1999-10-28
Page 1
BSP318S
Final data
SIPMOS Small-Signal-Transistor
Features
N-Channel
Enhancement mode
Avalanche rated
Logic Level
d
v
/d
t
rated
Product Summary
Drain source voltage V
V
DS 60
Drain-Source on-state resistance
R
DS(on) 0.09
Continuous drain current A
I
D2.6
VPS05163
123
4
Type Package Ordering Code
BSP318S SOT-223 Q67000-S4002
Pin 1 Pin 2, 4 PIN 3
G D S
Maximum Ratings,at
T
j = 25 °C, unless otherwise specified
Parameter Symbol Value Unit
Continuous drain current 2.6 A
I
D
Pulsed drain current
T
A = 25 °C
I
D puls 10.4
Avalanche energy, single pulse
I
D = 2.6 A,
V
DD = 25 V,
R
GS = 25 60 mJ
E
AS
Avalanche current,periodic limited by
T
jmax A
I
AR 2.6
Avalanche energy, periodic limited by
T
jmax 0.18 mJ
E
AR
Reverse diode d
v
/d
t
I
S = 2.6 A,
V
DS = 20 V, d
i
/d
t
= 200 A/µs,
T
jmax = 150 °C
kV/µsd
v
/d
t
6
Gate source voltage ±20 V
V
GS
Power dissipation
T
A = 25 °C W
P
tot 1.8
Operating and storage temperature
T
j ,
T
stg -55... +150 °C
IEC climatic category; DIN IEC 68-1 55/150/56
1999-10-28
Page 2
BSP318S
Final data
Thermal Characteristics
Parameter Symbol UnitValues
typ. max.min.
Characteristics
Thermal resistance, junction - soldering point
(Pin 4) K/W-
R
thJS - 17
SMD version, device on PCB:
@ min. footprint
@ 6 cm2 cooling area 1)
R
thJA
-
-
100
-
-
70
Electrical Characteristics, at
T
j = 25 °C, unless otherwise specified
Parameter ValuesSymbol Unit
max.typ.min.
Static Characteristics
Drain- source breakdown voltage
V
GS = 0 V,
I
D = 0.25 mA
V
(BR)DSS 60 - V-
Gate threshold voltage,
V
GS =
V
DS
I
D = 20 µA 1.2 1.6
V
GS(th) 2
Zero gate voltage drain current
V
DS = 60 V,
V
GS = 0 V,
T
j = 25 °C
V
DS = 60 V,
V
GS = 0 V,
T
j = 150 °C
1
100
0.1
-
µA
I
DSS
-
-
Gate-source leakage current
V
GS = 20 V,
V
DS = 0 V
I
GSS 10 nA100-
R
DS(on) - 0.12Drain-Source on-state resistance
V
GS = 4.5 V,
I
D = 2.6 A 0.15
Drain-Source on-state resistance
V
GS = 10 V,
I
D = 2.6 A
R
DS(on) - 0.07 0.09
1Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm2 (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical without blown air.
1999-10-28
Page 3
BSP318S
Final data
Electrical Characteristics, at
T
j = 25 °C, unless otherwise specified
Parameter Symbol Values Unit
min. typ. max.
Dynamic Characteristics
Transconductance
V
DS2*
I
D*
R
DS(on)max ,
I
D = 2.6 A
g
fs 2.4 S-5.5
Input capacitance
V
GS = 0 V,
V
DS = 25 V,
f
= 1 MHz - 380 pF300
C
iss
Output capacitance
V
GS = 0 V,
V
DS = 25 V,
f
= 1 MHz - 90 120
C
oss
6550-
C
rss
Reverse transfer capacitance
V
GS = 0 V,
V
DS = 25 V,
f
= 1 MHz
Turn-on delay time
V
DD = 30 V,
V
GS = 4.5 V,
I
D = 2.6 A,
R
G = 16
t
d(on) 12 ns20-
Rise time
V
DD = 30 V,
V
GS = 4.5 V,
I
D = 2.6 A,
R
G = 16
t
r- 15 25
20 30
t
d(off)
Turn-off delay time
V
DD = 30 V,
V
GS = 4.5 V,
I
D = 2.6 A,
R
G = 16
-
Fall time
V
DD = 30 V,
V
GS = 4.5 V,
I
D = 2.6 A,
R
G = 16
t
f- 15 25
1999-10-28
Page 4
BSP318S
Final data
Electrical Characteristics, at
T
j = 25 °C, unless otherwise specified
Parameter Symbol Values Unit
min. typ. max.
Dynamic Characteristics
Gate charge at threshold
V
DD = 40 V,
I
D = 0.1 A, V = 1 V -
Q
G(th) nC0.60.4
Gate charge at
V
GS = 5 V
V
DD = 40 V,
I
D = 2.6 A,
V
GS = 0 to 5 V
Q
g(5) 7 10-
20-
Q
g
Gate charge total
V
DD = 40 V,
I
D = 2.6 A,
V
GS = 0 to 10 V 14
Gate plateau voltage
V
DD = 40 V ,
I
D = 2.6 A
V
(plateau) - 3.6 - V
Parameter ValuesSymbol Unit
max.typ.min.
