TLP627M(E(O - TOSHIBA

TLP627M,TLP627MF

1

Photocouplers Infrared LED & Photo Darlington Transistor

TLP627M,TLP627MF

Start of commercial production

2018-12

1.

1. Applications

Applications

• Programmable Logic Controllers (PLCs)

• I/O Interface Boards

• Home Electric Appliances

2.

2. General

General

TLP627M is a photocoupler that consists of an infrared emitting diode optically coupled to a photo darlington

transistor. Housed in a 4pin DIP, it has a high noise immunity and high insulation. With the high breakdown

voltage between the collector and emitter, TLP627M is suitable in applications such as 100 V DC output modules

of programmable controllers.

TLP627MF is a lead forming type for the long creepage mounting of TLP627M.

3.

3. Features

Features

(1) Collector-emitter voltage: 300 V (min)

(2) Current transfer ratio: 1000 % (min) (@IF = 1 mA, VCE = 1 V)

(3) Isolation voltage: 5000 Vrms (min)

(4) Operating temperature: -55 to 110 

(5) Safety standards

UL-recognized: UL 1577, File No.E67349

cUL-recognized: CSA Component Acceptance Service No.5A File No.E67349

VDE-approved: EN 60747-5-5, EN 62368-1 (Note 1)

(Note 1)

CQC-approved: GB4943.1, GB8898 Japan Factory (Pending)

Note 1: When a VDE approved type is needed, please designate the Option (D4)

Option (D4)

Option (D4).

2018-12-06

Rev.1.0

Toshiba Electronic Devices & Storage Corporation

TLP627M,TLP627MF

2

4.

4. Packaging (Note)

Packaging (Note)

TLP627M

11-5B2S

TLP627M(LF1,TP1)

11-5B201S

TLP627M(LF5,TP5)

11-5B205S

TLP627MF

11-5B202S

TLP627MF(LF4,TP4)

11-5B204S

Note: Through-hole type: TLP627M, TLP627MF

Lead forming option: (LF1), (LF4), (LF5)

Taping option: (TP1), (TP4), (TP5)

5.

5. Pin Assignment

Pin Assignment

1: Anode

2: Cathode

3: Emitter

4: Collector

6.

6. Mechanical Parameters

Mechanical Parameters

Characteristics

Creepage distances

Clearance

Internal isolation thickness

7.62 mm pitch

TLP627M type

(Min)

7.0

0.4

10.16 mm pitch

TLP627MF type

(Min)

8.0

0.4

Unit

mm

2018-12-06

Rev.1.0

Toshiba Electronic Devices & Storage Corporation

TLP627M,TLP627MF

3

7.

7. Absolute Maximum Ratings (Note) (Unless otherwise specified, T

Absolute Maximum Ratings (Note) (Unless otherwise specified, T

Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta

a

a = 25

= 25

= 25 



)

)

LED

Detector

Common

Characteristics

Input forward current

Input forward current derating

Input forward current (pulsed)

Input reverse voltage

Input power dissipation

Input power dissipation derating

Junction temperature

Collector-emitter voltage

Emitter-collector voltage

Collector current

Collector power dissipation

Collector power dissipation derating

Junction temperature

Operating temperature

Storage temperature

Lead soldering temperature

Total power dissipation

Total power dissipation derating

Isolation voltage

(Ta ≥ 90 )

(Ta ≥ 25 )

(10 s)

(Ta ≥ 25 )

(AC, 60 s, R.H. ≤ 60 %)

Symbol

IF

∆IF/∆Ta

IFP

VR

PD

∆PD/∆Ta

Tj

VCEO

VECO

IC

PC

∆PC/∆Ta

Tj

Topr

Tstg

Tsol

PT

∆PT/∆Ta

BVS

Note

(Note 1)

(Note 2)

Rating

50

-1.42

1

5

100

-2.85

125

300

0.3

150

-1.5

125

-55 to 110

-55 to 125

260

250

-2.5

5000

Unit

mA

mA/

A

V

mW

mW/



V

mA

mW

mW/



mW

mW/

Vrms

Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the

significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even

if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum

ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test

report and estimated failure rate, etc).

Note 1: Pulse width (PW) ≤ 0.1 ms, f = 100 Hz

Note 2: This device is considered as a two-terminal device: Pins 1 and 2 are shorted together, and pins 3 and 4 are

shorted together.

