MIC4421/4422 Micrel, Inc. MIC4421/4422 9A-Peak Low-Side MOSFET Driver Bipolar/CMOS/DMOS Process General Description Features MIC4421 and MIC4422 MOSFET drivers are rugged, efficient, and easy to use. The MIC4421 is an inverting driver, while the MIC4422 is a non-inverting driver. * BiCMOS/DMOS Construction * Latch-Up Proof: Fully Isolated Process is Inherently Immune to Any Latch-up. * Input Will Withstand Negative Swing of Up to 5V * Matched Rise and Fall Times ............................... 25ns * High Peak Output Current ...............................9A Peak * Wide Operating Range .............................. 4.5V to 18V * High Capacitive Load Drive ........................... 47,000pF * Low Delay Time .............................................30ns Typ. * Logic High Input for Any Voltage from 2.4V to VS * Low Equivalent Input Capacitance (typ) ................. 7pF * Low Supply Current .............. 450A With Logic 1 Input * Low Output Impedance .........................................1.5 * Output Voltage Swing to Within 25mV of GND or VS Both versions are capable of 9A (peak) output and can drive the largest MOSFETs with an improved safe operating margin. The MIC4421/4422 accepts any logic input from 2.4V to VS without external speed-up capacitors or resistor networks. Proprietary circuits allow the input to swing negative by as much as 5V without damaging the part. Additional circuits protect against damage from electrostatic discharge. MIC4421/4422 drivers can replace three or more discrete components, reducing PCB area requirements, simplifying product design, and reducing assembly cost. Applications Modern Bipolar/CMOS/DMOS construction guarantees freedom from latch-up. The rail-to-rail swing capability of CMOS/DMOS insures adequate gate voltage to the MOSFET during power up/down sequencing. Since these devices are fabricated on a self-aligned process, they have very low crossover current, run cool, use little power, and are easy to drive. * * * * * * * * Switch Mode Power Supplies Motor Controls Pulse Transformer Driver Class-D Switching Amplifiers Line Drivers Driving MOSFET or IGBT Parallel Chip Modules Local Power ON/OFF Switch Pulse Generators Functional Diagram VS 0.1mA MIC4421 IN V E R T I N G 0.3mA OUT IN 2k MIC4422 NONINVERTING GND Micrel, Inc. * 2180 Fortune Drive * San Jose, CA 95131 * USA * tel + 1 (408) 944-0800 * fax + 1 (408) 474-1000 * http://www.micrel.com August 2005 1 M9999-081005 MIC4421/4422 Micrel, Inc. Ordering Information Part Number Standard PbFree MIC4421BM MIC4421YM MIC4421BN MIC4421YN MIC4421CM MIC4421ZM MIC4421CN MIC4421ZN MIC4421CT MIC4421ZT MIC4422BM MIC4422YM MIC4422BN MIC4422YN MIC4422CM MIC4422ZM MIC4422CN MIC4422ZN MIC4422CT MIC4422ZT Configuration Inverting Inverting Inverting Inverting Inverting Non-inverting Non-inverting Non-inverting Non-inverting Non-inverting Temp. Range -40C to +85C -40C to +85C -0C to +70C -0C to +70C -0C to +70C -40C to +85C -40C to +85C -0C to +70C -0C to +70C -0C to +70C Package 8-pin SOIC 8-pin DIP 8-pin SOIC 8-pin DIP 5-pin TO-220 8-pin SOIC 8-pin DIP 8-pin SOIC 8-pin DIP 5-pin TO-220 Pin Configurations 8 VS VS 1 IN 2 7 OUT NC 3 6 OUT GND 4 5 GND Plastic DIP (N) SOIC (M) 5 4 3 2 1 OUT GND VS GND IN TO-220-5 (T) Pin Description Pin Number TO-220-5 Pin Number DIP, SOIC Pin Name 1 2 IN 2, 4 4, 5 GND 3, TAB 1, 8 VS 5 6, 7 OUT 3 NC M9999-081005 Pin Function Control Input Ground: Duplicate pins must be externally connected together. Supply Input: Duplicate pins must be externally connected together. Output: Duplicate pins must be externally connected together. Not connected. 2 August 2005 MIC4421/4422 Micrel, Inc. Absolute Maximum Ratings Operating Ratings (Notes 1, 2 and 3) Supply Voltage .............................................................. 