PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (C) Device Marking (3) (4/5) 7604001EA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 7604001EA SNJ54S194J 7604001FA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 7604001FA SNJ54S194W 7604001FA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 7604001FA SNJ54S194W JM38510/07601BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 07601BEA JM38510/07601BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 07601BEA JM38510/07601BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 07601BFA JM38510/07601BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 07601BFA JM38510/30601B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/ 30601B2A JM38510/30601B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/ 30601B2A JM38510/30601BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 30601BEA JM38510/30601BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 30601BEA JM38510/30601BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 30601BFA JM38510/30601BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 30601BFA M38510/07601BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 07601BEA M38510/07601BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 07601BEA M38510/07601BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 07601BFA M38510/07601BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 07601BFA Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (C) Device Marking (3) (4/5) M38510/30601B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/ 30601B2A M38510/30601B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/ 30601B2A M38510/30601BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 30601BEA M38510/30601BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 30601BEA M38510/30601BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 30601BFA M38510/30601BFA ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/ 30601BFA SN54194J OBSOLETE CDIP J 16 TBD Call TI Call TI -55 to 125 SN54194J OBSOLETE CDIP J 16 TBD Call TI Call TI -55 to 125 SN54LS194AJ ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SN54LS194AJ SN54LS194AJ ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SN54LS194AJ SN54S194J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SN54S194J SN54S194J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SN54S194J SN74194N OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70 SN74194N OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70 SN74LS194AD ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS194A SN74LS194AD ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS194A SN74LS194ADE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS194A SN74LS194ADE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS194A SN74LS194ADG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS194A SN74LS194ADG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS194A Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (C) Device Marking (3) (4/5) SN74LS194AN ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS194AN SN74LS194AN ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS194AN SN74LS194AN3 OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70 SN74LS194AN3 OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70 SN74LS194ANE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS194AN SN74LS194ANE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS194AN SN74S194N OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70 SN74S194N OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70 SN74S194N3 OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70 SN74S194N3 OBSOLETE PDIP N 16 TBD Call TI Call TI 0 to 70 SNJ54LS194AFK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 SNJ54LS 194AFK SNJ54LS194AFK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 SNJ54LS 194AFK SNJ54LS194AJ ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54LS194AJ SNJ54LS194AJ ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54LS194AJ SNJ54LS194AW ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54LS194AW SNJ54LS194AW ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54LS194AW SNJ54S194FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 SNJ54S 194FK SNJ54S194FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 SNJ54S 194FK SNJ54S194J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 7604001EA SNJ54S194J SNJ54S194J ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 7604001EA SNJ54S194J SNJ54S194W ACTIVE CFP W 16 1 TBD A42 N / A for Pkg Type -55 to 125 7604001FA SNJ54S194W Addendum-Page 3 Samples PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 Orderable Device Status (1) SNJ54S194W Package Type Package Pins Package Drawing Qty ACTIVE CFP W 16 1 Eco Plan Lead/Ball Finish (2) TBD MSL Peak Temp Op Temp (C) Device Marking (3) A42 N / A for Pkg Type (4/5) -55 to 125 7604001FA SNJ54S194W (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN54194, SN54LS194A, SN54S194, SN74194, SN74LS194A, SN74S194 : * Catalog: SN74194, SN74LS194A, SN74S194 Addendum-Page 4 Samples PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 * Military: SN54194, SN54LS194A, SN54S194 NOTE: Qualified Version Definitions: * Catalog - TI's standard catalog product * Military - QML certified for Military and Defense Applications Addendum-Page 5 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI's terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers' products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers' products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI's goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or "enhanced plastic" are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP(R) Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2013, Texas Instruments Incorporated