PESD Protection Devices
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• ESD protection for high-frequency applications
(HDMI 1.3)
• Smaller form factor for board space savings
• Helps protect sensitive electronic circuits against
damage caused by electrostatic discharge
(ESD) events
• Assists equipment to pass IEC 61000-4-2,
level 4 testing
• RoHS compliant
• Lead free
• Halogen free
(refers to: Br#900ppm, Cl#900ppm, Br+Cl#1500ppm)
• 0.25 pF (typ) capacitance
• Low-leakage current
• Low-clamping voltage
• Fast response time (< 1ns)
• Capable of withstanding numerous ESD strikes
• Compatible with standard reflow
installation procedures
• Thick film technology
• Bi-directional protection
• HDMI 1.3 interfaces
• LCD and plasma TVs
• Cellular phones
• Antennas
• Portable video players
• Portable devices (PDA, DSC, BlueTooth)
PESD Protection Devices
Benefits Features
Applications
• Printer ports
• Satellite radios
• USB 2.0 and IEEE 1394 interfaces
• DVI
• GPS systems
TE’s Polymer ESD (PESD) line of devices helps protect
I/O ports on HDMI 1.3, portable video players, LCD and
plasma TVs, USB 2.0, digital visual interface (DVI) and
antenna switches. PESD devices shunt electrostatic
discharge away from sensitive circuitry in HDTV
equipment, printers, laptops, cellular phones and other
portable devices.
PESD devices offer many advantages over traditional
protection devices, such as multi layer varistors (MLVs),
which may degrade or distort the signal in high data
rate circuits. Compared to transient voltage suppression
(TVS) diodes and miniature gas discharge tubes (GDTs),
PESD devices provide a more compact form factor and
an economical solution for the shrinking profiles of
today’s compact information appliances.
Available in a range of form factors, our PESD protection
devices provide low capacitance and meet transmission
line pulse (TLP) testing, as well as IEC61000-4-2 testing.
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Symbol VDC VT(TLP) VC(TLP) CP IL(TYP) IL(MAX)
Unit V V V pF µA µA
PESD0402-140 14 250 40 0.25 < 0.01 10.0
PESD0603-240 24 215 45 0.25 < 0.01 10.0
PESD1206Q-240 24 250 45 0.25 < 0.01 10.0
Continuous Max
Operating Voltage
Typ
Clamping Voltage†
Typ Capacitance
@1 MHz, 1VRMS
Typ Leakage
Current
Max Leakage
Current @ Max VDC
0.30
0.28
0.26
0.24
0.22
0.20
0.18
0.16
0.14
0.12
0.10
0.08
0.06
0.04
0.02
0
0 5001000 150 0 2000 2500 3000
Frequency (MHz)
Capacitance (pF)
Notes : * TLP test method at 1kV.
† Measured 30ns after pulse initiation.
Typical capacitance value is at 0V and max operating voltage bias.
Typ
Trigger Voltage*
Frequency (MHz)
0.3 1 10 100 1
000 6000
0.1
0
-0.1
-0.2
-0.3
-0.4
-0.5
-0.6
-0.7
-0.8
-0.9
-1.0
Insertion Loss (dB)
-0.25dB at 3.4GHz
Figure E1 Capacitance vs. Frequency for PESD Devices
Figure E2 Eye Diagram Performance at 3.4 GHz for PESD Devices
Figure E3 Insertion Loss Diagram for PESD Devices
Table E1 Electrical Characteristics for PESD Devices
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PESD0402-140 0.90 1.10 0.23 0.43 0.10 0.30 0.40 0.60 — — — — E6
(0.035) (0.043) (0.009) (0.017) (0.004) (0.012) (0.016) (0.024)
PESD0603-240 1.50 1.70 0.45 0.55 0.10 0.50 0.70 0.95 — — — — E6
(0.059) (0.067) (0.018) (0.022) (0.004) (0.020) (0.028) (0.037)
PESD1206Q-240 3.10 3.30 0.40 0.60 0.10 0.30 1.50 1.70 0.20 0.60 0.20 0.60 E7
(0.122) (0.130) (0.016) (0.024) (0.004) (0.012) (0.059) (0.067) (0.008) (0.024) (0.008) (0.024)
*The dimensions in inches are rounded approximations.
