BIPOLAR DIGITAL INTEGRATED CIRCUIT PB1509GV D 1GHz INPUT DIVIDE BY 2, 4, 8 PRESCALER IC FOR PORTABLE SYSTEMS UE PB1509GV is a divide by 2, 4, 8 prescaler IC for portable radio or cellular telephone applications. PB1509GV is a shrink package version of PB587G so that this small package contributes to reduce the mounting space. PB1509GV is manufactured using the high fT NESATTM IV silicon bipolar process. This process uses silicon nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability. FEATURES : fin = 50 MHz to 700 MHz @ 2, IN High toggle frequency 50 MHz to 800 MHz @ 4, 50 MHz to 1000 MHz @ 8 Low current consumption : 5.0 mA @ VCC = 3.0 V High-density surface mounting : 8 pin plastic SSOP (175mil) : VCC = 2.2 to 5.5 V : 2, 4, 8 O NT Supply voltage Selectable division APPLICATION Portable radio systems Cellular/cordless telephone 2nd Local prescaler and so on. ORDERING INFORMATION PART NUMBER PB1509GV-E1-A PACKAGE MARKING SUPPLYING FORM 8 pin plastic SSOP 1509 Embossed tape 8 mm wide. Pin 1 is in tape pull-out SC (175 mil) (Pb-Free) direction. 1000p/reel. Remarks : To order evaluation samples, please contact your local nearby sales office. (Part number for sample DI order: PB1509GV-A) Document No. P10769EJ2V0DS00 (2nd edition) Date Published September 1997 N Caution:Electro-static sensitive devices PB1509GV PIN CONNECTION (Top View) 2 7 3 6 4 5 1 VCC1 2 IN 3 IN 4 GND 5 SW1 6 SW2 D 8 Pin Name UE 1 Pin NO. PRODUCT LINE-UP 7 OUT 8 VCC2 ICC (mA) VCC (V) /2 fin (MHz) /4 fin (MHz) /8 fin (MHz) Package PB587 G 5.5 2.2 to 3.5 50 to 300 50 to 600 50 to 1000 8 pin SOP (225 mil) PB1509 GV 5.0 2.2 to 5.5 50 to 700 50 to 800 50 to 1000 8 pin SSOP (175 mil) Pin Connection NEC Original NT Remarks IN Product No. This table shows the TYP values of main parameters. Please refer to ELECTRICAL CHARACTERISTICS. PB587G is discontinued. INTERNAL BLOCK DIAGRAM D Q D Q SC O IN IN CLK CLK Q Q DI SW1 2 D Q CLK OUT Q SW2 PB1509GV SYSTEM APPLICATION EXAMPLE One of the example for usage DEMO I Q D RX VCO VCO /N PLL PLL UE SW /N 0 TX PB1509GV I PA Q IN 90 This block diagram schematically shows the PB1509GV's location in one of the example application system. The DI SC O NT other applications are also acceptable for divider use. 3 PB1509GV Pin Explanations Pin No. 1 Applied Pin Voltage Voltage 2.2 to 5.5 Symbol VCC1 Functions and Explanation Power supply pin of a input amplifier and dividers. This pin must be D equipped with bypass capacitor (eg 1000 pF) to minimize ground impedance. 2 IN 1.7 to 4.95 Signal input pin. This pin should be coupled to signal source with capacitor 3 IN 1.7 to 4.95 UE (eg 1000 pF) for DC cut. Signal input bypass pin. This pin must be equipped with bypass capacitor (eg 1000 pF) to minimize ground impedance. 4 GND 0 Ground pin. Ground pattern on the board should be formed as wide as possible to minimize ground impedance. 5 SW1 H/L Divide ratio control pin. Divide ratio can be determined by following applied level to these pins. SW2 H/L SW2 IN 6 SW1 H L H 1/2 1/4 L 1/4 1/8 NT These pins must be each equipped with bypass capacitor to minimize their impedance. 