8.

8. Electrical Characteristics (Unless otherwise specified, T

Electrical Characteristics (Unless otherwise specified, T

Electrical Characteristics (Unless otherwise specified, Ta

a

a = 25

= 25

= 25 



)

)

LED

Detector

Characteristics

Input forward voltage

Input reverse current

Input capacitance

Collector-emitter breakdown voltage

Emitter-collector breakdown voltage

Dark Current

Collector-emitter capacitance

Symbol

VF

IR

Ct

V(BR)CEO

V(BR)ECO

IDARK

CCE

Note Test Condition

IF = 10 mA

VR = 5 V

V = 0 V, f = 1 MHz

IC = 0.1 mA

IE = 0.1 mA

VCE = 200 V

VCE = 200 V, Ta = 85 

V = 0 V, f = 1 MHz

Min

1.1



300

0.3



Typ.

1.25



30



0.002



900

Max

1.4

10



0.2

20



Unit

V

µA

pF

V

µA

pF

9.

9. Coupled Electrical Characteristics (Unless otherwise specified, T

Coupled Electrical Characteristics (Unless otherwise specified, T

Coupled Electrical Characteristics (Unless otherwise specified, Ta

a

a = 25

= 25

= 25 



)

)

Characteristics

Current transfer ratio

Saturated current transfer ratio

Collector-emitter saturation voltage

OFF-state collector current

Symbol

IC/IF

IC/IF(sat)

VCE(sat)

IC(off)

Note Test Condition

IF = 1 mA, VCE = 1 V

IF = 10 mA, VCE = 1 V

IC = 10 mA, IF = 1 mA

IC = 100 mA, IF = 10 mA

VF = 0.7 V, VCE = 200 V

Min

1000

500



0.3



Typ.

6000



Max



1.0

1.2

20

Unit

%

V

µA

2018-12-06

Rev.1.0

Toshiba Electronic Devices & Storage Corporation

TLP627M,TLP627MF

4

10.

10. Isolation Characteristics (Unless otherwise specified, T

Isolation Characteristics (Unless otherwise specified, T

Isolation Characteristics (Unless otherwise specified, Ta

a

a = 25

= 25

= 25 



)

)

Characteristics

Total capacitance (input to output)

Isolation resistance

Isolation voltage

Symbol

CS

RS

BVS

Note

(Note 1)

Test Condition

VS = 0 V, f = 1 MHz

VS = 500 V, R.H. ≤ 60 %

AC, 60 s

Min



1 × 1012

5000

Typ.

0.6

1014



Max



Unit

pF

Ω

Vrms

Note 1: This device is considered as a two-terminal device: Pins 1 and 2 are shorted together, and pins 3 and 4 are

shorted together.

11.

11. Switching Characteristics (Unless otherwise specified,T

Switching Characteristics (Unless otherwise specified,T

Switching Characteristics (Unless otherwise specified,Ta

a

a = 25

= 25

= 25 



)

)

Characteristics

Rise time

Fall time

Turn-on time

Turn-off time

Turn-on time

Storage time

Turn-off time

Symbol

tr

tf

ton

toff

ton

ts

toff

Note Test Condition

VCC = 10 V, IC = 10 mA,

RL = 100 Ω

See Fig. 11.1.

RL = 180 Ω, VCC = 10 V,

IF = 16 mA

Min



Typ.

60

30

110

30

2

25

80

Max



Unit

µs

Fig.

Fig. 11.1

11.1

11.1 Switching Time Test Circuit and Waveform

Switching Time Test Circuit and Waveform

2018-12-06

Rev.1.0

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TLP627M,TLP627MF

5

12.

12. Characteristics Curves (Note)

Characteristics Curves (Note)

Fig.

Fig. 12.1

12.1

12.1 I

I

IF

F

F - T

- T

- Ta

a

aFig.

Fig.

Fig. 12.2

12.2

12.2 P

P

PC

C

C - T

- T

- Ta

a

Fig.

Fig. 12.3

12.3

12.3 I

I

IFP

FP

FP - D

- D

- DR

R

RFig.

Fig.

Fig. 12.4

12.4

12.4 I

I

IF

F

F - V

- V

- VF

F

Fig.

