INTEGRATED CIRCUITS DIVISION
www.ixysic.com
DS-CPC1020N-R03 1
CPC1020N
Single-Pole, Normally Open
4-Lead SOP OptoMOS® Relay
e3
Pb
Part # Description
CPC1020N 4-Lead SOP (100/tube)
CPC1020NTR 4-Lead SOP (2000/reel)
Parameter Rating Units
Blocking Voltage 30 VP
Load Current 1.2 ADC
On-Resistance (max) 0.25
Applications
Features
Description
Ordering Information
Pin Configuration
• Sensor Circuitry
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment—Patient/Equipment Isolation
• Aerospace
• Industrial Controls
• 1500Vrms Input/Output Isolation
• Small 4-Lead SOP Package
• Low Drive Power Requirements (TTL/CMOS
Compatible)
• No Moving Parts
• High Reliability
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Machine Insertable, Wave Solderable
• Tape & Reel Version Available
The CPC1020N is a 30V, single-pole, normally open
(1-Form-A) Solid State Relay. The ultra-low
on-resistance, 0.25, of this relay allows for
high-current operation.
IXYS Integrated Circuits Division's patented OptoMOS
architecture makes available the optically coupled
technology necessary to activate the output's efficient
MOSFET switches while providing 1500Vrms input
to output isolation. Control of the isolated output is
accomplished by means of the highly effective GaAlAs
infrared LED at the input.
Approvals
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate 1175739
• EN/IEC 60950-1 Certified Component:
TUV Certificate B 09 07 49410 004
Switching Characteristics
of Normally Open Devices
Form-A
IF
ILOAD
10%
90%
ton toff
1
23
4
+ Control
– Control
Load
Load
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
2R03
CPC1020N
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Absolute Maximum Ratings @ 25ºC
Parameter Ratings Units
Blocking Voltage 30 VP
Input Power Dissipation 175 mW
Input Control Current 50 mA
Peak (10ms) 1 A
Reverse Input Voltage 5 V
Total Power Dissipation 2400 mW
Isolation voltage, Input to Output 1500 Vrms
Operational Temperature -40 to +85 °C
Storage Temperature -40 to +125 °C
1 Derate linearly 1.33 mW / ºC
2 Derate linearly 3.33 mW / ºC
Parameter Conditions Symbol Min Typ Max Units
Output Characteristics
Load Current
Continuous 1IF=2mA IL- - 1.2 ADC
Peak t < 10ms ILPK --3A
On-Resistance 2IL=1A RON - 0.116 0.25
Off-State Leakage Current VL=30VPILEAK --1A
Switching Speeds
Turn-On IF=5mA, VL=10V ton - 0.48 3 ms
Turn-Off toff - 0.65 3
Output Capacitance VL=15V, f=1MHz COUT -70 -pF
Input Characteristics
Input Control Current to Activate IL=1A IF- 0.13 2 mA
Input Control Current to Deactivate - IF0.1 - - mA
Input Voltage Drop IF=5mA VF0.9 1.2 1.4 V
Reverse Input Current VR=5V IR- - 10 µA
Input/Output Characteristics
Capacitance, Input to Output - CI/O -3 -pF
1 Load current derates linearly from 1.2A @ 25oC to 0.58A @85oC.
2 Measurement taken within 1 second of on-time.
Electrical Characteristics @ 25ºC
ESD Rating (Human Body Model)
1000 Volts
ESD Rating
INTEGRATED CIRCUITS DIVISION
CPC1020N
www.ixysic.com 3
R03
PERFORMANCE DATA*
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please
contact our application department.
