKO

PCICLKA

PCICLKB

PCICLKC

0 - 22

10 - 33

De vice A

De vice B

De vice C

0 - 33pF

DESIGN GUIDELINES

Release 1.5 - January 29, 2002 69/93

In the case of higher clock load it is recommended

to use a zero-delay clock buffer as described in

Figure 6-8. This approach is also recommended

when implementing the delay on PCICLKI

according to the PCI section of the Electrical

Specifications chapte r.

Figure 6-8. PCI clock routing with zero-del ay clock bu ffer

PCICLKI

PCICLKO Device A

Device B

Device C

PLL

Device D

PCICLKI

PCICLKO Device A

Device B

Device C

PLL

Device D

CY2305CY2305

Implementation 1 Implementation 2

DESIGN GUIDELINES

70/93 Release 1.5 - Januar

29, 2002

6.3.5. LOCA L BUS

The local bus has al l the signals to connect flash

devices or I/O devices with the minimum glue

logic.

ure 6- 9 de scribes how to connect a 16-bit boot

flash (the correspondin

strap options must be set

accordin

ly).

Figure 6-9. Typical 16-bit boot flash implementation

M58LW064A

STPC

DQ[15:0]

A[22:1]

CLK

3V3

GND

RESET#

PD[15:0]

FCS0#

PWR0#

SYSRSTI#

PRD0#

PA[22:1]

PRD1#

PWR1#

DESIGN GUIDELINES

Release 1.5 - January 29, 2002 71/93

6.3.6. IP C

Most of the IPC signals are multiplexed: Interrupt

inputs, DMA Request inputs, DMA Acknowledge

outputs. The figure below describes a complete

implementation of t he IRQ[15:0] time-multiplexing.

When an interrupt line is used internally, the

corresponding input can be grounded. In most of

the embedded designs, only few interrupts lines

are necessary and the glue logic can be simplified.

When the interface is integrated into the STPC,

the correspondi ng interrupt line can be grounded

as it is connected internally.

For example, if the integrated IDE controller is

activated, the IRQ[14] and IRQ[15] inputs can be

grounded.

Figure 6-10. Typical IRQ multiplexing

74x153

1C0

IRQ[0]

IRQ_MUX[0]

1C1

1C2

1C3

2C0

2C1

2C2

2C3

2Y IRQ_MUX[1]

IRQ[1]

IRQ[2]

IRQ[3]

IRQ[4]

IRQ[5]

IRQ[6]

IRQ[7]

74x153

1C0

IRQ_MUX[2]

1C1

1C2

1C3

2C0

2C1

2C2

2C3

2Y IRQ_MUX[3]

IRQ[8]

IRQ[9]

IRQ[10]

IRQ[11]

IRQ[12]

IRQ[13]

IRQ[14]

IRQ[15]

ISA_CLK2X

ISA_CLK

Ti m er 0

Keyboard

Slave P IC

COM2/COM4

COM1/COM3

LPT2

LPT1

RTC

Mouse

FPU

PCI / ID E

Floppy

DESIGN GUIDELINES

72/93 Release 1.5 - Januar

29, 2002

The figure below describes a complete

implementation of the external glue logic for DMA

Request time-multiplexing and DMA Acknowledge

demultiplexing. Like for the interrupt lines, this

logic can be simplified when only few DMA

channels are used in the application.

This glue logic is not needed in Local bus mode as

it does not s up port DMA transfers.

Figure 6-11. Typical DMA multiplexing and demultiplexing

74x153

1C0

DRQ[0]

DREQ_MUX[0]

1C1

1C2

1C3

2C0

2C1

2C2

2C3

2Y DREQ_MUX[1]

DRQ[1]

DRQ[2]

DRQ[3]

DRQ[4]

DRQ[5]

DRQ[6]

DRQ[7]

74x138

Y0#

G2B

DACK0#

Y1#

Y2#

Y3#

Y4#

Y5#

Y6#

Y7#

G2A

ISA_CLK2X

ISA_CLK

ISA, Refresh

ISA, PIO

ISA, FDC

ISA, PIO

Slave DMAC

ISA

DMA_ENC[0]

DMA_ENC[1]

DMA_ENC[2]

DACK1#

DACK2#

DACK3#

DACK5#

DACK6#

DACK7#

DESIGN GUIDELINES

Release 1.5 - January 29, 2002 73/93

6.3.7. IDE / ISA DYNAMIC DEMULTIPLEXING

Some of the ISA bus signals are dynamically

multiplexed to optimize the pin c ount. Figure 6-12

describes how to implement the external glue

logic to demu ltiplex the IDE and ISA interfaces. In

Local Bus mode the two buffers are not needed

and the NAND gates can be simplified to inverters.

