FEATURES
NEC's 1.5W
L, S-BAND SPDT SWITCH
DESCRIPTION
UPG2179TB
NEC's UPG2179TB is a GaAs MMIC L, S-band SPDT (Single
Pole Double Throw) switch for mobile phone and
L, S-band applications from 0.5 to 3.0 GHz.
This device can operate with 2.5 to 5.3 V from 50 MHz to
3 GHz with low insertion loss and high isolation.
The UPG2179TB is housed in a Pb-Free 6-pin super minimold
package suitable for high-density surface mounting.
APPLICATIONS
• L, S-band digital cellular and cordless telephones
• PCS, W-LAN, WLL and BluetoothTM
• Short Range Wireless
California Eastern Laboratorie
s
ORDERING INFORMATION
Remark To order evaluation samples, contact your nearby sales ofÞ ce.
Part number for sample order: UPG2179TB-A
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.
• SWITCH CONTROL VOLTAGE:
Vcont (H) = 2.5 to 5.3 V (3.0 V TYP.)
V
cont (L) = −0.2 to +0.2 V (0 V TYP.)
• LOW INSERTION LOSS:
0.25 dB TYP. @ 0.5 to 1.0 GHz, Vcont = 3.0 V/0 V
0.30 dB TYP. @ 1.0 to 2.0 GHz, Vcont = 3.0 V/0 V
0.35 dB TYP. @ 2.0 to 2.5 GHz, Vcont = 3.0 V/0 V
0.40 dB TYP. @ 2.0 to 3.0 GHz, Vcont = 3.0 V/0 V
• HIGH ISOLATION:
27 dB TYP. @ 0.5 to 2.0 GHz, Vcont = 3.0 V/0 V
24 dB TYP. @ 2.0 to 2.5 GHz, Vcont = 3.0 V/0 V
• HIGH POWER:
Pin (0.1 dB) = +29.0 dBm TYP. @ 0.5 to 3.0 GHz, Vcont = 3.0 V/0 V
P
in (1 dB) = +32.0 dBm TYP. @ 0.5 to 3.0 GHz, Vcont = 3.0 V/0 V
• HIGH-DENSITY SURFACE MOUNT PACKAGE:
6-pin super minimold package (2.0 × 1.25 × 0.9 mm)
• PB-FREE
PART NUMBER PACKAGE MARKING SUPPLYING FORM
UPG2179TB-E4-A 6-pin super minimold G4C • Embossed tape 8 mm wide
• Pin 4, 5, 6 face the perforation side of the tape
• Qty 3 kpcs/reel
UPG2179TB
TRUTH TABLE
RECOMMENDED OPERATING RANGE (TA = 25°C, unless otherwise speciÞ ed)
PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM
Pin No. Pin Name
1 OUTPUT1
2 GND
3 OUTPUT2
4V
cont2
5 INPUT
6Vcont1
(Top View)
1
2
3
6
5
4
G4C
(Bottom View)
6
5
4
1
2
3
(Top View)
1
2
3
6
5
4
ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise speciÞ ed)
VCONT1 VCONT2 INPUT−OUTPUT1 INPU−OUTPUT2
Low High ON OFF
High Low OFF ON
PARAMETER SYMBOL RATINGS UNIT
Switch Control Voltage Vcont 6.0 V
Input Power Pin +33 dBm
Operating Ambient Temperature TA−45 to +85 °C
Storage Temperature Tstg −55 to +150 °C
PARAMETER SYMBOL MIN. TYP. MAX. UNIT
Switch Control Voltage (H) Vcont (H) 2.5 3.0 5.3 V
Switch Control Voltage (L) Vcont (L) −0.2 0 0.2 V
Note |Vcont1 – Vcont2| ≤ 6.0 V
ELECTRICAL CHARACTERISTICS
(TA = +25°C, Vcont = 3.0 V/0V, DC blocking capacitors = 100 pF, unless otherwise speciÞ ed)
UPG2179TB
Caution It is necessary to use DC blocking capacitors with this device.
