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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

LM2586

SNVS121E –MAY 1996–REVISED MAY 2019

LM2586 4-V to 40-V, 3-A Step-Up Wide V

Flyback Regulator

1 Features

1• Requires Few External Components

• Family of Standard Inductors and Transformers

• NPN Output Switches 3 A, Can Stand Off 65 V

• Wide Input Voltage Range: 4 V to 40 V

• Adjustable Switching Frequency: 100 kHz to 200

kHz

• External Shutdown Capability

• Draws Less Than 60 μA When Shut Down

• Frequency Synchronization

• Current-mode Operation for Improved Transient

Response, Line Regulation, and Current Limit

• Internal Soft-start Function Reduces In-rush

Current During Start-up

• Output Transistor Protected by Current Limit,

Undervoltage Lockout, and Thermal Shutdown

• System Output Voltage Tolerance of ±4%

Maximum Over Line and Load Conditions

• Create a Custom Design Using the LM2586 With

the WEBENCH®Power Designer

2 Typical Applications

• Flyback Regulator

• Forward Converter

• Multiple-output Regulator

• Simple Boost Regulator

3 Description

The LM2586 series of regulators are monolithic

integrated circuits specifically designed for flyback,

step-up (boost), and forward converter applications.

The device is available in 4 different output voltage

versions: 3.3 V, 5 V, 12 V, and adjustable.

Requiring a minimum number of external

components, these regulators are cost effective, and

simple to use. Included in the datasheet are typical

circuits of boost and flyback regulators. Also listed

are selector guides for diodes and capacitors and a

family of standard inductors and flyback transformers

designed to work with these switching regulators.

The power switch is a 3-A NPN device that can

stand-off 65 V. Protecting the power switch are

current and thermal limiting circuits, and an

undervoltage lockout circuit. This IC contains an

adjustable frequency oscillator that can be

programmed up to 200 kHz. The oscillator can also

be synchronized with other devices, so that multiple

devices can operate at the same switching frequency.

Other features include soft start mode to reduce in-

rush current during start up, and current mode control

for improved rejection of input voltage and output

load transients and cycle-by-cycle current limiting.

The device also has a shutdown pin, so that it can be

turned off externally. An output voltage tolerance of

±4%, within specified input voltages and output load

conditions, is ensured for the power supply system.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)

LM2586 TO-220 (7) 10.1 mm × 8.89 mm

DDPAK /TO-263 (7) 14.986 mm × 10.16 mm

(1) For all available packages, see the orderable addendum at

the end of the data sheet.

Block Diagram

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Table of Contents

1 Features.................................................................. 1

2 Typical Applications.............................................. 1

3 Description............................................................. 1

4 Revision History..................................................... 2

5 Pin Configurations................................................. 3

6 Specifications......................................................... 4

6.1 Absolute Maximum Ratings ..................................... 4

6.2 ESD Ratings.............................................................. 4

6.3 Recommended Operating Ratings............................ 4

6.4 Thermal Information.................................................. 5

6.5 Electrical Characteristics: 3.3 V................................ 5

6.6 Electrical Characteristics: 5 V................................... 6

6.7 Electrical Characteristics: 12 V................................. 7

6.8 Electrical Characteristics: Adjustable........................ 8

6.9 Typical Characteristics............................................ 10

7 Detailed Description............................................ 13

7.1 Overview ................................................................. 13

7.2 Functional Block Diagram....................................... 13

7.3 Feature Description................................................. 13

8 Application and Implementation ........................ 20

8.1 Application Information............................................ 20

8.2 Typical Applications ............................................... 20

8.3 System Examples ................................................... 31

9 Layout................................................................... 33

9.1 Layout Guidelines ................................................... 33

9.2 Layout Example ...................................................... 33

9.3 Heat Sink/Thermal Considerations ......................... 33

10 Device and Documentation Support ................. 35

10.1 Device Support...................................................... 35

10.2 Receiving Notification of Documentation Updates 35

10.3 Community Resources.......................................... 35

10.4 Trademarks........................................................... 35

10.5 Electrostatic Discharge Caution............................ 36

10.6 Glossary................................................................ 36

11 Mechanical, Packaging, and Orderable

Information........................................................... 36

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision D (April 2013) to Revision E Page

• Editorial changes only, no technical revisions........................................................................................................................ 1

Changes from Revision C (April 2013) to Revision D Page

• Changed layout of National Semiconductor data sheet to TI format.................................................................................... 34

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5 Pin Configurations

NDZ Package

7-Pin TO-220

Top View, Bent, Staggered Leads

KTW Package

7-Pin DDPAK/TO-263

Top View

NDZ Package

7-Pin TO-220

Side View; Bent, Staggered Leads

KTW Package

7-Pin DDPAK/TO-263

Side View

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(1) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. These ratings apply when the current is

limited to less than 1.2 mA for pins 1, 2, 3, and 6. Operating ratings indicate conditions for which the device is intended to be functional,

but device parameter specifications may not be ensured under these conditions. For ensured specifications and test conditions, see the

Electrical Characteristics.

(3) Note that switch current and output current are not identical in a step-up regulator. Output current cannot be internally limited when the

LM2586 is used as a step-up regulator. To prevent damage to the switch, the output current must be externally limited to 3A. However,

output current is internally limited when the LM2586 is used as a flyback regulator (see the section for more information).

(4) The junction temperature of the device (TJ) is a function of the ambient temperature (TA), the junction-to-ambient thermal resistance

(θJA), and the power dissipation of the device (PD). A thermal shutdown will occur if the temperature exceeds the maximum junction

temperature of the device: PD×θJA + TA(MAX) ≥TJ(MAX). For a safe thermal design, check that the maximum power dissipated by the

device is less than: PD≤[TJ(MAX) −TA(MAX)]/θJA. When calculating the maximum allowable power dissipation, derate the maximum

junction temperature—this ensures a margin of safety in the thermal design.

