NCP154MX330300TAG - ON Semiconductor

January, 2015 − Rev. 2 1Publication Order Number:

NCP154/D

NCP154

Dual 300 mA, Low IQ, Low

Dropout, Dual Input Voltage

Regulator

The NCP154 is 300 mA, Dual Output Linear Voltage Regulator that

offers two independent input pins and provides a very stable and

accurate voltage with ultra low noise and very high Power Supply

Rejection Ratio (PSRR) suitable for RF applications. The device

doesn’t require any additional noise bypass capacitor to achieve ultra

low noise performance. In order to optimize performance for battery

operated portable applications, the NCP154 employs the Adaptive

Ground Current Feature for low ground current consumption during

light-load conditions.

Features

•Operating Input Voltage Range: 1.9 V to 5.25 V

•Two Independent Input Voltage Pins

•Two Independent Output Voltage (for detail please refer to Ordering

Information)

•Low IQ of typ. 55 mA per Channel

•High PSRR: 75 dB at 1 kHz

•Very Low Dropout: 140 mV Typical at 300 mA

•Thermal Shutdown and Current Limit Protections

•Stable with a 1 mF Ceramic Output Capacitor

•Available in XDFN8 1.2 × 1.6 mm Package

•Active Output Discharge for Fast Output Turn-Off

•These are Pb-free Devices

Typical Applications

•Smartphones, Tablets

•Wireless Handsets, Wireless LAN, Bluetooth®, ZigBee® Interfaces

•Other Battery Powered Applications

IN1

IN2

EN1

EN2

OUT1

OUT2

GND

NCP154

VOUT1

VOUT2

COUT1

1 mF

COUT2

1 mF

CIN2

1 mF

CIN1

1 mF

VIN1

VIN2

Figure 1. Typical Application Schematic

XDFN8, 1.2x1.6

CASE 711AS

MARKING DIAGRAM

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PIN CONNECTIONS

4GND

OUT1

3OUT2

5EN2

IN1

6 IN2

1GND 8EN1

See detailed ordering, marking and shipping information in the

package dimensions section on page 17 of this data sheet.

ORDERING INFORMATION

XDFN8

(Top View)

X = Specific Device Code

M = Date Code

G= Pb−Free Package

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Figure 2. Simplified Schematic Block Diagram

IN2

OUT2

ACTIVE

DISCHARGE

THERMAL

SHUTDOWN

ENABLE

LOGIC

GND

EN2

BANDGAP

REFERENCE MOSFET

DRIVER WITH

CURRENT LIMIT

THERMAL

SHUTDOWN

MOSFET

DRIVER WITH

CURRENT LIMIT

ACTIVE

DISCHARGE

EN1

BANDGAP

REFERENCE

ENABLE

LOGIC

EN1

OUT1

IN1

GND

Table 1. PIN FUNCTION DESCRIPTION

Pin No. Pin Name Description

1 GND Power supply ground. Soldered to the copper plane allows for effective heat dissipation.

2 OUT1 Regulated output voltage of the first channel. A small 1 mF ceramic capacitor is needed from this pin to

ground to assure stability.

3 OUT2 Regulated output voltage of the second channel. A small 1 mF ceramic capacitor is needed from this pin to

ground to assure stability.

4 GND Power supply ground. Soldered to the copper plane allows for effective heat dissipation.

5 EN2 Driving EN2 over 0.9 V turns-on OUT2. Driving EN below 0.4 V turns-off the OUT2 and activates the active

discharge.

6 IN2 Inputs pin for second channel. It is recommended to connect 1 mF ceramic capacitor close to the device pin.

7 IN1 Inputs pin for first channel. It is recommended to connect 1 mF ceramic capacitor close to the device pin.

8 EN1 Driving EN1 over 0.9 V turns-on OUT1. Driving EN below 0.4 V turns-off the OUT1 and activates the active

discharge.

− EP Exposed pad must be tied to ground. Soldered to the copper plane allows for effective thermal dissipation.

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Table 2. ABSOLUTE MAXIMUM RATINGS

Rating Symbol Value Unit

Input Voltage (Note 1) VIN1, VIN2 −0.3 V to 6 V V

Output Voltage VOUT1, VOUT2 −0.3 V to VIN + 0.3 V or 6 V V

Enable Inputs VEN1, VEN2 −0.3 V to VIN + 0.3 V or 6 V V

Output Short Circuit Duration tSC Indefinite s

Maximum Junction Temperature TJ(MAX) 150 °C

Storage Temperature TSTG −55 to 150 °C

ESD Capability, Human Body Model (Note 2) ESDHBM 2,000 V

ESD Capability, Machine Model (Note 2) ESDMM 200 V

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be af fected.

1. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area.

2. This device series incorporates ESD protection and is tested by the following methods:

ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)

ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)

Latchup Current Maximum Rating tested per JEDEC standard: JESD78.

