1
Motorola Optoelectronics Device Data
! ! "
(600 Volts Peak)
The MOC3051 Series consists of a GaAs infrared LED optically coupled to a
non–Zero–crossing silicon bilateral AC switch (triac). The MOC3051 Series
isolates low voltage logic from 115 and 240 Vac lines to provide random phase
control of high current triacs or thyristors. The MOC3051 Series features greatly
enhanced static dv/dt capability to ensure stable switching performance of
inductive loads.
•
To order devices that are tested and marked per VDE 0884 requirements, the
suffix ”V” must be included at end of part number. VDE 0884 is a test option.
Recommended for 115/240 Vac(rms) Applications:
•Solenoid/Valve Controls •Solid State Relays
•Lamp Ballasts •Incandescent Lamp Dimmers
•Static AC Power Switch •Temperature Controls
•Interfacing Microprocessors to 115 and 240 Vac •Motor Controls
Peripherals
MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
Rating Symbol Value Unit
INFRARED EMITTING DIODE
Reverse Voltage VR3 Volts
Forward Current — Continuous IF60 mA
Total Power Dissipation @ TA = 25°C
Negligible Power in Triac Driver
Derate above 25°C
PD100
1.33
mW
mW/°C
OUTPUT DRIVER
Off–State Output Terminal Voltage VDRM 600 Volts
Peak Repetitive Surge Current
(PW = 100 µs, 120 pps) ITSM 1 A
Total Power Dissipation @ TA = 25°C
Derate above 25°CPD300
4mW
mW/°C
TOTAL DEVICE
Isolation Surge Voltage (1)
(Peak ac Voltage, 60 Hz, 1 Second Duration) VISO 7500 Vac(pk)
Total Power Dissipation @ TA = 25°C
Derate above 25°CPD330
4.4 mW
mW/°C
Junction Temperature Range TJ–40 to +100 °C
Ambient Operating Temperature Range TA–40 to +85 °C
Storage Temperature RangeTstg –40 to +150 °C
Soldering Temperature (10 s) TL260 °C
1. Isolation surge voltage, VISO, is an internal device dielectric breakdown rating.
1. For this test, Pins 1 and 2 are common, and Pins 4, 5 and 6 are common.
GlobalOptoisolator
COUPLER SCHEMATIC
STANDARD THRU HOLE
1. ANODE
2. CATHODE
3. NC
4. MAIN TERMINAL
5. SUBSTRATE
DO NOT CONNECT
6. MAIN TERMINAL
1
2
3
6
5
4
61
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic Symbol Min Typ Max Unit
INPUT LED
Reverse Leakage Current
(VR = 3 V) IR— 0.05 100 µA
Forward Voltage
(IF = 10 mA) VF— 1.15 1.5 Volts
OUTPUT DETECTOR (IF = 0 unless otherwise noted)
Peak Blocking Current, Either Direction
(Rated VDRM, Note 1) @ IFT per device IDRM — 10 100 nA
Peak On–State Voltage, Either Direction
(ITM = 100 mA Peak) VTM — 1.7 2.5 Volts
Critical Rate of Rise of Off–State Voltage @ 400 V
(Refer to test circuit, Figure 10) dv/dt
static 1000 — — V/µs
COUPLED
LED Trigger Current, Either Direction, Current Required to Latch Output
(Main Terminal Voltage = 3 V, Note 2) MOC3051
MOC3052
IFT —
——
—15
10
mA
Holding Current, Either Direction IH— 280 — µA
1. Test voltage must be applied within dv/dt rating.
2. All devices are guaranteed to trigger at an IF value less than or equal to max IFT. Therefore, recommended operating IF lies between max
2. 15 mA for MOC3051, 10 mA for 3052 and absolute max IF (60 mA).
