PDTC143ZU,115 - NXP Semiconductors / Philips Semiconductors

DATA SH EET

Product data sheet

Supersedes data of 2004 Apr 06 2004 Aug 16

DISCRETE SEMICONDUCTORS

PDTC143Z series

NPN resistor-equipped transistors;

R1 = 4.7 kΩ, R2 = 47 kΩ

2004 Aug 16 2

NXP Semiconductors Product data sheet

NPN resistor-equipped transistors;

R1 = 4.7 kΩ, R2 = 47 kΩPDTC143Z series

FEATURES

•Built-in bias resistors

•Simplified circuit design

•Reduction of component count

•Reduced pick and place costs.

APPLICATIONS

•General purpose switc hing and amplification

•Inverter and interface c ir cu i ts

•Circuit driver.

QUICK REFERENCE DATA

DESCRIPTION

NPN resistor-equipped tran sistor (see “Simplified outline,

symbol and pinning” for pac kage details).

SYMBOL PARAMETER TYP. MAX. UNIT

VCEO collector-emitter

voltage −50 V

IOoutput curr en t (DC) −100 mA

R1 bias resistor 4.7 −kΩ

R2 bias resistor 47 −kΩ

PRODUCT OVERVIEW

Note

1. * = p: Made in Hong Kong.

* = t: Made in Malaysia.

* = W: Made in China.

TYPE NUMBER PACKAGE MARKING CODE PNP COMPLEMENT

PHILIPS EIAJ

PDTC143ZE SOT416 SC-75 38 PDTA143ZE

PDTC143ZEF SOT490 SC-89 53 PDTA143ZEF

PDTC143ZK SOT346 SC-59 18 PDTA143ZK

PDTC143ZM SOT883 SC-101 E3 PDTA143ZM

PDTC143ZS SOT54 (TO-92) SC-43 TC143Z PDTA143ZS

PDTC143ZT SOT23 −*18(1) PDTA143ZT

PDTC143ZU SOT323 SC-70 *54(1) PDTA143ZU

2004 Aug 16 3

NXP Semiconductors Pr oduct data sheet

NPN resistor-equipped transistors;

R1 = 4.7 kΩ, R2 = 47 kΩPDTC143Z series

SIMPLIFIED OUTLINE, SYMBOL AND PINNING

TYPE NUMBER SIMPLIFIED OUTLINE AND SYMBOL PINNING

PIN DESCRIPTION

PDTC143ZS 1base

2collector

3emitter

PDTC143ZE 1base

PDTC143ZEF 2emitter

PDTC143ZK 3collector

PDTC143ZT

PDTC143ZU

PDTC143ZM 1base

2emitter

3collector

handbook, halfpage

MAM364

handbook, halfpage

MDB269

Top view

handbook, halfpage

MHC506

bottom view

2004 Aug 16 4

NXP Semiconductors Pr oduct data sheet

NPN resistor-equipped transistors;

R1 = 4.7 kΩ, R2 = 47 kΩPDTC143Z series

ORDERING INFORMATION

LIMITING VALUES

In accordance with the A bsolute Maxi mum Rating Sys tem (IEC 60134).