6 Specifications

6.1 Absolute Maximum Ratings (1)(2)

Input Voltage −0.4V ≤VIN ≤45V

Switch Voltage −0.4V ≤VSW ≤65V

Switch Current (3) Internally Limited

Compensation Pin Voltage −0.4V ≤VCOMP ≤2.4V

Feedback Pin Voltage −0.4V ≤VFB ≤2 VOUT

ON /OFF Pin Voltage −0.4V ≤VSH ≤6V

Sync Pin Voltage −0.4V ≤VSYNC ≤2V

Power Dissipation (4) Internally Limited

Storage Temperature Range −65°C to +150°C

Lead Temperature (Soldering, 10 sec.) 260°C

Maximum Junction Temperature (4) 150°C

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings VALUE UNIT

V(ESD) Electrostatic discharge

(minimum) Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

(C = 100 pF, R = 1.5 kΩ)2000 V

6.3 Recommended Operating Ratings

Supply Voltage 4V ≤VIN ≤40V

Output Switch Voltage 0V ≤VSW ≤60V

Output Switch Current ISW ≤3A

Junction Temp. Range −40°C ≤TJ≤+125°C

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(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application

report.

(2) Junction-to-ambient thermal resistance for the 7-lead TO-263 mounted horizontally against a PC board area of 0.136 square inches (the

same size as the DDPAK/TO-263 package) of 1 oz. (0.0014 in. thick) copper.

(3) Junction-to-ambient thermal resistance (no external heat sink) for the 7-lead TO-220 package mounted vertically, with ½ inch leads in a

socket, or on a PC board with minimum copper area.

(4) Junction-to-ambient thermal resistance for the 7-lead TO-263 mounted horizontally against a PC board area of 0.4896 square inches

(3.6 times the area of the DDPAK/TO-263 package) of 1 oz. (0.0014 in. thick) copper.

(5) Junction-to-ambient thermal resistance (no external heat sink) for the 7-lead TO-220 package mounted vertically, with ½ inch leads

soldered to a PC board containing approximately 4 square inches of (1 oz.) copper area surrounding the leads.

(6) Junction-to-ambient thermal resistance for the 7-lead TO-263 mounted horizontally against a PC board copper area of 1.0064 square

inches (7.4 times the area of the DDPAK/TO-2633 package) of 1 oz. (0.0014 in. thick) copper. Additional copper area reduces thermal

resistance further.

6.4 Thermal Information

THERMAL METRIC(1) LM2585

UNITKTW (DDPAK/TO-263 NDZ (TO-220)

7 PINS 7 PINS

RθJA Junction-to-ambient thermal resistance 56(2) 65(3)

°C/W35(4) 45(5)

26(6) —

RθJC Junction-to-case thermal resistance 2 2 °C/W

(1) External components such as the diode, inductor, input and output capacitors can affect switching regulator performance. When the

LM2586 is used as shown in Figure 54 and Figure 55, system performance will be as specified by the system parameters.

(2) All room temperature limits are 100% production tested, and all limits at temperature extremes are specified via correlation using

standard Statistical Quality Control (SQC) methods.

(3) A 1.0 MΩresistor is connected to the compensation pin (which is the error amplifier output) to ensure accuracy in measuring AVOL.

6.5 Electrical Characteristics: 3.3 V

Specifications with standard type face are for TJ= 25°C, and those in bold type face apply over full Operating Temperature

Range. Unless otherwise specified, VIN = 5V.

PARAMETER TEST CONDITIONS TYP MIN MAX UNIT

SYSTEM PARAMETERS Test Circuit of Figure 54(1)

VOUT Output Voltage VIN = 4V to 12V

ILOAD = 0.3 to 1.2A 3.3 3.17/3.14 3.43/3.46 V

ΔVOUT/

ΔVIN Line Regulation VIN = 4V to 12V

ILOAD = 0.3A 20 50/100 mV

ΔVOUT/

ΔILOAD Load Regulation VIN = 12V

ILOAD = 0.3A to 1.2A 20 50/100 mV

ηEfficiency VIN = 5V, ILOAD = 0.3A 76%

UNIQUE DEVICE PARAMETERS (2)

VREF Output Reference

Voltage Measured at Feedback Pin

V = 1.0V 3.3 3.242/3.234 3.358/3.366 V

ΔVREF Reference Voltage

Line Regulation VIN = 4V to 40V 2 mV

GMError Amp

Transconductance ICOMP =−30 μA to +30 μA

VCOMP = 1V 1.193 0.678 2.259 mmho

AVOL Error Amp

Voltage Gain VCOMP = 0.5V to 1.6V

RCOMP = 1 MΩ(3) 260 151/75 V/V

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(1) External components such as the diode, inductor, input and output capacitors can affect switching regulator performance. When the

LM2586 is used as shown in Figure 54 and Figure 55, system performance will be as specified by the system parameters.

(2) All room temperature limits are 100% production tested, and all limits at temperature extremes are specified via correlation using

standard Statistical Quality Control (SQC) methods.

(3) A 1.0 MΩresistor is connected to the compensation pin (which is the error amplifier output) to ensure accuracy in measuring AVOL.

6.6 Electrical Characteristics: 5 V

PARAMETER TEST CONDITIONS TYP MIN MAX UNIT

SYSTEM PARAMETERS Test Circuit of COMPFigure 54(1)

VOUT Output Voltage VIN = 4V to 12V

ILOAD = 0.3A to 1.1A 5.0 4.80/4.75 5.20/5.25 V

ΔVOUT/

ΔVIN Line Regulation VIN = 4V to 12V

ILOAD = 0.3A 20 50/100 mV

ΔVOUT/

ΔILOAD Load Regulation VIN = 12V

ILOAD = 0.3A to 1.1A 20 50/100 mV

ηEfficiency VIN = 12V, ILOAD = 0.6A 80%

UNIQUE DEVICE PARAMETERS (2)

VREF Output Reference

Voltage Measured at Feedback Pin

VCOMP = 1 V 5.0 4.913/4.900 5.088/5.100 V

ΔVREF Reference Voltage

Line Regulation VIN = 4V to 40V 3.3 mV

GMError Amp

Transconductance ICOMP =−30 μA to +30 μA

VCOMP = 1 V 0.750 0.447 1.491 mmho

AVOL Error Amp

Voltage Gain VCOMP = 0.5V to 1.6V

RCOMP = 1 MΩ(3) 165 99/49 V/V

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(1) External components such as the diode, inductor, input and output capacitors can affect switching regulator performance. When the

LM2586 is used as shown in Figure 54 and Figure 55, system performance will be as specified by the system parameters.