1000
800
600
400
200
0
–200
–400
–600
–800
–1000–6 –4 –2 0 2 4 6
Figure 1. LED Forward Voltage versus
Forward Current
IF, LED FORWARD CURRENT (mA) 1000100101
V ,
FFORWARD VOLTAGE (VOLTS)
2
1.8
1.6
1.4
1.2
1
25
°
C
Figure 2. On–State Characteristics
VTM, ON–STATE VOLTAGE (VOLTS)
ITM, ON–STATE CURRENT (mA)
85
°
C
TA = –40
°
C
PULSE OR DC
PULSE ONLY
TYPICAL ELECTRICAL CHARACTERISTICS
TA = 25°C
MOC3051, MOC3052
TYPICAL ELECTRICAL CHARACTERISTICS
TA = 25°C
Figure 3. Trigger Current versus Temperature
TA, AMBIENT TEMPERATURE (
°
C)
–40
1.6
1.4
1.2
1
0.8
0.6 –30 –20 –10 0 10 20 30 40 50 60 70 80
NORMALIZED TO
TA = 25
°
C
IFT, LED TRIGGER CURRENT (mA)
Figure 4. LED Current Required to Trigger
versus LED Pulse Width
PWin, LED TRIGGER PULSE WIDTH (
µ
s)
1
25
20
15
10
5
02 5 10 20 50 100
NORMALIZED TO:
PWin
≥
100
µ
s
IFT, NORMALIZED LED TRIGGER CURRENT
Figure 5. Minimum Time for LED Turn–Off to Zero
Cross of AC Trailing Edge
AC SINE
0
°
180
°
LED PW
LED CURRENT
LED TURN OFF MIN 200
µ
s
IFT versus Temperature (normalized)
This graph shows the increase of the trigger current when
the device is expected to operate at an ambient temperature
below 25°C. Multiply the normalized IFT shown on this graph
with the data sheet guaranteed IFT.
Example:
TA = –40°C, IFT = 10 mA
IFT @ –40°C = 10 mA x 1.4 = 14 mA
Phase Control Considerations
LED Trigger Current versus PW (normalized)
Random Phase Triac drivers are designed to be phase
controllable. They may be triggered at any phase angle with-
in the AC sine wave. Phase control may be accomplished by
an AC line zero cross detector and a variable pulse delay
generator which is synchronized to the zero cross detector.
The same task can be accomplished by a microprocessor
which is synchronized to the AC zero crossing. The phase
controlled trigger current may be a very short pulse which
saves energy delivered to the input LED. LED trigger pulse
currents shorter than 100 µs must have an increased ampli-
tude as shown on Figure 4. This graph shows the dependen-
cy of the trigger current IFT versus the pulse width t (PW).
The reason for the IFT dependency on the pulse width can be
seen on the chart delay t(d) versus the LED trigger current.
IFT in the graph IFT versus (PW) is normalized in respect to
the minimum specified IFT for static condition, which is speci-
fied in the device characteristic. The normalized IFT has to be
multiplied with the devices guaranteed static trigger current.
Example:
Guaranteed IFT = 10 mA, Trigger pulse width PW = 3 µs
IFT (pulsed) = 10 mA x 5 = 50 mA
Minimum LED Off Time in Phase Control Applications
In Phase control applications one intends to be able to
control each AC sine half wave from 0 to 180 degrees. Turn
on at zero degrees means full power and turn on at 180 de-
gree means zero power. This is not quite possible in reality
because triac driver and triac have a fixed turn on time when
activated at zero degrees. At a phase control angle close to
180 degrees the driver’s turn on pulse at the trailing edge of
the AC sine wave must be limited to end 200 µs before AC
zero cross as shown in Figure 5. This assures that the triac
driver has time to switch off. Shorter times may cause loss of
control at the following half cycle.
MOC3051, MOC3052
Figure 6. Holding Current, IH
versus Temperature
TA, AMBIENT TEMPERATURE (
°
C)
–40
1
0.9
0–30 –20 –10 0 10 20 30 40 50 60 70 80
IH, HOLDING CURRENT (mA)
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
Figure 7. Leakage Current, IDRM
versus Temperature
TA, AMBIENT TEMPERATURE (
°
C)
–40
100
1–30 –20 –10 0 10 20 30 40 50 60 70 80
10
IDRM, LEAKAGE CURRENT (nA)
TYPICAL ELECTRICAL CHARACTERISTICS
TA = 25°C
Figure 8. ED Trigger Current, IFT, versus dv/dt
dv/dt (V/
µ
s)
0.001
1.5
0.5 10000
NORMALIZED TO:
IFT at 3 V
IFT, LED TRIGGER CURRENT (NORMALIZED)
1.4
1.3
1.2
1.1
1
0.9
0.8
0.7
0.6
0.01 0.1 1 10 100 1000
IFT versus dv/dt
Triac drivers with good noise immunity (dv/dt static) have
internal noise rejection circuits which prevent false triggering
of the device in the event of fast raising line voltage tran-
sients. Inductive loads generate a commutating dv/dt that
may activate the triac drivers noise suppression circuits. This
prevents the device from turning on at its specified trigger
current. It will in this case go into the mode of “half waving” of
the load. Half waving of the load may destroy the power triac
and the load.