7 OUT 1.0 to 4.7 Divided frequency output pin. This pin is designed as emitter follower output. This pin can output 0.1 VP-P min with 200 load. This pin should be coupled to load device with capacitor (eg 1000 pF) for DC cut. 8 VCC2 2.2 to 5.5 Power supply pin of output buffer amplifier. This pin must be equipped with DI SC O bypass capacitor (eg 1000 pF) to minimize ground impedance. 4 PB1509GV ABSOLUTE MAXIMUM RATINGS PARAMETER SYMBOL CONDITION RATINGS UNIT VCC TA = +25 C 6.0 V Input voltage Vin TA = +25 C, SW1, SW2 pins 6.0 V Total power dissipation PD Mounted on double sided copper clad 50 x 50 x 1.6 D Supply voltage mm epoxy glass PWB (TA = +85 C) Operating ambient TA Storage temperature -40 to +85 C -55 to +150 Tstg RECOMMENDED OPERATING CONDITIONS SYMBOL MIN. TYP. Supply voltage VCC 2.2 3.0 Operating ambient temperature TA -40 MAX. UNIT 5.5 V C NOTICE IN PARAMETER mW UE temperature 250 +25 +85 C PARAMETERS Circuit current NT ELECTRICAL CHARACTERISTICS (TA = -40 to +85 C, VCC = 2.2 to 5.5 V) TEST CONDITIONS MIN. TYP. MAX. UNIT No signals, VCC = 3.0 V 3.5 5.0 5.9 mA 500 MHz MHz SYMBOLS ICC Upper Limit Operating Frequency 1 fin(U)1 Pin = -20 to 0 dBm Upper Limit Operating Frequency 2 fin(U)2 Pin = -20 to -5 dBm @ / 2 700 @/4 800 @/8 1000 fin(L)1 Pin = -20 to 0 dBm 50 MHz Lower Limit Operating Frequency 2 fin(L)2 Pin = -20 to -5 dBm 500 MHz Input Power 1 Pin1 fin = 50 MHz to 1000 MHz -20 -5 dBm Input Power 2 Pin2 fin = 50 MHz to 500 MHz -20 0 dBm Output Voltage Vout RL = 200 0.1 0.2 VP-P Divide ratio control input high VIH1 Connection in the test circuit VCC VCC VCC Divide ratio control input low VIL1 Connection in the test circuit OPEN OPEN OPEN or or or GND GND GND SC O Lower Limit Operating Frequency 1 VIH2 Connection in the test circuit VCC VCC VCC Divide ratio control input low VIL2 Connection in the test circuit OPEN OPEN OPEN or or or GND GND GND DI Divide ratio control input high 5 PB1509GV TEST CIRCUIT C7 C1 VCC1 VCC2 8 UE 1 D Power Supply 1000 pF High impedance C2 2 IN OUT 7 Oscilloscope C6 50 3 IN SW2 6 R1 150 C5 C3 4 GND SW1 5 IN Signal Generator EQUIPMENTS Signal Generator (HP-8665A) NT C4 50 Counter (or Spectrum Analizer) Counter (HP-5350B) for measuring input sensitivity (Spectrum Analyzer for measuring output frequency) Oscilloscope for measuring output swing (In measuring output power on Spectrum Analyzer, oscilloscope should be turned off.) SC O Divide Ratio Setting SW2 SW1 H L H 1/2 1/4 L 1/4 1/8 H: SW pin should be connected to VCC1 pin. DI L: SW pin should be opened or connected to GND. 6 PB1509GV ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD D 1P VCC2 C1 IN IN UE VCC1 C7 C6 R1 OUT IN C4 C 5 C3 C2 OUT Component List Value SW1 Notes for evaluation board SC O No. NT PB1506/08/09GV SW2 C1 to C7 R1 1000 pF 150 Note (1) 35 m thick double sided copper clad 50 x 50 x 0.4 mm polyimide board (2) Back side : GND pattern (3) Solder plated on pattern (4) O O : Through holes (5) : Remove pattern Note For Output load of IC, R1 is determined as follows; R1 + Impedance of measurement equipment = 200 . The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. DI The usage and applications of PB1509GV should be referred to the application note (Document No. P12611E). 