(2) All room temperature limits are 100% production tested, and all limits at temperature extremes are specified via correlation using

standard Statistical Quality Control (SQC) methods.

(3) A 1.0 MΩresistor is connected to the compensation pin (which is the error amplifier output) to ensure accuracy in measuring AVOL.

6.7 Electrical Characteristics: 12 V

PARAMETER TEST CONDITIONS TYP MIN MAX UNIT

SYSTEM PARAMETERS Test Circuit of Figure 55 (1)

VOUT Output Voltage VIN = 4V to 10V

ILOAD = 0.2A to 0.8A 12 11.52/11.40 12.48/12.60 V

ΔVOUT/

ΔVIN Line Regulation VIN = 4V to 10V ILOAD = 0.2A 20 100/200 mV

ΔVOUT/

ΔILOAD Load Regulation VIN = 10V

ILOAD = 0.2A to 0.8A 20 100/200 mV

ηEfficiency VIN = 10V, ILOAD = 0.6A 93%

UNIQUE DEVICE PARAMETERS (2)

VREF Output Reference

Voltage Measured at Feedback Pin

VCOMP = 1.0V 12 11.79/11.76 12.21/12.24 V

ΔVREF Reference Voltage

Line Regulation VIN = 4V to 40V 7.8 mV

GMError Amp

Transconductance ICOMP =−30 μA to +30 μA

VCOMP = 1.0V 0.328 0.186 0.621 mmho

AVOL Error Amp

Voltage Gain VCOMP = 0.5V to 1.6V

RCOMP = 1.0 MΩ(3) 70 41/21 V/V

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(1) External components such as the diode, inductor, input and output capacitors can affect switching regulator performance. When the

LM2586 is used as shown in Figure 54 and Figure 55, system performance will be as specified by the system parameters.

(2) All room temperature limits are 100% production tested, and all limits at temperature extremes are specified via correlation using

standard Statistical Quality Control (SQC) methods.

(3) A 1.0 MΩresistor is connected to the compensation pin (which is the error amplifier output) to ensure accuracy in measuring AVOL.

(4) To measure this parameter, the feedback voltage is set to a high value, depending on the output version of the device, to force the error

amplifier output low and the switch off.

(5) To measure this parameter, the feedback voltage is set to a low value, depending on the output version of the device, to force the error

amplifier output high and the switch on.

(6) To measure the worst-case error amplifier output current, the LM2586 is tested with the feedback voltage set to its low value (Note 4)

and at its high value (Note 5).

6.8 Electrical Characteristics: Adjustable

PARAMETER TEST CONDITIONS TYP MIN MAX UNIT

SYSTEM PARAMETERS Test Circuit of Figure 55 (1)

VOUT Output Voltage VIN = 4V to 10V

ILOAD = 0.2A to 0.8A 12.0 11.52/11.40 12.48/12.60 V

ΔVOUT/

ΔVIN Line Regulation VIN = 4V to 10V

ILOAD = 0.2A 20 100/200 mV

ΔVOUT/

ΔILOAD Load Regulation VIN = 10V

ILOAD = 0.2A to 0.8A 20 100/200 mV

ηEfficiency VIN = 10V, ILOAD = 0.6A 93 %

UNIQUE DEVICE PARAMETERS (2)

VREF Output Reference

Voltage Measured at Feedback Pin

VCOMP = 1.0V 1.230 1.208/1.205 1.252/1.255 V

ΔVREF Reference Voltage

Line Regulation VIN = 4V to 40V 1.5 mV

GMError Amp

Transconductance ICOMP =−30 μA to +30 μA

VCOMP = 1.0V 3.200 1.800 6.000 mmho

AVOL Error Amp Voltage Gain VCOMP = 0.5V to 1.6V,

RCOMP = 1.0 MΩ(3) 670 400/200 V/V

IBError Amp

Input Bias Current VCOMP = 1.0V 125 425/600 nA

COMMON DEVICE PARAMETERS for all versions (2)

ISInput Supply Current Switch Off (4) 11 15.5/16.5 mA

ISWITCH = 1.8A 50 100/115 mA

IS/D Shutdown Input

Supply Current VSH = 3V 16 100/300 μA

VUV Input Supply

Undervoltage Lockout RLOAD = 100Ω3.30 3.05 3.75 V

fOOscillator Frequency Measured at Switch Pin

RLOAD = 100Ω, VCOMP = 1.0V

Freq. Adj. Pin Open (Pin 1) 100 85/75 115/125 kHz

RSET = 22 kΩ200 kHz

fSC Short-Circuit

Frequency Measured at Switch Pin

RLOAD = 100Ω

VFEEDBACK = 1.15V 25 kHz

VEAO Error Amplifier

Output Swing Upper Limit (5) 2.8 2.6/2.4 V

Lower Limit (4) 0.25 0.40/0.55 V

IEAO Error Amp

Output Current

(Source or Sink)

See (6) 165 110/70 260/320 μA

ISS Soft Start Current VFEEDBACK = 0.92V

VCOMP = 1.0V 11.0 8.0/7.0 17.0/19.0 μA

DMAX Maximum Duty Cycle RLOAD = 100Ω(5) 98% 93%/90%

ILSwitch Leakage

Current Switch Off

VSWITCH = 60V 15 300/600 μA

VSUS Switch Sustaining Voltage dV/dT = 1.5V/ns 65 V

VSAT Switch Saturation Voltage ISWITCH = 3.0A 0.45 0.65/0.9 V

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Electrical Characteristics: Adjustable (continued)

PARAMETER TEST CONDITIONS TYP MIN MAX UNIT

(7) When testing the minimum value, do not sink current from this pin—isolate it with a diode. If current is drawn from this pin, the frequency

adjust circuit will begin operation (Figure 25).