Table 3. THERMAL CHARACTERISTICS (Note 3)

Rating Symbol Value Unit

Thermal Characteristics, XDFN8 1.2 ×1.6 mm,

Thermal Resistance, Junction-to-Air qJA 160 °C/W

3. Single component mounted on 1 oz, FR4 PCB with 645 mm2 Cu area.

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Table 4. ELECTRICAL CHARACTERISTICS

(−40°C≤TJ≤85°C; VIN =V

OUT(NOM) + 1 V or 2.5 V, whichever is greater; VEN = 0.9 V, IOUT = 1 mA, CIN =C

OUT =1mF.

Typical values are at TJ= +25°C. Min/Max values are specified for TJ= −40°C and TJ=85°C respectively.) (Note 4)

Parameter Test Conditions Symbol Min Typ Max Unit

Operating Input Voltage VIN 1.9 5.25 V

Output Voltage Accuracy −40°C ≤ TJ ≤ 85°C VOUT > 2 V VOUT −2 +2 %

VOUT ≤ 2 V −60 +60 mV

Line Regulation VOUT + 0.5 V ≤ VIN ≤ 5 V RegLINE 0.02 0.1 %/V

Load Regulation IOUT = 1 mA to 300 mA RegLOAD 15 40 mV

Dropout Voltage (Note 5) IOUT = 300 mA

VOUT(nom) = 1.5 V

VDO

360 470 mV

VOUT(nom) = 1.8 V 335 390 mV

VOUT(nom) = 2.7 V 165 275 mV

VOUT(nom) = 2.8 V 160 270 mV

VOUT(nom) = 3.0 V 150 260 mV

VOUT(nom) = 3.3 V 140 250 mV

Output Current Limit VOUT = 90% VOUT(nom) ICL 400 mA

Quiescent Current IOUT = 0 mA, EN1=VIN, EN2=0V or EN2=VIN, EN1=0V IQ55 100 mA

IOUT1 = IOUT2 = 0 mA, VEN1 = VEN2 = VIN IQ110 200 mA

Shutdown current (Note 6) VEN ≤ 0.4 V, VIN = 5.25 V IDIS 0.1 1 mA

EN Pin Threshold Voltage

High Threshold

Low Threshold VEN Voltage increasing

VEN Voltage decreasing VEN_HI

VEN_LO

0.9 0.4 V

EN Pin Input Current VEN = VIN = 5.25 V IEN 0.3 1.0 mA

Power Supply Rejection Ratio VIN = VOUT+1 V for VOUT > 2 V, VIN = 2.5 V,

for VOUT ≤ 2 V, IOUT = 10 mA f = 1 kHz PSRR 75 dB

Output Noise Voltage f = 10 Hz to 100 kHz VN75 mVrms

Active Discharge Resistance VIN = 4 V, VEN < 0.4 V RDIS 50 W

Thermal Shutdown Temperature Temperature increasing from TJ = +25°C TSD 160 °C

Thermal Shutdown Hysteresis Temperature falling from TSD TSDH − 20 − °C

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product

performance may not be indicated by the Electrical Characteristics if operated under different conditions.

4. Performance guaranteed over the indicated operating temperature range by design and/or characterization. Production tested at

TJ=T

A=25°C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.

5. Characterized when VOUT falls 100 mV below the regulated voltage at VIN =V

OUT(NOM) +1V.

6. Shutdown Current is the current flowing into the IN pin when the device is in the disable state.

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TYPICAL CHARACTERISTICS

Figure 3. Output Voltage vs. Temperature –

VOUT = 1.0 V Figure 4. Output Voltage vs. Temperature –

VOUT = 1.0 V

TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)

805035205−10−25−40

0.95

0.96

0.98

0.99

1.00

1.02

1.04

1.05

806535205−10−25−40

1.75

1.76

1.78

1.79

1.80

1.81

1.83

1.85

Figure 5. Output Voltage vs. Temperature –

VOUT = 1.0 V Figure 6. Output Voltage vs. Temperature –

VOUT = 1.0 V

TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)

806535205−10−25−40

2.75

2.76

2.78

2.79

2.80

2.82

2.83

2.85

806550205−10−25−40

3.25

3.26

3.28

3.29

3.31

3.32

3.33

3.35

Figure 7. Ground Current vs. Output Current Figure 8. Quiescent Current vs. Input Voltage

IOUT, OUTPUT CURRENT (mA) VIN, INPUT VOLTAGE (V)

2702101501209060300

120

240

360

420

540

600

5.04.03.53.02.01.00.50

VOUT, OUTPUT VOLTAGE (V)

IGND, GROUND CURRENT (mA)

IQ, QUIESCENT CURRENT (mA)