Turn-On Time (ms)
0.35 0.40 0.45 0.50 0.55 0.60
Device Count (N)
0
5
10
15
20
25
Typical Turn-On Time Distribution
(N=50, IF=5mA, IL=5mA, TA=25ºC)
Turn-Off Time (ms)
0.47 0.55 0.63 0.71 0.79
Device Count (N)
0
5
10
15
20
25
30
Typical Turn-Off Time Distribution
(N=50, IF=5mA, IL=5mA, TA=25ºC)
On-Resistance (:)
0.113 0.114 0.115 0.116 0.117 0.118
Device Count (N)
0
5
10
15
20
Typical On-Resistance Distribution
(N=50, IF=2mA, IL=1A, TA=25ºC)
LED Forward Current (mA)
0.093 0.101 0.109 0.117 0.125 0.133
Device Count (N)
0
5
10
15
20
25
Typical IF for Switch Operation
(N=50, IL=100mA, TA=25ºC)
Blocking Voltage (VP)
37.8 38.2 38.6 39.0 39.4
Device Count (N)
0
5
10
15
20
25
Typical Blocking Voltage Distribution
(N=50, TA=25ºC)
LED Forward Voltage (V)
1.25 1.26 1.27 1.28 1.29
Device Count (N)
0
5
10
15
20
25
30
35
Typical LED Forward Voltage Drop
(N=50, IF=5mA, TA=25ºC)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
LED Forward Voltage (V)
1.0
1.1
1.2
1.3
1.4
1.5
1.6
Typical LED Forward Voltage Drop
vs. Temperature
IF=2mA
IF=5mA
IF=50mA
IF=20mA
IF=10mA
LED Forward Current (mA)
0 1020304050
Turn On Time (ms)
0
0.5
1.0
1.5
2.0
2.5
Typical Turn-On Time
vs. LED Forward Current
(IL=100mA)
LED Forward Current (mA)
0 1020304050
Turn-Off Time (Ps)
600
620
640
660
680
700
Typical Turn-Off Time
vs. LED Forward Current
(IL=100mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
LED Forward Current (mA)
0.08
0.10
0.12
0.14
0.16
0.18
0.20
Typical IF for Switch Operation
vs. Temperature
(IL=1A)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Turn-On Time (ms)
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
Typical Turn-On Time vs. Temperature
(IL=100mA)
IF=2mA
IF=5mA
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Turn-Off Time (ms)
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
Typical Turn-Off Time vs. Temperature
(IL=100mA)
IF=2mA
IF=5mA
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
4R03
CPC1020N
PERFORMANCE DATA*
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please
contact our application department.
Load Voltage (V)
-0.20 -0.15 -0.10 -0.05 0.00 0.05 0.10 0.15 0.20
Load Current (A)
-1.5
-1.0
-0.5
0.0
0.5
1.0
1.5
Typical Load Voltage vs. Load Current
(IF=2mA, TA=25ºC)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
On-Resistance (:)
0.10
0.15
0.20
0.25
0.30
0.35
0.40
Typical On-Resistance vs. Temperature
(IF=2mA, IL=0.5A)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Blocking Voltage (VP)
36.5
37.0
37.5
38.0
38.5
39.0
39.5
40.0
40.5
Typical Blocking Voltage
vs. Temperature
(IL=1PA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Leakage Current (nA)
0
20
40
60
80
100
Typical Leakage Current vs. Temperature
Measured Across Pins 3&4
(IF=0mA, VL=30V)
Time
10Ps 100Ps 1ms 10ms 100ms 1s 10s 100s
Current (A)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
Energy Rating Curve
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Load Current (ADC)
0.0
0.25
0.50
0.75
1.00
1.25
1.50
Maximum Load Current
vs. Temperature
(IF=2mA)
INTEGRATED CIRCUITS DIVISION
CPC1020N
www.ixysic.com 5
R03
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Rating
CPC1020N MSL 3
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device Maximum Temperature x Time
CPC1020N 260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
e3
Pb
INTEGRATED CIRCUITS DIVISION
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-CPC1020N-R03
©Copyright 2012, IXYS Integrated Circuits Division
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/13/2012
For additional information please visit our website at: www.ixysic.com
6
CPC1020N
Dimensions
mm
(inches)
NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted
Embossment
Embossed
Carrier
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
U
ser Direction o
f
Feed
User Direction of Feed
K0=2.70
(0.106)
K1=2.30
(0.091)
B0=4.70
(0.185)
W=12.00
(0.472)
P=8.00
(0.315)
A0=6.50
(0.256)
MECHANICAL DIMENSIONS
Recommended PCB Land Pattern
2.54
(0.10)
5.60
(0.2205)
1.30
(0.0512)
0.60
(0.0217)
Dimensions
mm
(inches)
Pin 1
4.089 ± 0.203
(0.161 ± 0.008)
2.54 Typ
(0.100 Typ)
6.096 ± 0.102
(0.240 ± 0.004)
3.810 ± 0.076
(0.150 ± 0.003) 0.432 ± 0.127
(0.017 ± 0.005)
0.200 ± 0.025
(0.008 ± 0.001)
1.02 ± 0.025
(0.040 ± 0.001)
2.184 Max
(0.086 Max)
0.381 TYP.
(0.015 TYP.)
Lead to package standoff:
0.0637 ± 0.0383
(0.0025 ± 0.0015)
0.762 ± 0.102
(0.030 ± 0.004)
CPC1020N
CPC1020NTR Tape & Reel