Figure 8 shows the dependency of the triac drivers IFT ver-
sus the reapplied voltage rise with a Vp of 400 V. This dv/dt
condition simulates a worst case commutating dv/dt ampli-
tude.
It can be seen that the IFT does not change until a commu-
tating dv/dt reaches 1000 V/µs. Practical loads generate a
commutating dv/dt of less than 50 V/µs. The data sheet spe-
cified IFT is therefore applicable for all practical inductive
loads and load factors.
MOC3051, MOC3052
TYPICAL ELECTRICAL CHARACTERISTICS
TA = 25°C
Figure 9. Delay Time, t(d), and Fall Time, t(f),
versus LED Trigger Current
IFT, LED TRIGGER CURRENT (mA)
100
0.110 20 30 40 50 60
10
t(delay) AND t(fall) ( s)
µ
1t(f)
t(d)
t(delay), t(f) versus IFT
The triac driver’s turn on switching speed consists of a turn
on delay time t(d) and a fall time t(f). Figure 9 shows that the
delay time depends on the LED trigger current, while the ac-
tual trigger transition time t(f) stays constant with about one
micro second.
The delay time is important in very short pulsed operation
because it demands a higher trigger current at very short trig-
ger pulses. This dependency is shown in the graph IFT ver-
sus LED PW.
The turn on transition time t(f) combined with the power
triac’s turn on time is important to the power dissipation of
this device.
Switching Time Test Circuit
1. The mercury wetted relay provides a high speed repeated
pulse to the D.U.T.
2. 100x scope probes are used, to allow high speeds and
voltages.
3. The worst–case condition for static dv/dt is established by
triggering the D.U.T. with a normal LED input current, then
removing the current. The variable RTEST allows the dv/dt to
be gradually increased until the D.U.T. continues to trigger in
response to the applied voltage pulse, even after the LED
current has been removed. The dv/dt is then decreased until
the D.U.T. stops triggering. τRC is measured at this point and
recorded.
Figure 10. Static dv/dt Test Circuit
+400
Vdc
PULSE
INPUT
RTEST
CTEST
R = 1 k
Ω
MERCURY
WETTED
RELAY D.U.T.
X100
SCOPE
PROBE
APPLIED VOLTAGE
WAVEFORM
Vmax = 400 V
dv/dt = 0.63 Vmax
τ
RC 252
τ
RC
=
τ
RC
252 V
0 VOLTS
SCOPE
IFT
VTM
t(d) t(f)
ZERO CROSS
DETECTOR
EXT. SYNC
Vout
FUNCTION
GENERATOR
PHASE CTRL.
PW CTRL.
PERIOD CTRL.
Vo AMPL. CTRL.
IFT
VTM
10 k
Ω
DUT
100
Ω
ISOL. TRANSF.
AC
115 VAC
MOC3051, MOC3052
APPLICATIONS GUIDE
Basic Triac Driver Circuit
The new random phase triac driver family MOC3052 and
MOC3051 are very immune to static dv/dt which allows
snubberless operations in all applications where external
generated noise in the AC line is below its guaranteed dv/dt
withstand capability. For these applications a snubber circuit
is not necessary when a noise insensitive power triac is
used. Figure 11 shows the circuit diagram. The triac driver is
directly connected to the triac main terminal 2 and a series
Resistor R which limits the current to the triac driver. Current
limiting resistor R must have a minimum value which restricts
the current into the driver to maximum 1A.
R = Vp AC/ITM max rep. = Vp AC/1A
The power dissipation of this current limiting resistor and
the triac driver is very small because the power triac carries
the load current as soon as the current through driver and
current limiting resistor reaches the trigger current of the
power triac. The switching transition times for the driver is
only one micro second and for power triacs typical four micro
seconds.
Triac Driver Circuit for Noisy Environments
When the transient rate of rise and amplitude are expected
to exceed the power triacs and triac drivers maximum ratings
a snubber circuit as shown in Figure 12 is recommended.
Fast transients are slowed by the R–C snubber and exces-
sive amplitudes are clipped by the Metal Oxide V aristor MOV.