65 95

0.97

1.01

1.03

IOUT = 1 mA

IOUT = 300 mA

IOUT = 1 mA

IOUT = 300 mA

50 95

1.77

1.82

1.84

IOUT = 1 mA

IOUT = 300 mA

IOUT = 1 mA

IOUT = 300 mA

VIN = 2.5 V

VOUT = 1.0 V

CIN = COUT = 1 mF

50 95

2.77

2.81

2.84

35 95

3.27

3.30

3.34

VIN = 2.8 V

VOUT = 1.8 V

CIN = COUT = 1 mF

VIN = 3.8 V

VOUT = 2.8 V

CIN = COUT = 1 mF

VIN = 4.3 V

VOUT = 3.3 V

CIN = COUT = 1 mF

180

300

480

180 240 300

VIN = 4.3 V

VOUT = 3.3 V

CIN = COUT = 1 mFTJ = 85°C

TJ = 25°C

TJ = −40°C

1.5 2.5 4.5 5.5

85°C

−40°C

25°C

VIN = 4.3 V

VOUT = 3.3 V

CIN = COUT = 1 mF

NCP154

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TYPICAL CHARACTERISTICS

Figure 9. Quiescent Current vs. Temperature Figure 10. Line Regulation vs. Temperature –

VOUT = 1.0 V

TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)

806550355−10−25−40

956550205−10−25−40

−0.10

−0.08

−0.04

0.06

0.04

0.08

0.10

Figure 11. Line Regulation vs. Temperature –

VOUT = 3.3 V Figure 12. Load Regulation vs. Temperature –

VOUT = 1.0 V

TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)

806550355−10−25−40

−0.10

0.06

−0.04

−0.02

0.02

0.04

0.08

0.10

806550205−10−25−40

Figure 13. Load Regulation vs. Temperature –

VOUT = 3.3 V Figure 14. Dropout Voltage vs. Output Current

– VOUT = 3.3 V

TJ, JUNCTION TEMPERATURE (°C) IOUT, OUTPUT CURRENT (mA)

956535205−10−25−40

27522517512510075500

125

150

175

200

IQ, QUIESCENT CURRENT (mA)

LINEREG, LINE REGULATION (%/V)

REGLOAD, LOAD REGULATION (mV)

VDROP, DROPOUT VOLTAGE (mV)

VIN = 4.3 V

VOUT = 3.3 V

CIN = COUT = 1 mF

20 95 35 80

−0.06

−0.02

0.02

VIN = 2.5 V

VOUT = 1.0 V

CIN = COUT = 1 mF

20 95

−0.08

−0.06

VIN = 4.3 V

VOUT = 3.3 V

CIN = COUT = 1 mF

VIN = 2.5 V

VOUT = 1.0 V

CIN = COUT = 1 mF

35 95

50 80

VIN = 4.3 V

VOUT = 3.3 V

CIN = COUT = 1 mF

25 150 200 250 300

100

VIN = 4.3 V

VOUT = 3.3 V

CIN = COUT = 1 mF

TJ = 85°C

TJ = 25°C

TJ = −40°C

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TYPICAL CHARACTERISTICS

Figure 15. Dropout Voltage vs. Temperature Figure 16. Dropout Voltage vs. Output Voltage

TJ, JUNCTION TEMPERATURE (°C) VOUT, OUTPUT VOLTAGE (V)

956550205−10−25−40

100

120

180

200

3.33.12.72.52.32.11.71.5

100

150

200

300

350

400

Figure 17. Current Limit vs. Temperature Figure 18. Short Circuit Current vs.

Temperature

TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)

806550205−10−25−40

350

375

425

450

500

525

575

600

958050205−10−25−40

350

375

400

450

500

525

575

600

Figure 19. Short Circuit Current vs. Input

Voltage Figure 20. Disable Current vs. Temperature

VIN, INPUT VOLTAGE (V) TJ, JUNCTION TEMPERATURE (°C)

5.24.94.34.03.73.12.82.5

430

440

460

470

490

500

520

530

95805035205−25−40

VDROP, DROPOUT VOLTAGE (mV)

VDO, DROPOUT VOLTAGE (mV)

ICL, CURRENT LIMIT (mA)

ISC, SHORT CIRCUIT CURRENT (mA)

IDIS, DISABLE CURRENT (nA)

VIN = 4.3 V

VOUT = 3.3 V

CIN = COUT = 1 mF

IOUT = 300 mA

140

160

250

1.9 2.9 3.535 80

35 95

400

475

550 VOUT = 90% VOUT(NOM)

CIN = COUT = 1 mF

VIN = 3.8 V

VIN = 5.25 V

6535

425

475

550 VOUT = 0 V

CIN = COUT = 1 mFVIN = 3.8 V

VIN = 5.25 V

65−10

27 VIN = 4.3 V

VOUT = 0 V

VEN = 0 V

CIN = COUT = 1 mF

3.4 4.6 5.5

450

480

510

VOUT = 0 V

CIN = COUT = 1 mF

IOUT = 150 mA

IOUT = 0 mA

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TYPICAL CHARACTERISTICS

Figure 21. Enable Thresholds vs. Temperature Figure 22. Current to Enable Pin vs.