ICL NPN Switch Current Limit 4.0 3.0 7.0 A

VSTH Synchronization

Threshold Voltage FSYNC = 200 kHz

VCOMP = 1V, VIN = 5V 0.75 0.625/0.40 0.875/1.00 V

ISYNC Synchronization

Pin Current VIN = 5V

VCOMP = 1V, VSYNC = VSTH 100 200 μA

VSHTH ON/OFF Pin (Pin 1)

Threshold Voltage VCOMP = 1V

(7) 1.6 1.0/0.8 2.2/2.4 V

ISH ON/OFF Pin (Pin 1)

Current VCOMP = 1V

VSH = VSHTH 40 15/10 65/75 μA

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6.9 Typical Characteristics

Figure 1. Supply Current vs Temperature Figure 2. Reference Voltage vs Temperature

Figure 3. Δreference Voltage vs Supply Voltage Figure 4. Supply Current vs Switch Current

Figure 5. Current Limit vs Temperature Figure 6. Feedback Pin Bias Current vs Temperature

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Typical Characteristics (continued)

Figure 7. Switch Saturation Voltage vs Temperature Figure 8. Switch Transconductance vs Temperature

Figure 9. Oscillator Frequency vs Temperature Figure 10. Error Amp Transconductance vs Temperature

Figure 11. Error Amp Voltage Gain vs Temperature Figure 12. Short Circuit Frequency vs Temperature

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Typical Characteristics (continued)

Figure 13. Shutdown Supply Current vs Temperature Figure 14. ON/Off Pin Current vs Voltage

Figure 15. Oscillator Frequency vs Resistance

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7 Detailed Description

7.1 Overview

The LM2586 series of regulators are monolithic integrated circuits specifically designed for flyback, step-up

(boost), and forward converter applications. The device is available in 4 different output voltage versions: 3.3 V,

5 V, 12 V, and adjustable. Requiring a minimum number of external components, these regulators are cost

effective, and simple to use. Included in the datasheet are typical circuits of boost and flyback regulators. Also

listed are selector guides for diodes and capacitors and a family of standard inductors and flyback transformers

designed to work with these switching regulators.

7.2 Functional Block Diagram

For Fixed Versions

3.3V, R1 = 3.4k, R2 = 2k

5V, R1 = 6.15k, R2 = 2k

12V, R1 = 8.73k, R2 = 1k

For Adj. Version

R1 = Short (0Ω), R2 = Open

7.3 Feature Description

7.3.1 Flyback Regulator Operation

The LM2586 is ideally suited for use in the flyback regulator topology. The flyback regulator can produce a single

output voltage, such as the one shown in Figure 16, or multiple output voltages. In Figure 16, the flyback

regulator generates an output voltage that is inside the range of the input voltage. This feature is unique to

flyback regulators and cannot be duplicated with buck or boost regulators.

The operation of a flyback regulator is as follows (refer to Figure 16): when the switch is on, current flows

through the primary winding of the transformer, T1, storing energy in the magnetic field of the transformer. Note

that the primary and secondary windings are out of phase, so no current flows through the secondary when

current flows through the primary. When the switch turns off, the magnetic field collapses, reversing the voltage

polarity of the primary and secondary windings. Now rectifier D1 is forward biased and current flows through it,

releasing the energy stored in the transformer. This produces voltage at the output.

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Feature Description (continued)

The output voltage is controlled by modulating the peak switch current. This is done by feeding back a portion of

the output voltage to the error amp, which amplifies the difference between the feedback voltage and a 1.230V

reference. The error amp output voltage is compared to a ramp voltage proportional to the switch current (in

other words, inductor current during the switch on time). The comparator terminates the switch on time when the

two voltages are equal, thereby controlling the peak switch current to maintain a constant output voltage.

As shown in Figure 16, the LM2586 can be used as a flyback regulator by using a minimum number of external

components. The switching waveforms of this regulator are shown in . Typical performance characteristics observed

during the operation of this circuit are shown in .

Figure 16. 12-V Flyback Regulator Design Example

Figure 17. 12-V Flyback Regulator Design Example

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Feature Description (continued)

(1) As shown in Figure 17, the LM2585 can be used as a flyback regulator by using a minimum number of external

components. The switching waveforms of this regulator are shown in Figure 18. Typical characteristics observed

during the operation of this circuit are shown in Figure 19.

A: Switch Voltage, 20 V/div

B: Switch Current, 2 A/div

C: Output Rectifier Current, 2 A/div

D: Output Ripple Voltage, 50 mV/div

AC-Coupled

Horizontal: 2 μs/div

Figure 18. Switching Waveforms Figure 19. VOUT Load Current Step Response

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Feature Description (continued)

7.3.2 Step-Up (Boost) Regulator Operation

Figure 20 shows the LM2586 used as a step-up (boost) regulator. This is a switching regulator that produces an

output voltage greater than the input supply voltage.

A brief explanation of how the LM2586 boost regulator works is as follows (refer to Figure 20). When the NPN

switch turns on, the inductor current ramps up at the rate of VIN/L, storing energy in the inductor. When the

switch turns off, the lower end of the inductor flies above VIN, discharging its current through diode (D) into the

output capacitor (COUT) at a rate of (VOUT −VIN)/L. Thus, energy stored in the inductor during the switch on time

is transferred to the output during the switch off time. The output voltage is controlled by adjusting the peak

switch current, as described in .

Figure 20. 12-V Boost Regulator

By adding a small number of external components (as shown in Figure 20), the LM2586 can be used to produce

a regulated output voltage that is greater than the applied input voltage. The switching waveforms observed

during the operation of this circuit are shown in Figure 21. Typical performance of this regulator is shown in

Figure 22.

A: Switch Voltage,10V/div

B: Switch Current, 2A/div

C: Inductor Current, 2A/div

D: Output Ripple Voltage,100 mV/div, AC-Coupled

Figure 21. Switching Waveforms Figure 22. VOUT Response To Load Current Step

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Feature Description (continued)

7.3.3 Programming Output Voltage (Selecting R1 And R2)

Referring to the adjustable regulator in Figure 26, the output voltage is programmed by the resistors R1 and R2

by the following formula:

VOUT = VREF (1 + R1/R2)

where

• VREF = 1.23V (1)

Resistors R1 and R2 divide the output voltage down so that it can be compared with the 1.23V internal

reference. With R2 between 1k and 5k, R1 is:

R1 = R2 (VOUT/VREF −1)

where

• VREF = 1.23V (2)

For best temperature coefficient and stability with time, use 1% metal film resistors.