Reverse Diode
A-- 2.6
I
S
Inverse diode continuous forward current
T
A = 25 °C
Inverse diode direct current,pulsed
T
A = 25 °C -
I
SM - 10.4
Inverse diode forward voltage
V
GS = 0 V,
I
F = 5.2 A V1.2
V
SD 0.95-
Reverse recovery time
V
R = 30 V,
I
F=
I
S , d
i
F/d
t
= 100 A/µs - 75 ns50
t
rr
- 0.1 0.15
Q
rr
Reverse recovery charge
V
R = 30 V,
I
F=
l
S , d
i
F/d
t
= 100 A/µs µC
1999-10-28
Page 5
BSP318S
Final data
Power Dissipation
P
tot =
f
(TA)
0 20 40 60 80 100 120 °C 160
TA
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
W
1.9
BSP318S
P
tot
Drain current
I
D =
f
(
T
A)
0 20 40 60 80 100 120 °C 160
TA
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
A
2.8
BSP318S
I
D
Safe operating area
I
D =
f
(
V
DS )
parameter :
D
= 0 ,
T
A = 25 °C
10 -1 10 0 10 1 10 2
V
V
DS
-2
10
-1
10
0
10
1
10
2
10
A
BSP318S
I
D
R
DS(on)
=
V
DS
/
I
D
DC
10 ms
1 ms
t
p = 140.0µs
Transient thermal impedance
Z
thJA =
f
(tp)
parameter :
D =
t
p/
T
10 -5 10 -4 10 -3 10 -2 10 -1 10 0 10 1 10 2 10 4
s
t
p
-2
10
-1
10
0
10
1
10
2
10
K/W
BSP318S
Z
thJA
single pulse 0.01
0.02
0.05
0.10
0.20
D = 0.50
1999-10-28
Page 6
BSP318S
Final data
Typ. output characteristic
I
D = f (
V
DS);
T
j=25°C
parameter:
t
p = 80 µs
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 V5.0
V
DS
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
A
6.5
BSP318S
I
D
V
GS [V]
a
a 2.0
b
b 2.5
cc 3.0
d
d 3.5
e
e 4.0
f
f 4.5
g
g 5.0
h
h 5.5
i
i 6.0
j
j 7.0
k
k 8.0
l
P
tot = 1.80W
l 10.0
Typ. transfer characteristics
I
D=
f
(
V
GS )
V
DS 2 x
I
D x
R
DS(on)max
parameter:
t
p = 80 µs
0 1 2 3 4 5 6 7 8 V10
V
GS
0
1
2
3
4
5
6
7
8
9
10
11
12
A
15
I
D
Drain-source on-resistance
R
DS(on) =
f
(
T
j)
parameter :
I
D = 2.6 A,
V
GS = 4.5 V
-60 -20 20 60 100 °C 180
T
j
0.00
0.04
0.08
0.12
0.16
0.20
0.24
0.28
0.36
BSP318S
R
DS(on)
typ
98%
Gate threshold voltage
V
GS(th) =
f
(
T
j)
parameter:
V
GS =
V
DS,
I
D = 20 µA
-60 -20 20 60 100 140 °C 200
T
j
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
V
3.0
V
GS(th)
min
typ
max
1999-10-28
Page 7
BSP318S
Final data
Typ. capacitances
C = f(VDS)
parameter:
V
GS=0 V,
f
=1 MHz
0 5 10 15 20 25 30 V40
V
DS
1
10
2
10
3
10
pF
C
C
iss
C
oss
C
rss
Forward characteristics of reverse diode
I
F =
f
(VSD)
parameter:
T
j , tp = 80 µs
0.0 0.4 0.8 1.2 1.6 2.0 2.4 V3.0
V
SD
-1
10
0
10
1
10
2
10
A
BSP318S
I
F
T
j = 25 °C typ
T
j = 25 °C (98%)
T
j = 150 °C typ
T
j = 150 °C (98%)
Avalanche Energy
E
AS =
f
(
T
j)
parameter:
I
D = 2.6 A,
V
DD = 25 V
R
GS = 25
20 40 60 80 100 120 °C 160
T
j
0
5
10
15
20
25
30
35
40
45
50
55
mJ
65
E
AS
Typ. gate charge
V
GS =
f
(
Q
Gate)
parameter:
I
D = 2.6 A pulsed
0 4 8 12 16 nC 24
Q
Gate
0
2
4
6
8
10
12
V
16
BSP318S
V
GS
DS max
V
0,8
DS max
V
0,2
1999-10-28
Page 8
BSP318S
Final data
Drain-source breakdown voltage
V
(BR)DSS = f
(
T
j)
-60 -20 20 60 100 °C 180
T
j
54
56
58
60
62
64
66
68
V
72
BSP318S
V
(BR)DSS
1999-10-28
Page 9
BSP318S
Final data
Published by
Infineon Technologies AG,
Bereichs Kommunikation
St.-Martin-Strasse 53,
D-81541 München
© Infineon Technologies AG 1999
All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be considered as warranted
characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement,
regarding circuits, descriptions and charts stated herein.
Infineon Technologies is an approved CECC manufacturer.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list).
Warnings
Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express
written approval of Infineon Technologies, if a failure of such components can reasonably be expected to
cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device
or system Life support devices or systems are intended to be implanted in the human body, or to support
and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health
of the user or other persons may be endangered.