6.3 .8. BASIC AUDIO USING IDE IN TERFACE

When the application requires only basic audio

capabilities, an audio DAC on the IDE interface

can avoid using a PCI-based audio device. This

low cost solution is no t C PU cons uming t hanks t o

the DMA controller implemented in the IDE

controller and can generate 16-bit stereo sound.

The clock speed is programmable when using the

speaker output.

Figure 6 -12. Typical IDE / ISA Demultiplexing

MASTER#

74xx245

RMRTCCS#

DIR

ISAOE#

KBCS#

RTCRW#

RTCDS

SA[19:8]

STPC bus / DD[15:0]

LA[24]

LA[25]

LA[22]

LA[23]

SCS1#

SCS3#

PCS1#

PCS3#

Figure 6-13. Basic audio on IDE

74xx74

DD[15:0]

DPR

RST

D[15:0]

CS#PCS1 WR#

A/B

Au di o Out

Right

Left

Stereo DAC

PDRQ

SYSRSTO#

Speaker

PDIOW#

Vcc

STPC

QD PR

RST

Note * : the inverter can be removed when the DAC CS# is directly connected to GND

DESIGN GUIDELINES

74/93 Release 1.5 - Januar

29, 2002

6.3.9. VG A INTERFACE

The STPC integrates a voltage reference and

video buffers. The amount of external devices is

then limited to the minimum as described in the

ure 6-14.

All the resistors and capacitors have to be as

close as possible to the STPC while the circuit

protector DALC112S1 must be close to the VGA

connector.

The DDC[1:0] lines, not represented here, have

also to be protected when they are used on the

VGA connector.

COL_SEL can be used when implementing the

Picture-In-Picture function outside the STPC, for

example when multiplexing an analog video

source. In that case, the CRTC of the STPC has to

be genlocked to this analog source.

DCLK is usually used by the TFT display which

has RGB inputs in order to synchronise the picture

at the level of the pixel.

When the VGA interface is not needed, the signals

R, G, B, HSYNC, VSYNC, COMP, RSET can be

left unconnected, VSS_DAC and V DD_ DAC must

then be connected to GND.

Figure 6-14. Typical VGA implementation

143

VDD_DAC

COMP

VREF_DAC

RSET

VSS_DAC

2.5V

10nF

100nF 47uF

AGND

COL_SEL

DCLK

HSYNC

VSYNC

75 1% DALC112S1

AGND3.3V

100nF

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Release 1.5 - January 29, 2002 75/93

6.3.10. TV INTERFAC E

The STPC integrates a voltage reference and

video DACs. The amount of external devices is

then limited to video buffers as described in the

Figure 6-15.

The connec tion from IREF x and VREFx u p to the

20 ohms resistors must be as short as possible.

The constraint is the same for the connection from

VDDA_TV and VSSA_TV up to the decoupling

capacitances.

The resistors and capacitors of the amplifier stage

have to be as close as possible to the video buffer.

When the TV interface is not needed , the signals

RED, GREEN, BLUE, CVBS, IREF1, IREF2 can

be left unconnected, VDDA_TV must then be

connected to GND.

R,G,B,CVBS outputs:

. Io u tmax = 80.704 / Rref < 5mA

. Rload = 274 ohms

. Vout = {10-bit code} x Rload x 0.079 / Rref

Fine tuning of the maximum output level must be

done using the gain control registers 0x11 to 0x13

of the integrated Digital Encoder (write the value

0x0B for a gain of 109%).

Figure 6-15. Typical VGA implem entation

20 1%

IREF1

VREF1

IREF2

VREF2

VDDA_TV 2.5V

10nF

100nF 22uF

DCLK

CVBS

RED

GREEN

BLUE 316 1%

27MHz

47pF

FBEAD

VSSA_TV

AGND

GND

3.3V

FBEAD

100nF

GND

same

as for

RED

AGND

15uH

AGND

526

1% 326

1% 478 1%

AGND

VCCA

To the connecto r

75 1%

TSH74

100nF 22uF

FBEAD

AGND FBEAD GND

VCCA

GND

Rref = 20K 1%

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76/93 Release 1.5 - Januar

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6.3.11. JTAG INTER FA CE

The STPC integrates a JTAG interface for scan-

chain and on-board testing. The only external

device neede d are the pull up resistors. Fi

ure 6-

16 describes a typical implementation using these

devices.

