SK82C - SK810C
Taiwan Semiconductor
1 Version:K1903
8A, 20V - 100V Surface Mount Schottky Barrier Rectifier
FEATURES
Low power loss, high efficiency
Ideal for automated placement
Guard ring for over-voltage protection
High surge current capability
Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
Halogen-free according to IEC 61249-2-21
APPLICATIONS
Switching mode power supply (SMPS)
Adapters
Lighting application
Converter
MECHANICAL DATA
Case: DO-214AB (SMC)
Molding compound meets UL 94V-0 flammability rating
Part no. with suffix "H" means AEC-Q101 qualified
Packing code with suffix "G" means green compound
(halogen-free)
Moisture sensitivity level: level 1, per J-STD-020
Terminal: Matte tin plated leads, solderable per J-STD-002
Meet JESD 201 class 2 whisker test
Polarity: As marked
Weight: 0.21 g (approximately)
KEY PARAMETERS
PARAMETER
VALUE
UNIT
IF(AV)
8
A
VRRM
20 - 100
V
IFSM
150
A
Package
DO-214AB (SMC)
Configuration
Single die
DO-214AB (SMC)
PARAMETER
SYMBOL
SK
82C
SK
83C
SK
84C
SK
85C
SK
86C
SK
810C
UNIT
Marking code on the device
SK
82C
SK
83C
SK
84C
SK
85C
SK
86C
SK
810C
Repetitive peak reverse voltage
VRRM
20
30
40
50
60
100
V
Reverse voltage, total rms value
VR(RMS)
14
21
28
35
42
70
V
Maximum DC blocking voltage
VDC
20
30
40
50
60
100
V
Forward current
IF(AV)
8
A
Surge peak forward current, 8.3
ms single half sine-wave
superimposed on rated load per
diode
IFSM
150
A
Critical rate of rise of off-state
voltage
dV/dt
10,000
V/μs
Junction temperature
TJ
- 55 to +125
- 55 to +150
°C
Storage temperature
TSTG
- 55 to +150
°C
SK82C - SK810C
Taiwan Semiconductor
2 Version:K1903
PARAMETER
SYMBOL
TYP
UNIT
Junction-to-ambient thermal resistance per diode
RӨJA
20
°C/W
PARAMETER
CONDITIONS
SYMBOL
TYP.
MAX.
UNIT
Forward voltage per diode (1)
SK82C
SK83C
SK84C
IF = 8A, TJ = 25°C
VF
-
0.55
V
SK85C
SK86C
-
0.75
V
SK810C
-
0.90
V
Reverse current @ rated VR per diode (2)
TJ = 25°C
IR
-
0.5
mA
Reverse current @ rated VR
per diode (2)
SK82C
SK83C
SK84C
TJ = 100°C
IR
-
15
mA
SK85C
SK86C
SK810C
-
10
mA
Notes:
1. Pulse test with PW=0.3 ms
2. Pulse test with PW=30 ms
SK82C - SK810C
Taiwan Semiconductor
3 Version:K1903
PART NO.
PART NO.
SUFFIX
PACKING
CODE
PACKING
CODE
SUFFIX
PACKAGE
PACKING
SK8xxC
(Note 1,2)
H
R7
G
SMC
850 / 7" Plastic reel
R6
SMC
3,000 / 13" Paper reel
M6
SMC
3,000 / 13" Plastic reel
V7
Matrix SMC
850 / 7" Plastic reel
V6
Matrix SMC
3,000 / 13" Plastic reel
Note :
1. "xx" defines voltage from 20V (SK82C) to 100V (SK810C)
2. Only V6 and V7 are all green compound (halogen free)
EXAMPLE P/N
PART NO.
PART NO.
SUFFIX
PACKING
CODE
PACKING CODE
SUFFIX
DESCRIPTION
SK82CHR7G
SK82C
H
R7
G
AEC-Q101 qualified
Green compound
SK82C - SK810C
Taiwan Semiconductor
4 Version:K1903
CHARACTERISTICS CURVES
(TA = 25°C unless otherwise noted)
Fig.1 Forward Current Derating Curve
Fig.2 Typical Junction Capacitance
Fig.3 Typical Reverse Characteristics
Fig.4 Typical Forward Characteristics
0
2
4
6
8
10
025 50 75 100 125 150
LEAD TEMPERATURE (°C)
RESISTIVEOR
INDUCTIVE LOAD
SK85C - SK810C
SK82C- SK84C
10
100
1000
0.1 1 10 100
JUNCTION CAPACITSUCE (pF)
f=1.0MHZ
Vsig=50mvp-p
SK82C - SK84C
SK85C - SK86C
SK810C
0.0001
0.001
0.01
0.1
1
10
100
020 40 60 80 100 120 140
SK82C - SK84C
SK85C - SK810C
TJ=25°C
TJ=75°C
TJ=125°C
0.1
1
10
100
0 0.2 0.4 0.6 0.8 1 1.2
SK82C - SK84C
SK85C - SK86C
Pulse width 300μs
1% duty cycle
SK810C
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
INSTANTANEOUS FORWARD CURRENT (A)
(A)
0.001
0.01
0.1
1
10
0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2
Pulse width
TJ=25°C
TJ=125°C
UF1DLW
FORWARD VOLTAGE (V)
REVERSE VOLTAGE (V)
AVERAGE FORWARD CURRENT (A)
INSTANTANEOUS REVERSE CURRENT (mA)
SK82C - SK810C
Taiwan Semiconductor
5 Version:K1903
CHARACTERISTICS CURVES
(TA = 25°C unless otherwise noted)
Fig.5 Maximum Non-repetitive Forward Surge Current Fig.6 Typical Transient Thermal Characteristics
TRANSIENT THERMAL IMPEDANCE(/ W)
PEAK FORWARD SURGE CURRENT (A)
0.1
1
10
100
0.01 0.1 1 10 100
PULSE DURATION. (sec)
60
120
180
240
110 100
NUMBER OF CYCLES AT 60 HZ
8.3ms Single Half Sine Wave
SK82C - SK810C
Taiwan Semiconductor
6 Version:K1903
PACKAGE OUTLINE DIMENSIONS
DO-214AB (SMC)
DIM.
Unit (mm)
Unit (inch)
Min.
Max.
Min.
Max.
A
2.90
3.20
0.114
0.126
B
6.60
7.11
0.260
0.280
C
5.59
6.22
0.220
0.245
D
2.00
2.62
0.079
0.103
E
1.00
1.60
0.039
0.063
F
7.75
8.13
0.305
0.320
G
0.10
0.20
0.004
0.008
H
0.15
0.31
0.006
0.012
SUGGESTED PAD LAYOUT
MARKING DIAGRAM
Matrix SMC SMC
Symbol
Unit (mm)
Unit (inch)
A
3.30
0.130
B
2.50
0.098
C
6.80
0.268
D
4.40
0.173
E
9.40
0.370
P/N
=Marking Code
G
=Green Compound
YW
=Date Code
F
=Factory Code
SK82C - SK810C
Taiwan Semiconductor
7 Version:K1903
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, to
any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.