Temperature

TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)

806535205−10−25−40

0.1

0.3

0.4

0.5

0.7

0.8

1.0

806550205−10−25−40

150

200

250

300

400

450

Figure 23. Discharge Resistivity vs.

Temperature Figure 24. Power Supply Rejection Ratio,

VOUT = 1.0 V

TJ, JUNCTION TEMPERATURE (°C) FREQUENCY (kHz)

806550205−10−25−40

100

10,0001,0001001010.1

100

Figure 25. Power Supply Rejection Ratio,

VOUT = 3.3 V Figure 26. Output Capacitor ESR vs. Output

Current

FREQUENCY (kHz) IOUT, OUTPUT CURRENT (mA)

10,0001,0001001010.1

100

27021018015012060300

0.1

100

VEN, ENABLE VOLTAGE (V)

IEN, ENABLE CURRENT (nA)

RDIS, DISCHARGE RESISTIVITY (W)

RR, RIPPLE REJECTION (dB)

ESR (W)

50 95

0.2

0.6

0.9

OFF → ON

ON → OFF

35 95

100

350

VIN = 4.3 V

VOUT = 3.3 V

CIN = COUT = 1 mF

VIN = 4.3 V

VOUT = 3.3 V

CIN = COUT = 1 mF

35 95

VIN = 4 V

VOUT = 1 V

CIN = COUT = 1 mF

300 mA

150 mA

100 mA

1 mA

10 mA

VIN = 2.5 V + 100 mVPP

VOUT = 1.0 V

CIN = none

COUT = 1 mF, MLCC

300 mA

150 mA

100 mA

1 mA

10 mA

VIN = 4.3 V + 100 mVPP

VOUT = 3.3 V

CIN = none

COUT = 1 mF, MLCC

VOUT = 1.0 V

VOUT = 3.3 V

90 240 300

VIN = VOUT + 1 V or 2.5 V

CIN = COUT = 1 mF, MLCC,

size 1206

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TYPICAL CHARACTERISTICS

Figure 27. Output Voltage Noise Spectral Density for VOUT = 1.0 V, COUT = 1 mF

FREQUENCY (kHz)

100101 10000.10.01

0.001

0.01

0.1

Figure 28. Output Voltage Noise Spectral Density for VOUT = 1.8 V, COUT = 1 mF

Figure 29. Output Voltage Noise Spectral Density for VOUT = 3.3 V, COUT = 1 mF

OUTPUT VOLTAGE NOISE (mV/sqrtHz)

IOUT 10 Hz – 100 kHz 100 Hz – 100 kHz

1 mA 40.83 40.27

10 mA 36.03 35.38

150 mA 36.54 35.97

300 mA 37.05 36.48

RMS Output Noise (mV)

IOUT 10 Hz – 100 kHz 100 Hz – 100 kHz

1 mA 77.84 77.28

10 mA 71.71 70.48

150 mA 71.95 70.88

300 mA 72.71 71.67

RMS Output Noise (mV)

IOUT 10 Hz – 100 kHz 100 Hz – 100 kHz

1 mA 119.7 117.87

10 mA 113.47 111.47

150 mA 113.84 112.05

300 mA 115.95 114.03

RMS Output Noise (mV)

300 mA

150 mA

1 mA 10 mA

VIN = 2.5 V

VOUT = 1.0 V

CIN = COUT = 1 mF

FREQUENCY (kHz)

100101 10000.10.01

0.001

0.01

0.1

OUTPUT VOLTAGE NOISE (mV/sqrtHz)

300 mA

150 mA

1 mA 10 mA

VIN = 2.8 V

VOUT = 1.8 V

CIN = COUT = 1 mF

FREQUENCY (kHz)

100101 10000.10.01

0.001

0.01

0.1

OUTPUT VOLTAGE NOISE (mV/sqrtHz)