Fig. 12.5

12.5

12.5 ∆

∆

∆V

V

VF

F

F/

/

/∆

∆

∆T

T

Ta

a

a - I

- I

- IF

F

FFig.

Fig.

Fig. 12.6

12.6

12.6 I

I

IFP

FP

FP - V

- V

- VFP

FP

2018-12-06

Rev.1.0

Toshiba Electronic Devices & Storage Corporation

TLP627M,TLP627MF

6

Fig.

Fig. 12.7

12.7

12.7 I

I

IC

C

C - V

- V

- VCE

CE

CE Fig.

Fig.

Fig. 12.8

12.8

12.8 I

I

IDARK

DARK

DARK - T

- T

- Ta

a

Fig.

Fig. 12.9

12.9

12.9 V

V

VCE(sat)

CE(sat)

CE(sat) - T

- T

- Ta

a

aFig.

Fig.

Fig. 12.10

12.10

12.10 I

I

IC

C

C - I

- I

- IF

F

Fig.

Fig. 12.11

12.11

12.11 I

I

IC

C

C/I

/I

/IF

F

F - I

- I

- IF

F

FFig.

Fig.

Fig. 12.12

12.12

12.12 I

I

IC

C

C - T

- T

- Ta

a

2018-12-06

Rev.1.0

Toshiba Electronic Devices & Storage Corporation

TLP627M,TLP627MF

7

Fig.

Fig. 12.13

12.13

12.13 Switching Time - R

Switching Time - R

Switching Time - RL

L

LFig.

Fig.

Fig. 12.14

12.14

12.14 Switching Time - T

Switching Time - T

Switching Time - Ta

a

Note: The above characteristics curves are presented for reference only and not guaranteed by production test,

unless otherwise noted.

2018-12-06

Rev.1.0

Toshiba Electronic Devices & Storage Corporation

TLP627M,TLP627MF

8

13.

13. Soldering and Storage

Soldering and Storage

13.1.

13.1. Precautions for Soldering

Precautions for Soldering

The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective

of whether a soldering iron or a reflow soldering method is used.

• When using soldering reflow.

The soldering temperature profile is based on the package surface temperature.

(See the figure shown below, which is based on the package surface temperature.)

Reflow soldering must be performed once or twice.

The mounting should be completed with the interval from the first to the last mountings being 2 weeks.

An Example of a Temperature Profile When Lead(Pb)-Free Solder Is Used

• When using soldering flow

Preheat the device at a temperature of 150  (package surface temperature) for 60 to 120 seconds.

Mounting condition of 260  within 10 seconds is recommended.

Flow soldering must be performed once.

• When using soldering Iron

Complete soldering within 10 seconds for lead temperature not exceeding 260  or within 3 seconds not

exceeding 350 

Heating by soldering iron must be done only once per lead.

13.2.

13.2. Precautions for General Storage

Precautions for General Storage

• Avoid storage locations where devices may be exposed to moisture or direct sunlight.

• Follow the precautions printed on the packing label of the device for transportation and storage.

• Keep the storage location temperature and humidity within a range of 5  to 35  and 45 % to 75 %,

respectively.

• Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty

conditions.

• Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during

storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the

solderability of the leads.

• When restoring devices after removal from their packing, use anti-static containers.

• Do not allow loads to be applied directly to devices while they are in storage.

• If devices have been stored for more than two years under normal storage conditions, it is recommended

that you check the leads for ease of soldering prior to use.

2018-12-06

Rev.1.0

Toshiba Electronic Devices & Storage Corporation

TLP627M,TLP627MF

9

14.

14. Marking (Note)

Marking (Note)

Fig.

Fig. 14.1

14.1

14.1 Marking example of TLP627M

Marking example of TLP627M

Marking example of TLP627M Fig.

Fig.

Fig. 14.2

14.2

14.2 Marking example of TLP627MF

Marking example of TLP627MF

Note: A different marking is used for photocouplers that have been qualified according to option (D4) of EN 60747.

See Fig.15.4 and Fig.15.5.

2018-12-06

Rev.1.0

Toshiba Electronic Devices & Storage Corporation

TLP627M,TLP627MF

10

15.