Figure 6-16. Typical JT AG implementation

STPC

TCLK

TDO

3V3 Connector

910

TMS

TDI

TRST

3V3 3V3 3V3

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6.4. PLACE AND ROUTE

RECOMMENDATIONS

6.4.1. GENERAL RECOMMENDATIONS

Some STPC Interfaces run at high speed and

need to be carefully routed or even shielded like:

1) Me mory In t e r face

2) PCI bus

3) Graphics and video interfaces

4) 14 MHz oscillator stage

All clock signals have to be routed first and

shielded for speeds of 27MHz or hi gher. The h igh

speed signals follow the same constraints, as for

the memory and PCI control signals.

The next interfaces to be routed are Memory, PCI,

and Video/graphics.

All the analog noise-sensitive signals have to be

routed in a separate area and hence can be

routed indepedently.

6.4.2. PLL DEFINITION AN D IMPLIMENT ATION

PLLs are analog cells which supply the internal

STPC Clocks. To get the cleanest clock, the jitter

on the power supply must be reduced as much as

possible. This will result in a more stable syste m.

Each of the integrated PLL has a dedicated power

pin so a single power plane for all of these PLLs,

or one wire for each, or any solution in between

which help the layout of the board can be used.

Powering these pins with one Ferrite +

capacitances is enough. We recommend at least

2 capacitances: one 'big' (few uF) for power

storage, and one or 2 smalls (100nF + 1nF) for

noise filtering.

Figure 6-17. Shielding signals

ground ring

ground pad

shielded signal line

ground pad shielded signal lines

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6.4.3. MEM ORY INTERFACE

6.4.3.1. Introduction

In order to achieve SDRAM memory interfaces

which work at clock frequencies of 100 MHz and

above, careful consideration has to be given to the

timing of the interface with all the various electrical

and physical constraints taken i nto consideration.

The guidelines described below are related to

SDRAM components on DIMM modules. For

applications where the memories are directly

soldered to the motherboard, the PCB should be

laid out such that the trace lengths fit within the

constraints shown here. The traces could be

slightly shorter since the extra routing on the

DIMM PCB is no longer present but it i s t hen up to

the user to verify the timing s.

6.4.3.2. SDRAM Clocking Scheme

The SDRAM Clocking Scheme deserves a special

mention here. Basically the memory clock is

generated on-chip through a PLL and goes

directly to the MCLKO output pin of the STPC. The

nominal frequency is 100 MHz. Because of the

high load p rese nted to th e M CLK on the board by

the DIMMs it is recommended to rebuffer the

MCLKO signal on the board and balance the skew

to the clock ports of the different DIMMs and the

MCLKI input pin of STPC.

6.4.3.3. Board Layout Issues

The physical layout of the motherboard PCB

assumed in this presentation is as shown in Fi

ure

6-19. Because all of the memory interface signal

balls are located in the same region of the STPC

device, it is possible to orientate the device to

reduce the trace lengths. The worst case routing

length to the DIMM1 is estimated to be 100 mm.

Solid power and ground planes are a must in order

to provide good return paths for the signals and to

reduce EMI and noise. Also there should be am ple

high frequency decoupling between the power

and ground planes to provide a low impedance

path between the planes for the return paths for

signal routings which change layers. If possible,

the traces shou ld be routed adjacent to the s ame

power or ground p lane for the length of the trace.

For the SDRAM interface, the most critical signal

is the clock. Any skew between the clocks at the

SDRAM components and the memory controller

will impact the timing budget. In order to get well

matched clocks at all components it is

recommended that all the DIMM clock pins, STPC

Figure 6-18. Clock Scheme

DIMM1

MCLKI

MCLKO

DIMM2

PLL

MA[ ] + Control

MD[63:0]

SDRAM

CONTROLLER

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memory clock input (MCLKI) and any other

component using the memory clock are

individually driven from a low skew clock driver

with matched routing lengths. In other words, all

clock line lengths that go from the buffer to the

memory chips (MCLKx) and from the buffer to the

STPC (MCLKI) must be identical.

This is show n in F igure 6-20.