Notes

1. Refer to standard mounting conditions.

2. Reflow soldering is the only recommended soldering method.

3. Refer to SOT883 standard mounting conditions; FR4 with 60 μm copper strip line.

TYPE NUMBER PACKAGE

NAME DESCRIPTION VERSION

PDTC143ZE −plastic surface mounted package; 3 leads SOT416

PDTC143ZEF −plastic surface mounted package; 3 leads SOT490

PDTC143ZK −plastic surface mounted package; 3 leads SOT346

PDTC143ZM −leadless ultr a small plastic package; 3 solder lands; b ody

1.0 × 0.6 × 0.5 mm SOT883

PDTC143ZS −plastic single-e nded leaded (through hole) package; 3 leads SOT54

PDTC143ZT −plastic surface mounted package; 3 leads SOT23

PDTC143ZU −plastic surface mounted package; 3 leads SOT323

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

VCBO collector-base voltage open emitter −50 V

VCEO collector-emitter voltage open base −50 V

VEBO emitter-base voltage open collector −10 V

VIinput voltage

positive −+30 V

negative − −5 V

IOoutput current (DC) −100 mA

ICM peak collector current −100 mA

Ptot total power dissipation Tamb ≤ 25 °C

SOT54 note 1 −500 mW

SOT23 note 1 −250 mW

SOT346 note 1 −250 mW

SOT323 note 1 −200 mW

SOT883 notes 2 and 3 −250 mW

SOT416 note 1 −150 mW

SOT490 notes 1 and 2 −250 mW

Tstg storage temperature −65 +150 °C

Tjjunction temperature −150 °C

Tamb operating ambient

temperature −65 +150 °C

2004 Aug 16 5

NXP Semiconductors Pr oduct data sheet

NPN resistor-equipped transistors;

R1 = 4.7 kΩ, R2 = 47 kΩPDTC143Z series

THERMAL CHARACTE RISTICS

Notes

1. Refer to standard mounting conditions.

2. Reflow soldering is the only recommended soldering method.

3. Refer to SOT883 standard mounting conditions; FR4 with 60 μm copper strip line.

CHARACTERISTICS

Tamb = 25 °C unless otherwise specified.

SYMBOL PARAMETER CONDITIONS VALUE UNIT

Rth(j-a) thermal resistance from junction to ambient in free air

SOT54 note 1 250 K/W

SOT23 note 1 500 K/W

SOT346 note 1 500 K/W

SOT323 note 1 625 K/W

SOT883 notes 2 and 3 500 K/W

SOT416 note 1 833 K/W

SOT490 notes 1 and 2 500 K/W

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

ICBO collector-base cut-off current VCB = 50 V; IE = 0 A −−100 nA

ICEO collector-emitter cut-off current VCE = 30 V; IB = 0 A −−1μA

VCE = 30 V; IB = 0 A; Tj = 150 °C−−50 μA

IEBO emitter-base cu t-off current VEB = 5 V; IC = 0 A −−170 μA

hFE DC current gain VCE = 5 V; IC = 10 mA 100 − −

VCEsat collector-emitter saturation voltage IC = 5 mA; IB = 0.25 mA −−100 mV

Vi(off) input-off voltage IC = 100 μA; VCE = 5 V −0.6 0.5 V

Vi(on) input-on voltage IC = 5 mA; VCE = 0.3 V 1.3 0.9 −V

R1 input resistor 3.3 4.7 6.1 kΩ

resistor ratio 810 12

Cccollector capacitance IE = ie = 0 A; VCB = 10 V;

f = 1 MHz −−2.5 pF

--------

2004 Aug 16 6

NXP Semiconductors Pr oduct data sheet

NPN resistor-equipped transistors;

R1 = 4.7 kΩ, R2 = 47 kΩPDTC143Z series

PACKAGE OUTLINES

UNIT A

cDE e

Qwv

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

mm 0.50

0.35 0.26

0.10 3.1

2.7 1.7

1.3 0.95

1.9 3.0

2.5 0.33

0.23 0.2

0.2

DIMENSIONS (mm are the original dimensions)

0.6

0.2

SOT346 TO-236 SC-59A

detail X

0 1 2 mm

scale

1.3

1.0 0.1

0.013

Plastic surface-mounted package; 3 leads SOT34

04-11-11

06-03-16

2004 Aug 16 7

NXP Semiconductors Pr oduct data sheet

NPN resistor-equipped transistors;

R1 = 4.7 kΩ, R2 = 47 kΩPDTC143Z series

UNIT A1

max.

