BAT54CV,115 - NEXPERIA

Important notice

Dear Customer,

On 7 February 2017 the former NXP Standard Product business became a new company with the

tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS

semiconductors with its focus on the automotive, industrial, computing, consumer and wearable

application markets

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Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on

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reserved

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Team Nexperia

1. Product profile

1.1 General description

Two planar Schottky barrier double diodes with common cathodes and an integrated

guard ring for stress protection encapsulated in a SOT666 ultra small and flat lead

Surface-Mounted Device (SMD) plastic package.

1.2 Features and benefits

Low forward voltage

Low capacitance

AEC-Q101 qualified

Ultra small and flat lead SMD plastic package

Excellent coplanarity and improved thermal behavior

1.3 Applications

Ultra high-speed switching

Voltage clamping

Line termination

Reverse polarity protection

1.4 Quick reference data

[1] Pulse test: tp≤300 μs; δ≤0.02.

BAT54CV

Two Schottky barrier double diodes

Rev. 3 — 15 November 2010 Product data sheet

Table 1. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

Per diode

IFforward current - - 200 mA

VRreverse voltage - - 30 V

VFforward voltage [1]

IF=0.1mA - - 240 mV

IF=1mA - - 320 mV

IF=10mA - - 400 mV

IF=30mA - - 500 mV

IF= 100 mA - - 800 mV

Product data sheet Rev. 3 — 15 November 2010 2 of 10

NXP Semiconductors BAT54CV

Two Schottky barrier double diodes

2. Pinning information

3. Ordering information

4. Marking

5. Limiting values

Table 2. Pinning

Pin Description Simplified outline Graphic symbol

1 anode (diode 1)

2 anode (diode 2)

3 common cathode (diode 3, 4)

4 anode (diode 3)

5 anode (diode 4)

6 common cathode (diode 1, 2) 123

456

sym05

Table 3. Ordering i nformation

Type number Package

Name Description Version

BAT54CV - plastic surface-mounted package; 6 leads SOT666

Table 4. Marking codes

Type number Marking code

BAT54CV C5

Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

Per diode

VRreverse voltage - 30 V

IFforward current - 200 mA

IFRM repetitive peak

forward current tp≤10 ms; δ≤0.5 - 0.85 A

IFSM non-repetitive peak

forward current square wave;

tp=8.3ms [1] -2A

Product data sheet Rev. 3 — 15 November 2010 3 of 10

NXP Semiconductors BAT54CV

Two Schottky barrier double diodes

[1] Tj=25°C prior to surge.

[2] Reflow soldering is the only recommended soldering method.

[3] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard

footprint.

[4] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.

6. Thermal characteristics

[1] For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse

power losses PR are a significant part of the total power losses.

[2] Reflow soldering is the only recommended soldering method.

[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

[4] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.

[5] Soldering point of cathode tab.

Per device, one diode loaded

Ptot total power dissipation Tamb ≤25 °C[2]

[3] -350mW

[4] -420mW

Tjjunction temperature - 125 °C

Tamb ambient temperature −65 +125 °C

Tstg storage temperature −65 +150 °C

Table 5. Limiting values …continued

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

Table 6. Thermal characteristics

Symbol Parameter Conditions Min Typ Max Unit

Per device, one diode loaded

Rth(j-a) thermal resistance from

junction to ambient in free air [1][2]

[3] --360K/W

[4] --300K/W

Rth(j-sp) thermal resistance from

junction to solder point [5] --175K/W

Product data sheet Rev. 3 — 15 November 2010 4 of 10

NXP Semiconductors BAT54CV

Two Schottky barrier double diodes

7. Characteristics

[1] Pulse test: tp≤300 μs; δ≤0.02.

Table 7. Characteristics

Tamb =25

C unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

Per diode

VFforward voltage [1]

IF=0.1mA - - 240 mV

IF=1mA - - 320 mV

IF=10mA - - 400 mV

IF=30mA - - 500 mV

IF= 100 mA - - 800 mV

IRreverse current VR=25V - - 2 μA

Cddiode capacitance VR=1V; f=1MHz - - 10 pF

(1) Tamb = 125 °C

(2) Tamb =85°C

(3) Tamb =25°C

(1) Tamb = 125 °C

(2) Tamb =85°C

(3) Tamb =25°C

Fig 1. Forward current as a function of forward

voltage; typical values Fig 2. Reverse current as a function of reverse

voltage; typical values

103

102

10−1

(mA)

VF (V)

1.20.80.40

msa892

(3)(2)(1)

0102030

VR (V)

103

102

10−1

(μA)

(1)

(2)

(3)

msa893

Product data sheet Rev. 3 — 15 November 2010 5 of 10

NXP Semiconductors BAT54CV

Two Schottky barrier double diodes

8. Test information

8.1 Quality information

This product has been qualified in accordance with the Automotive Electronics Council

(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is

suitable for use in auto motive applications.