The maximum skew between pins for this part is

250ps. The important factors for the clock buffer

are a consistent drive strength and low skew

between the outputs. The delay through the buffer

is not important so it does not have to be a zero

delay PLL type buffer. The trace lengths from the

clock driver to the DIMM CKn pins should be

matched exactly. Since the propagation speed

can vary between PCB layers, the clocks should

be routed in a consistent way. The routing to the

STPC memory input s hould be longer by 75 mm to

compensate for the extra clock routing on the

DIMM. Also a 20 pF capacitor should be placed as

near as possible to the clock input of the ST PC to

compensate for the DIMM’s higher clock load. The

impedance of the t race used for the cl ock routing

should be matched to the DIMM clock trace

impedance (60-75 ohms).To minimise crosstalk

the clocks should be routed with spacing to

adjacent tracks of at least twice the clock trace

width. For designs which use SDRAMs directly

mounted on the motherboard PCB all the clock

trace lengths should be matched exactly.

Figure 6-19. DIMM placement

DIMM2

DIMM1

STPC

35mm

15mm

10mm

116mm

SDRAM I/F

Figure 6-20. Clock Routing

MCLKO

DIMM CKn input

STPC MCLKI

DIMM CKn input

Low skew clock driver:

L+75mm*

20pF

* No additional 75mm when SDRAM directly soldered on board

DESIGN GUIDELINES

80/93 Release 1.5 - Januar

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The DIMM sockets should be populated starting

with the furthest DIMM from the STPC device f irst

(DIMM1). There are two types of DIMM devices;

single-row and dual-row. The dual-row devices

require two chip select signals to select between

the two rows. A STPC device with 4 chip select

control lines could control either 4 single-row

DIMMs or 2 dual-row DIMMs. When only 2 chip

select cont rol li nes are ac tivated, o nly two s ingle-

row DIMMs or one dual-row DIMM can be

controlled.

When using DIMM modules, schematics have to

be done carefully in order to avoid data buses

completely crossing on the board. This has to be

checked at the library level. In order to achieve the

layout shown in Fi

ure 6-21, schematics have to

implement the crossing described in Fi

ure 6-22.

The DQM signals must be exchanged using the

same order.

6.4.3.4. Summary

For unbuffered DIMMs the address/control signals

will be t he m o s t cr iti ca l for ti mi n g. Th e s imu lat io ns

show that for these signals the best way to drive

them is to use a parallel termination. For

applications where speed is not so critical series

termination can be used as this will save power.

Using a low impedance such as 50Ω for these

critical traces is recomm ended as it both reduc es

the delay and the overshoot.

The other memory interface signals will typically

be not as critical as the address/control signals.

Using lower impedance traces is also beneficial

for the other signals but if their timing is not as

critical as the address/control signals they could

use the default value. Using a lower impedance

implies using wider traces which may have an

impact on the routing of the board.

The layout of this interface can be validated by an

electrical simulation using the IBIS model

available on the STPC web site.

Figure 6-21. Optimum Data Bus Layout for DIMM

Figure 6-22. Schematics for Optimum Data Bus Layout for DIMM

DIMM

STPC

SDRAM I/F

D[15:00] D[31:16]

D[47:32] D[63:48]

MD[31:00]

MD[63:32]

MD[15:00],DQM[1:0]

MD[31:16],DQM[3:2]

MD[47:32],DQM[5:4]

MD[63:48],DQM[7:6]

D[15:00],DQM[1:0]

D[31:16],DQM[3:2]

D[47:32],DQM[5:4]

D[63:48],DQM[7:6]

DIMMSTPC

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6.4 .4. PCI INT ERFACE

6.4.4.1. Introduction

In order to achieve a PCI interface which work at

clock frequencies up to 33MHz, careful

consideration has to be given to the timing of the

interface with all the various electrical and

physical constrain ts taken into consideration.

6.4.4.2. PCI Clocking Scheme

The PCI Clocking Scheme deserves a special

mention here. Basically the PCI clock (PCICLKO)

is generated on-chip from HCLK through a

programma ble delay line and a clock divider. The

nominal frequency is 33MHz. This clock must be

looped to PCI CLK I and goes to th e internal S outh

Bridge through a deskewer. On the contrary, the

internal North Bridge is clocked by HCLK, putting

some additionnal const raints on T0 and T1.

Figure 6-23. Clock Scheme

HCLK PLL

1/2

1/3

1/4

clock

Strap Options

PCICLKO

PCICLKI

HCLK

AD[31:0]

South

North

Deskewer

MUX

delay

STPC

MD[30:27] MD[17,4]

MD[7:6]

Bridge

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82/93 Release 1.5 - Januar

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6.4.4.3. Board Layout Issues

The physical layout of the motherboard PCB

assumed in this presentation is as shown in Fi

ure

6-24. For the PCI interface, the most critical signal

is the clock. Any skew between the clocks at the

PCI components and the STPC will impact the

timing budget. In order to get well matched clocks

at all components it is recommended that all the

PCI clocks are individually driven from a serial

resistance with matched routing lengths. In other

words, all clock line lengths that go from the

resistor to the PCI chips (PCICLKx) must be

identical.