Triac Driver Circuit for Extremely Noisy Environments,
as specified in the noise standards IEEE472 and IEC255–4.
Industrial control applications do specify a maximum tran-
sient noise dv/dt and peak voltage which is superimposed
onto the AC line voltage. In order to pass this environment
noise test a modified snubber network as shown in Figure 13
is recommended.
Figure 11. Basic Driver Circuit
Figure 12. Triac Driver Circuit for Noisy Environments
Figure 13. Triac Driver Circuit for Extremely Noisy
Environments
VCC
RET.
RLED TRIAC DRIVER POWER TRIAC
AC LINE
LOAD
R
Q
CONTROL
R
TRIAC DRIVER POWER TRIAC
RLED
VCC
RET.
CONTROL
RS
CS
MOV
LOAD
AC LINE
R
TRIAC DRIVER
POWER TRIAC
RS
CS
MOV
LOAD
AC LINE
VCC
RET.
CONTROL
RLED
RLED = (VCC – VF LED – Vsat Q)/IFT
R = Vp AC line/ITSM
Typical Snubber values RS = 33 Ω, CS = 0.01 µF
MOV (Metal Oxide Varistor) protects triac and
driver from transient overvoltages >VDRM max.
Recommended snubber to pass IEEE472 and IEC255–4 noise tests
RS = 47 W, CS = 0.01 mF
MOC3051, MOC3052
PACKAGE DIMENSIONS
THRU HOLE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
STYLE 6:
PIN 1. ANODE
2. CATHODE
3. NC
4. MAIN TERMINAL
5. SUBSTRATE
6. MAIN TERMINAL
6 4
1 3
–A–
–B–
SEATING
PLANE
–T–
4 PLF
K
C
N
G
6 PLD
6 PLE
M
A
M
0.13 (0.005) B M
T
L
M
6 PLJ
M
B
M
0.13 (0.005) A M
T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.320 0.350 8.13 8.89
B0.240 0.260 6.10 6.60
C0.115 0.200 2.93 5.08
D0.016 0.020 0.41 0.50
E0.040 0.070 1.02 1.77
F0.010 0.014 0.25 0.36
G0.100 BSC 2.54 BSC
J0.008 0.012 0.21 0.30
K0.100 0.150 2.54 3.81
L0.300 BSC 7.62 BSC
M0 15 0 15
N0.015 0.100 0.38 2.54
_ _ _ _
SURFACE MOUNT
–A–
–B–
S
SEATING
PLANE
–T–
J
K
L
6 PL
M
B
M
0.13 (0.005) A M
T
C
D6 PL
M
A
M
0.13 (0.005) B M
T
H
G
E6 PL
F4 PL
31
46
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.320 0.350 8.13 8.89
B0.240 0.260 6.10 6.60
C0.115 0.200 2.93 5.08
D0.016 0.020 0.41 0.50
E0.040 0.070 1.02 1.77
F0.010 0.014 0.25 0.36
G0.100 BSC 2.54 BSC
H0.020 0.025 0.51 0.63
J0.008 0.012 0.20 0.30
K0.006 0.035 0.16 0.88
L0.320 BSC 8.13 BSC
S0.332 0.390 8.43 9.90
MOC3051, MOC3052
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
0.4" LEAD SPACING
6 4
1 3
–A–
–B–
N
C
K
G
F4 PL
SEATING
D6 PL
E6 PL
PLANE
–T–
M
A
M
0.13 (0.005) B M
T
L
J
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.320 0.350 8.13 8.89
B0.240 0.260 6.10 6.60
C0.115 0.200 2.93 5.08
D0.016 0.020 0.41 0.50
E0.040 0.070 1.02 1.77
F0.010 0.014 0.25 0.36
G0.100 BSC 2.54 BSC
J0.008 0.012 0.21 0.30
K0.100 0.150 2.54 3.81
L0.400 0.425 10.16 10.80
N0.015 0.040 0.38 1.02
MOC3051, MOC3052
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES
OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR
CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body,
or (b) support or sustain life, and (c) whose failure to
perform when properly used in accordance with
instructions for use provided in the labeling, can be
reasonably expected to result in a significant injury of the
user.
2. A critical component in any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO
ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME
ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
www.fairchildsemi.com © 2000 Fairchild Semiconductor Corporation