7 PB1509GV CHARACTERISTIC CURVES Circuit Current vs. Supply Voltage 9 8 T A = -40C D 6 T A = +25C 5 T A = +85C Recommended operating range 4 UE Circuit Current ICC (mA) 7 3 2 1 0 1 2 3 4 Supply Voltage VCC (V) 5 6 IN 0 Divide by 2 mode (Guaranteed operating window: VCC = 2.2 to 5.5 V, TA = -40 to +85C) Input power vs. Input frequency 20 NT V CC Guaranteed operating window -20 -30 V CC = 2.2 V -40 -50 V CC = 3.0 V DI V CC = 5.5 V TA = +25C -60 10 100 Input frequency fin (MHz) 8 1000 2000 0 Input power Pin (dBm) -10 10 V CC = 3.0 V = 5.5 V V CC = 2.2 V SC O Input power Pin (dBm) 10 0 Input power vs. Input frequency 20 T A = +25C T A = -40C -10 T A = +85C Guaranteed operating window -20 T A = +85C -30 -40 -50 -60 10 T A = -40C VCC = 3.0 V T A = +25C 100 Input frequency fin (MHz) 1000 2000 PB1509GV Input power vs. Input frequency Input power vs. Input frequency 20 T A = +25C 10 0 Guaranteed operating window -10 -20 -30 T A = +85C -40 T A = +25C -50 -60 10 VCC = 2.2 V 100 Input frequency fin (MHz) -30 T A = +85C -40 T A = -40C TA = +25C Pin = 0 dBm T A = +85C T A = +25C SC O 100 Input frequency fin (MHz) 0.2 0 10 1000 2000 TA = +85C Pin = 0 dBm 0.2 V CC = 2.2 V 0.1 100 Input frequency fin (MHz) 1000 2000 1000 2000 V CC = 5.5 V 0.3 Output voltage swing VP-P (V) V CC = 3.0 V 100 Input frequency fin (MHz) Output voltage swing vs. Input frequency V CC = 5.5 V DI Output voltage swing VP-P (V) 0.3 V CC = 2.2 V 0.1 Output voltage swing vs. Input frequency TA = -40C Pin = 0 dBm V CC = 5.5 V V CC = 3.0 V NT T A = -40C T A = +85C T A = -40C 0.1 1000 2000 0.3 T A = +25C 0 10 100 Input frequency fin (MHz) IN 0.3 VCC = 5.5 V Output voltage swing vs. Input frequency Output voltage swing VP-P (V) VCC = 3.0 V Pin = 0 dBm T A = +25C -60 10 1000 2000 Output voltage swing vs. Input frequency Output voltage swing VP-P (V) -20 -50 T A = -40C 0 10 Guaranteed operating window -10 D Input power Pin (dBm) T A = -40C Input power Pin (dBm) T A = +85C 0 0.2 T A = +25C T A = -40C T A = +85C 10 UE 20 V CC = 3.0 V 0.2 V CC = 2.2 V 0.1 0 10 100 Input frequency fin (MHz) 1000 2000 9 PB1509GV Divide by 4 mode (Guaranteed operating window: VCC = 2.2 to 5.5 V, TA = -40 to +85C) Input power vs. Input frequency 20 V CC 0 V CC = 2.2 V Input power Pin (dBm) Guaranteed operating window -10 -20 V CC = 2.2 V -30 -40 V CC = 5.5 V V CC = 3.0 V -50 -60 10 V CC = 5.5 V 1000 2000 100 Input frequency fin (MHz) Input power vs. Input frequency 20 10 -60 10 T A = +85C -30 T A = +25C 1000 2000 100 Input frequency fin (MHz) T A = -40C -10 -20 -30 VCC = 2.2 V 100 Input frequency fin (MHz) 1000 2000 T A = +85C T A = +25C Guaranteed operating window T A = -40C T A = +85C -40 T A = +25C DI -60 10 VCC = 3.0 V Input power vs. Input frequency Input power Pin (dBm) -20 T A = -40C T A = -40C NT Guaranteed operating window SC O Input power Pin (dBm) -40 T A = +85C 0 -50 10 -30 10 T A = +25C T A = -40C 0 -40 -20 20 T A = +85C -10 Guaranteed operating window -10 -50 TA = +25C T A = -40C T A = +25C IN Input power Pin (dBm) 0 10 V CC = 5.5 V = 3.0 V UE 10 T A = +85C D Input power vs. Input frequency 20 -50 -60 10 T A = -40C T A = +25C VCC = 5.5 V 100 Input frequency fin (MHz) 1000 2000 PB1509GV Divide by 8 mode (Guaranteed operating window: VCC = 2.2 to 5.5 V, TA = -40 to +85C) Input power vs. Input frequency Input power vs. Input frequency 20 20 0 