The figure below is for PCI devices soldered on-

board. In the case of a PCI slot, the wire length

must be shortened by 2.5" to compensate the

clock layout on the PCI board. The maximum

clock skew between all devices is 2ns according

to PCI specifications.

The Fi

ure 6-25 describes a typical clock delay

implementation. The exact timing constraints are listed in the PCI section of the Electrical

Specifications Chapter.

Figure 6-24. T ypi cal PCI clock rou ting

Length(PCICLKI) = Length(PCICLKx) with x = {A,B,C}

Note: The value of 22 Ohms cor responds to tracks wit h Z

= 70 Ohms.

PCICLKI

PCICLKO

PCICLKA

PCICLKB

PCICLKC

De vice A

De vice B

De vice C

Figure 6-25. Clocks relationships

PCICLKO

PCICLKI

HCLK

PCICLKx

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6.4.5. THE RMAL DI SSIP ATION

6.4.5.1. Power saving

Thermal dissipation of the STPC depends mainly

on supply voltage. When the system does not

need to work at the upper voltage limit, it may

therefore be beneficial to reduce the voltage to the

lower voltage limit, where possible. This could

save a few 100’s of mW.

The second area to look at is unused interfaces

and functions. Depending on the application,

some input signals can be grounded, and some

blocks not powered or shutdown. Clock speed

dynamic adjustment is al so a s olution t hat c an be

used along with the integrated power

management unit.

6.4.5.2. Thermal balls

The standard way to route thermal balls to ground

layer implements only one via pad for each ball

pad, connected using a 8-mil wire.

With such configuration the P lastic BG A package

does 90% of the thermal dissipation through the

ground balls, and especially the central thermal

balls which are di rectly connected to the die. The

remaining 10% is dissipated through the case.

Adding a heat sink reduces this value to 85%.

As a result, some basic rules must be followed

when routing the STPC in order to avoid thermal

problems.

As the whole ground layer acts as a heat sink, the

ground balls must be directly connected to it, as

illustrated in Figure 6-26. If one ground layer is not

enough, a second ground plane may be added.

When possible, it is important to avoid other

devices on-board using the PCB for heat

dissipation, like linear regulators, as this would

heat the STPC itself and reduce the temperature

range of the whole s ystem , In case the se dev ices

can not use a separate heat sink, they must not be

located just near the STPC

Figu re 6- 26. Ground routi ng

Pad for ground ball

Thru hole to ground layer

Top Layer : Signals

Power layer

Internal layer: signals

Bottom Layer : ground layer

Note: For better visibility, ground balls are not all routed.

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84/93 Release 1.5 - Januar

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When considering thermal d issipation, one o f the

most important parts of the layout is the

connection between the ground balls and the

ground layer.

A 1-wire conne ction is s hown in Fi

ure 6-27. T h e

use of a 8-mil wire results in a therm al resistance

of 105°C/W assuming copper is used (418 W/

m.°K). This high value i s due to the thickness (34

µm) of the copper on the external side of the PCB.

Considering only the central matrix o f 36 thermal

balls and one via for each ball, the global therm al

resistance is 2.9°C/W. This can be easily

improved using four 12.5 mil wires to connect to

the four vias around the ground pad link as in

ure 6-28. This gives a total of 49 vias and a

global resistance for the 36 thermal balls of 0.5°C/

The use of a ground plane like in Fi

ure 6-29 is

even better.

Fig ure 6 -2 7. R ecom m ended 1 -wi re Po wer/Gr ound P ad Layout

Solder Mask (4 mil)

Pad for ground ball (diamete r = 25 mil)

Hole to ground layer (diameter = 12 mil)

Connection Wire (width = 12.5 mil)

Via (diameter = 24 mil)

34.5 mil

1 mil = 0.0254 m m

Figu re 6-2 8. Rec o m m ende d 4-wi re Gr ound P a d Layout

4 via pad s for each ground ball

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To avoid s older wicking over t o the via pads during

soldering, it is important to have a solder mas k of

4 mil around the pad (NSMD pad). This gives a

diameter of 33 mil for a 25 mil ground pad.

To obtain the optimum ground layout, place the

vias directly under the ball pads. In this case no

local board distortion is tolerated.

6.4.5.3. Heat dissipation

The thickness of the copper on PCB layers is

typically 34 µm for external layers and 17 µm for

internal layers. This means that thermal

dissipation is not good; high board temperatures

are concentrated around the devices and these

fall quickly with increased distance.

