EC2500TS-10.000M TR EC25 00 TS -10.000M TR Series Quartz Crystal Clock Oscillators XO (SPXO) HCMOS/TTL (CMOS) 5.0Vdc 4 Pad 5.0mm x 7.0mm Ceramic Surface Mount (SMD) Packaging Options Tape & Reel Nominal Frequency 10.000MHz Frequency Tolerance/Stability 100ppm Maximum Load Drive Capability Low Drive Operating Temperature Range -10C to +70C Pin 1 Connection Tri-State (High Impedance) Duty Cycle 50 10(%) ELECTRICAL SPECIFICATIONS Nominal Frequency 10.000MHz Frequency Tolerance/Stability 100ppm Maximum (Inclusive of all conditions: Calibration Tolerance at 25C, Frequency Stability over the Operating Temperature Range, Supply Voltage Change, Ouput Load Change, First Year Aging at 25C, Shock, and Vibration) Aging at 25C 5ppm/year Maximum Operating Temperature Range -10C to +70C Supply Voltage 5.0Vdc 10% Input Current 10mA Maximum (No Load) Output Voltage Logic High (Voh) 2.4Vdc Minimum with (LS)TTL Load, Vdd-0.5Vdc Minimum with CMOS Load Input Current Logic High (Ioh) -4mA Output Voltage Logic Low (Vol) 0.4Vdc Maximum with (LS)TTL Load, 0.5Vdc Maximum with CMOS Load Input Current Logic Low (Iol) 4mA Rise/Fall Time 10nSec Maximum (Measured at 0.4Vdc to 2.4Vdc with (LS)TTL Load; Measured at 10% to 90% of waveform with CMOS Load) Duty Cycle 50 10(%) (Measured at 50% of waveform with CMOS Load or at 1.4Vdc with (LS)TTL Load) Load Drive Capability Low Drive (10LSTTL Load or 30pF CMOS Load Maximum) Output Logic Type CMOS Pin 1 Connection Tri-State (High Impedance) Tri-State Input Voltage (Vih and Vil) +2.0Vdc Minimum to enable output, +0.8Vdc Maximum to disable output (High Impedance), No Connect to enable output. RMS Phase Jitter 1pSec Maximum (12kHz to 20MHz offset frequency) Start Up Time 10mSec Maximum Storage Temperature Range -55C to +125C ENVIRONMENTAL & MECHANICAL SPECIFICATIONS ESD Susceptibility MIL-STD-883, Method 3015, Class 1, HBM: 1500V Fine Leak Test MIL-STD-883, Method 1014, Condition A Flammability UL94-V0 Gross Leak Test MIL-STD-883, Method 1014, Condition C Mechanical Shock MIL-STD-883, Method 2002, Condition B Moisture Resistance MIL-STD-883, Method 1004 Moisture Sensitivity J-STD-020, MSL 1 Resistance to Soldering Heat MIL-STD-202, Method 210, Condition K Resistance to Solvents MIL-STD-202, Method 215 Solderability MIL-STD-883, Method 2003 Temperature Cycling MIL-STD-883, Method 1010, Condition B Vibration MIL-STD-883, Method 2007, Condition A www.ecliptek.com | Specification Subject to Change Without Notice | Revision P 06/13/2012 | Page 1 of 8 EC2500TS-10.000M TR MECHANICAL DIMENSIONS (all dimensions in millimeters) 7.00 0.15 5.08 0.15 4 3 MARKING ORIENTATION 5.00 0.15 2.60 0.15 2 1 1.2 0.2 1.4 01 PIN CONNECTION 1 Tri-State 2 Ground 3 Output 4 Supply Voltage LINE MARKING 1 ECLIPTEK 2 10.000M 3 XXXXX XXXXX=Ecliptek Manufacturing Identifier 3.68 0.15 1.6 +0.2/-0.5 Suggested Solder Pad Layout All Dimensions in Millimeters 2.0 (X4) 2.2 (X4) Solder Land (X4) 2.88 1.81 All Tolerances are 0.1 www.ecliptek.com | Specification Subject to Change Without Notice | Revision P 06/13/2012 | Page 2 of 8 EC2500TS-10.000M TR CLOCK OUTPUT TRI-STATE INPUT OUTPUT WAVEFORM & TIMING DIAGRAM VIH VIL VOH 90% or 2.4VDC OUTPUT DISABLE (HIGH IMPEDANCE STATE) 50% or 1.4VDC 10% or 0.4VDC VOL tPLZ Fall Time Rise Time tPZL TW T Duty Cycle (%) = TW/T x 100 www.ecliptek.com | Specification Subject to Change Without Notice | Revision P 06/13/2012 | Page 3 of 8 EC2500TS-10.000M TR Test Circuit for TTL Output Output Load Drive Capability RL Value (Ohms) CL Value (pF) 10TTL 5TTL 2TTL 10LSTTL 1TTL 390 780 1100 2000 2200 15 15 6 15 3 Oscilloscope Table 1: RL Resistance Value and CL Capacitance Value Vs. Output Load Drive Capability + + Power Supply _ Current Meter _ Supply Voltage (VDD) Frequency Counter Probe (Note 2) RL (Note 4) Output + Voltage Meter _ + 0.01F (Note 1) 0.1F (Note 1) Ground CL (Note 3) Power Supply _ No Connect or Tri-State Note 1: An external 0.1F low frequency tantalum bypass capacitor in parallel with a 0.01F high frequency ceramic bypass capacitor close to the package ground and VDD pin is required. Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth (>300MHz) passive probe is recommended. Note 3: Capacitance value CL includes sum of all probe and fixture capacitance. Note 4: Resistance value RL is shown in Table 1. See applicable specification sheet for 'Load Drive Capability'. Note 5: All diodes are MMBD7000, MMBD914, or equivalent. www.ecliptek.com | Specification Subject to Change Without Notice | Revision P 06/13/2012 | Page 4 of 8 EC2500TS-10.000M TR Test Circuit for CMOS Output Frequency Counter Oscilloscope + + Power Supply _ Current Meter _ Supply Voltage (VDD) Probe (Note 2) Output + Voltage Meter _ 0.01F (Note 1) 0.1F (Note 1) Ground CL (Note 3) No Connect or Tri-State Note 1: An external 0.1F low frequency tantalum bypass capacitor in parallel with a 0.01F high frequency ceramic bypass capacitor close to the package ground and VDD pin is required. Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth (>300MHz) passive probe is recommended. Note 3: Capacitance value CL includes sum of all probe and fixture capacitance. www.ecliptek.com | Specification Subject to Change Without Notice | Revision P 06/13/2012 | Page 5 of 8 EC2500TS-10.000M TR Tape & Reel Dimensions All Dimensions in Millimeters Compliant to EIA-481 Quantity Per Reel: 1,000 units 4.00 0.10 0.60 MAX DIA 1.50 +0.10/-0.00 0.10 MAX 2.00 0.10 1.75 0.10 7.50 0.10 MARKING ORIENTATION 16.00 0.30 DIA 1.50 MIN 8.00 0.10 B0 A0 K0 Direction of Unreeling 1.50 MIN 22.40 MAX DIA 40 MIN Access Hole at Slot Location 360 MAX DIA 50 MIN DIA 20.20 MIN DIA 13.00 0.20 2.50 MIN Width 10 MIN Depth Tape slot in Core for Tape Start 16.4 +2.00/-0.00 www.ecliptek.com | Specification Subject to Change Without Notice | Revision P 06/13/2012 | Page 6 of 8 EC2500TS-10.000M TR Recommended Solder Reflow Methods Critical Zone TL to T P Temperature (T) TP Ramp-up Ramp-down TL TS Max TS Min tL t S Preheat t 25C to Peak tP Time (t) High Temperature Infrared/Convection TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level Additional Notes 3C/second Maximum 150C 175C 200C 60 - 180 Seconds 3C/second Maximum 217C 60 - 150 Seconds 260C Maximum for 10 Seconds Maximum 250C +0/-5C 20 - 40 seconds 6C/second Maximum 8 minutes Maximum Level 1 Temperatures shown are applied to body of device. www.ecliptek.com | Specification Subject to Change Without Notice | Revision P 06/13/2012 | Page 7 of 8 EC2500TS-10.000M TR Recommended Solder Reflow Methods Critical Zone TL to T P Temperature (T) TP Ramp-up Ramp-down TL TS Max TS Min tL t S Preheat t 25C to Peak tP Time (t) Low Temperature Infrared/Convection 240C TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level Additional Notes 5C/second Maximum N/A 150C N/A 60 - 120 Seconds 5C/second Maximum 150C 200 Seconds Maximum 240C Maximum 240C Maximum 2 Times / 230C Maximum 1 Time 10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time 5C/second Maximum N/A Level 1 Temperatures shown are applied to body of device. Low Temperature Manual Soldering 185C Maximum for 10 seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) High Temperature Manual Soldering 260C Maximum for 5 seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) www.ecliptek.com | Specification Subject to Change Without Notice | Revision P 06/13/2012 | Page 8 of 8