Guaranteed operating window -10 -20 V CC = 2.2 V -30 -40 T A = -40C T A = -40C T A = +85C Guaranteed operating window -10 -20 UE Input power Pin (dBm) Input power Pin (dBm) 0 V CC 10 V CC = 2.2 V = 3.0 V D 10 V CC = 5.5 V T A = +25C -30 T A = +85C -40 T A = -40C -60 10 TA = +25C -50 V CC = 5.5 V V CC = 3.0 V 100 Input frequency fin (MHz) 1000 2000 Input power vs. Input frequency T A = +85C T A = +25C T A = -40C 0 Guaranteed operating window -10 -20 T A = +85C -30 -40 T A = -40C -50 VCC = 2.2 V 1000 2000 T A = +85C T A = +25C Guaranteed operating window -10 -20 -30 T A = +85C -40 -50 T A = +25C 100 Input frequency fin (MHz) 1000 2000 -60 10 T A = -40C VCC = 5.5 V T A = +25C 100 Input frequency fin (MHz) 1000 2000 DI -60 10 T A = -40C NT 0 T A = +25C 100 Input frequency fin (MHz) Input power vs. Input frequency 10 SC O Input power Pin (dBm) 10 T A = +25C VCC = 3.0 V 20 Input power Pin (dBm) 20 -60 10 IN -50 11 PB1509GV S11 vs. Input Frequency S11 REF 1.0 Units/ 2 200.0 mUnits/ 55.375 - 142.79 100.0000 200.0000 300.0000 400.0000 500.0000 600.0000 700.0000 800.0000 900.0000 1000.0000 MARKER 2 700.0 MHz 1 2 START 0.050000000 GHz STOP 1.000000000 GHz S22 vs. Output Frequency NT S22 REF 1.0 Units/ 200.0 mUnits/ SC O Z 50 MHz 149.09 + j 14.86 350 MHz 194.21 - j 36.64 0.050000000 GHz 0.350000000 GHz DI START STOP 12 .929 .898 .866 .840 .834 .819 .803 .792 .787 .771 ANG -6.7 -10.5 -13.6 -15.9 -19.1 -21.9 -24.7 -27.0 -30.0 -32.7 IN 3 S11 MAG UE FREQUENCY MHz D VCC1 = VCC2 = 3.0 V, SW1 = SW2 = 3.0 V PB1509GV PACKAGE DIMENSIONS (UNIT: mm) 8 PIN PLASTIC SSOP (175 mil) 5 D 8 3 -3 +7 UE Detail of lead end 1 4 3.20.1 0.15-0.05 0.65 0.575 MAX. 0.50.2 +0.10 0.3 -0.05 0.10 M 0.15 DI SC O 0.10.1 0.870.2 +0.10 NT 1.50.1 1.8 MAX. 3.0 MAX. IN 4.940.2 13 PB1509GV NOTE ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired operation). (3) Keep the wiring length of the ground pins as short as possible. RECOMMENDED SOLDERING CONDITIONS D (4) Connect a bypass capacitor (e.g. 1000 pF) to the VCC pin. This product should be soldered in the following recommended conditions. Other soldering methods and conditions than PB1509GV UE the recommended conditions are to be consulted with our sales representatives. Recommended Soldering method Soldering conditions condition symbol Infrared ray reflow Package peak temperature: 235C, Hour: within 30 s. (more than 210C), VPS IN Time: 3 times, Limited days: no.* IR35-00-3 Package peak temperature: 215C, Hour: within 40 s. (more than 200C), VP15-00-3 Time: 3 times, Limited days: no.* Soldering tub temperature: less than 260C, NT Wave soldering Hour: within 10 s. WS60-00-1 Time: 1 time, Limited days: no. Pin part heating Pin area temparature: less than 300C, Hour: within 3 s./pin Limited days: no.* SC O * It is the storage days after opening a dry pack, the storage conditions are 25C, less than 65% RH. Caution The combined use of soldering method is to be avoided (However, except the pin area heating method). For details of recommended soldering conditions for surface mounting, refer to information document DI SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E). 14 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: CEL: UPA863TD-A UPA863TD-T3-A UPB1509GV-EVAL-A