(Drawing not to Scale)
(Side View)
A
Min MaxPart Number
B
Min Max
C
Min Max
D
Min Max
E
Min Max
F
Min Max Figure
Figure E6
A
D
B
C
A
B
C
Figure E7
F
E
C
B
A
D
A
B
C
EF
(Drawing not to Scale)
(Side View)
PESD Devices
TX0+
TX0-
TX01+
TX01-
TX02-
TC+
TC-
TX02+
Chassis
GND
HDMI Port
ESD Protection for HDMI (0402 and 0603)
HDMI
Transmitter or
Receiver
Outside World
Figure E4
ESD Protection for HDMI (1206Q)
PESD Devices
Two PESD1206Q Arrays
TX0+
TX0-
TX01+
TX01-
TX02-
TC+
TC-
TX02+
Chassis
GND
HDMI Port
HDMI
Transmitter or
Receiver
Outside World
Figure E5
Test Conditions Pass / Fail Criteria
Bias Humidity Test 85°C, 85% RH, VDC (max), 1000 hrs IL % 10 µA
Thermal Shock -55°C to 125°C, 30 min Dwell, 1000 Cycles IL % 10 µA
Bias Heat Test 125°C, VDC (max), 1000 hrs IL % 10 µA
Bias Low Temp Test -55°C, VDC (max), 1000 hrs IL % 10 µA
Solderability 250°C ± 5°C, 3 ±1s 95% Coverage
Solder Heat 260°C, 10s 90% Coverage
Vibration 10 to 50Hz, 60s Cycle, 2 hrs Each in X-Y-Z-Direction No Physical Damage
Solvent Resistance IPA Ultrasonic 300s No Physical Damage
Shock 1500G, 0.5ms Each, X-Y-Z Axis 3 Times Each Axis No Physical Damage
Figures E4-E5 PESD Device Protection for HDMI (PESD devices provide electrostatic discharge protection)
Table E2 Dimensions for PESD Devices in Millimeters and (Inches*)
Table E3 Environmental Specifications for PESD Devices
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Table E6 Recommended Pad Layout for PESD Devices in Millimeters and (Inches*)
PESD0402-140 — — 0.60 0.70 0.30 0.40 0.80 0.90 2.10 2.20 E8
(0.024) (0.028) (0.012) (0.016) (0.031) (0.035) (0.083) (0.087)
PESD0603-240 — — 0.90 1.00 0.50 0.60 1.00 1.10 2.70 2.80 E8
(0.035) (0.039) (0.020) (0.024) (0.039) (0.043) (0.106) (0.110)
*The dimensions in inches are rounded approximations.
X
Y
Z
W
Figure E8
A Temperature Ramp-up 1 From Ambient to Preheating 30s to 60s
Temperature
B Preheating 140°C - 160°C 60s to 120s
C Temperature Ramp-up 2 From Preheating to Main 20s to 40s
Heating Temperature
D Main Heating at 200°C 60s to 70s
at 220°C 50s to 60s
at 240°C 30s to 40s
at 260°C 5s to 10s
E Cooling From Main Heating 4°C/s max
Temperature to 100°C
Preheating
Reflow Profile
Soldering Cooling
300
250
200
150
100
50
0
Temperature (˚C)
Times (s)
ACD EB
Note: Solder thickness 0.15 to 0.2mm.