20V Input Voltage ...................................VS + 0.3V to GND - 5V Input Current (VIN > VS) .............................................. 50 mA Power Dissipation, TA 25C PDIP .................................................................... 960mW SOIC .................................................................. 1040mW 5-Pin TO-220 .............................................................. 2W Power Dissipation, TCASE 25C 5-Pin TO-220 ......................................................... 12.5W Derating Factors (to Ambient) PDIP ................................................................ 7.7mW/C SOIC ................................................................ 8.3mW/C 5-Pin TO-220 .................................................... 17mW/C Storage Temperature ................................ -65C to +150C Lead Temperature (10 sec) ....................................... 300C Electrical Characteristics: Symbol Junction Temperature ................................................ 150C Ambient Temperature C Version .................................................... 0C to +70C B Version ................................................ -40C to +85C Thermal Resistance 5-Pin TO-220 (JC) ............................................... 10C/W (TA = 25C with 4.5 V VS 18 V unless otherwise specified.) Parameter Conditions Min Typ 2.4 1.3 Max Units INPUT VIH Logic 1 Input Voltage VIL Logic 0 Input Voltage VIN Input Voltage Range IIN Input Current 1.1 V 0.8 V -5 VS+0.3 V 0 V VIN VS -10 10 A VS-.025 OUTPUT VOH High Output Voltage See Figure 1 VOL Low Output Voltage See Figure 1 RO Output Resistance, Output High IOUT = 10 mA, VS = 18 V 0.6 RO Output Resistance, Output Low IOUT = 10 mA, VS = 18 V 0.8 IPK Peak Output Current VS = 18 V (See Figure 6) 9 IDC Continuous Output Current IR Latch-Up Protection Withstand Reverse Current Duty Cycle 2% t 300 s V 0.025 V 1.7 A 2 A >1500 mA SWITCHING TIME (Note 3) tR Rise Time Test Figure 1, CL = 10,000 pF 20 75 ns tF Fall Time Test Figure 1, CL = 10,000 pF 24 75 ns tD1 Delay Time Test Figure 1 15 60 ns tD2 Delay Time Test Figure 1 35 60 ns VIN = 3 V VIN = 0 V 0.4 80 1.5 150 mA A 18 V POWER SUPPLY IS Power Supply Current VS Operating Input Voltage August 2005 4.5 3 M9999-081005 MIC4421/4422 Micrel, Inc. Electrical Characteristics: Symbol (Over operating temperature range with 4.5V VS 18V unless otherwise specified.) Parameter Conditions Min Typ 2.4 1.4 Max Units INPUT VIH Logic 1 Input Voltage VIL Logic 0 Input Voltage V 1.0 0.8 V VIN Input Voltage Range IIN Input Current 0V VIN VS -5 VS+0.3 V -10 10 A VOH High Output Voltage Figure 1 VOL Low Output Voltage Figure 1 0.025 V RO Output Resistance, Output High IOUT = 10mA, VS = 18V 0.8 3.6 RO Output Resistance, Output Low IOUT = 10mA, VS = 18V 1.3 2.7 OUTPUT VS-.025 V SWITCHING TIME (Note 3) tR Rise Time Figure 1, CL = 10,000pF 23 120 ns tF Fall Time Figure 1, CL = 10,000pF 30 120 ns tD1 Delay Time Figure 1 20 80 ns tD2 Delay Time Figure 1 40 80 ns VIN = 3V VIN = 0V 0.6 0.1 3 0.2 mA 18 V POWER SUPPLY IS Power Supply Current VS Operating Input Voltage Note 1: Note 2: 4.5 Functional operation above the absolute maximum stress ratings is not implied. Static-sensitive device. Store only in conductive containers. Handling personnel and equipment should be grounded to prevent damage from static discharge. Switching times guaranteed by design. Note 3: Test Circuits VS = 18V VS = 18V 0.1F 0.1F IN OUT 15000pF MIC4421 INPUT 5V 90% tD1 tP W tF tD2 0.1F 0.1F IN OUT 15000pF MIC4422 2.5V tP W 0.5s 10% 0V VS 90% 4.7F INPUT tR 5V 90% 2.5V tP W 0.5s 10% 0V VS 90% 4.7F tD1 tP W tR tD2 tF O U TPU T O U TPU T 10% 0V 10% 0V Figure 2. Noninverting Driver Switching Time Figure 1. Inverting Driver Switching Time M9999-081005 4 August 2005 MIC4421/4422 