A(1) bb

1e1

eLL

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

mm 0.50

0.46 0.20

0.12 0.55

0.47

0.03 0.62

0.55 0.35 0.65

DIMENSIONS (mm are the original dimensions)

Note

1. Including plating thickness

0.30

0.22

0.30

0.22

SOT883 SC-101 03-02-05

03-04-03

1.02

0.95

0 0.5 1 mm

scale

eadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.5 mm SOT88

2004 Aug 16 8

NXP Semiconductors Pr oduct data sheet

NPN resistor-equipped transistors;

R1 = 4.7 kΩ, R2 = 47 kΩPDTC143Z series

UNIT A

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

mm 5.2

5.0

0.48

0.40

0.45

0.38

4.8

4.4

1.7

1.4

4.2

3.6

14.5

12.7

2.54

1.27

L1(1)

max.

2.5

0.66

0.55

DIMENSIONS (mm are the original dimensions)

Note

1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities.

SOT54 TO-92 SC-43A 04-06-28

04-11-16

A L

0 2.5 5 mm

scale

b1L1

Plastic single-ended leaded (through hole) package; 3 leads SOT5

e1e

2004 Aug 16 9

NXP Semiconductors Pr oduct data sheet

NPN resistor-equipped transistors;

R1 = 4.7 kΩ, R2 = 47 kΩPDTC143Z series

UNIT A

max. b

cDE e

Qwv

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

04-11-04

06-03-16

IEC JEDEC JEITA

mm 0.1 0.48

0.38 0.15

0.09 3.0

2.8 1.4

1.2 0.95

1.9 2.5

2.1 0.55

0.45 0.1

0.2

DIMENSIONS (mm are the original dimensions)

0.45

0.15

SOT23 TO-236AB

detail X

0 1 2 mm

scale

1.1

0.9

Plastic surface-mounted package; 3 leads SOT2

2004 Aug 16 10

NXP Semiconductors Pr oduct data sheet

NPN resistor-equipped transistors;

R1 = 4.7 kΩ, R2 = 47 kΩPDTC143Z series

UNIT A1

max bpcD Ee1HELpQwv

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

mm 0.1

1.1

0.8 0.4

0.3 0.25

0.10 2.2

1.8 1.35

1.15 0.65

1.3 2.2

2.0 0.23

0.13 0.20.2

DIMENSIONS (mm are the original dimensions)

0.45

0.15

SOT323 SC-70

detail X

vMA

0 1 2 mm

scale

Plastic surface-mounted package; 3 leads SOT32

04-11-04

06-03-16

2004 Aug 16 11

NXP Semiconductors Pr oduct data sheet

NPN resistor-equipped transistors;

R1 = 4.7 kΩ, R2 = 47 kΩPDTC143Z series

UNIT A1

max bpcDEe1HELpQw

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

mm 0.1 0.30

0.15 0.25

0.10 1.8

1.4 0.9

0.7 0.5

11.75

1.45 0.2

0.2

DIMENSIONS (mm are the original dimensions)

0.45

0.15 0.23

0.13

SOT416 SC-75

detail X

EAB

vMA

0 0.5 1 mm

scale

0.95

0.60

Plastic surface-mounted package; 3 leads SOT41

04-11-04

06-03-16

2004 Aug 16 12

NXP Semiconductors Pr oduct data sheet

NPN resistor-equipped transistors;

R1 = 4.7 kΩ, R2 = 47 kΩPDTC143Z series

UNIT bpcDE e1HELpwv

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

05-07-28

06-03-16

IEC JEDEC JEITA

mm 0.33

0.23 0.2

0.1 1.7

1.5 0.95

0.75 0.5

1.0 1.7

1.5 0.1

0.1

DIMENSIONS (mm are the original dimensions)

0.5

0.3

SOT490 SC-89

detail X

vMA

0 1 2 mm

scale

0.8

0.6

Plastic surface-mounted package; 3 leads SOT49

2004 Aug 16 13

NXP Semiconductors Pr oduct data sheet

NPN resistor-equipped transistors;

R1 = 4.7 kΩ, R2 = 47 kΩPDTC143Z series

DATA SHEET STATUS

Notes

1. Please consult the most recently issued document before initiating or completing a design.

2. The product s ta tus of device(s) described in this document may have changed since this docu ment was published

and may differ in case of multiple devices. The latest product status information is available on the Internet at

URL http://www.nxp.com.

