Redpine Signals, Inc. Proprietary and confidential Page 3
Server
Data Sheet
Version 1.3
Table of Contents
1: Detailed Feature List ............................................................ 7
1.1: Host Interfaces...................................................................... 7
1.2: General Purpose Input/Output .............................................. 7
1.3: WLAN .................................................................................... 7
1.3.1: MAC .............................................................................................. 7
1.3.2: Baseband Processing .................................................................... 7
1.3.3: RF ................................................................................................. 8
1.4: Networking Protocols ............................................................ 8
1.5: Configuration......................................................................... 8
1.6: Coexistence ........................................................................... 8
1.7: Software ............................................................................... 8
1.8: Compliance and Certification.................................................. 9
2: Pin Description ................................................................... 10
2.1: Module Pinout...................................................................... 10
2.2: Pin Description .................................................................... 11
3: Electrical Characteristics .................................................... 15
3.1: Absolute Maximum Ratings.................................................. 15
3.2: Recommended Operating Conditions .................................... 15
3.3: DC Characteristics – Digital I/O Signals ............................... 15
3.4: AC Characteristics................................................................ 16
3.4.1: SPI Interface .............................................................................. 16
3.4.1.1: Low Speed Mode ................................................................... 16
3.4.1.2: High Speed Mode .................................................................. 17
3.4.2: JTAG Interface............................................................................ 17
4: Performance Specifications ................................................ 19
4.1: Wireless Specifications ........................................................ 19
4.2: Standards Compliance ......................................................... 19
5: Software Details................................................................. 20
5.1: Host .................................................................................... 21
5.1.1: UART........................................................................................... 21
5.1.2: SPI ............................................................................................. 21
5.1.3: Thin SPI Driver ........................................................................... 21
5.2: RS9110-N-11-26.................................................................. 21
5.2.1: SPI ............................................................................................. 21
5.2.2: UART........................................................................................... 22
5.2.3: Host Abstraction Layer (HAL) ..................................................... 22
5.2.4: Wireless Control Block (WCB)..................................................... 22
5.2.4.1: Wi-Fi Control frames ............................................................. 22
5.2.4.2: TCP/IP Control frames.......................................................... 22
5.2.5: Station Management Entity (SME) .............................................. 22
5.2.6: WPA Supplicant .......................................................................... 22
6: Ordering Information ......................................................... 23
6.1: Contact Information ............................................................ 23
6.2: Device Ordering Information................................................ 23
6.3: Collateral............................................................................. 24