74VHC74MSCX - Fairchild Semiconductor

October 1992

Revised March 1999

74VHC74 Dual D-Type Flip-Flop with Preset and Clear

74VHC74

Dual D-Type Flip-Flop with Preset and Clear

General Descript ion

The VHC74 is an advanced high speed CMOS Dual D-

Type Flip-Flop fabricated with silicon gate CMOS technol-

ogy. It achieves the high speed operation similar to equiva-

lent Bipolar Schottky TTL while maintaining the CMOS low

power dissip atio n. Th e si gn al l eve l applied to the D in put is

transferre d to th e Q o utp ut during t he p osi tive go ing transi-

tion of the CK pulse. CLR a nd PR are independent of the

CK and are accomplished by settin g the appropriate input

LOW.

An input protection circuit ensures that 0V to 7V can be

applied to the input pins without regard to the supply volt-

age. This device can be used to interface 5V to 3V systems

and two supply systems such as bat tery backup. This cir-

cuit pr eve nts dev ic e d estr uct ion due to m i sma tche d s upp l y

and input voltages.

Features

■High Speed: fMAX = 170 MHz (typ) at TA=25°C

■High noise immunity: VNIH = VNIL = 28% VCC (min)

■Power down protection is provided on all inputs

■Low power dissipation: ICC = 2 µA (max) at TA=25°C

■Pin and function compatible with 74HC74

Ordering Code:

Surface m ount pa c k ages are als o available on Tape and Reel. Specify by appendi ng the suffix let te r “X” to the ordering co de.

Logic Symbol

IEEE/IEC

Pin Descriptions

Connection Diagram

Truth Table

Note 1: This co nfigu ratio n is nons tab le; tha t is , it wi ll not pers ist w hen p re-

set and c lear input s ret urn to the ir inactive (H I GH ) s t at e.

Order Number Package Number Package Description

74VHC74M M14A 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-120, 0.150” Narrow

74VHC74SJ M14D 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide

74VHC74MTC MTC14 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide

74VHC74N N14A 14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide

Pin Names Description

D1, D2Data Inputs

CK1, CK2Clock Pulse Inputs

CLR1, CLR2Direct Clear Inputs

PR1, PR2Direct Preset Inputs

Q1, Q1, Q2, Q2Output

Inputs Outputs Function

CLR PR DCK Q Q

L H X X L H Clear

HLXX H L Preset

L L X X H (Note 1) H (Note 1)

HHL



HHH



HHX



QnQnNo Change

www.fairchildsemi.com 2

74VHC74

Absolute Maximum Ratings(Note 2) Recommended Operating

Conditions (Note 3)

Note 2: Absolute maximum ratings are values beyond which the device

may be da maged or ha ve its useful li fe impaire d. The datab ook specific a-

tions should be met, without exception, to ensure that the system design is

reliable ov er its pow er supply, temperatur e, and out put/inpu t loading varai-

bles. Fair child does not reco mmend ope ration outsid e databook sp ecifica-

tions.

Note 3: Unused inputs must be held HIGH or LOW. They may not float.

DC Electrical Characteristics

Supply Voltage (VCC)−0.5V to +7.0V

DC In put Voltage (VIN)−0.5V to +7.0V

DC Output Voltage (VOUT)−0.5V to VCC + 0.5V

Input Diode Current (IIK)−20 mA

Output Diode Current (IOK)±20 mA

DC Output Current (IOUT)±25 mA

DC VCC/GND Current (ICC)±50 mA

Storage Temperature (TSTG)−65°C to +150°C

Lead Temperature (TL)

Soldering (10 seconds) 260°C

Supply Voltage (VCC) 2.0V to 5.5V

Input Voltage (VIN)0V to +5.5V

Output Voltage (VOUT) 0V to VCC

Operating Temperature (TOPR)−40°C to +85°C

Input Rise and Fall Time (tr, tf)

VCC = 3.3V ± 0.3V 0 ∼ 100 ns/V

VCC = 5.0V ± 0.5V 0 ∼ 20 ns/V

Symbol Parameter VCC

(V)