The value of DC blocking capacitors should be chosen to accommodate the frequency of operation, bandwidth,
switching speed and the condition with the actual board of your system. The range of recommended
DC blocking capacitor value is less than 100 pF for frequencies above 0.5 GHz, and 1,000 pF for frequencies
below 0.5 GHz.
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT
Insertion Loss 1 LINS1 f = 0.5 to 1.0 GHz Note1 −0.25 0.45 dB
Insertion Loss 2 LINS2 f = 1.0 to 2.0 GHz −0.30 0.50 dB
Insertion Loss 3 LINS3 f = 2.0 to 2.5 GHz −0.35 0.55 dB
Insertion Loss 4 LINS4 f = 2.5 to 3.0 GHz −0.40 0.60 dB
Isolation 1 ISL1f = 0.5 to 2.0 GHz Note1 23 27 −dB
Isolation 2 ISL2f = 2.0 to 3.0 GHz 20 24 −dB
Input Return Loss RLin f = 0.5 to 3.0 GHz Note1 15 20 −dB
Output Return Loss RLout f = 0.5 to 3.0 GHz Note1 15 20 −dB
0.1 dB Loss Compression
Input Power Note2
Pin (0.1 dB) f = 2.0 GHz +25.5 +29.0 −dBm
f = 2.5 GHz +25.5 +29.0 −dBm
f = 0.5 to 3.0 GHz −+29.0 −dBm
Switch Control Current Icont No signal −420μA
Switch Control Speed tSW 50%CTL to 90/10%RF −50 500 ns
Note 1. DC blocking capacitor = 1 000pF at f = 0.05 to 0.5 GHz.
2. Pin(0.1 dB) is the measured input power level when the insertion loss increases 0.1 dB more than that of linear range.
STANDARD CHARACTERISTICS FOR REFERENCE
(TA = +25°C, Vcont = 3.0 V/0 V, DC blocking capacitors = 100 pF, unless otherwise speciÞ ed)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT
1 dB Loss Compression
Input Power Note
Pin (1 dB) f = 0.5 to 3.0 GHz −+32.0 −dBm
3rd Order Intermodulation Intercept
Point
IIP3f = 0.5 to 3.0 GHz, 2 tone,
5 MHz spacing
−+60.0 −dBm
Note Pin (1 dB) is the measured input power level when the insertion loss increases 1 dB more than that of linear range.
UPG2179TB
EVALUATION CIRCUIT
(Vcont1 = 3.0 V, Vcont2 = 0 V or Vcont2 = 0 V, Vcont1 = 3.0 V, off chip DC blocking capacitors value C1 = 51 pF, C2 = 1 000 pF
(Bypass), using NEC standard evaluation board)
OUTPUT2 OUTPUT1
56 pF
56 pF
65
4
1
23
Vcont2 Vcont1INPUT
56 pF 1 000 pF1 000 pF
This application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
UPG2179TB
ILLUSTRATION OF TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
C3
C5
C1
C2
C4
G4C
6pin SMM SPDT SW
Vc2
Vc1
IN
OUT 2
OUT 1
C1
C1
C1
C2
C2
Vcont2
OUTPUT2
INPUT
OUTPUT1
Vcont1
USING THE NEC EVALUATION BOARD
SYMBOL VALUES
C1, C2, C3 100 pF
C4, C5 1 000 pF
UPG2179TB
TYPICAL CHARACTERISTICS
(TA = +25°C, Vcont = 3.0 V/0 V, DC blocking capacitors = 100 pF, unless otherwise speciÞ ed)
Remark The graphs indicate nominal characteristics.