Where possible, place a metal layer inside the

PCB; this improves dramatically the spread of

heat and hence the thermal dissipation of the

board.

The possibility of using the whole system box for

thermal diss ipation is very us eful in cases o f high

internal temperatures and low outside

temperatures. Bot tom side of the PBGA should be

thermally co nnected to the metal cha ssis in order

to propagate the heat flow through the metal.

Thermally connecting also the top side will

improve furthermore the heat dissipation. Figure

6-30 illust r ates s uc h a n imple m e ntation .

Figu re 6- 29. Opt i m um La yout for C ent r a l Ground B al l - top layer

Via to Ground layer

Pad for ground ball

Clearance = 6mil

diame ter = 25 mil

hole diam eter = 14 mil

Sol der mask

diame ter = 33 mil

External diameter = 37 mil

conne ction s = 10 mil

Figure 6-30. Use of Metal Plate for Thermal Dissipation

Metal planes Th ermal conduc tor

Board

Die

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As the PCB acts as a heat sink, the layout of top

and ground layers must be done with care to

maximize the board surface dissipating the heat.

The only limitation is the risk of losing routing

channels. Fi

ure 6-31 and Fi

ure 6-32 show a

routing with a good thermal dissipation thanks to

an optimized placement of power and signal vias.

The ground plane should be on bottom layer for

the best heat spreading (thicker layer than internal

ones) and dissipation (direct contact with air). .

Figure 6-31. Layout for Good Thermal Dissipation - top layer

3.3V ball

2.5V ball (Core / PLLs)

Via

STPC ball GN D ball

Not Conn ected ball

DESIGN GUIDELINES

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Figure 6-32. Recommend signal wiring (top & ground layers) with corresponding heat flow

STPC balls

External row

I n t ernal row

GND PowerPower

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88/93 Release 1.5 - Januar

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6.5. DEB UG METH ODOL OGY

In order to bring a STPC-based board to life with

the best efficiency, it i s recommended to follow the

check-list described in this section.

6.5.1 . POWER SUPPL IES

In parallel with the assembly process, it is useful to

get a bare PCB to check the potential short-

circuits between the various power and ground

planes. This test is also recommended when the

first boards are back from assembly. This will

avoid bad surprises in case of a short-circuit due

to a bad soldering.

When the system is powered, all power supplies,

including the PL L power pins must be checked t o

be sure the right level is present. See Table 4-2 for

the exact supported voltage range:

VDD_CORE: 2.5V

VDD_xxxPLL : 2.5V

VDD: 3.3V

6.5.2 . BOO T SEQUENC E

6.5.2.1. Reset input

The checking of the reset sequence is the next

step. The waveform o f SYSRST I# must complies

with the timings described in Fi

ure 4-3. This

signal must not have glitches and must stay low

until the 14.3181 8MHz outpu t (OSC14M) is a t the

right frequency and the strap options are

stabilized to a valid configuration.

In case this clock is not present, check the 14MHz

oscillator stage (see Fi

ure 6- 3).

6.5.2.2. Strap options

The STPC has been designed in a way to allow

configurations for test purpose that differs from the

functional configuration. In many cases, the

troubleshootings at this stage of t he debug are the

resulting of bad strap options. This is why it is

mandatory to check they are properly setup and

sampled during the boot sequen ce.

The list of all the strap options is summarized at

the beginning of Section 3.

6.5.2.3. Clocks

Once OSC14M is checked and correct, the next

signals to measure are the Host clock (HCLK),

PCI clocks (PCI_CLKO, PCI_CLKI) and Memory

clock (MCLKO , MCLKI).

HCLK must run at the speed defined by the

corresponding strap options (see Table 3-1) and

must not be m ore than 100MHz. In x2 CPU clock

mode, this clock mu st be limited to 66MHz.

PCI_CLKI a nd PCI_CLK O m ust be connected as

described in Fi

ure 6-19 and not be higher than

33MHz. Their speed depends on HCLK and on

the divider ratio defined by the MD[4] and MD[17]

strap options as described in Section 3.

To ensure a correct behaviour of the device, the

PCI des kewing logic must b e configured properly

by the M D[ 7:6 ] strap o ptions acc ordin g t o Sec t ion

3. For timing s constra ints, refers to Section 4.

MCLKI and MCLKO must be connected as

described in Fi

ure 6-3 to Fi

ure 6-5 depending

on the SDRAM implementation. The memory

clock must run at HCLK speed when in

synchronous mode and must not be higher than

100MHz in any case.