7.3.4 Shutdown Control

A feature of the LM2586 is its ability to be shut down using the ON /OFF pin (pin 1). This feature conserves input

power by turning off the device when it is not in use. For proper operation, an isolation diode is required (as

shown in Figure 23).

The device will shut down when 3V or greater is applied on the ON /OFF pin, sourcing current into pin 1. In shut

down mode, the device will draw typically 56 μA of supply current (16 μA to VIN and 40 μA to the ON /OFF pin).

To turn the device back on, leave pin 1 floating, using an (isolation) diode, as shown in Figure 23 (for normal

operation, do not source or sink current to or from this pin—see the next section).

Figure 23. Shutdown Operation

7.3.5 Frequency Adjustment

The switching frequency of the LM2586 can be adjusted with the use of an external resistor. This feature allows

the user to optimize the size of the magnetics and the output capacitor(s) by tailoring the operating frequency. A

resistor connected from pin 1 (the Freq. Adj. pin) to ground will set the switching frequency from 100 kHz to 200

kHz (maximum). As shown in Figure 23, the pin can be used to adjust the frequency while still providing the

shutdown function. A curve in Typical Characteristics the resistor value to the corresponding switching frequency.

Table 1 shows resistor values corresponding to commonly used frequencies.

However, changing the LM2586 operating frequency from its nominal value of 100 kHz changes the magnetics

selection and compensation component values.

Table 1. Frequency Setting Resistor Guide

RSET(kΩ) Frequency (kHz)

Open 100

200 125

47 150

33 175

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Feature Description (continued)

Table 1. Frequency Setting Resistor Guide (continued)

RSET(kΩ) Frequency (kHz)

22 200

7.3.6 Frequency Synchronization

Another feature of the LM2586 is the ability to synchronize the switching frequency to an external source, using

the sync pin (pin 6). This feature allows the user to parallel multiple devices to deliver more output power.

A negative falling pulse applied to the sync pin will synchronize the LM2586 to an external oscillator (see

Figure 24 and Figure 25).

Use of this feature enables the LM2586 to be synchronized to an external oscillator, such as a system clock. This

operation allows multiple power supplies to operate at the same frequency, thus eliminating frequency-related

noise problems.

Figure 24. Frequency Synchronization

Figure 25. Waveforms of a Synchronized 12-V Boost Regulator

The scope photo in Figure 25 shows a LM2586 12-V boost regulator synchronized to a 200-kHz signal. There is

a 700-ns delay between the falling edge of the sync signal and the turning on of the switch.

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Figure 26. Boost Regulator

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8 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Customers should

validate and test their design implementation to confirm system functionality.

8.1 Application Information

The LM2586 series of regulators are monolithic integrated circuits specifically designed for flyback, step-up

(boost), and forward converter applications. Requiring a minimum number of external components, these

regulators are cost effective, and simple to use. Included in the datasheet are typical circuits of boost and flyback

regulators. Also listed are selector guides for diodes and capacitors and a family of standard inductors and

flyback transformers designed to work with these switching regulators.

8.2 Typical Applications

8.2.1 Typical Flyback Regulator Applications

Figure 27 through Figure 32 show six typical flyback applications, varying from single output to triple output. Each

drawing contains the part number(s) and manufacturer(s) for every component except the transformer. For the

transformer part numbers and manufacturers' names, see Table 2. For applications with different output

voltages—requiring the LM2586-ADJ—or different output configurations that do not match the standard

configurations, refer to the Switchers Made Simple software.

Figure 27. Single-Output Flyback Regulator

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Typical Applications (continued)

Figure 28. Single-Output Flyback Regulator

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Typical Applications (continued)

Figure 29. Single-Output Flyback Regulator

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Typical Applications (continued)

Figure 30. Dual-Output Flyback Regulator

Figure 31. Dual-Output Flyback Regulator

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Typical Applications (continued)

Figure 32. Triple-Output Flyback Regulator

8.2.1.1 Design Requirements

8.2.1.1.1 Transformer Selection (T)

Table 2 lists the standard transformers available for flyback regulator applications. Included in the table are the

turns ratio(s) for each transformer, as well as the output voltages, input voltage ranges, and the maximum load

currents for each circuit.

Table 2. Transformer Selection Table

Applications Figure 27 Figure 28 Figure 29 Figure 30 Figure 31 Figure 32

Transformers T7 T7 T7 T6 T6 T5

VIN 4V–6V 4V–6V 8V–16V 4V–6V 18V–36V 18V–36V

VOUT1 3.3V 5V 12V 12V 12V 5V

IOUT1 (Max) 1.4A 1A 0.8A 0.15A 0.6A 1.8A

N11 1 1 1.2 1.2 0.5

VOUT2 −12V −12V 12V

IOUT2(Max) 0.15A 0.6A 0.25A

N21.2 1.2 1.15

VOUT3 −12V

IOUT3 (Max) 0.25A

N31.15

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(1) Coilcraft Inc., Phone: (800) 322-2645

1102 Silver Lake Road, Cary, IL 60013 Fax: (708) 639-1469

European Headquarters, 21 Napier Place Phone: +44 1236 730 595

Wardpark North, Cumbernauld, Scotland G68 0LL Fax: +44 1236 730 627

(2) Pulse Engineering Inc., Phone: (619) 674-8100

12220 World Trade Drive, San Diego, CA 92128 Fax: (619) 674 -8262

European Headquarters, Dunmore Road Phone: +353 93 24 107

Tuam, Co. Galway, Ireland Fax: +353 93 24 459

(3) Renco Electronics Inc., Phone: (800) 645-5828

60 Jeffryn Blvd. East, Deer Park, NY 11729 Fax: (516) 586-5562

(4) Schott Corp., Phone: (612) 475-1173

1000 Parkers Lane Road, Wayzata, MN 55391 Fax: (612) 475-1786

Table 3. Transformer Manufacturer Guide

Transformer

Type Manufacturers' Part Numbers

Coilcraft (1) Coilcraft (1)

Surface Mount Pulse (2)

Surface Mount Pulse (2) Renco (3) Schott (4)

T5 Q4338-B Q4437-B PE-68413 — RL-5532 67140890

T6 Q4339-B Q4438-B PE-68414 — RL-5533 67140900

T7 S6000-A S6057-A — PE-68482 RL-5751 26606

8.2.1.1.2 Transformer Footprints

Figure 33 through Figure 47 show the footprints of each transformer, listed in Table 3.