300 mA

150 mA

1 mA 10 mA

VIN = 4.3 V

VOUT = 3.3 V

CIN = COUT = 1 mF

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TYPICAL CHARACTERISTICS

Figure 30. Enable Turn−on Response –

VOUT = 1.0 V, COUT = 1 mFFigure 31. Enable Turn−on Response –

VOUT = 1.0 V, COUT = 4.7 mF

40 ms/div 40 ms/div

500 mV/div

Figure 32. Enable Turn−on Response –

VOUT = 3.3 V, COUT = 1 mFFigure 33. Enable Turn−on Response –

VOUT = 3.3 V, COUT = 4.7 mF

40 ms/div 40 ms/div

Figure 34. Line Transient Response – Rising

Edge, VOUT = 3.3 V, IOUT = 10 mA Figure 35. Line Transient Response – Falling

Edge, VOUT = 3.3 V, IOUT = 10 mA

8 ms/div 8 ms/div

VIN = 2.5 V

VOUT = 1.0 V

IOUT = 10 mA

CIN = COUT = 1 mF

50 mA/div 500 mV/div

500 mV/div

VIN = 2.5 V

VOUT = 1.0 V

IOUT = 10 mA

CIN = COUT = 4.7 mF

100 mA/div 500 mV/div

VEN

IIN

VOUT

VEN

IIN

VOUT

1 V/div

VIN = 4.3 V

VOUT = 3.3 V

IOUT = 10 mA

CIN = COUT = 1 mF

100 mA/div 500 mV/div

1 V/div

VIN = 4.3 V

VOUT = 3.3 V

IOUT = 10 mA

CIN = COUT = 4.7 mF

200 mA/div 500 mV/div

VEN

IIN

VOUT

VEN

IIN

VOUT

20 mV/div 500 mV/div

20 mV/div

VIN = 4.8 V to 3.8 V

IOUT = 10 mA

CIN = none

COUT = 1 mF

500 mV/div

VIN

VOUT

VIN

VOUT

VIN = 3.8 V to 4.8 V

IOUT = 10 mA

CIN = none

COUT = 1 mF

tRISE = 1 mstFALL = 1 ms

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TYPICAL CHARACTERISTICS

Figure 36. Line Transient Response– Rising

Edge, VOUT = 3.3 V, IOUT = 300 mA Figure 37. Line Transient Response– Falling

Edge, VOUT = 3.3 V, IOUT = 300 mA

4 ms/div 4 ms/div

Figure 38. Line Transient Response– Rising Edge,

VOUT = 3.3 V, IOUT = 10 mA, COUT = 4.7 mFFigure 39. Line Transient Response– Falling

Edge, VOUT = 3.3 V, IOUT = 10 mA, COUT = 4.7 mF

4 ms/div 4 ms/div

Figure 40. Load Transient Response − 1.0 V –

Rising Edge, IOUT1 = 100 mA to 300 mA Figure 41. Load Transient Response − 1.0 V –

Falling Edge, IOUT1 = 300 mA to 100 mA

4 ms/div 100 ms/div

VIN = 3.8 V to 4.8 V

IOUT = 300 mA

CIN = none

COUT = 1 mF

20 mV/div 500 mV/div

VIN

VOUT

VIN

VOUT

20 mV/div 500 mV/div

VIN

VOUT

VIN

VOUT

50 mV/div 100 mA/div

VOUT1

tRISE = 1 ms

VIN = 4.8 V to 3.8 V

IOUT = 300 mA

CIN = none

COUT = 1 mF

tFALL = 1 ms

VIN = 3.8 V to 4.8 V

IOUT = 10 mA

CIN = none

COUT = 4.7 mF

tRISE = 1 ms

VIN = 4.8 V to 3.8 V

IOUT = 10 mA

CIN = none

COUT = 4.7 mF

tFALL = 1 ms

VOUT2

50 mV/div

VIN = 2.8 V

VOUT1 = 1.0 V, VOUT2 = 1.8 V

IOUT2 = 10 mA

COUT1 = 1 mF, COUT2 = 1 mF

tRISE = 500 ns

50 mV/div 100 mA/div

IOUT1

VOUT1

VOUT2

50 mV/div

VIN = 2.8 V

VOUT1 = 1.0 V, VOUT2 = 1.8 V

IOUT2 = 10 mA

COUT1 = 1 mF, COUT2 = 1 mF

tFALL = 500 ns

IOUT1

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TYPICAL CHARACTERISTICS

Figure 42. Load Transient Response − 1.0 V –

Rising Edge, IOUT1 = 1 mA to 300 mA Figure 43. Load Transient Response − 1.0 V –

Falling Edge, IOUT1 = 300 mA to 1 mA

4 ms/div 10 ms/div

Figure 44. Load Transient Response − 1.0 V –

Rising Edge, IOUT1 = 50 mA to 300 mA Figure 45. Load Transient Response − 1.0 V –

Falling Edge, IOUT1 = 300 mA to 50 mA

4 ms/div 4 ms/div

Figure 46. Load Transient Response − 3.3 V –

Rising Edge, IOUT1 = 100 mA to 300 mA Figure 47. Load Transient Response – 3.3 V –