6.5.2.4. Reset output

If SYSRSTI# and all clocks are correct, then the

SYSRSTO# output signal should behave as

described in Fi

ure 4-3.

6.5.3. ISA MODE

Prior to check the ISA bus control signals,

PC I_ C L KI, ISA_C LK , ISA_CLK2 X, and D EV_ C L K

must be running properly. If it is not t he case , it is

probably because one of the previous steps has

not been completed.

6.5.3.1. First code fetches

When booting on the ISA bus, the two key signals

to check at the very beginning are RMRTCCS#

and FRAM E#.

The first one is a Chip Select for the boot flash

and is multiplexed with the IDE interface. It should

toggle together with ISAOE# and MEMRD# to

fetch the first 16 bytes of code. This corresponds

to the l oadin g of the first line of the CPU cache.

In case RMRTCCS# does not toggle, it is then

necessary to check the PCI FRAME# signal.

Indeed the ISA controller is part of the South

Bridge and all ISA bus cycles are visible on the

PCI bus.

If there is no activity on the PCI bus, then one of

the previous steps has not been c hecked properly.

If there is activity then there must be something

conflicting on the ISA bus or on the PCI bus.

6.5.3.2. Boot Flash size

The ISA bus supports 8-bit and 16-bit memory

devices. In case of a 16-bit boot flash, the signal

MEMCS16# must be activated during

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RMRTCCS# cycle to inf orm the IS A controller of a

16-bit device.

6.5.3.3. POST code

Once the 16 first bytes are fetched and decoded,

the CPU core continue its execution depending on

the content of these first data. Usually, it

corresponds to a JUMP instruction and the code

fetching continues, generating read cycles on the

I SA bus.

Most of the BIOS and boot loaders are reading the

content of the f lash, decompressin g i t in S DRAM,

and then continue the execution by jumping to the

entry point i n RAM. This boot process ends with a

JUMP to the entry point of the OS launcher.

These various steps of the booting sequence are

codified by the so-called PO ST codes (Pow er-O n

Self-Test). A 8-bit code is written to the port 80H at

the beginning of each stage of the booting process

(I/O write to address 0080H) and can be displayed

on two 7-segment display, enabling a fast visual

check of the booting completion level .

Usually, the last POST code is 0x00 and

corresponds to the ju mp into the OS launcher.

When the execution fails or hangs, the lastest

written code stays visible on that display,

indicating either the piece of code to analyse,

either the area of the hardware not working

properly.

6.5.4. LOCAL BUS MODE

As the Local Bus controller is located into the Host

interface, there is no access to the cycles on the

PCI, reducing the amount of signals to check.

6.5.4.1. First code fetches

When booti ng on the Local Bu s, the key signal to

check at the very begin ning i s FCS 0#. This signal

is a Chip Select for the boot flash and should

toggle together with PRD# to fetch the first 16

bytes of code. This corres ponds t o the l oading of

the firs t line o f the CPU ca c he.

In case FCS0# does not toggle, then one of the

previous steps has not been done properly, like

HCLK speed and CPU clock multiplier (x1, x2).

6.5.4.2. Boot Flash size

The Local Bus support 16-bit boot memory

devices only.

6.5.4.3. POST code

Like in ISA mode, POST codes can be

implemented on the Local Bus. The difference is

that an IOCS# must be programmed at I/O

address 80H prior to writing these c ode, the POST

display being con nected to this IO CS# and t o the

lower 8 bits of the bus.

6.5.5. SUMMARY

Here is a check-list for the STPC board debug

from power-on to CPU e xe cution.

For each step, in case of failure, verify first the

corresponding balls of the STPC:

- check if the voltage or activity is correct

- search for potential shortcuts.

For troubleshooting in steps 5 to 10, verify the

related strap options:

- value & connection. Refer to Section 3.

- see Figure 4-3 for timing constraints

Steps 8a and 9a are for debug in ISA mode while

steps 8b and 9b are for Local Bus mode.

Check: How? Troubleshooting

1Power

supplies

Verify that voltage is within specs:

- this must include HF & LF noise

- avoid full range sweep

Refer to Table 4-1 for values

Measure voltage near STPC balls:

- use very low GND connection.

Add some decoupling capacitor:

- the smallest, the nearest to STPC balls.

2 14.318 MHz Verify OSC14M speed The 2 capacitors used with the quartz must

match with the capacitance of the crystal.

Try other values.