Figure 33. Coilcraft S6000-A (Top View)

Figure 34. Coilcraft Q4339-B (Top View)

Figure 35. Coilcraft Q4437-B (Surface Mount) (Top View) Figure 36. Coilcraft Q4338-B (Top View)

Figure 37. Coilcraft S6057-A

(Surface Mount) (Top View) Figure 38. Coilcraft Q4438-B

(Surface Mount) (Top View)

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Figure 39. Pulse PE-68482 (Top View)

Figure 40. Pulse PE-68414

(Surface Mount) (Top View)

Figure 41. Pulse PE-68413

(Surface Mount) (Top View)

Figure 42. Renco Rl-5751 (Top View)

Figure 43. Renco Rl-5533 (Top View)

Figure 44. Renco Rl-5532 (Top View)

Figure 45. Schott 26606 (Top View) Figure 46. Schott 67140900 (Top View)

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Figure 47. Schott 67140890 (Top View)

8.2.1.2 Detailed Design Procedure

8.2.1.2.1 Custom Design With WEBENCH® Tools

Click here to create a custom design using the LM2586 device with the WEBENCH® Power Designer.

1. Start by entering the input voltage (VIN), output voltage (VOUT), and output current (IOUT) requirements.

2. Optimize the design for key parameters such as efficiency, footprint, and cost using the optimizer dial.

3. Compare the generated design with other possible solutions from Texas Instruments.

The WEBENCH Power Designer provides a customized schematic along with a list of materials with real-time

pricing and component availability.

In most cases, these actions are available:

• Run electrical simulations to see important waveforms and circuit performance

• Run thermal simulations to understand board thermal performance

• Export customized schematic and layout into popular CAD formats

• Print PDF reports for the design, and share the design with colleagues

Get more information about WEBENCH tools at www.ti.com/WEBENCH.

8.2.1.2.2 Flyback Regulator Input Capacitors

A flyback regulator draws discontinuous pulses of current from the input supply. Therefore, there are two input

capacitors needed in a flyback regulator—one for energy storage and one for filtering (see Figure 48). Both are

required due to the inherent operation of a flyback regulator. To keep a stable or constant voltage supply to the

LM2586, a storage capacitor (≥100 μF) is required. If the input source is a rectified DC supply and/or the

application has a wide temperature range, the required rms current rating of the capacitor might be very large.

This means a larger value of capacitance or a higher voltage rating will be needed for the input capacitor. The

storage capacitor will also attenuate noise which may interfere with other circuits connected to the same input

supply voltage.

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Figure 48. Flyback Regulator

In addition, a small bypass capacitor is required due to the noise generated by the input current pulses. To

eliminate the noise, insert a 1-μF ceramic capacitor between VIN and ground as close as possible to the device.

8.2.1.2.3 Switch Voltage Limits

In a flyback regulator, the maximum steady-state voltage appearing at the switch, when it is off, is set by the

transformer turns ratio, N, the output voltage, VOUT, and the maximum input voltage, VIN (maximum):

VSW(OFF) = VIN (maximum) + (VOUT +VF)/N

where

• VFis the forward biased voltage of the output diode, and is typically 0.5 V for Schottky diodes and 0.8 V for

ultra-fast recovery diodes (3)

In certain circuits, there exists a voltage spike, VLL, superimposed on top of the steady-state voltage (see ,

waveform A). Usually, this voltage spike is caused by the transformer leakage inductance and/or the output

rectifier recovery time. To “clamp” the voltage at the switch from exceeding its maximum value, a transient

suppressor in series with a diode is inserted across the transformer primary (as shown in the circuit in Figure 16

and other flyback regulator circuits throughout the datasheet). The schematic in Figure 48 shows another method

of clamping the switch voltage. A single voltage transient suppressor (the SA51A) is inserted at the switch pin.

This method clamps the total voltage across the switch, not just the voltage across the primary.

If poor circuit layout techniques are used (see the Circuit Layout Guideline section), negative voltage transients

may appear on the Switch pin (pin 5). Applying a negative voltage (with respect to the IC's ground) to any

monolithic IC pin causes erratic and unpredictable operation of that IC. This holds true for the LM2586 IC as well.

When used in a flyback regulator, the voltage at the Switch pin (pin 5) can go negative when the switch turns on.

The “ringing” voltage at the switch pin is caused by the output diode capacitance and the transformer leakage

inductance forming a resonant circuit at the secondary(ies). The resonant circuit generates the “ringing” voltage,

which gets reflected back through the transformer to the switch pin. There are two common methods to avoid this

problem. One is to add an RC snubber around the output rectifier(s), as in Figure 48. The values of the resistor

and the capacitor must be chosen so that the voltage at the Switch pin does not drop below −0.4 V. The resistor

may range in value between 10Ωand 1 kΩ, and the capacitor will vary from 0.001 μF to 0.1 μF. Adding a

snubber will (slightly) reduce the efficiency of the overall circuit.

The other method to reduce or eliminate the “ringing” is to insert a Schottky diode clamp between pins 5 and 4

(ground), also shown in Figure 48. This prevents the voltage at pin 5 from dropping below −0.4 V. The reverse

voltage rating of the diode must be greater than the switch off voltage.

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Figure 49. Input Line Filter

8.2.1.2.4 Output Voltage Limitations

The maximum output voltage of a boost regulator is the maximum switch voltage minus a diode drop. In a

flyback regulator, the maximum output voltage is determined by the turns ratio, N, and the duty cycle, D, by the

equation:

VOUT ≈N × VIN × D/(1 −D) (4)

The duty cycle of a flyback regulator is determined by Equation 5:

(5)

Theoretically, the maximum output voltage can be as large as desired—just keep increasing the turns ratio of the

transformer. However, there exists some physical limitations that prevent the turns ratio, and thus the output

voltage, from increasing to infinity. The physical limitations are capacitances and inductances in the LM2586

switch, the output diode(s), and the transformer—such as reverse recovery time of the output diode (mentioned

above).