Falling Edge, IOUT1 = 300 mA to 100 mA

4 ms/div 100 ms/div

50 mV/div 100 mA/div

VOUT2

50 mV/div 100 mA/div

VOUT1

tRISE = 500 ns

VOUT2

50 mV/div

VIN = 4.3 V

VOUT1 = 3.3 V, VOUT2 = 2.8 V

IOUT2 = 10 mA

COUT1 = 1 mF, COUT2 = 1 mF

tRISE = 500 ns

50 mV/div 100 mA/div

IOUT1

VOUT1

VOUT2

50 mV/div

VIN = 4.3 V

VOUT1 = 3.3 V, VOUT2 = 2.8 V

IOUT2 = 10 mA

COUT1 = 1 mF, COUT2 = 1 mF

tFALL = 500 ns

50 mV/div

VOUT1

IOUT1

VIN = 2.8 V

VOUT1 = 1.0 V, VOUT2 = 1.8 V

IOUT2 = 10 mA

COUT1 = 1 mF, COUT2 = 1 mF

50 mV/div

VOUT2

tFALL = 500 ns

VOUT1

IOUT1 VIN = 2.8 V

VOUT1 = 1.0 V, VOUT2 = 1.8 V

IOUT2 = 10 mA

COUT1 = 1 mF, COUT2 = 1 mF

50 mV/div 100 mA/div

VOUT2

tRISE = 500 ns

50 mV/div

VOUT1

IOUT1 VIN = 2.8 V

VOUT1 = 1.0 V, VOUT2 = 1.8 V

IOUT2 = 10 mA

COUT1 = 1 mF, COUT2 = 1 mF

50 mV/div 100 mA/div50 mV/div

VOUT2

tFALL = 500 ns

VOUT1

IOUT1 VIN = 2.8 V

VOUT1 = 1.0 V, VOUT2 = 1.8 V

IOUT2 = 10 mA

COUT1 = 1 mF, COUT2 = 1 mF

IOUT1

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TYPICAL CHARACTERISTICS

Figure 48. Load Transient Response − 3.3 V –

Rising Edge, IOUT1 = 1 mA to 300 mA Figure 49. Load Transient Response – 3.3 V –

Falling Edge, IOUT1 = 300 mA to 1 mA

4 ms/div 10 ms/div

Figure 50. Load Transient Response − 3.3 V –

Rising Edge, IOUT1 = 50 mA to 300 mA Figure 51. Load Transient Response – 3.3 V –

Falling Edge, IOUT1 = 300 mA to 50 mA

4 ms/div 4 ms/div

Figure 52. Enable Turn−Off – VOUT = 1.0 V Figure 53. Enable Turn−Off – VOUT = 3.3 V

200 ms/div 200 ms/div

50 mV/div 100 mA/div

VOUT2

500 mV/div

VOUT

tRISE = 500 ns

500 mV/div

VIN = 4.3 V

VOUT = 3.3 V

IOUT = 0 mA

COUT = 1 mF, 4.7 mF

tRISE = 500 ns

50 mV/div

VOUT1

IOUT1

VIN = 4.3 V

VOUT1 = 3.3 V, VOUT2 = 2.8 V

IOUT2 = 10 mA

COUT1 = 1 mF, COUT2 = 1 mF

50 mV/div

VOUT2

tFALL = 500 ns

VOUT1

IOUT1 VIN = 4.3 V

VOUT1 = 3.3 V, VOUT2 = 2.8 V

IOUT2 = 10 mA

COUT1 = 1 mF, COUT2 = 1 mF

50 mV/div 100 mA/div

VOUT2

tRISE = 500 ns

50 mV/div

VOUT1

IOUT1 VIN = 4.3 V

VOUT1 = 3.3 V, VOUT2 = 2.8 V

IOUT2 = 10 mA

COUT1 = 1 mF, COUT2 = 1 mF

50 mV/div 100 mA/div50 mV/div

VOUT2

tFALL = 500 ns

VOUT1

IOUT1 VIN = 4.3 V

VOUT1 = 3.3 V, VOUT2 = 2.8 V

IOUT2 = 10 mA

COUT1 = 1 mF, COUT2 = 1 mF

VEN

COUT = 1 mF

COUT = 4.7 mF

500 mV/div

VOUT

1 V/div

VIN = 4.3 V

VOUT = 3.3 V

IOUT = 0 mA

COUT = 1 mF, 4.7 mF

tRISE = 500 ns

VEN

COUT = 1 mF

COUT = 4.7 mF

NCP154

http://onsemi.com

TYPICAL CHARACTERISTICS

Figure 54. Turn−on/off − Slow Rising VIN Figure 55. Short Circuit and Thermal

Shutdown

20 ms/div 4 ms/div

1 V/div

VOUT1

VOUT2

VIN

VIN = 4.3 V

VOUT1 = 3.3 V, VOUT2 = 2.8 V

IOUT1 = 10 mA, IOUT2 = 10 mA

CIN = COUT1 = COUT2 = 1 mF

1 V/div

IOUT

500 mA/div

VOUT TSD cycling

Thermal

Shutdown

Short circuit

current

Short circuit

event

Overheating

VIN = 5.25 V

VOUT = 3.3 V

CIN = COUT = 1 mF

NCP154

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General

The NCP154 is a dual output high performance 300 mA

Low Dropout Linear Regulator. This device delivers very

high PSRR (75 dB at 1 kHz) and excellent dynamic

performance as load/line transients. In connection with low

quiescent current this device is very suitable for various

battery powered a pplications s uch as t ablets, cellular p hones,

wireless and many others. Each output is fully protected in

case of output overload, output short circuit condition and

overheating, assuring a very robust design. The NCP154

device is housed in XDFN−8 1.6 mm x 1.2 mm package

which is useful for space constrains application.