DOCUMENT

STATUS(1) PRODUCT

STATUS(2) DEFINITION

Objective data sheet Development This document contains data from the objective specification for pro duct

development.

Preliminary data sheet Qualification This document contains data from the preliminary specification.

Product data sheet Production T his document contains the product specification.

DISCLAIMERS

General ⎯ Information in this document is believed to be

accurate and reliable . H ow ev er, NXP Semiconductors

does not give any representations or warranties,

expressed or implied, as to the accuracy or completeness

of such information and shall have no liability for the

consequenc es of use of such information.

Right to make changes ⎯ NXP Semiconductors

reserves the right to make changes to informa tion

published in this doc ument, including without limitation

specifications and product descriptions, at any time and

without notice. This document supersedes and replaces all

information supplied prior to the publication hereo f.

Suitability for use ⎯ NXP Semiconductors products are

not designed, au thorized or warran ted to be suitable for

use in medical, military, aircraft, space or life support

equipment, nor in applications where failure or malfunction

of an NXP Semiconductors product can reason ably be

expected to result in pe rs onal injury, death or severe

property or environmental damage. NXP Semiconductors

accepts no liability for inclusion and/or use of NXP

Semiconductors products in such equipment or

applications and therefor e s uc h inclusion and/or use is at

the customer’s own risk .

Applications ⎯ Applications that are described herein for

any of these products are for illustrative purposes only.

NXP Semiconductors makes no representation or

warranty that such applications will be suitable for the

specified use witho ut fu rth e r testing or modificati on .

Limiting values ⎯ Stress above one or more limiting

values (as defined in the Absolute Maximum Ratings

System of IEC 60134) may cause permanent damage to

the device. Limiting values are stress ratin gs only and

operation of the device at these or any other conditions

above those given in the Characteristics sections of this

document is not implied. Exposure to limiting values for

extended periods may affect device reliability.

Terms and conditions of sale ⎯ NXP Semiconductors

products are sold subject to the general terms and

conditions of commercial sale, as published at

http://www.nxp.com/profile/terms, including those

pertaining to warranty, intellectual property rights

infringement and limitation of liability, unless explicitly

otherwise agreed to in writing by NXP Semiconductors. In

case of any incons istency or conflict between information

in this document an d such terms and conditio ns, the latter

will prevail.

No offer to sell or license ⎯ Nothing in this document

may be interpreted or construed as an offer to sell products

that is open for accept ance or the grant, conveyance or

implication of any license under any copyrights, patents or

other industr i al or inte llectual property rights.

Export control ⎯ This document as well as the item(s)

described herein may be subject to export control

regulations. Export might require a prior authorization from

national author ities.

Quick refer ence data ⎯ The Quick reference data is an

extract of th e product data given in the Limiting values and

Characteristics sections of this document, and as such is

not complete, exhaus tive or legally binding.

NXP Semiconductors

Contact information

For additional information p lease visit: http://www.nxp.com

For sales offices addresses send e-mail to: salesaddresses@nxp.com

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information pr e sent ed in this document does not form p art o f an y quotation or contract, is believed to b e a ccur ate a nd re li a ble and may be change d

without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license

under patent- or other ind us trial or intellectual property rights .

Customer notification

This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal

definitions and disclaimer s. No changes were made to the technical content, except for package outline

drawings which were updated to the la test version.

Printed in The Netherlands R75/07/pp14 Date of release: 2004 Aug 16 Document orde r number: 9397 750 13677