8.2.1.2.5 Noisy Input Line Condition

A small, low-pass RC filter should be used at the input pin of the LM2586 if the input voltage has an unusually

large amount of transient noise, such as with an input switch that bounces. The circuit in Figure 49 demonstrates

the layout of the filter, with the capacitor placed from the input pin to ground and the resistor placed between the

input supply and the input pin. Note that the values of RIN and CIN shown in the schematic are good enough for

most applications, but some readjusting might be required for a particular application. If efficiency is a major

concern, replace the resistor with a small inductor (say 10 μH and rated at 200 mA).

8.2.1.2.6 Stability

All current-mode controlled regulators can suffer from an instability, known as subharmonic oscillation, if they

operate with a duty cycle above 50%. To eliminate subharmonic oscillations, a minimum value of inductance is

required to ensure stability for all boost and flyback regulators. The minimum inductance is given by:

where

• VSAT is the switch saturation voltage and can be found in the Characteristic Curves (6)

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(1) Coilcraft Inc., Phone: (800) 322-2645

1102 Silver Lake Road, Cary, IL 60013 Fax: (708) 639-1469

European Headquarters, 21 Napier Place Phone: +44 1236 730 595

Wardpark North, Cumbernauld, Scotland G68 0LL Fax: +44 1236 730 627

(2) Pulse Engineering Inc., Phone: (619) 674-8100

12220 World Trade Drive, San Diego, CA 92128 Fax: (619) 674 -8262

European Headquarters, Dunmore Road Phone: +353 93 24 107

Tuam, Co. Galway, Ireland Fax: +353 93 24 459

(3) Renco Electronics Inc., Phone: (800) 645-5828

60 Jeffryn Blvd. East, Deer Park, NY 11729 Fax: (516) 586-5562

(4) Schott Corp., Phone: (612) 475-1173

1000 Parkers Lane Road, Wayzata, MN 55391 Fax: (612) 475-1786

8.2.2 Typical Boost Regulator Applications

Figure 50 through Figure 53 show four typical boost applications—one fixed and three using the adjustable

version of the LM2586. Each drawing contains the part number(s) and manufacturer(s) for every component. For

the fixed 12-V output application, the part numbers and manufacturers' names for the inductor are listed in

Table 4. For applications with different output voltages, refer to the Switchers Made Simple software.

Figure 50. 5-V to 12-V Boost Regulator Figure 51. 12-V to 24-V Boost Regulator

The LM2586 requires a heat sink in this application. The size of the

heat sink depends on the maximum ambient temperature. To

calculate the thermal resistance of the IC and the size of the heat

sink needed, see Heat Sink/Thermal Considerations.

Figure 52. 24-V to 36-V Boost Regulator

The LM2586 requires a heat sink in this application. The size of the

heat sink depends on the maximum ambient temperature. To

calculate the thermal resistance of the IC and the size of the heat

sink needed, see Heat Sink/Thermal Considerations.

Figure 53. 24-V to 48-V Boost Regulator

8.2.2.1 Design Requirements

Table 4 contains a list of standard inductors, by part number and corresponding manufacturer, for the fixed

output regulator of Figure 50.

Table 4. Inductor Selection Table

Coilcraft(1) Pulse(2) Renco(3) Schott(4) Schott(4)

(Surface Mount)

DO3316-153 PE-53898 RL-5471-7 67146510 67146540

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8.2.2.2 Detailed Design Procedure

See Detailed Design Procedure

8.3 System Examples

8.3.1 Test Circuits

CIN1—100 μF, 25V Aluminum Electrolytic

CIN2—0.1 μF Ceramic

T—22 μH, 1:1 Schott #67141450

D—1N5820

COUT—680 μF, 16V Aluminum Electrolytic

CC—0.47 μF Ceramic

RC—2k

Figure 54. 3.3-V LM2586 and 5-V LM2586

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System Examples (continued)

CIN1—100 μF, 25V Aluminum Electrolytic

CIN2—0.1 μF Ceramic

L—15 μH, Renco #RL-5472-5

D—1N5820

COUT—680 μF, 16V Aluminum Electrolytic

CC—0.47 μF Ceramic

RC—2k

For 12V Devices: R1 = Short (0Ω) and 2 = Open

For ADJ Devices: R1 = 48.75k, ±0.1% and 2 = 5.62k, ±0.1%

Figure 55. LM2586-12 and LM2586-ADJ

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9 Layout

9.1 Layout Guidelines

As in any switching regulator, layout is very important. Rapidly switching currents associated with wiring

inductance generate voltage transients which can cause problems. For minimal inductance and ground loops,

keep the length of the leads and traces as short as possible. Use single point grounding or ground plane

construction for best results. Separate the signal grounds from the power grounds (as indicated in Figure 56).

When using the adjustable version, physically locate the programming resistors as close as possible to the

regulator IC, to keep the sensitive feedback wiring short.

9.2 Layout Example

Figure 56. Circuit Board Layout

9.3 Heat Sink/Thermal Considerations

In many cases, a heat sink is not required to keep the LM2586 junction temperature within the allowed operating

temperature range. For each application, to determine whether or not a heat sink will be required, the following

must be identified:

1) Maximum ambient temperature (in the application).

2) Maximum regulator power dissipation (in the application).

3) Maximum allowed junction temperature (125°C for the LM2586). For a safe, conservative design, a

temperature approximately 15°C cooler than the maximum junction temperature should be selected (110°C).

4) LM2586 package thermal resistances θJA and θJC (given in the Electrical Characteristics).

Total power dissipated (PD) by the LM2586 can be estimated as follows:

where

• VIN is the minimum input voltage

• VOUT is the output voltage

• N is the transformer turns ratio, D is the duty cycle

• ILOAD is the maximum load current (and ∑ILOAD is the sum of the maximum load currents for multiple-output

flyback regulators) (7)

The duty cycle is given by:

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Heat Sink/Thermal Considerations (continued)

where

• VFis the forward biased voltage of the diode and is typically 0.5 V for Schottky diodes and 0.8 V for fast

recovery diodes

• VSAT is the switch saturation voltage and can be found in the Characteristic Curves (8)

When no heat sink is used, the junction temperature rise is:

ΔTJ= PD•θJA. (9)

Adding the junction temperature rise to the maximum ambient temperature gives the actual operating junction

temperature:

TJ=ΔTJ+ TA. (10)

If the operating junction temperature exceeds the maximum junction temperature in item 3 above, then a heat

sink is required. When using a heat sink, the junction temperature rise can be determined by the following:

ΔTJ= PD• (θJC +θInterface +θHeat Sink) (11)

Again, the operating junction temperature will be:

TJ=ΔTJ+ TA(12)

As before, if the maximum junction temperature is exceeded, a larger heat sink is required (one that has a lower

thermal resistance).