Input Capacitor Selection (CIN)

It is recommended to connect at least a 1 mF Ceramic X5R

or X7R capacitor as close as possible to the IN pin of the

device. This capacitor will provide a low impedance path for

unwanted AC signals or noise modulated onto constant

input voltage. There is no requirement for the min. or max.

ESR of the input capacitor but it is recommended to use

ceramic capacitors for their low ESR and ESL. A good input

capacitor will limit the influence of input trace inductance

and source resistance during sudden load current changes.

Larger input capacitor may be necessary if fast and large

load transients are encountered in the application.

Output Decoupling (COUT)

The NCP154 requires an output capacitor for each output

connected as close as possible to the output pin of the

regulator. The recommended capacitor value is 1 mF and

X7R or X5R dielectric due to its low capacitance variations

over the specified temperature range. The NCP154 is

designed to remain stable with minimum effective

capacitance of 0.33 mF to account for changes with

temperature, D C bias and package size. Especially for small

package size capacitors such as 0201 the effective

capacitance drops rapidly with the applied DC bias.

There is no requirement for the minimum value of

Equivalent Series Resistance (ESR) for the COUT but the

maximum value of ESR should be less than 3 W. Larger

output capacitors and lower ESR could improve the load

transient response or high frequency PSRR. It is not

recommended to use tantalum capacitors on the output due

to their large ESR. The equivalent series resistance of

tantalum capacitors is also strongly dependent on the

temperature, increasing at low temperature.

Enable Operation

The NCP154 uses the dedicated EN pin for each output

channel. This feature allows driving outputs separately.

If the EN pin voltage is <0.4 V the device is guaranteed to

be disabled. The pass transistor is turned−off so that there is

virtually n o current flow b etween the I N a nd OU T . The active

discharge transistor is active so that the output voltage VOUT

is pulled to GND through a 50 W resistor. In the disable state

the device consumes as low as typ. 10 nA from the VIN.

If the EN pin voltage >0.9 V the device is guaranteed to

be enabled. The NCP154 regulates the output voltage and

the active discharge transistor is turned−off.

The both EN pin has internal pull−down current source

with typ. value of 300 nA which assures that the device is

turned−off when the EN pin is not connected. In the case

where the EN function isn’t required the EN should be tied

directly to IN.

Output Current Limit

Output Current is internally limited within the IC to a

typical 400 mA. The NCP154 will source this amount of

current measured with a voltage drops on the 90% of the

nominal VOUT. If the Output Voltage is directly shorted to

ground (VOUT = 0 V), the short circuit protection will limit

the output current to 520 mA (typ). The current limit and

short circuit protection will work properly over whole

temperature range and also input voltage range. There is no

limitation for the short circuit duration. This protection

works separately for each channel. Short circuit on the one

channel do not influence second channel which will work

according to specification.

Thermal Shutdown

When the die temperature exceeds the Thermal Shutdown

threshold (TSD − 160°C typical), Thermal Shutdown event

is detected and the affected channel is turn−off. Second

channel still working. The channel which is overheated will

remain in this state until the die temperature decreases below

the Thermal Shutdown Reset threshold (TSDU − 140°C

typical). Once the device temperature falls below the 140°C

the appropriate channel is enabled again. The thermal

shutdown feature provides the protection from a

catastrophic device failure due to accidental overheating.

This protection is not intended to be used as a substitute for

proper heat sinking. The long duration of the short circuit

condition t o some output channel could cause turn−off other

output when heat sinking is not enough and temperature of

the other output reach TSD temperature.

Power Dissipation

As power dissipated in the NCP154 increases, it might

become necessary to provide some thermal relief. The

maximum power dissipation supported by the device is

dependent upon board design and layout. Mounting pad

configuration on the PCB, the board material, and the

ambient temperature affect the rate of junction temperature

rise for the part.