0.5
0.4
0.2
0.3
0.1
0
-0.1
-0.2
-0.3
-0.4
-0.5
0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5
Insertion Loss LINS (dB)
Frequency f (GHz)
INSERTION LOSS vs. FREQUENCY
INPUT-OUTPUT1
50
40
30
-10
20
10
0
-30
-20
-40
-50
0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5
Isolation ISL (dB)
Frequency f (GHz)
ISOLATION vs. FREQUENCY
INPUT-OUTPUT1
50
10
20
30
40
-10
0
-30
-20
-40
-50
0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5
Input Return Loss RLin (dB)
Frequency f (GHz)
INPUT RETURN LOSS vs. FREQUENCY
INPUT-OUTPUT1
50
10
20
30
40
-10
0
-30
-20
-40
-50
0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5
Isolation ISL (dB)
Frequency f (GHz)
ISOLATION vs. FREQUENCY
INPUT-OUTPUT2
50
10
20
30
40
-10
0
-30
-20
-40
-50
0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5
Input Return Loss RLin (dB)
Frequency f (GHz)
INPUT RETURN LOSS vs. FREQUENCY
INPUT-OUTPUT2
0.5
0.4
0.3
0.2
0
0.1
-0.1
-0.2
-0.3
-0.4
-0.5
0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5
Insertion Loss LINS (dB)
Frequency f (GHz)
INSERTION LOSS vs. FREQUENCY
INPUT-OUTPUT2
UPG2179TB
33
13
15
31
29
27
25
23
21
19
17
15 14 19 21 23 25 27 29 31 33 35
Output Power Pout (dBm)
Input Power Pin (dBm)
OUTPUT POWER vs. INPUT POWER
f = 2.5 GHz
23
25
27
29
31
33
13
15
17
19
21
15 17 19 21 23 25 27 29 31 33 35
Output Power Pout (dBm)
Input Power Pin (dBm)
OUTPUT POWER vs. INPUT POWER
f = 1.0 GHz
50
10
20
30
40
-10
0
-30
-20
-40
-50
0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5
Output Return Loss RLout (dB)
Frequency f (GHz)
OUTPUT RETURN LOSS vs. FREQUENCY
INPUT-OUTPUT1
50
10
20
30
40
-10
0
-30
-20
-40
-50
0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5
Output Return Loss RLout (dB)
Frequency f (GHz)
OUTPUT RETURN LOSS vs. FREQUENCY
INPUT-OUTPUT2
Remark The graphs indicate nominal characteristics.
PACKAGE DIMENSIONS
6-PIN SUPER MINIMOLD (UNIT: mm)
UPG2179TB
0.9±0.1
0.7
0 to 0.1
0.15+0.1
-0.05 0.2+0.1
-0.05
2.0±0.2
1.3
0.650.65
1.25±0.1
2.1±0.1
0.1 MIN.
5-148
UPG2179TB
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering
methods and conditions other than those recommended below, contact your nearby sales ofÞ ce.
Soldering Method Soldering Conditions Condition Symbol
Infrared Reß ow Peak temperature (package surface temperature) : 260°C or below
Time at peak temperature : 10 seconds or less
Time at temperature of 220°C or higher : 60 seconds or less
Preheating time at 120 to 180°C : 120±30 seconds
Maximum number of reß ow processes : 3 times
Maximum chlorine content of rosin ß ux (% mass) : 0.2%(Wt.) or below
IR260
VPS Peak temperature (package surface temperature) : 215°C or below
Time at temperature of 200°C or higher : 25 to 40 seconds
Preheating time at 120 to 150°C : 30 to 60 seconds
Maximum number of reß ow processes : 3 times
Maximum chlorine content of rosin ß ux (% mass) : 0.2%(Wt.) or below
VP215
Wave Soldering Peak temperature (molten solder temperature) : 260°C or below
Time at peak temperature : 10 seconds or less
Preheating temperature (package surface temperature) : 120°C or below
Maximum number of ß ow processes : 1 time
Maximum chlorine content of rosin ß ux (% mass) : 0.2%(Wt.) or below
WS260
Partial Heating Peak temperature (pin temperature) : 350°C or below
Soldering time (per side of device) : 3 seconds or less
Maximum chlorine content of rosin ß ux (% mass) : 0.2%(Wt.) or below
HS350
Life Support Applications
These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably
be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and
agree to fully indemnify CEL for all damages resulting from such improper use or sale.
A Business Partner of NEC Compound Semiconductor Devices, Ltd.
06/01/2004
Caution Do not use different soldering methods together (except for partial heating).