Micrel, Inc. 0 10k August 2005 100k 1M FREQUENCY (Hz) 10M TIME (ns) 100 60 pF 80 40 20 0 10k 100k 1M FREQUENCY (Hz) 5 10M 16 18 Supply Current vs. Capacitive Load VS = 5V 100 kH z 50 0k H Hz 1M 15 20 30 z 45 60 VS = 12V 8 10 12 14 VOLTAGE (V) 1000 10k CAPACITIVE LOAD (pF) 100k Supply Current vs. Frequency VS = 5V 50 40 30 1000 pF Supply Current vs. Frequency 6 60 0 100k 4 F z 1000 10k CAPACITIVE LOAD (pF) Crossover Energy vs. Supply Voltage 0.01 100 0k H 30 SUPPLY CURRENT (mA) 20 Hz 1M 0 40 80 120 TEMPERATURE (C) 10-8 75 VS = 12V 20 50 F 60 40 Supply Current vs. Capacitive Load 60 -40 PER TRANSITION 10-9 100k F kH z z H 1000 p 80 0.01 0.1 F 120 F 140 1000 10k CAPACITIVE LOAD (pF) 90 120 VS = 18V 100 120 0 100k Supply Current vs. Frequency 100 18V 1000 160 Hz 1M 1000 10k CAPACITIVE LOAD (pF) 10V 0.01 180 150 VS = 18V 100 150 0 100k tRISE 10-7 5V 50 Supply Current vs. Capacitive Load 20 0k 220 200 180 160 140 120 100 80 60 40 20 0 Fall Time vs. Capacitive Load 100 20 0 18 kH z 18V 1000 10k CAPACITIVE LOAD (pF) 6 8 10 12 14 16 SUPPLY VOLTAGE (V) 200 30 10 50 10V 100 4 F RISE TIME (ns) 5V 150 0 10,000pF 250 200 100 300 22,000pF tFALL 40 F Rise Time vs. Capacitive Load 50 SUPPLY CURRENT (mA) 18 47,000pF 0.1 6 8 10 12 14 16 SUPPLY VOLTAGE (V) CL = 10,000pF VS = 18V 50 0.1 4 Rise and Fall Times vs. Temperature 60 CROSSOVER ENERGY (A*s) 10,000pF 220 200 180 160 140 120 100 80 60 40 20 0 Fall Time vs. Supply Voltage SUPPLY CURRENT (mA) 22,000pF 250 SUPPLY CURRENT (mA) FALL TIME (ns) 47,000pF FALL TIME (ns) 300 Rise Time vs. Supply Voltage SUPPLY CURRENT (mA) 220 200 180 160 140 120 100 80 60 40 20 0 SUPPLY CURRENT (mA) RISE TIME (ns) Typical Characteristics 20 10 0 10k 100k 1M FREQUENCY (Hz) 10M M9999-081005 MIC4421/4422 Micrel, Inc. Typical Characteristics 20 tD1 10 QUIESCENT SUPPLY CURRENT (A) 0 4 6 8 10 12 14 16 SUPPLY VOLTAGE (V) 18 Quiescent Supply Current vs. Temperature 1000 VS = 18V INPUT = 1 100 INPUT = 0 10 -40 0 40 80 TEMPERATURE (C) M9999-081005 120 Propagation Delay vs. Input Amplitude 50 40 30 tD2 20 tD2 tD1 10 0 2 4 6 INPUT (V) tD1 8 TJ = 150C TJ = 25C 4 6 8 10 12 14 16 SUPPLY VOLTAGE (V) 6 0 10 High-State Output Resist. vs. Supply Voltage 2.4 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 Propagation Delay vs. Temperature VS = 10V TIME (ns) 30 TIME (ns) tD2 HIGH-STATE OUTPUT RESISTANCE () TIME (ns) 40 120 110 100 90 80 70 60 50 40 30 20 10 0 18 LOW-STATE OUTPUT RESISTANCE () Propagation Delay vs. Supply Voltage 50 -40 0 40 80 120 TEMPERATURE (C) Low-State Output Resist. vs. Supply Voltage 2.4 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 TJ = 150C TJ = 25C 4 6 8 10 12 14 16 SUPPLY VOLTAGE (V) 18 August 2005 MIC4421/4422 Micrel, Inc. Applications Information To guarantee low supply impedance over a wide frequency range, a parallel capacitor combination is recommended for supply bypassing. Low inductance ceramic disk capacitors with short lead lengths (< 0.5 inch) should be used. A 1F low ESR film capacitor in parallel with two 0.1F low ESR ceramic capacitors, (such as AVX RAM Guard(R)), provides adequate bypassing. Connect one ceramic capacitor directly between pins 1 and 4. Connect the second ceramic capacitor directly between pins 8 and 5. Supply Bypassing Charging and discharging large capacitive loads quickly requires large currents. For example, charging a 10,000pF load to 18V in 50ns requires 3.6A. The MIC4421/4422 has double bonding on the supply pins, the ground pins and output pins. This reduces parasitic lead inductance. Low inductance enables large currents to be switched rapidly. It also reduces internal ringing that can cause voltage breakdown when the driver is operated at or near the maximum rated voltage. Grounding The high current capability of the MIC4421/4422 demands careful PC board layout