Included in the Switchers Made Simple®design software is a more precise (non-linear) thermal model that can

be used to determine junction temperature with different input-output parameters or different component values.

It can also calculate the heat sink thermal resistance required to maintain the regulator junction temperature

below the maximum operating temperature.

To further simplify the flyback regulator design procedure, Texas Instruments is making available computer

design software to be used with the Simple Switcher ®line of switching regulators. Switchers Made Simple is

available on a 3½″diskette for IBM compatible computers from a Texas Instruments sales office in your area or

the Texas Instruments Customer Response Center ((800) 477-8924).

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10 Device and Documentation Support

10.1 Device Support

10.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT

CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES

OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER

ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

10.1.2 Development Support

10.1.2.1 Custom Design With WEBENCH® Tools

Click here to create a custom design using the LM2586 device with the WEBENCH® Power Designer.

1. Start by entering the input voltage (VIN), output voltage (VOUT), and output current (IOUT) requirements.

2. Optimize the design for key parameters such as efficiency, footprint, and cost using the optimizer dial.

3. Compare the generated design with other possible solutions from Texas Instruments.

The WEBENCH Power Designer provides a customized schematic along with a list of materials with real-time

pricing and component availability.

In most cases, these actions are available:

• Run electrical simulations to see important waveforms and circuit performance

• Run thermal simulations to understand board thermal performance

• Export customized schematic and layout into popular CAD formats

• Print PDF reports for the design, and share the design with colleagues

Get more information about WEBENCH tools at www.ti.com/WEBENCH.

10.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper

right corner, click on Alert me to register and receive a weekly digest of any product information that has

changed. For change details, review the revision history included in any revised document.

10.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective

contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of

Use.

TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration

among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help

solve problems with fellow engineers.

Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and

contact information for technical support.

10.4 Trademarks

E2E is a trademark of Texas Instruments.

WEBENCH is a registered trademark of Texas Instruments.

Switchers Made Simple,Simple Switcher are registered trademarks of dcl_owner.

All other trademarks are the property of their respective owners.

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10.5 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

10.6 Glossary

SLYZ022 —TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

11 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

PACKAGE OPTION ADDENDUM

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Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LM2586S-12/NOPB ACTIVE DDPAK/

TO-263 KTW 7 45 Green (RoHS

& no Sb/Br) SN Level-3-245C-168 HR -40 to 125 LM2586S

-12 P+

LM2586S-3.3/NOPB ACTIVE DDPAK/

TO-263 KTW 7 45 Green (RoHS

& no Sb/Br) SN Level-3-245C-168 HR -40 to 125 LM2586S

-3.3 P+

LM2586S-5.0/NOPB ACTIVE DDPAK/

TO-263 KTW 7 45 Green (RoHS

& no Sb/Br) SN Level-3-245C-168 HR -40 to 125 LM2586S

-5.0 P+

LM2586S-ADJ/NOPB ACTIVE DDPAK/

TO-263 KTW 7 45 Green (RoHS

& no Sb/Br) SN Level-3-245C-168 HR -40 to 125 LM2586S

-ADJ P+

LM2586SX-3.3/NOPB ACTIVE DDPAK/

TO-263 KTW 7 500 Green (RoHS

& no Sb/Br) SN Level-3-245C-168 HR -40 to 125 LM2586S

-3.3 P+

LM2586SX-5.0/NOPB ACTIVE DDPAK/

TO-263 KTW 7 500 Green (RoHS

& no Sb/Br) SN Level-3-245C-168 HR -40 to 125 LM2586S

-5.0 P+

LM2586SX-ADJ/NOPB ACTIVE DDPAK/

TO-263 KTW 7 500 Green (RoHS

& no Sb/Br) SN Level-3-245C-168 HR -40 to 125 LM2586S

-ADJ P+

LM2586T-3.3/NOPB ACTIVE TO-220 NDZ 7 45 Green (RoHS

& no Sb/Br) SN Level-1-NA-UNLIM -40 to 125 LM2586T

-3.3 P+

LM2586T-5.0/NOPB ACTIVE TO-220 NDZ 7 45 Green (RoHS

& no Sb/Br) SN Level-1-NA-UNLIM -40 to 125 LM2586T

-5.0 P+

LM2586T-ADJ NRND TO-220 NDZ 7 45 TBD Call TI Call TI -40 to 125 LM2586T

-ADJ P+

LM2586T-ADJ/NOPB ACTIVE TO-220 NDZ 7 45 Green (RoHS

& no Sb/Br) SN Level-1-NA-UNLIM -40 to 125 LM2586T

-ADJ P+

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

PACKAGE OPTION ADDENDUM

www.ti.com 9-Jun-2020

Addendum-Page 2

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish

value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

LM2586SX-3.3/NOPB DDPAK/

TO-263 KTW 7 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2

LM2586SX-5.0/NOPB DDPAK/

TO-263 KTW 7 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2

LM2586SX-ADJ/NOPB DDPAK/

TO-263 KTW 7 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2

PACKAGE MATERIALS INFORMATION

www.ti.com 30-May-2019

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

LM2586SX-3.3/NOPB DDPAK/TO-263 KTW 7 500 367.0 367.0 45.0

LM2586SX-5.0/NOPB DDPAK/TO-263 KTW 7 500 367.0 367.0 45.0

LM2586SX-ADJ/NOPB DDPAK/TO-263 KTW 7 500 367.0 367.0 45.0

PACKAGE MATERIALS INFORMATION

www.ti.com 30-May-2019

Pack Materials-Page 2

MECHANICAL DATA

NDZ0007B

www.ti.com

TA07B (Rev E)

MECHANICAL DATA

KTW0007B

www.ti.com

BOTTOM SIDE OF PACKAGE

TS7B (Rev E)

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