3SYSRSTI#

(Power Good) Measure SYSRSTI# of STPC

See Figure 4-3 for waveforms.

Verify reset generation circuit:

- device reference

- components value

5 HCLK Measure HCLK is at selected frequency

25MHz < HCLK < 100MHz HCLK wire must be as short as possible

DESIGN GUIDELINES

90/93 Release 1.5 - Januar

29, 2002

6.6.

6 PCI clocks

Measure PCICLKO:

- maximum is 33MHz by standard

- check it is at selected frequency

- it is generated from HCLK by a division

(1/2, 1/3 or 1/4)

Check PCICLKI equals PCICLKO

Verify PCICLKO loops to PCICLKI.

Verify maximum skew between any PCI clock

branch is below 2ns.

In Synchronous mode, check MCLKI.

7Memory

clocks

Measure MCLKO:

- use a low-capacitance probe

- maximum is 100MHz

- check it is at selected frequency

- In SYNC mode MCLK=HCLK

- in ASYNC mode, default is 66MHz

Check MCLKI equals MCLKO

Verify load on MCLKI.

Verify MCLK programming (BIOS setting).

4 SYSRSTO# Measure SYSRSTO# of STPC

See Fi

ure 4-3 for waveforms.

Verify SYSRSTI# duration.

Verify SYSRSTI# has no glitch

Verify clocks are running.

8a PCI cycles

Check PCI signals are toggling:

- FRAME#, IRDY#, TRDY#, DEVSEL#

- these signals are active low.

Check, with a logic analyzer, that first

PCI cycles are the expected ones:

memory read starting at address with

lower bits to 0xFFF0

Verify PCI slots

If the STPC don’t boot

- verify data read from boot memory is OK

- ensure Flash is correctly programmed

- ensure CMOS is cleared.

ISA

cycles

boot memory

Check RMRTCCS# & MEMRD#

Check direct ly on boot memory pin

Verify MEMCS16#:

- must not be asserted for 8-bit memory

Verify IOCHRDY is not be asserted

Verify ISAOE# pin:

- it controls IDE / ISA bus demultiplexing

8b Local Bus

cycles

boot memory

Check FCS0# & PRD#

Check direct ly on boot memory pin Verify HCLK speed and CPU clock mode.

Check, with a logic analyzer, that first

Local Bus cycles are the expected one:

memory read starting at the top of boot

memory less 16 bytes

If the STPC don’t boot

- verify data read from boot memory is OK

- ensure Flash is correctly programmed

- ensure CMOS is cleared.

The CPU fills its first cache line by fetching 16 bytes from boot memory.

Then, first instructions are executed from the CPU.

Any boot memory access done after the first 16 bytes are due to the instructions executed by the CPU

=> Minimum hardware is correctly set, CPU executes code.

Please have a look to the Bios Writer’s Guide or Programming Manual to go further with your board testing.

Check: How? Troubleshooting

ORDERING DATA

Release 1.5 - January 29, 2002 91/93

7. ORDERING DATA

7.1. ORDERING CODES

ST PC C4 E E B C

STMicroelectronics

Prefix

Product Family

PC: PC Compatible

Product ID

C4: Consumer-II

Core Speed

E: 100 MHz

H: 133 MHz

Memory Interface Speed

D: 90 MHz

E: 100 MHz

Package

B: 388 Overmoulded BGA

Temperature Range

C: Commercial

Case Temperature (Tcase) = 0°C to +85°C

I: Industrial

Case Temperature (Tcase) = -40°C to +115°C

ORDERING DATA

92/93 Release 1.5 - Januar

29, 2002

7.2. AVAIL ABLE PART NUMBERS

7.3. CUSTOMER SERVICE

More information is available on the

STMicroelectronics Internet site

http://

www.st.com/stpc

Part Number Core Frequency

( MHz ) CPU Mode

( X1 / X2 ) Interface

Speed (MHz) Tcase Range

( °C )

STPCC4HEBC 133 X2 100 0°C to +85°

STPCC4HEBI 133 X2 100 -40°C to +115°

STPCC5HEBC 133 X2 100 0°C to +85°

STPCC5HEBI 133 X2 100 -40°C to +115°

Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences

of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted

by i m pl i cat i on or oth erwi se under any pat ent or pat ent r i ghts of S T M i croelectroni cs. Spec i ficat i ons m ent i oned i n this public at ion are subject

to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics product s are not

authorized f or use as c ritical com ponents in li fe su pport dev i ces or sy st ems wi t hout exp ress wri tt en approva l of STMi croelectr onics.

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Release 1.5

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