RoHS Compliant Directive 2002/95/EC Compliant
RoHS 2.0 Directive 2011/65/EU Compliant
ELV Compliant Directive 2000/53/EC Compliant
Halogen Free Halogen Free Refers to: Br#900ppm, Cl#900ppm, Br+Cl#1500ppm
Storage Temperature -40°C to +85°C
Operating Temperature -55°C to +125°C
ESD Voltage Capability Contact Discharge Mode : 8kV (Typ), 15kV (max)
(Tested per IEC 61000-4-2) Air Discharge Mode : 15kV (Typ), 25kV (max) [1 Pulse: per Customer Request]
ESD Pulse Withstand 100 Pulses
(Tested per IEC 61000-4-2, Level 4, Contact Method)
V
Min MaxPart Number
W
Min Max
X
Min Max
Y
Min Max
Z
Min Max Figure
X
V
Z W
Y
Figure E9
PESD1206Q-240 3.20 2.20 0.50 0.80 1.00 E9
(0.126) (0.087) (0.020) (0.031) (0.039)
V
TypPart Number
W
Typ
X
Typ
Y
Typ
Z
Typ Figure
Table E4 General Characteristics for PESD Devices
Table E5 Materials Information for PESD Devices
Table E7 Solder Reflow Recommendations for PESD Devices
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Figure E10
Dimension (mm) Tolerance Dimension (mm) Tolerance Dimension (mm) Tolerance
W 8.00 ±0.30 8.00 ±0.30 8.00 ±0.30
P0 4.00 ±0.10 4.00 ±0.10 4.00 ±0.10
P1 2.00 ±0.05 4.00 ±0.05 4.00 ±0.05
P2 2.00 ±0.05 2.00 ±0.05 2.00 ±0.05
A0 0.69 ±0.05 1.27 ±0.15 2.02 ±0.20
B0 1.19 ±0.05 2.02 ±0.20 3.62 ±0.20
D0 1.50 ±0.10 1.50 ±0.10 1.50 ±0.10
F 3.50 ±0.05 3.50 ±0.05 3.50 ±0.05
E1 1.75 ±0.10 1.75 ±0.10 1.75 ±0.10
T 0.48 ±0.03 0.60 ±0.03 0.75 ±0.03
Table E8 Tape Specifications for PESD Devices
0402 0603 1206Q
P0
E1
FW
P2
D0
A0
P1
B0
T
Tape Dimension
EIA Mark
Reel Dimensions (0402, 0603 & 1206Q)
EIA Mark Dimension (mm)
A max 180.0
N min 60.5
W1 max 9.5
W2 max 14.0
Figure E11
Table E9 Reel Specifications for PESD Devices
AN
W2
W1
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Part Numbering System for Polymer ESD (PESD) Devices
PESD xxxx Q - 240
Operating Voltage Designator
14 x 10˚ = 14VDC
24 x 10˚ = 24VDC
Package Type
Q - Array of 4 Elements
EIA Size
Series
Parameter Definitions for PESD Devices
Operation Voltage (VDC)
Defined as DC voltage, under which device is in OFF state and leakage current below certain threshold.
Leakage Current (IL)
Current through device under Operation Voltage VDC.
Trigger Voltage (VT)
Voltage at which the device switches from the OFF to the ON state, during the IEC waveform or the TLP system.
Clamping Voltage (VC)
Voltage cross device under 8kV per IEC or measured by TLP system. Typically measured 30ns after initiation of the ESD pulse
(for TLP, both 30ns and 60ns are sometimes used).
Capacitance (CP)
Capacitance of the device measured at 1MHz with 0V and max operating voltage bias.
Warning :
Application Limitations for PESD0402-140, PESD0603-240 and PESD1206Q-240: These parts are not intended to be used on power
lines or for power bus applications. Users should independently evaluate the suitability of and test each product selected for their
own application.
Notice :
Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability and test each product
selected for their own applications. Tyco Electronics Corporation and its affiliates in the TE Connectivity Ltd. group of companies (“TE”) reserves
the right to change or update, without notice, any information contained in this publication; to change, without notice, the design, construction,
processing, or specification of any product; and to discontinue or limit production or distribution of any product. This publication supersedes
and replaces all information previously supplied. Without express written consent by an officer of TE, TE does not authorize the use of any of
its products as components in nuclear facility applications, aerospace, or in critical life support devices or systems. TE expressly disclaims all
implied warranties regarding the information contained herein, including, but not limited to, any implied warranties of merchantability or fitness
for a particular purpose. TE’s only obligations are those in the TE Standard Terms and Conditions of Sale and in no case will TE be liable for any
incidental, indirect, or consequential damages arising from the sale, resale, use, or misuse of its products.
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