9. Package outline

Tamb =25°C; f = 1 MHz

Fig 3. Diod e capacitance as a function of reverse voltage; typical values

0102030

(V)

(pF)

msa891

Fig 4. Package outline BAT54CV (SOT666)

Dimensions in mm 04-11-08

1.7

1.5

1.7

1.5

1.3

1.1

0.18

0.08

0.27

0.17

0.5

pin 1 index

123

456

0.6

0.5

0.3

0.1

Product data sheet Rev. 3 — 15 November 2010 6 of 10

NXP Semiconductors BAT54CV

Two Schottky barrier double diodes

10. Packing information

[1] For further information and the availability of packing methods, see Section 14.

11. Soldering

Table 8. Packing methods

The indicated -xxx are the last thre e digits of the 12NC ordering code.[1]

Type number Package Description Packing quantity

4000

BAT54CV SOT666 4 mm pitch, 8 mm tape and reel -115

Reflow soldering is the only recommended soldering method.

Fig 5. Reflow soldering footprint BAT54CV (SOT666)

solder lands

placement area

occupied area

solder paste

sot666_

2.75

2.45

2.1

1.6

0.4

(6×)

0.55

(2×)

0.25

(2×)

0.6

(2×)

0.65

(2×)

0.3

(2×)

0.325

(4×)

0.45

(4×)

0.5

(4×)

0.375

(4×)

1.72

1.7

1.075

0.538

Dimensions in mm

Product data sheet Rev. 3 — 15 November 2010 7 of 10

NXP Semiconductors BAT54CV

Two Schottky barrier double diodes

12. Revision history

Table 9. Revision history

Document ID Release date Data sheet status Change notice Supersedes

BAT54CV v.3 20101115 Product data sheet - BAT54CV_2

Modifications: •Section 1.2 “Features and benefits”: amended.

•Table 1 “Quick reference data”: updated.

•Table 5 “Limiting values”: Ptot amended.

•Table 6 “Thermal characteristics”: Rth(j-a) amended, Rth(j-sp) added.

•Figure 4: superseded by minimized outline drawin g.

•Section 8 “Test inform at io n”: added.

•Section 11 “Soldering”: added.

•Section 13 “Legal information”: updated.

BAT54CV_2 20100115 Objective data sheet - BAT54CV_1

BAT54CV_1 20040922 Objective data sheet - -

Product data sheet Rev. 3 — 15 November 2010 8 of 10

NXP Semiconductors BAT54CV

Two Schottky barrier double diodes

13. Legal information

13.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is document m ay have cha nged since thi s document w as publish ed and may di ffe r in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

13.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not b e relied u pon to cont ain det ailed and

full information. For detailed and full informatio n see the relevant full data

sheet, which is available on request via the local NXP Semicond uctors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall pre va il.

Product specificat io n — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyon d those described in the

Product data sheet.

13.3 Disclaimers

Limited warr a nty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warrant ies, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequ ential damages (including - wit hout limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ ag gregate and cumulative l iability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suit able for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in perso nal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Custo mers should provide appropriate

design and operating safeguards to minimize the risks associated with t heir

applications and products.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party custo m er(s). Customer is responsible for doing all necessary

testing for the customer’s applications and pro ducts using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the ter m s and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing i n this document may be interpreted or

construed as an of fer t o sell product s that is open for accept ance or the gr ant,

conveyance or implication of any license under any copyrights, patents or

other industrial or inte llectual property rights.

Export control — This document as well as the item(s) described herein

may be subject to export control regulatio ns. Export might require a prior

authorization from national authorities.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet D evelopment This document contain s data from the objective specification for product development .

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.

Product [short] data sheet Production This document contains the product specification.

Product data sheet Rev. 3 — 15 November 2010 9 of 10

NXP Semiconductors BAT54CV

Two Schottky barrier double diodes

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

13.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respective ow ners.

14. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors BAT54CV

Two Schottky barrier double diodes

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 15 November 2010

Document identifier: BAT54CV

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

15. Contents

1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 General description . . . . . . . . . . . . . . . . . . . . . 1

1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1

1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1

2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2

6 Thermal characteristics . . . . . . . . . . . . . . . . . . 3

7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4

8 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 5

8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 5

9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5

10 Packing information . . . . . . . . . . . . . . . . . . . . . 6

11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 7

13 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 8

13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 8

13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

13.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

14 Contact information. . . . . . . . . . . . . . . . . . . . . . 9

15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10