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Nov. 2012
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Product Guide
Graphic Memory
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Product Guide Graphic Memory
Nov. 2012
1. GRAPHIC MEMORY ORDERING INFORMATION
3. Product
4~5. Density & Refresh
6~7. Organization
8. Bank
9. Interface ( VDD, VDDQ)
12. Package Type
11. "-" 1. SAMSUNG Memory
2. DRAM
Revision
Bank
Organization
Density & Refresh
Product
DRAM
SAMSUNG Memory
Interface (VDD, VDDQ)
Package Type
Temperature & Power
K 4 X X X X X X X X - X X X X
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
Speed
6:SSTL_15 (1.5V,1.5V)
F:POD_15 (1.5V,1.5V)
K:POD_18 (1.8V,1.8V)
W:gDDR3 SDRAM
J:GDDR3 SGRAM
G:GDDR5 SGRAM
51 :512M, 8K/64ms
52 :512M, 8K/32ms
10 :1G, 8K/32ms
20 :2G, 16K/32ms
1G :1G, 8K/64ms
2G :2G, 8K/64ms
4G :4G, 8K/64ms
41 :4G, 16K/32ms
16 :x16
32 :x32
3:4Banks
4:8Banks
5:16Banks
gDDR3
E :100FBGA(Halogen Free & Lead Free)
H:96FBGA(Halogen Free & Lead Free)
B:96FBGA(Halogen Free & Lead Free & Flip-Chip)
G:78FBGA(Halogen Free & Lead Free)
V:78FBGA(Halogen Free & Lead Free & Flip-Chip)
GDDR3
B:136FBGA(Lead Free)
H:136FBGA(Halogen Free & Lead Free)
GDDR5
H:170FBGA(Halogen Free & Lead Free & Flip-Chip)
F:170FBGA(Halogen Free & Lead Free)
C:Commercial Normal
J:Commercial High
L:Commercial Low
Y:Commercial Low Voltage
1B :0.83ns (2400Mbps) 25 : 0.25ns (8000Mbps)
1A :1.0ns (2133Mbps) 28 : 0.28ns (7000Mbps)
11 :1.07ns (1866Mbps) 03 : 0.33ns (6000Mbps)
12 :1.25ns (1600Mbps) 04 : 0.40ns (5000Mbps)
14 :1.4ns (1400Mbps) 05 : 0.50ns (4000Mbps)
15 :1.5ns (1333Mbps) 5C : 0.56ns (3600Mbps)
16 :1.6ns (1200Mbps) 06 : 0.62ns (3200Mbps)
18 :1.8ns (1100Mbps) 6A : 0.66ns (3000Mbps)
19 :1.875ns (1066Mbps) 07 : 0.71ns (2800Mbps)
20 :2.0ns (1000Mbps) 7A : 0.77ns (2600Mbps)
22 :2.2ns (900Mbps) 09 : 0.9ns (2200Mbps)
14~15. Speed
13. Temperature & Power(VDD)
10. Revision
M:1st Gen.
B:3rd Gen.
D:5th Gen.
F:7th Gen.
H:9th Gen.
Q:17th Gen.
A:2nd Gen.
C:4th Gen.
E:6th Gen.
G:8th Gen.
I :10th Gen.
Z:26th Gen.
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Product Guide Graphic Memory
Nov. 2012
2. GRAPHIC MEMORY COMPONENT PRODUCT GUIDES
Product Density Banks Part Num. PKG & Speed Org. Interf. Ref. Voltage(V) PKG. Status
gDDR3
SDRAM
1Gb G-die
8Banks
K4W1G1646G BC08/1A
11/12/15 64Mx16
SSTL_15 8K/64ms 1.5V ± 0.075V 96ball
FBGA
Mass
Production
2Gb C-die K4W2G1646C HC1A/11
12/15
128Mx16
Mass
Production
2Gb E-die K4W2G1646E BC1A/11
12/15
Mass
Production
4Gb B-die K4W4G1646B HC 1A/11/12 256Mx16 Mass
Production
GDDR3
SGRAM 1Gb G-die 8Banks K4J10324KG HC1A/14 32Mx32 POD_18 8K/32ms 1.8V ± 0.1V 136ball
FBGA
Mass
Production
GDDR5
SGRAM
1Gb G-die
16Banks
K4G10325FG HC03/04/05 32Mx32 POD_15 8K/32ms 1.5V ± 0.045V
170ball
FBGA
Mass
Production
2Gb D-die K4G20325FD FC28/03/04 64Mx32 POD_15 16K/32ms 1.5V ± 0.045V Mass
Production
4Gb C-die K4G41325FC HC28/03/04 128Mx32 POD_15 16K/32ms 1.5V ± 0.045V ES
Sep.’12