for best performance. Since the MIC4421 is an inverting driver, any ground lead impedance will appear as negative feedback which can degrade switching speed. Feedback is especially noticeable with slow-rise time inputs. The MIC4421 input structure includes about 200mV of hysteresis to ensure clean transitions and freedom from oscillation, but attention to layout is still recommended. Internal ringing can also cause output oscillation due to feedback. This feedback is added to the input signal since it is referenced to the same ground. VS Figure 5 shows the feedback effect in detail. As the MIC4421 input begins to go positive, the output goes negative and several amperes of current flow in the ground lead. As little as 0.05 of PC trace resistance can produce hundreds of millivolts at the MIC4421 ground pins. If the driving logic is referenced to power ground, the effective logic input level is reduced and oscillation may result. 1F VS MIC4451 O2 O1 DRIV E S IGNA L DRIVE L OGIC CONDUCTION ANGLE CONT ROL 0 TO 180 O1 CONDUCTION ANGLE CONTROL 180 TO 360 M O3 To insure optimum performance, separate ground traces should be provided for the logic and power connections. Connecting the logic ground directly to the MIC4421 GND pins will ensure full logic drive to the input and ensure fast output switching. Both of the MIC4421 GND pins should, however, still be connected to power ground. VS VS 1F MIC4452 PHASE 1 of 3 PHASE MOTOR DRIVER USING MIC4420/4429 Figure 3. Direct Motor Drive +15 (x2) 1N4448 5.6 k OUTPUT VOLTAGE vs LOAD CURRENT 30 560 0.1F 50V + 1 2 0.1F WIMA MKS2 8 MIC4421 4 5 1F 50V MKS2 6, 7 VOLTS 29 BYV 10 (x 2) 28 12 LINE 27 26 + 25 + 560F 50V 100F 50V UNIT E D CHE MCON S X E 0 50 100 150 200 250 300 350 mA Figure 4. Self Contained Voltage Doubler August 2005 7 M9999-081005 MIC4421/4422 Micrel, Inc. Input Stage dissipation limit can easily be exceeded. Therefore, some attention should be given to power dissipation when driving low impedance loads and/or operating at high frequency. The input voltage level of the MIC4421 changes the quiescent supply current. The N channel MOSFET input stage transistor drives a 320A current source load. With a logic "1" input, the maximum quiescent supply current is 400A. Logic "0" input level signals reduce quiescent current to 80A typical. The supply current vs. frequency and supply current vs capacitive load characteristic curves aid in determining power dissipation calculations. Table 1 lists the maximum safe operating frequency for several power supply voltages when driving a 10,000pF load. More accurate power dissipation figures can be obtained by summing the three dissipation sources. The MIC4421/4422 input is designed to provide 300mV of hysteresis. This provides clean transitions, reduces noise sensitivity, and minimizes output stage current spiking when changing states. Input voltage threshold level is approximately 1.5V, making the device TTL compatible over the full temperature and operating supply voltage ranges. Input current is less than 10A. Given the power dissipation in the device, and the thermal resistance of the package, junction operating temperature for any ambient is easy to calculate. For example, the thermal resistance of the 8-pin plastic DIP package, from the data sheet, is 130C/W. In a 25C ambient, then, using a maximum junction temperature of 150C, this package will dissipate 960mW. The MIC4421 can be directly driven by the TL494, SG1526/1527, SG1524, TSC170, MIC38C42, and similar switch mode power supply integrated circuits. By offloading the power-driving duties to the MIC4421/4422, the power supply controller can operate at lower dissipation. This can improve performance and reliability. Accurate power dissipation numbers can be obtained by summing the three sources