The maximum power dissipation the NCP154 can handle

is given by:

PD(MAX) +ƪ125oC*TAƫ

qJA (eq. 1)

The power dissipated by the NCP154 for given

application conditions can be calculated from the following

equations:

PD[ǒVIN1 @IGND1Ǔ)ǒVIN2 @IGND2Ǔ)(eq. 2)

)IOUT1ǒVIN1 *VOUT1Ǔ)IOUT2ǒVIN2 *VOUT2Ǔ

NCP154

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Figure 56. qJA vs. Copper Area (XDFN-8)

COPPER HEAT SPREADER AREA (mm2)

500 700400300200 6001000

100

120

140

180

200

220

qJA, JUNCTION TO AMBIENT THER-

MAL RESISTANCE (°C/W)

0.25

0.50

0.75

1.00

PD(MAX), MAXIMUM POWER DISSIPATION (W)

160

240

PD(MAX), TA = 25°C, 2 oz Cu

PD(MAX), TA = 25°C, 1 oz Cu

qJA, 1 oz Cu

qJA, 2 oz Cu

Reverse Current

The PMOS pass transistor has an inherent body diode

which will be forward biased in the case that VOUT > VIN.

Due to this fact in cases, where the extended reverse current

condition can be anticipated the device may require

additional external protection.

Power Supply Rejection Ratio

The NCP154 features very good Power Supply Rejection

ratio. If desired the PSRR at higher frequencies in the range

100 kHz – 10 MHz can be tuned by the selection of COUT

capacitor and proper PCB layout.

Turn−On Time

The turn−on time is defined as the time period from EN

assertion to the point in which VOUT will reach 98% of its

nominal value. This time is dependent on various

application conditions such as VOUT(NOM), COUT, TA.

PCB Layout Recommendations

To obtain good transient performance and good regulation

characteristics place input and output capacitors close to the

device pins and make the PCB traces wide. In order to

minimize the solution size, use 0402 capacitors. Larger

copper area connected to the pins will also improve the

device thermal resistance. The actual power dissipation can

be calculated from the equation above (Equation 2). Expose

pad should be tied the shortest path to the GND pin.

NCP154

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Table 5. ORDERING INFORMATION

Device Voltage Option*

(OUT1/OUT2) Marking Package Shipping †

NCP154MX280280TAG 2.8 V / 2.8 V DA

XDFN−8

(Pb-Free) 3000 / Tape & Reel

NCP154MX180280TAG 1.8 V / 2.8 V DC

NCP154MX330180TAG 3.3 V / 1.8 V DD

NCP154MX300180TAG 3.0 V / 1.8 V DE

NCP154MX330280TAG 3.3 V / 2.8 V DF

NCP154MX330330TAG 3.3 V / 3.3 V DG

NCP154MX330300TAG 3.3 V / 3.0 V DH

NCP154MX300300TAG 3.0 V / 3.0 V DJ

NCP154MX100180TAG 1.0 V / 1.8 V DK

NCP154MX150280TAG 1.5 V / 2.8 V DL

NCP154MX180290TAG 1.8 V / 2.9 V DM

NCP154MX180300TAG 1.8 V / 3.0 V DN

NCP154MX280270TAG 2.8 V / 2.7 V DP

NCP154MX310310TAG 3.1 V / 3.1 V DQ

NCP154MX330285TAG 3.3 V / 2.85 V DR

NCP154MX180270TAG 1.8 V / 2.7 V DT

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

*Contact factory for other voltage options. Output voltage range 1.0 V to 3.3 V with step 50 mV.

NCP154

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PACKAGE DIMENSIONS

XDFN8 1.6x1.2, 0.4P

CASE 711AS

ISSUE A

ÍÍÍÍ

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

SEATING

PLANE

0.10 C

2X 0.10 C

DIM

AMIN MAX

MILLIMETERS

0.30 0.45

A1 0.00 0.05

b0.13 0.23

PIN ONE

IDENTIFIER

0.08 C

0.10 C

A0.10 C

88X

0.05 C

MOUNTING FOOTPRINT*

1.60 BSC

1.20 BSC

0.05 REF

1.20 1.40

0.20 0.40

BOTTOM VIEW

8X DIMENSIONS: MILLIMETERS

0.35

8X 0.26

1.40

0.40

PITCH

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

NOTE 3

L0.15 0.25

TOP VIEW

SIDE VIEW RECOMMENDED

0.44

e/2

D2 1.44

PACKAGE

OUTLINE

DETAIL B

DET AIL A

DETAIL A

OPTIONAL

CONSTRUCTION

ÉÉ

ÇÇ

DETAIL B

MOLD CMPDEXPOSED Cu

OPTIONAL

CONSTRUCTION

e0.40 BSC

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UBLICATION ORDERING INFORMATION

N. American Technical Support: 800−282−9855 Toll Free

USA/Canada

Europe, Middle East and Africa Technical Support:

Phone: 421 33 790 2910

Japan Customer Focus Center

Phone: 81−3−5817−1050

NCP154/D

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ON Semiconductor:

NCP154MX180280TAG NCP154MX330180TAG NCP154MX100180TAG NCP154MX300300TAG

NCP154MX330285TAG NCP154MX280280TAG NCP154MX330300TAG NCP154MX280270TAG

NCP154MX310310TAG NCP154MX150280TAG