TA = 25°CT

A = −40°C to +85°CUnits Conditions

Min Typ Max Min Max

VIH HIGH Level Input 2.0 1.50 1.50 V

Voltage 3.0 − 5.5 0.7 VCC 0.7 VCC

VIL LOW Level Input 2.0 0.50 0.50 V

Voltage 3.0 − 5.5 0.3 VCC 0.3 VCC

VOH HIGH Level Output 2.0 1.9 2.0 1.9 VIN = VIH IOH = −50 µA

Voltage 3.0 2.9 3.0 2.9 V or VIL

4.5 4.4 4.5 4.4

3.0 2.58 2.48 VIOH = −4 mA

4.5 3.94 3.80 IOH = −8 mA

VOL LOW Level Output 2.0 0.0 0.1 0.1 VIN = VIH IOL = 50 µA

Voltage 3.0 0.0 0.1 0.1 V or VIL

4.5 0.0 0.1 0.1

3.0 0.36 0.44 VIOL = 4 mA

4.5 0.36 0.44 IOL = 8 mA

IIN Input Leakage Current 0 − 5.5 ±0.1 ±1.0 µAV

IN = 5.5V or GND

ICC Quiescent Supply Current 5.5 2.0 20.0 µAV

IN = VCC or GND

3 www.fairchildsemi.com

74VHC74

AC Electrical Characteristics

Note 4: CPD is defined as th e v alue of th e intern al equivalent capa c it ance whic h is calculated fr om t he operating cu rrent consumptio n w it ho ut load. Avera ge

operati ng c urrent ca n be obtained from the equat ion: ICC (opr.) = CPD * VCC * fIN + ICC/2 (per F/F).

AC Operating Requirements

Note 5: VCC is 3. 3 ± 0. 3V or 5.0 ± 0.5V

Symbol Parameter VCC

(V)

TA = 25°CT

A = −40°C to +85°CUnits Conditions

Min Typ Max Min Max

fMAX Maximum Clock 3.3 ± 0.3 80 125 70 MHz CL = 15 pF

Frequency 50 75 45 CL = 50 pF

5.0 ± 0.5 130 170 110 MHz CL = 15 pF

90 115 75 CL = 50 pF

tPLH Propagation Delay 3.3 ± 0.3 6.7 11.9 1.0 14.0 ns CL = 15 pF

tPHL Time (CK-Q, Q)9.2 15.4 1.0 17.5 CL = 50 pF

5.0 ± 0.5 4.6 7.3 1.0 8.5 ns CL = 15 pF

6.1 9.3 1.0 10.5 CL = 50 pF

tPLH Propagation Delay Time 3.3 ± 0.3 7.6 12.3 1.0 14.5 ns CL = 15 pF

tPHL (CLR, PR -Q, Q)10.1 15.8 1.0 18.0 CL = 50 pF

5.0 ± 0.5 4.8 7.7 1.0 9.0 ns CL = 15 pF

6.3 9.7 1.0 11.0 CL = 50 pF

CIN Input Capacitance 4 10 10 pF VCC = Open

CPD Power Dissipation 25 pF (Note 4)

Capacitance

Symbol Parameter VCC

(V)

(Note 5)

TA = 25°CT

A = −40°C to +85°CUnits

Typ Guara nteed Mini mu m

tW(L) Minimum Pulse Width (CK) 3.3 6.0 7.0 ns

tW(H) 5.0 5.0 5.0

tW(L) Minimum Pulse Width (CLR,PR)3.3 6.0 7.0 ns

5.0 5.0 5.0

tSMinimum Setup Time 3.3 6.0 7.0 ns

5.0 5.0 5.0

tHMini mum Hold Time 3.3 0.5 0.5 ns

5.0 0.5 0.5

tREC Minim um Recovery Time (CLR ,PR)3.3 5.0 5.0 ns

5.0 3.0 3.0

www.fairchildsemi.com 4

74VHC74

Physical Dimensions inches (millimeters) unless otherwise noted

14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-120, 0.150” Narrow

Package Number M14A

14-Lead Sma ll Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide

Package Number M14D

5 www.fairchildsemi.com

74VHC74

Physical Dimensions inches (millimeters) unless otherwise noted (Continued)

14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide

Packag e Num be r MTC 14

Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.

74VHC74 Dual D-Type Flip-Flop with Preset and Clear

LIFE SUPPORT POLICY

FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT

DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD

SEMICONDUCTOR CORPORATION. As used herein:

1. Life suppor t de vices o r systems a re devices or syste ms

which, (a) are intended for surgical implant into the

body, or (b) support or sustain life, and (c) whose failure

to perform when properly used in accordance with

instructions for use provided in the labeling, can be rea-

sonably expected to result in a significant injury to the

user.

2. A critical compon ent i n any compon ent of a life su pport

device or system whose failure to perform can be rea-

sonabl y ex pect ed to ca use the fa i lure of the life su pp ort

device or system, or to affect its safety or effectiveness.

www.fairchildsemi.com

Physical Dimensions inches (millimeters) unless otherwise noted (Continued)

14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide

Package Number N14A