of power dissipation in the device: The input can be greater than the VS supply, however, current will flow into the input lead. The input currents can be as high as 30mA p-p (6.4mARMS) with the input. No damage will occur to MIC4421/4422 however, and it will not latch. * Load Power Dissipation (PL) * Quiescent power dissipation (PQ) * Transition power dissipation (PT) Calculation of load power dissipation differs depending on whether the load is capacitive, resistive or inductive. The input appears as a 7pF capacitance and does not change even if the input is driven from an AC source. While the device will operate and no damage will occur up to 25V below the negative rail, input current will increase up to 1mA/V due to the clamping action of the input, ESD diode, and 1k resistor. Resistive Load Power Dissipation Dissipation caused by a resistive load can be calculated as: PL = I2 RO D Power Dissipation where: CMOS circuits usually permit the user to ignore power dissipation. Logic families such as 4000 and 74C have outputs which can only supply a few milliamperes of current, and even shorting outputs to ground will not force enough current to destroy the device. The MIC4421/4422 on the other hand, can source or sink several amperes and drive large capacitive loads at high frequency. The package power I= RO = D= the current drawn by the load the output resistance of the driver when the output is high, at the power supply voltage used. (See data sheet) fraction of time the load is conducting (duty cycle) +18 WIMA MKS-2 1 F 5.0V 1 8 MIC4421 0V 5 0.1F 0.1F 4 LOGIC GROUND Table 1: MIC4421 Maximum Operating Frequency VS Max Frequency 18V 220kHz 15V 300kHz 10V 640kHz 5V 2MHz 0V 2,500 pF POLYCARBONATE 6 AMPS 300 mV POWE R GROUND 6, 7 18 V TEK CURRENT PROBE 6302 PC TRACE RESISTANCE = 0.05 Conditions: Figure 5. Switching Time Degradation Due to Negative Feedback M9999-081005 8 1. JA = 150C/W 2. TA = 25C 3. CL = 10,000pF August 2005 MIC4421/4422 Micrel, Inc. Capacitive Load Power Dissipation Transition Power Dissipation Dissipation caused by a capacitive load is simply the energy placed in, or removed from, the load capacitance by the driver. The energy stored in a capacitor is described by the equation: Transition power is dissipated in the driver each time its output changes state, because during the transition, for a very brief interval, both the N- and P-channel MOSFETs in the output totem-pole are ON simultaneously, and a current is conducted through them from VS to ground. The transition power dissipation is approximately: E = 1/2 C V2 As this energy is lost in the driver each time the load is charged or discharged, for power dissipation calculations the 1/2 is removed. This equation also shows that it is good practice not to place more voltage in the capacitor than is necessary, as dissipation increases as the square of the voltage applied to the capacitor. For a driver with a capacitive load: PT = 2 f VS (A*s) where (A*s) is a time-current factor derived from the typical characteristic curve "Crossover Energy vs. Supply Voltage." Total power (PD) then, as previously described is just PL = f C (VS)2 PD = PL + PQ + PT where: Definitions f = Operating Frequency C = Load Capacitance VS =Driver Supply Voltage CL = Load Capacitance in Farads. D = Duty Cycle expressed as the fraction of time the input to the driver is high. Inductive Load Power Dissipation f = Operating Frequency of the driver in Hertz For inductive loads the situation is more complicated. For the part of the cycle in which the driver is actively forcing current into the inductor, the situation is the same as it is in the resistive case: IH = Power supply current drawn by a driver when both inputs are high and neither output is loaded. IL = Power supply current drawn by