15. EN 60747-5-5 Option (D4) Specification

EN 60747-5-5 Option (D4) Specification

• Part number: TLP627M, TLP627MF (Note 1)

(Note 1)

• The following part naming conventions are used for the devices that have been qualified according to

option (D4) of EN 60747.

Example: TLP627M(D4-TP1,E

D4: EN 60747 option

TP1: Tape type

E: [[G]]/RoHS COMPATIBLE (Note 2)

(Note 2)

Note 1: Use TOSHIBA standard type number for safety standard application.

e.g., TLP627M(D4-TP1,E → TLP627M

Note 2: Please contact your Toshiba sales representative for details on environmental information such as the product's

RoHS compatibility.

RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the

restriction of the use of certain hazardous substances in electrical and electronic equipment.

Fig.

Fig. 15.1

15.1

15.1 EN 60747 Insulation Characteristics

EN 60747 Insulation Characteristics

2018-12-06

Rev.1.0

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TLP627M,TLP627MF

11

Fig.

Fig. 15.2

15.2

15.2 Insulation Related Specifications (Note)

Insulation Related Specifications (Note)

Note: If a printed circuit is incorporated, the creepage distance and clearance may be reduced below this value.

(e.g., at a standard distance between soldering eye centers of 7.5 mm). If this is not permissible, the user shall

take suitable measures.

Note: This photocoupler is suitable for safe electrical isolation

safe electrical isolation

safe electrical isolation only within the safety limit data.

Maintenance of the safety data shall be ensured by means of protective circuits.

Fig.

Fig. 15.3

15.3

15.3 Marking on packing for EN 60747

Marking on packing for EN 60747

Fig.

Fig. 15.4

15.4

15.4 Marking Example of TLP627M(Note)

Marking Example of TLP627M(Note)

Marking Example of TLP627M(Note) Fig.

Fig.

Fig. 15.5

15.5

15.5 Marking Example of TLP627MF(Note)

Marking Example of TLP627MF(Note)

Note: The above marking is applied to the photocouplers that have been qualified according to option (D4) of EN 60747.

2018-12-06

Rev.1.0

Toshiba Electronic Devices & Storage Corporation

TLP627M,TLP627MF

12

Fig.

Fig. 15.6

15.6

15.6 Measurement Procedure

Measurement Procedure

2018-12-06

Rev.1.0

Toshiba Electronic Devices & Storage Corporation

TLP627M,TLP627MF

13

Package Dimensions

Unit: mm

TLP627M

Weight: 0.24 g (typ.)

Package Name(s)

TOSHIBA: 11-5B2S

2018-12-06

Rev.1.0

Toshiba Electronic Devices & Storage Corporation

TLP627M,TLP627MF

14

Package Dimensions

Unit: mm

TLP627M(LF1,TP1)

Weight: 0.24 g (typ.)

Package Name(s)

TOSHIBA: 11-5B201S

2018-12-06

Rev.1.0

Toshiba Electronic Devices & Storage Corporation

TLP627M,TLP627MF

15

Package Dimensions

Unit: mm

TLP627M(LF5,TP5)

Weight: 0.24 g (typ.)

Package Name(s)

TOSHIBA: 11-5B205S

2018-12-06

Rev.1.0

Toshiba Electronic Devices & Storage Corporation

TLP627M,TLP627MF

16

Package Dimensions

Unit: mm

TLP627MF

Weight: 0.24 g (typ.)

Package Name(s)

TOSHIBA: 11-5B202S

2018-12-06

Rev.1.0

Toshiba Electronic Devices & Storage Corporation

TLP627M,TLP627MF

17

Package Dimensions

Unit: mm

TLP627MF(LF4,TP4)

Weight: 0.24 g (typ.)

Package Name(s)

TOSHIBA: 11-5B204S

2018-12-06

Rev.1.0

Toshiba Electronic Devices & Storage Corporation

TLP627M,TLP627MF

18

https://toshiba.semicon-storage.com/

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Hardware, software and systems described in this document are collectively referred to as "Product".

• TOSHIBA reserves the right to make changes to the information in this document and related Product without notice.

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minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage

to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate

the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA

information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the

precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application

with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications,

including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating

and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample

application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications.

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• GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor.

Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.

• Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,

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applicable export laws and regulations.

• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.

Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,

including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING

TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING

AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.

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