a driver when both inputs are low and neither output is loaded. PL1 = I2 RO D However, in this instance the RO required may be either the on resistance of the driver when its output is in the high state, or its on resistance when the driver is in the low state, depending on how the inductor is connected, and this is still only half the story. For the part of the cycle when the inductor is forcing current through the driver, dissipation is best described as ID = Output current from a driver in Amps. PD = Total power dissipated in a driver in Watts. PL = Power dissipated in the driver due to the driver's load in Watts. PQ = Power dissipated in a quiescent driver in Watts. PL2 = I VD (1 - D) PT = Power dissipated in a driver when the output changes states ("shoot-through current") in Watts. NOTE: The "shoot-through" current from a dual transition (once up, once down) for both drivers is stated in Figure 7 in ampere-nanoseconds. This figure must be multiplied by the number of repetitions per second (frequency) to find Watts. where VD is the forward drop of the clamp diode in the driver (generally around 0.7V). The two parts of the load dissipation must be summed in to produce PL PL = PL1 + PL2 Quiescent Power Dissipation RO = Output resistance of a driver in Ohms. Quiescent power dissipation (PQ, as described in the input section) depends on whether the input is high or low. A low input will result in a maximum current drain (per driver) of 0.2mA; a logic high will result in a current drain of 3.0mA. Quiescent power can therefore be found from: VS = Power supply voltage to the IC in Volts. PQ = VS [D IH + (1 - D) IL] where: IH = IL = D= VS = quiescent current with input high quiescent current with input low fraction of time input is high (duty cycle) power supply voltage August 2005 9 M9999-081005 MIC4421/4422 Micrel, Inc. +18 V WIMA MK22 1 F 5.0V 1 2 0V 0.1F 8 MIC4421 4 6, 7 5 TEK CURRENT PROBE 6302 0.1F 18 V 0V 10,000 pF POLYCARBONATE Figure 6. Peak Output Current Test Circuit M9999-081005 10 August 2005 MIC4421/4422 Micrel, Inc. Package Information PIN 1 INCH (MM) 0.370 (9.40) 0.245 (6.22) 0.125 (3.18) 0.300 (7.62) 0.013 (0.330) 0.010 (0.254) 0.018 (0.57) 0.130 (3.30) 0.100 (2.54) 0.0375 (0.952) 8-Pin Plastic DIP (N) MAX ) PIN 1 INCHES (MM) 0.150 (3.81) 0.013 (0.33) 45 TYP 0.0040 (0.102) 0.010 (0.25) 0.007 (0.18) 0-8 0.189 (4.8) 0.045 (1.14) 0.016 (0.40) PLANE 0.228 (5.79) 8-Pin SOIC (M) August 2005 11 M9999-081005 MIC4421/4422 Micrel, Inc. 0.187 (4.74) 0.112 (2.84) INCH (MM) 0.116 (2.95) 0.038 (0.97) 0.032 (0.81) 0.007 (0.18) 0.005 (0.13) 0.012 (0.30) R 0.012 (0.03) 5 0 MIN 0.004 (0.10) 0.0256 (0.65) TYP 0.012 (0.03) R 0.035 (0.89) 0.021 (0.53) 8-Pin MSOP (MM) 0.150 D 0.005 (3.81 D 0.13) 0.177 0.008 (4.50 0.20) 0.400 0.015 (10.16 0.38) 0.050 0.005 (1.27 0.13) 0.108 0.005 (2.74 0.13) 0.241 0.017 (6.12 0.43) 0.578 0.018 (14.68 0.46) SEATING PLANE 7 Typ. 0.550 0.010 (13.97 0.25) 0.067 0.005 (1.70 0.127) 0.032 0.005 (0.81 0.13) 0.268 REF (6.81 REF) 0.018 0.008 (0.46 0.20) Dimensions: 0.103 0.013 (2.62 0.33) inch (mm) 5-Lead TO-220 (T) MICREL INC. TEL 2180 FORTUNE DRIVE + 1 (408) 944-0800 FAX SAN JOSE, CA 95131 + 1 (408) 474-1000 WEB USA http://www.micrel.com This information furnished by Micrel in this data sheet is believed to be accurate and reliable. However no responsibility is assumed by Micrel for its use. Micrel reserves the right to change circuitry and specifications at any time without notification to the customer. Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser's use or sale of Micrel Products for use in life support appliances, devices or systems is a Purchaser's own risk and Purchaser agrees to fully indemnify Micrel for any damages resulting from such use or sale. (c) 2004 Micrel, Inc. M9999-081005 12 August 2005